A test device and process for gallium nitride device failure analysis

Abstract

The application relates to the technical field of gallium nitride device testing, in particular to a testing device for gallium nitride device failure analysis and a process, which comprises a simulation part, a fixed supporting base, a control display screen, a positioning adjustment control part, a detection positioning mounting part, a supporting bracket, a rotating adjustment gear ring, a driving gear and a first motor; the fixed supporting base is fixedly mounted at the bottom end of the supporting bracket; the rotating adjustment gear ring is rotatably clamped at the middle part of the upper end of the supporting bracket; and the driving gear is rotatably clamped at the edge of the upper end of the supporting bracket. The application integrates multiple functional modules, can complete the multi-parameter detection and environment simulation test of the gallium nitride device at one time, avoids the problems of single equipment function, complicated steps and inconvenient connection detection between different equipment in the traditional testing method, greatly shortens the detection time, and improves the detection efficiency.

Description

Technical Field

[0001] This invention relates to the field of gallium nitride device testing technology, specifically a testing device and process for gallium nitride device failure analysis. Background Technology

[0002] Gallium nitride (GaN), as a wide bandgap semiconductor material, possesses excellent properties such as high electron mobility, high breakdown electric field, and high saturation electron velocity, and has broad application prospects in high-frequency, high-power, and high-temperature electronic devices. However, in practical applications, GaN devices may fail due to various reasons. Accurately analyzing the failure causes of GaN devices is crucial for improving device reliability and stability and refining manufacturing processes.

[0003] Currently, commonly used gallium nitride (GaN) device testing methods mainly rely on traditional semiconductor testing equipment. These devices have certain functional limitations, making it difficult to conveniently limit and fix GaN devices of different sizes during failure analysis testing. The detection methods after limiting are limited, and multiple testing devices cannot be easily plugged into or connected to GaN devices. The principles and factors for detecting and analyzing GaN device failures are also limited. Furthermore, the testing process cannot simulate the environment in which the GaN device is used, resulting in inaccurate results. The testing steps are cumbersome, and connecting different devices is inconvenient. Moreover, existing GaN device failure analysis testing devices have a single testing mode and cannot automatically adapt to accurately utilize specific equipment to test and process GaN devices of a given specification. Therefore, there is an urgent need for a GaN device failure analysis testing device and process to solve the above problems. Summary of the Invention

[0004] To address the problems in the prior art, this invention provides a testing device and process for gallium nitride device failure analysis.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a testing device and process for gallium nitride device failure analysis, comprising a simulation unit, a fixed support base, a control display screen, a positioning adjustment control unit, a detection positioning mounting unit, a support bracket, a rotating adjustment gear ring, a drive gear, and a first motor. The fixed support base is fixedly installed at the bottom end of the support bracket. The rotating adjustment gear ring is rotatably engaged with the upper middle part of the support bracket. The drive gear is rotatably engaged with the upper edge of the support bracket, and the drive gear meshes with the rotating adjustment gear ring. The first motor is fixedly installed inside the support bracket, and the drive end of the first motor is fixedly connected to the bottom middle part of the drive gear. The positioning adjustment control unit is located at the upper middle part of the rotating adjustment gear ring. The simulation unit is located above the positioning adjustment control unit and the detection positioning mounting unit. The control display screen is uniformly fixedly installed on the side end of the simulation unit. The detection positioning mounting unit is located on the fixed support base, and the positioning adjustment control unit is located inside the detection positioning mounting unit.

[0006] Preferably, the positioning adjustment control unit includes a first electric push rod, a support plate, a sliding adjustment base, a second motor, a mounting support frame, a second electric push rod, a first sliding adjustment limit rod, a placement adjustment plate, a pressing and fixing plate, a lifting control plate, an adjusting threaded rod, a buffer protection spring, a second sliding adjustment limit rod, and an adjustment plate. The sliding adjustment base is slidably engaged with the support plate. The first electric push rod is fixedly installed on the upper ends of both sides of the support plate, and the front end of the first electric push rod is fixedly connected to the outer end of the sliding adjustment base. The mounting support frame is fixedly installed on the sliding adjustment base with bolts. The second motor is fixedly installed on the outer end of the mounting support frame. The bottom end of the placement adjustment plate is rotatably engaged inside the mounting support frame. The drive end of the second motor is fixedly connected to the outer end of the mounting support frame. The lifting control plate is located above the placement adjustment plate. The first sliding adjustment limit rod is fixedly installed at the bottom of both ends of the lifting control plate. The second electric push rod is fixedly installed at the bottom of both ends of the placement adjustment plate by bolts, and the bottom end of the second electric push rod is fixedly connected to the bottom of the first sliding adjustment limit rod. The first sliding adjustment limit rod passes through the placement adjustment plate, and the adjustment plate is located below the lifting control plate. The second sliding adjustment limit rod is fixedly installed at the upper part of both ends of the adjustment plate, and the second sliding adjustment limit rod slides and is engaged with the lifting control plate. The buffer protection spring is evenly fixedly connected to the bottom end of the adjustment plate. The pressing and fixing plate is fixedly connected to the bottom end of the buffer protection spring, and the pressing and fixing plate is located above the placement adjustment plate. The adjusting threaded rod is threaded and rotated through and inserted into the middle of the lifting control plate, and the bottom end of the adjusting threaded rod is rotated and engaged with the upper middle part of the adjustment plate.

[0007] Preferably, the detection and positioning mounting part includes a mounting frame, fixed mounting holes, a third electric push rod, a lifting and adjusting bracket, and a fourth electric push rod. The fourth electric push rods are evenly distributed, and the upper end of the fourth electric push rod is fixedly connected to the bottom end of the lifting and adjusting bracket by bolts. The mounting frame is evenly slidably engaged with the lifting and adjusting bracket. The third electric push rods are evenly and symmetrically fixedly installed on the lifting and adjusting bracket, and the front end of the third electric push rod is fixedly connected to the side end of the mounting frame. The fixed mounting holes are evenly opened on both sides of the mounting frame.

[0008] Preferably, an auxiliary mounting slot is provided in the middle of the fixed mounting hole, and fixing holes are provided on both sides of the auxiliary mounting slot.

