Laddering metal film and manufacturing process thereof

Abstract

The invention provides a wire drawing metal film which prolongs the service life of a screen plate, reduces the replacement frequency of the screen plate and ensures stable and reliable operation of solar printing. The surface of the metal layer is provided with a plurality of groups of thick grid line grooves penetrating in the thickness direction; the PI film layer is provided with corresponding fine grid line grooves in the position areas of the thick grid line grooves; the PI film layer is attached to the upper surface of the metal layer through back glue, and the position of the thin grid line groove corresponds to the position of the thick grid line groove.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solar screen printing, in particular to a wire-drawing metal film, and also provides a manufacturing process of the wire-drawing metal film. BACKGROUND

[0002] The existing solar screen printing is performed by using a tungsten wire mesh cloth, which is formed by arranging a plurality of tungsten wires in the form of grid lines. In the actual printing process, the mesh cloth is arranged in the form of grid lines, which results in a large void ratio of the entire mesh plate. In actual use, the mesh cloth will be deformed after a certain number of printing operations, and the deformed mesh cloth cannot be used for reliable and precise printing. Therefore, the service life of the existing tungsten wire mesh cloth is relatively short. Thus, how to improve the service life of the mesh plate used for solar screen printing is a technical problem to be solved urgently. SUMMARY

[0003] In view of the above problems, the present application provides a wire-drawing metal film, which improves the service life of the mesh plate, reduces the replacement frequency of the mesh plate, and ensures that the solar printing is stable and reliable.

[0004] The wire-drawing metal film comprises: a metal layer, a surface of the metal layer being provided with a plurality of groups of thick-directionally penetrating coarse grid line grooves; and a PI film layer, the PI film layer being provided with corresponding fine grid line grooves at the position regions of the coarse grid line grooves; the PI film layer being attached to the upper surface of the metal layer by means of back adhesive, and the positions of the fine grid line grooves corresponding to the coarse grid line grooves.

[0005] Further features are as follows: the grid line grooves corresponding to the PI film layer and the metal layer are arranged only in the pre-set printing area, without covering the entire surface area; the metal layer is made of pure nickel or nickel alloy; preferably, when the metal layer is made of nickel alloy, the material is specifically nickel-cobalt alloy; the thickness of the metal layer is 10-20 μm; the coarse grid line grooves are arranged in the printing area, and the width of the coarse grid line grooves is 100-300 μm; the fine grid line grooves are arranged at the width-directionally central positions corresponding to the coarse grid line grooves, the width of the fine grid line grooves is 10-20 μm, the length of the fine grid line grooves is not greater than the length of the coarse grid line grooves at the corresponding positions, and the fine grid line grooves are corresponding slurry passing grooves set according to the shape of the printing area, which ensures that the screen printing is stable and reliable.

[0006] The application discloses a manufacturing process of a wire drawing metal film, characterized in that: a metal layer is obtained on a substrate through photoetching and exposure and development and through electroforming, the metal layer is provided with a coarse grid line groove, then a PI film layer is adhered to the upper surface of the metal layer through back adhesive, and the fine grid line groove on the PI film layer is cut through laser to make each fine grid line groove correspond to the corresponding area of the coarse grid line groove completely. Further, the manufacturing process comprises the following steps: S1, preparing a metal layer, providing a photoresist layer on a conductive substrate, then removing the photoresist layer except the coarse grid line area through photoetching and exposure and development, retaining the photoresist layer of the coarse grid line area, then growing a metal layer on the removed photoresist layer through electroforming process, and the coarse grid line groove area is left out of the metal layer growth due to the photoresist layer covering the coarse grid line area, thereby generating the metal layer with the coarse grid line groove; S2, then removing the photoresist of the adhering position of the metal layer and the substrate to obtain an independent metal layer; S3, cutting the fine grid line groove with the required grid line width on the PI film layer through laser cutting process, and each fine grid line groove corresponds to the corresponding coarse grid line groove area completely; S4, adhering the PI film layer, and attaching the PI film layer to the upper surface of the metal film prepared in S2 through back adhesive to obtain the wire drawing metal film.

[0007] Further, the application is characterized in that: The PI film layer in step S4 is provided with a back adhesive layer, and the surface area of the PI film layer is the same as that of the metal layer obtained in step S2.

