Electrical connection unit

Abstract

The electrical connection unit includes: an electronic component having a terminal at a component end in a second direction; a wiring substrate having a base member and a bus bar; and a connecting member having a first portion having a first mounting hole, facing the first surface, and having an upright orientation in the first direction, and a second portion having a second mounting hole, protruding along the first surface from an end portion of the first portion on the first surface side, the connecting member having a second surface facing the second surface in a planar view viewed from the first direction, the position of the second mounting hole is offset from a side-by-side position in the second direction with respect to the position of the first mounting hole.

Description

Technical Field

[0001] Embodiments of the present invention relate to electrical connection units. Background Technology

[0002] An electrical connection unit is known, which has a housing for accommodating electronic components and a busbar mounted in an upright position on the housing.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2024-037492 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, with the increasing current of electrical connection units, there is a tendency for electrical connection units to become larger.

[0008] One implementation provides an electrical connection unit capable of suppressing large-scale applications.

[0009] Technical solutions for solving the problem

[0010] An electrical connection unit according to one embodiment includes: an electronic component having a terminal at a component end in a second direction; a wiring substrate having a base component and a busbar, the base component having a plate-like or sheet-like planar portion having thickness in a first direction, the planar portion having a first surface facing the electronic component, the busbar being held by the planar portion, extending along the planar portion, and having a connecting portion; and a connecting member having a first portion and a second portion, the first portion having a first mounting hole extending in the second direction, facing the first surface, and having an upright posture in the first direction, the second portion having a second mounting hole extending in the first direction, protruding from the end of the first portion on the first surface side along the first surface, the connecting member being disposed between the electronic component and the busbar, electrically connecting the terminal to the connecting portion, and in a plan view viewed from the first direction, the position of the second mounting hole being offset relative to the position of the first mounting hole from a position parallel to each other in the second direction.

[0011] Invention Effects

[0012] According to one embodiment, it is possible to suppress the enlargement of electrical connection units. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing the electrical connection unit of the embodiment.

[0014] Figure 2 This is a perspective view of the main body used to illustrate the implementation method.

[0015] Figure 3 This is a perspective view showing a sub-unit of the implementation method.

[0016] Figure 4 This is a perspective view showing a portion of the sub-units of the implementation method exploded.

[0017] Figure 5 This is a perspective view showing an exploded view of a portion of the electronic components and connecting components of the embodiment.

[0018] Figure 6 This is a perspective view showing the main parts of the subunit of the embodiment in an enlarged view.

[0019] Figure 7 This is a plan view showing the main parts of the sub-unit of the implementation method in an enlarged manner.

[0020] Figure 8 yes Figure 10 The structure shown is a cross-sectional view along line F8-F8.

[0021] Figure 9 This is a perspective view showing the wiring substrate according to the embodiment.

[0022] Figure 10 This is a plan view showing the wiring substrate of the embodiment.

[0023] Figure 11 This is a perspective view showing an exploded portion of the electrical connection unit of the embodiment.

[0024] Figure 12 This is a bottom view showing the wiring substrate of the embodiment.

[0025] Figure 13 This is a cross-sectional view illustrating the manufacturing method of the electrical connection unit in the embodiment.

[0026] Figure 14 This is a cross-sectional view illustrating the manufacturing method of the electrical connection unit in the embodiment.

[0027] Figure 15 This is a cross-sectional view illustrating the manufacturing method of the electrical connection unit in the embodiment.

[0028] Figure 16 This is a cross-sectional view illustrating the manufacturing method of the electrical connection unit in the embodiment.

[0029] Figure 17 This is a cross-sectional view illustrating the manufacturing method of the electrical connection unit in the embodiment.

[0030] Figure 18 This diagram illustrates the function of the electrical connection unit in the implementation method. Detailed Implementation

[0031] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following description, structures having the same or similar functions will be labeled with the same reference numerals. Furthermore, repeated descriptions of these structures may be omitted. Additionally, the structures described below do not limit the scope of the embodiments.

[0032] In this disclosure, the terms are defined as follows: "Connection" is not limited to mechanical connections and may include electrical connections. That is, "connection" is not limited to the case where two elements are directly connected, but may also include the case where two elements are connected by intervening other elements. "Containment" is not limited to the case where the entire component is contained, but may also include the case where only a portion of the component is contained (the remaining portion of the component protrudes). "Facing" refers to the case where the imaginary projected images of two objects overlap when viewed from a specific direction. That is, "facing" is not limited to the case where two objects face each other directly, but may also include the case where two objects face each other with other components present between them. "Parallel," "orthogonal," or "identical" may respectively include cases of "approximately parallel," "approximately orthogonal," or "approximately identical." "Sheet-like" or "sheet" is not limited to components with a thickness of 1 mm or more, but may also be components with a thickness of less than 1 mm (so-called membranes).

[0033] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows. The +X direction is the direction from the first end 80e1 of the metal plate 80 (described later) toward the second end 80e2 (see reference). Figure 11 The -X direction is the opposite of the +X direction. Hereinafter, without distinguishing between the +X and -X directions, it will be simply referred to as the "X direction". The +Y and -Y directions are directions that intersect (e.g., are perpendicular to) the X direction. The +Y direction is the direction from the third end 80e3 of the metal plate 80 described later toward the fourth end 80e4 (see reference). Figure 11 The -Y direction is the opposite of the +Y direction. Hereinafter, without distinguishing between the +Y and -Y directions, it will be simply referred to as the "Y direction". The +Z and -Z directions are directions that intersect (e.g., are orthogonal) the X and Y directions. The +Z direction is the direction from the metal plate 80 described later toward the main body MU (see reference). Figure 1 The -Z direction is the opposite of the +Z direction. Hereinafter, without distinguishing between the +Z and -Z directions, it will be simply referred to as the "Z direction." The Z direction is an example of the "first direction." The X direction is an example of the "second direction."

[0034] Hereinafter, without distinguishing between the X and Y directions, it will sometimes be referred to as the "horizontal direction". Hereinafter, the Z direction will sometimes be referred to as the "vertical direction". In addition, hereinafter, the +Z direction side will sometimes be referred to as "up" and the -Z direction side will sometimes be referred to as "down". However, these expressions are for ease of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the setting posture of the electrical connection unit 1).

