Method for embedding heat dissipation copper columns in microwave printed circuit board

Abstract

The invention discloses a method for embedding a heat dissipation copper column in a microwave printed circuit board, and relates to the technical field of embedding the heat dissipation copper column in the microwave printed circuit board, and the method comprises the following steps: S1, taking out a microwave printed circuit board; s2, taking out the two heat dissipation copper columns B; s3, the two heat dissipation copper columns B are supported on the table top of the table; s4, enabling the two heat dissipation copper columns B to be in interference fit with two through holes of the microwave printed circuit board respectively; s5, taking out one strip-shaped copper plate; s6, taking out one strip-shaped copper plate and one strip-shaped cured sheet; s7, fixing the strip-shaped copper plate and the microwave printed circuit board together; s8, the left end and the right end of the strip-shaped copper plate are turned upwards; s9, operating the spot welding machine to enable a spot welding head on the spot welding machine to touch the top surface of the turnover part; and S10, the microwave printed circuit board embedded with the two heat dissipation copper columns B is taken away from the table. The microwave printed circuit board has the beneficial effects that the heat dissipation efficiency of the microwave printed circuit board is improved, and the embedding quality of the heat dissipation copper column B is greatly improved.

Description

Technical Field

[0001] This invention relates to the technical field of embedding heat dissipation copper pillars in microwave printed circuit boards, and in particular to a method for embedding heat dissipation copper pillars in microwave printed circuit boards. Background Technology

[0002] Microwave printed circuit boards (PCBs) are printed circuit boards used in the microwave frequency band (generally 1GHz~200GHz). They are made of materials such as polytetrafluoroethylene (PTFE) and ceramics, and possess excellent dielectric constant stability and low loss characteristics, making them particularly suitable for various microwave applications. These microwave PCBs are typically installed on mechanical equipment to control the normal operation of various power assemblies.

[0003] The structure of microwave printed circuit board 1 produced in a certain workshop is as follows: Figures 1-2 As shown, two through holes 2 are formed on the edge of the microwave printed circuit board 1. The two through holes 2 are on the same straight line. In order to increase the heat dissipation efficiency of the microwave printed circuit board 1, the process requires that a heat sink be embedded in each of the two through holes 2. Figures 3-4 The heat dissipation copper pillar A3 shown is cylindrical and has a central hole 4 along its axial direction. The heat dissipation copper pillar A3 is interference-fitted with the through hole 2, as shown. Figures 5-6 The diagram shows a microwave printed circuit board 1 with two heat dissipation copper pillars A3 embedded in it.

[0004] When the microwave printed circuit board 1, which has two embedded heat dissipation copper pillars A3, is in operation, the heat generated on it is transferred to the heat dissipation copper pillars A3, and the heat is released into the atmosphere through the central hole 4 of the heat dissipation copper pillars A3, thereby achieving the purpose of heat dissipation for the microwave printed circuit board 1.

[0005] The method used by the workers in the workshop to embed two heat dissipation copper pillars A3 inside the microwave printed circuit board 1 is as follows: S1. The worker takes out a microwave printed circuit board 1 and then places it flat on the table surface 5, as follows: Figure 7 As shown; S2. The worker takes out two heat dissipation copper pillars A3, wherein the outer diameter of the heat dissipation copper pillar A3 is slightly larger than the diameter of the through hole 2 of the microwave printed circuit board 1. S3. The worker aligns the lower end of a heat dissipation copper pillar A3 with the top port of the left through hole 2, as follows: Figure 8 As shown, the top of the heat dissipation copper pillar A3 is then struck downwards with a wooden hammer. Under the hammering, the heat dissipation copper pillar A3 gradually enters the through hole 2. When the heat dissipation copper pillar A3 and the through hole 2 are fully interference-fitted, the first heat dissipation copper pillar A3 is embedded in the left through hole 2 of the microwave printed circuit board 1. S4. The worker repeats step S3 once to embed the second heat dissipation copper pillar A3 into the right-side through-hole 2 of the microwave printed circuit board 1, thus ultimately achieving the embedding of two heat dissipation copper pillars A3 within the microwave printed circuit board 1. Figures 5-6 The diagram shows a microwave printed circuit board 1 with two heat dissipation copper pillars A3 embedded in it. S5. The worker removes the microwave printed circuit board 1, which has two heat dissipation copper pillars A3 embedded in it, from the tabletop 5. S6. The worker repeats steps S1 to S5 multiple times to embed two heat dissipation copper pillars A3 in each of the multiple microwave printed circuit boards 1.