[0009] Preferably, the simulation unit includes a simulation cover, a hot air blower, a fifth electric push rod, a temperature sensor, and a delivery pipe. The fifth electric push rods are evenly distributed, and the upper ends of the fifth electric push rods are fixedly connected to the bottom edge of the simulation cover by bolts. The hot air blower is fixedly installed in the middle of the upper end of the simulation cover. The delivery pipe is fixedly connected to the bottom end of the hot air blower and is located inside the simulation cover. The temperature sensor is evenly fixedly installed inside the simulation cover.

[0010] Preferably, the bottom end of the fifth electric push rod is fixedly mounted on the fixed support base by bolts, and the mounting bracket is located below the simulation cover.

[0011] Preferably, the fourth electric push rod is fixedly connected to the fixed support base, and the mounting bracket is distributed around the placement adjustment plate.

[0012] Preferably, the bottom center of the support plate is fixedly connected to the upper center of the rotating adjustment gear ring, and an angle sensor for detecting the rotation of the adjustment plate is provided on the side of the mounting support frame away from the second motor.

[0013] Preferably, solenoid valves are uniformly fixedly installed on the simulation hood, a connecting pipe is fixedly installed in the middle of the solenoid valve, and spray pipes are uniformly fixedly installed inside the simulation hood, and the spray pipes are connected to the connecting pipes.

[0014] Preferably, a selection control panel is fixedly installed on one side of the upper end of the simulation cover. Three auxiliary analysis and testing devices are evenly arranged on the outer side of the fixed support base. An auxiliary support bracket is fixedly installed at the center of the bottom end of the fixed support base. The auxiliary analysis and testing devices are staggered with the support base. Each auxiliary analysis and testing device includes a sixth electric push rod, a support base, a rotation control gear ring, a rotation retaining ring, a first auxiliary failure analysis and testing device, a second auxiliary failure analysis and testing device, a support arm, a support column, a third motor, a mounting plate, and a second drive gear. The sixth electric push rod is evenly and symmetrically distributed on the outer side of the support base, and its front end is fixedly connected to the outer end of the support base. The bottom end of the support column is fixedly connected to the center of the support base. The rotation retaining ring is rotatably engaged with the upper end of the support column. The rotation control gear ring is fixedly connected to the support arm. The support arm is fixedly connected to the bottom end of the rotating retaining ring. The first auxiliary failure analysis test device and the second auxiliary failure analysis test device are respectively fixedly installed on the upper part of both ends of the support arm. The first auxiliary failure analysis test device and the second auxiliary failure analysis test device have the same structure. The mounting plate is fixedly installed on the support column. The third motor is fixedly installed on the bottom end of the mounting plate. The second drive gear is rotatably engaged on the mounting plate, and the drive end of the third motor passes through the mounting plate and is fixedly connected to the middle of the second drive gear. The second drive gear is internally meshed with the rotating control gear ring. The sixth electric push rod is fixed on the fixed support base. Both the first auxiliary failure analysis test device and the second auxiliary failure analysis test device include a test platform, a control box, a display panel, a moving slot, a device moving mechanism, test contacts, and testing equipment.

[0015] A gallium nitride device failure analysis process includes the following steps:

[0016] S1. Pretreatment and Installation

[0017] A preliminary optical microscopic examination is performed on the failed gallium nitride device under test to record appearance defects such as cracks, burns, corrosion, and grid cavities. The device is activated by controlling the display screen, and each electric push rod and motor returns to its initial zero position. The fifth electric push rod is controlled to raise the simulation cover to the highest point, providing a wide operating space. The fourth electric push rod is controlled to lower the lifting and adjusting bracket to the low position, facilitating the installation of the testing equipment. Based on the initially suspected failure mode, a suitable testing equipment is selected and installed onto different mounting brackets through the fixed mounting holes and auxiliary mounting slots. The third electric push rod is used to initially adjust its horizontal position so that its probe or interface faces the center. The failed gallium nitride device is manually placed in the center of the placement adjustment plate. The second electric push rod is activated by controlling the display screen to drive the lifting control plate to descend, so that the pressing and fixing plate initially presses down on the device. The adjusting thread rod is manually finely adjusted to precisely control the downward pressing distance of the adjustment plate. Combined with the buffer protection spring, a stable and non-destructive fixation of the device is achieved.

[0018] S2, Electrical Connections and Preliminary Testing

[0019] By controlling the first electric push rod through the display screen, the position of the sliding adjustment base on the support plate is finely adjusted. The first motor drives the drive gear and rotates the adjustment ring, causing the entire positioning adjustment control unit and device to rotate on the horizontal plane. The second motor drives the placement adjustment plate to tilt at a preset angle. Combined with the feedback from the angle sensor on the side of the mounting support frame, through multi-dimensional adjustments, the pads or pins on the device are precisely aligned and physically connected with the test equipment probes on the target mounting frame. Under room temperature conditions, the connected test equipment program is executed sequentially to perform preliminary electrical tests.

[0020] S3. Failure Reproduction and Testing under Environmental Stress

[0021] The fifth electric push rod is controlled to lower the simulation cover, forming a sealed cavity. The hot air blower is started, and hot air is delivered into the cavity through the delivery pipe. The target high temperature inside the cavity is precisely controlled and maintained through the feedback of the temperature sensor. Under high temperature conditions, the electrical test in step 2 is repeated to observe the trend of parameter changes with temperature and determine whether there are thermal stability problems or temperature-related failure mechanisms. An external humid gas source is connected to the solenoid valve. At the set temperature, the solenoid valve is opened, and humid gas is evenly introduced into the simulation cover cavity through the spray pipe to simulate a high humidity environment. Under this condition, a delay test or intermittent electrical test is performed to evaluate the device's resistance to moisture and reliability, and to check whether the parameters drift or fail due to moisture intrusion.

[0022] S4. Multi-angle analysis and data synthesis

[0023] After completing the test at one angle, without opening the simulation cover, the device can be rotated and tilted to a new angle by controlling the first and second motors, and then connected and tested with another testing device on the mounting bracket. This allows for rapid switching between multiple analysis modes without re-fixing the device. Throughout the entire testing process, all data and environmental parameters of the testing equipment are collected in real time and displayed on the control screen. The system automatically records and stores the data for subsequent analysis.

