Chip transmission mechanism, control method thereof and chip testing equipment

Abstract

The invention provides a chip transmission mechanism, a control method thereof and chip testing equipment, and belongs to the technical field of chip testing. The sealing transfer device is internally provided with a containing cavity, and the side wall of the sealing transfer device is provided with an external inlet / outlet, a first internal inlet / outlet and a second internal inlet / outlet which are communicated with the containing cavity; a first sealing door, a second sealing door and a third sealing door which can be controlled to be opened and closed are respectively arranged at each entrance and exit; the internal transmission line comprises a first internal transmission line and a second internal transmission line which are in butt joint with the first internal access port and the second internal access port respectively; the external transmission line is in butt joint with the external inlet and outlet; the sealed transfer device and the internal transmission line are arranged in a test environment of the chip test equipment; the external transmission line is arranged in a non-test environment; the air inflation assembly is used for filling the containing cavity with dry air; and the air exhaust assembly is used for vacuumizing the accommodating cavity. The chip transmission efficiency can be improved while the sealing performance of the chip sealing test equipment is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to a chip conveying mechanism, a control method thereof and a chip testing device. BACKGROUND

[0002] In order to ensure the accuracy and reliability of chip testing data, a chip sealing testing device usually needs to be in a sealed low-dew-point environment. In order to ensure such a testing environment, a sealing transition structure is usually arranged at the inlet and outlet ends of the device to avoid the internal environment of the device being destroyed by the external environment when the chip is fed in or out.

[0003] In the prior art, the sealing transition structure is usually a sealing cavity provided with two sealing doors. When one of the sealing doors is opened, the external chip is allowed to enter the sealing cavity, and then the sealing door is closed, and then the other sealing door is opened, so that the chip in the sealing cavity can enter the internal environment of the chip sealing testing device.

[0004] However, the sealing effect of such a sealing transition structure is not ideal and the conveying efficiency is low. SUMMARY

[0005] One object of the first aspect of the present application is to provide a chip conveying mechanism which can improve the conveying efficiency of the chip while ensuring the sealing of the chip sealing testing device.

[0006] Another object of the present application is to save the occupied space of the conveying mechanism in the sealing transfer device.

[0007] One object of the second aspect of the present application is to provide a chip testing device comprising the above chip conveying mechanism.

[0008] One object of the third aspect of the present application is to provide a control method for the above chip conveying mechanism, which can improve the detection efficiency.

[0009] The first aspect of the embodiments of the present application provides a chip conveying mechanism arranged in a chip testing device for driving a carrier carrying a chip to convey between a sealed testing environment and an external environment, the chip conveying mechanism comprising: a sealing transfer device, which is internally provided with a containing cavity and externally provided with an external inlet and outlet, a first internal inlet and outlet and a second internal inlet and outlet which are in communication with the containing cavity; the external inlet and outlet is provided with a first sealing door which can be controllably opened or closed, the first internal inlet and outlet is provided with a second sealing door which can be controllably opened or closed, and the second internal inlet and outlet is provided with a third sealing door which can be controllably opened or closed; internal transmission lines including a first internal transmission line and a second internal transmission line respectively interfacing with the first internal inlet and outlet and the second internal inlet and outlet, the first internal transmission line and the second internal transmission line being used for alternately transporting the carrier with chips between the sealed transfer device and a tester of the chip testing apparatus; external transmission lines interfacing with the external inlet and outlet, used for driving the carrier to move back and forth so as to transfer the carrier into or out of the sealed transfer device; the sealed transfer device and the internal transmission lines are arranged in a testing environment of the chip testing apparatus; and the external transmission lines are arranged in a non-testing environment of the chip testing apparatus; an air charging assembly used for filling the accommodating cavity with dry air; a vacuum pumping assembly used for pumping the accommodating cavity to be vacuumized.

[0010] Optionally, the accommodating cavity of the sealed transfer device is provided with a transfer transmission mechanism, and the transfer transmission mechanism includes a first transmission mechanism and a second transmission mechanism; the first transmission mechanism interfaces with the external transmission lines, and is used for realizing the transmission of the in-and-out material between the accommodating cavity and the external transmission lines; two ends of the second transmission mechanism respectively interface with the first internal transmission line and the second internal transmission line, and are used for realizing the transmission of the in-and-out material between the accommodating cavity and the first internal transmission line and the transmission of the in-and-out material between the accommodating cavity and the second internal transmission line.

