Wafer connector appearance inspection apparatus

Abstract

The application relates to a wafer connector appearance detection equipment, and relates to the technical field of product detection.The equipment comprises a workbench, a storage bin and a track mechanism, which are arranged on the workbench; a transfer manipulator mechanism, a single-face appearance detection mechanism, a grabbing mechanism, a five-face appearance detection mechanism and a variable-distance material placing mechanism are movably arranged on the track mechanism.The overall structure of the equipment takes the workbench as a basic platform, the storage bin is used for storing wafer connectors to be detected, the track mechanism provides a moving path, the transfer manipulator mechanism is responsible for taking materials from the storage bin and transferring the materials to other mechanisms, the single-face appearance detection mechanism is used for detecting a single surface of the wafer connector, the grabbing mechanism is used for grabbing and moving the wafer connector, and the five-face appearance detection mechanism is used for comprehensively detecting other five surfaces of the wafer connector, and unqualified products are separately placed, so that efficient automatic detection is realized, manual intervention is reduced, the continuity and high precision of the detection process are ensured, and the overall production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the product detection technical field, in particular to a wafer connector appearance detection equipment. BACKGROUND

[0002] As a high-performance electrical connection component for connecting circuit boards, chips, modules and other electronic components in electronic devices, wafer connectors play a crucial role in data transmission and power transmission of electronic devices. With the continuous development and upgrading of electronic devices, the performance and quality requirements of wafer connectors are becoming higher and higher, and their production and detection technologies are also continuously improving. High-performance wafer connectors can ensure the stable and reliable operation of electronic devices, which is of great significance to improve the performance and efficiency of the entire electronic system and promote the development of electronic devices towards miniaturization and high performance.

[0003] In the prior art, the imaging function of a CCD camera is usually used to convert the appearance information of one side of the connector into a digital image, and defects are identified through image processing algorithms such as edge detection and gray scale contrast. However, each detection can only cover one side, and multiple adjustments are required to complete six-sided detection, resulting in low detection efficiency.

[0004] Therefore, in view of the above status, it is urgent to develop a wafer connector appearance detection equipment to overcome the deficiencies in current practical applications. SUMMARY

[0005] In order to solve the defects in the above-mentioned technology, the application provides a wafer connector appearance detection equipment.

[0006] The wafer connector appearance detection equipment provided by the application adopts the following technical scheme:

[0007] A wafer connector appearance detection equipment, comprising a workbench, a storage bin and a track mechanism arranged on the workbench, a transfer mechanical hand mechanism, a single-sided appearance detection mechanism, a grabbing mechanism, a five-sided appearance detection mechanism and a variable-distance material placing mechanism movably arranged on the track mechanism.

[0008] Beneficial effects: By integrating multiple mechanisms on the track mechanism, efficient automated detection is achieved, reducing manual intervention. The track mechanism allows flexible movement of each mechanism, optimizing equipment layout, saving floor space, while ensuring the continuity and high precision of the detection process, improving overall production efficiency.

[0009] In an optional embodiment, the storage bin comprises a first fixed frame fixedly arranged on the workbench, a material taking groove is formed below the first fixed frame, and a plurality of clamping grooves for placing wafer connectors are arranged on the side wall of the first fixed frame.

[0010] Beneficial effects: The clamping groove design makes the wafer connector not easy to slide or damage during storage, improving the reliability and safety of storage. The material taking groove simplifies the material taking process, facilitates the quick access of the mechanical hand, and improves the loading efficiency and overall smoothness of the equipment.

[0011] In an alternative embodiment, the transfer mechanism includes a first track fixedly arranged on the workbench below the first fixed frame, a first moving part movably arranged on the first track, a first support frame fixedly arranged on the first moving part, a first lifting member arranged on the first support frame, and a material placing plate fixedly arranged on the lifting end of the first lifting member.

