Soldering device and soldering method for assembling camera module

Abstract

The invention discloses a tin soldering device and method for assembling a camera module. The tin soldering device comprises a workbench, a rotatable double-station rotating disc is arranged on the workbench, and two stations of the double-station rotating disc are each provided with a carrier used for bearing the camera module; the workbench is further provided with a three-axis moving mechanism used for driving the laser welding head to move. A clamping mechanism is arranged on the workbench and located on one side of the double-station rotary table; the invention belongs to the technical field of welding, and achieves the technical effects that the action of clamping a PCB (Printed Circuit Board) at the upper part is closely associated with the action of clamping a camera shell by a carrier at the lower part, so that up-and-down synchronous fixation is realized; the linkage ensures that the whole workpiece (from the shell to the PCB) becomes a whole with extremely high rigidity at the moment of laser welding, any infinitesimal displacement caused by equipment vibration or tin melting tension is effectively inhibited, and the accuracy of the welding position and the reliability of the welding spot quality are improved.

Description

Technical Field

[0001] This invention relates to the field of welding technology, and more specifically to a soldering apparatus and method for assembling camera modules. Background Technology

[0002] As a core component of modern smart terminal devices, the imaging quality of the camera module directly determines the visual performance of the terminal device. In the assembly process of the camera module, the precise and reliable fixing of the printed circuit board (PCB) to the housing containing the lens assembly is a key process. At present, laser soldering technology is widely used in this connection process due to its advantages such as small heat-affected zone and high precision. This process usually involves first placing a solder ring on the positioning post of the housing, then covering it with the PCB board, and finally melting the solder ring by local laser heating. After cooling, a solder joint is formed, achieving mechanical fixation and electrical connection. However, existing soldering equipment for this type of assembly still faces several technical challenges in practical applications. First, the PCB board is typically initially aligned with the positioning posts on the housing via positioning holes, inevitably creating a clearance between them. During laser soldering, slight vibrations of the equipment itself or the surface tension of the molten solder can cause minor shifts in the PCB board, leading to inaccurate soldering positions and even defects such as bridging and cold solder joints, severely impacting yield. Second, in pursuit of efficiency, simple carriers are often used to fix the housing. These carriers either have insufficient clamping force to effectively suppress micro-movements during soldering, or excessive or uneven clamping force, posing a risk of damaging precision optical components. Furthermore, existing equipment has relatively limited functionality; the stability of the soldering station and the efficiency of loading and unloading are often difficult to balance. The rigidity, vibration resistance, and coordination of the entire system lack optimized design, limiting the achievement of high-precision, high-efficiency production goals. Therefore, since it does not meet the existing requirements, we propose a soldering device and soldering method for camera module assembly. Summary of the Invention

[0003] Therefore, the present invention provides a soldering apparatus and soldering method for assembling camera modules to solve the above-mentioned problems in the prior art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: According to a first aspect of the present invention, a soldering apparatus for assembling a camera module includes a worktable, on which a rotatable dual-station turntable is provided, and each of the two stations of the dual-station turntable is provided with a carrier for carrying a camera module; the worktable is also provided with a three-axis moving mechanism for driving a laser welding head to move; a clamping mechanism is provided on one side of the dual-station turntable on the worktable, the clamping mechanism is mounted on the worktable via a multi-dimensional motion mechanism, and the clamping mechanism is used to clamp and fix the PCB board on the camera module at the welding station; the carrier includes a platform and a pair of side plates movably disposed on the platform, the pair of side plates being drivenly connected to the clamping mechanism via a linkage mechanism, such that when the clamping mechanism performs a clamping action on the PCB board, it can synchronously drive the pair of side plates to move towards each other to clamp the housing of the camera module.

[0005] Furthermore, the multi-dimensional motion mechanism includes a Y / Z dual-axis traversal mechanism for coarse positioning and a PI six-axis for fine-tuning the attitude, with the clamping mechanism mounted on the output end of the PI six-axis.

[0006] Furthermore, the clamping mechanism includes a bidirectional clamping cylinder and a pair of grippers driven therefrom.

