Intelligent film pasting device for printed circuit board production

Abstract

The invention relates to the technical field of printed circuit board production, in particular to an intelligent film pasting device for printed circuit board production, which comprises a machine table, a first connecting roller, a first silica gel conveying belt, a first limiting plate and the like, the machine table is rotationally connected with at least two first connecting rollers; all the first connecting rollers are jointly connected with a first silica gel conveying belt; the machine table is connected with a first limiting plate, the first limiting plate is located between the two first connecting rollers, the two ends of the first limiting plate make close contact with the adjacent first connecting rollers, and the first limiting plate makes contact with the inner side face of the first silica gel conveying belt. The pre-pasted copper substrate is conveyed and subjected to vacuum mold pressing through the first silica gel conveying belt, the second silica gel conveying belt and the sealing assembly, a carrier film winding and unwinding mechanism and a leveling mechanism do not need to be arranged for leveling, the production process is optimized, the occupied area is reduced, the structure is simple, maintenance is facilitated, and the production efficiency is improved by adopting the vacuum mold pressing mode. Continuous production can be achieved, and the production efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board (PCB) manufacturing technology, and more particularly to an intelligent film-applying device for PCB manufacturing. Background Technology

[0002] In the production process of printed circuit boards (PCBs), a laminating device is needed to bond dry film to the surface of a copper substrate for subsequent exposure and development processes. Common laminating devices in existing technologies are divided into roller type and vacuum type. Roller type laminating devices mainly use the deformation of a silicone roller to compress the dry film. Its characteristic is localized surface pressure. When there is a certain height difference on the copper substrate surface, the deformation of the silicone cannot completely ensure a tight bond between the dry film and the copper substrate, resulting in air bubbles. Furthermore, due to the localized pressure, wrinkles and uneven thickness of the dry film are easily caused, affecting subsequent exposure and development processes. Vacuum type laminating devices mainly use the deformation of a silicone pad to compress the dry film, combined with negative pressure to bond the dry film to the copper substrate surface. Its characteristic is comprehensive surface pressure, ensuring a tight bond between the dry film and the copper substrate surface without causing wrinkles or uneven thickness.

[0003] However, after the dry film pre-applied by the vacuum molding device, the copper substrate with the pre-applied dry film needs to be transported by the carrier film take-up and take-down mechanism, and then vacuum film application is performed by the vacuum molding device. Finally, the copper substrate with the film applied is transported to the leveling mechanism by the carrier film take-up and take-down mechanism for leveling. This results in the vacuum molding device having many processes, a large footprint, and high maintenance difficulty. Summary of the Invention

[0004] To overcome the shortcomings of existing vacuum molding devices, such as numerous processes, large footprint, and high maintenance difficulty, this invention provides an intelligent film application device for printed circuit board production.

[0005] The technical embodiment of the present invention is as follows: an intelligent film-applying device for printed circuit board production, comprising a machine platform; further comprising a first connecting roller, a first silicone conveyor belt, a first limiting plate, a second connecting roller, a second silicone conveyor belt, a second limiting plate, and a sealing assembly; at least two first connecting rollers are rotatably connected to the machine platform; all the first connecting rollers are connected to a first silicone conveyor belt; a first limiting plate is connected to the machine platform, the first limiting plate is located between the two first connecting rollers, and both ends of the first limiting plate are in close contact with the adjacent first connecting rollers, and the first limiting plate is in contact with the inner side of the first silicone conveyor belt; at least two second connecting rollers are rotatably connected to the machine platform, the second connecting rollers are located above the first connecting rollers, and the space between the two second connecting rollers is... The distance between the two first connecting rollers is less than the distance between the two second connecting rollers, and the midpoint between the two second connecting rollers is directly opposite the midpoint between the two first connecting rollers; all the second connecting rollers are connected to a second silicone conveyor belt, and the widths of the first and second silicone conveyor belts are equal; a second limiting plate is connected to the machine base, the second limiting plate is located between the two second connecting rollers, and the two ends of the second limiting plate are in close contact with the adjacent second connecting rollers, and the second limiting plate is in contact with the inner side of the second silicone conveyor belt; one of the first connecting rollers and the second connecting roller are respectively connected to the output end of an external motor; heaters are provided on both the first and second limiting plates for softening the photoresist layer of the dry film; a sealing component for forming a sealed space is connected to the second limiting plate.

