Wafer cleaning device based on ultrasonic cleaning

By designing an angled water outlet and a vortex connector, combined with a defoaming and uniform vibrating rotor and a pressure control device, the problems of bubble bursting and uneven cleaning in ultrasonic wafer cleaning devices are solved, achieving efficient and uniform cleaning results and equipment stability.

CN121017169BActive Publication Date: 2025-12-30HANGLING MICRO (TAIZHOU) TECH CO LTD
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Patent Information

Application Number
CN202511546066.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-10-28
Publication Date
2025-12-30
Estimated Expiration
2045-10-28

AI Technical Summary

Technical Problem

Existing ultrasonic wafer cleaning equipment is prone to localized stress concentration and bubble bursting in glass containers, affecting the cleaning effect and equipment stability. Furthermore, uneven replenishment of ultrapure water leads to incomplete cleaning.

Method used

The system employs an angled outlet and a vortex connector in conjunction with a defoaming and uniformly vibrating rotor. Through rotational disturbance and centrifugal separation technology, it shears bubbles and evenly distributes the cleaning solution. Combined with a pressure control device, it achieves flow control. Through the vortex connector and the defoaming and uniformly vibrating rotor, it achieves continuous replenishment and uniform distribution of ultrapure water, preventing bubble aggregation.

Benefits of technology

It achieves uniform distribution of ultrapure water and continuous variation of ultrasonic vibration, avoiding glass breakage and uneven cleaning, improving cleaning efficiency and defoaming effect, and reducing manual intervention and resource waste.

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Abstract

The application discloses a wafer cleaning device based on ultrasonic cleaning and relates to the technical field of wafer cleaning devices. The wafer cleaning device comprises a cleaning machine outer tank body, a wafer cleaning glass tank, an ultrasonic cleaning tank, an ultrasonic device, a bottom plate, a cover, a cleaning tank track, a shunt water supply device and a bubble removing uniform vibration device. The application effectively conducts ultrasonic vibration to the wafer cleaning glass tank by taking ultrapure water as a medium, drives the strong acid solution in the tank to uniformly vibrate and realizes efficient cleaning of the wafer. The oblique water replenishment forms high turbulent pulsation and local shear stress at the junction with the original liquid, shears large bubbles into tiny bubbles, prevents bubble aggregation, improves liquid purity and ultrasonic cleaning efficiency. The centrifugal separation effect of the cyclone connecting seat and the annular cyclone sheet makes the bubbles in the water flow concentrate at the center position, the outer ultrapure water is quickly discharged, the bubbles are efficiently absorbed after contacting the hydrophobic porous membrane, and the bubble removing effect is significantly improved.
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