[0024] This invention has at least the following beneficial effects:

[0025] I. This invention utilizes a first electric push rod to move the sliding adjustment base laterally, and a second electric push rod to drive the first sliding adjustment limit rod to raise and lower the lifting control plate, which in turn drives the pressing and fixing plate to press and fix the gallium nitride device. Tightening the adjusting thread rod allows for precise adjustment of the adjustment plate position, enabling the pressing and fixing plate to fix gallium nitride devices of different sizes. A buffer spring provides cushioning protection, ensuring both effective fixing and preventing damage to the device. A second motor controls the tilt angle of the adjusted plate and the fixed gallium nitride device. Combined with the angle sensor on the side of the mounting support frame, the tilt angle of the gallium nitride device can be precisely controlled, facilitating accurate docking with testing equipment on various mounting frames and meeting diverse testing needs. The first motor drives the drive gear to rotate, which in turn drives the rotating adjustment gear ring to rotate, causing the entire positioning adjustment control unit to rotate, thus rotating the gallium nitride device. This facilitates docking and testing with testing equipment in different positions, improving testing flexibility and efficiency.

[0026] II. The uniformly distributed mounting bracket of this invention can accommodate various testing and inspection equipment, such as semiconductor parameter analyzers, curve tracers, and thermal resistance and thermal characteristic testers. This enables comprehensive detection and analysis of different failure factors in gallium nitride (GaN) devices, achieving one-stop multi-parameter testing and improving the comprehensiveness and efficiency of the testing. The auxiliary mounting slots help fix the mounting support bracket, allowing adjustment and control of the height and position of the testing and inspection equipment mounted on the bracket. This facilitates connection or interlocking with the GaN device testing process, further enhancing the flexibility and accuracy of the testing. The environment is realistically simulated; the simulation cover can be lowered by the fifth electric push rod to cover the GaN device and the corresponding docked testing equipment. A hot air blower delivers hot air into the simulation cover through a delivery pipe, and a temperature sensor monitors the temperature in real time, simulating a high-temperature environment to analyze the impact of high temperatures on GaN device failure. The solenoid valves, connecting pipes, and spray pipes on the simulation cover are connected to the delivery... The delivery hose can transport humid gas into the simulation chamber to simulate a humid environment, thereby analyzing and determining whether humidity is related to the failure of gallium nitride devices, making the test analysis results more accurate and comprehensive. The control display screen is evenly and fixedly installed on the side of the simulation chamber, allowing operators to operate and control the entire testing device, set various test parameters such as temperature, humidity, and rotation angle, and display the detected data and information on the control display screen after analysis by the analysis module. Operators can observe various data and images in real time during the test process, realizing comprehensive monitoring and management of the gallium nitride device failure analysis test process. The operation is simple and intuitive. This device integrates multiple functional modules and can complete multi-parameter detection and environmental simulation testing of gallium nitride devices in one go. It avoids the problems of single equipment function, cumbersome steps, and inconvenient connection between different devices in traditional testing methods, greatly shortening the test time and improving the test efficiency.

[0027] Third, this invention sets up multiple auxiliary analysis and testing devices, which can accurately select and match auxiliary failure analysis and testing devices at designated locations to complete the analysis and detection process for different types and specifications of gallium nitride devices. This makes the detection modes more diverse and the detection and analysis results more accurate. In addition, the specific auxiliary failure analysis and testing device can be quickly and accurately selected and used during the analysis and detection process. Attached Figure Description

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0029] Figure 1 This is a schematic diagram of the main three-dimensional structure of the present invention;

[0030] Figure 2 This is a schematic diagram of the upper structure of the fixed support base in this invention;

[0031] Figure 3This is a schematic diagram of the upper structure of the support bracket in this invention;

[0032] Figure 4 This is a schematic diagram of the internal structure of the support bracket in this invention;

[0033] Figure 5 This is a schematic diagram of the positioning adjustment control unit in the present invention;

[0034] Figure 6 This is a side-view three-dimensional structural diagram of the positioning adjustment control unit in this invention;

[0035] Figure 7 This is a schematic diagram of the detection and positioning mounting part in this invention;

[0036] Figure 8 This is a schematic diagram of the simulation unit structure in this invention;

[0037] Figure 9 This is a schematic diagram of the internal structure of the simulation unit in this invention;

[0038] Figure 10 This is a schematic diagram of the outer structure of the main body in this invention;

[0039] Figure 11 This is a schematic diagram of the auxiliary analysis and testing device in this invention;

[0040] Figure 12 This is a schematic diagram of the internal structure of the auxiliary analysis and testing device in this invention.

[0041] In the diagram: 1. Simulation unit; 2. Fixed support base; 3. Control display screen; 4. Positioning and adjustment control unit; 5. Detection and positioning mounting unit; 6. Support bracket; 7. Rotation adjustment gear ring; 8. Drive gear; 9. First motor; 10. First electric push rod; 11. Support plate; 12. Sliding adjustment base; 13. Second motor; 14. Mounting support frame; 15. Second electric push rod; 16. First sliding adjustment limit rod; 17. Placement adjustment plate; 18. Pressing fixed plate; 19. Lifting control plate; 20. Adjustment threaded rod; 21. Buffer protection spring; 22. Second sliding adjustment limit rod; 23. Adjustment plate; 24. Mounting frame; 25. Fixed mounting hole; 26. Auxiliary mounting plate. 27. Mounting slot; 28. Third electric actuator; 29. ​​Lifting and adjusting bracket; 30. Fourth electric actuator; 31. Simulation cover; 32. Hot air blower; 33. Connecting pipe; 34. Solenoid valve; 35. Fifth electric actuator; 36. Spray pipe; 37. Temperature sensor; 38. Delivery pipe; 39. Auxiliary support bracket; 40. Selection control panel; 41. Auxiliary analysis and testing device; 42. Sixth electric actuator; 43. Support base; 44. Rotation control gear ring; 45. Rotation retaining ring; 46. First auxiliary failure analysis and testing device; 47. Second auxiliary failure analysis and testing device; 48. Support arm; 49. Support column; 50. Third electric motor; 51. Mounting plate; 52. Second drive gear. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Example 1

[0044] like Figure 1-4As shown, a testing device and process for gallium nitride device failure analysis according to the present invention includes a simulation unit 1, a fixed support base 2, a control display screen 3, a positioning adjustment control unit 4, a detection positioning mounting unit 5, a support bracket 6, a rotating adjustment gear ring 7, a drive gear 8, and a first motor 9. The fixed support base 2 is fixedly installed at the bottom end of the support bracket 6. The rotating adjustment gear ring 7 is rotatably engaged with the middle of the upper end of the support bracket 6. The drive gear 8 is rotatably engaged with the upper edge of the support bracket 6, and the drive gear 8 is meshed with the rotating adjustment gear ring 7. The first motor 9 is fixedly installed... Inside the support bracket 6, the drive end of the first motor 9 is fixedly connected to the bottom center of the drive gear 8. The positioning adjustment control unit 4 is located at the upper center of the rotating adjustment gear ring 7. The simulation unit 1 is located above the positioning adjustment control unit 4 and the detection positioning mounting unit 5. The control display screen 3 is evenly fixedly installed on the side of the simulation unit 1. The detection positioning mounting unit 5 is located on the fixed support base 2, and the positioning adjustment control unit 4 is located inside the detection positioning mounting unit 5. Starting the first motor 9 to drive the drive gear 8 to rotate can synchronously control the rotation adjustment gear ring 7 to rotate and adjust.