[0035] (Implementation Method)

[0036] <1. Structure of the electrical connection unit>

[0037] Figure 1 This is a cross-sectional view showing the electrical connection unit 1 of this embodiment. The electrical connection unit 1 is, for example, an on-board device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0038] Electrical connection unit 1 is electrically connected to an external device. In this disclosure, "external device" refers to an electrical device located outside of electrical connection unit 1. External devices may be, for example, a battery cell mounted on a vehicle, or an inverter for driving a vehicle's motor, but are not limited to these examples.

[0039] Electrical connection unit 1, for example, includes a main body MU, a metal plate 80, and an insulating sheet 91 (see reference). Figure 11 ), multiple heat-conducting components 92 and an insulating cover 93.

[0040] <2. Main Body>

[0041] First, let's explain the main body MU.

[0042] Figure 2 This is a perspective view illustrating the main body MU. The main body MU is the part that implements the main functions of the electrical connection unit 1 (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into multiple sub-units SU. The main body MU is formed by connecting multiple sub-units SU. In this embodiment, the main body MU has 3 sub-units SU (sub-units SUX, SUY, and SUZ). Each sub-unit SU can also be referred to as a "circuit structure".

[0043] The sub-unit SUX has a primary electrical function. The sub-unit SUX includes, for example, multiple electronic components 10X and a wiring substrate 40X. The multiple electronic components 10X are electrically connected to the wiring substrate 40X.

[0044] The subunit SUY has a secondary electrical function. This secondary function is different from the primary function. The subunit SUY includes, for example, multiple electronic components 10Y and a wiring substrate 40Y. The multiple electronic components 10Y are electrically connected to the wiring substrate 40Y.

[0045] The sub-unit SUZ has a third electrical function. This third function is different from the first and second functions. The sub-unit SUZ includes, for example, multiple electronic components 10Z and a wiring substrate 40Z. The multiple electronic components 10Z are electrically connected to the wiring substrate 40Z.

[0046] In this embodiment, the three sub-units SUX, SUY, and SUZ are arranged in the X direction.

[0047] In this embodiment, the three wiring substrates 40X, 40Y, and 40Z contained in the three subunits SUX, SUY, and SUZ are arranged on the same plane. In other words, the three wiring substrates 40X, 40Y, and 40Z are arranged at the same height position in the Z direction. A large wiring substrate 40M is formed by the arrangement of these three wiring substrates 40X, 40Y, and 40Z.

[0048] In this embodiment, the three subunits SUX, SUY, and SUZ have the same or similar basic structures. Hereinafter, a detailed description will be given using one subunit SU as an example. From now on, the subunits SUX, SUY, and SUZ will not be distinguished, and will only be referred to as "subunit SU". Similarly, the electronic components 10X, 10Y, and 10Z will not be distinguished, and will only be referred to as "electronic component 10". Furthermore, the wiring substrates 40X, 40Y, and 40Z will not be distinguished, and will only be referred to as "wiring substrate 40".

[0049] <3. Structure of Subunits>

[0050] Next, the structure of the subunit SU will be explained.

[0051] like Figure 3 and Figure 4 As shown, the subunit SU includes, for example, multiple electronic components 10, multiple connecting components 20 for connecting the components, and a wiring substrate 40. Each connecting component 20 is a component that forms a vertical power path. The connecting component 20 can also be referred to as a "vertical wiring component".

[0052] <3.1 Electronic components and connecting components for connecting components>

[0053] First, the electronic component 10 and the connecting component 20 for connecting the components will be described.

[0054] Electronic component 10 is an electronic component mounted according to the functions required by the subunit SU. Electronic component 10 may be, for example, a connector, fuse, relay (e.g., a mechanical relay or a semiconductor relay), capacitor, branch component, various sensors (e.g., current sensors or voltage sensors), electronic control unit, or an electronic component unit composed of two or more of these. Electronic component 10 is disposed on the +Z direction side of the wiring board 40. Furthermore, the type of electronic component 10 is not limited to the examples described above. Electronic component 10 may be, for example, a heat-generating component that generates heat when energized.

[0055] The connecting member 20 is a component that electrically connects the electronic component 10 to the wiring substrate 40. The connecting member 20 forms part of the power path in the sub-unit SU. The connecting member 20 is made of metal (e.g., copper or copper alloy). The connecting member 20 is located on the +Z direction side of the wiring substrate 40. The connecting member 20 may also be referred to as a "metal component".

[0056] <Electronic Components in 3.1.1>

[0057] like Figure 5 As shown, electronic component 10 is an electronic component in which a plurality of terminals 13 are arranged on one component end 10e. Electronic component 10, for example, has a housing 11, a component body 12, a plurality of terminals 13 and a plurality of mounting portions 14.

[0058] (case)

[0059] The housing 11 is the outer contour component that forms most of the external shape of the electronic component 10. The housing 11 is made of, for example, synthetic resin and has insulating properties. The housing 11 houses the main body portion 12 of the component. Alternatively, the housing 11 and the main body portion 12 of the component may be formed integrally.

[0060] In this embodiment, the housing 11 has an insulating rib 11a that protrudes in a horizontal direction (e.g., the X direction) and extends in a Z direction. The insulating rib 11a is, for example, plate-shaped along both the horizontal (e.g., X direction) and Z direction. The insulating rib 11a extends, for example, along the entire length of the housing 11 in the Z direction. The insulating rib 11a is disposed between a plurality of terminals 13 (terminals 13A and 13B, described later). The insulating rib 11a electrically insulates between terminals 13A and 13B. Additionally, in this embodiment, a portion of the insulating rib 11a is disposed between the first portions 21 (described later) of two connecting members 20 connected to the electronic component 10. The insulating rib 11a electrically insulates between the first portions 21 of the two connecting members 20 connected to the electronic component 10.

[0061] (Main body of the component)

[0062] The main body 12 of the component is the part that performs the main functions of the electronic component 10. For example, when the electronic component 10 is a relay, the main body 12 includes a switching part (e.g., a contact part) that switches between an on and off state. For example, when the electronic component 10 is a fuse, the main body 12 includes a fuse-breaking part that melts when an overcurrent flows. For example, when the electronic component 10 is a capacitor, the main body 12 includes a part that stores charge.

[0063] (terminal)

[0064] Terminal 13 is an electrical connection portion exposed to the outside of housing 11. Terminal 13 is electrically connected to the main body 12 of component inside housing 11. In this embodiment, electronic component 10 includes terminals 13A and 13B as a plurality of terminals 13. One of terminals 13A and 13B is a terminal on the positive side. The other of terminals 13A and 13B is a terminal on the negative side. One of terminals 13A and 13B is an example of a "first terminal". The other of terminals 13A and 13B is an example of a "second terminal".