[0011] Optionally, the first transmission mechanism and the second transmission mechanism are arranged in vertical overlap, and one of the first transmission mechanism and the second transmission mechanism is arranged to be liftable; the height of the effective conveying surface of the first transmission mechanism and the second transmission mechanism is changed by lifting, so as to cooperate with different transmission lines.

[0012] Optionally, the first internal transmission line and the second internal transmission line have the same length.

[0013] Optionally, the accommodating cavity is rectangular and matches the shape of the carrier, and the external transmission line, the first internal transmission line and the second internal transmission line are arranged in a “T” shape.

[0014] In particular, the second aspect of the embodiment of the present application further provides a control method for the chip transmission mechanism, and the control method includes: controlling the external transmission lines to transport the carrier loaded with the to-be-tested chips to the first sealed door, and the to-be-tested chips fill half of the positions of the carrier; controlling the first sealing door to open and the air charging assembly to start, so as to fill dry air when the carrier enters the accommodating cavity; controlling the first sealing door and the air charging assembly to close when the carrier is in the accommodating cavity; controlling the second sealing door to open and the air exhausting assembly to start, so as to make the carrier enter the first internal transmission line when the accommodating cavity is in a negative pressure state.

[0015] Optionally, the to-be-tested chip fills half of the carrier position, and the step of controlling the second sealing door to open and the air exhausting assembly to start further comprises: controlling the second sealing door and the air exhausting assembly to close after the carrier leaves the accommodating cavity; controlling the first internal transmission line to drive the carrier to move to the test machine; controlling the first internal transmission line to drive the carrier to move to the second sealing door after the tested chip is received by the test machine and the to-be-tested chip is moved to the test machine; controlling the second sealing door to open and the air exhausting assembly to start, so as to make the carrier enter the accommodating cavity when the accommodating cavity is in a negative pressure state.

[0016] Optionally, the step of controlling the second sealing door to open and the air exhausting assembly to start further comprises: controlling the carrier on the next external transmission line to move to the second internal transmission line through the sealing transfer device; controlling the second internal transmission line to drive the carrier to move to the test machine, so as to receive the tested chip at the test machine and transfer the to-be-tested chip on the carrier to the test machine.

[0017] Optionally, the step of controlling the second sealing door to open and the air exhausting assembly to start further comprises: controlling the first sealing door to open and the air charging assembly to start; controlling the external transmission line to transfer the carrier to the next station; controlling the carrier on the next external transmission line to move to the first internal transmission line through the sealing transfer device; controlling the carrier on the second internal transmission line to move to the external transmission line through the sealing transfer device.

[0018] In particular, the third aspect of the embodiment of the present application further provides a chip testing device, which comprises the chip transmission mechanism as described in any one of the above.

[0019] According to the first aspect of this application, through the coordinated operation of the external transmission line, the sealed transfer device, the first internal transmission line, and the second internal transmission line, efficient chip transfer between the external environment and the test unit of the chip sealing test equipment can be achieved. The gas filling component prevents external air from entering the sealed transfer device, and the gas extraction component creates a negative pressure inside the sealed transfer device when it is connected to the internal environment of the chip sealing test equipment. This further prevents the sealed transfer device, which has already interacted with the external environment, from affecting the internal environment of the chip sealing test equipment, thereby ensuring a constant internal environment. In other words, the chip transfer mechanism of this application can improve chip transfer efficiency, i.e., chip testing efficiency, while ensuring the internal gas environment of the chip sealing test equipment.

[0020] Furthermore, by vertically arranging overlapping first and second transmission mechanisms, and by making one of the transmission mechanisms liftable, the switching between the first and second transmission mechanisms can be achieved, while saving space.