[0045] like Figure 5-6As shown, the positioning adjustment control unit 4 includes a first electric push rod 10, a support plate 11, a sliding adjustment base 12, a second motor 13, a mounting support frame 14, a second electric push rod 15, a first sliding adjustment limit rod 16, a placement adjustment plate 17, a pressing fixing plate 18, a lifting control plate 19, an adjustment threaded rod 20, a buffer protection spring 21, a second sliding adjustment limit rod 22, and an adjustment plate 23. The sliding adjustment base 12 is slidably engaged with the support plate 11. The first electric push rod 10 is fixedly installed on the upper ends of both sides of the support plate 11, and the front end of the first electric push rod 10 is fixedly connected to the outer end of the sliding adjustment base 12. The mounting support frame 14 is fixedly installed on the sliding adjustment base 12 by bolts. The second motor 13 is fixedly mounted on the support plate 11. The bottom end of the adjustment plate 17 is rotatably engaged inside the mounting support frame 14, which is mounted on the outer end of the mounting support frame 14. The drive end of the second motor 13 is fixedly connected to the outer end of the mounting support frame 14. The lifting control plate 19 is positioned above the adjustment plate 17. The first sliding adjustment limit rod 16 is fixedly installed at the bottom of both ends of the lifting control plate 19. The second electric push rod 15 is fixedly installed at the bottom of both ends of the adjustment plate 17 by bolts, and the bottom end of the second electric push rod 15 is fixedly connected to the bottom of the first sliding adjustment limit rod 16. The first sliding adjustment limit rod 16 passes through the adjustment plate 17. The adjustment plate 23 is positioned below the lifting control plate 19, and the second sliding adjustment limit rod 22 is fixedly installed at the upper ends of both ends of the adjustment plate 23. The second sliding adjustment limit rod 22 is slidably engaged with the lifting control plate 19. The buffer protection spring 21 is evenly fixedly connected to the bottom end of the adjustment plate 23. The pressing and fixing plate 18 is fixedly connected to the bottom end of the buffer protection spring 21, and the pressing and fixing plate 18 is located above the placement adjustment plate 17. The adjusting threaded rod 20 is threadedly inserted through the middle of the lifting control plate 19, and the bottom end of the adjusting threaded rod 20 is rotatably engaged with the upper middle part of the adjustment plate 23. After the gallium nitride device is placed on the placement adjustment plate 17, activating the second electric push rod 15 can cause the first sliding adjustment limit rod 16 to slide downward along the placement adjustment plate 17, thereby driving the lifting control plate 19 to move downward, thereby driving the adjustment plate 23 set at the bottom of the lifting control plate 19. 3. The pressing and fixing plate 18 moves downward, allowing it to press and fix the gallium nitride device placed on the adjustment plate 17. The adjustment plate 23 can be raised and lowered by turning the adjusting threaded rod 20. Adjusting the position of the adjustment plate 23 allows it to slide stably on the lifting control plate 19 via the second sliding adjustment limit rod 22, achieving stable lifting and lowering. This allows the pressing and fixing plate 18 to press and fix gallium nitride devices of different sizes. The buffer protection spring 21 provides cushioning protection, ensuring sufficient pressing and fixing without damaging the gallium nitride device. Starting the second motor 13 controls the tilt angle of the adjustment plate 17 and the fixed gallium nitride device.This allows the rotating adjusting gear ring 7 to rotate, thereby causing the gallium nitride device to rotate, and then precisely mate or connect with the ranging devices installed on each mounting bracket 24.

[0046] like Figure 7 As shown, the detection and positioning mounting part 5 includes a mounting frame 24, fixed mounting holes 25, a third electric push rod 27, a lifting and adjusting bracket 28, and a fourth electric push rod 29. The fourth electric push rods 29 are evenly distributed, and the upper end of the fourth electric push rod 29 is fixedly connected to the bottom end of the lifting and adjusting bracket 28 by bolts. The mounting frame 24 is evenly slidably engaged on the lifting and adjusting bracket 28. The third electric push rods 27 are evenly and symmetrically fixedly installed on the lifting and adjusting bracket 28, and the front end of the third electric push rod 27 is fixedly connected to the side end of the mounting frame 24. The fixed mounting holes 25 are evenly opened on both sides of the mounting frame 24. The evenly distributed mounting frame 24 can install different testing and detection equipment, and can detect and analyze different failure factors of gallium nitride devices.

[0047] An auxiliary mounting slot 26 is provided in the middle of the fixed mounting hole 25, and fixing holes are provided on both sides of the auxiliary mounting slot 26. The auxiliary mounting slot 26 can be used to fix the support frame, adjust and control the height and position of the testing and detection equipment installed on the mounting frame 24, and facilitate connection or interlocking with the gallium nitride device testing process.

[0048] like Figure 8-9 As shown, the simulation unit 1 includes a simulation cover 30, a hot air blower 31, a fifth electric push rod 34, a temperature sensor 36, and a delivery pipe 37. The fifth electric push rods 34 are evenly distributed, and their upper ends are fixedly connected to the bottom edge of the simulation cover 30 by bolts. The hot air blower 31 is fixedly installed in the middle of the upper end of the simulation cover 30. The delivery pipe 37 is fixedly connected to the bottom end of the hot air blower 31 and is located inside the simulation cover 30. The temperature sensor 36 is evenly fixedly installed inside the simulation cover 30. The bottom end of the fifth electric push rod 34 is fixedly installed on the fixed support base 2 by bolts. The mounting bracket 24 is located below the simulation cover 30. After the fifth electric push rod 34 is activated to control the simulation cover 30 to descend, it can cover the gallium nitride device and the corresponding docked testing equipment. The hot air blower 31 is activated to simulate testing under high temperature conditions, making the test and detection results more realistic and accurate.

