Wafer cleaning device based on ultrasonic cleaning

Abstract

The application discloses a wafer cleaning device based on ultrasonic cleaning and relates to the technical field of wafer cleaning devices. The wafer cleaning device comprises a cleaning machine outer tank body, a wafer cleaning glass tank, an ultrasonic cleaning tank, an ultrasonic device, a bottom plate, a cover, a cleaning tank track, a shunt water supply device and a bubble removing uniform vibration device. The application effectively conducts ultrasonic vibration to the wafer cleaning glass tank by taking ultrapure water as a medium, drives the strong acid solution in the tank to uniformly vibrate and realizes efficient cleaning of the wafer. The oblique water replenishment forms high turbulent pulsation and local shear stress at the junction with the original liquid, shears large bubbles into tiny bubbles, prevents bubble aggregation, improves liquid purity and ultrasonic cleaning efficiency. The centrifugal separation effect of the cyclone connecting seat and the annular cyclone sheet makes the bubbles in the water flow concentrate at the center position, the outer ultrapure water is quickly discharged, the bubbles are efficiently absorbed after contacting the hydrophobic porous membrane, and the bubble removing effect is significantly improved.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning equipment technology, specifically a wafer cleaning equipment based on ultrasonic cleaning. Background Technology

[0002] Ultrasonic wafer cleaning equipment is a key device in semiconductor manufacturing processes used to remove particles, metal ions, photoresist residues, and chemical byproducts from the wafer surface. Its cleaning effect directly impacts the yield and overall product quality of subsequent core processes such as photolithography, etching, and deposition. As chip linewidths continue to shrink, even minute contamination on the wafer surface can lead to circuit defects or even functional failures. Therefore, modern wafer cleaning equipment not only requires efficient, uniform, and low-damage cleaning capabilities but also needs to maintain stable operation in various chemical environments, including strong acids, strong alkalis, and ultrapure water.

[0003] During ultrasonic wafer cleaning, since the wafer cleaning tank is a glass container, if the ultrasonic waves act directly on the glass, it can easily lead to local stress concentration and cause cracking. At the same time, the replenished and circulated ultrapure water will carry air and generate bubbles. These bubbles are unstable under ultrasonic vibration and may burst violently, which not only risks damaging the glass container, but also reduces the contact area between ultrapure water and glass, weakens the vibration transmission effect, and results in incomplete cleaning. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer cleaning device based on ultrasonic cleaning to solve the problems mentioned in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a wafer cleaning device based on ultrasonic cleaning, comprising an outer tank of the cleaning machine and an ultrasonic cleaning tank, wherein cleaning tank support legs are installed at the bottom of the ultrasonic cleaning tank and are installed inside the outer tank of the cleaning machine, a base plate is installed on the ultrasonic cleaning tank, an ultrasonic device is installed on the ultrasonic cleaning tank, a cover is installed on the base plate and connected to the ultrasonic cleaning tank, cleaning tank tracks are symmetrically installed on the base plate, a wafer cleaning glass tank is installed on the cleaning tank tracks, a water diversion supply device is also installed inside the ultrasonic cleaning tank, and a defoaming and vibration equalization device is installed on the water diversion supply device.

[0006] The wafer cleaning glass tank is filled with a strong acid solution used to clean the wafers. Ultrapure water is placed between the outer tank of the cleaning machine and the wafer cleaning glass tank. An external control cabinet is connected to the wafer cleaning unit to control its operation.

[0007] During cleaning, the control system activates the ultrasonic device, which generates vibrations. These vibrations are transmitted through the ultrapure water to the wafer cleaning glass tank, causing the strong acid solution inside to vibrate and clean the wafer. The control system supplies water to the diversion water supply device via the water supply equipment. The replenished ultrapure water is evenly distributed through the inclined outlet, and the diverted ultrapure water enters the corresponding vortex connector and defoaming and uniform vibrating rotor. The treated ultrapure water is then discharged into the ultrasonic cleaning tank and then into the outer tank of the cleaning machine, achieving the purpose of continuously replenishing the lost ultrapure water.

