Printed circuit boards for embedded ceramic components and their manufacturing methods

Abstract

This application relates to the field of printed circuit board technology, and discloses a printed circuit board with embedded ceramic components and its manufacturing method. The manufacturing method of the printed circuit board with embedded ceramic components includes: providing a laminating plate, the laminating plate including a first sub-board, a first dielectric layer, an embedded layer, a second dielectric layer, and a second sub-board arranged sequentially and in layers, the embedded layer including an embedded substrate and a ceramic component, the embedded substrate having an embedded groove, the embedded substrate including a protrusion on the inner wall of the embedded groove, the ceramic component being disposed in the embedded groove, the edge of the ceramic component having a recess, the gap of the protrusion being accommodated in the recess; and machining a first through hole on the laminating plate, the first through hole penetrating the first sub-board, the first dielectric layer, the protrusion, the second dielectric layer, and the second sub-board. The printed circuit board with embedded ceramic components and its manufacturing method provided in this application are used to improve the problem in related technologies where pre-drilled holes located at the edge of ceramic blocks are prone to incomplete filling and voids in the glue filling, affecting the quality of subsequent through holes.

Description

Technical Field

[0001] This application relates to the field of printed circuit board technology, and in particular to a printed circuit board with embedded ceramic components and a method for manufacturing the same. Background Technology

[0002] Embedded printed circuit boards (PCBs) are a special type of printed circuit board product in which components, conductors or other functional structures are pre-embedded or embedded inside an embedded substrate during the manufacturing process, rather than using traditional surface mount or through-hole mounting processes.

[0003] In recent years, embedding high thermal conductivity and low CTE (Coefficient of thermal expansion) materials such as metal blocks and ceramic blocks into printed circuit boards (PCBs) to achieve better thermal management and improve product reliability has become a popular technology. Some PCBs with embedded ceramic blocks are designed with through-holes penetrating the ceramic blocks to effectively utilize wiring space. However, ceramic materials are hard, and conventional mechanical drilling methods cannot directly drill holes in laminated boards with embedded ceramic blocks, easily causing the ceramic blocks to crack.

[0004] In related technologies, pre-drilled holes are typically made on the ceramic block first, and then through holes are drilled at the pre-drilled hole locations after lamination. During the lamination process, the pre-drilled holes on the ceramic block are filled with molten resin formed from the prepreg. However, during production, it has been found that pre-drilled holes with larger diameters (e.g., diameter ≥ 1mm) located at the edge of the ceramic block are prone to incomplete resin filling or voids, affecting the quality of subsequent through holes. Summary of the Invention

[0005] This application provides a printed circuit board with embedded ceramic components and a method for manufacturing the same, which improves the problem in related technologies where pre-drilled holes located at the edge of ceramic blocks are prone to incomplete filling and voids in the adhesive, affecting the quality of subsequent through-hole drilling.

[0006] In a first aspect, embodiments of this application provide a method for manufacturing a printed circuit board with embedded ceramic components, comprising:

[0007] A laminating plate is provided, the laminating plate comprising a first sub-plate, a first dielectric layer, an embedded layer, a second dielectric layer, and a second sub-plate arranged sequentially and in layers, the embedded layer comprising an embedded substrate and a ceramic component, the embedded substrate being provided with an embedded groove, the embedded substrate including a protrusion disposed on the inner wall of the embedded groove, the ceramic component being disposed in the embedded groove, the edge of the ceramic component being provided with a recess, and the protrusion being gap-accommodated within the recess;

[0008] A first through hole is machined on the pressing plate, and the first through hole penetrates the first sub-plate, the first dielectric layer, the protrusion, the second dielectric layer and the second sub-plate.

[0009] In some embodiments, the first sub-board is provided with a first circuit layer, the second sub-board is provided with a second circuit layer, and the first via penetrates the first circuit layer and the second circuit layer; after the first via is processed on the laminating plate, the method for manufacturing the printed circuit board of the embedded ceramic component further includes:

[0010] A first conductive layer is provided on the inner wall of the first through hole, and both the first circuit layer and the second circuit layer are connected to the first conductive layer.

