Environment-friendly wafer ultrasonic cleaning equipment

Abstract

The application discloses an environment-friendly wafer ultrasonic cleaning equipment and relates to the field of wafer ultrasonic cleaning liquid recovery.The equipment comprises a cleaning chamber and a recovery filtering chamber, the cleaning chamber is fixedly installed at the top of the recovery filtering chamber and is used for cleaning wafers by using ultrasonic waves, a cleaning recovery mechanism is fixedly installed at the top of the recovery filtering chamber, a filtering mechanism is fixedly installed in the recovery filtering chamber, and the filtering mechanism is in communication with the cleaning recovery mechanism.The equipment is provided with the recovery filtering chamber, cleaning liquid flows into the filtering mechanism through the cleaning recovery mechanism, and the cleaning liquid is recycled after being filtered by double filtering cores.The recycling mode greatly reduces the consumption of the cleaning liquid, reduces production cost, reduces the pollution of the cleaning liquid discharge to the environment, and the like.In addition, the backflow pipeline utilizes a liquid level difference to make the cleaning liquid flow naturally, reduces the use of additional power equipment, reduces energy consumption, and realizes the double goals of environmental protection and energy saving.

Description

Technical Field

[0001] This invention relates to the field of wafer ultrasonic cleaning fluid recovery technology, specifically to an environmentally friendly wafer ultrasonic cleaning device. Background Technology

[0002] Ultrasonic cleaning of wafers is a key technology for cleaning wafers in semiconductor manufacturing. It utilizes the properties of ultrasonic waves to effectively remove impurities from the wafer surface.

[0003] However, in existing technologies, traditional wafer cleaning equipment typically discharges the cleaning solution directly after a single use without effective recycling and reuse. This not only wastes a large amount of cleaning solution and increases production costs, but also puts significant pressure on the environment. Especially with the expansion of the semiconductor industry, the consumption and cost of cleaning solutions are becoming increasingly prominent. There is a need for equipment that can efficiently recycle and reuse cleaning solutions to reduce resource waste and costs. Furthermore, during the cleaning process, there are many types of impurities on the wafer surface, such as particulate contaminants, organic residues, and metal ions. Ordinary cleaning equipment cannot completely remove these impurities, resulting in residual impurities that affect subsequent wafer processing and chip performance. Summary of the Invention

[0004] The purpose of this invention is to provide an environmentally friendly ultrasonic cleaning device for wafers, in order to solve the problem mentioned in the background art that the cleaning fluid is usually discharged directly after a single use without effective recycling and reuse. This not only causes a large amount of cleaning fluid waste and increases production costs, but also puts a great deal of pressure on the environment.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an environmentally friendly wafer ultrasonic cleaning device, comprising a cleaning chamber and a recovery filter chamber, wherein the cleaning chamber is fixedly installed on the top of the recovery filter chamber for ultrasonic cleaning of wafers, a cleaning and recovery mechanism is fixedly installed on the top of the recovery filter chamber, and a filter mechanism is fixedly installed inside the recovery filter chamber, the filter mechanism being connected to the cleaning and recovery mechanism.

[0006] The cleaning and recycling mechanism includes a partition platform, an overflow baffle, and a main cylinder. The main cylinder is fixedly installed at the center of the partition platform. The overflow baffle is fixedly installed on the upper surface of the partition platform, surrounding and above the main cylinder. A movable plate is slidably connected inside the main cylinder. Return pipes are connected to both sides of the main cylinder, and there is a height difference between the connection port of the return pipe and the main cylinder.

[0007] The filtration mechanism includes a hollow tube, a first piston, and a second piston. The first piston and the second piston are symmetrically slidably connected inside the hollow tube. The hollow tube is connected to the return pipe and is perpendicular to the return pipe. Two filter elements are provided at the junction of the return pipe and the hollow tube.

[0008] Preferably, vertical plates are fixedly installed at both ends of the partition platform, a positioning frame is fixedly installed at the top of the recycling filter chamber, the vertical plates are fixedly connected to the positioning frame, and a positioning plate is fixedly installed at the bottom of the recycling filter chamber.

[0009] Preferably, a geared motor is fixedly installed on the upper surface of one end of the positioning plate, the output shaft of the geared motor is fixedly connected to a crank, one end of the crank is fixedly connected to a transmission rod, one end of the transmission rod is rotatably connected to a push rod, and the push rod is rotatably connected to the first piston.