[0008] Furthermore, the water supply diversion device includes a water supply shell, which is installed in the ultrasonic cleaning tank. The water supply shell has a water inlet and a diversion cavity inside. The top of the water supply shell has several oblique water outlets that are connected to the diversion cavity. A defoaming and vibration equalization device is installed on the water supply shell and is connected to the oblique water outlets.

[0009] The inlet is connected to a water supply device, which is used to replenish ultrapure water into the distribution chamber through the inlet. The replenished ultrapure water is evenly distributed at an angle to the outlet. The distributed ultrapure water enters the corresponding vortex connector and defoaming and uniform vibration rotor. The treated ultrapure water is discharged into the ultrasonic cleaning tank and then enters the outer tank of the cleaning machine.

[0010] Furthermore, the slanted outlet is set at an angle.

[0011] The angled water outlet, combined with the angled vortex connector and the defoaming and uniform vibrating head, allows the water to enter the outer tank of the cleaning machine at an angle. When the angled replenishment water comes into contact with the original liquid, a transition zone appears at their interface where the speed changes from fast to slow and the direction changes. High turbulence pulsation and local shear stress are generated in the zone, which can effectively tear the bubbles, shear and break large bubbles into tiny bubbles, and prevent bubble aggregation.

[0012] Furthermore, the defoaming and vibration equalization device includes several swirling connection seats and a transmission toothed belt. The swirling connection seats are installed on the water supply shell and are connected to the inclined water outlet. A defoaming and vibration equalization head is rotatably installed on the swirling connection seat. A connecting shell is installed on the swirling connection seat, and a drive motor is installed on the connecting shell. A drive gear is installed on the output shaft of the drive motor. The transmission toothed belt meshes with several defoaming and vibration equalization heads for transmission, and the transmission toothed belt meshes with the drive gear for transmission.

[0013] The inner ring of the transmission toothed belt meshes with the transmission gear through the transmission teeth, while the outer ring of the transmission toothed belt meshes with the drive gear through the transmission teeth.

[0014] During water supply, the control system activates the drive motor. The motor's output shaft rotates the drive gear, which in turn drives the transmission belt. The transmission belt, through the driven gear, drives the defoaming and uniform vibrating head to rotate. The distribution shell rotates accordingly, and the water distribution port on it continuously dispenses water during rotation, constantly changing the direction and speed of the ultrapure water flow. This causes the replenished ultrapure water to form a continuously changing propagation path in the original solution, generating a disturbance effect. This continuous disturbance of the liquid synchronously changes the propagation path of the ultrasonic waves, thus preventing the formation of stable standing waves within the square cleaning tank. This results in continuously changing and more uniform vibrations around the wafer cleaning glass tank, avoiding localized stress concentrations or even glass breakage around the glass, and also preventing uneven cleaning.

[0015] Furthermore, the defoaming and oscillating rotor includes a flow-diverting outer shell, which is rotatably mounted on a cyclone connector. A defoaming inner shell is installed inside the flow-diverting outer shell, a rotary joint is rotatably mounted on the defoaming inner shell, a sliding detection plug is slidably installed inside the defoaming inner shell, a membrane frame is installed on the defoaming inner shell, and several hydrophobic porous membranes are installed on the membrane frame. A pressure sensor is installed on the side of the sliding detection plug near the membrane frame.

[0016] The rotary joint is externally connected to a pressure control device, which is used to pressurize or depressurize the interior of the defoaming inner shell via the rotary joint. A hydrophobic porous membrane is used to allow air to pass through while blocking ultrapure water.

[0017] During water replenishment, the pressure control device reduces the pressure in the adjustment area between the rotary joint and the sliding detection plug inside the defoaming inner shell. The negative pressure causes the sliding detection plug to slide towards the rotary joint in the defoaming inner shell. After the sliding detection plug slides, the collection area between the sliding detection plug and the hydrophobic porous membrane is evacuated. The control system controls the movement distance of the sliding detection plug through the electrical signal transmitted by the pressure sensor, so that a moderate negative pressure appears in the collection area, which allows the bubbles in contact with the hydrophobic porous membrane to be drawn in more quickly.

