A glass phased array antenna control module and a manufacturing method thereof

Abstract

The application discloses a glass phased array antenna control module and a manufacturing method thereof, and realizes high-precision control of the phased array antenna by manufacturing a control circuit on a glass substrate through a TFT manufacturing process, guarantees the accuracy of the phased array antenna beam pointing and the quality of signal processing, saves the layout space of the control circuit through the combination of the TFT manufacturing process and the TGV technology, saves the mounting space of the antenna chip through the COB packaging mode, realizes high integration of the phased array antenna, meets the miniaturization and multifunctionalization requirements of the phased array antenna, realizes good anti-crosstalk performance through the setting of the grounding isolation hole around the antenna chip, improves the stability and reliability of the phased array antenna, and thus comprehensively improves the performance of the phased array antenna, so that the phased array antenna has stronger competitiveness in the fields of satellite communication, vehicle-mounted and military radar, and can better meet the requirements of various fields for high-performance phased array antennas.

Description

Technical Field

[0001] This invention belongs to the field of phased array antenna technology, and relates to a high-precision, highly integrated glass phased array antenna control module, specifically a glass phased array antenna control module and its manufacturing method. Background Technology

[0002] In the development of phased array antennas, the requirements for the precision and integration of antenna control modules have been increasing. Phased array antennas manufactured using traditional processes have many shortcomings in their control modules.

[0003] On the one hand, the control circuits of traditional phased array antenna control modules struggle to achieve high-precision linewidth and spacing control. Specifically, control circuits fabricated using conventional printed circuit board (PCB) technology typically have linewidths and spacings of tens of micrometers or even larger, failing to meet the high-precision control circuit requirements of phased array antennas. This large linewidth and spacing not only limits the integration of the control circuitry but can also introduce signal transmission delays and losses, affecting the overall performance of the phased array antenna. For example, in some satellite communication phased array antennas with extremely high signal processing precision requirements, control circuits fabricated using traditional PCB technology cannot achieve precise signal phase adjustment and amplitude control, leading to a decline in communication quality.

[0004] On the other hand, traditional phased array antenna control module chip packaging methods occupy a significant amount of space. Conventional chip packaging methods, such as Dual In-line Package (DIP) or Plastic Quad Flat Package (PQFP), require reserved space around the antenna chip for pin connections and mounting, resulting in a large overall control module size. This hinders the miniaturization and integration of phased array antennas. In space-constrained automotive phased array antenna applications, a large control module may not fit within the limited interior space, restricting the installation and use of the phased array antenna.

[0005] Furthermore, traditional phased array antenna control modules face difficulties in suppressing crosstalk between antenna chips. As the functionality of phased array antennas continues to improve, the number of antenna chips integrated into the control module increases, making electromagnetic interference between these chips increasingly prominent. Traditional control module layouts and shielding measures are insufficient to effectively reduce crosstalk between antenna chips, leading to signal quality degradation and affecting the performance stability of the phased array antenna. For example, in military radar phased array antennas, the complex electromagnetic environment can cause crosstalk between antenna chips to lead to misjudgments of radar signals, affecting the accuracy of target detection.

[0006] In summary, existing phased array antenna control modules are insufficient in terms of accuracy, integration, and anti-crosstalk capability, and cannot meet the development requirements of modern phased array antennas in terms of high performance and miniaturization. Summary of the Invention

[0007] To address the technical problems existing in the background art, this invention proposes a glass phased array antenna control module and its manufacturing process, which enables the phased array antenna to have high precision, high integration and anti-crosstalk performance, and can better meet the needs of various fields for high-performance phased array antennas.

[0008] The objective of this invention can be achieved through the following technical solutions:

[0009] A glass phased array antenna control module includes multiple phased array antenna chips with different functions and control circuits for each antenna chip. The control circuits are fabricated on the surface of a glass substrate to integrate the control circuits of multiple antenna chips on a multilayer glass substrate. Vertical conductive paths are provided on the glass substrate to connect the control circuits on different layers of glass substrates together. Each antenna chip is connected to the control circuit on the top glass substrate and is encapsulated as a whole on the top glass substrate.

[0010] Furthermore, each antenna chip has a grounding isolation layer surrounding the glass substrate.