[0065] In this embodiment, terminals 13A and 13B are disposed at one end 10e of the electronic component 10 in the horizontal direction (e.g., the X direction). Terminals 13A and 13B are arranged side by side in the horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole 13h for mounting with a fastening member 71 (e.g., a screw or bolt), described later. The mounting hole 13h is open in the horizontal direction (e.g., the X direction). The inner circumferential surface of the mounting hole 13h of the electronic component 10 has a threaded groove.

[0066] (Installation Department)

[0067] Mounting section 14 is a part used to fix electronic component 10. Mounting section 14 has fastening components 112 (e.g., screws or bolts, see below) for fastening later. Figure 11 The mounting hole 14h is for installation. The mounting hole 14h is open in the Z direction. The mounting hole 14h is a through hole through which the fastening member 112 passes. The object to be fastened to the mounting part 14 will be described later.

[0068] <3.1.2 Connecting Components>

[0069] The connecting member 20 is a component that electrically connects the electronic component 10 to the wiring substrate 40. In this embodiment, the connecting member 20 connects the electronic component 10 to the busbar 42 (see reference 40) included in the wiring substrate 40. Figure 4Electrical connection. The connecting component 20 has, for example, a first part 21 and a second part 22.

[0070] (Part 1)

[0071] The first portion 21 of the connecting member 20 is the portion that connects to the terminal 13 of the electronic component 10. The first portion 21 is a plate-shaped or prismatic portion extending along the Z direction. The first portion 21 extends along one end portion of the electronic component 10, namely the component end 10e (e.g., the plane of the component end 10e in the X direction). The first portion 21 is an erected portion that stands upright in the Z direction relative to the wiring substrate 40 (e.g., relative to the busbar 42 described later). The first portion 21 is adjacent to the electronic component 10 in the horizontal direction (e.g., the X direction). For example, the first portion 21 is adjacent to the terminal 13 of the electronic component 10 in the horizontal direction (e.g., the X direction) and is connected to the terminal 13 of the electronic component 10 from the horizontal direction (e.g., the X direction).

[0072] The first portion 21 of the connecting member 20 has a first mounting hole 21h through which a fastening member 71 (e.g., a screw or bolt) passes. The first mounting hole 21h is open in a horizontal direction (e.g., the X direction). By engaging the fastening member 71 passing through the first mounting hole 21h with the mounting hole 13h of the terminal 13 of the electronic component 10, the first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10. Furthermore, the fastening member 71 is an example of a first fastening portion.

[0073] (Part Two)

[0074] The second part 22 of the connecting component 20 is connected to the busbar 42 (see reference). Figure 8 The second part 22 protrudes horizontally (e.g., in the X direction) from the end 10f on the -Z direction side of the first part 21. The second part 22 is a plate portion along the horizontal direction and along the wiring substrate 40. The second part 22 is adjacent to the busbar 42 in the Z direction and is connected to the busbar 42 from the +Z direction. The second part 22 of the connecting member 20 is mounted from the +Z direction to a fastening member 43 (e.g., a screw or bolt, see reference 43) protruding from the busbar 42 in the +Z direction. Figure 3 It is physically and electrically connected to the busbar 42. In this embodiment, the second portion 22 of the connecting member 20 has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The second mounting hole 22h of the second portion 22 is through which the fastening member 43 passes. And, by engaging the engaging member 44 (e.g., a nut, see...) Figure 3The second part 22 engages with the end of the fastening member 43 passing through the second mounting hole 22h, thereby fixing the second part 22 to the busbar 42. In this embodiment, a connecting member 20 having an L-shape in a side view viewed from the Y direction is formed by the first part 21 and the second part 22.

[0075] like Figure 6 , Figure 7 As shown, the position of the second mounting hole 22h is offset towards the -Y direction relative to the position of the first mounting hole 21h in the connecting component 20. Specifically, as... Figure 7 As shown, in the plan view viewed from the Z direction (first direction), the position of the second mounting hole 22h deviates from its parallel position in the X direction (second direction) relative to the position of the first mounting hole 21h. That is, in the plan view viewed from the Z direction, the hole center 22c of the second mounting hole 22h is offset in the Y direction relative to the extension line LX1 of the axis of the first mounting hole 21h. Furthermore, this positional relationship can also be described as the axis of the second mounting hole 22h being offset in the Y direction relative to the ZX plane containing the axis of the first mounting hole 21h. For example, in the plan view viewed from the Z direction, the position of the second mounting hole 22h can also be offset in the Y direction such that the hole center 22c of the second mounting hole 22h is located further away from the inner circumference of the first mounting hole 21h relative to the extension line LX1 of the axis of the first mounting hole 21h. For example, in the side view viewed from the X direction, the position of the second mounting hole 22h can also be offset in the Y direction such that the axis of the second mounting hole 22h is located outside the first mounting hole 21h.

[0076] like Figure 7 As shown, for example, in a plan view taken from the Z direction, at least a portion of the fastening member 43 (including the head 43b and shaft portion 43a described later) may overlap with the outer diameter region RG1, which is the region extending along the X direction the portion of the fastening member 71 having the largest outer diameter. Here, "the portion of the fastening member 71 having the largest outer diameter" may be the head of the fastening member 71. For example, in a plan view taken from the Z direction, at least a portion of the shaft portion 43a of the fastening member 43 may overlap with the outer diameter region RG1. For example, in a plan view taken from the Z direction, the shaft center 43c of the shaft portion 43a of the fastening member 43 may also overlap with the outer diameter region RG1.

[0077] For example, in a plan view viewed from the Z direction, the second mounting hole 22h can be located on the center line of the second portion 22 extending along the X direction, i.e., the first center line LC1. For example, in a plan view viewed from the Z direction, the hole center 22c of the second mounting hole 22h can be located on the first center line LC1 of the second portion 22 extending along the X direction. Here, the first center line LC1 of the second portion 22 is the axis of symmetry that divides the second portion 22 into line-symmetrical parts in the plan view viewed from the Z direction.

[0078] For example, in a plan view taken from the Z direction, the first mounting hole 21h can be closer to the center line, i.e., the second center line LC2, of the component end 10e of the electronic component 10 extending along the X direction than the second mounting hole 22h. That is, in a plan view taken from the Z direction, the first mounting hole 21h can be located closer to the second center line LC2 of the component end 10e of the electronic component 10 extending along the X direction than the second mounting hole 22h. Here, the second center line LC2 of the component end 10e is the axis of symmetry that divides the plane of the component end 10e into a line-symmetric portion in a side view taken from the X direction.