[0018] During maintenance, the ultrapure water in the outer tank of the cleaning machine is drained. Then, the pressure control device pressurizes the adjustment area, causing the sliding detection plug to slide in the opposite direction and expelling the collected air.

[0019] Furthermore, anti-clogging needles are installed on the membrane frame, which pass through the swirl connector and the angled outlet and enter the diversion chamber.

[0020] After passing through the vortex connector and the angled outlet, the anti-clogging needle tip enters the diversion chamber. When large air bubbles clog the gap between the diversion chamber and the angled outlet, the rotating needle tip can break up the bubbles.

[0021] Furthermore, the diversion housing is provided with several staggered water distribution ports, and a transmission gear is installed on the diversion housing, which meshes with the transmission belt for transmission.

[0022] Furthermore, the swirl connector is provided with several swirl vanes and a swirl cavity, which is connected to the inclined outlet. Several swirl vanes are arranged around the swirl cavity.

[0023] When ultrapure water enters the vortex connector from the inclined outlet, it comes into contact with the annularly arranged vortex vanes. Under the action of the vortex vanes, it rotates, and the rotation of the water generates centrifugal force. Because the mass of the ultrapure water is greater than the control, it moves outward. The air bubbles in the water flow gradually settle in the center of the water flow. When the water flow enters the distribution shell, the water flow on the outside quickly enters the area between the defoaming inner shell and the distribution shell, and is discharged from the water distribution port. The air bubbles in the center of the water flow come into contact with the hydrophobic porous membrane on the membrane frame at the front end of the defoaming inner shell. The hydrophobic porous membrane will draw in the air bubbles that come into contact with it, achieving the effect of air bubble absorption.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] 1. Using ultrapure water as a medium, ultrasonic vibrations are effectively transmitted to the wafer cleaning glass tank, causing the strong acid solution inside the tank to vibrate uniformly, achieving efficient cleaning of the wafers. A water supply system and a diversion water supply device ensure continuous replenishment of ultrapure water, maintaining a suitable water level in both the outer tank of the cleaning machine and the ultrasonic cleaning tank, reducing manual intervention and conserving resources.

[0026] 2. The rotational disturbance of the inclined water outlet and the diversion shell breaks the fixed sound wave propagation path in the liquid, avoiding the formation of standing waves. This ensures that the vibration around the glass tank is continuously varied and evenly distributed, reducing local stress concentration and the risk of glass breakage, and preventing uneven cleaning. When large air bubbles block the pores between the diversion chamber and the inclined water outlet, the rotating needle tip can break the bubbles.

[0027] 3. The centrifugal separation effect of the swirl connector and the annular swirl vane concentrates the air bubbles in the water flow at the center, while the ultrapure water on the outside is quickly discharged. The air bubbles are efficiently absorbed after contacting the hydrophobic porous membrane, which significantly improves the defoaming effect.

[0028] 4. The oblique water replenishment creates high turbulence pulsation and local shear stress at the interface with the original liquid, which shears large bubbles into tiny bubbles, prevents bubble aggregation, and improves liquid purity and ultrasonic cleaning efficiency.

[0029] 5. The pressure control device precisely controls the movement distance of the sliding detection plug by adjusting the pressure reduction or increase in the adjustment area. It utilizes moderate negative pressure to accelerate bubble intake and improve defoaming efficiency. During maintenance, reverse pressurization can expel the collected air, achieving both bubble collection and removal. Attached Figure Description

[0030] Figure 1 This is a perspective view of the wafer cleaning apparatus of the present invention;

[0031] Figure 2 The three-dimensional representation of the wafer cleaning apparatus of the present invention Figure 1 ;

[0032] Figure 3 The three-dimensional representation of the wafer cleaning apparatus of the present invention Figure 2 ;

[0033] Figure 4 This is a perspective view of the water diversion supply device of the present invention;

[0034] Figure 5 This is an exploded view of the wafer cleaning apparatus of the present invention;

[0035] Figure 6 The three-dimensional representation of the wafer cleaning apparatus of the present invention Figure 3 ;

[0036] Figure 7 For the present invention Figure 3 A magnified view of a portion of region A in the middle;

[0037] Figure 8 This is a perspective view of the defoaming and vibration equalization device of the present invention;

[0038] Figure 9 This is a perspective view of the bubble-removing and uniform vibrating rotor of the present invention;

[0039] Figure 10 For the present invention Figure 9 A magnified view of a portion of region B in the middle.