[0008] After the application, the entire screen cloth only needs to be provided with the grid line groove in the corresponding printing area, and the other areas of the non-printing area are provided with the metal layer and the PI film layer, so that the hollow area of the entire screen cloth is relatively small, the toughness and strength of the entire screen cloth during actual silk printing are far greater than those of the previous tungsten screen cloth, and the service life of the screen plate is prolonged when the wire drawing metal film is used as the screen cloth, the replacement frequency of the screen plate is reduced, and the solar printing is ensured to be stable and reliable. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 It is a perspective exploded view of the wire drawing metal film of the application; Figure 2 It is an enlarged view of the arrangement of the coarse grid line groove and the fine grid line groove of the application; Figure 3 It is a service life summary diagram of the wire drawing metal film of the application and the tungsten screen plate of the prior art; The names corresponding to the serial numbers in the figure are as follows: Metal layer 10, coarse grid line groove 11, PI film layer 20, fine grid line groove 21. DETAILED DESCRIPTION

[0010] The wire drawing metal film is seen in Figure 1 andFigure 2 It comprises a metal layer 10 and a PI film layer 20. The surface of the metal layer 10 is provided with several groups of thick grid line grooves 11 in the thickness direction. The PI film layer 20 is provided with corresponding fine grid line grooves 21 in the position area of the thick grid line grooves 11. The PI film layer 20 is attached to the upper surface of the metal layer 10 by the self-provided back adhesive, and the position of the fine grid line groove 21 corresponds to the thick grid line groove 11.

[0011] In specific embodiments, the grid line grooves corresponding to the PI film layer 20 and the metal layer 10 are only provided in the pre-set printing area, without covering the entire surface area. The material of the metal layer 10 is pure nickel or nickel alloy; and when the metal layer is a nickel alloy, the preferred material is nickel-cobalt alloy.

[0012] In specific embodiments, the thickness of the metal layer is 10-20 μm. The thick grid line grooves are arranged in the printing area, and the width of the thick grid line grooves is 100-300 μm. In preferred embodiments, the width of the thick grid line grooves is 200 μm.

[0013] In specific embodiments, the fine grid line groove 21 is arranged at the center position of the width direction corresponding to the thick grid line groove 11, the width of the fine grid line groove 21 is 10-20 μm, the length of the fine grid line groove 21 is not greater than the length of the corresponding thick grid line groove 11 at the corresponding position, and the fine grid line groove 21 is a corresponding slurry passing groove set according to the shape set for the printing area, to ensure stable and reliable silk printing.

[0014] A manufacturing process of a drawn metal film: a metal layer 10 is obtained on a substrate by photoetching and exposure development, and by electroforming, the metal layer 10 is provided with thick grid line grooves 11, then the PI film layer 20 is adhered to the upper surface of the metal layer 10 by back adhesive and the fine grid line grooves 21 on the PI film layer 20 are cut by laser to make each fine grid line groove 21 completely correspond to the corresponding area of the thick grid line groove 11.

[0015] It comprises the following steps: S1, preparing a metal layer, setting a photoresist layer on a conductive substrate, then removing the photoresist layer outside the area where the coarse grid line needs to be set by exposure and development of a photoetching machine, retaining the photoresist layer of the coarse grid line area, then growing a metal layer 10 on the removed photoresist layer by electroforming process, the thickness of the metal layer 10 is 10-20 microns, and the area of the coarse grid line groove 11 is left out because it is covered with the photoresist layer, thereby generating a metal layer 10 with a coarse grid line groove 1; S2, then remove the photoresist of the adhesion position of the metal layer 10 and the substrate, obtain an independent metal layer 10; S3, cut the PI film layer 20 to obtain the fine grid line groove 21 of the required grid line width by laser cutting process, and each fine grid line groove 21 completely corresponds to the area of its corresponding coarse grid line groove 11; S4, adhere the PI film layer 20, and adhere the PI film layer 20 to the upper surface of the metal layer 10 obtained in S2 by the back adhesive. S401, before lamination, the metal layer is treated by plasma to keep the surface clean; S402, when laminating, the lamination of the PI film layer 20 and the metal layer 10 is completed at a temperature of 180-200℃, a pressure of 45-55MPa and a holding time of 30-40 minutes.

[0016] In specific embodiments, the PI film layer 20 in step S4 has a back adhesive layer, and the area of the PI film layer 20 is the same as the area of the metal layer 10 obtained in step S2.

