Electronic device

Abstract

The application discloses an electronic device, comprising: a device body, the device body being provided with a first opening and a second opening, the device body being internally provided with a mounting cavity; the bracket is arranged in the mounting cavity; the mainboard assembly is stacked on one side of the support, an air duct is defined by the side, away from the mainboard assembly, of the support and the cavity wall of the mounting cavity, the air duct is connected between the first opening and the second opening, at least one of the equipment body and the support is provided with a silencing cavity, and the silencing cavity is communicated with the air duct; and the fan is arranged in the air duct.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] With the development of technology, electronic devices have become an important medium for human-computer interaction. They not only need to meet daily communication needs, but users also have increasingly higher demands for entertainment, gaming, and other experiential aspects. Current electronic devices are now payment tools, transportation guides, life guides, communication tools, entertainment tools, and more. To achieve these functions, various sensors and chips are densely packed inside electronic devices. Sensors and chips generate heat during operation, and the slow heat dissipation within the enclosed space of electronic devices causes them to overheat, potentially damaging internal electronic components.

[0003] In related technologies, an air duct is installed inside the electronic device, with an air inlet and an air outlet on the side of the device. The air duct connects the air inlet and outlet, and a fan is installed inside the air duct to dissipate heat from the electronic device. The fan generates a strong airflow, and as the airflow passes through the fan blades and the walls of the air duct, it generates flow noise due to sudden airflow changes and vortex shedding. This increases the operating noise of the electronic device and affects its performance. Summary of the Invention

[0004] This application aims to provide an electronic device that solves the problem in the related art where the operation noise of the electronic device is relatively high when air ducts and fans are set inside the electronic device to dissipate heat, which affects the performance of the electronic device.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application provides an electronic device, comprising: a device body having a first opening and a second opening, and a mounting cavity within the device body; a bracket disposed within the mounting cavity; a motherboard assembly stacked on one side of the bracket, the side of the bracket away from the motherboard assembly and the cavity wall of the mounting cavity enclosing an air duct, the air duct connecting between the first opening and the second opening, at least one of the device body and the bracket having a silencing cavity connected to the air duct; and a fan disposed within the air duct.

[0007] In embodiments of this application, the electronic device includes a device body, a bracket, a motherboard assembly, and a fan.

[0008] The bracket, motherboard assembly, and fan are all housed within the device body. The device body serves as the mounting carrier for the bracket, motherboard assembly, and fan, and has the function of installing and fixing the bracket, motherboard assembly, and fan to ensure the fit dimensions of the bracket, motherboard assembly, and fan.

[0009] The motherboard assembly is stacked on one side of the bracket. The side of the bracket facing away from the motherboard assembly and the cavity wall of the mounting cavity enclose an air duct, within which the fan is located. The device body has a first opening and a second opening, and the air duct connects to both openings; that is, the air duct communicates with both the first and second openings. When the fan operates, air from the external environment flows into the air duct through one of the first and second openings, and then exits the device body through the other of the first and second openings.

[0010] The motherboard assembly is stacked on one side of the bracket, and the side of the bracket facing away from the motherboard assembly forms part of the air duct wall. This allows airflow to carry away heat from the motherboard assembly, reducing its temperature rise and improving the heat dissipation efficiency of the electronic device. Furthermore, the airflow also accelerates the heat exchange between the hot air within the duct and the ambient air, with some heat dissipated through the device itself to the outside environment. This further reduces the temperature of the electronic device, preventing overheating and providing structural support for ensuring the performance and lifespan of the electronic components.

[0011] At least one of the equipment body and the support frame is provided with a sound-absorbing cavity. That is, the equipment body is provided with a sound-absorbing cavity, or the support frame is provided with a sound-absorbing cavity, or both the equipment body and the support frame are provided with sound-absorbing cavities. The sound-absorbing cavity is connected to the air duct. By setting up a sound-absorbing cavity and connecting it to the air duct, sound waves are transmitted to the sound-absorbing cavity, thereby achieving the purpose of noise reduction. In other words, while ensuring the heat dissipation performance of electronic equipment, reducing the operating noise of electronic equipment is beneficial to improving the performance and market competitiveness of electronic equipment.

[0012] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0013] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0014] Figure 1 This is a schematic diagram of the first part of the structure of an electronic device according to an embodiment of this application;

[0015] Figure 2 This is a schematic diagram of the second part of the structure of an electronic device according to an embodiment of this application;

[0016] Figure 3 This is a schematic diagram of the third part of an electronic device according to an embodiment of this application;

[0017] Figure 4This is a graph showing how the sound pressure level of the electronic device in this application and related technologies changes with frequency.