[0012] Beneficial effects: The automatic material taking and placing operation is realized, and the positioning error is reduced through accurate control of lifting and movement. The mechanism improves the transfer efficiency, reduces the labor operation cost, and ensures the stability of the wafer connector during transfer.

[0013] In an alternative embodiment, the track mechanism includes a second fixed frame and a third fixed frame, the second fixed frame and the third fixed frame are respectively fixedly arranged in parallel on the workbench, a second track is fixedly arranged on the second fixed frame, a third track is fixedly arranged on the third fixed frame, the single-side appearance detection mechanism is movably arranged on the second track, the five-side appearance detection mechanism is movably arranged on the second track and the third track, the grabbing mechanism is movably arranged on the third track, and the variable-distance material placing mechanism is movably arranged on the second track and the third track.

[0014] Beneficial effects: The parallel track design allows multiple mechanisms to move simultaneously, avoiding motion interference and improving the multi-task processing capability of the equipment. Track sharing reduces the number of components, reduces manufacturing costs, and enhances the flexibility and scalability of the equipment.

[0015] In an alternative embodiment, the single-side appearance detection mechanism includes a second support frame movably arranged on the second track, a second lifting member fixedly arranged on one side of the second support frame, a clamping block arranged on the lifting end of the second lifting member, and a one-way detection element arranged on the clamping block.

[0016] Beneficial effects: The mechanism realizes rapid and accurate detection of the single side of the wafer connector, and the lifting design enhances adaptability to handle wafer connectors of different sizes. The mechanism simplifies the detection process, improves the detection speed and consistency.

[0017] In an alternative embodiment, the grabbing mechanism comprises a third support frame, the second support frame is movably arranged on the third track, one side of the third support frame is fixedly provided with a third lifting piece, and the lifting end of the third lifting piece is provided with an arc-shaped frame, and the bottom of the arc-shaped frame is provided with a plurality of electrostatic chuck.

[0018] Beneficial effects: The electrostatic chuck ensures that the wafer connector surface is scratch-free or pollution-free during the grabbing process. The arc-shaped frame design fits the shape of the wafer, improving the stability of the grabbing. The lifting and moving functions realize precise positioning, improving the grabbing efficiency and reliability.

[0019] In an alternative embodiment, the five-surface appearance detection mechanism comprises a fourth track fixedly arranged on the workbench, a right-angle plate movably arranged on the fourth track, a supporting plate arranged on the top of the right-angle plate for placing the wafer connector, a taking and placing groove arranged in the center of the supporting plate, an expansion ring arranged on the bottom of the supporting plate, two pads arranged on the two sides of the fourth track, a fifth track arranged on the two pads, a second moving part movably arranged on the fifth track, a fourth lifting piece arranged on the second moving part, a top PIN needle arranged on the lifting end of the fourth lifting piece, the top PIN needle arranged in the center of the taking and placing groove, a guide rail arranged on the two sides of the supporting plate, and an empty material bin arranged at the other end of the guide rail.

[0020] Beneficial effects: The five-surface appearance detection mechanism realizes comprehensive detection of the five surfaces of the wafer connector. The top PIN needle design allows the wafer connector to be flipped or lifted, facilitating the CCD camera to take pictures from different angles. The guide rail and the empty material bin ensure the smoothness and continuity of the detection process, improving the detection coverage and efficiency.

[0021] In an alternative embodiment, a first mechanical hand is arranged on the second track, a second mechanical hand is arranged on the third track, the first mechanical hand and the second mechanical hand are respectively provided with a linear rotary actuator, a plurality of suction nozzles for sucking wafers are arranged on the linear rotary actuator, and a plurality of CCD camera groups for detecting different directions are arranged on the workbench between the second fixed frame and the third fixed frame.

[0022] Beneficial effects: The mechanical hand realizes efficient grabbing and positioning through multi-degree-of-freedom motion, and the suction nozzle design ensures safe suction. Multiple CCD camera groups cover multiple detection directions, improving the comprehensiveness and accuracy of detection, reducing the missed detection rate, and improving the automation level.