[0011] A method for manufacturing a glass phased array antenna control module as described above includes the following steps:

[0012] S1, a control circuit for fabricating multiple antenna chips on the surface of a multilayer glass substrate;

[0013] S2, Create conductive paths on the glass substrate to connect control circuits on different layers of glass substrate;

[0014] S3 encapsulates the antenna chip entirely on the top glass substrate.

[0015] Further, in step S1, a control circuit is fabricated on the surface of the glass substrate using a TFT manufacturing process, including the following steps:

[0016] S11, depositing multiple layers of semiconductor material on the surface of a glass substrate as the active layer of the control circuit;

[0017] S12, patterning the active layer of the circuit to form a control circuit with a TFT structure;

[0018] S13, Fabricating matching auxiliary components for the control circuit on a glass substrate;

[0019] S14, deposit a metal layer on the surface of the glass substrate as wiring for the control circuit;

[0020] S15, pattern the metal layer to form wires connecting the various matching components.

[0021] Furthermore, in step S12, photoresist is first applied to the active layer of the control circuit using photolithography, and the gate, source, and drain structure patterns of the control circuit are formed by exposure using a mask. Then, excess semiconductor material is removed by etching to form the control circuit structure. In step S15, the metal layer is patterned again using photolithography and etching.

[0022] Furthermore, in step S13, the matching auxiliary components include capacitors and resistors. The capacitor achieves the desired capacitance value by depositing dielectric materials with different dielectric constants and controlling their thickness and area. The resistor controls the resistance value by adjusting the doping concentration and geometry of the semiconductor material.

[0023] Furthermore, in step S2, TGV technology is used to create conductive paths connecting control circuits on different glass substrates, including the following steps:

[0024] S21, Drill vertical through-holes for TGV in the glass substrate;

[0025] S22, depositing one or more layers of metal on the wall of a vertical through hole to form a vertical conductive path;

[0026] S23, Align the multilayer glass substrates with the conductive paths fabricated so that the conductive paths on different layers of glass substrates are aligned and connect the multilayer glass substrates together.

[0027] Furthermore, in step S3, the antenna chip is packaged on the glass substrate using a COB (Chip-on-Board) integrated packaging method, including the following steps:

[0028] S31, fix the antenna chip in a predetermined position on the glass substrate according to the design layout;

[0029] S32 connects the pins of the antenna chip to the control circuit wiring on the glass substrate, realizing the electrical connection between the antenna chip and the control circuit.

[0030] S33 uses encapsulation materials to comprehensively encapsulate and protect the antenna chip and electrical connection areas.

[0031] Furthermore, the manufacturing method further includes the following steps:

[0032] S4. A grounding isolation layer is made around the antenna chip on a glass substrate around each antenna chip to block electromagnetic interference between the antenna chips.

[0033] Furthermore, in step S4, a ring of grounding vias is first opened around the antenna chip, and conductive material is deposited in the grounding vias to form a grounding isolation layer surrounding the antenna chip.

[0034] The beneficial effects of this invention are:

[0035] (a) High-precision control.

[0036] 1. Improved line width and spacing accuracy: By mimicking the manufacturing process of TFT circuits for liquid crystal displays, the minimum line width and spacing of the control circuit can be reduced to 2μm. This significantly improves accuracy compared to traditional processes, enabling the control circuit to transmit signals more precisely and reducing signal distortion and delay.

[0037] 2. Precise matching of component parameters: The matching capacitors and resistors are manufactured using TFT manufacturing technology, which can precisely control their parameters and achieve more accurate matching with the phased array antenna chip. This optimizes the signal processing process, reduces signal reflection and loss, and improves the accuracy of signal processing.

[0038] (ii) High integration is achieved.

[0039] 1. Combination of TFT manufacturing process and TGV technology: TFT manufacturing process enables high-precision layout of control circuits on the glass substrate, increasing the number of integrated circuit components per unit area. Simultaneously, TGV technology establishes vertical electrical connections between multilayer glass substrates, saving planar wiring space and further improving integration. This high degree of integration allows the phased array antenna control module to perform more functions within a limited space, meeting the development trend of miniaturization and multi-functionality of phased array antennas.

