A method and apparatus for optimizing a diamond-copper-based red-brass-substrate heat-dissipation module

Abstract

The present application relates to the technical field of heat dissipation module, especially to a method and device for optimizing a red copper substrate heat dissipation module based on diamond copper. The present application comprises the following steps: 100, determining a three-dimensional geometric model of the red copper substrate heat dissipation module based on initial geometric parameters; 102, determining a simulation model of the red copper substrate heat dissipation module based on the three-dimensional geometric model; 104, simulating the heat dissipation performance by using the simulation model to obtain the heat dissipation time length of the simulation model reaching the design limit; 106, updating the initial geometric parameters and re-executing steps 100-106 until reaching a preset number of times to obtain the heat dissipation time length of the simulation model reaching the design limit under different geometric parameters; 108, optimizing the red copper substrate heat dissipation module based on the heat dissipation time length of the simulation model reaching the design limit under different geometric parameters. Thus, the present application can improve the heat dissipation performance of the red copper substrate heat dissipation module based on diamond copper.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation modules, and in particular to a method and device for optimizing a red copper substrate heat dissipation module based on diamond copper. BACKGROUND

[0002] With the development of electronic devices towards high performance, miniaturization and integration, the heat generated by electronic components during operation increases dramatically. An efficient heat dissipation system is a key factor to ensure stable operation of electronic devices, prolong service life and improve performance. The heat dissipation performance of traditional red copper substrates gradually becomes insufficient when facing high-power electronic components. The limited thermal conductivity of the red copper substrate makes it difficult to quickly conduct a large amount of heat, which can easily lead to high component temperature, performance degradation, failure and even damage.

[0003] Currently, although there are some heat dissipation improvement measures, such as using fin structures to increase the heat dissipation area, heat pipes, etc., these methods have certain limitations. The heat generated by the heating device cannot be conducted out, and the conducted heat cannot be dissipated. Therefore, it is of great practical significance to develop a new and efficient heat dissipation module.

[0004] Based on this, the present application provides a method and device for optimizing a red copper substrate heat dissipation module based on diamond copper to solve the problem of how to improve the heat dissipation performance of the red copper substrate heat dissipation module based on diamond copper. SUMMARY

[0005] To solve the problem of how to improve the heat dissipation performance of the red copper substrate heat dissipation module based on diamond copper, the present application provides a method and device for optimizing a red copper substrate heat dissipation module based on diamond copper.

[0006] In a first aspect, the present application provides a method for optimizing a red copper substrate heat dissipation module based on diamond copper, which comprises:

[0007] Step 100: determining a three-dimensional geometric model of the red copper substrate heat dissipation module based on diamond copper based on initial geometric parameters;

[0008] Step 102: determining a simulation model of the red copper substrate heat dissipation module based on diamond copper based on the three-dimensional geometric model;

[0009] Step 104: performing simulation and modeling of the heat dissipation performance using the simulation model to obtain the heat dissipation time length of the simulation model reaching the design limit; wherein the heat dissipation time length is used to represent the heat dissipation performance of the red copper substrate heat dissipation module based on diamond copper;

[0010] Step 106: updating the initial geometric parameters and re-executing steps 100-106 until a preset number of times is reached to obtain the heat dissipation time length of the simulation model reaching the design limit under different geometric parameters;

[0011] Step 108: based on the heat dissipation time length of the simulation model under different geometric parameters reaching the design limit, optimizing the diamond copper red copper substrate heat dissipation module.

[0012] In a second aspect, the embodiment of the present application provides an optimization device of a diamond copper red copper substrate heat dissipation module, which comprises:

[0013] The first data processing module is configured to perform step 100: based on initial geometric parameters, determining a three-dimensional geometric model of the diamond copper red copper substrate heat dissipation module.

[0014] The second data processing module is configured to perform step 102: based on the three-dimensional geometric model, determining a simulation model of the diamond copper red copper substrate heat dissipation module.

[0015] The third data processing module is configured to perform step 104: using the simulation model to perform simulation of heat dissipation performance, and obtaining a heat dissipation time length of the simulation model reaching the design limit; wherein the heat dissipation time length is used to represent the heat dissipation performance of the diamond copper red copper substrate heat dissipation module.