[0006] However, although the method used in the workshop can embed two heat dissipation copper pillars A3 within the microwave printed circuit board 1, it still has the following technical defects: I. In step S3, after the heat dissipation copper pillar A3 and the through hole 2 are fully interference-fitted, a large number of protrusions 6 appear on the inner wall of the heat dissipation copper pillar A3, such as... Figure 9 As shown (due to the irregular deformation of the inner wall material of the heat dissipation copper pillar A3 during the process of the wooden hammer striking the top of the heat dissipation copper pillar A3, protrusions 6 are generated on the inner wall of the heat dissipation copper pillar A3), and the presence of these protrusions 6 prevents the heat on the microwave printed circuit board 1 from being released smoothly into the atmosphere through the central hole 4, which in turn causes the heat on the microwave printed circuit board 1 to take a long time to be completely released into the atmosphere, thereby reducing the heat dissipation efficiency of the microwave printed circuit board 1.

[0007] II. Since the heat dissipation copper pillar A3 is only fixed in the through hole 2 by interference fit, when the microwave printed circuit board 1 works in a vibrating working environment for a long time, the heat dissipation copper pillar A3 will vibrate out of the through hole 2, causing the entire microwave printed circuit board 1 to become unusable. This not only reduces the embedding quality of the heat dissipation copper pillar A3, but also shortens the service life of the microwave printed circuit board 1. Summary of the Invention

[0008] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for embedding heat dissipation copper pillars in a microwave printed circuit board.