[0049] The fourth electric push rod 29 is fixedly connected to the fixed support base 2, and the mounting brackets 24 are distributed around the adjustment plate 17. The mounting brackets 24, which are evenly distributed, can be used to install related testing and analysis equipment such as semiconductor parameter analyzers, curve trackers, and thermal resistance and thermal characteristic testers.

[0050] The bottom center of the support plate 11 is fixedly connected to the upper center of the rotating adjustment gear ring 7. The side of the mounting support frame 14 away from the second motor 13 is provided with an angle sensor for detecting the rotation of the placement adjustment plate 17. The angle sensor can accurately control the tilt angle of the gallium nitride device fixed on the placement adjustment plate 17, which facilitates precise insertion and connection with the testing equipment set on each mounting frame 24.

[0051] like Figure 10-12As shown, a selection control panel 39 is fixedly installed on one side of the upper end of the simulation cover 30. Three auxiliary analysis and testing devices 40 are evenly arranged on the outer side of the fixed support base 2. An auxiliary support bracket 38 is fixedly installed in the middle of the bottom end of the fixed support base 2. The auxiliary analysis and testing devices 40 and 34 are staggered. Each auxiliary analysis and testing device 40 includes a sixth electric push rod 41, a support base 42, a rotation control gear ring 43, a rotation retaining ring 44, a first auxiliary failure analysis and testing device 45, a second auxiliary failure analysis and testing device 46, a support arm 47, a support column 48, a third motor 49, a mounting plate 50, and a second drive gear 51. The sixth electric push rod 41... The components are evenly and symmetrically distributed on the outside of the support base 42, and the front end of the sixth electric push rod 41 is fixedly connected to the outer end of the support base 42. The bottom end of the support column 48 is fixedly connected to the middle of the support base 42. The rotating retaining ring 44 is rotatably engaged with the upper end of the support column 48. The rotating control gear ring 43 is fixedly connected to the bottom end of the rotating retaining ring 44. The support arm 47 is fixedly connected to the rotating retaining ring 44. The first auxiliary failure analysis test device 45 and the second auxiliary failure analysis test device 46 are respectively fixedly installed on the upper parts of both ends of the support arm 47. The first auxiliary failure analysis test device 45 and the second auxiliary failure analysis test device 46 have the same structure. The mounting plate 50 is fixedly installed on the support column 48. The third motor 4... 9 is fixedly installed at the bottom of the mounting plate 50. The second drive gear 51 is rotatably engaged with the mounting plate 50, and the drive end of the third motor 49 passes through the mounting plate 50 and is fixedly connected to the middle of the second drive gear 51. The second drive gear 51 is internally meshed with the rotation control gear ring 43. The sixth electric push rod 41 is fixed on the fixed support base 2. The first auxiliary failure analysis test device 45 and the second auxiliary failure analysis test device 46 both include a test platform, a control box, a display panel, a moving slot, a device moving mechanism, test contacts, and testing equipment. The testing equipment is a scanning electron microscope or a transmission electron microscope or other qualified testing equipment. The test platform provides support and a fixed platform for the entire device. The control box has a built-in control circuit and data processing system, responsible for controlling the operation of the device and processing data. The display panel is electrically connected to the control box and is used to display information such as test parameters, test results, and device operating status. The moving slot is located at the top of the test bench and is used to place the gallium nitride device under test (GaN) and provide a moving track for the device moving mechanism. The device moving mechanism is installed in the moving slot and can realize the automatic delivery and precise positioning of the GaN device under test, accurately delivering it to the area below the test contact. The test contact contacts the GaN device under test for transmitting test signals and collecting test data. Various detection devices are installed around the test bench, which can perform different aspects of detection and analysis on the GaN device according to the test requirements.

[0052] In this embodiment, the first motor 9 is started, driving the drive gear 8 to rotate, which in turn drives the rotating adjustment gear ring 7 to rotate and adjust, providing power for the subsequent rotation operation of the gallium nitride device. The gallium nitride device is placed on the placement adjustment plate 17, and the second electric push rod 15 is started, causing the first sliding adjustment limit rod 16 to slide downward along the placement adjustment plate 17, driving the lifting control plate 19 to move downward, which in turn drives the adjustment plate 23 and the pressing and fixing plate 18 to move downward, thereby achieving the compression and fixing of the gallium nitride device. By turning the adjusting threaded rod 20, the lifting position of the adjustment plate 23 can be controlled and adjusted, so that the adjustment plate 23 slides stably on the lifting control plate 19 with the help of the second sliding adjustment limit rod 22, achieving stable lifting. The system allows for the adjustment and fixation of gallium nitride (GaN) devices of different sizes. Simultaneously, the buffer spring 21 provides cushioning protection, ensuring both sufficient pressure and fixation of the GaN devices while preventing damage. Starting the second motor 13 controls the tilt angle of the mounting support frame 14, the adjustment plate 17, and the fixed GaN devices. Rotating the adjustment gear ring 7 rotates the positioning adjustment control unit 4, enabling precise insertion or connection of the GaN devices with the ranging devices mounted on each mounting frame 24. An angle sensor is located on the side of the mounting support frame 14 away from the second motor 13, precisely controlling the tilt angle of the GaN devices fixed on the adjustment plate 17 to ensure accurate docking with the testing equipment.

[0053] The evenly distributed mounting brackets 24 can accommodate various testing and inspection equipment, such as semiconductor parameter analyzers, curve tracers, and thermal resistance and thermal characteristic testers, for detecting and analyzing different failure factors of gallium nitride devices. The auxiliary mounting slots 26 assist in fixing the mounting support frame, adjusting and controlling the height and position of the testing and inspection equipment mounted on the mounting brackets 24, facilitating connection or interlocking with the gallium nitride device testing process. Activating the fifth electric push rod 34 lowers the simulation cover 30, enclosing the gallium nitride device and the corresponding docked testing equipment. Activating the hot air blower 31 delivers hot air into the simulation cover 30 through the delivery pipe 37, simulating a high-temperature environment. Temperature sensor 36 monitors the internal temperature of simulation cover 30 in real time, making the test and detection results more realistic and accurate. It can analyze the impact of high temperature on gallium nitride device failure and further improve the accuracy of detection and analysis results. The control display screen 3 is uniformly fixed on the side of simulation cover 30. The operator can operate and control the entire test device through the control display screen 3, set various test parameters such as temperature, humidity, and rotation angle, and the detected data and information are displayed on the control display screen 3 after being analyzed by the analysis module. The operator can observe various data and images in real time during the test process and realize comprehensive monitoring and management of the gallium nitride device failure analysis test process.