[0021] According to a second aspect of this application, this application also provides a control method for a chip transfer mechanism. By coordinating the feeding and discharging between the first internal transfer line, the second internal transfer line, the external transfer line, and the sealed transfer device, it is possible to realize chip testing in the testing machine. While the tested chip is being transmitted out of the internal transfer line on one side, the next carrier loaded with the chip to be tested is being transmitted out of the sealed transfer device by the internal transfer line on the other side. This coordinates the chip transmission cycle and the testing cycle, thereby improving the testing efficiency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a chip transmission mechanism according to an embodiment of this application; Figure 2 yes Figure 1 A schematic diagram of the sealed transfer device of the chip transmission mechanism in the diagram; Figure 3 This is a schematic diagram of the structure of a relay transmission mechanism of a chip transmission mechanism according to an embodiment of this application; Figure 4 This is a schematic diagram of the external transmission line of a chip transmission mechanism according to an embodiment of this application; Figure 5 This is a flowchart of a control method according to an embodiment of this application; Figure 6 This is a schematic diagram of a control method according to an embodiment of this application; Figure label: 100-Chip transmission mechanism, 10-Sealed transfer device, 101-Accommodation cavity, 102-External inlet / outlet, 103-First internal inlet / outlet, 104-Second internal inlet / outlet, 21-First sealed door, 22-Second sealed door, 23-Third sealed door, 30-First internal transmission line, 40-Second internal transmission line, 50-External transmission line, 60-Transfer transmission mechanism, 61-First transmission mechanism, 62-Second transmission mechanism, 63-Limiting component, 64-Air shower pipe, 200-Carrier, 300-Testing machine. Detailed Implementation

[0023] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0024] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0025] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed description. Those skilled in the art should understand that this application can be implemented without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the spirit of this disclosure.

[0026] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0027] In this application's embodiments, "multiple" refers to two or more. The descriptions of "first," "second," etc., appearing in this application's embodiments are merely illustrative and for distinguishing the described objects; they have no order and do not indicate a specific limitation on the number in this application's embodiments, nor do they constitute any limitation on the embodiments of this application.

[0028] Figure 1 This is a schematic diagram of the structure of a chip transmission mechanism 100 according to an embodiment of this application. Figure 2 yes Figure 1The diagram shows the structure of the sealed transfer device 10 within the chip transfer mechanism 100. The chip transfer mechanism 100 of this application is used in chip sealing test equipment, where a sealed environment needs to be maintained inside the chip sealing test equipment, such as achieving a dew point environment, to ensure the normal operation and testing accuracy of the chip sealing test equipment.

[0029] like Figure 1 As shown, in one embodiment, the chip transfer mechanism 100 includes a sealed transfer device 10, an internal transmission line, an external transmission line 50, an inflation assembly, and a vacuum assembly. This chip transfer mechanism 100 is used to transport a carrier carrying chips between a sealed testing environment and the external environment. The sealed transfer device 10 has an internal accommodating cavity 101 and external inlet / outlet 102, a first internal inlet / outlet 103, and a second internal inlet / outlet 104 communicating with the accommodating cavity 101 on its side wall. Figure 2 As shown, the sealed transfer device 10 also includes a first sealing door 21 disposed at the external inlet / outlet 102, a second sealing door 22 disposed at the first internal inlet / outlet 103, and a third sealing door 23 disposed at the second internal inlet / outlet 104; the first sealing door 21 can controllably open or close the external inlet / outlet 102; the second sealing door 22 can controllably open or close the first internal inlet / outlet 103; and the third sealing door 23 can controllably open or close the second internal inlet / outlet 104.

[0030] The internal transmission lines include a first internal transmission line 30, which interfaces with the first internal inlet / outlet 103, and a second internal transmission line 40, which interfaces with the second internal inlet / outlet 104. The first and second internal transmission lines 30 and 40 are used to alternately transport a carrier carrying a chip between the sealing transfer device 10 and the testing machine of the chip sealing test equipment. For example, the first internal transmission line 30 first transports the carrier from the sealing transfer device 10 to the testing machine. While the first internal transmission line 30 is transporting the carrier back from the testing machine to the sealing transfer device, the second internal transmission line 40 transports the carrier from the sealing transfer device 10 to the testing machine. This alternating transport of the carrier to the testing machine and back to the sealing transfer device 10 is repeated. The external transmission line 50 interfaces with the external inlet / outlet 102 and is used to drive the carrier to move back and forth, to deliver the chip to be tested to the sealing transfer device 10 or to transfer the tested chip out from the external inlet / outlet 102. The method of transferring the carrier 200 between the external transmission line, the sealed transfer device 10, the first internal transmission line 30, and the second internal transmission line 40 is not limited here; it can be a docked conveyor belt or a transfer robotic arm, etc. The sealed transfer device 10 and the internal transmission line are arranged in the test environment of the chip test equipment, while the external transmission line is arranged in the non-test environment of the chip test equipment. The sealed transfer device 10 is used to isolate the test environment and the non-test environment. The gas filling component is used to fill the accommodating cavity 101 with dry air. The vacuuming component is used to evacuate the accommodating cavity 101. The functions of the gas filling component and the vacuuming component can be achieved by the same gas device or by two separate components; there is no limitation here.