[0023] In an alternative embodiment, the top end of the PIN needle is provided with an elastic contact part, and the surface of the elastic contact part is provided with anti-skid lines; the CCD camera groups are arranged in a ring along the movement path of the wafer connector, and the CCD camera groups include a front detection group, a left side detection group, a right side detection group, a front side detection group, a rear side detection group, and a back detection group.

[0024] Beneficial effects: The elastic contact part protects the surface of the wafer connector from damage, and the anti-skid lines enhance the lifting stability. The ring arrangement of the CCD camera groups realizes no dead angle detection, ensures the comprehensiveness and high precision of appearance detection, and reduces the product quality risk.

[0025] In an alternative embodiment, the variable-distance placement mechanism includes a third moving part, the third moving part is movably arranged on the second rail and the third rail respectively, a plurality of blade air cylinders are arranged on the third moving part, a vacuum suction cup for sucking wafers is arranged at the moving end of the blade air cylinder, two distribution frames are arranged below the second fixed frame respectively, and a distribution disc is movably arranged in the distribution frame.

[0026] Beneficial effects: The blade air cylinder realizes flexible adjustment of the distance between the suction cups, adapts to wafer connectors of different sizes, and improves the versatility of the equipment. The vacuum suction cup ensures stable grabbing, the distribution frame and the distribution disc facilitate sorting and storage, optimize the placement process, and improve production efficiency and flexibility.

[0027] In summary, the present application includes at least one of the following beneficial technical effects:

[0028] By integrating multiple mechanisms on the rail mechanism, efficient automated detection is realized, and manual intervention is reduced. The rail mechanism allows flexible movement of each mechanism, optimizes the equipment layout, saves floor space, ensures the continuity and high precision of the detection process, and improves overall production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a schematic diagram of the overall structure provided by the embodiments of the present application;

[0030] Figure 2 is a schematic diagram of the storage bin structure provided by the embodiments of the present application;

[0031] Figure 3 is a schematic diagram of the transfer robot mechanism structure provided by the embodiments of the present application;

[0032] Figure 4 is a schematic diagram of the grabbing mechanism structure provided by the embodiments of the present application;

[0033] Figure 5 is a schematic diagram of part of the five-sided appearance detection mechanism provided by the embodiments of the present application;

[0034] Figure 6 Figure 7 is another part structure schematic diagram of the five-face appearance detection mechanism provided by the embodiment of the present application;

[0035] Figure 7 Figure 8 is a structure schematic diagram of the variable-distance material placing mechanism.

[0036] The label explanation: 1, workbench; 2, material storage bin; 21, first fixed frame; 22, material taking groove; 23, clamping groove; 24, wafer connector; 3, transfer mechanical hand mechanism; 31, first track; 32, first moving part; 33, first support frame; 34, first lifting piece; 35, material placing plate; 4, track mechanism; 41, second fixed frame; 42, third fixed frame; 43, second track; 44, third track; 5, single-face appearance detection mechanism; 51, second support frame; 52, second lifting piece; 53, clamping block; 54, one-way detection element; 6, grabbing mechanism; 61, third support frame; 62, third lifting piece; 63, arc-shaped frame; 64, electrostatic chuck; 7, five-face appearance detection mechanism; 71, fourth track; 72, right-angle plate; 73, supporting plate; 74, taking and placing groove; 75, film expanding ring; 76, cushion block; 77, fifth track; 78, second moving part; 79, top PIN needle; 80, guide rail; 81, empty material storage bin; 82, first mechanical hand; 83, second mechanical hand; 84, linear rotary actuator; 85, suction nozzle; 86, CCD camera group; 87, fourth lifting piece; 88, wafer; 9, variable-distance material placing mechanism; 91, third moving part; 92, blade cylinder; 93, material distributing frame; 94, material distributing disc. DETAILED DESCRIPTION

[0037] The technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0038] In the description of the present application, it should be noted that the terms “center”, “upper”, “lower”, “left”, “right”, “vertical”, “horizontal”, “inner”, “outer” and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms “first”, “second”, “third” are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0039] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0040] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict between them.