[0040] In the diagram: 1. Outer tank of the cleaning machine; 2. Wafer cleaning glass tank; 3. Ultrasonic cleaning tank; 4. Ultrasonic device; 5. Base plate; 6. Cover; 7. Cleaning tank track; 8. Diverting water supply device; 9. Defoaming and vibration device; 31. Cleaning tank support legs; 91. Defoaming and vibration rotor; 92. Transmission toothed belt; 93. Drive motor; 94. Drive gear; 95. Swirl connector; 96. Connecting shell; 911. Diverting outer shell; 912. Defoaming inner shell; 913. Sliding detection plug; 914. Anti-clogging pin; 915. Membrane holder; 916. Rotary joint; 9111. Water distribution port; 9112. Transmission gear; 951. Swirl vane; 81. Water supply shell; 82. Angled outlet; 83. Inlet; 84. Diverting chamber. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] like Figures 1-10 As shown, the present invention provides a wafer cleaning device based on ultrasonic cleaning: it includes an outer tank 1 and an ultrasonic cleaning tank 3. The bottom of the ultrasonic cleaning tank 3 is equipped with cleaning tank support legs 31, which are installed inside the outer tank 1. A base plate 5 is installed on the ultrasonic cleaning tank 3. An ultrasonic device 4 is installed on the ultrasonic cleaning tank 3. A cover 6 is installed on the base plate 5 and connected to the ultrasonic cleaning tank 3. Cleaning tank tracks 7 are symmetrically installed on the base plate 5. A wafer cleaning glass tank 2 is installed on the cleaning tank tracks 7. A water diversion device 8 is also installed inside the ultrasonic cleaning tank 3. A defoaming and vibration equalization device 9 is installed on the water diversion device 8.

[0043] The wafer cleaning glass tank 2 is filled with a strong acid solution for cleaning the wafers. Ultrapure water is filled between the outer tank 1 and the wafer cleaning glass tank 2. An external control cabinet is connected to the wafer cleaning unit to control its operation. During cleaning, the control system activates the ultrasonic device 4, which vibrates. This vibration is transmitted through the ultrapure water to the wafer cleaning glass tank 2, causing the internal strong acid solution to vibrate and clean the wafers. The control system supplies water to the diversion water supply device 8 via a water supply system. The replenished ultrapure water is evenly diverted by the inclined outlet 82, entering the corresponding vortex connector 95 and defoaming and uniform vibration rotor 91. The treated ultrapure water is then discharged into the ultrasonic cleaning tank 3 and then back into the outer tank 1 of the cleaning unit, achieving continuous replenishment of lost ultrapure water.

[0044] The water supply device 8 includes a water supply housing 81, which is installed in the ultrasonic cleaning tank 3. The water supply housing 81 is provided with a water inlet 83 and a diversion cavity 84 inside. The top of the water supply housing 81 is provided with several oblique water outlets 82, which are connected to the diversion cavity 84. A defoaming and vibration equalization device 9 is installed on the water supply housing 81, which is connected to the oblique water outlets 82.

[0045] The inlet 83 is connected to a water supply device, which is used to replenish ultrapure water into the diversion chamber 84 through the inlet 83. The replenished ultrapure water is evenly diverted by the inclined outlet 82. The diverted ultrapure water enters the corresponding vortex connector 95 and the defoaming and uniform vibration rotor 91. The treated ultrapure water is discharged into the ultrasonic cleaning tank 3 and then enters the outer tank 1 of the cleaning machine.