[0009] The objective of this invention is achieved through the following technical solution: a method for embedding heat dissipation copper pillars within a microwave printed circuit board, comprising the following steps: S1. The worker takes out a microwave printed circuit board and then places it flat on the table. S2. The worker takes out two heat dissipation copper pillars B. The outer diameter of the heat dissipation copper pillar B is smaller than the diameter of the through hole of the microwave printed circuit board. A tapered hole is opened in the heat dissipation copper pillar B along its axial direction. S3. The worker places one heat dissipation copper pillar B into the left through hole of the microwave printed circuit board, and then places another heat dissipation copper pillar B into the right through hole of the microwave printed circuit board. At this time, both heat dissipation copper pillars B are supported on the table surface. S4. The two heat dissipation copper pillars B are respectively interference-fitted with the two through holes of the microwave printed circuit board. The specific operation steps are as follows: S41. The worker takes out an expansion assembly, which consists of a conical head and a cylindrical head that are sequentially fixed together. The conical head matches the conical hole of the heat dissipation copper pillar B. S42. The worker inserts the conical head of the expansion assembly into the conical hole of the left heat dissipation copper pillar B, and then uses a wooden hammer to strike the cylindrical head of the expansion assembly downwards. Under the hammering of the wooden hammer, the conical head gradually expands the circumferential material of the heat dissipation copper pillar B outwards. After striking for a period of time, the heat dissipation copper pillar B expands into the through hole on the left, thereby making the left heat dissipation copper pillar B and the left through hole interference fit. S43. The worker repeats step S42 once, so that the heat dissipation copper pillar B on the right side is interference-fitted with the through hole on the right side, and finally the two heat dissipation copper pillars B are interference-fitted with the two through holes of the microwave printed circuit board respectively. S44. The worker removes the microwave printed circuit board with two heat dissipation copper pillars B, which has an interference fit, from the table. S5. The worker takes out a strip of copper plate and a strip of curing sheet, wherein the longitudinal width of the strip of curing sheet is equal to the longitudinal width of the strip of copper plate, and the horizontal length of the strip of curing sheet is less than the horizontal length of the strip of copper plate; then the worker places the strip of copper plate flat on the top surface of the wooden pad. Then the worker places the strip curing sheet flat on the top surface of the strip copper plate. The worker then adjusts the position of the strip curing sheet so that it is in the center of the strip copper plate and that the front and rear ends of the strip curing sheet are flush with the front and rear ends of the strip copper plate, respectively. Then, the worker places the microwave printed circuit board with two heat dissipation copper pillars B, which are interference fit, on the top surface of the strip curing sheet. The worker then adjusts the position of the microwave printed circuit board so that the left and right end faces of the microwave printed circuit board are flush with the left and right end faces of the strip curing sheet, and ensures that the tapered holes of the two heat dissipation copper pillars B of the microwave printed circuit board are directly above the strip curing sheet. S6. The worker first presses down the microwave printed circuit board by hand to fix the microwave printed circuit board, strip curing sheet, and strip copper plate on the top surface of the wooden pad. Then the worker operates the vertical drilling machine, so that the drill bit of the vertical drilling machine passes through the conical hole of a heat dissipation copper pillar B to drill holes in the strip-shaped curing sheet and the strip-shaped copper plate, thereby drilling a through hole P and a through hole R in the strip-shaped curing sheet and the strip-shaped copper plate respectively. The through holes P and R are connected to the conical hole of the heat dissipation copper pillar B. Then the worker operates the vertical drilling machine, so that the drill bit of the vertical drilling machine passes through the conical hole of another heat dissipation copper pillar B to drill holes in the strip-shaped curing sheet and the strip-shaped copper plate, thereby drilling another through hole P and another through hole R in the strip-shaped curing sheet and the strip-shaped copper plate respectively, thus realizing the drilling of two through holes P and two through holes R in the strip-shaped curing sheet and the strip-shaped copper plate respectively. Then, the workers used the milling cutter of a horizontal milling machine to mill a U-shaped groove at both ends of the strip copper plate. S7. Fix the strip copper plate to the microwave printed circuit board together. The specific steps are as follows: S71. The worker transfers the strip copper plate, strip curing sheet and microwave printed circuit board on the wooden pad to the table surface, ensuring that both U-shaped grooves of the strip copper plate are on the outside of the table, so as to facilitate the subsequent flanging of the strip copper plate. S72. Control the hot press head of the hot press to move downwards, so that the hot press head presses on the top surface of the microwave printed circuit board. The heat on the hot press head is transferred to the microwave printed circuit board, and the microwave printed circuit board then transfers the heat to the strip curing sheet. After holding the pressure for a period of time, the heated strip curing sheet fixes the strip copper plate together with the microwave printed circuit board with two heat dissipation copper pillars B through interference fit. S73. Control the hot press head of the hot press to move upward so that the hot press head is away from the microwave printed circuit board; S8. The worker flips the left and right ends of the strip copper plate upward to obtain the folded part covering the top surface of the heat dissipation copper pillar B. At this time, the U-shaped groove of the folded part is connected to the conical hole of the heat dissipation copper pillar B. S9. The worker operates the spot welding machine so that the spot welding head touches the top surface of the folded part. The spot welding head welds the folded part to the top surface of the heat dissipation copper pillar B, thus finally realizing the embedding of two heat dissipation copper pillars B in the microwave printed circuit board. S10. The worker removes the microwave printed circuit board with two heat dissipation copper pillars B embedded in it from the table. S11. Workers can repeat steps S1 to S10 multiple times to embed two heat dissipation copper pillars B in multiple microwave printed circuit boards.

[0010] In step S2, the height of the heat dissipation copper pillar B is equal to the thickness of the microwave printed circuit board.

[0011] In step S41, the conical head of the tightening assembly is coaxial with the cylindrical head.

[0012] In step S6, the diameter of the through hole P of the strip-shaped cured sheet is equal to the diameter of the through hole R of the strip-shaped copper plate.