[0010] Preferably, a secondary rod is rotatably connected to the outer wall of the crank, and a connecting rod is rotatably connected to one end of the secondary rod. The connecting rod is located above the hollow tube and is fixedly connected to the second piston, which is located below the connecting rod.

[0011] Preferably, the connecting rod has a cavity inside, and a vertical rod is fixedly installed on the lower surface of the movable plate, with the vertical rod inserted into the cavity.

[0012] Preferably, a partition plate is fixedly installed on the inner wall of the main cylinder, and a notch is opened at the edge of the partition plate. A support column is fixedly installed on the upper surface of the partition plate, and a turntable is rotatably connected to the top of the support column. A small motor is fixedly installed on one side of the support column, and the output end of the small motor is meshed with the bottom of the turntable.

[0013] Preferably, a permeation plate is fixedly installed on the inner wall of the return pipe, a sealing block is slidably connected inside the permeation plate, and a spring is fixedly connected between the sealing block and the permeation plate.

[0014] Preferably, a first arc plate and a second arc plate are movably installed at the junction of the return pipe and the main cylinder. The first arc plate is slidably connected to the return pipe and the vertical plate. A water pump is fixedly installed inside a section of the return pipe, and the water pump is located below the second arc plate.

[0015] Preferably, the partition platform has a connecting hole inside, which communicates with the main cylinder, and the junction of the connecting hole and the partition platform is located between the main cylinder and the overflow baffle.

[0016] Preferably, an electric cylinder is fixedly installed on the upper surface of the other end of the positioning plate, and one end of the piston of the electric cylinder is fixedly connected to the movable plate.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. In this invention, the equipment is equipped with a recovery filtration chamber. The cleaning fluid flows into the filtration mechanism through the cleaning recovery mechanism, and is then filtered through a double filter element before being recycled. This recycling method significantly reduces the consumption of cleaning fluid, lowers production costs, and reduces environmental pollution caused by cleaning fluid discharge. Furthermore, the return pipeline utilizes the liquid level difference to allow the cleaning fluid to flow naturally, reducing the need for additional power equipment, lowering energy consumption, and achieving the dual goals of environmental protection and energy conservation.

[0019] 2. In this invention, the cleaning chamber utilizes ultrasonic cleaning of the wafer. The explosive force of the bubbles generated by the ultrasonic waves effectively removes particulate contaminants, organic residues, and metal ions from the wafer surface. The turntable rotates under the drive of a small motor, ensuring that the wafer comes into full contact with the cleaning solution, resulting in more uniform and thorough cleaning. A dual-filter system efficiently filters the cleaning solution, preventing secondary contamination of the wafer by impurities and guaranteeing the cleanliness of the wafer surface after cleaning. This contributes to improving the quality of subsequent processing steps and chip performance.

[0020] 3. In this invention, the partition platform, vertical plate, positioning frame, and positioning plate of the equipment are interconnected, constructing a stable structural framework to ensure the stability and reliability of each component during operation. The inclusion of components such as electric cylinders and geared motors makes the operation of the equipment more precise and controllable. Moreover, the rational design of each component facilitates inspection and maintenance. Regularly checking the wear of components such as filter elements, springs, sealing blocks, and arc plates, and replacing them in a timely manner, can ensure the long-term stable operation of the equipment, reduce equipment failures and downtime, and improve production efficiency. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of an environmentally friendly ultrasonic cleaning device for wafers according to the present invention;

[0022] Figure 2 This is a schematic diagram of the internal structure of the recycling filter chamber of an environmentally friendly wafer ultrasonic cleaning device according to the present invention;

[0023] Figure 3 This is a schematic diagram of the planar structure of the cleaning and recycling mechanism and the filtration mechanism of an environmentally friendly wafer ultrasonic cleaning equipment according to the present invention;

[0024] Figure 4 This is a schematic diagram of the internal structure of the cleaning and recycling mechanism and the filtration mechanism of an environmentally friendly wafer ultrasonic cleaning equipment according to the present invention.

[0025] Figure 5 This is a schematic diagram of the planar structure of the cleaning and recycling mechanism and the filtration mechanism of an environmentally friendly wafer ultrasonic cleaning equipment according to the present invention;

[0026] Figure 6 This is a schematic diagram of the planar structure of the filter mechanism of an environmentally friendly wafer ultrasonic cleaning device according to the present invention;

[0027] Figure 7 This is a schematic diagram showing the disassembled structure of the movable plate and connecting rod of an environmentally friendly wafer ultrasonic cleaning device according to the present invention;

[0028] Figure 8 This is a schematic diagram of the operation process of an environmentally friendly ultrasonic cleaning device for wafers according to the present invention.

