Power brick module thin film capacitor and preparation method thereof

Abstract

The invention relates to the technical field of automobile capacitors, and discloses a power brick module thin-film capacitor and a preparation method thereof, the power brick module thin-film capacitor comprises an aluminum shell, and a capacitor module is arranged in a cavity of the aluminum shell; the capacitor module comprises an epoxy resin plate, the epoxy resin plate is fixedly connected with the inner wall of the aluminum shell, the upper surface of the epoxy resin plate is fixedly connected with an insulating support, the inner wall of the epoxy resin plate is fixedly connected with a first busbar, the upper surface of the first busbar is fixedly connected with a second busbar, and the inner wall of the second busbar is provided with a core. The upper surface of the epoxy resin plate is fixedly connected with a capacitor body. According to the thin-film capacitor, the aluminum shell provided with the water channel and the integrated capacitor module are arranged, the current density of the thin-film capacitor can be increased through water circulation, meanwhile, the integrated compact design is adopted, the size of the capacitor is reduced, the installation occupied space is reduced, and the installation convenience of a client is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of automobile capacitors, in particular to a power brick module film capacitor and a preparation method thereof. BACKGROUND

[0002] The power brick module film capacitor is a key component in a power brick module, is a capacitor made of a plastic film as a medium and a metal electrode as an electrode. The power brick module film capacitor has the advantages of small volume, large capacity, good high-frequency characteristics, low loss, self-healing, high reliability and the like, and can stably work under harsh conditions such as high temperature and high pressure. In the power brick module, the film capacitor helps to filter high-frequency noise in a circuit, stabilizes current and voltage, and improves the performance of the circuit. Some power brick modules also design the film capacitor and the power module in an integrated manner, realize efficient heat dissipation through a shared heat sink and the like, and further improve the reliability and service life of the film capacitor.

[0003] The power brick module film capacitors used on the market at present mostly adopt a plastic shell scheme. In use, the power brick module film capacitors lack water channel design, it is difficult to improve the capacitance density of the capacitor body through water circulation, and the capacitors of the traditional structure have large volume, so that a large space needs to be occupied in actual installation, and the installation of the user is not facilitated. Therefore, the application provides a power brick module film capacitor and a preparation method thereof. SUMMARY

[0004] (I) Technical problems solved

[0005] In view of the defects of the prior art, the application provides a power brick module film capacitor and a preparation method thereof, which solve the problems that the existing automobile capacitors lack water channel design, it is difficult to improve the capacitance density of the capacitor body through water circulation, and the capacitors of the traditional structure have large volume, so that a large space needs to be occupied in actual installation, and the installation of the user is not facilitated.

[0006] (II) Technical scheme

[0007] In order to achieve the above object, the application is implemented by the following technical scheme: a power brick module film capacitor and a preparation method thereof, comprising an aluminum shell, a capacitor module is arranged in the cavity of the aluminum shell;

[0008] The capacitor module comprises an epoxy resin plate, the epoxy resin plate is fixedly connected with the inner wall of the aluminum shell, an insulating support is fixedly connected to the upper surface of the epoxy resin plate, a busbar one is fixedly connected to the inner wall of the epoxy resin plate, a busbar two is fixedly connected to the upper surface of the busbar one, a core is installed on the inner wall of the busbar two, a capacitor body is fixedly connected to the upper surface of the epoxy resin plate, and a terminal table is fixedly connected to the lower surface of the epoxy resin plate.

[0009] The capacitor module further comprises a blocking support, an insulating paper I, a terminal table, a grounding row, a connecting bolt, an insulating paper II, an insulating paper III, a female row IV and an insulating paper IV.

[0010] Preferably, the surface of the aluminum shell is fixedly connected with a joint I, the surface of the aluminum shell is fixedly connected with a joint II, the inner wall of the aluminum shell is provided with a water channel I, the inner wall of the aluminum shell is provided with a water channel II, and the inner wall of the aluminum shell is provided with a cooling cavity. The design of the cooling cavity enables the water channel I and the water channel II to be communicated, thereby ensuring the circulation effect of the water source entering the cooling cavity.

[0011] Preferably, the blocking support is fixedly connected with the upper surface of the insulating support, the insulating paper III is attached to the inner wall of the blocking support, the female row III is fixedly connected with the upper surface of the female row II, and the female row III is inserted into the inner wall of the blocking support. The insulating paper I is sleeved on the surface of the female row III. The blocking support can shield the installation position of the female row III, so as to prevent the tank sealing medium from overflowing through the installation position of the female row III during the tank sealing of the capacitor.