[0007] Furthermore, the linkage mechanism includes: a connecting column and an L-shaped plate disposed on the side plate; an adjustment frame rotatably disposed on the carrier; and a motion conversion mechanism connecting the clamping cylinder and the adjustment frame; the motion conversion mechanism is configured to convert the linear motion of the piston rod of the bidirectional clamping cylinder into the rotational motion of the adjustment frame, thereby driving the connecting column and the L-shaped plate to move the side plate linearly through the adjustment frame.

[0008] Furthermore, the motion conversion mechanism includes a rack one that is linked to the output end of the bidirectional clamping cylinder, a gear that meshes with the rack one, and a rack two that meshes with the gear.

[0009] Furthermore, a second connecting column is fixedly connected to the top of the other end of the adjusting frame away from the first connecting column; a lever is provided on the inner side of the second connecting column, and the bottom end of the lever is fixedly connected to the top end of the second rack.

[0010] Furthermore, a guide assembly is provided between the side plate and the platform. The guide assembly includes a guide frame, which is located on both sides of the bottom of the side plate, and a guide rail is slidably connected to the inner side of the guide frame.

[0011] Furthermore, the bottom of the guide rail is fixedly connected to the top of the platform, allowing the side plate to slide relative to the platform along the guide rail.

[0012] Furthermore, a spring is provided between the L-shaped connecting plate and the carrier.

[0013] A soldering method for assembling camera modules further includes the following steps: S1. Place the camera module 81, which has been pre-installed with PCB board and solder ring, on the carrier on this side from the loading and unloading end, and control the motor of the dual-station turntable to drive it to rotate 180 degrees to send the workpiece to be welded to the welding station. S2. Control the three-axis moving mechanism to move the laser welding head to the welding point; heat the tin ring sleeved on the positioning post to perform tin soldering, and after it cools and solidifies, firmly solder the PCB board to the positioning post of the camera module. S3. After the soldering is completed, control the dual-station turntable to rotate 180 degrees and turn the soldered workpiece back to the loading and unloading end for unloading.

[0014] The present invention has the following advantages: 1. This soldering device for assembling camera modules uses a mechanical linkage mechanism to forcibly synchronize the action of clamping the PCB board above with the action of clamping the camera housing below. When the clamping cylinder moves to drive the jaws to close and fix the PCB board, the linear motion is converted into rotational motion through a gear and rack transmission pair, which in turn drives the two side plates of the carrier to move towards each other, firmly holding the camera housing from both sides. This synchronous clamping mechanism makes the camera module housing and the PCB board above form a highly rigid whole at the moment of soldering, completely eliminating the slight relative displacement between the PCB board and the housing caused by factors such as equipment micro-vibration or surface tension when the solder melts. This elimination of displacement is the key to ensuring that each solder joint is accurately positioned, full in shape, and reliably connected, fundamentally eliminating soldering defects such as cold solder joints and bridging, and providing a solid mechanical foundation for the subsequent optical performance of the camera module. 2. This soldering device for assembling camera modules uses mechanical components such as gears, racks, and levers to achieve power transmission and motion conversion. Its response speed is extremely fast, and its synchronization is far superior to the scheme that relies on the coordinated action of multiple independent electronic control components. This purely mechanical synchronization method is not only stable and reliable in operation and has a long service life, but also reduces the requirements for the complexity of the control system, reduces the risk of failure caused by electronic signal delay or asynchrony, and improves the long-term stability and maintenance convenience of the entire equipment. 3. This soldering device for camera module assembly organically integrates a dual-station turntable layout, a precision clamping system, and the aforementioned linkage carrier into a cooperating whole. The dual-station turntable design allows the loading and unloading operations to be spatially separated from the core welding and inspection processes, while overlapping them in time. This hides the operation time of one station within the cycle of the other station, reducing equipment idle waiting time. Furthermore, the integrated linkage design enables the clamping action, which originally required steps or independent drive sources, to be completed efficiently and synchronously in a single cylinder action, achieving a simultaneous improvement in precision and efficiency. Attached Figure Description

[0015] Figure 1 This is a front view of a soldering device for assembling camera modules according to the present invention; Figure 2 for Figure 1 The front view; Figure 3 This is the front view of the three-axis moving mechanism; Figure 4 This is the main view of the workbench; Figure 5 This is the front view of the Y / Z dual-axis traverse mechanism; Figure 6 for Figure 5 A side view diagram; Figure 7 Front view of the adjustment frame and lever; Figure 8 This is a schematic diagram of the lever; Figure 9 This is the front view of the vehicle; Figure 10 This is a top view of the rack; Figure 11 for Figure 10 A schematic diagram of the decomposition process; Figure 12 This is the main view of the support base.