[0040] 2. Space-saving COB packaging: The bare-chip COB packaging method greatly reduces the packaging area of ​​the antenna chip. Compared with traditional packaging, COB packaging does not require a complex shell and a large amount of pin space, which allows more antenna chips to be integrated on the same glass substrate area, further improving the integration of the control module and making it possible to apply phased array antennas in space-constrained scenarios.

[0041] (iii) Enhanced anti-crosstalk performance.

[0042] By setting a ground isolation layer around the antenna chip, crosstalk between antenna chips is effectively reduced, ensuring the normal operation of multiple antenna chips with different functions in the control module. This improves the stability and reliability of the phased array antenna control module, especially in complex electromagnetic environments such as military radar and vehicle communication, ensuring the accuracy and stability of phased array antenna signal processing.

[0043] (iv) Overall performance improvement.

[0044] The glass phased array antenna control module provided by this invention comprehensively improves the performance of the phased array antenna. Through high-precision control, it ensures the accuracy of beam pointing and the quality of signal processing. Through high integration, it meets the requirements for miniaturization and multi-functionality of the phased array antenna. Through good anti-crosstalk performance, it improves the stability and reliability of the phased array antenna, making the phased array antenna more competitive in satellite communication, vehicle-mounted, and military radar fields, and better meeting the needs of various fields for high-performance phased array antennas. Attached Figure Description

[0045] Figure 1 This is a schematic diagram of the control module for a glass phased array antenna.

[0046] Figure 2 This is a schematic diagram of fabricating a control circuit on a glass substrate using TFT manufacturing technology.

[0047] Figure 3 This is a schematic diagram of connecting multilayer glass substrates using TGV technology.

[0048] Figure 4 This is a schematic diagram of an antenna chip packaged using the COB (Chip-on-Board) packaging method.

[0049] Figure 5 This is a schematic diagram showing the arrangement of grounding vias around the antenna chip. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] This invention provides a glass phased array antenna control module, including multiple phased array antenna chips 1 with different functions (phase shifters, amplifiers, low-noise amplifiers, up / down converters, etc.) and control circuits 2 for each antenna chip 1. For example... Figure 1As shown, the control circuit 2 is fabricated on the surface of the glass substrate 3 to integrate multiple control circuits 2 of antenna chips 1 with different functions on the multilayer glass substrate 3. Specifically, the control circuit 2 of the antenna chip 1 can be fabricated on the multilayer glass substrate 3 by mimicking the process of manufacturing TFT (Thin Film Transistor) circuits for liquid crystal displays. The process of manufacturing TFT circuits for liquid crystal displays has extremely high precision and can achieve extremely fine linewidths and spacings. Through this process, the linewidth and spacing of the control circuit 2 can be as small as 2μm, which greatly improves the integration of the control module. Compared with the traditional PCB process, more circuit components can be arranged in the same area to achieve more complex control functions. For example, in the control circuit of the phase shifter chip of the phased array antenna, finer linewidths and spacings can achieve more accurate phase control signal transmission, improve the accuracy of the phased array antenna beam pointing, and meet the requirements of high-precision beam control such as satellite communication. At the same time, by using the TFT manufacturing process to fabricate corresponding matching capacitors and resistors in the TFT structure control circuit 2, the parameters of the capacitors and resistors can be precisely controlled to achieve a more accurate match with the phased array antenna chip 1. This precise matching helps improve the accuracy of signal processing and reduce signal reflection and loss. For example, in the control circuit of a phased array antenna amplifier chip, precisely matched capacitors and resistors can optimize the amplifier's gain accuracy and linearity, thereby improving the overall signal amplification performance and quality of the phased array antenna.

[0052] The glass substrate 3 has vertically penetrating conductive paths to connect the control circuits 2 on different layers of the glass substrate 3. Specifically, TGV (Through Glass Via) technology can be used to create vertically penetrating conductive paths on the multilayer glass substrate 3, achieving electrical connections between different layers of the glass substrate 3. TGV connections have excellent electrical performance, ensuring efficient and stable signal transmission between different layers. This technology transforms connections that originally required complex wiring on a plane into vertical connections, greatly saving planar space and further improving the integration of the control module. For example, when fabricating control circuits for different functional antenna chips on multilayer glass substrates, TGV technology can quickly and accurately connect the control circuits of each layer to form a complete control system, ensuring the coordinated operation of all functions of the phased array antenna.