[0011] In some embodiments, multiple first line layers are provided, and a first insulating dielectric layer is provided between adjacent first line layers; and / or, multiple second line layers are provided, and a second insulating dielectric layer is provided between adjacent second line layers.

[0012] In some embodiments, the method of fabricating the printed circuit board of the embedded ceramic component before providing the lamination plate includes:

[0013] A laminated board is provided, the laminated board comprising a first sub-board, a first connecting layer, the embedded layer, a second connecting layer and the second sub-board arranged sequentially and in a stacked manner;

[0014] The laminated plates are pressed together, and a portion of the first connecting layer and a portion of the second connecting layer fill the gap between the recess and the protrusion. The first connecting layer located between the first sub-plate and the embedded layer forms the first dielectric layer, and the second connecting layer located between the second sub-plate and the embedded layer forms the second dielectric layer, thereby obtaining the laminated plate.

[0015] In some embodiments, the cross-section of the protrusion perpendicular to the arrangement direction of the first sub-plate and the second sub-plate is semi-circular, rectangular, trapezoidal or triangular, and the shape of the recess is adapted to the shape of the protrusion.

[0016] In some embodiments, the cross-section of the protrusion perpendicular to the arrangement direction of the first sub-plate and the second sub-plate is rectangular.

[0017] In some embodiments, the ceramic component has a pre-drilled hole inside; when the first through hole is machined on the pressing plate, a second through hole is machined on the pressing plate, the second through hole penetrating the first sub-plate, the first dielectric layer, the pre-drilled hole, the second dielectric layer and the second sub-plate, and the diameter of the second through hole is smaller than the diameter of the pre-drilled hole.

[0018] In some embodiments, the diameter of the first through hole is greater than 1.0 mm.

[0019] Secondly, embodiments of this application provide a printed circuit board with embedded ceramic components, including a laminating plate. The laminating plate includes a first sub-board, a first dielectric layer, an embedded layer, a second dielectric layer, and a second sub-board arranged sequentially and in layers. The embedded layer includes an embedded substrate and a ceramic component. The embedded substrate is provided with an embedded groove. The embedded substrate includes a protrusion disposed on the inner wall of the embedded groove. The ceramic component is disposed in the embedded groove. The edge of the ceramic component is provided with a recess. The protrusion is gap-accommodating within the recess. The laminating plate is provided with a first through hole, which penetrates the first sub-board, the first dielectric layer, the protrusion, the second dielectric layer, and the second sub-board.

[0020] Thirdly, embodiments of this application provide a printed circuit board for embedded ceramic components, wherein the printed circuit board for embedded ceramic components is manufactured by the method for manufacturing a printed circuit board for embedded ceramic components as described in the first aspect.

[0021] The method for manufacturing a printed circuit board with embedded ceramic components provided in this application has the following advantages: Since the laminating plate includes a first sub-board, a first dielectric layer, an embedded layer, a second dielectric layer, and a second sub-board arranged sequentially and in layers, the embedded layer includes an embedded substrate and a ceramic component. The embedded substrate is provided with an embedded groove and includes a protrusion provided on the inner wall of the embedded groove. The ceramic component is disposed in the embedded groove, and the edge of the ceramic component is provided with a recess. The gap between the protrusion and the recess is accommodated in the recess. When the first through hole is processed on the laminating plate, the first through hole penetrates the first sub-board, the first dielectric layer, the protrusion, the second dielectric layer, and the second sub-board. Therefore, it is not necessary to provide pre-drilled holes on the edge of the ceramic component. Thus, there will be no problem of incomplete filling of pre-drilled holes or voids in the filling, and the quality of the processed first through hole is guaranteed.