[0018] Figure label:

[0019] Figures 1 to 3 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0020] 10 Electronic device, 100 Device body, 110 First opening, 120 Second opening, 130 Mounting cavity, 140 Frame, 150 Battery cover, 152 Third opening, 160 Screen assembly, 170 Decorative assembly, 200 Bracket, 210 Clearance opening, 300 Motherboard assembly, 400 Air duct, 410 First side of air duct, 420 Second side of air duct, 500 Noise silencing cavity, 500a First noise silencing cavity, 500b Second noise silencing cavity, 600 Fan, 700 Heat sink, 800 Thermal conductive connection layer, 910 Front camera, 920 Rear camera area, 930 Waterproof component. Detailed Implementation

[0021] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0023] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] The following is combined Figures 1 to 4 An electronic device 10 according to an embodiment of this application is described.

[0026] like Figure 1 , Figure 2 and Figure 3 As shown, an electronic device 10 according to some embodiments of this application includes: a device body 100, the device body 100 having a first opening 110 and a second opening 120, and a mounting cavity 130 inside the device body 100; a bracket 200 disposed inside the mounting cavity 130; a motherboard assembly 300 stacked on one side of the bracket 200, the side of the bracket 200 away from the motherboard assembly 300 and the cavity wall of the mounting cavity 130 enclosing an air duct 400, the air duct 400 connecting between the first opening 110 and the second opening 120, at least one of the device body 100 and the bracket 200 having a silencing cavity 500 connected to the air duct 400; and a fan 600 disposed inside the air duct 400.

[0027] The electronic device 10 according to an embodiment of this application includes a device body 100, a bracket 200, a motherboard assembly 300, and a fan 600.

[0028] The bracket 200, motherboard assembly 300 and fan 600 are all located inside the device body 100. The device body 100 serves as the mounting carrier for the bracket 200, motherboard assembly 300 and fan 600, and has the function of installing and fixing the bracket 200, motherboard assembly 300 and fan 600 to ensure the matching dimensions of the bracket 200, motherboard assembly 300 and fan 600.

[0029] The motherboard assembly 300 is stacked on one side of the bracket 200. The side of the bracket 200 opposite to the motherboard assembly 300 and the cavity wall of the mounting cavity 130 enclose an air duct 400, and the fan 600 is disposed within the air duct 400. The device body 100 has a first opening 110 and a second opening 120. The air duct 400 is connected to the first opening 110 and the second opening 120, that is, the air duct 400 is connected to the first opening 110 and also connected to the second opening 120. When the fan 600 is working, air from the outside environment flows into the air duct 400 through one of the first opening 110 and the second opening 120, and then flows out of the device body 100 through the other of the first opening 110 and the second opening 120.

[0030] The motherboard assembly 300 is stacked on one side of the bracket 200. The side of the bracket 200 facing away from the motherboard assembly 300 forms part of the air duct wall of the air duct 400. Thus, when airflow passes through the air duct 400, it can carry away heat from the motherboard assembly 300, reducing the temperature rise at the motherboard assembly 300 and improving the heat dissipation efficiency of the electronic device 10. It is also understood that when airflow passes through the air duct 400, it can accelerate the heat exchange between the hot air within the air duct 400 and the air in the external environment. Some of the heat can also be dissipated to the external environment through the device body 100, further reducing the temperature of the electronic device 10 and preventing it from overheating. This provides structural support for ensuring the performance and lifespan of the electronic components within the electronic device 10.

[0031] At least one of the device body 100 and the bracket 200 is provided with a silencing cavity 500. That is, the device body 100 is provided with a silencing cavity 500, or the bracket 200 is provided with a silencing cavity 500, or both the device body 100 and the bracket 200 are provided with silencing cavities 500. The silencing cavity 500 is connected to the air duct 400. By providing the silencing cavity 500 and connecting it to the air duct 400, sound waves are transmitted to the silencing cavity 500, thereby achieving the purpose of noise reduction. In other words, while ensuring the heat dissipation performance of the electronic device 10, the operating noise of the electronic device 10 is reduced, which is beneficial to improving the performance and market competitiveness of the electronic device 10.

[0032] For example, the electronic device 10 can be a mobile phone, tablet computer, laptop computer, handheld computer, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM, or self-service machine, etc. The embodiments of this application do not specifically limit it.