[0016] The fourth data processing module is configured to perform step 106: updating the initial geometric parameters, and re-executing steps 100-106 until a preset number of times are reached, and obtaining the heat dissipation time length of the simulation model under different geometric parameters reaching the design limit.

[0017] The fifth data processing module is configured to perform step 108: based on the heat dissipation time length of the simulation model under different geometric parameters reaching the design limit, optimizing the diamond copper red copper substrate heat dissipation module.

[0018] In a third aspect, the embodiment of the present application further provides an electronic device comprising a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the method of any embodiment of the present application.

[0019] In a fourth aspect, the embodiment of the present application further provides a computer readable storage medium, which stores a computer program, and when the computer program is executed in a computer, the computer executes the method of any embodiment of the present application.

[0020] The embodiment of the present application provides a kind of optimization method and device of red copper substrate heat dissipation module based on diamond copper, first, determine three-dimensional geometric model based on initial geometric parameter.Initial parameters cover substrate thickness, diamond particle distribution density, red copper matrix size and heat dissipation channel structure and other data, these parameters are converted into accurate digitized model by three-dimensional modeling tool, complete presentation module internal material ratio and spatial structure characteristics.Based on three-dimensional model, simulation model is built.This process needs to integrate material thermal physical parameters (such as diamond thermal conductivity, red copper thermal expansion coefficient), interface contact thermal resistance and working environment temperature boundary conditions, convert geometric model into calculable simulation model by finite element analysis software, ensure that heat transfer path can be truly reflected.The heat dissipation time is obtained by simulation simulation.In simulation process, the temperature change of key node of module is monitored in real time, when the temperature of core area reaches the highest tolerance threshold of device (i.e. design limit), the time required is recorded as heat dissipation performance evaluation index, and the longer the time is, the higher the heat dissipation efficiency is.Parameter iteration is optimized.Geometric parameters (such as increasing the height of heat dissipation fin, optimizing diamond particle arrangement) are adjusted according to preset gradient, and modeling and simulation process is repeatedly executed, and usually 20-50 groups of parameter combinations need to be tested to form multiple sets of comparison data.Optimization is carried out based on multiple sets of data.The optimal parameter ratio is determined by analyzing the change rule of heat dissipation time under different parameter combinations, and the key factors affecting heat dissipation efficiency can be accurately positioned through this systematic parameter iteration and simulation verification, so that the heat dissipation performance of red copper substrate heat dissipation module based on diamond copper is significantly improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0022] Figure 1 The optimization method flow chart of red copper substrate heat dissipation module based on diamond copper according to one embodiment is shown;

[0023] Figure 2 It is a hardware architecture diagram of electronic equipment provided by the embodiment of the present application;

[0024] Figure 3 The optimization device structure diagram of red copper substrate heat dissipation module based on diamond copper according to one embodiment is shown. DETAILED DESCRIPTION

[0025] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0026] Please refer to Figure 1 The embodiments of the present application provide an optimization method of a diamond copper red copper substrate heat dissipation module, and the method comprises the following steps:

[0027] Step 100: determining a three-dimensional geometric model of the diamond copper red copper substrate heat dissipation module based on initial geometric parameters;

[0028] Step 102: determining a simulation model of the diamond copper red copper substrate heat dissipation module based on the three-dimensional geometric model;

[0029] Step 104: performing simulation simulation of heat dissipation performance by using the simulation model to obtain a heat dissipation time length of the simulation model reaching a design limit; wherein the heat dissipation time length is used to represent the heat dissipation performance of the diamond copper red copper substrate heat dissipation module;

[0030] Step 106: updating the initial geometric parameters, and re-executing steps 100-106 until a preset number of times are reached to obtain the heat dissipation time length of the simulation model reaching the design limit under different geometric parameters;

[0031] Step 108: optimizing the diamond copper red copper substrate heat dissipation module based on the heat dissipation time length of the simulation model reaching the design limit under different geometric parameters.