[0053] In this design, multiple antenna chips 1 are connected to control circuits 2 on the top glass substrate 3 and are individually packaged on the top glass substrate 3. Specifically, a bare-chip COB (Chip on Board) package can be used to reduce the packaging area of ​​the antenna chips 1. COB packaging directly fixes the bare antenna chips 1 to the glass substrate 3 and uses techniques such as thermoforming to connect the antenna chips 1 to the control circuits 2 on the glass substrate 3. This eliminates the need for complex casings and numerous pin layouts found in traditional packaging methods, significantly reducing the space occupied by the antenna chips 1 and facilitating the miniaturization and integration of the phased array antenna control module. For example, within the limited space of a phased array antenna, COB packaging allows for the integration of more antenna chips on a glass substrate of the same area, enabling more powerful control functions.

[0054] Preferably, to reduce crosstalk between antenna chips 1, a grounding isolation layer 4 is provided around each antenna chip 1 on the glass substrate 3 surrounding the antenna chip 1. Specifically, the grounding isolation layer 4 consists of a ring of grounding vias surrounding a specific area around the antenna chip 1, which can effectively block electromagnetic interference between antenna chips 1. The grounding isolation layer 4 can shield interference signals so that they do not affect the normal operation of adjacent antenna chips 1. For example, in the case of a densely arranged array of multiple amplifier chips, the grounding isolation layer can prevent electromagnetic interference generated by one amplifier chip from affecting the signal amplification effect of other amplifier chips, thereby ensuring the signal processing accuracy and stability of the phased array antenna.

[0055] In summary, the glass phased array antenna control module provided by this invention has the characteristics of high precision and high integration, and can meet the high-performance control requirements of phased array antennas in satellite communication, vehicle-mounted and military radar fields.

[0056] Furthermore, the present invention also provides a method for manufacturing the glass phased array antenna control module, the method specifically including the following steps:

[0057] S1, fabricating control circuitry for multiple antenna chips on the surface of a multilayer glass substrate. Specifically, before step S1, a suitable glass substrate is selected and pre-treated, such as by cleaning, to ensure a smooth and clean surface, providing a good foundation for subsequent processes. The number of layers and dimensions of the glass substrate are determined according to the design requirements of the phased array antenna control module. In one embodiment of this application, step S1 utilizes TFT manufacturing processes to fabricate control circuitry on the surface of the glass substrate, such as... Figure 2 As shown, it specifically includes the following steps:

[0058] S11, deposit one or more layers of semiconductor material on the surface of the glass substrate as the active layer of the control circuit. Specifically, in step S11, one or more layers of semiconductor material, such as amorphous silicon or low-temperature polycrystalline silicon, can be deposited on the surface of the glass substrate using methods such as chemical vapor deposition (CVD) as the active layer of the control circuit. During the deposition process, deposition parameters, such as temperature, gas flow rate, and deposition time, are precisely controlled to ensure the uniformity of the active layer thickness and its electrical performance.

[0059] In step S12, the active layer of the control circuit is patterned using photolithography and etching to form the control circuit of the TFT structure. Specifically, in step S12, photoresist is first applied to the active layer of the control circuit using photolithography, and the gate, source, and drain structure patterns of the TFT are formed by exposure using a mask. Then, excess semiconductor material is removed by etching to form the control circuit of the TFT structure. During the photolithography and etching process, the accuracy and dimensional consistency of the TFT structure are ensured by controlling process parameters such as the photoresist coating thickness, exposure time, etchant concentration, and etching time.

[0060] S13: Matching auxiliary components for the TFT structure control circuit are fabricated on a glass substrate using TFT manufacturing processes. Specifically, in step S13, the matching auxiliary components include capacitors and resistors. The capacitor achieves the desired capacitance value by depositing dielectric materials with different dielectric constants and controlling their thickness and area. The resistor's resistance value is controlled by adjusting the doping concentration and geometry of the semiconductor material. During the fabrication process, precise testing equipment can be used to monitor the parameters of the capacitor and resistor in real time to ensure they match the design values.