[0041] The present application provides the following embodiments: Embodiment 1

[0042] The present application embodiment discloses a wafer connector appearance detection equipment, referring to Figure 1 , including a workbench 1, a storage bin 2 and a track mechanism 4 are arranged on the workbench 1 respectively, a transfer manipulator mechanism 3, a single-face appearance detection mechanism 5, a grabbing mechanism 6, a five-face appearance detection mechanism 7 and a variable-distance material placing mechanism 9 are movably arranged on the track mechanism 4.

[0043] The working principle and beneficial effects of the above technical solution are as follows: the overall structure of the equipment takes the workbench 1 as the basic platform, the storage bin 2 is used for storing the wafer connector 24 to be detected, the track mechanism 4 provides a moving path, the transfer manipulator mechanism 3 is responsible for taking materials from the storage bin 2 and transferring them to other mechanisms, the single-face appearance detection mechanism 5 is used for detecting a single surface of the wafer connector 24, the grabbing mechanism 6 is used for grabbing and moving the wafer connector 24, the five-face appearance detection mechanism 7 is used for comprehensively detecting the other five surfaces of the wafer connector 24, and the variable-distance material placing mechanism 9 is used for adjusting the distance and placing the wafer connector 24. All these mechanisms are movably arranged on the track mechanism 4, and the automatic detection process is realized through coordinated movement.

[0044] By integrating multiple mechanisms on the track mechanism 4, efficient automatic detection is realized, manual intervention is reduced, the track mechanism 4 allows flexible movement of each mechanism, the equipment layout is optimized, six-face detection is completed through multiple adjustments of the posture, the floor area is saved, and the continuity and high precision of the detection process are ensured, thereby improving the overall production efficiency. Embodiment 2

[0045] Based on embodiment 1, as shown in Figures 1-2 , the storage bin 2 comprises a first fixed frame 21, the first fixed frame 21 is fixedly arranged on the workbench 1, a material taking groove 22 is formed below the first fixed frame 21, and a plurality of clamping grooves 23 for placing wafer connectors 24 are arranged on the side wall of the first fixed frame 21.

[0046] The working principle and beneficial effects of the above technical solution are that the storage bin 2 is fixed on the workbench 1 through the first fixing frame 21, the material taking groove 22 below the first fixing frame 21 facilitates the transfer mechanical hand mechanism 3 to access the wafer connector 24, and a plurality of clamping grooves 23 are arranged on the side wall of the first fixing frame 21 to fix and place the wafer connector 24, thereby ensuring the orderly storage and stable positioning of the wafer connector 24.

[0047] The clamping groove 23 is designed to prevent the wafer connector 24 from sliding or being damaged during storage, thereby improving the reliability and safety of storage, and the material taking groove 22 simplifies the material taking process, facilitates the quick access of the mechanical hand, and improves the loading efficiency and overall smoothness of the equipment. Embodiment 3

[0048] On the basis of embodiment 2, as shown in Figures 1-2 The transfer mechanical hand mechanism 3 includes a first track 31 fixedly arranged on the workbench 1 below the first fixing frame 21, a first moving part 32 movably arranged on the first track 31, a first support frame 33 fixedly arranged on the first moving part 32, a first lifting piece 34 arranged on the first support frame 33, and a material placing plate 35 fixedly arranged on the lifting end of the first lifting piece 34.

[0049] The working principle and beneficial effects of the above technical solution are that the transfer mechanical hand mechanism 3 moves through the first track 31, the first moving part 32 slides along the first track 31, the first lifting piece 34 on the first support frame 33 controls the lifting movement of the material placing plate 35, the material placing plate 35 can take or place materials from the material taking groove 22 of the storage bin 2, and the precise transfer of the wafer connector 24 is realized.