[0033] In addition, at least one of the device body 100 and the bracket 200 is provided with a silencing cavity 500. That is, by making reasonable use of the existing structure of at least one of the device body 100 and the bracket 200, the effectiveness of forming the silencing cavity 500 can be guaranteed, while avoiding the investment of additional components to form the silencing cavity 500, thereby reducing the modification cost of the electronic device 10.

[0034] In some embodiments, the silencing cavity 500 is recessed in a direction away from the air duct 400 along a direction perpendicular to the bracket 200 to the motherboard assembly 300.

[0035] In this embodiment, the structure of the silencing cavity 500 is further defined such that, along the direction perpendicular to the support 200 to the motherboard assembly 300, the silencing cavity 500 is recessed in the direction away from the air duct 400. That is, the extension direction of the silencing cavity 500 is defined. This arrangement makes reasonable use of the space of the electronic device 10 in the direction perpendicular to the support 200 to the motherboard assembly 300, which can not only meet the requirements of the position setting and external size of the silencing cavity 500, but also reduce the space occupation of the electronic device 10 in the direction from the motherboard assembly 300 to the support 200.

[0036] In some embodiments, there are multiple silencing cavities 500, which are arranged at circumferential intervals along the air duct 400.

[0037] In this embodiment, the number and arrangement of the silencing cavities 500 are further defined.

[0038] The number of silencing cavities 500 is multiple, and the multiple silencing cavities 500 are arranged at intervals along the circumference of the air duct 400, forming an array structure. This arrangement increases the communication area between the silencing cavities 500 and the air duct 400, and increases the number of silencing cavities 500, so that sound waves can be transmitted to the silencing cavities 500 from multiple directions and multiple positions, which can ensure the silencing effect and effectively reduce the operating noise of the electronic equipment 10.

[0039] In some embodiments, such as Figure 2 As shown, the silencing cavity 500 includes at least one of a first silencing cavity 500a and a second silencing cavity 500b, wherein the first silencing cavity 500a is a Helmholtz silencing cavity and the second silencing cavity 500b is a quarter-wavelength silencing cavity.

[0040] In this embodiment, the silencing cavity 500 includes at least one of a first silencing cavity 500a and a second silencing cavity 500b. That is, the silencing cavity 500 includes a first silencing cavity 500a, or the silencing cavity 500 includes a second silencing cavity 500b, or the silencing cavity 500 includes both a first silencing cavity 500a and a second silencing cavity 500b.

[0041] The first silencing cavity 500a and the second silencing cavity 500b are of different types. The first silencing cavity 500a is a Helmholtz silencing cavity, while the second silencing cavity 500b is a quarter-wavelength silencing cavity.

[0042] The size of the air duct 400 is limited by the external dimensions of the electronic device 10. This limitation can lead to cavity resonance and the generation of harsh mid-to-high frequency noise. Therefore, this application provides various types of anechoic cavities 500, including at least one of a Helmholtz anechoic cavity and a quarter-wavelength anechoic cavity. The Helmholtz anechoic cavity, the quarter-wavelength anechoic cavity, and the air duct 400 work together to form an acoustic resonance unit array, thereby canceling and reducing mid-to-high frequency energy and noise. This reduces the harsh mid-to-high frequency noise caused by the extreme size of the air duct 400, ensuring the performance of the electronic device 10 and enhancing its market competitiveness.

[0043] Understandably, a Helmholtz silencing cavity comprises a connected neck and a resonant cavity. The air inside the resonant cavity acts as a "spring." The neck connects the resonant cavity and the air duct 400. The cross-sectional area of ​​the neck is smaller than that of the resonant cavity, making the neck a narrow channel relative to the resonant cavity. The air column in the neck acts as a "mass." When the external noise frequency matches the system's natural resonant frequency, the air column in the neck of the Helmholtz silencing cavity vibrates cyclically under sound pressure, interacting with the air spring within the resonant cavity to create resonance. At this point, acoustic energy is converted into mechanical vibration energy and dissipated through friction and heat conduction, thereby reducing noise.

[0044] Understandably, the first end of the quarter-wavelength anechoic cavity is closed, while the second end is connected to a ventilation duct 400. When a sound wave enters the quarter-wavelength anechoic cavity from the second end, it is reflected at the first end. The reflected wave is out of phase with the incident wave, thus creating destructive interference and canceling out noise at a specific frequency.

[0045] In some other embodiments, the anechoic cavity 500 includes a third anechoic cavity, which, through a special design of its internal pipes or cavities (e.g., pipes of different lengths, such as a multi-chamber structure), causes interference of sound waves during propagation. When two or more sound waves are out of phase, their amplitudes cancel each other out, thereby reducing the noise intensity. The number of third anechoic cavities is at least one.