[0012] Preferably, the inner wall of the epoxy resin plate is fixedly connected with a grounding row, the grounding row is electrically connected with the capacitor body, the inner wall of the grounding row is inserted with a connecting bolt, and the connecting bolt is threadedly connected with the inner wall of the aluminum shell. Through the cooperation of the grounding row and the connecting bolt, the capacitor can be connected with the ground wire on the installation equipment after installation.

[0013] Preferably, the surface of the female row I is attached with an insulating paper II, the lower surface of the female row I is attached with an insulating paper III, the inner wall of the epoxy resin plate is fixedly connected with a female row IV, and the lower surface of the female row IV is attached with an insulating paper IV. The insulating paper III can shield the contact part of the female row IV and the female row I, so as to avoid the direct contact of the female row IV and the female row I, thereby preventing the short circuit of the contact part.

[0014] Preferably, the joint I is in communication with the inside of the water channel I, the water channel I is in communication with the inside of the cooling cavity, the joint II is in communication with the inside of the water channel II, and the water channel II is in communication with the inside of the cooling cavity.

[0015] Preferably, the insulating support is located on the inner wall of the aluminum shell, the number of the cores is seven, and the seven cores are arranged in a convex shape. The cores are electrically connected with the capacitor body.

[0016] Preferably, the side surfaces of the female row I and the female row IV are provided with protruding parts, the surface of the terminal table is provided with grooves matched with the protruding parts, and the upper surface of the insulating paper III is in contact with the female row IV.

[0017] Preferably, in step S1, during production, the feeding equipment transports the film used to produce the core to the stacking area, so that two films are stacked together. After stacking, the stacked film is transferred to the fully automatic winding device by a robotic arm or other equipment. After placement, the winding device winds the film. After winding, the robotic arm transfers the wound core to the conveying mechanism. The conveying mechanism transfers the core to the gold spraying chamber. When the core reaches the gold spraying processing position, the gold spraying device vaporizes the solid metal at high temperature, converting it into fine particles. The particles are then sprayed onto the two end faces of the core using high-pressure gas to form two capacitor plates and ensure the uniformity of the two plates.

[0018] S2. After the gold plating process is completed, the conveyor mechanism transports the core to a nitrogen oven. The nitrogen oven bakes the core at 110℃±5℃ / 24H, expelling interlayer air during the high-temperature baking process to ensure sufficient isolation between the film layers and prevent surface metal oxidation. After heat treatment, the core is transferred to a sandblasting machine. The sandblasting machine then operates, using alumina microspheres (80 mesh) at low pressure to sandblast the core surface, avoiding damage to the metal layers and increasing surface roughness. To improve subsequent welding wettability; after sandblasting, the core is transferred to the power-enhancing device. The power-enhancing device is connected to the core, and after connection, the power-enhancing device uses a stepped voltage increase method to break down the defects in the core. The high-temperature arc generated at the moment of breakdown causes the metal plating around the defect to vaporize and evaporate, forming an insulating oxide zone that isolates the conductive channel, thereby repairing the defects in the core; after completing the above steps, the seven cores are welded together in a convex shape using an automatic welding device, and the cores are welded together with busbar two.

[0019] S3. After welding, fix busbar 1 with insulating paper 2 and insulating paper 3 pasted on it to the epoxy resin board, and install busbar 4 below busbar 1. After installing busbar 4, paste insulating paper 4 on busbar 4. After completing the above operations, install busbar 2 with busbar 3 fixed on it on busbar 1, and fix the capacitor body in the pre-reserved mounting groove of the epoxy resin. Connect the capacitor body to the core using a ribbon cable. After completing the operation, fix the insulating bracket and terminal block to the epoxy resin board in sequence. Then install the assembled capacitor module into the pre-reserved cavity of the aluminum shell. Then fill the mounting cavity with epoxy resin through the pre-reserved sealing hole of the aluminum shell to encapsulate the capacitor module. After filling, fix the sealing bracket on the insulating bracket. After encapsulation, place the assembled capacitor in a vacuum environment to eliminate air bubbles in the epoxy resin.