[0050] The automatic material taking and placing operations are realized, the positioning error is reduced through the accurate control of lifting and movement, the transfer efficiency is improved, the labor operation cost is reduced, and the stability of the wafer connector 24 during the transfer process is ensured. Embodiment 4

[0051] On the basis of embodiment 3, as shown in Figure 1As shown, the track mechanism 4 includes a second fixed frame 41 and a third fixed frame 42, which are respectively fixed and arranged in parallel on the workbench 1, the second fixed frame 41 is fixedly provided with a second track 43, and the third fixed frame 42 is fixedly provided with a third track 44, the single-sided appearance detection mechanism 5 is movably arranged on the second track 43, the five-sided appearance detection mechanism 7 is movably arranged on the second track 43 and the third track 44, and the grabbing mechanism 6 is movably arranged on the third track 44, and the variable-distance material placing mechanism 9 is movably arranged on the second track 43 and the third track 44.

[0052] The working principle and beneficial effects of the above technical solution are that the track mechanism 4 is fixed in parallel on the workbench 1 by the second fixed frame 41 and the third fixed frame 42, and the second track 43 and the third track 44 are arranged on the fixed frames respectively. The single-sided appearance detection mechanism 5 moves on the second track 43, the five-sided appearance detection mechanism 7 moves on the second track 43 and the third track 44, the grabbing mechanism 6 moves on the third track 44, and the variable-distance material placing mechanism 9 moves on both of them, realizing independent operation and cooperative work of each mechanism.

[0053] The parallel track design allows multiple mechanisms to move simultaneously, avoids motion interference, improves the multi-task processing capability of the equipment, track sharing reduces the number of components, reduces manufacturing costs, and at the same time enhances the flexibility and scalability of the equipment. Embodiment 5

[0054] On the basis of embodiment 4, as shown in Figure 1 , Figure 3 As shown, the single-sided appearance detection mechanism 5 includes a second support frame 51 movably arranged on the second track 43, a second lifting piece 52 fixedly arranged on one side of the second support frame 51, a clamping block 53 arranged on the lifting end of the second lifting piece 52, and a one-way detection element 54 arranged on the clamping block 53.

[0055] The working principle and beneficial effects of the above technical solution are that the single-sided appearance detection mechanism 5 moves on the second track 43 through the second support frame 51, the second lifting piece 52 controls the lifting of the clamping block 53, and the one-way detection element 54 (such as a CCD camera) arranged on the clamping block 53 performs image acquisition and detection on a single surface of the wafer connector 24. The lifting movement allows the detection height to be adjusted to adapt to different products.

[0056] The lifting design enhances the adaptability and can handle wafer connectors 24 of different sizes. This mechanism simplifies the detection process, improves the detection speed and consistency, and realizes rapid and accurate detection of a single side of the wafer connector 24. Embodiment 6

[0057] On the basis of embodiment 5, as shown in Figure 1 、 Figure 4 The grabbing mechanism 6 includes a third support frame 61, the second support frame 51 is movably arranged on the third track 44, one side of the third support frame 61 is fixedly arranged with a third lifting piece 62, the lifting end of the third lifting piece 62 is arranged with an arc-shaped frame 63, and the bottom of the arc-shaped frame 63 is arranged with a plurality of electrostatic chuck 64.

[0058] The working principle and beneficial effects of the above technical scheme are: the third support frame 61 moves on the third track 44, the third lifting piece 62 controls the lifting of the arc-shaped frame 63, and the plurality of electrostatic chuck 64 at the bottom of the arc-shaped frame 63 is used to grab the wafer connector 24 by electrostatic adsorption, so as to realize the repositioning of the wafer connector 24. The electrostatic chuck 64 provides non-contact fixing to avoid physical damage.

