Automatic cutting system and method for multi-chain DNA synthetic rubber plate

By integrating components such as the MES control system and the digital twin system, the automated cutting system for multi-strand DNA synthesis gels has solved the problems of low efficiency and insufficient precision of manual operation. It has achieved high-precision, multi-station continuous cutting and collection of gels, improving experimental consistency and reliability.

CN121068291APending Publication Date: 2025-12-05DALIAN DAHUA ZHONGTIAN TECH CO LTD
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Patent Information

Application Number
CN202511236625.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-01
Publication Date
2025-12-05

AI Technical Summary

Technical Problem

The cutting process of multi-stranded DNA synthesis gels in the present technology relies on manual operation, which has problems such as low efficiency, insufficient precision, susceptibility to subjective factors, complex operation and easy introduction of exogenous nucleic acid contamination. Moreover, existing automated equipment is difficult to achieve high precision, multi-station continuous processing and flexible cutting.

Method used

By integrating an MES control system, a digital twin system, a rubber sheet pretreatment system, a rubber sheet cutting system, a ribbon detection camera, a ribbon pushing system, a rubber granule extrusion system, and a rubber granule collection device, the system achieves automated cutting and collection of rubber sheets through high-precision visual positioning, adaptive cutting, and intelligent control.

Benefits of technology

This improved the cutting precision and efficiency of multi-stranded DNA synthesis gels, ensured the uniformity of gel particles, reduced the breakage rate of gel particles, and enhanced experimental consistency and reliability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses an automatic cutting system and method for a multi-chain DNA synthetic rubber plate. The system comprises an MES control system, a digital twin system, a rubber plate pretreatment system, a rubber plate cutting system, a colored tape detection camera, a colored tape pushing system, a colloidal particle extrusion system and a colloidal particle collection device. Through the MES control system, the digital twin system, the rubber plate pretreatment system, the rubber plate cutting system, the colored tape detection camera, the colored tape pushing system, the rubber particle extrusion system and the rubber particle collection device, automatic cutting and collection of rubber plates synthesized by multi-chain DNA are realized; the requirements of high-throughput experiments are met, complex strips are accurately distinguished, and the situation that cutting position deviation affects the uniformity of colloidal particles and the subsequent purification efficiency is avoided; the single-time positioning error of a mechanical arm base coordinate system is small, and the requirement for millimeter-level DNA colloidal particle cutting precision can be met; and multi-station continuous processing is realized, and the processing efficiency, precision and experiment consistency are improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the field of multi-chain DNA synthesis gel plate cutting technology, and in particular to a multi-chain DNA synthesis gel plate automatic cutting system and method. BACKGROUND

[0002] As a key technology of genetic engineering and synthetic biology, multi-chain DNA synthesis has long relied on manual operation in its gel plate processing process. The traditional method requires experimenters to manually complete the cutting of the gel plate after electrophoresis, target band identification and gel particle collection, which has the following significant defects: manual cutting is inefficient, time-consuming and difficult to match the high-throughput experimental demand; the naked eye identification of DNA bands is easily disturbed by subjective factors, resulting in deviation of the cutting position and affecting the uniformity of the gel particles and the subsequent purification efficiency; in addition, multi-chain gel plates need to be cut according to different sequences, and manual operation is difficult to accurately distinguish complex bands, which is highly complex and frequent contact with the gel plate, which easily introduces exogenous nucleic acid contamination and reduces the reliability of the experiment. Although existing automatic equipment partially replaces manual operation, it still has obvious limitations: the single positioning error in the mechanical arm-based coordinate system is large, which is difficult to adapt to the millimeter-level DNA gel particle cutting precision requirement; the cutting, visual detection and storage modules lack coordinated control, and cannot realize multi-station continuous processing; the equipment lacks flexibility, and cannot dynamically adjust the cutting parameters according to the thickness of the gel plate or the distribution of the bands, resulting in a high gel particle breakage rate.

[0003] The above problems seriously restrict the large-scale application of multi-chain DNA synthesis experiments, and it is necessary to develop an integrated device that integrates high-precision visual positioning, adaptive cutting and intelligent control to improve processing efficiency, precision and experimental consistency. SUMMARY

[0004] Therefore, it is necessary to propose a multi-chain DNA synthesis gel plate automatic cutting system and method in view of the above problems.

[0005] A multi-chain DNA synthesis gel plate automatic cutting system, the method comprising:

[0006] An MES control system, in communication connection with a digital twin system, a gel plate pretreatment system and a gel plate cutting system, for receiving orders from a cloud platform and sending gel plate parameters in the orders to the digital twin system;

[0007] A digital twin system, for receiving the gel plate parameters and determining the spraying amount of the electric pulse liquid sprayed on the gel plate and the cutting depth of the gel plate according to the gel plate parameters; and sending the spraying amount and the cutting depth to the MES control system; the MES control system is further used to generate an electrophoresis liquid pump spraying instruction according to the spraying amount and the cutting depth, and send it to the gel plate pretreatment system;

[0008] The adhesive plate pretreatment system is configured to receive the electrophoretic liquid spraying instruction, spray the electrophoretic liquid in the spraying amount on the adhesive plate in the adhesive plate feeding area by clamping the electrophoretic liquid pump pipe, and transport the adhesive plate sprayed with the electrophoretic liquid to the adhesive plate cutting area.

[0009] The ribbon detection camera is in communication connection with the MES control system, and is configured to scan the frame of the adhesive plate, and output the collected ultraviolet fluorescent image to the MES control system and the digital twin system; the MES control system is further configured to generate a cutting coordinate matrix according to the ultraviolet fluorescent image, and send a first collection needle cylinder moving instruction to the adhesive plate cutting system and a non-stick buffer spraying instruction to the adhesive plate pretreatment system; the digital twin system is further configured to calculate a pose compensation amount according to the cutting coordinate matrix and send it to the adhesive plate cutting system; and the adhesive plate pretreatment system is further configured to receive the non-stick buffer spraying instruction to spray the non-stick buffer on the adhesive plate, and output a spraying completion instruction to the MES control system.

[0010] The adhesive plate cutting system is configured to receive the first collection needle cylinder moving instruction to clamp the collection needle cylinder to the collection area, and receive the pose compensation amount to calibrate the action of clamping the collection needle cylinder; the MES control system is further configured to receive the spraying completion instruction to send a cutting instruction to the adhesive plate cutting system; the adhesive plate cutting system is further configured to receive the cutting instruction and cut the adhesive plate sprayed with the non-stick buffer to obtain effective ribbons and waste, and output a cutting completion instruction to the MES control system; and the MES control system is further configured to receive the cutting completion instruction to output a pushing instruction to the ribbon pushing system.