[0020] S4. After packaging, the capacitor is transferred to the aging test equipment and subjected to aging tests under simulated operating conditions. After the aging test is completed, the capacitor is transferred to the final test equipment to conduct a final test under simulated operating conditions. After the final test is completed, the capacitor is manually inspected by FQC (Final Quality Control).

[0021] In summary, the technical effects and advantages of this invention are as follows:

[0022] 1. In this invention, by setting an aluminum shell with water channels and an integrated capacitor module, the film capacitor can increase the current density of the capacitor by utilizing water circulation. At the same time, the integrated compact design reduces the size of the capacitor, reduces the space occupied during installation, and increases the convenience of installation for customers. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of a power brick module thin film capacitor and its preparation method according to the present invention;

[0024] Figure 2 This is a side view of a power brick module thin-film capacitor and its preparation method according to the present invention;

[0025] Figure 3 This is a front view of a power brick module thin-film capacitor and its fabrication method according to the present invention.

[0026] Figure 4 This is a rear view of a power brick module thin-film capacitor and its preparation method according to the present invention.

[0027] Figure 5 This is a bottom view of a power brick module thin-film capacitor and its preparation method according to the present invention;

[0028] Figure 6 This is a schematic diagram of the aluminum shell structure of a power brick module thin film capacitor and its preparation method according to the present invention;

[0029] Figure 7 This is a bottom view of the aluminum casing of a power brick module thin film capacitor and its preparation method according to the present invention.

[0030] Figure 8 This is a cross-sectional view of the aluminum casing of a power brick module thin film capacitor and its preparation method according to the present invention.

[0031] Figure 9 This is a schematic diagram of the capacitor module structure of a power brick module thin film capacitor and its preparation method according to the present invention.

[0032] Figure 10 This invention relates to a power brick module thin-film capacitor and its preparation method. Figure 9 Partial structural diagram;

[0033] Figure 11 This invention relates to a power brick module thin-film capacitor and its preparation method. Figure 9 A partial structural diagram;

[0034] Figure 12 This is a schematic diagram of the capacitor module structure of a power brick module thin film capacitor and its preparation method according to the present invention.

[0035] Figure 13 This invention relates to a power brick module thin-film capacitor and its preparation method. Figure 12 A partial structural diagram;

[0036] Figure 14 This invention relates to a power brick module thin-film capacitor and its preparation method. Figure 12 Partial structural diagram;

[0037] Figure 15 This invention relates to a power brick module thin-film capacitor and its preparation method. Figure 14 Partial structural diagram;

[0038] Figure 16 This invention relates to a power brick module thin-film capacitor and its preparation method. Figure 15 Partial structural diagram;

[0039] Figure 17 This invention relates to a power brick module thin-film capacitor and its preparation method. Figure 16 Partial structural diagram;

[0040] Figure 18 This invention relates to a power brick module thin-film capacitor and its preparation method. Figure 17 A partial structural diagram.

[0041] In the diagram: 1. Aluminum casing; 11. Connector 1; 12. Connector 2; 13. Water channel 1; 14. Water channel 2; 15. Cooling chamber; 2. Capacitor module; 21. Epoxy resin board; 22. Insulating bracket; 23. Busbar 1; 24. Busbar 2; 25. Core; 26. Capacitor body; 27. Sealing bracket; 28. Insulating paper 1; 29. ​​Busbar 3; 210. Terminal block; 211. Grounding busbar; 212. Connecting bolt; 213. Insulating paper 2; 214. Insulating paper 3; 215. Busbar 4; 216. Insulating paper 4. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] refer to Figures 1-18 The power brick module thin film capacitor shown herein and its preparation method include an aluminum shell 1, and a capacitor module 2 disposed inside the cavity of the aluminum shell 1.

[0044] The capacitor module 2 includes an epoxy resin board 21, which is fixedly connected to the inner wall of the aluminum shell 1. An insulating bracket 22 is fixedly connected to the upper surface of the epoxy resin board 21. A busbar 23 is fixedly connected to the inner wall of the epoxy resin board 21. A busbar 24 is fixedly connected to the upper surface of the busbar 23. A core 25 is installed on the inner wall of the busbar 24. A capacitor body 26 is fixedly connected to the upper surface of the epoxy resin board 21. A terminal block 210 is fixedly connected to the lower surface of the epoxy resin board 21.