[0017] In specific embodiments, the thickness of the metal layer 10 is 15 microns, and the thickness of the PI film layer 20 is 8 microns, which are processed to obtain the corresponding coarse grid line groove 11 and fine grid line groove 21 by the above steps, and the comparative example uses a conventional PI tungsten screen plate, the thickness of the tungsten screen is 15 microns, and the thickness of the PI film is 8 microns, the corresponding printing area is the same as that of the specific embodiment, and the service life is obtained by experiment Figure 3 The service life summary chart is shown.

[0018] The entire screen cloth only needs to be provided with grid line grooves in the corresponding printing area, and the other areas of the non-printing area are provided with metal layers and PI film layers, thereby the hollow area of the entire screen cloth is relatively small, and the toughness and strength of the entire screen cloth during actual silk printing are much greater than those of the previous tungsten screen cloth, thereby the service life of the screen plate is improved when the silk metal film is used as a screen cloth, the replacement frequency of the screen plate is reduced, and the solar printing is ensured to be stable and reliable.

[0019] It will be obvious to a person skilled in the art that the application is not limited to the details of the foregoing exemplary embodiments and can be implemented in other concrete forms without departing from the spirit or essential characteristics of the application. The embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. No reference signs in the claims should be considered as limiting the scope of the claims to the identity of the reference signs therein.

[0020] Furthermore, it should be understood that although the description is made on the basis of the embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. A drawn metal film, characterized in that, It comprises: a metal layer, the surface of which is provided with a plurality of groups of thick-directionally penetrating coarse grid line grooves; and a PI film layer, which is provided with corresponding fine grid line grooves in the position area of the coarse grid line grooves; The PI film layer is attached to the upper surface of the metal layer by back adhesive, and the position of the fine grid line groove corresponds to the coarse grid line groove.

2. The drawn metal film of claim 1, wherein: The grid line grooves corresponding to the PI film layer and the metal layer are only provided in the pre-set printing area, without covering the entire surface area.

3. The drawn metal film of claim 1, wherein: The material of the metal layer is pure nickel or nickel alloy.

4. The drawn metal film of claim 3, wherein: When the metal layer is a nickel alloy, the material is specifically a nickel-cobalt alloy.

5. The drawn metal film of claim 1, wherein: The thickness of the metal layer is 10-20 μm.

6. The drawn metal film of claim 5, wherein: The coarse grid line grooves are arranged in the printing area, and the width of the coarse grid line groove is 100-300 μm.

7. The drawn metal film of claim 6, wherein: The fine grid line groove is arranged at the width-directional central position corresponding to the coarse grid line groove, the width of the fine grid line groove is 10-20 μm, the length of the fine grid line groove is not greater than the length of the coarse grid line groove at the corresponding position, and the fine grid line groove is a corresponding slurry passing groove set according to the shape set by the printing area.

8. A process for making the drawn metal film of any one of claims 1-7, characterized by: It obtains a metal layer on a substrate by photoetching and exposure development, and by electroforming, the metal layer is provided with coarse grid line grooves, then a PI film layer is attached to the upper surface of the metal layer by back adhesive, and the fine grid line grooves on the PI film layer are cut by laser to make each fine grid line groove completely correspond to the corresponding area of the coarse grid line groove.

9. The process of claim 8, wherein the metal film is drawn to a thickness of 0.1 to 10 microns. It comprises the following steps: S1, preparing a metal layer, providing a photoresist layer on a conductive substrate, then removing the photoresist layer outside the area where the coarse grid line is needed to be set by photoetching and exposure development, retaining the photoresist layer of the coarse grid line area, then growing a metal layer on the removed photoresist layer by electroforming process, while the area of the coarse grid line groove is left out because the photoresist layer is covered, so that the metal layer is not grown in the area of the coarse grid line groove, thereby generating a metal layer with coarse grid line grooves; S2, then removing the photoresist of the adhesion position of the metal layer and the substrate to obtain an independent metal layer; S3, cutting the fine grid line groove with the required grid line width on the PI film layer by laser cutting process, and each fine grid line groove completely corresponds to the area of its corresponding coarse grid line groove; S4, adhering the PI film layer, attaching the PI film layer to the upper surface of the metal film prepared in S2 by back adhesive to obtain a drawn metal film.

10. The process of claim 9, wherein: The PI film layer in step S4 is self-provided with a back adhesive layer, and the surface area of the PI film layer is the same as that of the metal layer obtained in step S2. The PI film layer in step S4 is self-provided with a back adhesive layer, and the surface area of the PI film layer is the same as that of the metal layer obtained in step S2.

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