[0011] The ribbon pushing system is in communication connection with the MES control system, and is configured to receive the pushing instruction and push the effective ribbons into the colloidal particle collection device, and output a pushing completion instruction to the MES control system; the MES control system is further configured to send a second collection needle cylinder moving instruction to the adhesive plate pretreatment system; the adhesive plate pretreatment system is further configured to receive the second collection needle cylinder moving instruction, move the collection needle cylinder from the collection area to the extrusion area, and send a moving completion instruction to the MES control system; and the MES control system is in communication connection with the MES control system, and is further configured to receive the moving completion instruction and send an extrusion instruction to the colloidal particle extrusion system.

[0012] The colloidal particle extrusion system is configured to receive the extrusion instruction to extrude the effective ribbons in the collection needle cylinder in the extrusion area into colloidal particles, and extrude the colloidal particles into the colloidal particle collection device.

[0013] The colloidal particle collection device is configured to collect the colloidal particles.

[0014] In one embodiment, the adhesive sheet pretreatment system comprises:

[0015] A pretreatment mechanical arm is configured to drive the second parallel opening and closing electric claw and the dot matrix suction cup to operate;

[0016] The second parallel opening and closing electric claw is configured to clamp the electrophoretic liquid pump pipe;

[0017] The dot matrix suction cup is configured to adsorb the adhesive sheet and move the adhesive sheet to the adhesive sheet cutting area;

[0018] The electrophoretic liquid pump pipe is configured to spray the electrophoretic liquid of the spraying amount to the adhesive sheet in the adhesive sheet loading area.

[0019] In one embodiment, the adhesive sheet cutting system comprises:

[0020] A cutting mechanical arm is configured to drive the rotary opening and closing electric claw and the first parallel opening and closing electric claw to operate;

[0021] The rotary opening and closing electric claw is configured to clamp the collection needle cylinder;

[0022] The first parallel opening and closing electric claw is configured to clamp the adhesive sheet cutting knife;

[0023] The adhesive sheet cutting knife is configured to cut the adhesive sheet sprayed with the anti-sticking buffer into effective ribbons and waste materials.

[0024] In one embodiment, the adhesive sheet collection device comprises:

[0025] A collection tray is configured to collect the waste materials;

[0026] A collection needle cylinder is configured to collect the effective ribbons.

[0027] An automatic cutting method of a multi-chain DNA synthesis adhesive sheet, the method comprising:

[0028] S1: Start the MES control system, send the equipment state query instruction to the adhesive sheet pretreatment system and the adhesive sheet cutting system; the adhesive sheet pretreatment system and the adhesive sheet cutting system feed back the offline or online signal to the MES control system through the Ethernet, when all the equipment states are displayed as online, the MES control system enters the ready state; and receive the order from the cloud platform, and send the adhesive sheet parameters in the order to the digital twin system;

[0029] S2: The digital twin system calls the pre-stored three-dimensional model, combines the parameters of the adhesive plate, simulates the cutting path in the virtual environment, calculates the spraying amount of the electrophoretic liquid sprayed on the adhesive plate and the cutting depth of the adhesive plate, and returns the simulation result to the MES control system. The MES control system generates electrophoretic liquid pump spraying instructions according to the spraying amount and the cutting depth, and sends them to the adhesive plate pretreatment system through a TLS1.3 encrypted channel;

[0030] S3: After the adhesive plate pretreatment system receives the electrophoretic liquid pump spraying instructions, it immediately returns an acknowledgement packet to the MES control system, clamps the electrophoretic liquid pump tube to spray the electrophoretic liquid on the adhesive plate in the adhesive plate loading area in the spraying amount, and transports the adhesive plate sprayed with electrophoretic liquid to the adhesive plate cutting area according to the preset program;

[0031] S4: The color band detection camera scans the frame of the adhesive plate and outputs the collected ultraviolet fluorescence image to the MES control system and the digital twin system. The MES control system is also used to generate a cutting coordinate matrix according to the ultraviolet fluorescence image, and send a first collection needle cylinder moving instruction to the adhesive plate cutting system and a anti-sticking buffer spraying instruction to the adhesive plate pretreatment system. The digital twin system is also used to simulate the cutting path according to the cutting coordinate matrix, detect the interference risk, calculate the pose compensation amount, and send it to the adhesive plate cutting system. The adhesive plate pretreatment system is also used to receive the anti-sticking buffer spraying instruction to spray the anti-sticking buffer on the adhesive plate, and output a spraying completion instruction to the MES control system;

[0032] S5: The adhesive plate cutting system receives the first collection needle cylinder moving instruction to clamp the collection needle cylinder to the collection area, and receives the pose compensation amount to calibrate the action of clamping the collection needle cylinder. The MES control system receives the spraying completion instruction to send a cutting instruction to the adhesive plate cutting system. The adhesive plate cutting system receives the cutting instruction and cuts the adhesive plate sprayed with the anti-sticking buffer to obtain effective color bands and waste, and outputs a cutting completion instruction to the MES control system. The MES control system outputs a pushing instruction to the color band pushing system according to the cutting completion instruction;

[0033] S6: The color band pushing system receives the pushing instruction and pushes the effective color bands into the colloidal particle collection device, and outputs a pushing completion instruction to the MES control system. The MES control system sends a second collection needle cylinder moving instruction to the adhesive plate pretreatment system. The adhesive plate pretreatment system receives the second collection needle cylinder moving instruction and moves the collection needle cylinder from the collection area to the extrusion area, and sends a moving completion instruction to the MES control system. The MES control system receives the moving completion instruction and sends an extrusion instruction to the colloidal particle extrusion system;

[0034] S7: The pellet extrusion system receives the extrusion instruction to extrude the effective toner in the collection syringe of the extrusion area into pellets, and extrudes the pellets into a pellet collection device, the particle size of the pellets is less than or equal to 1mm; after the extrusion is completed, the pellet extrusion system sends a data packet containing pressure curve data to the MES control system for encryption.

[0035] In one embodiment, the automatic cutting method of the multi-strand DNA synthesis gel plate further comprises:

[0036] S8: The digital twin system maps the cutting progress in real time, optimizes the subsequent path, and predicts the waste distribution;

[0037] S9: After the pellets are filtered through the filter membrane, they flow into a sterile filtration tube, and the RFID tag records the batch information and synchronizes it to the database of the MES control system;

[0038] S10: The digital twin system synchronizes the data stored in the MES control system, dynamically updates the pellet position, remaining capacity, and batch status in a three-dimensional interface;

[0039] S11: The MES control system generates an experimental report in combination with the data of the digital twin system;

[0040] S12: Abnormal data triggers a self-learning algorithm to optimize the cutting parameters for the next batch.

[0041] The automatic cutting method of the multi-strand DNA synthesis gel plate, characterized in that,

[0042] The gel plate parameters include: target DNA strand number, gel plate cutting thickness, and gel plate cutting size; the gel plate cutting thickness is 1-5mm, and the gel plate cutting size is 100-300mm²;

[0043] The spraying amount of the electric pulse liquid is 10μL / cm²±2μL, and the cutting depth is 1-3mm;

[0044] The spraying amount of the anti-sticking buffer is 10μL / cm²±2μL.