[0045] The capacitor module 2 also includes a sealing bracket 27, insulating paper one 28, terminal block 210, grounding busbar 211, connecting bolt 212, insulating paper two 213, insulating paper three 214, busbar four 215, and insulating paper four 216.

[0046] The aluminum shell 1 has a connector 11 fixedly connected to its surface and a connector 12 fixedly connected to its surface. The inner wall of the aluminum shell 1 has a water channel 13 and a water channel 14. The inner wall of the aluminum shell 1 has a cooling chamber 15. The design of the cooling chamber 15 allows the water channel 13 and the water channel 14 to be connected, thereby ensuring the circulation effect of the water entering the cooling chamber 15.

[0047] The sealing bracket 27 is fixedly connected to the upper surface of the insulating bracket 22. The insulating paper 214 is pasted on the inner wall of the sealing bracket 27. The busbar 29 is fixedly connected to the upper surface of the busbar 24. The busbar 29 is inserted into the inner wall of the sealing bracket 27. The insulating paper 28 is sleeved on the surface of the busbar 29. The sealing bracket 27 can be used to shield the installation position of the busbar 29 to prevent the sealing medium from overflowing through the installation position of the busbar 29 when the capacitor is sealed.

[0048] Among them, the inner wall of the epoxy resin board 21 is fixedly connected to the grounding busbar 211, the grounding busbar 211 is electrically connected to the capacitor body 26, and the inner wall of the grounding busbar 211 is inserted with the connecting bolt 212, which is threadedly connected to the inner wall of the aluminum shell 1. Through the cooperation of the grounding busbar 211 and the connecting bolt 212, the capacitor can be connected to the ground wire on the installed equipment after installation.

[0049] Among them, the surface of busbar 1 23 is covered with insulating paper 213, the lower surface of busbar 1 23 is covered with insulating paper 3 214, the inner wall of epoxy resin board 21 is fixedly connected to busbar 4 215, the lower surface of busbar 4 215 is covered with insulating paper 4 216. The insulating paper 3 214 can be used to shield the contact part between busbar 4 215 and busbar 1 23, so as to avoid the problem of short circuit at the contact part due to direct contact between busbar 4 215 and busbar 1 23.

[0050] Among them, connector 11 is internally connected to water channel 13, water channel 13 is internally connected to cooling cavity 15, connector 2 12 is internally connected to water channel 2 14, and water channel 2 14 is internally connected to cooling cavity 15.

[0051] The insulating support 22 is located on the inner wall of the aluminum shell 1, and there are seven cores 25 arranged in a convex shape. The cores 25 are electrically connected to the capacitor body 26.

[0052] Among them, the side surfaces of busbar 1 23 and busbar 4 215 are provided with protrusions, the surface of terminal block 210 is provided with grooves that are adapted to the protrusions, and insulating paper 3 214 is in contact with the upper surface of busbar 4 215.

[0053] The production process of this invention is as follows: During production, the feeding equipment transports the film used to produce the core 25 to the stacking area, so that two films are stacked together. After stacking, the stacked films are transferred to the fully automatic winding device by a robotic arm or other equipment. After placement, the winding device winds the film. After winding, the robotic arm transfers the wound core 25 to the conveying mechanism. The conveying mechanism transfers the core 25 to the gold spraying chamber. When the core 25 reaches the gold spraying processing position, the gold spraying device vaporizes the solid metal at high temperature, converting it into fine particles. The particles are then sprayed onto the two end faces of the core 25 simultaneously by high-pressure gas to form two capacitor plates and ensure the uniformity of the two plates.

[0054] After the gold plating process, the conveyor transports core 25 to a nitrogen oven, where it is baked at 110℃±5℃ for 24 hours. During this high-temperature baking process, interlayer air is expelled to ensure adequate isolation between the film layers and prevent surface metal oxidation. After heat treatment, core 25 is transferred to a sandblasting machine. The sandblasting machine then operates, using alumina microspheres (80 mesh) at low pressure to sandblast the surface of core 25, avoiding damage to the metal layers and increasing surface roughness to improve subsequent performance. Welding wettability; After sandblasting, core 25 is transferred to the power-enhancing device. The power-enhancing device is connected to core 25. After connection, the power-enhancing device uses a stepped voltage increase method to break down the defect points of core 25. The high-temperature arc generated at the moment of breakdown causes the metal plating around the defect to vaporize and evaporate, forming an insulating oxide zone that isolates the conductive channel, thereby repairing the defect points of core 25. After completing the above steps, an automatic welding device is used to weld seven cores 25 together in a U-shape, and core 25 is welded to busbar 24.