[0032] In this embodiment, first, a three-dimensional geometric model is determined based on initial geometric parameters. The initial parameters include substrate thickness, diamond particle distribution density, red copper substrate size, heat dissipation channel structure and other core data. These parameters are converted into an accurate digital model through a three-dimensional modeling tool, which fully presents the material ratio and spatial structure characteristics of the module. A simulation model is constructed based on the three-dimensional model. This process needs to integrate material thermal physical parameters (such as diamond thermal conductivity, red copper thermal expansion coefficient), interface contact thermal resistance and working environment temperature boundary conditions. The geometric model is converted into a calculable simulation model through a finite element analysis software, which ensures that the heat transfer path can be truly reflected. The heat dissipation time is obtained through simulation. During the simulation process, the temperature changes of the key nodes of the module are monitored in real time. When the temperature of the core area reaches the highest tolerance threshold of the device (i.e. the design limit), the required time is recorded as the heat dissipation performance evaluation index. The longer the time, the higher the heat dissipation efficiency. The parameters are iteratively optimized. The geometric parameters (such as increasing the height of the heat dissipation fins and optimizing the arrangement of the diamond particles) are adjusted according to the preset gradient. The modeling and simulation process is repeated. Usually, 20-50 groups of parameter combinations need to be tested to form a plurality of comparison data. Based on the plurality of data, the optimal parameter ratio is determined. Through this systematic parameter iteration and simulation verification, the key factors affecting the heat dissipation efficiency can be accurately located, and the heat dissipation performance of the red copper substrate heat dissipation module of the diamond copper can be significantly improved.

[0033] In an embodiment of the present application, the three-dimensional geometric model includes a red copper substrate body, a diamond copper, and a plurality of heat dissipation fins.

[0034] The diamond copper is arranged on the upper surface of the red copper substrate body.

[0035] The plurality of heat dissipation fins are arranged on the lower surface of the red copper substrate body.

[0036] In this embodiment, the three-dimensional geometric model includes a red copper substrate body, a diamond copper layer and a plurality of heat dissipation fins. The red copper substrate body is used as a bearing core and adopts an integrated structure to ensure structural stability. The diamond copper layer is closely attached to the upper surface of the substrate body to form a high-efficiency heat conduction interface. The lower surface is uniformly distributed with a plurality of heat dissipation fins, which are arranged in parallel array to maximize the heat dissipation area. Each component realizes the optimal configuration of the heat transfer path through structural design.

[0037] In an embodiment of the present application, based on the three-dimensional geometric model, a simulation model of the red copper substrate heat dissipation module of the diamond copper is determined, which includes:

[0038] The three-dimensional geometric model is meshed to obtain a meshed geometric model.

[0039] The preset heat transfer parameters and material characteristic parameters are sequentially input into the diamond copper and the heat dissipation fins of the mesh-dissected geometric model, so that a simulation model of the red copper substrate heat dissipation module of the diamond copper is obtained.

[0040] In the embodiment, the process of determining the simulation model of the red copper substrate heat dissipation module of the diamond copper based on the three-dimensional geometric model is as follows: first, the three-dimensional geometric model is mesh-dissected, the adaptive mesh technology is adopted, the contact interface of the diamond copper and the red copper substrate, and the heat flow dense area such as the root of the heat dissipation fin are mesh-encrypted, and the remaining areas are mesh-dissected by using the conventional mesh, so that the mesh model with calculation accuracy and efficiency is formed. Then, the preset parameters are input in regions: the heat transfer parameters cover the convective heat transfer coefficient, the interface contact thermal resistance and the environmental radiation coefficient; the material characteristic parameters include the axial thermal conductivity of the diamond copper, the specific heat capacity of the red copper, the thermal expansion coefficient of the heat dissipation fin and the like. The parameters are matched to the diamond copper region and the heat dissipation fin region of the mesh model according to the structure corresponding relationship, and finally the simulation model capable of accurately simulating the heat conduction and convection process is constructed.

[0041] In one embodiment of the application, the red copper substrate heat dissipation module of the diamond copper is optimized based on the heat dissipation time of the simulation model under different geometric parameters reaching the design limit, including:

[0042] The heat dissipation time of the simulation model under different geometric parameters reaching the design limit is arranged in descending order to obtain a heat dissipation time sorting table;

[0043] Based on the heat dissipation time sorting table, a plurality of heat dissipation times meeting the design of the red copper substrate heat dissipation module of the diamond copper are determined.