[0006] Optionally, the sealing assembly includes two limiting blocks slidably connected to the second limiting plate; each limiting block has a first arc-shaped protrusion facing downwards; the second silicone conveyor belt forms a second arc-shaped protrusion under the constraint of the first arc-shaped protrusion; at least three springs are fixedly connected between each limiting block and the second limiting plate; two sealing plates are fixedly connected to the second limiting plate, the length of which is greater than the distance between the two second arc-shaped protrusions, and both the first and second silicone conveyor belts are in close contact with the sealing plates; the width of the first limiting plate is greater than the width of the second limiting plate; two slots are provided on the first limiting plate, and the sealing plates are inserted into the slots on adjacent sides; several suction holes are provided on the sealing plate, the suction holes being located vertically between the first and second silicone conveyor belts and horizontally between the two second arc-shaped protrusions; the sealing plates are hollow inside and connected to an external vacuum pump; a tensioning unit for keeping the second silicone conveyor belt taut is connected to the second limiting plate.

[0007] Optionally, the tensioning unit includes two spring telescopic rods fixed to the second limiting plate; the telescopic ends of the two spring telescopic rods face the second connecting roller that is not connected to the external motor, and the telescopic ends of the spring telescopic rods are rotatably connected to the second connecting roller, and the second connecting roller that is not connected to the external motor is slidably disposed in the limiting groove.

[0008] Optionally, it also includes a plurality of silicone strips connected to the surface of the first silicone conveyor belt, wherein the spacing between two adjacent silicone strips is greater than 3-4 mm of the standard length of the copper substrate; the thickness of the silicone strips is equal to the thickness of the copper substrate.

[0009] Optionally, the silicone strip is detachably connected to the first silicone conveyor belt, and the widths of both the first and second silicone conveyor belts are greater than the standard width of the largest copper substrate.

[0010] Optionally, it also includes a straightening assembly, which includes a mounting base fixed to the machine base and located to the right of the first silicone conveyor belt; a plurality of conveying rollers are rotatably connected to the mounting base, the length of the conveying rollers being greater than the width of the first silicone conveyor belt; two first electric push rods are connected to the mounting base; the telescopic ends of the first electric push rods are fixed to a plurality of connecting seats through connecting plates; each connecting seat is connected to a straightening rod, each straightening rod is located between two adjacent conveying rollers, and the top of the straightening rod is higher than the top of the conveying roller.

[0011] Optionally, the straightening rod is rotatably connected to the connecting seat.

[0012] Optionally, it also includes a detection and rejection assembly, which includes several visual inspection heads fixed to the mounting base; a first mounting plate is fixed to the machine base, the first mounting plate is located directly above the mounting base, and several visual inspection heads are also provided on the side of the first mounting plate facing the mounting base; a rectangular slot is opened on the mounting base; a second mounting plate is slidably connected to the rectangular slot; one of the first electric push rods on the mounting base is fixedly connected to the second mounting plate, and the other first electric push rod is fixedly connected to the mounting base; at least two second electric push rods with their telescopic ends facing upwards are fixedly connected in the rectangular slot, and the telescopic ends of the second electric push rods are fixedly connected to the second mounting plate; a feeding guide plate is fixedly connected to the side of the machine base near the rectangular slot, and the top of the feeding guide plate is lower than the top of the conveyor roller.

[0013] Optionally, it also includes an annular groove formed at the end of the conveyor roller facing the unloading guide plate; the top of the mounting base near the unloading guide plate is lower than the top of the conveyor roller; several annular clamps are detachably connected to the top of the mounting base near the unloading guide plate; the annular clamps are engaged in the annular groove of the conveyor roller, and the outer diameter of the annular clamps is the same as the outer diameter of the conveyor roller.

[0014] Optionally, it also includes a cooler detachably connected to the side of the machine away from the mounting base, with a first silicone conveyor belt passing through the cooler.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] 1. The present invention uses a first silicone conveyor belt, a second silicone conveyor belt, and a sealed assembly to transport and vacuum mold the pre-attached copper substrate, eliminating the need for a carrier film take-up and take-down mechanism and a leveling mechanism for leveling. This optimizes the production process, reduces the floor space required, and the present invention has a simple structure that is easy to maintain. Furthermore, the vacuum molding method of the present invention enables continuous production and improves production efficiency.

[0017] 2. The present invention restricts the copper substrate by using a silicone strip, so that when the copper substrate comes into contact with the second silicone conveyor belt, the silicone strip replaces it, thus avoiding the problem of the left end of the pre-applied dry film lifting up when the copper substrate comes into contact with the second silicone conveyor belt, which would cause wrinkles in the pre-applied dry film.