[0029] In the diagram: 1. Cleaning chamber; 2. Recycling and filtration chamber; 3. Cleaning and recycling mechanism; 4. Filtration mechanism; 5. Positioning plate; 6. Positioning frame; 31. Divider; 32. Overflow baffle; 33. Turntable; 34. Vertical plate; 35. Main cylinder; 36. Return pipe; 37. Divider; 38. Support column; 39. Small motor; 310. Connecting hole; 311. Notch; 312. Movable plate; 313. Electric cylinder; 314. Permeation plate; 315. Sealing block; 316. First arc plate; 317. Second arc plate; 318. Vertical rod; 319. Filter element; 320. Water pump; 41. Gear motor; 42. Hollow tube; 43. First piston; 44. Second piston; 45. Push rod; 46. Transmission rod; 47. Crank; 48. Secondary rod; 49. Connecting rod; 410. Cavity. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1: Refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown: An environmentally friendly ultrasonic wafer cleaning device includes a cleaning chamber 1 and a recovery filter chamber 2. The cleaning chamber 1 is fixedly installed on the top of the recovery filter chamber 2 and is used for ultrasonic cleaning of wafers. A cleaning recovery mechanism 3 is fixedly installed on the top of the recovery filter chamber 2. A filter mechanism 4 is fixedly installed inside the recovery filter chamber 2 and is connected to the cleaning recovery mechanism 3.

[0032] The cleaning and recycling mechanism 3 includes a partition platform 31, an overflow baffle 32, and a main cylinder 35. The main cylinder 35 is fixedly installed at the center of the partition platform 31. The overflow baffle 32 is fixedly installed on the upper surface of the partition platform 31, surrounding and being higher than the main cylinder 35. A movable plate 312 is slidably connected inside the main cylinder 35. Both sides of the main cylinder 35 are connected to return pipes 36, and there is a height difference between the connection port of the return pipes 36 and the main cylinder 35.

[0033] The filter mechanism 4 includes a hollow tube 42, a first piston 43 and a second piston 44. The first piston 43 and the second piston 44 are symmetrically slidably connected inside the hollow tube 42. The hollow tube 42 is connected to the return pipe 36 and is perpendicular to the return pipe 36. Two filter elements 319 are provided at the junction of the return pipe 36 and the hollow tube 42.

[0034] In this embodiment, the overall structure is as follows: the device consists of a cleaning chamber 1 and a recovery filter chamber 2. The cleaning chamber 1 is located on top of the recovery filter chamber 2. The cleaning chamber 1 uses ultrasonic cleaning to clean the wafer, while the recovery filter chamber 2 is responsible for the recovery and filtration of the cleaning solution. The two work together to ensure the efficient operation of the cleaning process. This device uses clean water as the cleaning solution.

[0035] Cleaning and recycling facility 3

[0036] Component composition and function: The partition platform 31 is used to support and fix the main cylinder 35, and at the same time rationally divides the top space of the recovery filter chamber 2; the overflow baffle 32 surrounds the main cylinder 35 and is higher than it, which can effectively prevent the cleaning fluid from overflowing, ensure the safe operation of the equipment, and avoid the environmental pollution or equipment damage caused by the outflow of cleaning fluid. The main cylinder 35 is a key component for the storage and circulation of cleaning fluid. The movable plate 312 can slide inside it. The change in the position of the movable plate 312 will affect the pressure and circulation path of the cleaning fluid in the main cylinder 35.

[0037] Return pipe 36 design: There is a height difference between the return pipe 36 on both sides of the main cylinder 35 and the connection port of the main cylinder 35. This design utilizes the principle of liquid level difference, so that the cleaning fluid can flow naturally between the main cylinder 35 and the return pipe 36, providing power for the circulation of the cleaning fluid, reducing the use of additional power equipment, and reducing energy consumption.

[0038] Filtering mechanism 4: The first piston 43 and the second piston 44 inside the hollow tube 42 slide symmetrically. The movement of the pistons changes the pressure inside the hollow tube 42, thereby controlling the flow direction and speed of the cleaning fluid inside the hollow tube 42. Two filter elements 319 are set at the junction of the return pipe 36 and the hollow tube 42, which can perform double filtration on the cleaning fluid flowing into the hollow tube 42 from the main cylinder 35, effectively removing impurities in the cleaning fluid, ensuring the cleanliness of the cleaning fluid returning to the main cylinder 35, improving the cleaning effect, and reducing secondary contamination of the wafer by impurities.