[0054] When the gallium nitride (GaN) device to be tested does not require simulated environmental analysis, the corresponding GaN device parameters and specifications can be input through the control panel 39. The control panel 39 then controls the operation of the sixth electric push rod 41 and the third motor 49 in the corresponding auxiliary analysis and testing device 40. The sixth electric push rod 41 allows the auxiliary analysis and testing device 40 adapted to the device to be analyzed to slide outwards, enabling the testing personnel to accurately and quickly select and use the corresponding auxiliary analysis and testing device 40. This allows different types and specifications of GaN devices to be accurately analyzed by the designated testing device. The third motor 49 drives the second drive gear 51 to rotate, which in turn controls the gear ring 43 to rotate the retaining ring 44 and the support arm 47. This causes the first auxiliary failure analysis and testing device 45 and the second auxiliary failure analysis and testing device 46 to rotate, moving either the first auxiliary failure analysis and testing device 45 or the second auxiliary failure analysis and testing device 46 to the outside. The moved auxiliary failure analysis and testing device 45 or the second auxiliary failure analysis and testing device 46 can then perform the GaN device testing. Three auxiliary analysis and testing devices 40 are evenly arranged. Each auxiliary analysis and testing device 40 is equipped with a first auxiliary failure analysis and testing device 45 and a second auxiliary failure analysis and testing device 46. This allows the device to accurately adapt and test various types of gallium nitride devices, and also makes the testing modes of gallium nitride devices diverse, resulting in more comprehensive test and analysis results. The test benches in the first auxiliary failure analysis and testing devices 45 and the second auxiliary failure analysis and testing devices 46 provide support and a fixed platform for the entire device. The control box has built-in control circuits and data processing systems, which are responsible for controlling the operation of the device and processing data. The display panel is electrically connected to the control box and is used to display test parameters, test results, and device operating status. The moving slot is located at the top of the test bench and is used to place the gallium nitride device under test and provide a moving track for the device moving mechanism. The device moving mechanism is installed in the moving slot and can realize the automatic delivery and precise positioning of the gallium nitride device under test, accurately delivering it to the area below the test contact. The test contact contacts the gallium nitride device under test for transmitting test signals and collecting test data. Various testing devices are installed around the test bench, which can perform different aspects of testing and analysis on gallium nitride devices according to testing needs.

[0055] Example 2

[0056] Based on Example 1, such as Figure 8-9 As shown, solenoid valves 33 are uniformly fixedly installed on the simulation hood 30, and a connecting pipe 32 is fixedly installed in the middle of the solenoid valve 33. Spray pipes 35 are uniformly fixedly installed inside the simulation hood 30, and the spray pipes 35 are connected to the connecting pipes 32.

[0057] In implementing this embodiment, by connecting the connecting pipe 32 to the delivery hose, humid gas can be delivered to the interior of the simulation chamber 30, thereby simulating a humid environment during the testing process. This allows for analysis and judgment on whether humidity is related to the failure of gallium nitride devices, making the test and analysis results more accurate and comprehensive.

[0058] A gallium nitride device failure analysis process includes the following steps:

[0059] S1. Pretreatment and Installation

[0060] A preliminary optical microscopic inspection is performed on the failed gallium nitride device under test to record appearance defects such as cracks, burns, corrosion, and grid cavities. The device is activated by controlling the display screen 3, and each electric push rod and motor returns to its initial zero position. The fifth electric push rod 34 is controlled to raise the simulation cover 30 to the highest point, providing a wide operating space. The fourth electric push rod 29 is controlled to lower the lifting adjustment bracket 28 to the low position to facilitate the installation of the testing equipment. According to the initially suspected failure mode, a suitable testing equipment is selected and installed on different mounting brackets 24 through the fixed mounting holes 25 and auxiliary mounting slots 26. The horizontal position is initially adjusted by the third electric push rod 27 so that the probe or interface faces the center. The failed gallium nitride device is manually placed in the center of the placement adjustment plate 17. The second electric push rod 15 is activated by controlling the display screen 3 to drive the lifting control plate 19 to descend, so that the pressing fixing plate 18 initially presses the device. The adjusting thread rod 20 is manually finely adjusted to control the downward pressing distance of the adjustment plate 23. Combined with the buffer protection spring 21, the device is fixed securely and without damage.

[0061] S2, Electrical Connections and Preliminary Testing

[0062] By controlling the first electric push rod 10 through the control display screen 3, the position of the sliding adjustment base 12 on the support plate 11 is finely adjusted. The first motor 9 is controlled to drive the drive gear 8 and rotate the adjustment gear ring 7, thereby driving the entire positioning adjustment control unit 4 and the device to rotate on the horizontal plane. The second motor 13 is controlled to drive the placement adjustment plate 17 to tilt at a preset angle. Combined with the feedback from the angle sensor on the side of the mounting support frame 14, through multi-dimensional adjustment, the pads or pins on the device are precisely aligned and physically connected with the test equipment probes on the target mounting frame 24. Under room temperature conditions, the connected test equipment program is executed sequentially to perform preliminary electrical tests.

[0063] S3. Failure Reproduction and Testing under Environmental Stress

[0064] The fifth electric push rod 34 is controlled to lower the simulation cover 30, forming a sealed cavity. The hot air blower 31 is started, and hot air is delivered into the cavity through the delivery pipe 37. The target high temperature in the cavity is precisely controlled and maintained through the feedback of the temperature sensor 36. Under high temperature conditions, the electrical test in step 2 is repeated to observe the trend of parameter changes with temperature and determine whether there is a thermal stability problem or a temperature-related failure mechanism. An external humid gas source is connected to the solenoid valve 33. At the set temperature, the solenoid valve 33 is opened, and the humid gas is evenly introduced into the cavity of the simulation cover 30 through the spray pipe 35 to simulate a high humidity environment. Under this condition, a delay test or intermittent electrical test is performed to evaluate the device's resistance to moisture and reliability, and to check whether the parameters drift or fail due to moisture intrusion.