[0045] In one embodiment,

[0046] For the step S3, the gel plate is sprayed with the electric pulse liquid in the spraying amount by the gel plate pre-treatment system, and the gel plate sprayed with the electric pulse liquid is transported to the gel plate cutting area, which includes: the second parallel opening and closing electric claw is switched to a dot matrix suction cup by the pre-treatment mechanical arm of the gel plate pre-treatment system, the dot matrix suction cup is used to adsorb the gel plate sprayed with the electric pulse liquid, and the gel plate is transported to the gel plate cutting area.

[0047] For the step of clamping the collection needle cylinder to the collection area in step S5, the rotating open-close electric claw is clamped to the collection area by the cutting mechanical arm of the rubber plate cutting system;

[0048] For the step of cutting the rubber plate sprayed with the anti-sticking buffer to obtain effective ribbons and waste in step S5, the rotating open-close electric claw is replaced by the first parallel open-close electric claw by the cutting mechanical arm, and the rubber plate cutting knife is clamped by the first parallel open-close electric claw to cut the rubber plate sprayed with the anti-sticking buffer to obtain effective ribbons and waste.

[0049] In one embodiment,

[0050] The scanning mode of the ribbon detection camera is as follows: vertical scanning at a distance of 10 cm from the rubber plate, the ultraviolet light source irradiates the rubber plate at an angle of 45°±5°, and the photometric sensor is dynamically adjusted to the optimal brightness to complete rough positioning.

[0051] In one embodiment, the step of cutting the rubber plate sprayed with the anti-sticking buffer by the rubber plate cutting knife is as follows:

[0052] The cutting mechanical arm drives the rubber plate cutting knife to perform block rough cutting according to the cutting coordinate matrix, retains a 0.5 mm connecting rib, cuts off the connecting rib to form independent ribbons, cuts horizontally from the +Y side to the -Y side, the row distance is 0.3 mm larger than the ribbon height, the cutting depth is the thickness of the rubber plate, the feeding speed is 50 mm / s during the idle stroke, the feeding speed is 5 mm / s±0.1 mm / s during the cutting section, and the feeding speed is 5 mm / s±0.1 mm / s during the cutting section. 0.2 mm is returned for each cutting of 10 mm to remove debris;

[0053] The longitudinal cutting is started to cut vertically from the +X side to the -X side, the column distance is 0.3 mm larger than the ribbon width, the cutting depth is the thickness of the rubber plate, the negative pressure adsorption is started during the whole cutting process to remove debris in time, and the data collected by the force sensor in real time during the cutting process is transmitted back to the MES control system through the OPCUA over TLS protocol encryption, and the cutting depth is dynamically adjusted according to the thickness of the rubber plate.

[0054] The present application realizes the automatic cutting and collection of the rubber plate for multi-chain DNA synthesis through the MES control system 10, the digital twin system 20, the rubber plate pretreatment system 30, the rubber plate cutting system 40, the ribbon detection camera 50, the ribbon pushing system 60, the rubber particle extrusion system 70 and the rubber particle collection device 80; avoids cutting position deviation, thereby affecting the uniformity of rubber particles and the subsequent purification efficiency; realizes multi-station continuous processing, improves processing efficiency, precision and experimental consistency. BRIEF DESCRIPTION OF DRAWINGS

[0055] In order to make the technical solutions in the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced below. Obviously, the accompanying drawings in the following description only represent some of the embodiments of the present application, and all other embodiments obtained by those of ordinary skill in the art without creative efforts based on these accompanying drawings also belong to the protection scope of the present application.

[0056] wherein:

[0057] Figure 1 is a structural block diagram of a multi-strand DNA synthesis gel plate automatic cutting system in an embodiment;

[0058] Figure 2 is a physical diagram of a multi-strand DNA synthesis gel plate automatic cutting system in an embodiment;

[0059] Figure 3 is a flowchart of a multi-strand DNA synthesis gel plate automatic cutting method in an embodiment. DETAILED DESCRIPTION

[0060] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments only represent some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts also belong to the protection scope of the present application.

[0061] As a key technology of genetic engineering and synthetic biology, the gel plate processing flow of multi-strand DNA synthesis has long relied on manual operation. The traditional method requires experimenters to manually complete the cutting of the gel plate after electrophoresis, target band recognition and gel particle collection, which has the following significant defects: manual cutting is inefficient, time-consuming and difficult to match the high-throughput experimental demand; the naked eye recognition of DNA bands is easily disturbed by subjective factors, leading to cutting position deviation, and then affecting the uniformity of gel particles and the subsequent purification efficiency; in addition, the multi-strand gel plate needs to be cut layer by layer according to different sequences, and manual operation is difficult to accurately distinguish complex bands, the operation complexity is high, and frequent contact with the gel plate easily introduces exogenous nucleic acid contamination, reducing the experimental reliability. Although the existing automatic equipment partially replaces manual operation, it still has obvious limitations: the single positioning error in the mechanical arm-based coordinate system is large, which is difficult to adapt to the millimeter-level DNA gel particle cutting precision requirement; the cutting, visual detection and storage modules lack collaborative control, and cannot realize multi-station continuous processing; the equipment lacks flexibility, and cannot dynamically adjust the cutting parameters according to the thickness of the gel plate or the distribution of the bands, resulting in a high gel particle breakage rate. The above problems seriously restrict the large-scale application of multi-strand DNA synthesis experiments, and it is urgent to develop an integrated equipment with high-precision visual positioning, adaptive cutting and intelligent control to improve the processing efficiency, precision and experimental consistency.

[0062] To solve the above technical problems, the present application provides a multi-chain DNA synthesis gel plate automatic cutting system, as shown in the figure, the system comprises: an MES control system 10, a digital twin system 20, a gel plate pretreatment system 30, a gel plate cutting system 40, a color band detection camera 50, a color band pushing system 60, a gel particle extrusion system 70 and a gel particle collection device 80, wherein, Figure 1 The MES control system 10 is in communication connection with the digital twin system 20, the gel plate pretreatment system 30 and the gel plate cutting system 40, used for receiving orders of a cloud platform, and sending gel plate parameters in the orders to the digital twin system 20;

[0063] The digital twin system 20 is used for receiving the gel plate parameters, and determining a spraying amount of electrophoretic liquid sprayed to the gel plate and a cutting depth of cutting the gel plate according to the gel plate parameters; and sending the spraying amount and the cutting depth to the MES control system 10; the MES control system 10 is further used for generating electrophoretic liquid pump spraying instructions according to the spraying amount and the cutting depth, and sending to the gel plate pretreatment system 30; the digital twin system constructs corresponding digital twins according to the characteristics of the intelligent laboratory, and realizes a data-driven visualization platform based on a laboratory model. Through the mutual mapping of virtual models and actual physical units, the overall running state of the laboratory can be better monitored by the management personnel;