[0046] In some other embodiments, the anechoic cavity 500 includes a fourth anechoic cavity, which alters the propagation path of the sound wave through structures such as an expansion chamber, a partition, and a baffle, causing it to reflect multiple times and attenuate its energy. The number of fourth anechoic cavities is at least one.

[0047] In some other embodiments, the anechoic cavity 500 includes a fifth anechoic cavity, which is provided with porous sound-absorbing material. The porous sound-absorbing material converts sound energy into heat energy to achieve noise reduction. There is at least one fifth anechoic cavity.

[0048] In some embodiments, such as Figure 2 As shown, when the silencing cavity 500 includes a first silencing cavity 500a and a second silencing cavity 500b, and the number of first silencing cavities 500a is multiple, a portion of the multiple first silencing cavities 500a are arranged on the first side 410 of the air duct, and another portion of the multiple first silencing cavities 500a are arranged on the second side 420 of the air duct. The first side 410 and the second side 420 of the air duct are opposite sides of the air duct 400 in the first direction; the second silencing cavity 500b is located on the second side 420 of the air duct.

[0049] In this embodiment, when the silencing cavity 500 includes a first silencing cavity 500a and a second silencing cavity 500b, and the number of first silencing cavities 500a is multiple, the arrangement positions of the multiple first silencing cavities 500a and second silencing cavities 500b are defined.

[0050] Along the first direction, the air duct 400 has a first side and a second side, with the first side 410 and the second side 420 being opposite sides of the air duct 400. For example, if the air duct 400 is sectioned along a direction perpendicular to the support 200 to the main board assembly 300, the outline of the air duct wall of the first side 410 and the outline of the air duct wall of the second side 420 are opposite to each other and spaced apart.

[0051] A portion of the multiple first anechoic cavities 500a are arranged on the first side 410 of the air duct, and another portion of the multiple first anechoic cavities 500a are arranged on the second side 420 of the air duct. The second anechoic cavity 500b is located on the second side 420 of the air duct. That is, the multiple first anechoic cavities 500a and the second anechoic cavity 500b are arranged in an array to form an acoustic resonance unit array. The multiple first anechoic cavities 500a and the second anechoic cavity 500b cooperate to achieve the cancellation and noise reduction of mid-to-high frequency energy, reducing the harsh mid-to-high frequency noise caused by the extreme size of the air duct 400.

[0052] For example, the number of second silencing cavities 500b is at least one.

[0053] In some other embodiments, when there are multiple first silencing cavities 500a, along the first direction, a portion of the multiple first silencing cavities 500a are arranged on the first side 410 of the air duct, and another portion of the multiple first silencing cavities 500a are arranged on the second side 420 of the air duct; at least one second silencing cavity 500b is located on the first side 410 of the air duct.

[0054] In some embodiments, such as Figure 1 and Figure 3 As shown, when the silencing cavity 500 includes a second silencing cavity 500b, the second silencing cavity 500b is arranged in a curved manner.

[0055] In this embodiment, the structure of the second silencing cavity 500b is further defined, such that the second silencing cavity 500b is arranged in a curved manner. In other words, the second silencing cavity 500b is a curved structure. This arrangement can adaptively reduce the space occupancy rate of the second silencing cavity 500b in the direction from the first side 410 to the second side 420 of the air duct while ensuring the length of the second silencing cavity 500b. For example, it can be adapted to the internal space of the mounting cavity 130 to effectively utilize the existing space of the mounting cavity 130 to arrange the second silencing cavity 500b.

[0056] For example, such as Figure 2 As shown, the second silencing cavity 500b extends circumferentially along the adjacent first silencing cavity 500a.

[0057] In some embodiments, such as Figure 2 As shown, at least a portion of the silencing cavity 500 is positioned opposite the fan 600.

[0058] In this embodiment, the mating structure of the silencing cavity 500 and the fan 600 is further defined, with at least a portion of the silencing cavity 500 disposed opposite to the fan 600. Since the fan 600 generates significant noise during operation, arranging at least a portion of the silencing cavity 500 adjacent to the fan 600 ensures effective noise reduction and can effectively lower the operating noise of the electronic device 10.

[0059] In some embodiments, such as Figure 1 and Figure 3 As shown, the bracket 200 is provided with a clearance opening 210, and the electronic device 10 also includes a heat sink 700. The heat sink 700 is located at the clearance opening 210 and is connected to the motherboard assembly 300. The heat sink 700 forms part of the air duct wall of the air duct 400.