[0065] S4. Multi-angle analysis and data synthesis

[0066] After completing the test at one angle, without opening the simulation cover, the device can be rotated and tilted to a new angle by controlling the first motor 9 and the second motor 13. This allows for connection and testing with another testing device on the mounting bracket 24, enabling rapid switching between multiple analysis modes without re-fixing the device. Throughout the testing process, all data and environmental parameters from the testing devices are collected in real time and displayed on the control display screen 3. The system automatically records and stores the data for subsequent analysis.

[0067] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A testing device for gallium nitride device failure analysis, comprising a simulation unit (1), a fixed support base (2), a control display screen (3), a positioning adjustment control unit (4), a detection positioning mounting unit (5), a support bracket (6), a rotation adjustment gear ring (7), a drive gear (8), and a first motor (9), characterized in that: The fixed support base (2) is fixedly installed at the bottom end of the support bracket (6), the rotating adjusting tooth ring (7) is rotatably connected at the middle of the upper end of the support bracket (6), the driving gear (8) is rotatably connected at the edge of the upper end of the support bracket (6), and the driving gear (8) is meshingly connected with the rotating adjusting tooth ring (7), the first motor (9) is fixedly installed at the inside of the support bracket (6), and the driving end of the first motor (9) is fixedly connected with the middle of the bottom end of the driving gear (8), the positioning adjusting control part (4) is arranged at the middle of the upper end of the rotating adjusting tooth ring (7), the simulation part (1) is arranged above the positioning adjusting control part (4) and the detection positioning mounting part (5), the control display screen (3) is uniformly fixedly installed at the side end of the simulation part (1), and the detection positioning mounting part (5) is arranged on the fixed support base (2), and the positioning adjusting control part (4) is located at the inside of the detection positioning mounting part (5).

2. The test apparatus of claim 1, wherein: the test apparatus is configured to perform a test of the GaN device to determine whether the GaN device is functional or non-functional. The positioning adjusting control unit (4) comprises a first electric push rod (10), a supporting plate (11), a sliding adjusting base (12), a second electric motor (13), a mounting supporting frame (14), a second electric push rod (15), a first sliding adjusting limiting rod (16), a placing adjusting plate (17), a pressing fixing plate (18), a lifting control plate (19), an adjusting screw rod (20), a buffer protection spring (21), a second sliding adjusting limiting rod (22) and an adjusting plate (23), the sliding adjusting base (12) is slidingly clamped on the supporting plate (11), the first electric push rod (10) is fixedly installed on the both-side upper ends of the supporting plate (11), the front end of the first electric push rod (10) is fixedly connected with the outer side of the end of the sliding adjusting base (12), the mounting supporting frame (14) is fixedly installed on the sliding adjusting base (12) through bolts, the second electric motor (13) is fixedly installed on the outer side end of the mounting supporting frame (14), the bottom end of the placing adjusting plate (17) is rotatably clamped in the mounting supporting frame (14), the driving end of the second electric motor (13) is fixedly connected with the outer side end of the mounting supporting frame (14), the lifting control plate (19) is arranged above the placing adjusting plate (17), the first sliding adjusting limiting rod (16) is fixedly installed at the both-end bottom of the lifting control plate (19), the second electric push rod (15) is fixedly installed at the both-end bottom of the placing adjusting plate (17), and the bottom end of the second electric push rod (15) is fixedly connected with the bottom of the first sliding adjusting limiting rod (16), the first sliding adjusting limiting rod (16) penetrates through the placing adjusting plate (17), the adjusting plate (23) is arranged below the lifting control plate (19), the second sliding adjusting limiting rod (22) is fixedly installed at the both-end upper part of the adjusting plate (23), and the second sliding adjusting limiting rod (22) penetrates and slidingly clamps on the lifting control plate (19), the buffer protection springs (21) are uniformly fixedly connected at the bottom end of the adjusting plate (23), the pressing fixing plate (18) is fixedly connected at the bottom end of the buffer protection spring (21), and the pressing fixing plate (18) is located above the placing adjusting plate (17), the adjusting screw rod (20) is threadedly rotatable and penetrates and is inserted in the middle part of the lifting control plate (19), and the bottom end of the adjusting screw rod (20) is rotatably clamped at the upper-end middle part of the adjusting plate (23).

3. A test apparatus for failure analysis of a gallium nitride device as defined in claim 2, wherein: The detection positioning mounting portion (5) comprises a mounting frame (24), fixed mounting holes (25), third electric push rods (27), a lifting adjusting bracket (28) and fourth electric push rods (29), the fourth electric push rods (29) are uniformly distributed, the upper ends of the fourth electric push rods (29) are fixedly connected to the bottom end of the lifting adjusting bracket (28) through bolts, the mounting frame (24) is uniformly and slidingly connected to the lifting adjusting bracket (28), the third electric push rods (27) are uniformly and symmetrically fixedly installed on the lifting adjusting bracket (28), and the front ends of the third electric push rods (27) are fixedly connected to the side ends of the mounting frame (24), the fixed mounting holes (25) are uniformly formed in the two sides of the mounting frame (24).

4. The test apparatus of claim 3, wherein: the test apparatus is configured to apply a voltage to the gallium nitride device under test to cause the gallium nitride device under test to fail. The middle part of the fixed mounting hole (25) is provided with an auxiliary mounting clamping groove (26), and the two sides of the auxiliary mounting clamping groove (26) are provided with fixed holes.

5. The test apparatus of claim 4, wherein: the test apparatus is configured to apply a voltage to the gallium nitride device under test to cause the gallium nitride device under test to fail. The simulation part (1) comprises a simulation cover (30), a hot air machine (31), fifth electric push rods (34), a temperature sensor (36) and a conveying pipe (37), the fifth electric push rods (34) are uniformly distributed, the upper ends of the fifth electric push rods (34) are fixedly connected to the edge bottom of the simulation cover (30) through bolts, the hot air machine (31) is fixedly installed at the upper end of the simulation cover (30), the conveying pipe (37) is fixedly connected to the bottom end of the hot air machine (31), and the conveying pipe (37) is located in the simulation cover (30), and the temperature sensor (36) is uniformly and fixedly installed in the simulation cover (30).

6. The test apparatus of claim 5, wherein: the test apparatus is configured to apply a voltage to the gallium nitride device under test to cause the gallium nitride device under test to fail. The bottom ends of the fifth electric push rods (34) are fixedly installed on the fixed support base (2), and the mounting frame (24) is located below the simulation cover (30).