[0059] The electrostatic chuck 64 ensures that there is no scratch or pollution on the surface of the wafer connector 24 during grabbing, the arc-shaped frame 63 is designed to match the shape of the wafer, the lifting and moving functions realize precise positioning, and the grabbing efficiency and reliability are improved. Embodiment 7

[0060] On the basis of embodiment 6, as shown in Figure 1 、 Figure 5 、 Figure 6 The five-face appearance detection mechanism 7 includes a fourth track 71, the fourth track 71 is fixedly arranged on the workbench 1, a right-angle plate 72 is movably arranged on the fourth track 71, a supporting plate 73 for placing the wafer connector 24 is arranged on the top of the right-angle plate 72, a taking and placing groove 74 is arranged in the center of the supporting plate 73, an expansion film ring 75 is arranged at the bottom of the supporting plate 73, two pads 76 are arranged on the two sides of the fourth track 71, a fifth track 77 is arranged on the two pads 76, a second moving part 78 is movably arranged on the fifth track 77, a fourth lifting piece 87 is arranged on the second moving part 78, a top PIN needle 79 is arranged at the lifting end of the fourth lifting piece 87, the top PIN needle 79 is arranged at the center of the taking and placing groove 74, guide bars 80 are arranged on the two sides of the supporting plate 73, and empty material bins 81 are arranged at the other ends of the guide bars 80.

[0061] A first mechanical hand 82 is arranged on the second track 43, a second mechanical hand 83 is arranged on the third track 44, a linear rotary actuator 84 is arranged on the first mechanical hand 82 and the second mechanical hand 83 respectively, a plurality of suction nozzles 85 for sucking wafers 88 are arranged on the linear rotary actuator 84, and a plurality of CCD camera groups 86 for detecting different directions are arranged on the workbench 1 between the second fixed frame 41 and the third fixed frame 42.

[0062] The top end of the top PIN needle 79 is provided with an elastic contact part, and the surface of the elastic contact part is provided with anti-skid lines; the CCD camera group 86 is annularly distributed along the movement path of the wafer connector 24, and the CCD camera group 86 includes a front face detection group, a left side detection group, a right side detection group, a front side detection group, a rear side detection group and a back face detection group.

[0063] The working principle and beneficial effects of the above technical solution are as follows: the fourth track 71 moves the right-angle plate 72, the right-angle plate 72 is provided to avoid the fourth track 71, the supporting plate 73 at the top of the right-angle plate 72 is used to place the wafer connector 24, the taking-and-placing groove 74 at the center of the supporting plate 73 facilitates the top PIN needle 79 to lift the wafer 88, the film-expanding ring 75 at the bottom of the supporting plate 73 is used to expand the blue film of the wafer connector 24, the top PIN needle 79 is controlled to lift and lower through the fourth lifting piece 87, the top PIN needle 79 lifts the wafer 88 from the center of the taking-and-placing groove 74, and is used to lift the wafer connector 24 according to the size of the wafer connector 24 to make the wafer connector 24 separate from the blue film, the guide rail 80 guides the wafer connector 24 to move, the first mechanical hand 82 on the second track 43 and the second mechanical hand 83 on the third track 44 are respectively equipped with linear rotary actuators 84, and the suction nozzles 85 on the actuators are used to suck the wafer 88 and move the wafer 88 away for five-face detection, the linear rotary actuators 84 realize linear movement and rotary motion, so that the mechanical hands can accurately grasp and place, and a plurality of CCD camera groups 86 are arranged on the workbench 1 between the second fixed frame 41 and the third fixed frame 42 to detect the wafer connector 24 from different directions, and the empty stock bin 81 is used to store blank wafer connectors 24.

[0064] The five faces of the wafer connector 24 are comprehensively detected, the top PIN needle 79 is designed to allow the wafer 88 placed in the wafer connector 24 to be flipped or lifted, the guide rail 80 and the empty stock bin 81 ensure the smoothness and continuity of the detection process, and the detection coverage rate and efficiency are improved.