[0022] The advantages of the printed circuit board for embedded ceramic components provided in this application compared to the prior art can be seen in the description of the advantages of the manufacturing method of the printed circuit board for embedded ceramic components provided in this application compared to the prior art, which will not be repeated here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1This is a flowchart of a method for manufacturing a printed circuit board with embedded ceramic components in one embodiment of this application;

[0025] Figure 2 This is a schematic diagram of the structure of the laminated plate in one embodiment of this application;

[0026] Figure 3 Yes Figure 2 A schematic diagram of the structure of the laminated plate obtained after laminating the laminated plates shown.

[0027] Figure 4 Is Figure 3 The diagram shows a first through hole machined on the press plate.

[0028] Figure 5 Yes Figure 4 A top view of the embedded layer in the laminated plate shown;

[0029] Figure 6 Yes Figure 5 A top view of the ceramic component embedded in the layer shown;

[0030] Figure 7 Is Figure 4 A schematic diagram showing the first conductive layer disposed on the inner wall of the first through hole;

[0031] Figure 8 This is a top view of the embedded layer in another embodiment of this application.

[0032] The markings in the diagram mean:

[0033] 10. First sub-board;

[0034] 11. First circuit layer; 12. First insulating dielectric layer;

[0035] 201, First interconnect layer; 20, First dielectric layer;

[0036] 30. Embedded layer;

[0037] 31. Embedded substrate; 311. Protrusion; 32. Ceramic component; 321. Recess;

[0038] 401, Second Connecting Layer; 40, Second Dielectric Layer;

[0039] 50. Second sub-board;

[0040] 51. Second circuit layer; 52. Second insulating dielectric layer;

[0041] 601, Third interconnect layer; 60, Third dielectric layer; 61, First copper foil;

[0042] 701, Fourth Connecting Layer; 70, Fourth Dielectric Layer; 71, Second Copper Foil;

[0043] 80. First via; 81. First conductive layer. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0045] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0047] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0048] Embedded printed circuit boards refer to a special type of printed circuit board product in which components, conductors or other functional structures are pre-embedded or embedded inside the embedded substrate during the printed circuit board manufacturing process, rather than the traditional surface mount or through-hole process.

[0049] In recent years, embedding high thermal conductivity and low CTE materials such as metal blocks and ceramic blocks into printed circuit boards (PCBs) to achieve better thermal management and improve product reliability has become a popular technology. PCBs with partially embedded ceramic blocks are designed with through-holes penetrating the ceramic blocks to effectively utilize wiring space. However, ceramic materials are hard, and conventional mechanical drilling methods cannot directly drill holes in laminated boards with embedded ceramic blocks, easily causing the ceramic blocks to crack.

[0050] In related technologies, pre-drilled holes are typically made on the ceramic block first, and then through holes are drilled at the pre-drilled hole locations after lamination. During the lamination process, the pre-drilled holes on the ceramic block are filled with molten resin formed from the prepreg. However, during production, it has been found that because the molten resin needs to fill both the gap between the ceramic block and the embedding groove of the embedded substrate, as well as the pre-drilled holes with larger diameters (e.g., diameter ≥ 1mm) at the edge of the ceramic block, the pre-drilled holes at the edge of the ceramic block are prone to incomplete filling or voids, thus affecting the quality of subsequent through holes.

[0051] In addition, if resin plugging is used to fill the pre-drilled holes of ceramic blocks in advance, multiple processes such as resin plugging, grinding, and curing are required, which reduces production efficiency and increases production costs. Moreover, for pre-drilled holes with a diameter >1.0mm, resin plugging cannot ensure fullness of the plugging, and there is a risk of resin depression and cracking.

[0052] In view of this, this application provides a printed circuit board with embedded ceramic components and a method for manufacturing the same. Since the laminating board includes a first sub-board, a first dielectric layer, an embedded layer, a second dielectric layer, and a second sub-board arranged sequentially and in layers, the embedded layer includes an embedded substrate and a ceramic component. The embedded substrate is provided with an embedded groove and includes a protrusion provided on the inner wall of the embedded groove. The ceramic component is disposed in the embedded groove, and the edge of the ceramic component is provided with a recess. The gap between the protrusion and the recess is accommodated in the recess. When the first through hole is processed on the laminating board, the first through hole penetrates the first sub-board, the first dielectric layer, the protrusion, the second dielectric layer, and the second sub-board. Therefore, it is not necessary to provide pre-drilled holes on the edge of the ceramic component. Thus, there is no problem of incomplete filling of pre-drilled holes or voids in the filling, and the quality of the processed first through hole is guaranteed.