[0060] In this embodiment, the structure of the electronic device 10 is further defined.

[0061] The bracket 200 has a clearance opening 210, and the electronic device 10 also includes a heat sink 700, which is located at the clearance opening 210, and the clearance opening 210 serves to allow the heat sink 700 to pass. The heat sink 700 covers the clearance opening 210 of the bracket 200, and the heat sink 700 forms part of the air duct wall of the air duct 400. The heat sink 700 is connected to the motherboard assembly 300. The structural design of the heat sink 700 helps to improve the heat transfer speed of the motherboard assembly 300, so that the heat at the motherboard assembly 300 can be quickly conducted to the air duct 400, which helps to improve the heat dissipation efficiency.

[0062] For example, the heat sink 700 includes a graphite heat sink.

[0063] For example, the heat sink 700 includes a metal heat sink.

[0064] In some embodiments, such as Figure 1 and Figure 3 As shown, the electronic device 10 also includes a thermally conductive connection layer 800, a heat sink 700 and a motherboard assembly 300 connected through the thermally conductive connection layer 800.

[0065] In this embodiment, the structure of the electronic device 10 is further defined. The electronic device 10 also includes a thermally conductive connection layer 800, through which the heat sink 700 and the motherboard assembly 300 are connected. Specifically, the thermally conductive connection layer 800 is connected between the heat sink 700 and the motherboard assembly 300. The thermally conductive connection layer 800 not only connects the heat sink 700 and the motherboard assembly 300, but also conducts heat. The thermally conductive connection layer 800 can fill the tiny gaps between the heat sink 700 and the motherboard assembly 300 to reduce the temperature at the motherboard assembly 300 through efficient heat conduction, providing structural support to ensure the stability and reliability of the electronic device 10.

[0066] For example, the thermally conductive bonding layer 800 includes a thermally conductive gel. The thermally conductive gel has excellent flowability and wettability, enabling it to penetrate and effectively fill the gap between the heat sink 700 and the motherboard assembly 300, significantly reducing thermal resistance. Simultaneously, the thermally conductive gel can quickly transfer heat from the heat source to the air duct 400, which helps improve the heat dissipation efficiency of the electronic device 10.

[0067] For example, the thermally conductive connection layer 800 includes a thermally conductive silicone grease layer. The thermally conductive silicone grease layer has high fluidity and can effectively fill the gap between the heat sink 700 and the motherboard assembly 300 to form a low-resistance interface.

[0068] In some embodiments, such as Figure 1 and Figure 3 As shown, the device body 100 includes: a frame 140, with a first opening 110 on the side of the frame 140, and a bracket 200 disposed on the frame 140; a battery cover 150, with a third opening 152; a screen assembly 160, with the frame 140 connected between the battery cover 150 and the screen assembly 160, the frame 140, the battery cover 150 and the screen assembly 160 enclosing a mounting cavity 130; and a decorative assembly 170, disposed on the side of the battery cover 150 away from the frame 140, the decorative assembly 170 covering the third opening 152, and the portion of the battery cover 150 located around the third opening 152 enclosing a second opening 120 with the outer edge of the decorative assembly 170.

[0069] In this embodiment, the structure of the device body 100 is further defined. The device body 100 also includes a frame 140, a battery cover 150, a screen assembly 160, and a decorative assembly 170.

[0070] The frame 140 is connected between the battery cover 150 and the screen assembly 160, and the frame 140, the battery cover 150 and the screen assembly 160 enclose the mounting cavity 130.

[0071] Decorative component 170 is located on the side of battery cover 150 facing away from frame 140. Decorative component 170 covers third opening 152. The portion of battery cover 150 located around third opening 152 and the outer edge of decorative component 170 enclose second opening 120. That is, decorative component 170, battery cover 150, bracket 200 and frame 140 enclose air duct 400.

[0072] The frame 140 has a first opening 110, and the battery cover 150 and decorative component 170 enclose a second opening 120. When the second opening 120 is an air inlet and the first opening 110 is an air outlet, air from the outside environment flows through the second opening 120 between the battery cover 150 and the decorative component 170 to the third opening 152, and then flows out of the electronic device 10 through the first opening 110 on the side of the frame 140. When the first opening 110 is an air inlet and the second opening 120 is an air outlet, air from the outside environment flows through the first opening 110 on the side of the frame 140 to the third opening 152, and then flows out of the electronic device 10 through the second opening 120 between the battery cover 150 and the decorative component 170.