[0055] After welding is completed, busbar 1 23, with insulating paper 213 and insulating paper 214 pasted on it, is fixed to the epoxy resin board 21. Busbar 4 215 is installed below busbar 1 23. After the installation of busbar 4 215 is completed, insulating paper 4 216 is pasted on busbar 4 215. After the above operations are completed, busbar 24, with busbar 3 29 fixed on it, is installed on busbar 1 23. The capacitor body 26 is fixed in the pre-reserved mounting groove in the epoxy resin and connected to the capacitor body 26 using a ribbon cable. After connecting the core 25 and completing the operation, fix the insulating bracket 22 and the terminal block 210 to the epoxy resin board 21 in sequence. Then, install the assembled capacitor module 2 into the cavity reserved in the aluminum shell 1. Then, fill the cavity with epoxy resin through the can sealing hole reserved in the aluminum shell 1 to encapsulate the capacitor module 2. After filling, fix the sealing bracket 27 on the insulating bracket 22. After encapsulation, place the assembled capacitor in a vacuum environment to eliminate air bubbles in the epoxy resin.

[0056] After packaging, the capacitor is transferred to an aging test device to undergo aging tests under simulated operating conditions. After the aging test, the capacitor is transferred to a final testing device to undergo final testing under simulated operating conditions. After the final test, the capacitor is manually inspected for FQC (Final Quality Control).

[0057] By incorporating an aluminum casing 1 with water channels and an integrated capacitor module 2, the film capacitor can utilize water circulation to increase the current density of the capacitor. At the same time, the integrated and compact design reduces the size of the capacitor, minimizes installation space, and increases the ease of installation for customers.

[0058] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A power brick module thin film capacitor, comprising an aluminum casing (1), characterized in that: A capacitor module (2) is disposed inside the cavity of the aluminum shell (1); The capacitor module (2) includes an epoxy resin board (21), which is fixedly connected to the inner wall of the aluminum shell (1). An insulating bracket (22) is fixedly connected to the upper surface of the epoxy resin board (21). A busbar one (23) is fixedly connected to the inner wall of the epoxy resin board (21). A busbar two (24) is fixedly connected to the upper surface of the busbar one (23). A core (25) is installed on the inner wall of the busbar two (24). A capacitor body (26) is fixedly connected to the upper surface of the epoxy resin board (21). A terminal block (210) is fixedly connected to the lower surface of the epoxy resin board (21). The capacitor module (2) also includes a sealing bracket (27), insulating paper one (28), terminal block (210), grounding busbar (211), connecting bolt (212), insulating paper two (213), insulating paper three (214), busbar four (215) and insulating paper four (216).

2. The power brick module thin-film capacitor according to claim 1, characterized in that: The surface of the aluminum shell (1) is fixedly connected to a connector one (11), the surface of the aluminum shell (1) is fixedly connected to a connector two (12), the inner wall of the aluminum shell (1) is provided with a water channel one (13), the inner wall of the aluminum shell (1) is provided with a water channel two (14), and the inner wall of the aluminum shell (1) is provided with a cooling cavity (15).

3. The power brick module thin-film capacitor according to claim 1, characterized in that: The sealing bracket (27) is fixedly connected to the upper surface of the insulating bracket (22), the insulating paper three (214) is pasted on the inner wall of the sealing bracket (27), the busbar three (29) is fixedly connected to the upper surface of the busbar two (24), the busbar three (29) is inserted into the inner wall of the sealing bracket (27), and the insulating paper one (28) is sleeved on the surface of the busbar three (29).

4. A power brick module thin-film capacitor according to claim 1, characterized in that: The inner wall of the epoxy resin board (21) is fixedly connected to a grounding bar (211), which is electrically connected to the capacitor body (26). A connecting bolt (212) is inserted into the inner wall of the grounding bar (211), and the connecting bolt (212) is threadedly connected to the inner wall of the aluminum shell (1).

5. A power brick module thin-film capacitor according to claim 1, characterized in that: The surface of the first busbar (23) is covered with insulating paper 2 (213), the lower surface of the first busbar (23) is covered with insulating paper 3 (214), the inner wall of the epoxy resin board (21) is fixedly connected with the fourth busbar (215), and the lower surface of the fourth busbar (215) is covered with insulating paper 4 (216).