[0039] Example 2: According to Figure 3 , Figure 4 and Figure 5 As shown, the cleaning and recycling mechanism 3 includes a partition platform 31, an overflow baffle 32, and a main cylinder 35. The main cylinder 35 is fixedly installed at the center of the partition platform 31. The overflow baffle 32 is fixedly installed on the upper surface of the partition platform 31, surrounding and exceeding the main cylinder 35. A movable plate 312 is slidably connected inside the main cylinder 35. Return pipes 36 are connected to both sides of the main cylinder 35, and there is a height difference between the connection port of the return pipes 36 and the main cylinder 35. Vertical plates 34 are fixedly installed at both ends of the partition platform 31. A positioning frame 6 is fixedly installed on the top of the recycling filter chamber 2, and the vertical plates 34 are fixedly connected to the positioning frame 6. A positioning plate 5 is fixedly installed on the bottom of the recycling filter chamber 2. A partition plate 37 is fixedly installed on the inner wall of the main cylinder 35. A notch 311 is opened at the edge of the partition plate 37. A support column 38 is fixedly installed on the upper surface of the partition plate 37. A turntable 33 is rotatably connected to the top of the support column 38. A small motor 3 is fixedly installed on one side of the support column 38. 9. The output end of the small motor 39 is engaged with the bottom of the turntable 33. A permeation plate 314 is fixedly installed on the inner wall of the return pipe 36. A sealing block 315 is slidably connected inside the permeation plate 314. A spring is fixedly connected between the sealing block 315 and the permeation plate 314. A first arc-shaped plate 316 and a second arc-shaped plate 317 are movably installed at the junction of the return pipe 36 and the main cylinder 35. The first arc-shaped plate 316 is slidably connected to the return pipe 36 and the vertical plate 34. A water pump 320 is fixedly installed inside a section of the return pipe 36, and the water pump 320 is located below the second arc plate 317. A connecting hole 310 is opened inside the partition platform 31, which is connected to the main cylinder 35. The junction of the connecting hole 310 and the partition platform 31 is located between the main cylinder 35 and the overflow baffle 32. An electric cylinder 313 is fixedly installed on the upper surface of the other end of the positioning plate 5. One end of the piston of the electric cylinder 313 is fixedly connected to the movable plate 312.

[0040] In this embodiment, the wafer to be cleaned is placed on the turntable 33 inside the main cylinder 35 to ensure the wafer's position is stable. The connection of each component of the equipment is checked to ensure that the cleaning fluid is sufficient and the filter element 319 is normal, in preparation for cleaning. The partition table 31 is connected to the positioning frame 6 through the vertical plate 34 to ensure its own structural stability. The turntable 33 is installed on the support column 38 on the upper surface of the partition plate 37 to determine the position of the wafer. The equipment is started, the ultrasonic generator is turned on to generate ultrasonic waves in the cleaning chamber 1, and the small motor 39 is started at the same time. The small motor 39 drives the turntable 33 to rotate, so that the wafer rotates accordingly.

[0041] Wafer cleaning stage: The small motor 39 continuously pushes the turntable 33. Under the action of ultrasound, the cleaning fluid in the cleaning chamber 1 generates a large number of bubbles. The explosion of the bubbles completes the cleaning of the wafer surface, causing the impurities on the wafer surface to be removed. As the cleaning proceeds, the cleaning fluid gradually increases. The wafer will eventually be immersed in the cleaning fluid. The cleaning fluid will flow into other areas of the main cylinder 35 through the connecting hole 310 inside the partition 31 to prevent the cleaning fluid from overflowing. The cleaning fluid flows into the bottom of the main cylinder 35 through the notch 311 on the edge of the partition plate 37 on the inner side wall of the main cylinder 35.