[0073] Therefore, it can be seen that the battery cover 150 and the decorative component 170 enclose one of the first opening 110 and the second opening 120. Compared with setting the first and second openings on the side of the frame, this arrangement can reduce the opening area of ​​the electronic device 10's exterior surface. While ensuring effective heat dissipation, the hidden structure that forms one of the first opening 110 and the second opening 120 is conducive to improving the aesthetics of the electronic device 10 and enhancing its market competitiveness.

[0074] Understandably, the decorative component 170 covers the third opening 152, and the portion of the battery cover 150 located around the third opening 152 and the outer edge of the decorative component 170 enclose the second opening 120. The outer edge of the decorative component 170 is positioned opposite to the portion of the battery cover 150 located around the third opening 152, that is, the outer edge of the decorative component 170 is located around the third opening 152. The decorative component 170 can completely cover the third opening 152, so the third opening 152 is not visible from the exterior of the electronic device 10, and the third opening 152 does not expose the electronic device 10. In this way, the aesthetic appearance of the electronic device 10 can be guaranteed.

[0075] For example, at least one of the frame 140 and the bracket 200 is provided with a sound-absorbing cavity 500.

[0076] In some embodiments, such as Figure 3 As shown, the electronic device 10 also includes a waterproof component 930, which is disposed at at least one of the second opening 120 and the third opening 152.

[0077] In this embodiment, the structure of the electronic device 10 is further defined. The electronic device 10 also includes a waterproof component 930, which is disposed at at least one of the second opening 120 and the third opening 152. That is, the waterproof component 930 is disposed at the second opening 120, or the waterproof component 930 is disposed at the third opening 152, or a portion of the waterproof component 930 is disposed at the second opening 120 and another portion of the waterproof component 930 is disposed at the third opening 152, or there are multiple waterproof components 930, with a portion of the multiple waterproof components 930 disposed at the second opening 120 and another portion of the multiple waterproof components 930 disposed at the third opening 152.

[0078] The waterproof component 930 has the function of preventing moisture, dirt and other substances in the external environment from entering the electronic device 10 through at least one of the second opening 120 and the third opening 152, thereby ensuring the safety and reliability of the electronic device 10.

[0079] Understandably, the waterproof component 930 is waterproof, but it does not obstruct airflow.

[0080] For example, the waterproof component 930 includes a waterproof and breathable membrane.

[0081] For example, the waterproof component 930 includes a pressure-balancing membrane.

[0082] In some embodiments, such as Figure 1 and Figure 3 As shown, fan 600 is closer to the first opening 110 than the second opening 120.

[0083] In this embodiment, the placement of the fan 600 is further defined, with the fan 600 being closer to the first opening 110 than the second opening 120. That is, the distance from the fan 600 to the first opening 110 is less than the distance from the fan 600 to the second opening 120. This arrangement makes efficient use of the internal space of the electronic device 10 to arrange the fan 600, ensuring the effectiveness and feasibility of the fan 600 in drawing air.

[0084] For example, this application reasonably sets up the structure of the electronic device 10, placing components such as a fan 600 and a heat sink 700 inside the electronic device 10, and using a bracket 200, decorative component 170, battery cover 150 and frame 140 to enclose an air duct 400, which connects the first opening 110 and the second opening 120 of the device body 100. When the fan 600 rotates, the fan blades drive the air to form an airflow, driving the air in the external environment to flow from one of the first opening 110 and the second opening 120 to the other. The airflow passing through the air duct 400 can quickly remove the heat from the heat sink 700. Specifically, the heat generated by the motherboard component 300 during operation is quickly transferred to the air duct 400 through the heat sink 700, and convection cooling is achieved through the airflow within the air duct 400.

[0085] For example, this application provides a plurality of silencing cavities 500 adjacent to the air duct 400. The silencing cavities 500 are connected to the air duct 400, and each silencing cavity 500 includes at least one Helmholtz silencing cavity and / or at least one quarter-wavelength silencing cavity. The plurality of silencing cavities 500 and the air duct 400 cooperate to form an acoustic resonant unit array for ventilation and noise reduction, thereby achieving the cancellation and noise reduction of mid-to-high frequency energy, and absorbing the harsh noise in the mid-to-high frequency band generated by the fan 600 and the air duct 400 over a wide frequency band.