[0031] In this embodiment, through the coordinated operation of the external transmission line 50, the sealed transfer device 10, the first internal transmission line 30, and the second internal transmission line 40, the chip under test can be transferred from the external transmission line in the external environment to the first internal transmission line 30 or the second internal transmission line 40 located in the test environment via the sealed transfer device 10, and then transferred to the chip testing area as needed; that is, the sealing transfer device realizes the switching between the external environment and the test environment. The efficient chip transfer between test units of the chip sealing test equipment is achieved by preventing external air from entering the sealed transfer device 10 through the gas filling component. The gas extraction component can create a negative pressure inside the sealed transfer device 10 when it is connected to the internal environment of the chip sealing test equipment, further preventing the sealed transfer device 10, which has already interacted with the external environment, from affecting the internal environment of the chip sealing test equipment, thereby ensuring the constancy of the internal environment of the chip sealing test equipment. In other words, the chip transfer mechanism 100 of this application can improve chip transfer efficiency, i.e., chip testing efficiency, while ensuring the internal gas environment of the chip sealing test equipment.

[0032] Figure 3This is a schematic diagram of the relay transmission mechanism 60 of a chip transmission mechanism 100 according to one embodiment of this application. In one embodiment, as... Figure 3 As shown, the sealed transfer device 10 has a transfer mechanism 60 within its accommodating cavity 101. The transfer mechanism 60 includes a first transfer mechanism 61 and a second transfer mechanism 62. The first transfer mechanism 61 engages with an external transfer line 50 to facilitate material transfer between the sealed transfer device 10 and the external transfer line 50. The two ends of the second transfer mechanism 62 correspond to a first internal transfer line 30 and a second internal transfer line 40, respectively, facilitating material transfer between the accommodating cavity 101 and the first internal transfer line 30, as well as between the accommodating cavity 101 and the second internal transfer line 40. Further, the first transfer mechanism 61 and the second transfer mechanism 62 are arranged vertically overlapping, and one of them is height-adjustable. This height adjustment changes the effective conveying surface height of either the first or second transfer mechanism 61, allowing for different transfer lines to be used. In this embodiment, the second transfer mechanism 62 is height-adjustable, for example... Figure 3 The roller mechanism shown has a first transmission mechanism 61 that is a fixedly installed conveyor belt mechanism, with the conveyor belt of the conveyor belt mechanism passing over the upper and lower sides of the second transmission mechanism 62. When the second transmission mechanism 62 is raised so that its roller mechanism is higher than the conveyor belt mechanism, the second transmission mechanism 62 is used to transport the carrier 200; conversely, the first transmission mechanism 61 is used to transport the carrier 200.

[0033] Furthermore, the transfer mechanism 60 may also be equipped with a limiting component 63 to limit the position of the vehicle 200 within the sealed transfer device 10.

[0034] In this embodiment, a first transmission mechanism 61 and a second transmission mechanism 62 are arranged vertically overlappingly. By making one of the transmission mechanisms liftable, the switching between the first transmission mechanism 61 and the second transmission mechanism 62 can be realized, and space can be saved.

[0035] like Figure 3 As shown, in one embodiment, the sealed transfer device 10 is further provided with an air shower pipe 64, which is arranged on the opposite side of the external inlet and outlet 102.

[0036] The ESD static electricity elimination function can be achieved by setting the air shower pipe 64. Setting the air shower pipe 64 relative to the external inlet and outlet 102 can make the air outlet face the external inlet and outlet 102, thereby preventing external air from entering the sealed transfer device 10.

[0037] In one embodiment, such as Figure 2As shown, the accommodating cavity 101 is rectangular in shape to match the carrier 200. The two sides along the length of the sealed transfer device 10 are used to set the first internal inlet / outlet 103 and the second internal inlet / outlet 104. The external transmission line 50, the first internal transmission line 30 and the second internal transmission line 40 are arranged in a "T" shape.