[0044] The geometric parameters corresponding to the heat dissipation time meeting the design of the red copper substrate heat dissipation module of the diamond copper are optimized according to the comprehensive objective function, and the final geometric parameters of the red copper substrate heat dissipation module of the diamond copper are determined.

[0045] In the embodiment, the optimization process of the diamond copper-copper substrate heat dissipation module is as follows based on the heat dissipation time length of the simulation model reaching the design limit under different geometric parameters: first, the heat dissipation time lengths corresponding to multiple groups of geometric parameters (such as substrate thickness, fin spacing, diamond filling rate, etc.) are sorted from large to small to form a visual heat dissipation time length sorting table. This can intuitively present the influence trend of the parameters on the heat dissipation efficiency, and provide a data basis for screening efficient parameter combinations. Subsequently, according to the design standards of the heat dissipation module (such as the maximum tolerance temperature of the equipment, the industry heat dissipation efficiency specification), multiple heat dissipation time lengths meeting the design requirements are selected from the sorting table to form a candidate parameter set. These candidate time lengths need to meet the conditions of core area temperature not exceeding the threshold value, heat dissipation response speed meeting the working condition requirements, etc. Finally, a comprehensive objective function is introduced to optimize the candidate parameter set. The geometric parameters with the highest score are finally selected as the final scheme, realizing the optimal balance between heat dissipation performance and engineering practicability.

[0046] In an embodiment of the present application, the comprehensive objective function is determined by the following formula:

[0047]

[0048] C(θ)=[ρ dia ·S dia ·h dia ·c dia ]+[ρ cu ·S cu ·h cu ·c cu +ρ fin ·n·t fin ·l fin ·h fin ·c fin ]+C p

[0049] V(θ)=S cu ·h cu +S dia ·h dia +n·t fin ·l fin ·h fin

[0050] θ=(h cu ,S cu ,h dia ,S dia ,t fin ,n,h fin ,l fin )

[0051] In the formula, minf(θ) is the comprehensive objective function, ω1 is the first preset weight, ω2 is the second preset weight, C(θ) is the cost function, V(θ) is the volume function, and C max V represents the maximum cost among the candidate parameters. max ρ represents the largest volume among the candidate parameters. dia The density of copper, S dia h is the area of ​​diamond copper paving. dia For the thickness of diamond copper, c dia ρ is the unit mass material cost of diamond copper. cu ρ is the density of diamond copper. fin c is the density of the fin material. fin S represents the unit mass material cost of the fins. cu h is the bottom area of ​​the copper substrate. cu Where n is the thickness of the copper substrate, n is the number of fins, and t is the thickness of the copper substrate. fin For fin thickness, l fin h is the fin length. fin c is the fin height. cu C represents the unit mass material cost of copper. p To maintain a fixed processing cost, θ is a vector of geometric parameters.

[0052] In this embodiment, the comprehensive objective function aims to select the optimal geometric parameters that are both cost-effective and compact while meeting heat dissipation performance requirements. This function integrates two objectives through weighted aggregation: first, cost and volume are normalized to eliminate unit differences (e.g., cost divided by the maximum cost among candidate parameters, volume divided by the maximum volume), and then appropriate weights are assigned to each. The weights reflect priority: if economic efficiency is prioritized (e.g., mass production), a larger cost weight is assigned; if compactness is emphasized (e.g., small electronic devices), a higher volume weight is assigned, and the sum of the two is 1. The function aims to minimize these weights; a smaller value indicates a better parameter combination. This function quantifies the overall performance of different parameters, quickly finding a cost-effective and compact solution that balances engineering costs and space constraints.