[0053] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0054] Please refer to Figures 1 to 6 In a first aspect, embodiments of this application provide a method for manufacturing a printed circuit board with an embedded ceramic component 32, comprising:

[0055] S100: A pressing plate is provided. The pressing plate includes a first sub-plate 10, a first dielectric layer 20, an embedded layer 30, a second dielectric layer 40, and a second sub-plate 50 arranged sequentially and in layers. The embedded layer 30 includes an embedded substrate 31 and a ceramic component 32. The embedded substrate 31 is provided with an embedded groove. The embedded substrate 31 includes a protrusion 311 provided on the inner wall of the embedded groove. The ceramic component 32 is disposed in the embedded groove. The edge of the ceramic component 32 is provided with a recess 321. The protrusion 311 is gapped and accommodated in the recess 321.

[0056] Both the first sub-board 10 and the second sub-board 50 may include a circuit layer (such as a copper layer, aluminum layer, or silver layer) and an insulating dielectric layer (which may include resin and fiberglass cloth). Multiple layers of the insulating dielectric layer and the circuit layer may be alternately stacked. For example, both the first sub-board 10 and the second sub-board 50 may include a copper-clad laminate or copper foil. Both the first dielectric layer 20 and the second dielectric layer 40 can be obtained by laminating prepreg. The embedding groove may penetrate the embedding substrate 31, which may be a core board, etc.

[0057] The ceramic component 32 can be a ceramic block. The material of the ceramic component 32 can be alumina, aluminum nitride, silicon nitride, beryllium oxide, etc.

[0058] The embedded substrate 31 can be a single insulating dielectric layer, meaning that no conductor layers (copper layers) are provided on either side of the embedded substrate 31; or it can consist of an insulating dielectric layer and conductor layers superimposed on both sides of the insulating dielectric layer, meaning that the embedded substrate 31 is a double-sided copper-clad embedded substrate 31; or it can consist of multiple insulating dielectric layers and multiple conductor layers alternately arranged, with the insulating dielectric layer located between two conductor layers, meaning that the embedded substrate 31 is a board that has undergone at least one lamination and contains multiple conductor layers. The conductor layers of the embedded substrate 31 can be fabricated using chemical etching to create the corresponding circuit patterns.

[0059] The thickness of the ceramic component 32 may be less than or equal to the thickness of the embedded substrate 31.

[0060] The shape of the embedded groove ceramic part 32 matches the shape of the ceramic part 32. The protrusion 311 can be a bump, and the recess 321 can be an indentation. The shape of the protrusion 311 matches the shape of the recess 321, and the size of the protrusion 311 is smaller than the size of the recess 321. Multiple protrusions 311 and recesses 321 can be provided, and they are provided in a one-to-one correspondence.

[0061] Understandably, since the pre-drilled holes located at the edge of ceramic part 32 have been eliminated, there will be no issues with incomplete filling, voids, or cracks in the filling in this area during the fabrication of the laminate.

[0062] S200: A first through hole 80 is machined on the press plate, the first through hole 80 passing through the first sub-plate 10, the first dielectric layer 20, the protrusion 311, the second dielectric layer 40 and the second sub-plate 50.

[0063] The first through hole 80 can be machined on the press plate by means of mechanical drilling or laser drilling. Multiple first through holes 80 can be provided.

[0064] It is understandable that since the first through hole 80 is directly set in the protrusion 311 of the embedded substrate 31, the drilling quality of the first through hole 80 can be well guaranteed.