[0016] In the diagram: 1. Worktable; 2. Three-axis moving mechanism; 3. Laser welding head; 4. Y / Z dual-axis moving mechanism; 41. Mounting plate one; 42. PI six-axis; 43. Mounting plate two; 44. Two-way clamping cylinder; 45. Moving block; 46. Gripper; 5. Carrier; 51. Platform; 52. Placement slot; 53. Side plate; 6. Dual-station turntable; 7. Fume hood; 81. Camera module; 82. Positioning column; 83. Center column; 84. PCB board; 85. Positioning hole; 86. Center hole; 8 7. Tin ring; 9. X / Z dual-axis moving mechanism; 91. Power-on probe; 93. Y-axis moving mechanism; 101. Guide rail; 102. Guide frame one; 103. L-shaped connecting plate; 104. Spring; 11. Connecting column one; 12. Adjusting frame; 121. Slide groove; 13. Support base; 14. Connecting column two; 16. Lever; 17. Support frame; 171. Gear; 172. Rack one; 173. Rack two; 174. Guide frame two; 175. T-shaped guide block; 176. Protective plate; 177. Sliding shaft; Detailed Implementation

[0017] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Example 1; Reference Figure 1 - Figure 12 A soldering device for assembling camera modules includes a workbench 1, on which a dual-station turntable 6 driven by a motor and rotatable is provided to enable switching between two stations; both sides of the top of the dual-station turntable 6 are provided with carriers 5, each carrier 5 including a platform 51 disposed at the top of the carrier 5, a placement groove 52 is opened in the middle of the top of the platform 51, and side plates 53 that play a preliminary limiting role are provided on both sides of the placement groove 52; A camera module 81 is slidably connected to the inner wall of the placement slot 52. A central post 83 is provided at the top center of the camera module 81, and positioning posts 82 are provided at each of the four corners of its top. A PCB board 84 is also provided above the camera module 81. Positioning holes 85 are provided at each of the four corners of the PCB board 84. The inner wall of the positioning hole 85 is slidably connected to the outer wall of the positioning post 82 to achieve initial alignment. A central hole 86 is provided in the center of the PCB board 84. The inner wall of the central hole 86 is slidably connected to the outer wall of the central post 83 to ensure center alignment. A solder ring 87 is sleeved on the positioning post 82, and the solder ring 87 is located above the PCB board 84. The top of the workbench 1 is provided with a three-axis moving mechanism 2 for precise positioning of the laser welding head 3, and the output end of the three-axis moving mechanism 2 is connected to the laser welding head 3. When using, such as Figure 1 As shown; the right side of the workbench 1 is the loading and unloading end; the camera module 81, with the PCB board 84 and solder ring 87 pre-installed, is placed on the carrier 5 on this side from the loading and unloading end; the motor of the dual-station turntable 6 is controlled to rotate it 180 degrees to send the workpiece to be welded to the welding station; the three-axis moving mechanism 2 is controlled to move the laser welding head 3 to the welding point; the solder ring 87 fitted on the positioning post 82 is heated to perform soldering; after it cools and solidifies, the PCB board 84 is firmly welded to the positioning post of the camera module 81; after the soldering is completed, the dual-station turntable 6 is controlled to rotate 180 degrees again to return the welded workpiece to the loading and unloading end for unloading; the cycle is repeated; Working principle: The dual-station turntable 6 separates the loading and unloading from the welding station, forming a continuous operation process and improving production efficiency; the three-axis moving mechanism 2 ensures that the laser welding head 3 can accurately reach each welding point to complete high-quality soldering operations. Example 2: Similar to Embodiment 1, regarding the issue that the PCB board 84 may have gaps due to the only connection between the positioning hole 85 and the positioning post 82, making it susceptible to slight displacement due to heat or minor external forces during soldering, thus affecting soldering quality; to further address this issue, referring to... Figure 1 - Figure 12 A soldering device for assembling camera modules, such as Figure 1 As shown, a Y / Z dual-axis moving mechanism 4 is provided on the top left side of the worktable 1. The output end of the Y / Z dual-axis moving mechanism 4 is connected to a mounting plate 41. The Y / Z dual-axis moving mechanism 4 drives the mounting plate 41 to move in approximate position (left and right and up and down). A high-precision PI six-axis 42 attitude adjustment mechanism is provided on the outside of the mounting plate 41. The output end of the PI six-axis 42 is fixedly connected