[0079] For example, in the case where two connecting parts 20 are mounted side by side along the Y direction at the component end 10e of the electronic component 10, such as Figure 7 As shown in the plan view viewed from the Z direction, for each connecting component 20, the first mounting hole 21h can be configured to be closer to the second centerline LC2 of the component end 10e of the electronic component 10 extending along the X direction than the second mounting hole 22h. That is, the distance between the first mounting holes 21h of the two connecting components 20 can also be closer than the distance between the second mounting holes 22h of the two connecting components 20.

[0080] The connecting member 20 is a heat storage member (heat absorption member) that increases the heat capacity of the energizing path of the electrical connection unit 1. For example, the connecting member 20 stores (absorbs) at least a portion of the heat emitted by the electronic component 10. Alternatively / otherwise, the connecting member 20 may also store (absorb) at least a portion of the heat generated in the busbar 42 due to energizing. The connecting member 20 may also be referred to as a "heat storage member" or a "heat absorption member".

[0081] like Figure 8As shown, the connecting member 20 is disposed between the electronic component 10 and the busbar 42. In this disclosure, "the connecting member is disposed between the electronic component and the busbar" is not limited to the case where a portion of the connecting member is located between the electronic component and the busbar when viewed from the X or Y direction. "The connecting member is disposed between the electronic component and the busbar" can also be equivalent to the case where a portion of the connecting member is located between the electronic component and the busbar when viewed from a direction inclined relative to the X or Y direction. The connecting member 20 electrically connects the terminals 13 of the electronic component 10 to the busbar 42.

[0082] In this embodiment, the thickness of at least a portion of the connecting member 20 is greater than the plate thickness T3 of the busbar 42. For example, the thickness T1 in the X direction of at least a portion of the connecting member 20 is greater than the plate thickness T3 of the busbar 42. In this embodiment, the thickness T1 in the X direction of the first portion 21 of the connecting member 20 is greater than the plate thickness T3 of the busbar 42. In this embodiment, the first portion 21 has a thickness T1 in the X direction that is greater than the plate thickness T3 of the busbar 42 along its entire length in the Z direction. Alternatively, in other views, the thickness T2 in the Z direction of the second portion 22 of the connecting member 20 may also be greater than the plate thickness T3 of the busbar 42.

[0083] In this embodiment, the thickness T1 of the first portion 21 of the connecting member 20 in the X direction is greater than the thickness T2 of the second portion 22 of the connecting member 20 in the Z direction. In this embodiment, the first portion 21 has a thickness T1 that is greater than the thickness T2 of the second portion 22 along its entire length in the Z direction.

[0084] <3.2 Substrate for Wiring>

[0085] Next, the wiring substrate 40 will be described.

[0086] Figure 9 This is a perspective view showing a wiring substrate 40. The wiring substrate 40 is a component that forms at least a portion of the power path between a plurality of electronic components 10 and / or at least a portion of the power path between an electronic component 10 and an external device. In this disclosure, "wiring substrate" refers to a substrate-type wiring structure. "Substrate-type" means that, regardless of its fine shape, it is plate-shaped along a plane when viewed as a whole. It should be noted that in this disclosure, "plate-shaped" is not limited to a completely flat case, and may include cases where there are fixing structures, ribs, etc., that protrude in the Z direction. In this embodiment, the wiring substrate 40 is plate-shaped along both the X and Y directions.

[0087] The wiring substrate 40 includes, for example, a base plate 41, one or more busbars 42, and multiple fastening members 43. In this embodiment, the base plate 41 and the multiple busbars 42 are integrated by insert molding. For example, after the fastening members 43 are fixed to the busbars 42, the busbars 42 are insert-molded with the base plate 41, thereby forming the wiring substrate 40 into a sheet-like component. That is, the busbars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. Alternatively, the wiring substrate 40 may be formed by other structures instead of insert molding.

[0088] (Substrate board)

[0089] The substrate 41 is a retaining member that integrally holds a plurality of busbars 42 arranged horizontally and spaced apart from each other. The substrate 41 is, for example, made of synthetic resin and has insulating properties. The substrate 41 provides electrical insulation between the plurality of busbars 42. The substrate 41 is an example of a "substrate component." The substrate 41 can also be referred to as an "insulating substrate." The substrate 41, for example, has a planar portion 51 and a plurality of fixing portions 52.

[0090] The planar portion 51 is a plate-shaped portion formed in the substrate plate 41. The planar portion 51 is plate-shaped along the horizontal direction. The planar portion 51 forms the main part of the substrate plate 41. The planar portion 51 forms the base (insulating base) of the substrate plate 41. In this embodiment, the planar portion 51 extends throughout the entire range of the substrate plate 41 in the X direction, except for the four corners of the substrate plate 41, and extends throughout the entire range of the substrate plate 41 in the Y direction.

[0091] The planar portion 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface facing the +Z direction. The first surface 51a is a plane along the horizontal direction. The first surface 51a faces the plurality of electronic components 10 and faces the insulating cover 93 of the electrical connection unit 1 (see reference). Figure 1 The second surface 51b is located on the opposite side to the first surface 51a. The second surface 51b is a surface facing the -Z direction. The second surface 51b is a plane along the horizontal direction. The second surface 51b faces the metal plate 80 (see reference). Figure 1 The thickness direction (plate thickness direction) of the planar portion 51 is the Z direction.

[0092] (Busbar)

[0093] Busbar 42 is a wiring component (electrical connection component) included in the wiring substrate 40. Busbar 42 is, for example, a wiring component for electrically connecting multiple electronic components 10. Alternatively, busbar 42 may also be a wiring component for connecting electronic components 10 to external devices. Busbar 42 is made of metal (e.g., copper or copper alloy) and is conductive. In this embodiment, the multiple busbars 42 of the wiring substrate 40 include portions arranged on the same plane. Each busbar 42 is held by a planar portion 51 of the substrate 41.