[0065] It should be noted that the number of layers in the laminated plate structure in the method for manufacturing the printed circuit board of the embedded ceramic component 32 provided in this application embodiment is only an example, and the number of layers can be increased or decreased according to actual needs. In addition to the first through hole 80 shown in the figure, the laminated plate may also have other through holes located in the internal area of ​​the ceramic component 32 and penetrating the ceramic component 32. Blind holes, buried holes, etc. may also be provided between other conductor layers, without limitation.

[0066] As can be seen from the above, the method for manufacturing a printed circuit board with an embedded ceramic component 32 provided in this application embodiment involves a laminating plate comprising a first sub-board 10, a first dielectric layer 20, an embedded layer 30, a second dielectric layer 40, and a second sub-board 50 arranged sequentially and in layers. The embedded layer 30 includes an embedded substrate 31 and a ceramic component 32. The embedded substrate 31 is provided with an embedded groove and includes a protrusion 311 disposed on the inner wall of the embedded groove. The ceramic component 32 is disposed within the embedded groove. The edge of part 2 is provided with a recessed portion 321, and the protrusion 311 is gapped and accommodated in the recessed portion 321. When the first through hole 80 is processed on the pressing plate, the first through hole 80 penetrates the first sub-plate 10, the first dielectric layer 20, the protrusion 311, the second dielectric layer 40 and the second sub-plate 50. Therefore, it is not necessary to provide pre-drilled holes on the edge of the ceramic part 32, so there will be no problem of incomplete filling of pre-drilled holes or voids in the filling, and the quality of the processed first through hole 80 is guaranteed.

[0067] It should be noted that the method for manufacturing the printed circuit board of the embedded ceramic component 32 provided in this application embodiment does not require pre-drilling holes on the edge of the ceramic component 32, but only provides recesses 321 on the edge of the ceramic component 32. Therefore, the ceramic component 32 can still have a large volume, thereby meeting the requirements for wiring and other functions of the ceramic component 32.

[0068] Please refer to this as well. Figure 7 In this embodiment, the first sub-board 10 is provided with a first circuit layer 11, and the second sub-board 50 is provided with a second circuit layer 51. The first through hole 80 penetrates the first circuit layer 11 and the second circuit layer 51. After the first through hole 80 is processed on the laminating plate, the method for manufacturing the printed circuit board of the embedded ceramic component 32 further includes:

[0069] A first conductive layer 81 is provided on the inner wall of the first through hole 80, and the first circuit layer 11 and the second circuit layer 51 are both connected to the first conductive layer 81.

[0070] By adopting the above scheme, the first circuit layer 11 and the second circuit layer 51 can be electrically connected through the first conductive layer 81.

[0071] It should be noted that both the first circuit layer 11 and the second circuit layer 51 can be copper, silver, or aluminum layers, etc. The first conductive layer 81 can be formed on the inner wall of the first via 80 by copper plating. The first conductive layer 81 can be copper, silver, or aluminum layers, etc. After forming the first conductive layer 81 on the inner wall of the first via 80 and completing the hole metallization, one or more processes such as outer layer circuit pattern fabrication, solder mask application, character processing, surface treatment, forming, and testing can be sequentially performed to complete other processes of the printed circuit board with embedded ceramic component 32.

[0072] Optionally, multiple first line layers 11 are provided, and a first insulating dielectric layer 12 is provided between adjacent first line layers 11; and / or, multiple second line layers 51 are provided, and a second insulating dielectric layer 52 is provided between adjacent second line layers 51.

[0073] With this configuration, electrical conduction of multiple first circuit layers 11 and / or multiple second circuit layers 51 can be achieved through the first conductive layer 81.

[0074] It should be noted that a third dielectric layer 60 and a first copper foil 61 may be stacked on the side of the first sub-board 10 opposite to the second sub-board 50, and a fourth dielectric layer 70 and a second copper foil 71 may be stacked on the side of the second sub-board 50 opposite to the first sub-board 10. The first circuit layer 11 and the second circuit layer 51 can be fabricated using chemical etching.