to a mounting plate 43. A bidirectional clamping cylinder 44 is fixedly connected to the outside of the mounting plate 43. Both output ends of the bidirectional clamping cylinder 44 are fixedly connected to moving blocks 45. A gripper 46 is fixedly connected to the outside of the right end of the moving block 45. In use: The motor of the dual-station turntable 6 is controlled to rotate it 180 degrees, rotating the camera module 81 to be soldered to a position below the laser welding head 3; coarse positioning is performed by the Y / Z dual-axis moving mechanism 4, adjusting the position of the grippers 46 so that the grippers 46 are located on both sides of the PCB board 84, while fine posture adjustment is performed by the PI six-axis 42 to ensure that the clamping surface of the grippers 46 is parallel to the PCB board 84 and at a suitable height; the bidirectional clamping cylinder 44 is controlled to move the grippers 46 on the two side moving blocks 45 inward, stably clamping the PCB board 84, effectively preventing it from shifting during the soldering process; in this stable clamping state, the three-axis moving mechanism 2 is controlled to move the laser welding head 3 to heat the solder ring 87 sleeved on the positioning post 82, thereby performing soldering; Working principle: This embodiment adds a precision clamping system consisting of a Y / Z dual-axis mechanism, a PI six-axis mechanism and a clamping cylinder to actively and smoothly clamp and fix the PCB board 84 before welding, overcoming the risk of displacement that may be caused by relying solely on the gap fit of the positioning holes, and significantly improving the stability of the welding process and the accuracy of the welding position. Example 3: Similar to Example 2, in order to enable preliminary electrical performance testing of the product immediately after welding and achieve online quality assessment, further improvements are made: Referring to... Figure 1 - Figure 2 A soldering device for assembling camera modules further includes a power-on probe 91, which is located above the central column 83. An X / Z dual-axis moving mechanism 9 is connected to one side of the power-on probe 91, and the bottom of the X / Z dual-axis moving mechanism 9 is fixedly connected to the top of the worktable 1. Working principle: After welding is completed, the X / Z dual-axis moving mechanism 9 is controlled to drive the power-on probe 91 to move, so that it contacts the specific contact on the welded center post 83 or PCB board 84 to power on, quickly detect whether the circuit is connected or whether the basic functions are normal, realize the integration of welding and detection, and facilitate timely screening of defective products. Example 4: The method is basically the same as in Embodiment 3, except for the installation method of the power-on probe 91, which is designed to make it follow the clamping mechanism, which may be more conducive to the relative positioning of the probe and the power-on point of the product. In this embodiment, a Y-axis moving mechanism 93 is connected to one side of the power-on probe 91, and the bottom end of one side of the Y-axis moving mechanism 93 is connected to the top of the mounting plate 43. Working principle: The power-on probe 91 is mounted on the mounting plate 43 of the clamping mechanism via the Y-axis moving mechanism 93, and can move together with the clamping mechanism. After the clamping mechanism is positioned, the relative position of the power-on probe 91 and the product is also determined. It can contact the power-on point by making a small adjustment through its own Y-axis moving mechanism 93, which may improve the detection positioning efficiency and consistency. Example 5: Similar to Embodiment 2, except that the side plates 53 on both sides of the placement slot 52 of the platform 51 are not fixed. Furthermore, to address the potential issue of insufficient clamping force of the vehicle on the camera module 81 or the need for adaptive adjustment, the following is further provided: Referring to... Figure 7 - Figure 12 A soldering device for assembling camera modules, such as Figure 9 As shown, guide frames 102 are fixedly connected to both bottom sides of the side plate 53. A guide rail 101 is slidably connected to the inner side of the guide frame 102. The bottom of the guide rail 101 is fixedly connected to the top of the platform 51, so that the side plate 53 can slide relative to the platform 51 along the guide rail 101. An L-shaped connecting plate 103 is fixedly connected to the outer side of the side plate 53. A spring 104 is provided between the inner side of the L-shaped connecting plate 103 and the outer side of the platform 51. In this embodiment, the spring 104 is a tension spring, which in its natural state tends to cause the two side