[0013] The present invention has the following advantages: improving the heat dissipation efficiency of microwave printed circuit boards, greatly improving the embedding quality of heat dissipation copper pillars B, and extending the service life of microwave printed circuit boards. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a microwave printed circuit board produced in a certain workshop. Figure 2 for Figure 1 CC section view; Figure 3 This is a schematic diagram of the structure of the heat dissipation copper pillar A in the prior art; Figure 4 for Figure 3 Main section diagram; Figure 5 A schematic diagram of a microwave printed circuit board with two embedded heat dissipation copper pillars A; Figure 6 for Figure 5 DD sectional view; Figure 7 This is a schematic diagram showing how to place a microwave printed circuit board flat on a tabletop. Figure 8 A schematic diagram showing how to align the lower end of a heat dissipation copper pillar A with the top port of the through hole on the left side of a microwave printed circuit board; Figure 9 A schematic diagram showing numerous protrusions on the inner wall of the copper pillar A used for heat dissipation; Figure 10 This is a schematic diagram of the structure of the heat dissipation copper pillar B of the present invention; Figure 11 for Figure 10 Main section diagram; Figure 12 This is a schematic diagram showing two heat dissipation copper pillars B supported on the tabletop. Figure 13 This is a schematic diagram of the structure of the expansion assembly of the present invention; Figure 14 This is a schematic diagram of inserting the conical head of the expansion assembly into the conical hole of the left heat dissipation copper pillar B; Figure 15 A schematic diagram of a microwave printed circuit board with two heat dissipation copper pillars B for interference fit. Figure 16 This is a schematic diagram of the structure of the strip copper plate of the present invention; Figure 17 for Figure 16 Top view; Figure 18 This is a schematic diagram of the structure of the strip-shaped cured sheet of the present invention; Figure 19 for Figure 18 Top view; Figure 20 This is a schematic diagram showing a strip of copper plate placed flat on the top surface of a wooden pad. Figure 21 for Figure 20 Top view; Figure 22 A schematic diagram showing how to align the front and rear ends of the strip-shaped cured sheet with the front and rear ends of the strip-shaped copper plate, respectively. Figure 23 for Figure 22 Top view; Figure 24 A schematic diagram showing how to align the left and right end faces of a microwave printed circuit board with the left and right end faces of a strip-shaped curing sheet, respectively. Figure 25 for Figure 24 Top view; Figure 26 A schematic diagram showing a drill bit drilling a through hole P and a through hole R inside a strip-shaped curing sheet and a strip-shaped copper plate, respectively; Figure 27 A schematic diagram illustrating how to drill two through holes P and two through holes R inside a strip-shaped cured sheet and a strip-shaped copper plate, respectively; Figure 28 A schematic diagram showing how a U-shaped groove is milled at both ends of a strip of copper plate; Figure 29 for Figure 28 Top view; Figure 30 A schematic diagram illustrating how to transfer the strip copper plate, strip curing sheet, and microwave printed circuit board on the wooden baseboard together to the tabletop. Figure 31 A schematic diagram showing how a hot press head is pressed against the top surface of a microwave printed circuit board; Figure 32 This is a schematic diagram showing how to flip both ends of a strip of copper upwards. Figure 33 for Figure 32 Enlarged view of part II; Figure 34 A schematic diagram showing the spot welding head touching the top surface of the folded part; Figure 35 A schematic diagram of a microwave printed circuit board with two embedded heat dissipation copper pillars B. In the picture: 1-Microwave printed circuit board, 2-Through hole, 3-Copper heat dissipation pillar A, 4-Center hole, 5-Tabletop, 6-Protrusion; 7-Copper heat dissipation pillar B, 8-Conical hole, 9-Conical head, 10-Cylindrical head, 11-Strip copper plate, 12-U-shaped groove, 13-Through hole R, 14-Strip curing sheet, 15-Through hole P, 16-Hot press head, 17-Folding part, 18-Spot welding head, 19-Wooden pad, 20-Drill bit. Detailed Implementation