[0094] At least a portion of each busbar 42 is plate-shaped along the horizontal direction. At least a portion of each busbar 42 is housed in a housing portion 55 and extends along a planar portion 51. That is, at least a portion of each busbar 42 extends along a first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the housing portion 55. In this embodiment, each busbar 42 is plate-shaped along the entire horizontal direction. Each busbar 42 is housed in a housing portion 55 and extends along the planar portion 51 along its entire length. Hereinafter, the portion of each busbar 42 housed in the housing portion 55 and extending along the planar portion 51 is sometimes referred to as "plate portion 42p". The busbar 42 is a component that forms a horizontal power path. The busbar 42 may also be referred to as a "horizontal wiring component". Several of the multiple busbars 42 may be, for example, busbars included in the positive line of the electrical connection unit 1. Several of the multiple busbars 42 other than the busbars included in the positive line may be, for example, busbars included in the negative line of the electrical connection unit 1.

[0095] Figure 10 This is a plan view showing the wiring substrate 40. Each busbar 42 has a plate portion 42p, for example, a connecting portion 61 and an extension portion 63.

[0096] The connecting portion 61 is the part that contacts a connecting member 20. The connecting member 20 is the connecting member that connects an electronic component 10 to a busbar 42. The connecting portion 61 is the portion of the busbar 42 that overlaps with the connecting member 20 when viewed from the Z direction. The connecting portion 61 is adjacent to and connected to the connecting member 20 in the Z direction. For example, when viewed from the Z direction, each connecting portion 61 is located on the +X direction side or the -X direction side relative to the electronic component 10. Each connecting portion 61 is electrically connected to a terminal 13A or terminal 13B of the electronic component 10 via the connecting member 20.

[0097] The extension 63 extends from the connecting portion 61 along the X or Y direction. The extension 63 is continuously connected to the connecting portion 61.

[0098] In this embodiment, the connecting portion 61 and the extension portion 63 are plate-shaped along the horizontal direction. In this embodiment, each busbar 42 extends at least over the connecting portion 61 and the extension portion 63, is housed in the housing portion 55, and extends along the planar portion 51. For example, the connecting portion 61 and the extension portion 63 are housed in the housing portion 55 and extend along the planar portion 51.

[0099] In this embodiment, some extensions 63 of the busbars 42 are housed in the housing 55, extending through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across both sides of the region R. For example, the extensions 63 extend in a straight line along the X direction. The extensions 63 extend through the region R that overlaps with the electronic component 10 when viewed from the Z direction and across the +X and -X direction sides of the region R. That is, since the busbars 42 are housed in the housing 55, they are not hindered by the presence of the electronic component 10 and can be easily laid out with a better path (e.g., a shorter path).

[0100] (Fastening components)

[0101] return Figure 8 Fastening component 43 is a component used to secure the busbar 42 to the connecting component 20. Fastening component 43 is, for example, a riveting bolt fixed to the busbar 42. Fastening component 43 is an example of a "second fastening part".

[0102] In this embodiment, the connecting portion 61 of the busbar 42 has a through hole 42h. The through hole 42h extends through the busbar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head 43b. The circumferential surface of the shaft portion 43a has a threaded groove. The diameter of the head 43b is larger than the diameter of the shaft portion 43a. With the shaft portion 43a passing through the through hole 42h of the busbar 42, the head 43b of the fastening member 43 is riveted to the busbar 42. Through this fixation, with the shaft portion 43a protruding from the through hole 42h of the busbar 42 in the +Z direction, the fastening member 43 is electrically and physically connected to the busbar 42. Furthermore, the fastening member 43 is not limited to riveting; it can also be fixed to the busbar 42 by welding or other methods.

[0103] In this embodiment, the connecting member 20 is first fixed to the electronic component 10 by the fastening member 71, and then mounted to the fastening member 43 in the Z direction. For example, the connecting member 20 is used to insert the shaft portion 43a of the fastening member 43 into the second mounting hole 22h of the second part 22. Then, the engaging member 44 (e.g., a nut) engages with the shaft portion 43a of the fastening member 43, which protrudes from the second mounting hole 22h of the second part 22 of the connecting member 20. The engaging member 44 is mounted to the shaft portion 43a, for example, along the Z direction. Through this engagement, the second part 22 of the connecting member 20 is fixed to the fastening member 43.

[0104] <4. Metal plates, insulating sheets, heat-conducting components, and insulating covers>

[0105] Next, the metal plate 80, the insulating sheet 91, the heat-conducting component 92, and the insulating cover 93 will be described.

[0106] <4.1 Metal Plate>

[0107] Figure 11 This is a perspective view showing an exploded portion of the electrical connection unit 1. The metal plate 80 is a component used to ensure the rigidity of the electrical connection unit 1 and improve its heat dissipation. The metal plate 80 is made of metal (e.g., aluminum or aluminum alloy). The metal plate 80 can also be referred to as a "rigid component". In this embodiment, multiple sub-units SU (e.g., sub-units SUX, SUY, SUZ) are respectively fixed to the metal plate 80. Through this fixing, the multiple sub-units SU (e.g., sub-units SUX, SUY, SUZ) are held by a metal plate 80.

[0108] The metal plate 80 is rectangular in shape along the X direction when viewed from the Z direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of end portions along the long side of the metal plate 80 and are separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of end portions along the short side of the metal plate 80 and are separated in the Y direction. The metal plate 80 includes, for example, a planar portion 81, a plurality of fixing portions 82, and a plurality of fixing portions 83.

[0109] The planar portion 81 is a plate-shaped portion formed in the metal plate 80. The planar portion 81 is plate-shaped along the horizontal direction. The planar portion 81 forms the main part of the metal plate 80. The planar portion 81 forms the base (metal base) of the metal plate 80. In this embodiment, the planar portion 81 has a size that covers three sub-units SU from below. The planar portion 81 faces the wiring substrate 40 of the three sub-units SU.

[0110] The fixing part 82 is a fixing part used to fix the base plate 41 of each sub-unit SU to the metal plate 80. When viewed from the Z direction, the fixing part 82 is provided at a position corresponding to the fixing part 52 of the base plate 41 of each sub-unit SU. The fixing part 82 is a cylindrical or prismatic boss that protrudes from the flat part 81 of the metal plate 80 in the +Z direction.

[0111] The fixing part 83 is used to fix the electronic components 10 of each subunit SU directly to the metal plate 80 without passing through the base plate 41. When viewed from the Z direction, the fixing part 83 is provided at a position corresponding to the mounting part 14 of the electronic components 10 of each subunit SU. The fixing part 83 is a cylindrical or prismatic boss that protrudes from the flat part 81 in the +Z direction.