[0053] In one embodiment of the present invention, the comprehensive objective function is determined by the following formula:

[0054]

[0055] C(θ)=[ρ dia ·S dia ·h dia ·c dia ]+[ρ cu ·S cu ·h cu ·c cu +ρ fin ·n·t fin·l fin ·h fin ·c fin ]+C p

[0056] W(θ)=ρ cu ·S cu ·h cu +ρ dia .S dia ·h dia +ρ fin ·n·t fin ·l fin ·h fin

[0057] θ=(h cu ,S cu ,h dia ,S dia ,t fin ,n,h fin ,l fin )

[0058] In the formula, minf(θ) is a comprehensive objective function, ω3 is a third preset weight, ω4 is a fourth preset weight, C(θ) is a cost function, W(θ) is a weight function, C max is the maximum cost in the candidate parameters, W max is the maximum weight in the candidate parameters, ρ dia is the density of red copper, S dia is the laying area of diamond copper, h dia is the thickness of diamond copper, c dia is the unit mass material cost of diamond copper, ρ cu is the density of diamond copper, ρ fin is the density of fin material, c fin is the unit mass material cost of fin, S cu is the bottom area of red copper substrate, h cu is the thickness of red copper substrate, n is the number of fins, t fin is the thickness of fin, l fin is the length of fin, h fin is the height of fin, c cu is the unit mass material cost of red copper, C p is a fixed processing cost, and θ is a geometric parameter vector.

[0059] In the embodiment, the comprehensive objective function is to find the optimal geometric parameters with low cost and light weight under the premise of meeting the heat dissipation performance. The function integrates the two objectives by weighting. The cost and weight are normalized to eliminate unit differences (e.g., the cost is divided by the maximum cost in the candidate parameters, and the weight is divided by the maximum weight), and then the weights are assigned. The weights reflect the priority: if economic efficiency is more concerned, the cost weight takes a larger value; if lightweight is focused (e.g., in an aviation scenario), the weight weight is higher, and the sum of the two is 1. The function aims to minimize, and the smaller the value, the better the parameter combination. Through this function, the comprehensive performance of different geometric parameters can be quantified, and the scheme that saves money and is light can be quickly selected to balance engineering needs and practical application limitations.

[0060] In an embodiment of the application, the initial geometric parameters are updated by particle swarm optimization.

[0061] In the embodiment, the particle swarm optimization algorithm is used to update the initial geometric parameters. In this process, parameters such as substrate thickness and diamond particle density are encoded as particle positions, and the heat dissipation time is used as the fitness function. The process simulates the cooperative search of a group of particles: particles dynamically adjust their flight speed based on their historical optimal solution and global optimal solution, iteratively update their positions, and gradually approach better parameter combinations. This adaptive updating mechanism can efficiently escape from local optima, ensuring that the iteration direction of the geometric parameters always points to the region with better heat dissipation performance, significantly improving the accuracy and efficiency of parameter updating.

[0062] As shown in Figure 2 , Figure 3 , the embodiment of the application provides an optimization device for a red copper substrate heat dissipation module based on diamond copper. The device embodiment can be implemented by software, or by hardware or a combination of software and hardware. From the hardware layer, as shown in Figure 2 , it is a hardware architecture diagram of an electronic device in which the optimization device for a red copper substrate heat dissipation module based on diamond copper is located. In addition to the processor, memory, network interface, and non-volatile memory shown in Figure 2 , the electronic device in which the device is located in the embodiment can also include other hardware, such as a forwarding chip responsible for processing packets, etc. Taking software implementation as an example, as shown in Figure 3 , as a logically meaningful device, it is formed by the CPU of the electronic device in which it is located reading the corresponding computer program in the non-volatile memory into the memory and running.

[0063] As shown in Figure 3 , the embodiment provides an optimization device for a red copper substrate heat dissipation module based on diamond copper, which includes:

[0064] The first data processing module 300 is configured to determine a three-dimensional geometric model of the diamond-copper red-brass substrate heat dissipation module based on the initial geometric parameters in step 100.

[0065] The second data processing module 302 is configured to determine a simulation model of the diamond-copper red-brass substrate heat dissipation module based on the three-dimensional geometric model in step 102.

[0066] The third data processing module 304 is configured to perform simulation modeling of the heat dissipation performance by using the simulation model to obtain a heat dissipation time length of the simulation model reaching a design limit in step 104, wherein the heat dissipation time length is used to represent the heat dissipation performance of the diamond-copper red-brass substrate heat dissipation module.