[0015] The present invention will be further described below with reference to the accompanying drawings. The scope of protection of the present invention is not limited to the following description: A method for embedding heat dissipation copper pillars within a microwave printed circuit board includes the following steps: S1. The worker takes out a microwave printed circuit board 1 and then places it flat on the table 5. S2, the worker took out two such... Figures 10-11 The heat dissipation copper pillar B7 shown has an outer diameter smaller than the diameter of the through hole 2 of the microwave printed circuit board 1. A tapered hole 8 is opened in the heat dissipation copper pillar B7 along its axial direction. The height of the heat dissipation copper pillar B7 is equal to the thickness of the microwave printed circuit board 1. S3. The worker inserts one heat dissipation copper pillar B7 into the left through-hole 2 of the microwave printed circuit board 1, and then inserts the other heat dissipation copper pillar B7 into the right through-hole 2 of the microwave printed circuit board 1. At this time, both heat dissipation copper pillars B7 are supported on the table surface 5. Figure 12 As shown; S4. The two heat dissipation copper pillars B7 are respectively interference-fitted with the two through holes 2 of the microwave printed circuit board 1. The specific operation steps are as follows: S41, The worker takes out a... Figure 13 The expansion assembly shown consists of a conical head 9 and a cylindrical head 10 that are sequentially fixed together. The conical head 9 and the cylindrical head 10 are coaxial, and the conical head 9 mates with the conical hole 8 of the heat dissipation copper pillar B7. S42. The worker inserts the conical head 9 of the expansion assembly into the conical hole 8 of the heat dissipation copper pillar B7 on the left, as follows: Figure 14 As shown, the cylindrical head 10 of the expansion assembly is then struck downwards with a wooden hammer. Under the hammering of the wooden hammer, the conical head 9 gradually expands the circumferential material of the heat dissipation copper column B7 outwards. After a period of hammering, the heat dissipation copper column B7 expands into the through hole 2 on the left side, thereby making the heat dissipation copper column B7 on the left side and the through hole 2 on the left side interference fit. S43. The worker repeats step S42 once, so that the heat dissipation copper pillar B7 on the right side is interference-fitted with the through hole 2 on the right side, and finally the two heat dissipation copper pillars B7 are interference-fitted with the two through holes 2 of the microwave printed circuit board 1 respectively. S44. The worker removes the microwave printed circuit board 1, which has an interference fit and two heat dissipation copper pillars B7, from the table 5. Figure 15The diagram shows a microwave printed circuit board 1 with two heat dissipation copper pillars B7 and an interference fit. As can be seen from step S4, since the conical head 9 of the expansion assembly is in constant contact with the conical hole 8 of the heat dissipation copper pillar B7, it expands the circumferential material of the heat dissipation copper pillar B7 outward. Therefore, when the heat dissipation copper pillar B7 and the through hole 2 are fully interference-fitted, no protrusion 6 will appear on the inner wall of the heat dissipation copper pillar B7. This ensures that the heat on the microwave printed circuit board 1 can be smoothly released to the atmosphere through the conical hole 8, thus achieving the complete release of the heat on the microwave printed circuit board 1 to the atmosphere in a short time. Therefore, this embedding method, compared to... Figures 3-9 The embedding method shown greatly improves the heat dissipation efficiency of the microwave printed circuit board 1.