[0038] In this embodiment, the first internal inlet / outlet 103 and the second internal inlet / outlet 104 are arranged at the short side of the sealing transfer device 10, which helps to reduce the size of the opening, thereby reducing the vacuum pressure of the gas extraction component. The smaller opening also reduces the probability of gas in the sealing transfer device 10 entering the internal environment of the chip sealing test equipment.

[0039] In one embodiment, the first internal transmission line 30 and the second internal transmission line 40 have the same stroke. For example, the first internal transmission line 30 and the second internal transmission line 40 are symmetrically arranged on the left and right sides of the sealed transfer device 10.

[0040] By setting the lengths of the first internal transmission line 30 and the second internal transmission line 40 to be the same, when their transmission speeds are the same, the time it takes for the carrier 200 to travel from the sealed transfer device 10 to the test machine is the same, which helps to simplify the control logic.

[0041] This application also provides a chip testing device including a tester 300 and the chip transfer mechanism 100 described above.

[0042] Figure 4 This is a schematic diagram of the external transmission line 50 of a chip transmission mechanism according to an embodiment of this application. Figure 4 As shown, in one embodiment, the external transmission line 50 includes a track 51 and a sliding mechanism 52 movable along the track 51. A pulley pushing assembly is provided at the sliding mechanism 52. The pulley pushing assembly 53 may include a transmission belt assembly 53 and a drive mechanism. The transmission belt assembly 53 includes a belt 531 and pulleys 532 located at both ends of the belt. The drive mechanism is, for example, a motor. The motor drives the pulleys 532 of the transmission belt assembly to rotate through a transmission mechanism, causing the belt 531 to move. When the sliding mechanism 52 moves along the track 51 to the vicinity of the external inlet / outlet 102, the drive mechanism is activated when the external inlet / outlet 102 is opened, causing the transmission belt assembly to continue conveying the carrier 200 carrying the chip in the direction toward the external inlet / outlet 102. This causes part of the carrier 200 to enter the sealed transfer device 10 and be transferred into the receiving cavity 101 through the first transmission mechanism 61.

[0043] Figure 5 This is a flowchart of a control method according to an embodiment of this application. This application also provides a control method for the chip transmission mechanism 100 described above, such as... Figure 5 As shown, in one embodiment, the control method includes: Step S10: Control the external transmission line 50 to transport the carrier 200 carrying the chip under test to the first sealing door 21; Step S20: When the vehicle 200 is located at the first sealing door 21, control the first sealing door 21 to open and start the inflation assembly so that dry air is filled when the vehicle 200 enters the accommodating cavity 101; Step S30: When the carrier 200 is located in the accommodating cavity 101, close the first sealing door 21 and the inflation assembly; In step S40, the second sealing door 22 is opened and the air extraction assembly is activated so that the carrier 200 enters the first internal transmission line 30 under negative pressure in the accommodating cavity 101.

[0044] In this embodiment, the control method inflates the accommodating cavity 101 with an inflation assembly when the first sealing door 21 is opened, preventing external gas from entering the accommodating cavity 101. When the second sealing door 22 is opened, the evacuating assembly evacuates the accommodating cavity 101 to create a negative pressure environment, preventing the gas in the accommodating cavity 101 from flowing into the internal environment of the chip sealing test equipment. This effectively maintains the gas environment of the chip sealing test equipment and ensures test accuracy.

[0045] Of course, while opening the first sealing door 21, the air shower pipe 64 can also be activated to blow air to eliminate static electricity on the chip on the vehicle 200.

[0046] When the chip sealing test equipment includes the aforementioned transfer mechanism 60, after opening the first sealing door 21 in step S20, the following transfer steps are also included: The first transmission mechanism 61 is activated to connect to the vehicle 200 on the external transmission line; When the vehicle 200 is at the target position, the first transmission mechanism 61 is shut down; Control the second transmission mechanism 62 to rise; When the second transmission mechanism 62 rises to the target height, the second transmission mechanism 62 is activated to move the vehicle 200 out to the first internal transmission line 30.

[0047] The control steps for the carrier 200 to transfer to the second internal transmission line 40 are similar to those for the transfer to the first internal transmission line 30, except that the transmission direction of the second transmission mechanism 62 needs to be changed. The control process for the carrier 200 to transfer from the first internal transmission line 30 or the second internal transmission line 40 to the external transmission line via the sealed transfer device 10 is the reverse of the above process and will not be described again here.