[0067] The fourth data processing module 306 is configured to update the initial geometric parameters and re-perform steps 100-106 until a preset number of times is reached to obtain the heat dissipation time length of the simulation model reaching the design limit under different geometric parameters in step 106.

[0068] The fifth data processing module 308 is configured to optimize the diamond-copper red-brass substrate heat dissipation module based on the heat dissipation time length of the simulation model reaching the design limit under the different geometric parameters in step 108.

[0069] In an embodiment of the present application, the three-dimensional geometric model comprises a red-brass substrate body, diamond-copper and a plurality of heat dissipation fins.

[0070] The diamond-copper is arranged on the upper surface of the red-brass substrate body.

[0071] The plurality of heat dissipation fins are arranged on the lower surface of the red-brass substrate body.

[0072] In an embodiment of the present application, the second data processing module 302 is configured to perform the following operations:

[0073] The three-dimensional geometric model is meshed to obtain a meshed geometric model;

[0074] The preset heat transfer parameters and material characteristic parameters are sequentially input into the diamond-copper and the heat dissipation fins of the meshed geometric model to obtain the simulation model of the diamond-copper red-brass substrate heat dissipation module.

[0075] In an embodiment of the present application, the fifth data processing module 308 is configured to perform the following operations:

[0076] The heat dissipation time lengths of the simulation models under the different geometric parameters are arranged in descending order to obtain a heat dissipation time length sorting table;

[0077] Based on the heat dissipation time sequence table, a plurality of heat dissipation time lengths meeting the heat dissipation module design of the diamond copper red copper substrate are determined.

[0078] The geometric parameters corresponding to the heat dissipation time lengths meeting the heat dissipation module design of the diamond copper red copper substrate are optimized according to the comprehensive target function to determine the final geometric parameters of the diamond copper red copper substrate heat dissipation module.

[0079] In an embodiment of the present application, the comprehensive target function is determined by the following formula:

[0080]

[0081] C(θ)=[ρ dia ·S dia ·h dia ·c dia ]+[ρ cu ·S cu ·h cu ·c cu +ρ fin ·n·t fin ·l fin ·h fin ·c fin ]+C p

[0082] V(θ)=S cu ·h cu +S dia ·h dia +n·t fin ·l fin ·h fin

[0083] θ=(h cu ,S cu ,h dia ,S dia ,t fin ,n,h fin ,l fin )

[0084] In the formula, minf(θ) is the comprehensive target function, ω1 is the first preset weight, ω2 is the second preset weight, C(θ) is the cost function, V(θ) is the volume function, C max is the maximum cost in the candidate parameters, V max is the maximum volume in the candidate parameters, ρ dia is the density of red copper, S dia is the diamond copper laying area, h dia is the diamond copper thickness, c dia is the unit mass material cost of diamond copper, ρ cuρ is the density of diamond copper. fin c is the density of the fin material. fin S represents the unit mass material cost of the fins. cu h is the bottom area of ​​the copper substrate. cu Where n is the thickness of the copper substrate, n is the number of fins, and t is the thickness of the copper substrate. fin For fin thickness, l fin h is the fin length. fin c is the fin height. cu C represents the unit mass material cost of copper. p To maintain a fixed processing cost, θ is a vector of geometric parameters.

[0085] In one embodiment of the present invention, the comprehensive objective function is determined by the following formula:

[0086]

[0087] C(θ)=[ρ dia ·S dia ·h dia ·c dia ]+[ρ cu ·S cu ·h cu ·c cu +ρ fin ·n·t fin ·l fin ·h fin ·c fin ]+C p

[0088] W(θ)=ρ cu ·S cu ·h cu +ρ dia .S dia ·h dia +ρ fin ·n·t fin ·l fin ·h fin

[0089] θ=(h cu ,S cu ,h dia ,S dia ,t fin ,n,h fin ,l fin )

[0090] In the formula, minf(θ) is the comprehensive objective function, ω3 is the third preset weight, ω4 is the fourth preset weight, C(θ) is the cost function, W(θ) is the weight function, and C max W represents the maximum cost among the candidate parameters.max ρ is the maximum weight among the candidate parameters dia S is the density of red copper dia h is the area of the red copper substrate dia c is the thickness of the red copper substrate dia ρ is the unit mass material cost of the red copper substrate cu ρ is the density of the diamond copper fin c is the density of the fin material fin S is the unit mass material cost of the fin cu h is the area of the red copper substrate cu c is the thickness of the red copper substrate n is the number of fins t fin c is the thickness of the fin fin h is the length of the fin fin c is the height of the fin cu C is the unit mass material cost of the red copper p θ is the fixed processing cost, and θ is a geometric parameter vector.