[0075] Please refer to Figures 2 to 6 In some embodiments, the method of fabricating the printed circuit board of the embedded ceramic part 32 before providing the lamination plate includes:

[0076] First, a laminated board is provided, which includes a first sub-board 10, a first connecting layer 201, an embedded layer 30, a second connecting layer 401, and a second sub-board 50 arranged sequentially and in a stacked manner.

[0077] Both the first connecting layer 201 and the second connecting layer 401 can be prepregs, etc.

[0078] Next, the laminated plates are pressed together, and part of the first connecting layer 201 and part of the second connecting layer 401 fill the gap between the recess 321 and the protrusion 311. The first connecting layer 201 located between the first sub-plate 10 and the embedded layer 30 forms the first medium layer 20, and the second connecting layer 401 located between the second sub-plate 50 and the embedded layer 30 forms the second medium layer 40, thus obtaining the laminated plate.

[0079] During the pressing process, the first connecting layer 201 and the second connecting layer 401 melt. The resin formed after melting flows and fills the gap between the recessed portion 321 and the protruding portion 311. After pressing, the first connecting layer 201 and the second connecting layer 401 become solidified, bonding the embedded layer 30, the first sub-board 10 and the second sub-board 50 and providing insulation.

[0080] It is understandable that part of the first connecting layer 201 and part of the second connecting layer 401 fill the gap between the inner wall of the embedded groove and the ceramic part 32.

[0081] By adopting the above solution, since it is not necessary to pre-drill holes on the edge of the ceramic part 32, there will be no problem of incomplete filling of pre-drilled holes or voids in the filling when the laminated plates are pressed together, and the quality of the first through hole 80 processed is guaranteed.

[0082] It should be noted that the laminate may further include a third connecting layer 601 and a first copper foil 61 located on the side of the first sub-board 10 opposite to the second sub-board 50, and a fourth connecting layer 701 and a second copper foil 71 located on the side of the second sub-board 50 opposite to the first sub-board 10. After the laminate is pressed together, the third connecting layer 601 forms a third dielectric layer 60, and the fourth connecting layer 701 forms a fourth dielectric layer 70. Both the third connecting layer 601 and the fourth connecting layer 701 can be prepregs, etc.

[0083] Optionally, the cross-section of the protrusion 311 perpendicular to the arrangement direction of the first sub-plate 10 and the second sub-plate 50 is semi-circular, rectangular, trapezoidal or triangular, and the shape of the recess 321 is adapted to the shape of the protrusion 311.

[0084] This design allows the protrusion 311 to be conveniently accommodated within the recess 321.

[0085] Please refer to Figure 8 In another embodiment, the cross-section of the protrusion 311 perpendicular to the arrangement direction of the first sub-plate 10 and the second sub-plate 50 is rectangular.

[0086] This configuration allows for better positioning of the ceramic component 32 via the protrusion 311 during the pressing process of the laminated plates, thereby improving the pressing accuracy of the ceramic component 32.

[0087] Please refer to Figures 2 to 6 In some embodiments, the ceramic part 32 has a pre-drilled hole (not shown in the figure) inside; when the first through hole 80 is machined on the pressing plate, a second through hole is machined on the pressing plate. The second through hole penetrates the first sub-plate 10, the first dielectric layer 20, the pre-drilled hole, the second dielectric layer 40 and the second sub-plate 50. The diameter of the second through hole is smaller than the diameter of the pre-drilled hole.

[0088] By adopting the above scheme, a second conductive layer can be subsequently provided on the inner wall of the second through hole to conduct other circuit layers of the first sub-board 10 and the second sub-board 50.