[0064] The gel plate pretreatment system 30 is used for receiving the electrophoretic liquid pump spraying instructions, so as to clamp an electrophoretic liquid pump pipe to spray the electrophoretic liquid with the spraying amount to the gel plate in a gel plate feeding area, and transport the gel plate 90 sprayed with the electrophoretic liquid to a gel plate cutting area;

[0065] The color band detection camera 50 is in communication connection with the MES control system 10, the color band detection camera 50 integrates a high-resolution industrial camera and an ultraviolet excitation light source, realizes DNA band recognition of the gel plate based on OpenCV and YOLOv5 algorithms; used for scanning a frame of the gel plate, and outputting collected ultraviolet fluorescence images to the MES control system 10 and the digital twin system 20; the MES control system 10 is further used for generating a cutting coordinate matrix according to the ultraviolet fluorescence images, and sending a first collection needle cylinder moving instruction to the gel plate cutting system 40, and sending an anti-sticking buffer spraying instruction to the gel plate pretreatment system 30; the digital twin system 20 is further used for calculating a pose compensation amount according to the cutting coordinate matrix, and sending to the gel plate cutting system 40; the gel plate pretreatment system 30 is further used for receiving the anti-sticking buffer spraying instruction, so as to spray the anti-sticking buffer to the gel plate, and outputting a spraying completion instruction to the MES control system 10;

[0066] The color band detection camera 50 is in communication connection with the MES control system 10, the color band detection camera 50 integrates a high-resolution industrial camera and an ultraviolet excitation light source, realizes DNA band recognition of the gel plate based on OpenCV and YOLOv5 algorithms; used for scanning a frame of the gel plate, and outputting collected ultraviolet fluorescence images to the MES control system 10 and the digital twin system 20; the MES control system 10 is further used for generating a cutting coordinate matrix according to the ultraviolet fluorescence images, and sending a first collection needle cylinder moving instruction to the gel plate cutting system 40, and sending an anti-sticking buffer spraying instruction to the gel plate pretreatment system 30; the digital twin system 20 is further used for calculating a pose compensation amount according to the cutting coordinate matrix, and sending to the gel plate cutting system 40; the gel plate pretreatment system 30 is further used for receiving the anti-sticking buffer spraying instruction, so as to spray the anti-sticking buffer to the gel plate, and outputting a spraying completion instruction to the MES control system 10;

[0067] The adhesive sheet cutting system 40 is configured to receive the first collection needle cylinder moving instruction to clamp a collection needle cylinder to a collection area, and receive the pose compensation amount to calibrate the action of clamping the collection needle cylinder; the MES control system 10 is further configured to receive the spraying completion instruction to send a cutting instruction to the adhesive sheet cutting system 40; the adhesive sheet cutting system 40 is further configured to receive the cutting instruction, cut the adhesive sheet sprayed with the anti-sticking buffer to obtain effective ribbon and waste, and output a cutting completion instruction to the MES control system 10; the MES control system 10 is further configured to receive the cutting completion instruction to output a pushing instruction to the ribbon pushing system 60;

[0068] The ribbon pushing system 60 is in communication connection with the MES control system 10, configured to receive the pushing instruction, push the effective ribbon into the bead collecting device 80, and output a pushing completion instruction to the MES control system 10; the MES control system 10 is further configured to send a second collection needle cylinder moving instruction to the adhesive sheet pretreatment system 30; the adhesive sheet pretreatment system 30 is further configured to receive the second collection needle cylinder moving instruction, move the collection needle cylinder from the collection area to the extrusion area, and send a moving completion instruction to the MES control system 10; the MES control system 10 is in communication connection with the MES control system 10, and is further configured to receive the moving completion instruction and send an extrusion instruction to the bead extrusion system 70;

[0069] The bead extrusion system 70 is configured to receive the extrusion instruction to extrude the effective ribbon in the collection needle cylinder in the extrusion area into beads, and extrude the beads into the bead collecting device 80;

[0070] The bead collecting device 80 is configured to collect the beads.

[0071] Specifically, as shown in Figure 2 The adhesive sheet pretreatment system 30 includes a pretreatment mechanical arm 301, a second parallel opening and closing electric claw 302, a dot matrix suction cup 303, and an electrophoretic liquid pump pipe 304. The pretreatment mechanical arm 301 is a four-degree-of-freedom collaborative mechanical arm, configured to drive the second parallel opening and closing electric claw 302 and the dot matrix suction cup 303 to act; the second parallel opening and closing electric claw 302 is configured to clamp the electrophoretic liquid pump pipe; the dot matrix suction cup 303 is configured to adsorb the adhesive sheet and move the adhesive sheet to the adhesive sheet cutting area; and the electrophoretic liquid pump pipe 304 is configured to spray the electrophoretic liquid of the spraying amount to the adhesive sheet in the adhesive sheet feeding area.

[0072] The glue plate cutting system 40 comprises a cutting mechanical arm 401, a rotating open-close electric claw 402, a first parallel open-close electric claw 403, and a glue plate cutting knife 404, wherein the cutting mechanical arm 401 is a seven-degree-of-freedom collaborative mechanical arm, used to drive the rotating open-close electric claw 402 and the first parallel open-close electric claw 403 to act.

[0073] The rotating open-close electric claw 402 is used to clamp the collection needle cylinder; the first parallel open-close electric claw 403 is used to clamp the glue plate cutting knife 404; and the glue plate cutting knife 404 is used to cut the glue plate 90 sprayed with the anti-sticking buffer into effective ribbons and waste materials.

[0074] The glue particle collection device 80 comprises a collection tray 801 and a collection needle cylinder 802, wherein the collection tray 801 is used to collect the waste materials, and the collection needle cylinder 802 is used to collect the effective ribbons.

[0075] The application also provides a multi-chain DNA synthesis glue plate automatic cutting method, as shown in the specification. Figure 3 The method comprises the following steps:

[0076] S1: Start the MES control system 10, send a device state query instruction to the glue plate pretreatment system 30 and the glue plate cutting system 40; the glue plate pretreatment system 30 and the glue plate cutting system 40 feed back an “offline” or “online” signal to the MES control system 10 through Ethernet; when the states of all devices are displayed as “online”, the MES control system 10 enters a ready state; and receive an order from a cloud platform, and send glue plate parameters in the order to the digital twin system 20;

[0077] S2: The digital twin system 20 calls a pre-stored three-dimensional model, simulates a cutting path in a virtual environment in combination with the glue plate parameters, calculates a spraying amount of electrophoretic liquid sprayed on the glue plate and a cutting depth for cutting the glue plate, and returns the simulation result to the MES control system 10; the MES control system 10 generates an electrophoretic liquid pump spraying instruction according to the spraying amount and the cutting depth, and sends the electrophoretic liquid pump spraying instruction to the glue plate pretreatment system 30 through a TLS1.3 encryption channel;

[0078] S3: After receiving the electrophoretic liquid pump spraying instruction, the glue plate pretreatment system 30 immediately returns an acknowledgement packet to the MES control system 10, clamps an electrophoretic liquid pump pipe, sprays the electrophoretic liquid with the spraying amount on the glue plate in the glue plate feeding area, and transports the glue plate 90 sprayed with the electrophoretic liquid to the glue plate cutting area according to a preset program.