plates 53 to converge toward the camera module 81, which is convenient for clamping the product. Working principle: When the camera module 81 is inserted, the side plate 53 can be pushed outward slightly, and the spring 104 is stretched. After insertion, under the pulling force of the spring 104, the side plate 53 returns to the inward, generating a continuous and gentle clamping force on the camera module 81, providing basic positioning and fixation, while avoiding scratching the product. Example 6: The embodiment is basically the same as that in Example 5, except that the spring 104 is a thrust spring. Furthermore, referring to... Figure 7 - Figure 12 A soldering device for assembling camera modules is disclosed. A connecting column 11 is fixedly connected to the top of the L-shaped connecting plate 103. Support seats 13 are fixedly connected to both sides of the top of the carrier 5. An adjusting frame 12 is rotatably connected to the top of the support seats 13. A through groove 121 is provided at one end of the adjusting frame 12, and the inner wall of the groove 121 is slidably connected to the outer wall of the connecting column 11, forming a linkage-slider mechanism. A connecting column 2 14 is fixedly connected to the top of the other end of the adjusting frame 12. A lever 16 is provided on the inner side of the connecting column 2 14, and an adjusting mechanism is provided between the lever 16 and the outer wall of the bidirectional clamping cylinder 44 to drive its movement. like Figure 10 , Figure 11As shown; the adjustment mechanism includes a support frame 17, one end of which is fixedly connected to the bottom end of a bidirectional clamping cylinder 44, thus moving with the clamping mechanism as a whole. A gear 171 is rotatably connected to the middle of the top of the support frame 17, and a rack 172 is meshed with one side of the gear 171. The top end of the rack 172 is fixedly connected to a moving block 45 and can move synchronously with the moving block 45. A rack 173 is meshed with the side of the gear 171 away from the rack 172, and the top end of the rack 173 is... The bottom of the lever 16 is fixedly connected, and a T-shaped guide block 175 is fixedly connected to the outer side of the rack 173. A guide frame 174 is fixedly connected to the top right side of the support frame 17. The inner side of the guide frame 174 is slidably connected to the outer wall of the T-shaped guide block 175 to provide guidance for the movement of the rack 173. A guard plate 176 is fixedly connected to both sides of the guide frame 174. A sliding shaft 177 is fixedly connected to both sides of the rack 173. The outer wall of the sliding shaft 177 is slidably connected to the inner side of the guard plate 176 to enhance the guiding stability. In use: When it is necessary to clamp the PCB board 84, the bidirectional clamping cylinder 44 drives the moving block 45 to converge inward, thereby driving the rack 172 to move inward. The rack 172 drives the gear 171 to rotate, and the gear 171 drives the rack 2 173 to move outward. Then, the rack 2 173 drives the lever 16 to move outward. The lever 16 abuts against the connecting column 2 14, causing the adjusting frame 12 to rotate inward around the hinge point between it and the support base 13. Then, the adjusting frame 12 connects with the connecting column 13 via the slide groove 121. The engagement of the connecting column 11 abuts against the connecting column 11, and the L-shaped connecting plate 103 pushes the side plate 53 to move inward to clamp the camera module 81; when the bidirectional clamping cylinder 44 is released, the components move in opposite directions, and the side plate 53 is reset by the spring 104; during the recovery, it is pushed outward and moved outward by other reset elements to release the product; throughout the process, the clamping of the camera module 81 by the carrier 5 and the clamping of the PCB board 84 by the gripper 46 achieve mechanical linkage, ensuring that the workpiece is firmly fixed on the entire welding station; Working principle: The core of this embodiment lies in the creative design of a mechanical linkage mechanism that synchronously converts the action of the gripper 46 holding the PCB board 84 into the action of the carrier 5 side plate 53 clamping the camera module 81. This linkage ensures that during welding, the lower camera module 81 and the upper PCB board 84 are synchronously and reliably fixed, which greatly enhances the rigidity of the entire welding system and effectively suppresses possible micro-vibrations or displacements, providing crucial stability assurance for high-quality laser soldering. At the same time, this linkage is completed automatically by the mechanism without the need for additional control components, improving response speed and reliability.