[0048] Figure 6 This is a schematic diagram of a control method according to an embodiment of this application. Figure 6The dashed box in the diagram represents the chip under test (DUT), the dotted box represents the chip already tested, the solid arrow indicates the transmission direction when transmitted via the first internal transmission line 30, and the dashed arrow indicates the transmission direction when transmitted via the second internal transmission line 40. In a further embodiment, the DUT fills half of the compartment of the carrier 200 (e.g., Figure 6 (The area indicated by the dashed box in section a contains the chip under test). After step S40, the following steps are also included: Step S50: After the vehicle 200 leaves the accommodating cavity 101, control the second sealing door 22 and the air extraction assembly to close. Step S60: Control the first internal transmission line 30 to move the carrier 200 to the test machine 300; Step S70: After receiving the tested chip from the test machine 300 and moving the chip to be tested to the test machine 300, control the first internal transmission line 30 to move the carrier 200 to the second sealing door 22. In step S80, the second sealing door 22 is opened and the air extraction assembly is activated so that the carrier 200 enters the accommodating cavity 101 when the accommodating cavity 101 is under negative pressure.

[0049] In step S70, the tested chips in the test machine 300 are first transferred to the carrier 200 of the first internal transmission line 30, and then the original chips to be tested in the carrier 200 are transferred to the test machine 300. That is to say, the number of chips tested by the test machine 300 in each batch is half the number of compartments in the carrier 200.

[0050] Furthermore, the procedure prior to step S80 also includes: Step S72: Control the carrier 200 on the next external transmission line to move to the second internal transmission line 40 via the sealed transfer device 10; Step S74: Control the second internal transmission line 40 to move the carrier 200 to the test machine 300 so as to receive the tested chip at the test machine 300 and transfer the chip under test on the carrier 200 to the test machine 300.

[0051] like Figure 6 As shown in b, before the tested chip is transferred to the sealed transfer device 10 via the first internal transmission line 30, the next carrier 200 containing the chip to be tested needs to be transferred from the outside to the second internal transmission line 40 via the sealed transfer device 10. Alternatively, in some special cases, the carrier 200 in the accommodating cavity 101 can be transferred to the second internal transmission line 40 while the carrier 200 on the first internal transmission line 30 is transferred to the accommodating cavity 101. Of course, in this special case, the vacuuming force of the vacuuming assembly can be increased to cope with the state where both the first sealing door 21 and the second sealing door 22 on both sides are open.

[0052] Step S80 is followed by: Step S92: Control the first sealing door 21 to open and start the inflation assembly; Step S94: Control the external transmission line to transfer the carrier 200 to the next workstation; Step S96: Control the carrier 200 on the next external transmission line to move to the first internal transmission line 30 via the sealed transfer device 10; Step S98: Control the carrier 200 on the second internal transmission line 40 to move to the external transmission line via the sealed transfer device 10.

[0053] like Figure 6 As shown in c, before the second internal transmission line 40 transfers the carrier 200 loaded with the tested chip to the transition chamber, the third carrier 200 loaded with the chip to be tested has been transferred from the sealed transfer device 10 to the first internal transmission line 30.

[0054] Thus, the first internal transmission line 30 and the second internal transmission line 40 alternately receive materials from the sealed transfer device 10, or alternately transmit the tested chips to the sealed transfer device 10, until a stop command is received, or no new carrier 200 transmits materials from the external transmission line.

[0055] In this embodiment, by coordinating the feeding and discharging between the first internal transmission line 30, the second internal transmission line 40, the external transmission line, and the sealed transfer device 10, it is possible to achieve chip testing in the testing machine. While the tested chip is being transmitted out of the internal transmission line on one side, the next carrier 200 loaded with the chip to be tested is being transmitted out of the sealed transfer device 10 by the internal transmission line on the other side. This coordinates the chip transmission cycle and the testing cycle, thereby improving the testing efficiency.