[0079] S4: The color band detection camera 50 scans the frame of the gel plate and outputs the collected ultraviolet fluorescence image to the MES control system 10 and the digital twin system 20; the MES control system 10 is also used to generate a cutting coordinate matrix according to the ultraviolet fluorescence image, and send a first collection needle cylinder moving instruction to the gel plate cutting system 40 and a anti-sticking buffer spraying instruction to the gel plate pretreatment system 30 according to the cutting coordinate matrix; the digital twin system 20 is also used to simulate a cutting path according to the cutting coordinate matrix, detect interference risks and calculate a pose compensation amount, and send to the gel plate cutting system 40; the gel plate pretreatment system 30 is also used to receive the anti-sticking buffer spraying instruction to spray anti-sticking buffer to the gel plate, and output a spraying completion instruction to the MES control system 10;

[0080] S5: The gel plate cutting system 40 receives the first collection needle cylinder moving instruction to clamp the collection needle cylinder to the collection area, and receives the pose compensation amount to calibrate the action of clamping the collection needle cylinder; the MES control system 10 receives the spraying completion instruction to send a cutting instruction to the gel plate cutting system 40; the gel plate cutting system 40 receives the cutting instruction and cuts the gel plate sprayed with anti-sticking buffer to obtain effective color bands and waste, and outputs a cutting completion instruction to the MES control system 10; the MES control system 10 sends the cutting completion instruction to the color band pushing system 60 to output a pushing instruction;

[0081] S6: The color band pushing system 60 receives the pushing instruction and pushes the effective color bands into the gel particle collection device 80, and outputs a pushing completion instruction to the MES control system 10; the MES control system 10 sends a second collection needle cylinder moving instruction to the gel plate pretreatment system 30; the gel plate pretreatment system 30 receives the second collection needle cylinder moving instruction and moves the collection needle cylinder from the collection area to the extrusion area, and sends a moving completion instruction to the MES control system 10; the MES control system 10 receives the moving completion instruction and sends an extrusion instruction to the gel particle extrusion system 70;

[0082] S7: The gel particle extrusion system 70 receives the extrusion instruction to extrude the effective color bands in the collection needle cylinder in the extrusion area into gel particles, and extrudes the gel particles into the gel particle collection device 80, the particle size of the gel particles is less than or equal to 1mm; after extrusion, the gel particle extrusion system 70 sends a data packet containing pressure curve data to the MES control system 10.

[0083] Further, the multi-chain DNA synthesis gel plate automatic cutting method also includes:

[0084] S8: The digital twin system 20 maps the cutting progress in real time, optimizes the subsequent path, and predicts the waste distribution;

[0085] S9: After the gel particles are filtered through the filter membrane, they flow into the sterile filtration tube, and the RFID tag records the batch information and synchronizes it to the database of the MES control system 10;

[0086] S10: The digital twin system 20 synchronizes the data stored in the MES control system 10, dynamically updates the gel particle position, remaining capacity, and batch status in the three-dimensional interface;

[0087] S11: The MES control system 10 generates an experimental report in combination with the data of the digital twin system 20;

[0088] S12: Abnormal data triggers a self-learning algorithm to optimize the cutting parameters for the next batch.

[0089] In one embodiment, the gel plate parameters include: target DNA strand number, gel plate cutting thickness, and gel plate cutting size; the gel plate cutting thickness is 1-5 mm, and the gel plate cutting size is 100-300 mm²; the spraying amount of the electroporation solution is 10 μL / cm²±2 μL, and the cutting depth is 1-3 mm; the spraying amount of the anti-sticking buffer is 10 μL / cm²±2 μL.

[0090] In one embodiment,

[0091] For the step S3, the gel plate spraying the spraying amount of electrophoresis liquid on the gel plate in the gel plate loading area, and transporting the gel plate 90 sprayed with electrophoresis liquid to the gel plate cutting area includes: the second parallel opening and closing electric claw 302 is driven by the pretreatment mechanical arm 301 of the gel plate pretreatment system 30 to spray the spraying amount of electrophoresis liquid on the gel plate in the gel plate loading area, the second parallel opening and closing electric claw 302 is switched to the dot matrix suction cup 303 by the pretreatment mechanical arm 301, the gel plate 90 sprayed with electrophoresis liquid is adsorbed by the dot matrix suction cup 303, and is transported to the gel plate cutting area;

[0092] For the step S5, the clamping collection needle cylinder to the collection area includes: the rotating opening and closing electric claw 402 is driven by the cutting mechanical arm 401 of the gel plate cutting system 40 to clamp the collection needle cylinder to the collection area;

[0093] For the step S5, the gel plate sprayed with the anti-sticking buffer is cut to obtain effective color bands and waste, which includes: the first parallel opening and closing electric claw 403 is switched to the gel plate cutting knife 404 by the cutting mechanical arm 401, and the gel plate sprayed with the anti-sticking buffer is cut to obtain effective color bands and waste.

[0094] In one embodiment,

[0095] The scanning mode of the color band detection camera 50 is as follows: scanning vertically at a distance of 10 cm from the rubber plate, the ultraviolet light source irradiates the rubber plate at an angle of 45°±5°, and the photometric sensor is dynamically adjusted to the optimal brightness; complete rough positioning.

[0096] In one embodiment, the rubber plate cutting knife 404 performs the following steps to cut the rubber plate sprayed with the anti-sticking buffer:

[0097] The cutting mechanical arm 401 drives the rubber plate cutting knife 404 to perform block rough cutting according to the cutting coordinate matrix, leaving a 0.5 mm connecting rib, then cutting off the connecting rib to form an independent color band, cutting horizontally from the +Y side to the -Y side, the row distance is 0.3 mm larger than the color band height, the cutting depth is the thickness of the rubber plate, the feeding speed is 50 mm / s during idle stroke, the feeding speed is 5 mm / s±0.1 mm / s during cutting section, and the cutting is 0.2 mm back for each 10 mm to remove debris;

[0098] Start longitudinal cutting and cut vertically from the +X side to the -X side, the column distance is 0.3 mm larger than the color band width, the cutting depth is the thickness of the rubber plate, the negative pressure adsorption is turned on during the whole cutting process to remove debris in time, and the data collected by the force sensor in real time during the cutting process is encrypted and returned to the MES control system 10 through OPC UA over TLS protocol, and the cutting depth is dynamically adjusted according to the thickness of the rubber plate.