Claims

1. A soldering apparatus for assembling camera modules, comprising a worktable (1), characterized in that, The workbench (1) is provided with a rotatable dual-station turntable (6), and each of the two stations of the dual-station turntable (6) is provided with a carrier (5) for carrying the camera module (81); the workbench (1) is also provided with a three-axis moving mechanism (2) for driving the laser welding head (3) to move; a clamping mechanism is provided on one side of the dual-station turntable (6) on the workbench (1), and the clamping mechanism is installed on the workbench (1) through a multi-dimensional motion mechanism. The clamping mechanism is used to clamp and fix the PCB board (84) on the camera module (81) at the welding station; the carrier (5) includes a platform (51) and a pair of side plates (53) movably arranged on the platform (51). The pair of side plates (53) are connected to the clamping mechanism through a linkage mechanism, so that when the clamping mechanism performs the clamping action on the PCB board (84), it can synchronously drive the pair of side plates (53) to move towards each other to clamp the housing of the camera module (81).

2. The soldering device for assembling camera modules according to claim 1, characterized in that, The multi-dimensional motion mechanism includes a Y / Z dual-axis traversing mechanism (4) for coarse positioning and a PI six-axis (42) for fine-tuning the attitude, with the clamping mechanism mounted on the output end of the PI six-axis (42).

3. The soldering device for assembling camera modules according to claim 2, characterized in that, The clamping mechanism includes a bidirectional clamping cylinder (44) and a pair of jaws (46) driven therefrom.

4. The soldering device for assembling a camera module according to claim 3, characterized in that, The linkage mechanism includes: a connecting column (11) and an L-shaped plate (103) disposed on the side plate (53); an adjustment frame (12) rotatably disposed on the carrier (5); and a motion conversion mechanism connecting the clamping cylinder (44) and the adjustment frame (12); the motion conversion mechanism is configured to convert the linear motion of the piston rod of the bidirectional clamping cylinder (44) into the rotational motion of the adjustment frame (12), thereby driving the connecting column (11) and the L-shaped plate (103) to move the side plate (53) linearly through the adjustment frame (12).

5. A soldering device for assembling camera modules according to claim 4, characterized in that, The motion conversion mechanism includes a rack one (172) that is linked to the output end of the bidirectional clamping cylinder (44), a gear (171) that meshes with the rack one (172), and a rack two (173) that meshes with the gear (171).

6. A soldering device for assembling camera modules according to claim 5, characterized in that, The top of the other end of the adjusting frame (12) away from the connecting column one (11) is fixedly connected to the connecting column two (14); the inner side of the connecting column two (14) is provided with a lever (16), and the bottom end of the lever (16) is fixedly connected to the top end of the rack two (173).

7. A soldering device for assembling camera modules according to claim 6, characterized in that, A guide assembly is provided between the side plate (53) and the platform (51). The guide assembly includes a guide frame (102), which is located on both sides of the bottom of the side plate (53). A guide rail (101) is slidably connected to the inner side of the guide frame (102).

8. A soldering device for assembling camera modules according to claim 7, characterized in that, The bottom of the guide rail (101) is fixedly connected to the top of the platform (51), so that the side plate (53) can slide along the guide rail (101) relative to the platform (51).

9. A soldering device for assembling a camera module according to claim 8, characterized in that, A spring (104) is provided between the L-shaped connecting plate (103) and the carrier (5).

10. A soldering method for assembling a camera module, applied to the soldering apparatus for assembling a camera module as described in claim 9, characterized in that, It also includes the following steps: S1. Place the camera module 81, which has been pre-installed with the PCB board (84) and solder ring (87), on the carrier (5) on this side from the loading and unloading end, and control the motor of the dual-station turntable (6) to drive it to rotate 180 degrees, and send the workpiece to be welded to the welding station. S2. Control the three-axis moving mechanism (2) to drive the laser welding head (3) to the welding point; heat the tin ring (87) sleeved on the positioning post (82) to perform tin welding, and after it cools and solidifies, firmly weld the PCB board (84) onto the positioning post of the camera module (81); S3. After the soldering is completed, control the dual-station turntable (6) to rotate 180 degrees and turn the soldered workpiece back to the loading and unloading end for unloading.

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