[0089] It is understood that the second conductive layer and the first conductive layer 81 respectively conduct different circuit layers of the first sub-board 10 and the second sub-board 50. Multiple pre-drilled holes can be provided. During the lamination of the laminated boards, since these pre-drilled holes are located inside the ceramic component 32, the corresponding first connecting layer 201 and second connecting layer 401 can fill the pre-drilled holes inside the ceramic component 32 without filling the gap between the inner wall of the embedded groove and the ceramic component 32, thus ensuring that the pre-drilled holes inside the ceramic component 32 are fully filled. Smaller diameter pre-drilled holes can also be provided at the edge of the ceramic component 32; these pre-drilled holes can be filled by normal adhesive flow through the first connecting layer 201 and the second connecting layer 401.

[0090] Optionally, the diameter of the first through hole 80 is greater than 1.0 mm.

[0091] With this setup, there is no need to pre-drill holes with a diameter greater than 1.0mm on the edge of the ceramic part 32, so there will be no problems with incomplete filling of the pre-drilled holes or voids in the filling, and the quality of the first through hole 80 produced is guaranteed.

[0092] It should be noted that the diameter of the first through hole 80 can be larger than the diameter of the second through hole.

[0093] Optionally, a conductive metal layer is provided on the side of the ceramic component 32 facing the first dielectric layer 20 and / or on the side of the ceramic component 32 facing the second dielectric layer 40.

[0094] This setup allows for the fabrication of circuitry using a metal layer, thereby increasing wiring density.

[0095] Secondly, embodiments of this application provide a printed circuit board with an embedded ceramic component 32, including a laminating plate. The laminating plate includes a first sub-board 10, a first dielectric layer 20, an embedded layer 30, a second dielectric layer 40, and a second sub-board 50 arranged sequentially and in layers. The embedded layer 30 includes an embedded substrate 31 and a ceramic component 32. The embedded substrate 31 is provided with an embedded groove and includes a protrusion 311 disposed on the inner wall of the embedded groove. The ceramic component 32 is disposed in the embedded groove, and the edge of the ceramic component 32 is provided with a recess 321. The protrusion 311 is gap-accommodated in the recess 321. The laminating plate is provided with a first through hole 80, which penetrates the first sub-board 10, the first dielectric layer 20, the protrusion 311, the second dielectric layer 40, and the second sub-board 50.

[0096] The printed circuit board with embedded ceramic component 32 provided in this application embodiment has the following characteristics: the laminating plate includes a first sub-board 10, a first dielectric layer 20, an embedded layer 30, a second dielectric layer 40, and a second sub-board 50 arranged sequentially and in layers; the embedded layer 30 includes an embedded substrate 31 and a ceramic component 32; the embedded substrate 31 is provided with an embedded groove; the embedded substrate 31 includes a protrusion 311 provided on the inner wall of the embedded groove; the ceramic component 32 is disposed in the embedded groove; the edge of the ceramic component 32 is provided with a recess 321; the protrusion 311 is gapped and accommodated in the recess 321; and when the first through hole 80 is processed on the laminating plate, the first through hole 80 penetrates the first sub-board 10, the first dielectric layer 20, the protrusion 311, the second dielectric layer 40, and the second sub-board 50. Therefore, it is not necessary to provide pre-drilled holes on the edge of the ceramic component 32, so there will be no problem of incomplete filling of pre-drilled holes or voids in the filling, and the quality of the processed first through hole 80 is guaranteed.

[0097] Thirdly, embodiments of this application provide a printed circuit board for an embedded ceramic component 32, which is manufactured by the method for manufacturing a printed circuit board for an embedded ceramic component 32 as described in the first aspect.

[0098] The printed circuit board with embedded ceramic component 32 provided in this application embodiment has the following characteristics: the laminating plate includes a first sub-board 10, a first dielectric layer 20, an embedded layer 30, a second dielectric layer 40, and a second sub-board 50 arranged sequentially and in layers; the embedded layer 30 includes an embedded substrate 31 and a ceramic component 32; the embedded substrate 31 is provided with an embedded groove; the embedded substrate 31 includes a protrusion 311 provided on the inner wall of the embedded groove; the ceramic component 32 is disposed in the embedded groove; the edge of the ceramic component 32 is provided with a recess 321; the protrusion 311 is gapped and accommodated in the recess 321; and when the first through hole 80 is processed on the laminating plate, the first through hole 80 penetrates the first sub-board 10, the first dielectric layer 20, the protrusion 311, the second dielectric layer 40, and the second sub-board 50. Therefore, it is not necessary to provide pre-drilled holes on the edge of the ceramic component 32, so there will be no problem of incomplete filling of pre-drilled holes or voids in the filling, and the quality of the processed first through hole 80 is guaranteed.