[0018] 3. By using silicone strips to confine the copper substrate, each copper substrate is placed in a separate small sealed space, which avoids all copper substrates being placed in the same sealed space, thus affecting the vacuum molding operation. Attached Figure Description

[0019] Figure 1 This is a schematic diagram from the first perspective of the present invention;

[0020] Figure 2 This is a schematic diagram from a second perspective of the present invention;

[0021] Figure 3 This is a schematic diagram of the combination of the first connecting roller, the first silicone conveyor belt, the first limiting plate, the second connecting roller, and the second silicone conveyor belt according to the present invention.

[0022] Figure 4 This is a schematic diagram of the second limiting plate, limiting block, and spring assembly of the present invention;

[0023] Figure 5 This is a schematic diagram of the suction hole of the present invention;

[0024] Figure 6 This is a schematic diagram of the card slot of the present invention;

[0025] Figure 7 This is a schematic diagram of the combination of the correction component and the detection and rejection component of the present invention;

[0026] Figure 8 This is a schematic diagram of the combination of the second mounting plate and the second electric push rod of the present invention;

[0027] Figure 9 This is an exploded view of the conveying roller and annular clamp of the present invention.

[0028] The components in the attached diagram are labeled as follows: 1-Machine base, 1001-Restriction groove, 101-First connecting roller, 102-First silicone conveyor belt, 103-First restriction plate, 10301-Card slot, 104-Second connecting roller, 105-Second silicone conveyor belt, 10501-Second arc-shaped protrusion, 106-Second restriction plate, 201-Restriction block, 20101-First arc-shaped protrusion, 202-Spring, 203-Sealing plate, 2030 1-Suction hole, 204-Spring telescopic rod, 301-Silicone strip, 401-Mounting base, 40101-Rectangular groove, 402-Conveying roller, 40201-Annular groove, 403-First electric push rod, 404-Connecting base, 405-Correcting rod, 501-Vision inspection head, 502-First mounting plate, 503-Discharge guide plate, 504-Second mounting plate, 505-Second electric push rod, 601-Annular clamp, 701-Cooler. Detailed Implementation

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1: As Figures 1-6 As shown, an intelligent film-applying device for printed circuit board production includes an organic platform 1.

[0031] It also includes a first connecting roller 101, a first silicone conveyor belt 102, a first limiting plate 103, a second connecting roller 104, a second silicone conveyor belt 105, a second limiting plate 106, and a sealing assembly; two symmetrically distributed first connecting rollers 101 are rotatably connected to the machine base 1; all the first connecting rollers 101 are connected to a first silicone conveyor belt 102; a first limiting plate 103 is connected to the machine base 1, the first limiting plate 103 is located between the two first connecting rollers 101, and both ends of the first limiting plate 103 are in close contact with the adjacent first connecting rollers 101, and the first limiting plate 103 is in contact with the inner side of the first silicone conveyor belt 102; two symmetrically distributed second connecting rollers 104 are rotatably connected to the machine base 1, the second connecting rollers 104 are located above the first connecting rollers 101, and the distance between the two second connecting rollers 104 is smaller than the distance between the two first connecting rollers 101, and the distance between the two second connecting rollers 104 is smaller than the distance between the two first connecting rollers 101. The midpoint between the two first connecting rollers 104 is directly opposite to the midpoint between the two first connecting rollers 101; all the second connecting rollers 104 are connected to a second silicone conveyor belt 105, the widths of the first silicone conveyor belt 102 and the second silicone conveyor belt 105 are equal; a second limiting plate 106 is connected to the machine base 1, the second limiting plate 106 is located between the two second connecting rollers 104, and the two ends of the second limiting plate 106 are in close contact with the adjacent second connecting rollers 104, and the second limiting plate 106 is in contact with the inner side of the second silicone conveyor belt 105; one of the first connecting rollers 101 and the second connecting roller 104 are respectively connected to the output end of an external motor, the external motor drives the first connecting roller 101 and the second connecting roller 104 to rotate, so that the first silicone conveyor belt 102 and the second silicone conveyor belt 105 rotate to transport the copper substrate; heaters are provided on both the first limiting plate 103 and the second limiting plate 106; a sealing component is connected to the second limiting plate 106.