7. A test apparatus for failure analysis of a gallium nitride device as defined in claim 6, wherein: The fourth electric push rods (29) are fixedly connected to the fixed support base (2), and the mounting frame (24) is distributed around the placement adjusting plate (17), the bottom end of the supporting plate (11) is fixedly connected to the upper end of the rotating adjusting tooth ring (7), and the side end, away from the second motor (13), of the mounting support frame (14) is provided with an angle sensor for detecting the rotation of the placement adjusting plate (17).

8. The test apparatus of claim 7, wherein: the test apparatus is configured to apply a voltage to the gallium nitride device under test to cause the gallium nitride device under test to fail. The simulation cover (30) is uniformly and fixedly provided with electromagnetic valves (33), the middle part of the electromagnetic valve (33) is fixedly provided with a connecting pipe (32), the inside of the simulation cover (30) is uniformly and fixedly provided with spraying pipes (35), and the spraying pipes (35) are in communication with the connecting pipe (32).

9. The test apparatus of claim 8, wherein: the test apparatus is configured to apply a voltage to the gallium nitride device under test to cause the gallium nitride device under test to fail. The upper end of the simulation cover (30) is fixedly provided with a selection control panel (39), the outer side of the fixed support base (2) is uniformly provided with an auxiliary analysis test device (40), and the auxiliary analysis test device (40) is provided with three, the bottom end of the fixed support base (2) is fixedly provided with an auxiliary support seat (38), the auxiliary analysis test device (40) is staggered with the fifth electric push rod (34), the auxiliary analysis test device (40) includes a sixth electric push rod (41), a support seat (42), a rotating control gear ring (43), a rotating clasp ring (44), a first auxiliary failure analysis test device (45), a second auxiliary failure analysis test device (46), a support arm (47), a support column (48), a third electric motor (49), a mounting plate (50) and a second drive gear (51), the sixth electric push rod (41) is uniformly and symmetrically distributed on the outer side of the support seat (42), and the front end of the sixth electric push rod (41) is fixedly connected with the outer side end of the support seat (42), the bottom end of the support column (48) is fixedly connected in the middle of the support seat (42), the rotating clasp ring (44) is rotatably connected at the upper end of the support column (48), the rotating control gear ring (43) is fixedly connected at the bottom end of the rotating clasp ring (44), the support arm (47) is fixedly connected on the rotating clasp ring (44), the first auxiliary failure analysis test device (45) and the second auxiliary failure analysis test device (46) are respectively fixedly installed on the upper part of both ends of the support arm (47), the first auxiliary failure analysis test device (45) and the second auxiliary failure analysis test device (46) are the same structure, the mounting plate (50) is fixedly installed on the support column (48), the third electric motor (49) is fixedly installed at the bottom end of the mounting plate (50), the second drive gear (51) is rotatably connected on the mounting plate (50), and the driving end of the third electric motor (49) is fixedly connected with the middle part of the second drive gear (51) after penetrating the mounting plate (50), the second drive gear (51) is meshingly connected with the inside of the rotating control gear ring (43), the sixth electric push rod (41) is fixed on the fixed support base (2), and the first auxiliary failure analysis test device (45) and the second auxiliary failure analysis test device (46) each include a test table, a control box, a display panel, a moving slot, a device moving mechanism, a test contact and a detection device.

10. A process for failure analysis of a gallium nitride device, adapted for use with a test apparatus for failure analysis of a gallium nitride device as defined in claim 9, wherein: The method comprises the following steps: S1, pretreatment and installation A preliminary optical microscope examination is performed on the failed gallium nitride device under test, and appearance defects are recorded. The device is started by operating the display screen (3), and each electric push rod and motor returns to the initial zero position. The fifth electric push rod (34) is controlled to lift the simulation cover (30) to the highest point to provide a wide operating space. The fourth electric push rod (29) is controlled to lower the lifting adjustment bracket (28) to a low position to facilitate the installation of detection equipment. According to the preliminary suspected failure mode, the appropriate detection equipment is selected and installed on different mounting racks (24) through the fixed mounting hole (25) and auxiliary installation card slot (26), and the horizontal position is preliminarily adjusted through the third electric push rod (27) so that the probe or interface faces the center. The failed gallium nitride device is placed at the center of the placement adjustment plate (17) manually. The second electric push rod (15) is started by operating the display screen (3) to drive the lifting control plate (19) to descend, so that the pressing fixed plate (18) preliminarily presses the device. The adjustment screw rod (20) is finely adjusted manually to finely control the downward distance of the adjustment plate (23), and the buffer of the buffer protection spring (21) is combined to realize stable and lossless fixation of the device. S2, Electrical connection and preliminary test The first electric push rod (10) is controlled by operating the display screen (3) to finely adjust the position of the sliding adjustment base (12) on the support plate (11). The first electric motor (9) is controlled to drive the drive gear (8) and the rotating adjustment gear ring (7) to drive the entire positioning adjustment control part (4) and the device to rotate in the horizontal plane. The second electric motor (13) is controlled to drive the placement adjustment plate (17) to tilt at a preset angle. Combined with the feedback of the angle sensor at the side end of the mounting support frame (14), the pins on the device are precisely aligned and physically connected with the test equipment probe on the target mounting rack (24) through multi-dimensional adjustment. In a room temperature environment, the connected test equipment program is executed in sequence to perform preliminary electrical tests. S3, Failure reproduction and test under environmental stress The fifth electric push rod (34) is controlled to lower the simulation cover (30) to form a sealed cavity. The air heater (31) is started, and hot air is delivered into the cavity through the delivery pipe (37). The target high temperature in the cavity is accurately controlled and maintained through the feedback of the temperature sensor (36). Under high temperature conditions, the electrical tests of step 2 are repeated to observe the trend of the parameters with temperature. The external humid gas source is connected to the electromagnetic valve (33). At a set temperature, the electromagnetic valve (33) is opened, and the humid gas is uniformly introduced into the cavity of the simulation cover (30) through the spraying pipe (35) to simulate a high-humidity environment. S4, Multi-angle analysis and data synthesis After completing a test angle test, without opening the simulation cover, the device can be directly rotated to a new angle by controlling the first motor (9) and the second motor (13), connected to another detection device on the mounting frame (24) and tested, realizing the rapid switching of multiple analysis modes without re-fixing the device. During the entire test process, the data and environmental parameters of all test devices are collected in real time and displayed on the control display screen (3). The system automatically records and stores for subsequent analysis.

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