[0099] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method of manufacturing a printed circuit board with a buried ceramic element, characterized in that The application relates to a buried ceramic piece printed circuit board manufacturing method. A press plate is provided, which comprises a first sub-plate, a first medium layer, a buried embedding layer, a second medium layer and a second sub-plate arranged in sequence and in layers, the buried embedding layer comprises a buried embedding substrate and a ceramic piece, the buried embedding substrate is provided with a buried embedding groove, the buried embedding substrate comprises a protruding part arranged on the inner wall of the buried embedding groove, the ceramic piece is arranged in the buried embedding groove, the edge of the ceramic piece is provided with a recessed part, the protruding part is gap-contained in the recessed part, and a pre-drilled hole is arranged in the interior of the ceramic piece; A first through hole is processed on the press plate, and a second through hole is processed on the press plate, the first through hole penetrates through the first sub-plate, the first medium layer, the protruding part, the second medium layer and the second sub-plate, the second through hole penetrates through the first sub-plate, the first medium layer, the pre-drilled hole, the second medium layer and the second sub-plate, and the aperture of the second through hole is smaller than that of the pre-drilled hole.

2. The method of manufacturing a buried ceramic part printed circuit board of claim 1, wherein, The first sub-plate is provided with a first circuit layer, the second sub-plate is provided with a second circuit layer, and the first through hole penetrates through the first circuit layer and the second circuit layer; after the first through hole is processed on the press plate, the buried ceramic piece printed circuit board manufacturing method further comprises: A first conductive layer is arranged on the inner hole wall of the first through hole, and the first circuit layer and the second circuit layer are connected with the first conductive layer.

3. The method of manufacturing a buried ceramic part printed circuit board of claim 2, wherein, The first circuit layer is arranged in a plurality of forms, and a first insulating medium layer is arranged between adjacent first circuit layers; and / or the second circuit layer is arranged in a plurality of forms, and a second insulating medium layer is arranged between adjacent second circuit layers.

4. The method of manufacturing a buried ceramic part printed circuit board of claim 1, wherein, Before the press plate is provided, the buried ceramic piece printed circuit board manufacturing method comprises: A laminated plate is provided, which comprises the first sub-plate, a first connecting layer, the buried embedding layer, a second connecting layer and the second sub-plate arranged in sequence and in layers; The laminated plate is pressed, part of the first connecting layer and part of the second connecting layer fill the gap between the recessed part and the protruding part, the first connecting layer between the first sub-plate and the buried embedding layer forms the first medium layer, the second connecting layer between the second sub-plate and the buried embedding layer forms the second medium layer, and the press plate is obtained.

5. The method of manufacturing a buried ceramic part printed circuit board of claim 1, wherein, The cross section of the protruding part perpendicular to the arrangement direction of the first sub-plate and the second sub-plate is semicircular, rectangular, trapezoidal or triangular, and the shape of the recessed part is matched with the shape of the protruding part.

6. The method of manufacturing a buried ceramic part printed circuit board of claim 5, wherein, The cross section of the protruding part perpendicular to the arrangement direction of the first sub-plate and the second sub-plate is rectangular.

7. The method of manufacturing a buried ceramic part printed circuit board according to any one of claims 1 to 6, wherein The aperture of the first through hole is greater than 1.0 mm.

8. A printed circuit board with a buried ceramic element, characterized in that The buried ceramic piece printed circuit board is processed by the buried ceramic piece printed circuit board manufacturing method in any one of claims 1 to 7.

Images