[0016] S5, the worker takes out one as... Figures 16-17 The strip copper plate 11 shown and a... Figures 18-19 The strip-shaped curing sheet 14 shown has a longitudinal width equal to the longitudinal width of the strip-shaped copper plate 11, and a horizontal length less than the horizontal length of the strip-shaped copper plate 11. Then, the worker places the strip-shaped copper plate 11 flat on the top surface of the wooden pad 19, as shown. Figures 20-21 As shown; The worker then places the strip-shaped curing sheet 14 flat on the top surface of the strip-shaped copper plate 11. The worker then adjusts the position of the strip-shaped curing sheet 14 so that it is in the center of the strip-shaped copper plate 11, and that its front and rear end faces are flush with the front and rear end faces of the strip-shaped copper plate 11, respectively. Figures 22-23 As shown; The worker then places the microwave printed circuit board 1, with two heat dissipation copper pillars B7 and an interference fit, flat on the top surface of the strip-shaped curing sheet 14. The worker then adjusts the position of the microwave printed circuit board 1 so that its left and right end faces are flush with the left and right end faces of the strip-shaped curing sheet 14, respectively. Figures 24-25 As shown, ensure that the tapered holes 8 of the two heat dissipation copper pillars B7 of the microwave printed circuit board 1 are directly above the strip curing sheet 14; S6. The worker first presses down the microwave printed circuit board 1 with his hand to fix the microwave printed circuit board 1, the strip curing sheet 14, and the strip copper plate 11 on the top surface of the wooden pad 19. Then, the worker operates a vertical drilling machine, causing the drill bit 20 to pass through the conical hole 8 of a heat dissipation copper pillar B7 to drill holes in the strip-shaped curing sheet 14 and the strip-shaped copper plate 11, thereby drilling a through hole P15 and a through hole R13 in the strip-shaped curing sheet 14 and the strip-shaped copper plate 11, respectively. Figure 26As shown, through holes P15 and R13 are connected to the conical hole 8 of the heat dissipation copper pillar B7, and the diameter of through hole P15 of strip-shaped curing sheet 14 is equal to the diameter of through hole R13 of strip-shaped copper plate 11. Then, the worker operates a vertical drilling machine, causing the drill bit 20 to pass through the conical hole 8 of another heat dissipation copper pillar B7 to drill holes in the strip-shaped curing sheet 14 and the strip-shaped copper plate 11. This results in drilling two through holes P15 and two through holes R13 within the strip-shaped curing sheet 14 and the strip-shaped copper plate 11, respectively. This achieves the goal of drilling two through holes P15 and two through holes R13 within the strip-shaped curing sheet 14 and the strip-shaped copper plate 11, respectively. Figure 27 As shown; Then, workers used a milling cutter on a horizontal milling machine to mill a U-shaped groove 12 at both ends of the strip copper plate 11, such as... Figures 28-29 As shown; S7. Fix the strip copper plate 11 together with the microwave printed circuit board 1. The specific operation steps are as follows: S71. The worker transfers the strip copper plate 11, strip curing sheet 14, and microwave printed circuit board 1 from the wooden pad 19 to the tabletop 5, as follows: Figure 30 As shown, ensure that both U-shaped grooves 12 of the strip copper plate 11 are outside the table 5 so as to facilitate the subsequent flanging of the strip copper plate 11; S72. Control the hot press head 16 of the hot press to move downwards, so that the hot press head 16 presses against the top surface of the microwave printed circuit board 1, such as... Figure 31 As shown, the heat on the hot press head 16 is transferred to the microwave printed circuit board 1, and the microwave printed circuit board 1 then transfers the heat to the strip curing sheet 14. After the pressure is maintained for a period of time, the heated strip curing sheet 14 fixes the strip copper plate 11 together with the microwave printed circuit board 1, which has two heat dissipation copper pillars B7 with an interference fit. S73. Control the hot press head 16 of the hot press to move upward so that the hot press head 16 moves away from the microwave printed circuit board 1; S8. The worker flips both ends of the strip copper plate 11 upwards to obtain the folded part 17 covering the top surface of the heat dissipation copper pillar B7, such as... Figures 32-33 As shown, at this time, the U-shaped groove 12 of the folded part 17 is connected to the conical hole 8 of the heat dissipation copper pillar B7; S9. The worker operates the spot welding machine so that the spot welding head 18 touches the top surface of the folded part 17, such as... Figure 34 As shown, the spot welding head 18 welds the folded part 17 to the top surface of the heat dissipation copper pillar B7, thereby ultimately realizing the embedding of two heat dissipation copper pillars B7 within the microwave printed circuit board 1, as shown. Figure 35The diagram shows a microwave printed circuit board 1 with two embedded heat dissipation copper pillars B7. When the microwave printed circuit board 1 with two embedded heat dissipation copper pillars B7 is working, the heat generated on it is transferred to the heat dissipation copper pillars B7. Part of the heat is released into the atmosphere through the conical hole 8 of the heat dissipation copper pillar B7 and the U-shaped groove 12 of the folded part 17 in sequence. The other part of the heat is released into the atmosphere through the conical hole 8, the through hole P and the through hole R in sequence, thereby achieving the purpose of heat dissipation for the microwave printed circuit board 1. S10. The worker removes the microwave printed circuit board 1, which has two heat dissipation copper pillars B7 embedded in it, from the table 5. S11. The worker repeats steps S1 to S10 multiple times to embed two heat dissipation copper pillars B7 in each of the multiple microwave printed circuit boards 1.