[0112] <4.2 Insulating Sheets>

[0113] The insulating sheet 91 is an insulating component used to electrically insulate the metal plate 80 from the busbars 42 of each subunit SU. The insulating sheet 91 is made of a synthetic resin such as polyester or polyimide and has insulating properties. The insulating sheet 91 is rectangular in shape when viewed from the Z-direction. The insulating sheet 91 is sheet-like along the horizontal direction. The insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and the wiring substrate 40 of each subunit SU. For example, the insulating sheet 91 is disposed between the planar portion 81 of the metal plate 80 and a plurality of heat-conducting components 92.

[0114] In this embodiment, the insulating sheet 91 is adhered to the flat portion 81 of the metal plate 80. The insulating sheet 91 has cutouts or openings to avoid the fixing portions 82 and 83 of the metal plate 80. Alternatively, the insulating sheet 91 may be disposed between the wiring substrate 40 of each subunit SU and the plurality of heat-conducting components 92, instead of the example described above.

[0115] <4.3 Thermal Conductive Components>

[0116] The heat-conducting component 92 is a component used to transfer the heat generated by the electronic component 10 when energized and / or the heat generated by the busbar 42 itself when energized to the metal plate 80. The heat-conducting component 92 is, for example, a flexible heat-conducting sheet (e.g., a thermally conductive silicone sheet). However, the heat-conducting component 92 is not limited to the above example and may also be a heat-conducting component formed of thermally conductive gel or other materials.

[0117] Figure 12 This is a bottom view showing the wiring substrate 40. In this embodiment, a plurality of heat-conducting components 92 are partially disposed in the wiring substrate 40. For example, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping a portion of the busbar 42. Furthermore, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged near the electronic component 10 at a position overlapping a portion of the busbar 42. In this embodiment, when viewed from the Z direction, the plurality of heat-conducting components 92 are arranged at a position overlapping the connecting component 20.

[0118] A heat-conducting component 92 is disposed between the metal plate 80 and the busbar 42. The heat-conducting component 92 transfers heat from the electronic component 10 to the busbar 42 and / or heat emitted by the busbar 42 from the busbar 42 to the metal plate 80.

[0119] In this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the connecting component 20 when viewed from the Z direction. In this case, the heat-conducting component 92 can easily transfer heat from the terminal 13 of the electronic component 10 to the connecting component 20 via the busbar 42 from the connecting component 20 to the metal plate 80.

[0120] In this embodiment, a portion of the heat-conducting component 92 is positioned to overlap with and contact the head 43b of the fastening component 43 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the terminal 13 of the electronic component 10 to the connecting component 20 from the fastening component 43 to the metal plate 80.

[0121] Furthermore, in this embodiment, a portion of the heat-conducting component 92 contacts the busbar 42 at a location where it overlaps with the electronic component 10 when viewed from the Z direction. In this case, the heat-conducting component 92 facilitates the transfer of heat from the electronic component 10 to the busbar 42, and then from the busbar 42 to the metal plate 80. Figure 8 In the example shown, the upper surface of the busbar 42 contacts the electronic component 10, thereby thermally connecting the busbar 42 and the electronic component 10. Furthermore, the portion of the busbar 42 that is thermally connected to the electronic component 10 can be an extension 63.

[0122] <4.4 Insulating Cover>

[0123] return Figure 1 The insulating cover 93 will be described below. The insulating cover 93 is a component used to ensure the safety of the power supply path of the main body MU. The insulating cover 93 is, for example, made of synthetic resin and has insulating properties. The insulating cover 93 is, for example, a box-shaped component open in the -Z direction. The insulating cover 93 has multiple vent holes 93h. The insulating cover 93 is mounted relative to the metal plate 80 along the Z direction. Furthermore, the insulating cover 93 is not limited to a box-shaped component; it can also be a sheet-shaped component that covers the power supply path of the main body MU.

[0124] <5. Manufacturing method of electrical connection unit>

[0125] Next, the manufacturing method of electrical connection unit 1 will be described.

[0126] Figures 13 to 17This is a cross-sectional view illustrating the manufacturing method of the electrical connection unit 1. Furthermore, in the wiring substrate 40 of each subunit SU, with the fastening member 43 fixed to the busbar 42, the base plate 41 is integrated with the multiple busbars 42 by insert molding or other methods. Through this integration, the wiring substrate 40 of each subunit SU is prepared in advance.

[0127] (First process)

[0128] Figure 13 This indicates the first step. In the first step, the fastening member 71 is used to fix the connecting member 20 to the terminal 13 of the electronic component 10. Through this fixing, an assembly SA integrating the electronic component 10 and the connecting member 20 is formed.

[0129] The first step is performed as follows: First, the electronic component 10 is placed on the mounting stage MP with the mounting holes 13h of the terminals 13 of the electronic component 10 facing vertically. Next, the connecting component 20 is placed on the electronic component 10 with the first mounting hole 21h of the connecting component 20 facing vertically. Then, the positions of the first mounting hole 21h of the connecting component 20 and the mounting holes 13h of the terminals 13 of the electronic component 10 are aligned. The first step is performed with the electronic component 10 and the connecting component 20 in a first position. The first position is with the mounting holes 13h and 21h facing vertically.

[0130] Next, the fastening member 71 is inserted vertically into the first mounting hole 21h of the connecting member 20. Then, the fastening member 71, passing through the first mounting hole 21h of the connecting member 20, engages with the mounting hole 13h of the terminal 13 of the electronic component 10. Through this engagement, an assembly SA integrating the electronic component 10 and the connecting member 20 is formed. The vertical direction is an example of the "first mounting direction".

[0131] (Second process)

[0132] Figure 14 This indicates the second step. In the second step, the assembly SA is fixed to the wiring substrate 40 of each subunit SU. For example, the connecting member 20 included in the assembly SA is fixed to the busbar 42 included in the wiring substrate 40. Through this fixing, the electronic component 10 is electrically connected to the busbar 42.

[0133] The second process is performed as follows. As described above, in the wiring substrate 40, the fastening member 43 is fixed to the busbar 42. The fastening member 43 protrudes vertically from the busbar 42. Then, the fastening member 43 is inserted vertically into the second mounting hole 22h of the second portion 22 of the connecting member 20, and the assembly SA is placed on the wiring substrate 40. Next, the engaging member 44 (e.g., a nut) is engaged vertically with the upper end of the fastening member 43. Through this engagement, the second portion 22 of the connecting member 20 included in the assembly SA is fixed to the busbar 42. Through this fixing, the assembly of each subunit SU is completed.