6. A power brick module thin-film capacitor according to claim 2, characterized in that: The first connector (11) is internally connected to the first water channel (13), the first water channel (13) is internally connected to the cooling chamber (15), the second connector (12) is internally connected to the second water channel (14), and the second water channel (14) is internally connected to the cooling chamber (15).

7. A power brick module thin-film capacitor according to claim 1, characterized in that: The insulating support (22) is located on the inner wall of the aluminum shell (1). There are seven cores (25), which are arranged in a convex shape. The cores (25) are electrically connected to the capacitor body (26).

8. A power brick module thin-film capacitor according to claim 1, characterized in that: The side surfaces of busbar 1 (23) and busbar 4 (215) are provided with protrusions, the surface of terminal block (210) is provided with grooves that are adapted to the protrusions, and the insulating paper 3 (214) is in contact with the upper surface of busbar 4 (215).

9. A method for preparing a thin-film capacitor based on a power brick module as described in any one of claims 1-8, characterized in that, Includes the following steps: S1. During production, the feeding equipment transports the film used to produce the core (25) to the stacking area, so that the two films are stacked together. After stacking, the stacked film is transferred to the fully automatic winding device by the robotic arm and other equipment. After placement, the winding device winds the film. After winding, the robotic arm transfers the wound core (25) to the conveying mechanism. The conveying mechanism transfers the core (25) to the spraying room. When the core (25) reaches the spraying processing position, the spraying device vaporizes the solid metal at high temperature and converts it into fine particles. The particles are then sprayed onto the two end faces of the core (25) by high pressure gas to form two capacitor plates and ensure the uniformity of the two plates. S2. After the gold spraying process is completed, the conveying mechanism transports the core (25) to a nitrogen oven. The nitrogen oven bakes the core (25) at 110℃±5℃ / 24H. During the high-temperature baking process, the interlayer air of the core (25) is discharged to ensure that the film layers are fully isolated from the air and to prevent surface metal oxidation. After the heat treatment is completed, the core (25) is transferred to the sandblasting equipment. After the transfer is completed, the sandblasting equipment is operated, using alumina microspheres with a particle size of 80 mesh to sandblast the surface of the core (25) at low pressure to avoid damaging the metal layer and increase the surface roughness to improve the subsequent performance. Welding wettability; After sandblasting, the core (25) is transferred to the power-on device. The power-on device is connected to the core (25). After the connection is completed, the power-on device uses a stepped voltage increase method to break down the defect point of the core (25). The high-temperature arc generated at the moment of breakdown causes the metal plating around the defect to vaporize and evaporate, forming an insulating oxide zone, isolating the conductive channel, thereby repairing the defect point of the core (25); After completing the above steps, the seven cores (25) are welded together in a convex shape using an automatic welding device, and the core (25) is welded together with the second busbar (24); S3. After welding, fix busbar 1 (23) with insulating paper 2 (213) and insulating paper 3 (214) pasted on it to the epoxy resin board (21), and install busbar 4 (215) below busbar 1 (23). After installing busbar 4 (215), paste insulating paper 4 (216) on busbar 4 (215). After completing the above operations, install busbar 2 (24) with busbar 3 (29) fixed on it on busbar 1 (23), and fix the capacitor body (26) in the pre-reserved mounting groove of the epoxy resin. Use ribbon cable to connect the capacitor. The main body (26) is connected to the core (25). After the operation is completed, the insulating bracket (22) and the terminal block (210) are fixed to the epoxy resin board (21) in sequence. Then the assembled capacitor module (2) is installed into the cavity reserved in the aluminum shell (1). Then epoxy resin is poured into the installation cavity through the can sealing hole reserved in the aluminum shell (1) to encapsulate the capacitor module (2). After the filling is completed, the sealing bracket (27) is fixed on the insulating bracket (22). After the encapsulation is completed, the assembled capacitor is placed in a vacuum environment to eliminate air bubbles in the epoxy resin. S4. After packaging, the capacitor is transferred to the aging test equipment and aging test is performed on the capacitor under the designed simulated working conditions. After the aging test is completed, the capacitor is transferred to the final test equipment to conduct a final test on the capacitor under simulated operating conditions. After the final test is completed, the capacitors are manually inspected by the FQC (Frequency Quality Control) team.

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