[0061] S14, deposit a metal layer on the glass substrate as wiring for the control circuit. Specifically, in step S14, processes such as sputtering and electroplating can be used to deposit a metal layer on the glass substrate as wiring for the control circuit.

[0062] In step S15, the metal layer is patterned again using photolithography and etching to form wires connecting the various matching components. Specifically, in step S15, the electrical performance and integration of the control circuit are ensured by precisely controlling the thickness of the metal layer and the line width and spacing of the wiring.

[0063] S2, conductive vias are fabricated on the glass substrate to connect control circuits on different layers of the glass substrate. As one embodiment of this application, step S2 utilizes TGV technology to connect the control circuits on the multilayer glass substrate, such as... Figure 3 As shown, it specifically includes the following steps:

[0064] S21. Drill vertical through-holes for TGV in the glass substrate. Specifically, vertical through-holes for TGV can be drilled in the glass substrate using methods such as laser-induced etching or mechanical drilling, and the position, diameter, and depth of the vertical through-holes must be precisely controlled according to design requirements. For vertical through-holes on different glass substrates, alignment accuracy must be ensured to achieve good electrical connection later.

[0065] S22, a seed layer metal is deposited on the wall of the vertical via, and then the seed layer is thickened to fill the via and form a vertical conductive path. Specifically, a seed layer metal, such as titanium copper or nickel copper, is deposited on the wall of the vertical via using methods such as chemical plating or physical vapor deposition; then, the seed layer is thickened to fill the via, using materials such as copper, tin, or aluminum, to form a vertical conductive path. During the metallization process, it is essential to ensure good adhesion between the metal layer and the wall of the vertical via, as well as the continuity and uniformity of the metal layer, to guarantee the electrical performance of the TGV.

[0066] S23, the multilayer glass substrates with the conductive paths fabricated are aligned to ensure that the conductive paths on different layers of the glass substrates are aligned, and the multilayer glass substrates are connected together by hot pressing and bonding. Specifically, during the glass substrate connection process, parameters such as temperature, pressure, and time are controlled to ensure that the connection between the multilayer glass substrates is firm and that the TGV conductive paths function normally.

[0067] S3, the antenna chip is entirely encapsulated on the top glass substrate. As one embodiment of this application, step S3 uses a COB (Chip-on-Board) encapsulation method to encapsulate the antenna chip on the glass substrate, such as... Figure 4 As shown, it specifically includes the following steps:

[0068] S31, the antenna chip is placed on a predetermined position on the glass substrate according to the design layout, and the antenna chip is fixed to the glass substrate using adhesive material. Specifically, for phased array antenna chips (phase shifters, amplifiers, low-noise amplifiers, up / down converters, etc.), the antenna chip is placed on a predetermined position on the glass substrate according to the design layout, and the antenna chip is fixed to the glass substrate using adhesive materials such as silver paste, ensuring that the antenna chip is accurately positioned and firmly fixed.

[0069] S32 connects the antenna chip to the control circuit wiring on the glass substrate using reflow soldering or thermoforming bonding, achieving an electrical connection between the antenna chip and the control circuit. Specifically, miniature solder bumps are fabricated at the antenna chip connection points to connect the control chip to the control circuit wiring on the glass substrate. The diameter of the miniature solder bumps can be reduced to 2μm, and techniques such as thermoforming bonding are used to improve connection density and reliability. During the bonding process, bonding parameters such as bonding pressure, ultrasonic power, and bonding time are controlled to ensure the quality and reliability of the bonding points, achieving a good electrical connection between the antenna chip and the control circuit.

[0070] S33 uses encapsulation materials to comprehensively protect the antenna chip and electrical connection areas. Specifically, methods such as dispensing and potting can be used, selecting encapsulation materials with good insulation and mechanical properties, such as epoxy resin, to prevent the antenna chip from being affected by the external environment and improve the stability and reliability of the control module.