[0134] Here, the second step is performed as follows. First, the position of the assembly SA is rotated 90 degrees from the first step. That is, from the first position where the mounting hole 13h and the first mounting hole 21h are oriented vertically (refer to...). Figure 13 The orientation is changed to a second position in which the mounting hole 13h and the first mounting hole 21h are oriented horizontally and the second mounting hole 22h of the connecting member 20 is oriented vertically (see reference). Figure 14 ).

[0135] Then, in the second position described above, the fastening member 43 is inserted vertically into the second mounting hole 22h of the second portion 22 of the connecting member 20, and the assembly SA is placed on the wiring substrate 40. Next, the engaging member 44 (e.g., a nut) is engaged vertically with the upper end of the fastening member 43. Through this engagement, the second portion 22 of the connecting member 20 included in the assembly SA is fixed to the busbar 42.

[0136] (Third process)

[0137] Figure 15 This indicates the third process. In the third process, each subunit SU is mounted on the metal plate 80. The third process is performed as follows, for example. First, an insulating sheet 91 is mounted on the surface of the flat portion 81 of the metal plate 80 (see reference). Figure 11 Next, the heat-conducting component 92 is fixed to the lower surface of each sub-unit SU using an adhesive or the like. Then, the insulating sheet 91 and the heat-conducting component 92 are positioned between each sub-unit SU and the metal plate 80, and each sub-unit SU is placed on the metal plate 80. Finally, the fixing part 52 of each sub-unit SU is fixed to the fixing part 82 of the metal plate 80 using the fastening member 111.

[0138] (Fourth process)

[0139] Figure 16 This indicates the fourth process. In the fourth process, the mounting portion 14 of the electronic components 10 of each subunit SU is fixed to the fixing portion 83 of the metal plate 80 by means of the fastening member 112. Alternatively, the fourth process can be performed together with the third process.

[0140] (Fifth process)

[0141] Figure 17 This indicates the fifth step. In the fifth step, the insulating cover 93 is mounted vertically onto the metal plate 80. Through this mounting, the electrical connection unit 1 is assembled.

[0142] <6. Advantages>

[0143] In this embodiment, in a plan view taken from the Z direction, the position of the second mounting hole 22h is offset from its position alongside the first mounting hole 21h in the X direction. This positional relationship allows the electrical connection unit 1 to be configured such that the second mounting hole 22h is positioned close to the terminal 13. If such a close configuration is implemented, at least the size of the connecting member 20 in the X direction is reduced. Therefore, it is possible to suppress the enlargement of the electrical connection unit 1.

[0144] As a comparative example, in a plan view taken from the Z direction, the second mounting hole of the second part of the connecting member is positioned side-by-side with the first mounting hole of the first part in the X direction. In this positional relationship, to ensure sufficient working space (SPC) for fastening the fastening member of the second part, the position of the fastening member in the second part is restricted to a position sufficiently far away from the fastening member of the first part in the +X direction. Figure 18 The hypothetical position PS1 is shown. Due to this limitation, in the comparative example, the dimension of the connecting component in the X direction is increased.

[0145] Compared to the comparative example, according to this embodiment, compared to the hypothetical position PS1, the fastening member 43 can be brought closer to the fastening member 71, which is equivalent to... Figure 18 The distance dX is shown. Therefore, as described above, the dimension of the connecting member 20 in the X direction is reduced.

[0146] Furthermore, if each of the plurality of electronic components 10 is configured such that the position of the second mounting hole 22h is close to the terminal 13, as described above, the following effects can also be expected. For example, if the above-described structure is provided between the plurality of electronic components 10 arranged so that the terminals 13 are opposite to each other in one direction, a structure in which the second mounting holes 22h are separated from each other can be provided, and a greater distance can be maintained between the second mounting holes 22h in two adjacent electronic components 10. By maintaining such a distance, for example, the insulation distance between the fastening members 43 mounted in the second mounting holes 22h can be ensured, and the engaging members 44 that engage with the fastening members 43 can be separated from each other. Therefore, the insulation between the terminals of two adjacent electronic components 10 can be ensured.

[0147] Furthermore, if the electronic component 10 is configured such that the second mounting hole 22h is located close to the terminal 13, as described above, the following effects can be expected. For example, if there are other structures arranged opposite to the terminal 13 in one direction, the above-described configuration allows these other structures to be separated from the fastening member 43 and the engaging member 44 mounted in the second mounting hole 22h. Therefore, an insulating distance between the terminals of the electronic component 10 and other structures can be ensured.

[0148] In this embodiment, at least a portion of the thickness of the connecting member 20 is greater than the plate thickness T3 of the busbar 42. With this structure, the connecting member 20 has a larger heat capacity per unit length compared to the busbar 42. Due to this increased heat capacity, even when a short-term large current flows through the electronic component 10 and the electronic component 10 heats up, a portion of the heat emitted by the electronic component 10 is stored in the connecting member 20. If such heat storage exists, temperature changes inside the electrical connection unit 1 can be suppressed. Therefore, the thermal characteristics of the electrical connection unit 1 can be improved.

[0149] In this embodiment, in a plan view taken from the Z direction, the fastening member 71 and the fastening member 43 are positioned such that at least a portion of the fastening member 43 overlaps with the outer diameter region RG1, which is formed by extending the portion of the fastening member 71 with its maximum outer diameter in the X direction. Based on this positional relationship, the fastening member 43 can be configured to be close to the fastening member 71. Therefore, the dimension in the Y direction of the connecting member 20 in the plan view is reduced.

[0150] In this embodiment, in a plan view taken from the Z direction, the second mounting hole 22h is located on the first center line LC1 of the second portion 22 extending along the X direction. With the second mounting hole 22h in such a position, the second portion 22 can be mounted to the connecting portion 61 along the center line of the second portion 22. Therefore, the connecting member 20 can be stably mounted to the busbar 42.

[0151] In this embodiment, in a plan view taken from the Z direction, the first mounting hole 21h is located closer to the component end 10e of the electronic component 10 along the second centerline LC2 extending in the Z direction than the second mounting hole 22h. Based on this positional relationship, the first mounting hole 21h can be configured such that its position is close to the center of the component end 10e of the electronic component 10. With this structure, the Y-direction dimension of the first portion 21 of the connecting component 20 can be reduced. Therefore, the enlargement of the connecting component 20 can be suppressed.