[0046] The inclined water outlet 82 is set at an angle. The inclined water outlet 82, together with the inclined vortex connector 95 and the defoaming and uniform vibrating rotor 91, allows the water to enter the outer tank 1 of the cleaning machine at an angle. When the inclined replenished water comes into contact with the original liquid, a transition zone will appear at their interface where the speed changes from fast to slow and the direction changes. High turbulence pulsation and local shear stress are generated in the zone, which can effectively tear the bubbles, shear and break the large bubbles into small bubbles, and avoid bubble aggregation.

[0047] The defoaming and vibration equalization device 9 includes several swirl connection seats 95 and a transmission toothed belt 92. The swirl connection seats 95 are installed on the water supply housing 81 and are connected to the inclined water outlet 82. A defoaming and vibration equalization rotor 91 is rotatably installed on the swirl connection seat 95. A connecting shell 96 is installed on the swirl connection seat 95 and a drive motor 93 is installed on the connecting shell 96. A drive gear 94 is installed on the output shaft of the drive motor 93. The transmission toothed belt 92 meshes with the several defoaming and vibration equalization rotors 91 and the drive gear 94.

[0048] The inner ring of the transmission toothed belt 92 meshes with the transmission gear 9112 through the transmission teeth, and the outer ring of the transmission toothed belt 92 meshes with the drive gear 94 through the transmission teeth.

[0049] During water supply, the control system activates the drive motor 93. The motor output shaft drives the drive gear 94 to rotate, which in turn drives the transmission belt 92. The transmission belt 92 drives the defoaming and uniform vibration head 91 to rotate via the driven gear. The diversion shell 911 rotates accordingly, and the water distribution port 9111 on it continuously outputs water during rotation, constantly changing the direction and speed of the ultrapure water output. This causes the added ultrapure water to form a continuously changing propagation path in the original solution, generating a disturbance effect. The continuous disturbance of the liquid causes the propagation path of the ultrasonic waves in the liquid to change synchronously, thereby avoiding the formation of stable standing waves by fixed sound waves in the square cleaning tank. This makes the vibration around the wafer cleaning glass tank 2 continuously change and more uniform, avoiding problems such as local stress concentration or even glass breakage around the glass, and also preventing uneven cleaning.

[0050] The vortex connector 95 is equipped with several vortex vanes 951 and a vortex cavity, which is connected to the inclined outlet 82. The vortex vanes 951 are arranged in a ring around the vortex cavity. When ultrapure water enters the vortex connector 95 from the inclined outlet 82, it comes into contact with the annularly arranged vortex vanes 951 and rotates under the action of the vortex vanes 951. The rotation of the water generates centrifugal force, and the ultrapure water moves outward due to its mass being greater than the control limit. The air bubbles in the water flow gradually move to the center of the water flow. When the water flow enters the distribution shell 911, the water flow on the outside quickly enters the area between the defoaming inner shell 912 and the distribution shell 911, and is discharged from the water equalization port 9111. The air bubbles in the center of the water flow come into contact with the hydrophobic porous membrane on the membrane frame 915 at the front end of the defoaming inner shell 912. The hydrophobic porous membrane draws in the air bubbles that come into contact with it, achieving the effect of air bubble absorption.

[0051] The defoaming and oscillating rotary head 91 includes a flow-diverting outer shell 911, which is rotatably mounted on a cyclone connector 95. A defoaming inner shell 912 is installed inside the flow-diverting outer shell 911. A rotary joint 916 is rotatably mounted on the defoaming inner shell 912. A sliding detection plug 913 is slidably installed inside the defoaming inner shell 912. A membrane frame 915 is installed on the defoaming inner shell 912. Several hydrophobic porous membranes are installed on the membrane frame 915. A pressure sensor is installed on the side of the sliding detection plug 913 near the membrane frame 915.

[0052] The rotary joint 916 is externally connected to a pressure control device, which is used to pressurize or depressurize the interior of the defoaming inner shell 912 via the rotary joint 916. A hydrophobic porous membrane is used to allow air to pass through while blocking ultrapure water.