[0042] Cleaning fluid circulation and filtration stage: When the liquid level rises to a certain level, the electric cylinder 313 pulls down the movable plate 312, moving it below the first arc plate 316, allowing the cleaning fluid to rush through the first arc plate 316 and enter the return pipe 36. During this process, the vertical rod 318 slides within the cavity 410 of the connecting rod 49 to prevent the movable plate 312 from tilting. The reduction motor 41 on one end of the positioning plate 5 starts, driving the crank 47 to rotate. The crank 47 pushes the push rod 45 through the transmission rod 46, causing the first piston 43 and the second piston 44 to move away from each other. Under the action of the piston movement, a negative pressure is generated in the hollow tube 42, thereby drawing the cleaning fluid in the return pipe 36 into the hollow tube 42. When the cleaning fluid flows through the junction of the return pipe 36 and the hollow tube 42, it is filtered by the filter element 319. Subsequently, the first piston 43 and the second piston 44 move closer to each other, forcing the cleaning fluid in the hollow tube 42 into the return pipe 36, and finally out from the second arc plate 317. The cleaning fluid is recycled back to the main cylinder 35. A permeation plate 314 is installed in the return pipe 36 to ensure normal flow of the cleaning fluid. When the first piston 43 and the second piston 44 move away from each other to generate suction to draw out the cleaning fluid, the left blocking block 315 will move away from the permeation plate 314 to allow the cleaning fluid to flow into the hollow tube 42. At this time, the right blocking block 315 will stick to the permeation plate 314 to prevent the cleaning fluid from flowing out. When the first piston 43 and the second piston 44 move closer to each other to press out the cleaning fluid, the left blocking block 315 will stick to the permeation plate 314, while the right blocking block 315 will move away from the permeation plate 314. At this time, the cleaning fluid can enter the right return pipe 36. As the first piston 43 and the second piston 44 continue to move closer and further away, the cleaning fluid will be continuously pressed into the right return pipe 36. Finally, it will be drawn out by the water pump 320 and discharged back into the main cylinder 35. The pressure of the cleaning fluid will push open the second arc plate 317.

[0043] Equipment shutdown and maintenance phase: After cleaning is completed, turn off the ultrasonic generator and small motor 39, stop cleaning and wafer rotation, regularly check the contamination of filter element 319, and replace filter element 319 in time; check the wear of components such as spring, sealing block 315, and arc plate, and replace them in time if there is any damage to ensure normal operation of the equipment.

[0044] Example 3: According to Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the filter mechanism 4 includes a hollow tube 42, a first piston 43, and a second piston 44. The first piston 43 and the second piston 44 are symmetrically slidably connected inside the hollow tube 42. The hollow tube 42 is connected to the return pipe 36 and is perpendicular to the return pipe 36. Two filter elements 319 are provided at the junction of the return pipe 36 and the hollow tube 42. A geared motor 41 is fixedly installed on the upper surface of one end of the positioning plate 5. The output shaft of the geared motor 41 is fixedly connected to a crank 47, and one end of the crank 47 is fixedly connected to a transmission rod 46. One end of the transmission rod 46 is rotatably connected to the push rod 45, which is rotatably connected to the first piston 43. A secondary rod 48 is rotatably connected to the outer wall of the crank 47, and one end of the secondary rod 48 is rotatably connected to the connecting rod 49. The connecting rod 49 is located above the hollow tube 42 and is fixedly connected to the second piston 44. The second piston 44 is located below the connecting rod 49. A cavity 410 is opened inside the connecting rod 49. A vertical rod 318 is fixedly installed on the lower surface of the movable plate 312 and is inserted into the cavity 410.

[0045] In this embodiment, when the environmentally friendly wafer ultrasonic cleaning equipment is turned on, the geared motor 41 on the upper surface of one end of the positioning plate 5 is energized and starts, providing a power source for a series of subsequent movements. The output shaft of the geared motor 41 drives the crank 47 to perform circular motion. The transmission rod 46 connected to one end of the crank 47 swings with the rotation of the crank 47. The transmission rod 46 pushes the push rod 45, causing the first piston 43 to perform reciprocating linear motion inside the hollow tube 42. At the same time, the auxiliary rod 48 rotatably connected to the outer wall of the crank 47 also rotates with the crank 47. The auxiliary rod 48 drives the connecting rod 49 to move. Since the connecting rod 49 is fixedly connected to the second piston 44, the second piston 44 performs reciprocating linear motion inside the hollow tube 42 corresponding to the first piston 43, and the two movements are in opposite directions.