[0091] In an embodiment of the present application, the initial geometric parameters are updated by particle swarm optimization.

[0092] It can be understood that the structure shown in the embodiment of the present application does not constitute a specific limitation on the optimization device of the red copper substrate heat dissipation module based on diamond copper. In other embodiments of the present application, the optimization device of the red copper substrate heat dissipation module based on diamond copper can include more or fewer components than the diagram, or combine certain components, or split certain components, or different component arrangement. The components shown in the diagram can be implemented in hardware, software, or a combination of software and hardware.

[0093] The information interaction, execution process, and the like between the modules in the above device are based on the same concept as the method embodiments of the present application, and the specific content can be referred to the description in the method embodiments of the present application, which will not be described here.

[0094] The embodiment of the present application also provides an electronic device, which includes a memory and a processor, the memory stores a computer program, and the processor implements the optimization method of the red copper substrate heat dissipation module based on diamond copper in any embodiment of the present application when executing the computer program.

[0095] The embodiment of the present application also provides a computer readable storage medium, which stores a computer program, and the computer program makes the processor execute the optimization method of the red copper substrate heat dissipation module based on diamond copper in any embodiment of the present application when being executed by the processor.

[0096] Specifically, a system or apparatus equipped with a storage medium on which a software program code for implementing the functions of any of the above-described embodiments is stored, and a computer (or CPU or MPU) of the system or apparatus is caused to read out and execute the program code stored in the storage medium.

[0097] In this case, the program code read out from the storage medium can itself implement the functions of any of the above-described embodiments, and therefore the program code and the storage medium which stores the program code constitute a part of the present application.

[0098] Embodiments of the storage medium for supplying the program code include a floppy disk, a hard disk, an optical disk such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW, a magnetic tape, a nonvolatile memory card, and a ROM. Alternatively, the program code can be downloaded from a server computer via a communication network.

[0099] Further, it should be understood by those skilled in the art that not only the program code read out by the computer, but also the operating system or the like operating on the computer based on the instructions of the program code can perform part or all of the actual operations to realize the functions of any of the above-described embodiments.

[0100] Further, it should be understood that the program code read out from the storage medium is written into a memory provided in an extension board inserted into the computer or a memory provided in an extension module connected to the computer, and then part or all of the actual operations are performed by a CPU or the like mounted on the extension board or the extension module based on the instructions of the program code to realize the functions of any of the above-described embodiments.

[0101] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0102] Those skilled in the art can understand that all or part of the steps of the above-mentioned method embodiments can be completed by program instruction related hardware, and the foregoing program can be stored in a computer readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the foregoing storage medium includes various storage media that can store program codes, such as ROM, RAM, magnetic disk or optical disk.