[0152] In this embodiment, the thickness of the first portion 21 in the X direction is greater than the thickness of the second portion 22 in the X direction. With this structure, a greater heat capacity can be ensured by the first portion 21 of the connecting member 20. Therefore, the thermal characteristics of the electrical connection unit 1 can be further improved.

[0153] <7. Variations>

[0154] Next, several variations will be described. Furthermore, in each variation, the structure other than that described below is the same as the structure of the embodiment described above.

[0155] In the above embodiment, in a plan view taken from the Z direction, the position of the second mounting hole 22h is offset from its position alongside the first mounting hole 21h in the X direction towards the side of the second center line LC2 in the Y direction, away from the component end 10e. However, if the dimension of the connecting component 20 in the X direction is reduced, the position of the second mounting hole 22h can be offset relative to the position of the first mounting hole 21h in any way. As a variation, in a plan view taken from the Z direction, the position of the second mounting hole 22h can also be offset from its position alongside the first mounting hole 21h in the X direction towards the side of the second center line LC2 in the Y direction, closer to the component end 10e.

[0156] The wiring substrate 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrally formed by insert molding. For example, the busbar 42 may be disposed in the receiving portion 55 after the base plate 41, which is provided with a receiving portion 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 may be fixed to the receiving portion 55 by fitting, or by adhesive or other fixing methods. In these cases, potting may also be performed to fill the gap between the busbar 42 and the receiving portion 55.

[0157] The base component of the wiring substrate 40 is not limited to a base plate 41 having a plate-shaped planar portion 51. The wiring substrate 40 may also be a base component having a sheet-shaped planar portion 51 (e.g., an insulating sheet). In this case, the receiving portion 55 may be formed by making a portion of the planar portion 51 follow the shape of the busbar 42.

[0158] The above describes several embodiments and variations. However, the embodiments and variations are not limited to the examples described above. For example, multiple embodiments can be combined with each other. The above embodiments can be implemented in various other ways, and various additions, omissions, substitutions, and modifications can be made without departing from the spirit of the present invention.

[0159] [Potential for Industrial Applications]

[0160] According to the present invention, it is possible to suppress the enlargement of electrical connection units.

[0161] Explanation of reference numerals in the attached figures

[0162] 1 Electrical connection unit

[0163] 10 electronic components

[0164] 10e component end

[0165] 10f end

[0166] 10X Electronic Components

[0167] 10Y Electronic Components

[0168] 10Z Electronic Components

[0169] 11. Shell

[0170] 11a Insulation Rib

[0171] 12 main components

[0172] 13 terminals

[0173] 13A terminal

[0174] 13B terminal

[0175] 13h mounting hole

[0176] 14 Installation Department

[0177] 14h mounting hole

[0178] 20 connecting parts

[0179] 21 Part 1

[0180] 21h First mounting hole

[0181] 22 Part Two

[0182] 22c Hole Center

[0183] 22h Second mounting hole

[0184] 40 wiring substrate

[0185] 40M wiring substrate

[0186] 40X Wiring Substrate

[0187] 40Y wiring substrate

[0188] 40Z wiring substrate

[0189] 41. Base plate (base component)

[0190] 42 busbars

[0191] 42h through hole

[0192] 42p board section

[0193] 43 Fastening components (second fastening part)

[0194] 43a Shaft

[0195] 43b Head

[0196] 43c axis center

[0197] 44 engaging components

[0198] 51 Planar section

[0199] 51a First page

[0200] 51b Second page

[0201] 52 Fixing Part

[0202] 55 Containment Department

[0203] 61 Connecting part

[0204] 63 Extension

[0205] 71 Fastening component (first fastening part)

[0206] 80 metal sheet

[0207] 80e1 first end

[0208] 80e2 second end

[0209] 80e3 third end

[0210] 80e4 fourth end

[0211] 81 Planar Section

[0212] 82 Fixing Part

[0213] 83 Fixing Part

[0214] 91 insulating sheet

[0215] 92 thermal conductive components

[0216] 93 Insulating Cover

[0217] 93h vent

[0218] 111 Fastening components

[0219] 112 Fastening components

[0220] LC1 First Centerline

[0221] LC2 Second Centerline

[0222] LX1 extension cable

[0223] MP mounting platform

[0224] MU main body

[0225] PS1 hypothetical location

[0226] R region

[0227] RG1 outer diameter region

[0228] SA assembly

[0229] SPC fastening workspace

[0230] SU subunit

[0231] SUX subunit

[0232] SUY subunit

[0233] SUZ subunit

[0234] T1 thickness

[0235] T2 thickness

[0236] T3 plate thickness

Claims

1. An electrical connection unit, characterized in that, have: An electronic component, wherein the electronic component has a terminal at its component end in a second direction; A wiring substrate having a base component and a busbar; the base component having a plate-shaped or sheet-shaped planar portion having a thickness in a first direction, the planar portion having a first surface facing the electronic component; The busbar is held by the planar portion, extends along the planar portion, and has a connecting portion; as well as A connecting component, the connecting component having a first part and a second part. The first portion has a first mounting hole extending along the second direction, faces the first surface, and has an upright posture in the first direction. The second portion has a second mounting hole extending along the first direction, protruding from the end of the first portion on the first surface side along the first surface. The connecting component is disposed between the electronic component and the busbar, electrically connecting the terminal to the connecting portion, and In a plan view taken from the first direction, the position of the second mounting hole is offset relative to the position of the first mounting hole from its side-by-side position in the second direction.

2. The electrical connection unit as claimed in claim 1, characterized in that, At least a portion of the connecting component is thicker than the busbar plate thickness.

3. The electrical connection unit as described in claim 1 or 2, characterized in that, It also has a first fastening part, which is inserted into the first mounting hole and is mounted on the terminal. The wiring substrate further includes a second fastening part, which is fixed to the busbar and inserted into the second mounting hole. In a plan view taken from the first direction, at least a portion of the second fastening portion overlaps with an outer diameter region, which is a region formed by extending the portion of the first fastening portion with the largest outer diameter in the second direction.

4. The electrical connection unit as described in claim 1 or 2, characterized in that, In the plan view, the second mounting hole is located on the first center line, which is the center line of the second portion extending along the second direction.

5. The electrical connection unit as described in claim 4, characterized in that, In the plan view, the first mounting hole is closer to the second center line than the second mounting hole, the second center line being the center line of the end of the component extending along the second direction.

6. The electrical connection unit as described in claim 1 or 2, characterized in that, The thickness of the first portion in the second direction is greater than the thickness of the second portion in the first direction.

Images