[0046] Under the relative motion of the first piston 43 and the second piston 44, a pressure difference is formed in the hollow tube 42. When the first piston 43 and the second piston 44 move away from each other, a negative pressure is generated, which draws the cleaning fluid in the main cylinder 35 into the hollow tube 42 through the return pipe 36. When the cleaning fluid flows through the junction of the return pipe 36 and the hollow tube 42, it is filtered by two filter elements 319 to trap impurities, metal shavings and other contaminants in the cleaning fluid. Then the first piston 43 and the second piston 44 move closer to each other, which pushes the cleaning fluid out of the hollow tube 42 and back to the main cylinder 35, realizing the recycling of the cleaning fluid. The cavity 410 in the connecting rod 49 is used to accommodate the vertical rod 318.

[0047] The usage and working principle of this device are as follows: Preparation: Place the wafer stably on the turntable 33 inside the main cylinder 35. Check whether the connection parts of the equipment are secure, whether the cleaning fluid is sufficient, and whether the filter element 319 is normal. When starting the equipment, turn on the ultrasonic generator to generate ultrasonic waves in the cleaning chamber 1. At the same time, start the small motor 39 to drive the turntable 33 to rotate, so that the wafer rotates accordingly, in preparation for cleaning, to ensure that the wafer can be cleaned evenly during the cleaning process and improve the cleaning effect.

[0048] Cleaning process: Inside cleaning chamber 1, the cleaning fluid generates a large number of bubbles under the action of ultrasound. The impact force generated by the bubble explosion impacts the wafer surface, causing impurities on the wafer surface to be removed. As cleaning continues, the amount of cleaning fluid increases. Some of the cleaning fluid flows into the main cylinder 35 through the connecting hole 310 inside the partition platform 31 to prevent the cleaning fluid from overflowing. The remaining cleaning fluid flows into the bottom of the main cylinder 35 through the notch 311 at the edge of the partition plate 37 on the inner side wall of the main cylinder 35.

[0049] Cleaning fluid circulation filtration process

[0050] Piston-driven cycle: The geared motor 41 on the positioning plate 5 starts, and its output shaft drives the crank 47 to perform circular motion. The crank 47 pushes the push rod 45 through the transmission rod 46, causing the first piston 43 to perform reciprocating linear motion in the hollow tube 42. At the same time, the auxiliary rod 48 rotatably connected to the outer wall of the crank 47 drives the connecting rod 49, causing the second piston 44 to perform reciprocating linear motion in the hollow tube 42 in the opposite direction to that of the first piston 43. This relative motion of the pistons creates a pressure difference in the hollow tube 42, providing power for the circulation of the cleaning fluid.

[0051] Filtration Process: When the first piston 43 and the second piston 44 move away from each other, a negative pressure is generated inside the hollow tube 42, drawing the cleaning fluid from the main cylinder 35 into the hollow tube 42 through the return pipe 36. As the cleaning fluid flows through the junction of the return pipe 36 and the hollow tube 42, it undergoes double filtration by two filter elements 319, effectively trapping impurities, metal shavings, and other contaminants in the cleaning fluid, ensuring the cleanliness of the cleaning fluid returning to the main cylinder 35. Afterward, the first piston 43 and the second piston 44 move closer together, forcing the filtered cleaning fluid into the return pipe 36, ultimately flowing back to the main cylinder 35. The cylinder 35 enables the recycling of the cleaning fluid. When the piston draws out the cleaning fluid, one side of the sealing block 315 moves away, allowing the cleaning fluid to flow into the hollow tube 42, while the other side of the sealing block 315 adheres to the permeation plate 314 to prevent the cleaning fluid from flowing out. When the piston pushes out the cleaning fluid, the two sealing blocks 315 are in opposite states to ensure that the cleaning fluid flows along a predetermined path. In addition, the water pump 320 installed in part of the return pipe 36 enhances the circulation power of the cleaning fluid. The pressure of the cleaning fluid can also open the second arc plate 317, assisting the cleaning fluid to circulate smoothly, further improving the circulation efficiency and cleaning effect.

[0052] Stop and maintenance: After cleaning, turn off the ultrasonic generator and small motor 39, stop cleaning and wafer rotation, regularly check the contamination of filter element 319, replace contaminated filter element 319 in time, and check the wear of components such as spring, sealing block 315, and arc plate.