[0053] During water replenishment, the pressure control device reduces the pressure in the adjustment area between the rotary joint 916 and the sliding detection plug 913 inside the defoaming inner shell 912. The negative pressure causes the sliding detection plug 913 to slide towards the rotary joint 916 in the defoaming inner shell 912. After the sliding detection plug 913 slides, the collection area between the sliding detection plug 913 and the hydrophobic porous membrane is evacuated. The control system controls the movement distance of the sliding detection plug 913 through the electrical signal transmitted by the pressure sensor, so that a moderate negative pressure appears in the collection area, thereby allowing the bubbles in contact with the hydrophobic porous membrane to be drawn in more quickly.

[0054] During maintenance, the ultrapure water in the outer tank 1 of the cleaning machine is drained. Then, the pressure control device pressurizes the adjustment area, causing the sliding detection plug 913 to slide in the reverse direction and expelling the collected air.

[0055] The membrane frame 915 is also equipped with an anti-clogging needle 914, which passes through the vortex connector 95 and the inclined outlet 82 and enters the diversion chamber 84.

[0056] After passing through the vortex connector 95 and the oblique outlet 82, the anti-clogging needle 914 enters the diversion chamber 84 at its tip. When a large air bubble blocks the flow between the diversion chamber 84 and the oblique outlet 82, the rotating needle tip can break the air bubble.

[0057] The diversion housing 911 is provided with a number of staggered water distribution ports 9111, and a transmission gear 9112 is installed on the diversion housing 911. The transmission gear 9112 meshes with the transmission belt 92 for transmission.

[0058] The working principle of this invention is as follows: During cleaning, the control system activates the ultrasonic device 4, which generates vibration. This vibration is transmitted through ultrapure water to the wafer cleaning glass tank 2. The wafer cleaning glass tank 2 then vibrates the strong acid solution inside, cleaning the wafer. The control system supplies water to the diversion water supply device 8 via a water supply device. The replenished ultrapure water is evenly diverted by the inclined outlet 82. The diverted ultrapure water enters the corresponding vortex connector 95 and the defoaming and uniform vibration rotor 91. The treated ultrapure water is discharged into the ultrasonic cleaning tank 3 and then into the outer tank 1 of the cleaning machine, achieving the purpose of continuously replenishing the lost ultrapure water.

[0059] When ultrapure water enters the vortex connector 95 from the inclined outlet 82, it comes into contact with the annularly arranged vortex vanes 951. Under the action of the vortex vanes 951, it rotates, and the water rotation generates centrifugal force. Because the mass of the ultrapure water is greater than the control, it moves outward. The air bubbles in the water flow gradually reside in the center of the water flow. When the water flow enters the distribution shell 911, the water flow on the outside quickly enters the area between the defoaming inner shell 912 and the distribution shell 911, and is discharged from the water distribution port 9111. The air bubbles in the center of the water flow come into contact with the hydrophobic porous membrane on the membrane frame 915 at the front end of the defoaming inner shell 912. The hydrophobic porous membrane will absorb the air bubbles that come into contact with it, achieving the effect of air bubble absorption.

[0060] During water supply, the control system activates the drive motor 93. The motor output shaft drives the drive gear 94 to rotate, which in turn drives the transmission belt 92. The transmission belt 92 drives the defoaming and uniform vibration head 91 to rotate via the driven gear. The diversion shell 911 rotates accordingly, and the water distribution port 9111 on it continuously outputs water during rotation, constantly changing the direction and speed of the ultrapure water output. This causes the added ultrapure water to form a continuously changing propagation path in the original solution, generating a disturbance effect. The continuous disturbance of the liquid causes the propagation path of the ultrasonic waves in the liquid to change synchronously, thereby avoiding the formation of stable standing waves by fixed sound waves in the square cleaning tank. This makes the vibration around the wafer cleaning glass tank 2 continuously change and more uniform, avoiding problems such as local stress concentration or even glass breakage around the glass, and also preventing uneven cleaning.