[0103] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optimization method for a copper substrate heat dissipation module based on diamond copper, characterized in that, include: Step 100: Based on the initial geometric parameters, determine the three-dimensional geometric model of the diamond copper copper substrate heat dissipation module; Step 102: Based on the three-dimensional geometric model, determine the simulation model of the diamond copper copper substrate heat dissipation module; Step 104: Use the simulation model to simulate the heat dissipation performance and obtain the heat dissipation time when the simulation model reaches the design limit; wherein, the heat dissipation time is used to characterize the heat dissipation performance of the diamond copper copper substrate heat dissipation module. Step 106: Update the initial geometric parameters and repeat steps 100 to 106 until the preset number of times is reached to obtain the heat dissipation time of the simulation model reaching the design limit under different geometric parameters; Step 108: Based on the heat dissipation time of the simulation model under different geometric parameters reaching the design limit, optimize the heat dissipation module of the diamond copper copper substrate. The optimization of the heat dissipation module of the diamond copper substrate based on the heat dissipation time of the simulation model reaching the design limit under different geometric parameters includes: The heat dissipation time of the simulation models under different geometric parameters reaching the design limit is arranged in descending order to obtain a heat dissipation time sorting table; Based on the heat dissipation duration ranking table, the heat dissipation duration of multiple copper substrate heat dissipation modules that meet the requirements of diamond copper is determined. The geometric parameters corresponding to the heat dissipation time of the copper substrate heat dissipation module that meets the design requirements of diamond copper are optimized according to the comprehensive objective function to determine the final geometric parameters of the copper substrate heat dissipation module. The comprehensive objective function is determined by the following formula: In the formula, The comprehensive objective function is... As the first preset weight, As the second preset weight, For cost function, It is a volume function. The maximum cost among the candidate parameters. The largest volume among the candidate parameters. The density of copper, The area covered by diamond copper. For diamond copper thickness, The unit mass material cost of diamond copper. The density of diamond copper, The density of the fin material, The cost per unit mass of material for the fins. This represents the bottom area of ​​the copper substrate. The thickness of the copper substrate. For the number of fins, For fin thickness, The length of the fin. The height of the fin. The cost per unit mass of copper material. To fix processing costs, A vector of geometric parameters; Alternatively, the comprehensive objective function can be determined by the following formula: In the formula, The comprehensive objective function is... As the third preset weight, As the fourth preset weight, For cost function, For weight function, The maximum cost among the candidate parameters. The maximum weight among the candidate parameters. The density of copper, The area covered by diamond copper. For diamond copper thickness, The unit mass material cost of diamond copper. The density of diamond copper, The density of the fin material, The cost per unit mass of material for the fins. This represents the bottom area of ​​the copper substrate. The thickness of the copper substrate. For the number of fins, For fin thickness, The length of the fin. The height of the fin. The cost per unit mass of copper material. To fix processing costs, This is a vector of geometric parameters.

2. The method according to claim 1, characterized in that, The three-dimensional geometric model includes a copper substrate, diamond copper, and multiple heat dissipation fins. The diamond copper is disposed on the upper surface of the copper substrate body; Multiple heat dissipation fins are disposed on the lower surface of the copper substrate body.

3. The method according to claim 2, characterized in that, The simulation model for determining the heat dissipation module of the diamond copper substrate based on the three-dimensional geometric model includes: The three-dimensional geometric model is meshed to obtain the meshed geometric model; The preset heat transfer parameters and material property parameters are sequentially input into the diamond copper and heat dissipation fins of the geometric model after meshing to obtain a simulation model of the diamond copper copper substrate heat dissipation module.

4. The method according to claim 1, characterized in that, The initial geometric parameters are updated through particle swarm optimization.

5. An optimized device for a copper substrate heat dissipation module based on diamond copper, characterized in that, For performing the method as described in any one of claims 1-4, comprising: The first data processing module is used for step 100: determining the three-dimensional geometric model of the diamond copper copper substrate heat dissipation module based on the initial geometric parameters. The second data processing module is used for step 102: determining the simulation model of the diamond copper copper substrate heat dissipation module based on the three-dimensional geometric model. The third data processing module is used in step 104: to simulate the heat dissipation performance using the simulation model and obtain the heat dissipation time when the simulation model reaches the design limit; wherein, the heat dissipation time is used to characterize the heat dissipation performance of the diamond copper copper substrate heat dissipation module. The fourth data processing module is used in step 106: updating the initial geometric parameters, re-executing steps 100 to 106 until a preset number of times is reached, and obtaining the heat dissipation time of the simulation model reaching the design limit under different geometric parameters; The fifth data processing module is used in step 108 to optimize the heat dissipation module of the diamond copper substrate based on the heat dissipation time of the simulation model under different geometric parameters reaching the design limit.

6. An electronic device, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the method as described in any one of claims 1-4.

7. A computer-readable storage medium, characterized in that, It stores a computer program that, when executed in a computer, causes the computer to perform the method described in any one of claims 1-4.

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