[0086] For example, the Helmholtz anechoic cavity is an acoustic resonant unit. The size of the acoustic resonant unit is set by the resonant frequency fs generated by the air duct 400. The size of the quarter-wavelength anechoic cavity is determined according to 1 / 4 of the wavelength of the desired frequency. The Helmholtz anechoic cavity, the quarter-wavelength anechoic cavity, and the air duct 400 together form the ventilation noise reduction metamaterial of this application. The acoustic resonant unit array and the air duct 400 form an acoustic metamaterial that can generate a negative bulk modulus in a specific frequency band to achieve sound absorption in a certain frequency band, thereby counteracting the mid-to-high frequency resonance peaks formed by the air duct 400 and producing the effect of canceling or reducing local frequency noise.

[0087] For example, the bracket 200, heat sink 700, decorative assembly 170, battery cover 150, and frame 140 enclose an air duct 400. A fan 600 is disposed within the air duct 400. A first opening 110 is provided on the side of the frame 140, and a second opening 120 is enclosed by the decorative assembly 170 and battery cover 150. The air duct 400 connects the first opening 110 and the second opening 120. The heat sink 700 quickly transfers heat from inside the device to the air duct 400, and the fan 600 drives airflow to form high-intensity convection cooling, thereby helping the electronic device 10 to dissipate heat quickly. Specifically, by setting multiple Helmholtz silencing cavities and at least one quarter-wavelength silencing cavity near the fan 600, an acoustic cavity array is formed by the multiple Helmholtz silencing cavities and at least one quarter-wavelength silencing cavity, and combined with the air duct 400 to form a ventilation noise reduction metamaterial with a negative modulus in a specific frequency band, in order to counteract the mid-to-high frequency resonance characteristics of the air duct 400 itself, and reduce the mid-to-high frequency harsh noise caused by the extreme size of the air duct 400.

[0088] For example, the electronic device 10 includes a battery cover 150, a screen assembly 160, a motherboard assembly 300 and various components and chips thereon, a bracket 200, a rear camera, a decorative assembly 170, a heat sink 700, and a thermally conductive connection layer 800, etc. An air inlet / outlet is enclosed between the battery cover 150 and the decorative assembly 170, and an air outlet is provided on the side of the frame 140. An air duct 400 is enclosed between the bracket 200, the heat sink 700, the battery cover 150, the decorative assembly 170, and the frame 140. A fan 600 is disposed within the air duct 400. When the fan 600 rotates, its blades drive air to form an airflow, which flows sequentially through the air inlet, the air duct 400, the fan 600, and the air outlet.

[0089] For example, the battery cover 150 is used to seal the overall structure. In this application, the battery cover 150 cooperates with the decorative component 170 to enhance the structural strength of the air duct wall.

[0090] For example, the screen assembly 160 has the functions of display and touch screen, and the screen assembly 160 also serves to seal the overall structure of the device.

[0091] For example, the motherboard assembly 300 is the control center, and the motherboard assembly 300 includes the motherboard and various components and chips arranged on the motherboard. The motherboard assembly 300 is one of the main heat sources.

[0092] For example, the bracket 200 is used to support and fix the motherboard assembly 300. The bracket 200 not only protects the motherboard assembly 300, but also strengthens the structure. It can be used to form a sound cavity, etc., which will not be listed here.

[0093] For example, multiple rear camera components are disposed below the decorative component 170, and the decorative component 170 is the outermost structure of the camera module. Among them, Figure 2 The image shows the front-facing camera 910 and the rear-facing camera area 920.

[0094] For example, the heat sink 700 can improve the heat dissipation speed, the heat sink 700 has high thermal conductivity, and the heat transfer speed of the heat sink 700 is fast.

[0095] For example, the thermally conductive connection layer 800 includes a thermal gel, which is a soft material. The thermally conductive connection layer 800 is used to attach between the heat sink 700 and the heat-generating chip of the motherboard assembly 300, and can quickly transfer heat.

[0096] For example, the battery cover 150 and the decorative component 170 enclose the second opening 120, and the decorative component 170 forms a hidden second opening 120, which is not visible from the front of the electronic device 10, thus ensuring the aesthetic appearance of the electronic device 10.

[0097] For example, the side wall of the frame 140 is provided with a first opening 110, one of the first opening 110 and the second opening 120 is an air inlet, and the other of the first opening 110 and the second opening 120 is an air outlet.