[0061] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A wafer cleaning apparatus based on ultrasonic cleaning, characterized by: The wafer cleaning device comprises an external tank of cleaning machine (1) and an ultrasonic cleaning tank (3), the bottom of the ultrasonic cleaning tank (3) is provided with cleaning tank supporting legs (31), the cleaning tank supporting legs (31) are installed in the external tank of cleaning machine (1), the ultrasonic cleaning tank (3) is provided with a bottom plate (5), the ultrasonic cleaning tank (3) is provided with an ultrasonic device (4), the bottom plate (5) is provided with a cover (6), the cover (6) is connected with the ultrasonic cleaning tank (3), the bottom plate (5) is symmetrically provided with cleaning tank tracks (7), the cleaning tank tracks (7) are provided with wafer cleaning glass tanks (2), the ultrasonic cleaning tank (3) is further provided with a shunt water supply device (8), and the shunt water supply device (8) is provided with a bubble removing and uniform vibration device (9). The shunt water supply device (8) comprises a water supply shell (81), the water supply shell (81) is installed in the ultrasonic cleaning tank (3), the water supply shell (81) is provided with a water inlet (83), the water supply shell (81) is provided with a shunt cavity (84), the top end of the water supply shell (81) is provided with a plurality of inclined water outlets (82), the inclined water outlets (82) are communicated with the shunt cavity (84), and the water supply shell (81) is provided with the bubble removing and uniform vibration device (9), and the bubble removing and uniform vibration device (9) is communicated with the inclined water outlets (82). The bubble removing and uniform vibration device (9) comprises a plurality of cyclone connecting bases (95) and a transmission toothed belt (92), the cyclone connecting bases (95) are installed on the water supply shell (81) and communicated with the inclined water outlets (82), the cyclone connecting bases (95) are rotatably provided with bubble removing and uniform vibration rotating heads (91), the cyclone connecting bases (95) are provided with connecting shells (96), the connecting shells (96) are provided with driving motors (93), the driving motors (93) are provided with driving gears (94) on output shafts, and the transmission toothed belt (92) is in meshing transmission with the plurality of bubble removing and uniform vibration rotating heads (91) and the driving gears (94).

2. The wafer cleaning device based on ultrasonic cleaning according to claim 1, wherein: The inclined water outlets (82) are arranged in an inclined manner.

3. The wafer cleaning device based on ultrasonic cleaning according to claim 1, wherein: The bubble removing and uniform vibration rotating head (91) comprises a shunt shell (911), the shunt shell (911) is rotatably installed on the cyclone connecting base (95), the shunt shell (911) is provided with a bubble removing inner shell (912), the bubble removing inner shell (912) is rotatably provided with a rotating joint (916), the bubble removing inner shell (912) is slidably provided with a sliding detection plug (913), the bubble removing inner shell (912) is provided with a membrane rack (915), the membrane rack (915) is provided with a plurality of hydrophobic porous membranes, and the side, close to the membrane rack (915), of the sliding detection plug (913) is provided with a pressure sensor.

4. The wafer cleaning apparatus based on ultrasonic cleaning according to claim 3, wherein: The membrane rack (915) is further provided with an anti-blocking needle (914), the anti-blocking needle (914) penetrates through the cyclone connecting base (95) and the inclined water outlet (82) and enters the shunt cavity (84).

5. The wafer cleaning apparatus based on ultrasonic cleaning according to claim 3, wherein: The shunt shell (911) is provided with a plurality of staggered water distribution openings (9111), and a transmission gear (9112) is installed on the shunt shell (911) and engaged with a transmission toothed belt (92).

6. The wafer cleaning apparatus based on ultrasonic cleaning according to claim 1, wherein: The cyclone connecting seat (95) is provided with a plurality of cyclone pieces (951), and the cyclone connecting seat (95) is provided with a cyclone cavity, the cyclone cavity is communicated with the inclined water outlet (82), and the plurality of cyclone pieces (951) are arranged in the cyclone cavity.

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