[0071] S4. A grounding isolation layer is fabricated around each antenna chip on a glass substrate to block electromagnetic interference between the antenna chips. Specifically, in step S4, the grounding isolation layer 4 consists of a ring of grounding vias surrounding a specific area of ​​the antenna chip 1, such as... Figure 5 As shown, the grounding via is fabricated using TGV technology or semiconductor via technology. By controlling the shape and position of the grounding via, it can be ensured that it can effectively block electromagnetic interference between antenna chips. During the fabrication of the grounding via, electromagnetic simulation software is used to simulate and analyze the performance of the grounding via, and the position and shape of the grounding via are adjusted according to the simulation results to achieve the preset anti-crosstalk effect.

[0072] The above description is merely an example and illustration of the structure of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described, or use similar methods to replace them, as long as they do not deviate from the structure of the invention or exceed the scope defined in the claims, all of which should fall within the protection scope of the present invention.

Claims

1. A glass phased array antenna control module comprising a plurality of different functional phased array antenna chips and control circuitry for each antenna chip, characterized in that, The control circuit is made on the surface of the glass substrate to integrate the control circuits of multiple antenna chips on the multilayer glass substrate. The glass substrate is provided with vertical conductive paths to connect the control circuits on different layers of the glass substrate together. The multiple antenna chips are connected to the control circuit on the top layer of the glass substrate and are integrally packaged on the top layer of the glass substrate. The method for manufacturing the glass phased array antenna control module comprises the following steps: S1. Making the control circuits of multiple antenna chips on the surface of the multilayer glass substrate; S2. Making the conductive paths on the glass substrate to connect the control circuits on different layers of the glass substrate; S3. Integrally packaging the antenna chips on the top layer of the glass substrate; In step S1, the control circuit is made on the surface of the glass substrate by using the TFT manufacturing process, comprising the following steps: S11. Depositing multiple layers of semiconductor materials on the surface of the glass substrate as the active layer of the control circuit; S12. Patternizing the active layer of the circuit to form the control circuit in the TFT structure; S13. Making the matching auxiliary elements of the control circuit on the glass substrate; S14. Depositing a metal layer on the surface of the glass substrate as the wiring of the control circuit; S15. Patternizing the metal layer to form the conductive wires connecting the matching elements.

2. The glass phased array antenna control module of claim 1, wherein, The glass substrate around each antenna chip is provided with a ground isolation layer surrounding the antenna chip.

3. The glass phased array antenna control module of claim 1, wherein, In step S12, firstly, a photoresist is covered on the active layer of the control circuit by using the photoetching technology, and the mask is exposed to form the gate, source and drain structure patterns of the control circuit, and then the excess semiconductor materials are removed by the etching process to form the control circuit structure. In step S15, the metal layer is again patternized by using the photoetching and etching.

4. The glass phased array antenna control module of claim 1, wherein, In step S13, the matching auxiliary elements include the capacitor and the resistor. The capacitor is realized by depositing the dielectric materials with different dielectric constants and controlling the thickness and area to achieve the required capacitance value, and the resistance value is controlled by adjusting the doping concentration and geometric shape of the semiconductor materials.

5. The glass phased array antenna control module of claim 1, wherein, In step S2, the conductive paths are made by using the TGV technology to connect the control circuits on different layers of the glass substrate, comprising the following steps: S21. Drilling the vertical through holes for the TGV on the glass substrate; S22. Depositing one or more layers of metal on the hole wall of the vertical through hole to form the vertical conductive path; S23. Aligning the multilayer glass substrate with the conductive paths made to butt joint the conductive paths on different layers of the glass substrate and connect the multilayer glass substrate together.

6. The glass phased array antenna control module of claim 1, wherein, In step S3, the antenna chip is packaged on the glass substrate by using the COB integral packaging method, comprising the following steps: S31. Fixing the antenna chip on the predetermined position of the glass substrate according to the design layout; S32. Connecting the pins of the antenna chip with the wiring of the control circuit on the glass substrate to realize the electrical connection between the antenna chip and the control circuit; S33. Using the packaging material to integrally package and protect the antenna chip and the electrical connection area.

7. The glass phased array antenna control module of claim 2, wherein, Further comprising the following steps: S4. Making the ground isolation layer around the antenna chip on the glass substrate around each antenna chip to block the electromagnetic interference between the antenna chips.

8. The glass phased array antenna control module of claim 7, wherein, In step S4, the ground isolation layer adopts a ground via encircling the antenna chip, and the ground via is made by using TGV technology or semiconductor via process.

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