[0017] In step S4, the heat dissipation copper pillar B7 is firmly tightened within the through hole 2 of the microwave printed circuit board 1. Simultaneously, in steps S8-S9, the heat dissipation copper pillar B7 is vertically fixed between the folded portion 17 and the strip copper plate 11, thus firmly securing the heat dissipation copper pillar B7. Therefore, when the microwave printed circuit board 1 operates under vibration for extended periods, the heat dissipation copper pillar B7 will not vibrate out of the through hole 2, ensuring the continuous use of the microwave printed circuit board 1. It can be seen that this embedding method, compared to... Figures 3-9 The method shown uses only a single fixed heat dissipation copper pillar A3, which not only greatly improves the embedding quality of the heat dissipation copper pillar B, but also extends the service life of the microwave printed circuit board 1.

Claims

1. A method for embedding heat dissipation copper pillars within a microwave printed circuit board, characterized in that: It comprises the following steps: S1, the worker takes out a microwave printed circuit board (1), and then places it on the table (5) surface; S2, the worker takes out two heat dissipation copper column B (7), wherein the outer diameter of the heat dissipation copper column B (7) is smaller than the diameter of the through hole (2) of the microwave printed circuit board (1), and the heat dissipation copper column B (7) is provided with a tapered hole (8) along the axial direction; S3, the worker puts one heat dissipation copper column B (7) into the left through hole (2) of the microwave printed circuit board (1), and then puts the other heat dissipation copper column B (7) into the right through hole (2) of the microwave printed circuit board (1), at this time, the two heat dissipation copper column B (7) are supported on the table (5) surface; S4, make two heat dissipation copper column B (7) respectively with two through hole (2) of the microwave printed circuit board (1) interference fit, its specific operation steps are: S41, the worker takes out an expansion assembly, which is composed of a tapered head (9) and a cylindrical head (10) connected in sequence, the tapered head (9) is matched with the tapered hole (8) of the heat dissipation copper column B (7); S42, the worker puts the tapered head (9) of the expansion assembly into the tapered hole (8) of the left heat dissipation copper column B (7), and then knocks the cylindrical head (10) of the expansion assembly with a wooden hammer, under the knocking of the wooden hammer, the tapered head (9) gradually expands the circumferential material of the heat dissipation copper column B (7) outward; after a period of time, the heat dissipation copper column B (7) is expanded in the left through hole (2), so that the left heat dissipation copper column B (7) is interference fit with the left through hole (2); S43, the worker repeats the operation of step S42 once, so that the right heat dissipation copper column B (7) is interference fit with the right through hole (2), and then finally makes two heat dissipation copper column B (7) respectively with two through hole (2) of the microwave printed circuit board (1) interference fit; S44, the worker takes away the microwave printed circuit board (1) with two heat dissipation copper column B (7) from the table (5); S5, the worker takes out a strip copper plate (11) and a strip curing piece (14), wherein the longitudinal width of the strip curing piece (14) is equal to the longitudinal width of the strip copper plate (11), and the horizontal length of the strip curing piece (14) is less than the horizontal length of the strip copper plate (11); then the worker places the strip copper plate (11) on the top surface of the wooden base plate (19); Then the worker places the strip curing piece (14) on the top surface of the strip copper plate (11), and then adjusts the position of the strip curing piece (14) so that the strip curing piece (14) is in the middle of the strip copper plate (11), and the front and rear end faces of the strip curing piece (14) are flush with the front and rear end faces of the strip copper plate (11); Then the worker places the microwave printed circuit board (1) with the two heat dissipation copper columns B (7) in interference fit on the top surface of the strip-shaped curing sheet (14), and then adjusts the position of the microwave printed circuit board (1) so that the left and right end faces of the microwave printed circuit board (1) are flush with the left and right end faces of the strip-shaped curing sheet (14), and ensures that the tapered holes (8) of the two heat dissipation