[0056] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A chip transfer mechanism, disposed in a chip testing device, for driving a carrier containing a chip to transfer between a sealed testing environment and an external environment, characterized in that, The chip transmission mechanism includes: A sealed transfer device has an internal accommodating cavity and external inlet / outlet, a first internal inlet / outlet, and a second internal inlet / outlet communicating with the accommodating cavity on its side wall; the external inlet / outlet is provided with a first sealed door that can be controlled to open or close, the first internal inlet / outlet is provided with a second sealed door that can be controlled to open or close, and the second internal inlet / outlet is provided with a third sealed door that can be controlled to open or close. The internal transmission line includes a first internal transmission line and a second internal transmission line that are respectively connected to the first internal inlet and outlet and the second internal inlet and outlet. The first internal transmission line and the second internal transmission line are used to alternately transport a carrier carrying a chip between the sealed transfer device and the test machine of the chip testing equipment. An external transmission line, connected to the external inlet and outlet, is used to drive the vehicle to move back and forth, so as to transfer the vehicle into or out of the sealed transfer device; The sealed transfer device and the internal transmission line are arranged in the test environment of the chip test equipment; the external transmission line is arranged in the non-test environment of the chip test equipment. An inflation assembly for filling the accommodating cavity with dry air; A vacuum assembly is used to evacuate the accommodating cavity.

2. The chip transmission mechanism according to claim 1, characterized in that, The sealed transfer device is provided with a transfer mechanism in its accommodating cavity, and the transfer mechanism includes a first transfer mechanism and a second transfer mechanism; The first transmission mechanism is connected to the external transmission line to realize the infeed and outfeed transmission between the accommodating cavity and the external transmission line; The two ends of the second transmission mechanism are respectively connected to the first internal transmission line and the second internal transmission line, and are used to realize the feeding and discharging of materials between the accommodating cavity and the first internal transmission line, as well as the feeding and discharging of materials between the accommodating cavity and the second internal transmission line.

3. The chip transmission mechanism according to claim 2, characterized in that, The first transmission mechanism and the second transmission mechanism are arranged overlapping vertically, and one of the first transmission mechanism and the second transmission mechanism is liftable; By raising and lowering the effective transmission surfaces of the first and second transmission mechanisms, different transmission lines can be used.

4. The chip transmission mechanism according to any one of claims 1-3, characterized in that, The first internal transmission line and the second internal transmission line are of the same length.

5. The chip transmission mechanism according to any one of claims 1-3, characterized in that, The accommodating cavity is rectangular in shape to match the shape of the carrier, and the external transmission line, the first internal transmission line, and the second internal transmission line are arranged in a "T" shape.

6. A control method for a chip transmission mechanism according to any one of claims 1-5, characterized in that, include: The external transmission line is controlled to transport the carrier loaded with the chip under test to the first sealed door, and the chip under test fills half of the compartment of the carrier; When the vehicle is located at the first sealing door, the first sealing door is controlled to open and the inflation assembly is activated so that dry air is filled when the vehicle enters the accommodating cavity; When the vehicle is located within the accommodating cavity, the first sealing door and the inflation assembly are closed; The second sealing door is opened and the air extraction assembly is activated so that the vehicle enters the first internal transmission line under negative pressure in the accommodating cavity.

7. The control method according to claim 6, characterized in that, After the step of filling half of the compartment of the carrier with the chip under test, controlling the second sealing door to open and starting the air extraction assembly, the method further includes: After the vehicle leaves the accommodating cavity, the second sealing door and the air extraction assembly are closed. Control the first internal transmission line to move the carrier to the test machine; After receiving the tested chip from the test machine and moving the chip to be tested to the test machine, the first internal transmission line is controlled to move the carrier to the second sealing door. The second sealing door is opened and the air extraction assembly is activated so that the vehicle enters the accommodating cavity when the accommodating cavity is under negative pressure.

8. The control method according to claim 7, characterized in that, The procedure further includes, prior to the step of controlling the opening of the second sealing door and activating the air extraction assembly: Control the vehicle on the next external transmission line to move to the second internal transmission line via the sealed transfer device; The second internal transmission line is controlled to move the carrier to the test machine, so as to receive the tested chip at the test machine and transfer the chip under test on the carrier to the test machine.

9. The control method according to claim 8, characterized in that, The steps following the control of the second sealing door to open and the activation of the air extraction assembly include: Control the opening of the first sealing door and activate the inflation assembly; Control the external transmission line to transfer the vehicle to the next workstation; Control the vehicle on the next external transmission line to move to the first internal transmission line via the sealed transfer device; The carrier on the second internal transmission line is controlled to move to the external transmission line via the sealed transfer device.

10. A chip testing device, characterized in that, Includes the chip transmission mechanism according to any one of claims 1-5.

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