[0065] The mechanical hands realize efficient grasping and positioning through multi-degree-of-freedom motion, and the suction nozzles 85 are designed to ensure safe suction. The plurality of CCD camera groups 86 cover multiple detection directions, improve the comprehensiveness and accuracy of detection, reduce the missed detection rate, and improve the automation level.

[0066] The top end of the top PIN needle 79 is provided with an elastic contact part, and the surface of the elastic contact part is provided with anti-skid lines; the CCD camera group 86 is annularly distributed along the movement path of the wafer connector 24, and the CCD camera group 86 includes a front face detection group, a left side detection group, a right side detection group, a front side detection group, a rear side detection group and a back face detection group.

[0067] The elastic contact part protects the wafer 88 surface from damage, and the anti-skid pattern enhances the lifting stability. The annularly distributed CCD camera group 86 realizes no dead angle detection, ensures the comprehensiveness and high precision of appearance detection, and reduces the product quality risk. Embodiment 8

[0068] On the basis of embodiment 7, as shown in Figure 1 、 Figure 7 The variable-distance material placing mechanism 9 includes a third moving part 91, the second track 43 and the third track 44 are respectively provided with the third moving part 91, a plurality of blade air cylinders 92 are arranged on the third moving part 91, a vacuum chuck for sucking the wafer 88 is arranged at the moving end of the blade air cylinder 92, two material distribution frames 93 are respectively arranged below the second fixed frame 41, and a material distribution disc 94 is movably arranged in the material distribution frame 93.

[0069] The working principle and beneficial effects of the above technical solution are as follows: the variable-distance material placing mechanism 9 moves on the second track 43 and the third track 44 through the third moving part 91, the blade air cylinder 92 on the third moving part 91 controls the distance adjustment of the vacuum chuck, the vacuum chuck is used for sucking and placing the wafer 88, the material distribution disc 94 is movably arranged in the material distribution frame 93 below the second fixed frame 41, and is used for sorting and storing the wafer 88.

[0070] The blade air cylinder 92 realizes flexible adjustment of the distance between the chucks, the material distribution disc 94 moves in the material distribution frame 93, adapts to wafers 88 of different sizes, improves the versatility of the equipment, facilitates sorting of the wafers 88, and ensures stable grabbing by the vacuum chuck. The unqualified wafers 88 are respectively placed into the qualified and unqualified material distribution discs 94 for storage and then moved away, which optimizes the material placing process and improves the production efficiency and flexibility.

[0071] Obviously, the above embodiments are only examples for clearly illustrating, and are not intended to limit the implementation modes. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, it is not necessary and impossible to enumerate all the implementation modes. The obvious changes or variations derived therefrom are still within the protection scope of the application.