[0098] For example, such as Figure 1 and Figure 3 As shown, under the rotation of fan 600, the air entering through the inlet passes through air duct 400 and then exits through the outlet, forming a circulating airflow. However, due to the limited size of air duct 400, it generates a resonant frequency band, which amplifies noise in the mid-to-high frequency range. Therefore, this application rationally sets the structure of electronic device 10, utilizing an array structure composed of air duct 400, multiple Helmholtz anechoic cavities, and at least one quarter-wavelength anechoic cavity to form a ventilation-noise-reducing acoustic metamaterial. Each acoustic cavity structure constitutes a unit cell, and the resonant frequency of a single unit cell can be obtained from the formula: Where Ma is the acoustic mass, corresponding to the mass of the oscillator that drives the air in the pipe to vibrate back and forth, according to acoustic theory. Ca corresponds to the acoustic volume within the acoustic cavity, which is related to its size, according to acoustic theory. Where ρ is air density and c is the speed of sound in air. From these formulas, it can be seen that the key parameters for the resonant frequency of a single unit cell are its length L, channel area s, and cavity volume V. By adjusting these dimensions, the acoustic characteristics of each unit cell can be precisely defined. Adjusting the channel dimensions corresponding to each unit cell according to the formulas creates resonance at multiple adjacent frequencies. The coupling of each unit cell forms a broadband anomalous absorption characteristic, effectively suppressing the mid-to-high frequency fan noise energy.

[0099] like Figure 4 As shown, the prominent mid-to-high frequency wind noise centers of the air duct 400 are f1 and f2, respectively. Taking f1 as an example, this frequency is between 1kHz and 3kHz, which is a sensitive area for the human ear, significantly increasing the user's perception of the wind noise and leading to a very poor experience. This application rationally sets up a cooperative structure of the air duct 400, the Helmholtz anechoic cavity, and the quarter-wavelength anechoic cavity to form an array structure, thereby creating a ventilation and noise reduction acoustic metamaterial that can effectively reduce wind noise. In related technologies, the electronic device 10 has an air duct 400, but does not have a Helmholtz anechoic cavity and a quarter-wavelength anechoic cavity connected to the air duct 400. Figure 4 As shown, compared with the electronic device 10 in the related technology, the present application has a significant improvement effect on mid-to-high frequency wind noise, and the sound pressure level in some frequency bands is reduced by 20dB to 30dB, which effectively improves the user experience.

[0100] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0101] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: The device body has a first opening and a second opening, and an installation cavity is provided inside the device body; The bracket is disposed within the mounting cavity; A motherboard assembly is stacked on one side of the bracket. The side of the bracket away from the motherboard assembly and the cavity wall of the mounting cavity enclose an air duct. The air duct is connected between the first opening and the second opening. At least one of the device body and the bracket is provided with a silencing cavity, which is connected to the air duct. A fan is located inside the air duct.

2. The electronic device according to claim 1, characterized in that, Along a direction perpendicular to the bracket to the motherboard assembly, the silencing cavity is recessed in a direction away from the air duct.

3. The electronic device according to claim 1 or 2, characterized in that, The silencing cavity includes at least one of a first silencing cavity and a second silencing cavity, wherein the first silencing cavity is a Helmholtz silencing cavity and the second silencing cavity is a quarter-wavelength silencing cavity.

4. The electronic device according to claim 3, characterized in that, When the silencing cavity includes the first silencing cavity and the second silencing cavity, and the number of the first silencing cavities is multiple, a portion of the multiple first silencing cavities are arranged on the first side of the air duct, and another portion of the multiple first silencing cavities are arranged on the second side of the air duct. The first side and the second side of the air duct are opposite sides of the air duct in the first direction. The second silencing cavity is located on the second side of the air duct.

5. The electronic device according to claim 3, characterized in that, In the case where the silencing cavity includes the second silencing cavity, the second silencing cavity is arranged in a curved manner.

6. The electronic device according to claim 1 or 2, characterized in that, At least a portion of the silencing cavity is positioned opposite the fan.

7. The electronic device according to claim 1 or 2, characterized in that, The bracket is provided with a clearance opening, and the electronic device also includes a heat sink, which is located at the clearance opening and connected to the motherboard assembly. The heat sink forms part of the air duct wall.

8. The electronic device according to claim 1 or 2, characterized in that, The device body includes: A frame, wherein the first opening is provided on the side of the frame, and the bracket is disposed on the frame; Battery cover, wherein the battery cover has a third opening; A screen assembly, wherein the frame is connected between the battery cover and the screen assembly, and the frame, the battery cover and the screen assembly enclose the mounting cavity; A decorative component is disposed on the side of the battery cover away from the frame. The decorative component covers the third opening, and the portion of the battery cover located around the third opening and the outer edge of the decorative component enclose the second opening.

9. The electronic device according to claim 8, characterized in that, Also includes: A waterproof component is provided at at least one of the second opening and the third opening.

10. The electronic device according to claim 1 or 2, characterized in that, The fan is closer to the first opening than the second opening.

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