[0099] In order to more clearly describe the multi-chain DNA synthesis rubber plate automatic cutting method of the present application, the present application includes:

[0100] The operation process and control logic are as follows:

[0101] 1. Experimental process configuration and device initialization

[0102] Step 1: Start the server of the MES control system 10, send device state query instructions to the rubber plate pretreatment system 30 and the rubber plate cutting system 40, the rubber plate pretreatment system 30 and the rubber plate cutting system 40 feedback “offline” or “online” signals to the interface of the MES control system 10 through Ethernet, when the state of all devices is displayed as “online”, the MES control system 10 enters the ready state;

[0103] Step 2: Select the rubber plate parameters and storage requirements on the order page of the MES control system 10, the rubber plate parameters include: target DNA chain number, rubber plate cutting thickness and rubber plate cutting size; the rubber plate cutting thickness is 1-5 mm, and the rubber plate cutting size is 100-300 mm²; the MES control system 10 encapsulates the rubber plate parameters into a JSON format data packet, stores it in the cloud database, and triggers the simulation task of the digital twin system 20.

[0104] Step 3: The digital twin system 20 calls the pre-stored three-dimensional model, combines the gel plate parameters uploaded by the MES control system 10, simulates the cutting path in the virtual environment, calculates the spraying amount of the electrophoretic liquid (10 μL / cm²±2 μL) and the cutting depth (1-3 mm), and returns the simulation results to the MES control system 10. The MES control system 10 generates standardized control instructions and transmits them to the controller in the gel plate pretreatment system 30 through a TLS 1.3 encrypted channel;

[0105] 2. Gel plate pretreatment and positioning calibration

[0106] Step 4: After receiving the MES control system 10 instructions, the gel plate pretreatment system 30 immediately returns an acknowledgement packet (cmd=101). The pretreatment mechanical arm of the gel plate pretreatment system 30 moves to the tool holder and switches to the second parallel open-close electric claw 302 to hold the electrophoretic liquid pump pipe. The pretreatment mechanical arm moves to the gel plate loading area according to the preset program, sprays the buffer solution (spraying amount 10 μL / cm²±2 μL) through PID flow control, sends an execution completion packet (cmd=102) to the MES system, and triggers the next instruction.

[0107] Step 5: The pretreatment mechanical arm moves to the dot matrix suction cup and replaces the second parallel open-close electric claw 302 with the dot matrix suction cup. The dot matrix suction cup adsorbs the gel plate and transports it to the gel plate cutting area.

[0108] Step 6: The ribbon detection camera scans the gel plate. The ribbon detection camera scans vertically at a distance of 10 cm from the gel plate. The ultraviolet light source irradiates the gel plate at an angle of 45°±5°. The luminosity sensor dynamically adjusts to the optimal brightness. The coarse positioning (accuracy ±0.5 mm) is completed (for the frame and peripheral positioning of the gel plate), and the ultraviolet fluorescence image of the gel plate is collected and sent to the MES control system 10 through AES-256-GCM encryption.

[0109] The MES control system 10 uses a multispectral fusion recognition algorithm. The ultraviolet fluorescence image is denoised by Gaussian filtering (σ=1.5), and then the ROI region of the denoised ultraviolet fluorescence image is extracted based on the YOLOv5 segmentation model. The center line coordinates and boundary box size (accuracy ±15 μm) of the ROI region are calculated by sub-pixel edge detection. The cutting coordinate matrix is generated based on the center line coordinates and boundary box size. When the cutting coordinate matrix is formed, to prevent adhesion boundaries, it is automatically expanded by 0.2 mm. The cutting coordinates are converted from the cutting coordinate matrix by the MES control system 10 and sent to the controller of the gel plate cutting system 40. The controller of the gel plate cutting system 40 sets the parameters of the gel plate cutting mechanical arm and determines the cutting coordinate matrix (accuracy ±20 μm) on the ultraviolet fluorescence image.

[0110] Step 7: The digital twin system 20 loads the cutting coordinate matrix in the virtual environment, simulates the cutting path and detects interference risks, calculates the pose compensation amount (≤0.1 mm) and returns it to the MES control system 10, and the MES control system 10 sends the pose compensation amount (≤0.1 mm) to the rubber plate cutting mechanical arm for calibration.

[0111] 3. Adaptive cutting and waste sorting

[0112] Step 8: The MES control system 10 sends instructions to the rubber plate cutting system 40, and the rubber plate cutting system 40 moves to the needle tube placement area with rotating open-close electric claws to clamp and collect the needle cylinder to the rubber particle collection device. The MES control system 10 sends instructions to the pretreatment mechanical arm to spray the cutting area rubber plate with anti-sticking buffer solution. Send a completion confirmation (cmd=102) to the MES control system 10, and after the MES verifies the feedback, issue the cutting instruction. Then the rubber plate cutting mechanical arm switches from the rotating open-close electric claws to the parallel open-close electric claws 1 and moves to the rubber plate cutting knife to clamp it. Execute block rough cutting according to the coordinate matrix, reserve 0.5mm connecting ribs, and then cut off the connecting ribs to form independent color bands. Cut horizontally from the +Y side to the -Y side, with a row distance of 0.3mm larger than the color band height, a cutting depth of the rubber plate thickness, an empty stroke feeding speed of 50mm / s, a cutting segment feeding speed of 5mm / s±0.1mm / s, and a 0.2mm backoff for every 10mm cut for chip removal. Turn on the longitudinal cutting to cut vertically from the +X side to the -X side, with a column distance of 0.3mm larger than the color band width, a cutting depth of the rubber plate thickness, and a negative pressure adsorption throughout the cutting process to remove debris in time. The data collected by the force sensor in real time during the cutting process is encrypted and returned to the MES control system 10 through the OPC UA over TLS protocol, and the cutting depth is dynamically adjusted according to the rubber plate thickness (error ±0.05 mm);

[0113] Step 9: After cutting is completed, the MES control system 10 sends a pushing instruction to the pneumatic push rod to push the waste into the waste rubber collection tray, and the effective color band slides through the conical guide hole to the collection needle cylinder. The pretreatment mechanical arm 301 clamps the collection needle cylinder from the collection area to the extrusion area.

[0114] Step 10: The digital twin system 20 maps the cutting progress in real time, optimizes the subsequent path, and predicts the waste distribution.

[0115] 4. Rubber particle collection and storage

[0116] Step 11: MES control system 10 issues instructions to the granule extrusion device. After receiving the instructions from the MES control system 10, the pneumatic extrusion device returns a confirmation packet (cmd=101) to start the pneumatic push rod piston, which extrudes the color band in the collection needle cylinder into granules with a particle size of ≤1mm. The granules are extruded into the bottom filter tube. After the extrusion is complete, the execution result packet (cmd=102) containing the pressure curve data (encrypted format) is sent to the MES control system 10;

[0117] Step 12: After the granules are filtered through the filter membrane, they flow into the sterile filter tube. The RFID tag records the batch information and synchronizes it to the database of the MES control system 10;

[0118] Step 13: The digital twin system 20 synchronizes the stored data of the MES control system 10 and dynamically updates the granule position, remaining capacity, and batch status in the three-dimensional interface. Experimenters can remotely monitor the storage unit status through the visual interface;

[0119] 5. Full-process monitoring and feedback optimization

[0120] Step 14: The MES control system 10 generates an experiment report based on the data from the digital twin system 20;

[0121] Step 15: Abnormal data triggers a self-learning algorithm to optimize the cutting parameters for the next batch;

[0122] 6. Technical details and coordination mechanism

[0123] Positioning and path planning: Under the drive of the digital twin system 20, the V-model synchronizes the cutting progress, granule storage status, and device health data in real time. Simulation rehearsal reduces operational errors and improves efficiency by 15%-20%.