Claims

1. A wafer connector appearance inspection apparatus characterized by comprising: Including workbench (1), storage bin (2), track mechanism (4), transfer mechanical hand mechanism (3), five-face appearance detection mechanism (7) are respectively arranged on the workbench (1), single-face appearance detection mechanism (5), grabbing mechanism (6), variable-distance material placing mechanism (9) are movably arranged on the track mechanism (4); The track mechanism (4) includes a second fixed frame (41) and a third fixed frame (42), the second fixed frame (41) and the third fixed frame (42) are respectively fixedly arranged on the workbench (1), a second track (43) is fixedly arranged on the second fixed frame (41), a third track (44) is fixedly arranged on the third fixed frame (42), the single-face appearance detection mechanism (5) is movably arranged on the second track (43), the grabbing mechanism (6) is movably arranged on the third track (44), the second track (43) and the third track (44) movably arrange the variable-distance material placing mechanism (9) respectively; The five-face appearance detection mechanism (7) includes a fourth track (71), the fourth track (71) is fixedly arranged on the workbench (1), a right-angle plate (72) is movably arranged on the fourth track (71), a supporting plate (73) for placing a wafer connector (24) is arranged on the top of the right-angle plate (72), a taking-and-placing groove (74) is arranged in the center of the supporting plate (73), and a film expanding ring (75) is arranged on the bottom of the supporting plate (73); A first mechanical hand (82) is arranged on the second track (43), a second mechanical hand (83) is arranged on the third track (44), the first mechanical hand (82) and the second mechanical hand (83) are respectively provided with a linear rotary actuator (84) in structure, a plurality of suction nozzles (85) for sucking wafers (88) are arranged on the linear rotary actuator (84), and a plurality of CCD camera groups (86) for detecting different directions are arranged on the workbench (1) between the second fixed frame (41) and the third fixed frame (42); The CCD camera groups (86) are annularly distributed along the movement path of the wafer connector (24), and the CCD camera groups (86) include a front detection group, a left side detection group, a right side detection group, a front side detection group, a rear side detection group and a back detection group; The variable-distance material placing mechanism (9) includes a third moving part (91), the third moving part (91) is movably arranged on the second track (43) and the third track (44), a plurality of blade air cylinders (92) are arranged on the third moving part (91), a vacuum suction disc for sucking wafers (88) is arranged on the moving end of the blade air cylinder (92), two material distribution frames (93) are respectively arranged below the second fixed frame (41), and a material distribution disc (94) is movably arranged in the material distribution frame (93).

2. The wafer connector appearance inspection apparatus according to claim 1, characterized by: The material storage bin (2) comprises a first fixing frame (21) fixedly arranged on the workbench (1), a material taking groove (22) is arranged below the first fixing frame (21), and a plurality of clamping grooves (23) for placing wafer connectors (24) are arranged on the side wall of the first fixing frame (21).

3. The wafer connector appearance inspection apparatus according to claim 2, characterized by: The transfer mechanical arm mechanism (3) comprises a first track (31) fixedly arranged on the workbench (1) below the first fixing frame (21), a first moving part (32) movably arranged on the first track (31), a first supporting frame (33) fixedly arranged on the first moving part (32), a first lifting piece (34) arranged on the first supporting frame (33), and a material placing plate (35) fixedly arranged on the lifting end of the first lifting piece (34).

4. The wafer connector appearance inspection apparatus according to claim 3, characterized by: The single-side appearance detection mechanism (5) comprises a second supporting frame (51) movably arranged on the second track (43), a second lifting piece (52) fixedly arranged on one side of the second supporting frame (51), a clamping block (53) arranged on the lifting end of the second lifting piece (52), and a one-way detection element (54) arranged on the clamping block (53).

5. The wafer connector appearance inspection apparatus according to claim 4, characterized by: The grabbing mechanism (6) comprises a third supporting frame (61) movably arranged on the third track (44), a third lifting piece (62) fixedly arranged on one side of the third supporting frame (61), an arc-shaped frame (63) arranged on the lifting end of the third lifting piece (62), and a plurality of electrostatic chucking plates (64) arranged on the bottom of the arc-shaped frame (63).

6. The wafer connector appearance inspection apparatus according to claim 5, wherein: The fourth track (71) is provided with a fifth track (77) on both sides of the fourth track (71), the fifth track (77) is movably arranged on the second moving part (78), the fourth lifting piece (87) is arranged on the second moving part (78), the lifting end of the fourth lifting piece (87) is provided with a top PIN needle (79), the top PIN needle (79) is arranged at the center of the taking and placing groove (74), the two sides of the supporting plate (73) are provided with guide bars (80), and the other end of the guide bar (80) is provided with a empty material bin (81).

7. The wafer connector appearance inspection apparatus according to claim 6, characterized by: The top end of the top PIN needle (79) is provided with an elastic contact part, and the surface of the elastic contact part is provided with anti-skid lines.

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