copper columns B (7) of the microwave printed circuit board (1) are directly above the strip-shaped curing sheet (14); S6, the worker first presses the microwave printed circuit board (1) with his hand to fix the microwave printed circuit board (1), the strip-shaped curing sheet (14) and the strip-shaped copper plate (11) on the top surface of the wooden backing plate (19); Then the worker operates the vertical drilling machine to make the drill bit (20) of the vertical drilling machine pass through the tapered hole (8) of one of the heat dissipation copper columns B (7) to drill holes in the strip-shaped curing sheet (14) and the strip-shaped copper plate (11), thereby drilling a through hole P (15) and a through hole R (13) in the strip-shaped curing sheet (14) and the strip-shaped copper plate (11) respectively, wherein the through hole P (15) and the through hole R (13) are in communication with the tapered hole (8) of the heat dissipation copper column B (7); Then the worker operates the vertical drilling machine to make the drill bit (20) of the vertical drilling machine pass through the tapered hole (8) of the other heat dissipation copper column B (7) to drill holes in the strip-shaped curing sheet (14) and the strip-shaped copper plate (11), thereby drilling another through hole P (15) and another through hole R (13) in the strip-shaped curing sheet (14) and the strip-shaped copper plate (11) respectively, thereby drilling two through holes P (15) and two through holes R (13) in the strip-shaped curing sheet (14) and the strip-shaped copper plate (11) respectively; Then the worker mills a U-shaped groove (12) at the left and right ends of the strip-shaped copper plate (11) through the milling cutter of the horizontal milling machine; S7, the strip-shaped copper plate (11) and the microwave printed circuit board (1) are fixed together, and the specific operation steps are as follows: S71, the worker turns the strip-shaped copper plate (11), the strip-shaped curing sheet (14) and the microwave printed circuit board (1) on the wooden backing plate (19) together onto the tabletop (5) of the table, and ensures that the two U-shaped grooves (12) of the strip-shaped copper plate (11) are outside the tabletop (5) to facilitate subsequent flanging of the strip-shaped copper plate (11); S72, control the hot head (16) of the hot press to move downward, so that the hot head (16) is pressed on the top surface of the microwave printed circuit board (1), the heat on the hot head (16) is transferred to the microwave printed circuit board (1), and the microwave printed circuit board (1) further transfers the heat to the strip-shaped curing sheet (14), after a certain pressure holding time, the heated strip-shaped curing sheet (14) fixes the strip-shaped copper plate (11) and the microwave printed circuit board (1) with the two heat dissipation copper columns B (7) in interference fit; S73, control the hot head (16) of the hot press to move upward, so that the hot head (16) moves away from the microwave printed circuit board (1); S8, the worker turns up the left and right ends of the strip-shaped copper plate (11) to obtain the folded part (17) covering the top surface of the heat dissipation copper column B (7), at this time, the U-shaped slot (12) of the folded part (17) is in communication with the tapered hole (8) of the heat dissipation copper column B (7); S9, the worker operates the spot welding machine to make the spot welding head (18) on it touch the top surface of the folded part (17), and the spot welding head (18) welds the folded part (17) on the top surface of the heat dissipation copper column B (7), thereby finally realizing the embedding of two heat dissipation copper columns B (7) in the microwave printed circuit board (1); S10, the worker takes away the microwave printed circuit board (1) embedded with two heat dissipation copper columns B (7) from the table (5); S11, the worker repeats the operations of steps S1-S10 multiple times, that is, two heat dissipation copper columns B (7) can be embedded in multiple microwave printed circuit boards (1).

2. The method of claim 1, wherein: The height of the heat dissipation copper column B (7) in step S2 is equal to the thickness of the microwave printed circuit board (1). ​ 3. The method of claim 1, wherein: The tapered head (9) and the cylindrical head (10) of the expansion assembly in step S41 are on the same axis. ​ 4. The method of claim 1, wherein: The diameter of the through hole P (15) of the strip-shaped cured sheet (14) in step S6 is equal to the diameter of the through hole R (13) of the strip-shaped copper plate (11).

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