[0124] Modular expansion: The quick jaw-changing mechanism supports electrophoretic liquid spraying, adhesive plate adsorption, and cutting function switching. The open API interface is compatible with multi-fluorescently labeled adhesive plates and cross-platform data synchronization.

[0125] System coordination architecture: Operation execution module: adhesive plate cutting robot, pretreatment robot, crushing device; Information processing module: vision detection camera, MES system, digital twin system;

[0126] Communication fault tolerance mechanism: Time-out retransmission: If no confirmation packet is received within 500ms after issuing an instruction, it is automatically reissued (up to 3 times);

[0127] Certificate revocation check: Real-time verification of device certificate status through OCSP binding. Invalid certificates trigger an alarm;

[0128] Data integrity check: CRC-32 (polynomial 0x04C11DB7) is used to check the instruction packet. The error packet discard rate is 100%.

[0129] Breakpoint continuation: when the task is suspended due to network interruption, the MES records the breakpoint state and continues to execute from the fault point after recovery.

[0130] Energy management module: wireless charging pile (if extended) supports automatic low-power return charging of the device.

[0131] Through the cooperation of the above modules, full-closed-loop automatic control from rubber plate input to rubber particle storage is realized, manual intervention is reduced by 95%, and experimental efficiency is improved by 5-8 times.

[0132] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0133] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent of the present application. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A multi-stranded DNA synthesis gel pad automated cutting system, comprising: The system comprises: An MES control system in communication with the digital twin system, the adhesive plate pretreatment system and the adhesive plate cutting system, configured to receive an order from a cloud platform and send adhesive plate parameters in the order to the digital twin system; The digital twin system is configured to receive the adhesive plate parameters and determine a spraying amount of electrophoretic liquid to be sprayed on the adhesive plate and a cutting depth for cutting the adhesive plate according to the adhesive plate parameters, and send the spraying amount and the cutting depth to the MES control system; the MES control system is further configured to generate electrophoretic liquid pump spraying instructions according to the spraying amount and the cutting depth and send the electrophoretic liquid pump spraying instructions to the adhesive plate pretreatment system; The adhesive plate pretreatment system is configured to receive the electrophoretic liquid pump spraying instructions, clamp an electrophoretic liquid pump tube to spray the electrophoretic liquid on the adhesive plate in the adhesive plate feeding area by the spraying amount, and transport the adhesive plate sprayed with the electrophoretic liquid to an adhesive plate cutting area; A color band detection camera in communication with the MES control system is configured to scan a frame of the adhesive plate and output an ultraviolet fluorescence image collected to the MES control system and the digital twin system; the MES control system is further configured to generate a cutting coordinate matrix according to the ultraviolet fluorescence image, send a first collection needle cylinder moving instruction to the adhesive plate cutting system according to the cutting coordinate matrix, and send an anti-sticking buffer spraying instruction to the adhesive plate pretreatment system; the digital twin system is further configured to calculate a pose compensation amount according to the cutting coordinate matrix and send the pose compensation amount to the adhesive plate cutting system; and the adhesive plate pretreatment system is further configured to receive the anti-sticking buffer spraying instruction to spray the anti-sticking buffer on the adhesive plate and output a spraying completion instruction to the MES control system; The adhesive plate cutting system is configured to receive the first collection needle cylinder moving instruction to clamp a collection needle cylinder to a collection area and receive the pose compensation amount to calibrate an action of clamping the collection needle cylinder; the MES control system is further configured to receive the spraying completion instruction to send a cutting instruction to the adhesive plate cutting system; the adhesive plate cutting system is further configured to receive the cutting instruction and cut the adhesive plate sprayed with the anti-sticking buffer to obtain effective color bands and waste, output a cutting completion instruction to the MES control system; and the MES control system is further configured to receive the cutting completion instruction to output a pushing instruction to a color band pushing system; The color band pushing system in communication with the MES control system is configured to receive the pushing instruction, push the effective color bands into a gel particle collection device, and output a pushing completion instruction to the MES control system; the MES control system is further configured to send a second collection needle cylinder moving instruction to the adhesive plate pretreatment system; the adhesive plate pretreatment system is further configured to receive the second collection needle cylinder moving instruction, move the collection needle cylinder from the collection area to a pressing area, and send a moving completion instruction to the MES control system; and the MES control system in communication with the MES control system is further configured to receive the moving completion instruction and send a pressing instruction to a gel particle pressing system. The glue particle extrusion system is configured to receive the extrusion instruction to extrude effective color bands in the collection syringe of the extrusion area into glue particles, and extrude the glue particles into the glue particle collection device. The glue particle collection device is configured to collect the glue particles.

2. The automated gel-cutter system for multi-strand DNA synthesis gels of claim 1, wherein, The glue plate pretreatment system comprises: A pretreatment mechanical arm configured to drive a second parallel opening and closing electric claw and a dot matrix suction cup to act; The second parallel opening and closing electric claw is configured to clamp the electrophoretic liquid pump pipe; The dot matrix suction cup is configured to adsorb the glue plate and move the glue plate to the glue plate cutting area; The electrophoretic liquid pump pipe is configured to spray the electrophoretic liquid of the spraying amount on the glue plate in the glue plate feeding area.

3. The automated cutting system for multi-stranded DNA synthesis gel plates of claim 1, wherein, The glue plate cutting system comprises: A cutting mechanical arm configured to drive a rotating opening and closing electric claw and a first parallel opening and closing electric claw to act; The rotating opening and closing electric claw is configured to clamp the collection syringe; The first parallel opening and closing electric claw is configured to clamp a glue plate cutting knife; The glue plate cutting knife is configured to cut the glue plate sprayed with the anti-sticking buffer into effective color bands and waste.

4. The automated gel-cutter system for multi-strand DNA synthesis gels of claim 3, wherein, The glue particle collection device comprises: A collection tray configured to collect the waste; A collection syringe configured to collect the effective color bands.