[0053] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An environmentally friendly ultrasonic wafer cleaning device, comprising a cleaning chamber (1) and a recovery filter chamber (2), wherein the cleaning chamber (1) is fixedly installed on top of the recovery filter chamber (2) for ultrasonic cleaning of wafers, characterized in that: A cleaning and recycling mechanism (3) is fixedly installed on the top of the recycling filter chamber (2), and a filter mechanism (4) is fixedly installed inside the recycling filter chamber (2). The filter mechanism (4) is connected to the cleaning and recycling mechanism (3). The cleaning and recycling mechanism (3) includes a partition platform (31), an overflow baffle (32), and a main cylinder (35). The main cylinder (35) is fixedly installed at the center of the partition platform (31). The overflow baffle (32) is fixedly installed on the upper surface of the partition platform (31), surrounding and higher than the main cylinder (35). A movable plate (312) is slidably connected inside the main cylinder (35). Both sides of the main cylinder (35) are connected to return pipes (36), and there is a height difference between the connection port of the return pipes (36) and the main cylinder (35). The filter mechanism (4) includes a hollow tube (42), a first piston (43) and a second piston (44). The first piston (43) and the second piston (44) are symmetrically slidably connected inside the hollow tube (42). The hollow tube (42) is connected to the return pipe (36) and the hollow tube (42) is perpendicular to the return pipe (36). Two filter elements (319) are provided at the junction of the return pipe (36) and the hollow tube (42). A permeation plate (314) is fixedly installed on the inner wall of the return pipe (36). A sealing block (315) is slidably connected inside the permeation plate (314). A spring is fixedly connected between the sealing block (315) and the permeation plate (314). A first arc plate (316) and a second arc plate (317) are movably installed at the junction of the return pipe (36) and the main cylinder (35). The first arc plate (316) is slidably connected to the return pipe (36) and the vertical plate (34).

2. The environmentally friendly ultrasonic cleaning equipment for wafers according to claim 1, characterized in that: Vertical plates (34) are fixedly installed at both ends of the partition (31), a positioning frame (6) is fixedly installed on the top of the recycling filter chamber (2), the vertical plates (34) are fixedly connected to the positioning frame (6), and a positioning plate (5) is fixedly installed at the bottom of the recycling filter chamber (2).

3. The environmentally friendly ultrasonic cleaning equipment for wafers according to claim 2, characterized in that: A geared motor (41) is fixedly installed on the upper surface of one end of the positioning plate (5). The output shaft of the geared motor (41) is fixedly connected to a crank (47). One end of the crank (47) is fixedly connected to a transmission rod (46). One end of the transmission rod (46) is rotatably connected to a push rod (45). The push rod (45) is rotatably connected to the first piston (43).

4. The environmentally friendly ultrasonic cleaning equipment for wafers according to claim 3, characterized in that: A secondary rod (48) is rotatably connected to the outer wall of the crank (47). A connecting rod (49) is rotatably connected to one end of the secondary rod (48). The connecting rod (49) is located above the hollow tube (42). The connecting rod (49) is fixedly connected to the second piston (44). The second piston (44) is located below the connecting rod (49).

5. The environmentally friendly ultrasonic cleaning equipment for wafers according to claim 4, characterized in that: The connecting rod (49) has a cavity (410) inside, and a vertical rod (318) is fixedly installed on the lower surface of the movable plate (312). The vertical rod (318) is inserted into the cavity (410).

6. The environmentally friendly ultrasonic cleaning equipment for wafers according to claim 1, characterized in that: A partition plate (37) is fixedly installed on the inner wall of the main cylinder (35). A notch (311) is opened at the edge of the partition plate (37). A support column (38) is fixedly installed on the upper surface of the partition plate (37). A turntable (33) is rotatably connected to the top of the support column (38). A small motor (39) is fixedly installed on one side of the support column (38). The output end of the small motor (39) is meshed with the bottom of the turntable (33).

7. The environmentally friendly ultrasonic cleaning equipment for wafers according to claim 1, characterized in that: A water pump (320) is fixedly installed inside one section of the return pipe (36), and the water pump (320) is located below the second arc plate (317).

8. The environmentally friendly ultrasonic cleaning equipment for wafers according to claim 1, characterized in that: The partition platform (31) has a connecting hole (310) inside, which is connected to the main cylinder (35), and the junction of the connecting hole (310) and the partition platform (31) is located between the main cylinder (35) and the overflow baffle (32).

9. The environmentally friendly ultrasonic cleaning equipment for wafers according to claim 2, characterized in that: An electric cylinder (313) is fixedly installed on the upper surface of the other end of the positioning plate (5), and one end of the piston of the electric cylinder (313) is fixedly connected to the movable plate (312).

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