5. An automated method for cutting multi-stranded DNA synthesis gels, characterized in that, The method comprises: S1: starting the MES control system, sending a device state query instruction to the glue plate pretreatment system and the glue plate cutting system, and feeding back an offline or online signal to the MES control system through Ethernet; when all device states are displayed as online, the MES control system enters a ready state; and receiving an order from a cloud platform, and sending glue plate parameters in the order to a digital twin system; S2: the digital twin system calls a pre-stored three-dimensional model, simulates a cutting path in a virtual environment in combination with the glue plate parameters, calculates a spraying amount of electrophoretic liquid sprayed on the glue plate and a cutting depth for cutting the glue plate, returns the simulation result to the MES control system, and generates an electrophoretic liquid pump spraying instruction according to the spraying amount and the cutting depth, and sends the electrophoretic liquid pump spraying instruction to the glue plate pretreatment system through a TLS1.3 encryption channel; S3: after the glue plate pretreatment system receives the electrophoretic liquid pump spraying instruction, the glue plate pretreatment system immediately returns an acknowledgement packet to the MES control system, clamps the electrophoretic liquid pump pipe to spray the electrophoretic liquid of the spraying amount on the glue plate in the glue plate feeding area, and transports the glue plate sprayed with the electrophoretic liquid to the glue plate cutting area according to a preset program. S4: The color band detection camera scans the frame of the rubber plate and outputs the collected ultraviolet fluorescence image to the MES control system and the digital twin system; the MES control system is also used to generate a cutting coordinate matrix according to the ultraviolet fluorescence image, and send a first collection needle cylinder moving instruction to the rubber plate cutting system and a anti-sticking buffer spraying instruction to the rubber plate pretreatment system; the digital twin system is also used to simulate a cutting path according to the cutting coordinate matrix, detect interference risks, calculate a pose compensation amount, and send to the rubber plate cutting system; the rubber plate pretreatment system is also used to receive the anti-sticking buffer spraying instruction to spray anti-sticking buffer to the rubber plate, and output a spraying completion instruction to the MES control system; S5: The rubber plate cutting system receives the first collection needle cylinder moving instruction to clamp the collection needle cylinder to the collection area, and receives the pose compensation amount to calibrate the action of clamping the collection needle cylinder; the MES control system receives the spraying completion instruction to send a cutting instruction to the rubber plate cutting system; the rubber plate cutting system receives the cutting instruction, cuts the rubber plate sprayed with anti-sticking buffer to obtain effective color bands and waste, and outputs a cutting completion instruction to the MES control system; the MES control system sends the cutting completion instruction to the color band pushing system to output a pushing instruction; S6: The color band pushing system receives the pushing instruction and pushes the effective color bands into the rubber particle collection device, and outputs a pushing completion instruction to the MES control system; the MES control system sends a second collection needle cylinder moving instruction to the rubber plate pretreatment system; the rubber plate pretreatment system receives the second collection needle cylinder moving instruction and moves the collection needle cylinder from the collection area to the extrusion area, and sends a moving completion instruction to the MES control system; the MES control system receives the moving completion instruction and sends an extrusion instruction to the rubber particle extrusion system; S7: The rubber particle extrusion system receives the extrusion instruction to extrude the effective color bands in the collection needle cylinder in the extrusion area into rubber particles, and extrudes the rubber particles into the rubber particle collection device, the particle size of the rubber particles is less than or equal to 1mm; after extrusion is completed, the rubber particle extrusion system sends a data packet containing pressure curve data to the MES control system.

6. The automated cutting method of multi-stranded DNA synthesis gel plates according to claim 5, wherein, Further comprising: S8: The digital twin system maps the cutting progress in real time, optimizes the subsequent path and predicts the waste distribution; S9: After the rubber particles are filtered through the filter membrane, they flow into the sterile filtration tube, and the RFID tag records the batch information and synchronizes to the database of the MES control system; S10: The digital twin system synchronizes the data stored by the MES control system, dynamically updates the rubber particle position, remaining capacity and batch state in the three-dimensional interface; S11: The MES control system generates an experiment report in combination with the data of the digital twin system; S12: Abnormal data triggers a self-learning algorithm to optimize the cutting parameters of the next batch.

7. The multi-strand DNA synthesis rubber plate automatic cutting method according to claim 5, characterized in that, The gel plate parameters include: target DNA chain quantity, gel plate cutting thickness, and gel plate cutting size; the gel plate cutting thickness is 1-5 mm, and the gel plate cutting size is 100-300 mm2; The spraying amount of the electroporation solution is 10 muL / cm2+ / -2 muL, and the cutting depth is 1-3 mm; The spraying amount of the anti-sticking buffer is 10 muL / cm2+ / -2 muL.

8. The automatic cutting method of the multi-chain DNA synthesis gel plate according to claim 5, wherein For the step S3, the gel plate is sprayed with the electroporation solution in the spraying amount by the electrophoresis solution pump pipe clamped by the second parallel open-close electric claw, and the gel plate sprayed with the electrophoresis solution is transported to the gel plate cutting area by the pretreatment mechanical arm of the gel plate pretreatment system; the second parallel open-close electric claw is switched to the dot-matrix suction disc by the pretreatment mechanical arm, the gel plate sprayed with the electrophoresis solution is adsorbed by the dot-matrix suction disc, and the gel plate is transported to the gel plate cutting area; For the step S5, the collection needle cylinder is clamped by the rotating open-close electric claw to the collection area by the cutting mechanical arm of the gel plate cutting system; For the step S5, the gel plate sprayed with the anti-sticking buffer is cut to obtain the effective color band and waste by the first parallel open-close electric claw.

9. The automatic cutting method of the multi-chain DNA synthesis gel plate according to claim 5, wherein The scanning mode of the color band detection camera is as follows: vertical scanning at a distance of 10 cm from the gel plate, the ultraviolet light source irradiates the gel plate at an angle of 45°+ / -5°, the photometric sensor is dynamically adjusted to the optimal brightness, and the coarse positioning is completed.

10. The automated cutting method of multi-stranded DNA synthesis gel plates according to claim 8, wherein, The steps of cutting the gel plate sprayed with the anti-sticking buffer by the gel plate cutting knife are as follows: The cutting mechanical arm drives the gel plate cutting knife to perform block coarse cutting according to the cutting coordinate matrix, retains a 0.5 mm connecting rib, cuts off the connecting rib, forms an independent color band, cuts horizontally from the +Y side to the -Y side, the row distance is 0.3 mm larger than the color band height, the cutting depth is the thickness of the gel plate, the feeding speed is 50 mm / s during the idle stroke, the feeding speed is 5 mm / s+ / -0.1 mm / s during the cutting section, and the cutting is returned by 0.2 mm to remove the chips every 10 mm; The longitudinal cutting is started to cut vertically from the +X side to the -X side, the column distance is 0.3 mm larger than the color band width, the cutting depth is the thickness of the gel plate, the negative pressure adsorption is started during the whole cutting process to timely remove the debris, and the data collected by the force sensor in real time during the cutting process is transmitted back to the MES control system through the OPCUA over TLS protocol encryption, and the cutting depth is dynamically adjusted according to the thickness of the gel plate.