[0032] The sealing assembly includes two limiting blocks 201 slidably connected to the second limiting plate 106, which are symmetrically distributed. Each limiting block 201 has a first arc-shaped protrusion 20101 facing downwards. A second silicone conveyor belt 105 forms a second arc-shaped protrusion 10501 under the constraint of the first arc-shaped protrusion 20101. Three springs 202 arranged in a linear array are fixedly connected between each limiting block 201 and the second limiting plate 106. Two sealing plates 203, symmetrically distributed front and rear, are fixedly connected to the second limiting plate 106. The length of each sealing plate 203 is greater than the distance between the two second arc-shaped protrusions 10501. Both the first silicone conveyor belt 102 and the second silicone conveyor belt 105 are connected to the sealing plates 203. The first limiting plate 103 is wider than the second limiting plate 106. Two slots 10301 are provided on the first limiting plate 103. The width of the slots 10301 is the same as the width of the sealing plate 203, and the length of the slots 10301 is the same as the length of the lower part of the sealing plate 203. The lower part of the sealing plate 203 is inserted into the adjacent slots 10301. Several rectangular suction holes 20301 are provided on the sealing plate 203. The suction holes 20301 are located vertically between the first silicone conveyor belt 102 and the second silicone conveyor belt 105, and horizontally between the two second arc-shaped protrusions 10501. The sealing plate 203 is hollow inside and connected to an external vacuum pump. A tensioning unit is connected to the second limiting plate 106.

[0033] The tensioning unit includes two spring telescopic rods 204 fixed to the second limiting plate 106. The two spring telescopic rods 204 are symmetrically distributed front and back. The telescopic ends of the two spring telescopic rods 204 face the second connecting roller 104 which is not connected to the external motor, and the telescopic ends of the spring telescopic rods 204 are rotatably connected to the second connecting roller 104. The second connecting roller 104 which is not connected to the external motor is slidably disposed in the limiting groove 1001. The elastic coefficient and deformation of the spring 202 are both greater than the elastic coefficient and deformation of the elastic element inside the spring telescopic rod 204.

[0034] The specific operation of this embodiment is described below:

[0035] by Figure 1 Using the perspective reference, the side where machine 1 is labeled is the front. Machine 1 has a dry film pre-attachment mechanism (existing technology, not shown in the figure) on its right side and a temporary storage mechanism (existing technology, not shown in the figure) on its left side. The right end of the first silicone conveyor belt 102 connects to the conveying unit of the dry film pre-attachment mechanism, and the left end of the first silicone conveyor belt 102 connects to the temporary storage mechanism. The gap between the first silicone conveyor belt 102 and the second silicone conveyor belt 105 is less than 2-3 mm (the total thickness of the pre-attached copper substrate plus the dry film).

[0036] In use, the copper substrate is first pre-attached with dry film by a dry film pre-attachment mechanism. After pre-attachment, the copper substrate is conveyed onto the first silicone conveyor belt 102. As an external motor drives the first silicone conveyor belt 102 to rotate via the first connecting roller 101 (the rotation direction of the first silicone conveyor belt 102 is counterclockwise from a front-to-back perspective), the pre-attached copper substrate is conveyed to the left as the first silicone conveyor belt 102 rotates. When the pre-attached copper substrate contacts the second silicone conveyor belt 105, the second silicone conveyor belt 105 is driven to rotate via the second connecting roller 104 by an external motor (the rotation direction of the second silicone conveyor belt 105 is counterclockwise from a front-to-back perspective). The rotation direction is clockwise. The pre-attached copper substrate will enter between the first silicone conveyor belt 102 and the second silicone conveyor belt 105, and will be held and transported by the first silicone conveyor belt 102 and the second silicone conveyor belt 105. After the pre-attached copper substrate enters between the first silicone conveyor belt 102 and the second silicone conveyor belt 105, the heaters on the first limiting plate 103 and the second limiting plate 106 heat the first silicone conveyor belt 102 and the second silicone conveyor belt 105, and the photoresist layer on the dry film will soften, thereby pressing the pre-attached dry film onto the copper substrate by the first silicone conveyor belt 102 and the second silicone conveyor belt 105.

[0037] Furthermore, after the pre-attached copper substrate enters between the first silicone conveyor belt 102 and the second silicone conveyor belt 105, as the pre-attached copper substrate continues to move to the left, it will contact the second arc-shaped protrusion 10501 at the right end of the second silicone conveyor belt 105 (the second arc-shaped protrusion 10501 is in close contact with the first silicone conveyor belt 102). As the copper substrate moves, it will force the second arc-shaped protrusion 10501 to deform upward, and the corresponding limiting block 201 will move upward. The spring 202 will be compressed to avoid the pre-attached copper substrate. At the same time, the telescopic end of the spring telescopic rod 204 forces another second connecting roller 104, which is not connected to the external motor, to slide in the limiting groove 1001 of the machine base 1 (the telescopic end of the spring telescopic rod 204 is initially in a retracted state) to maintain the tension of the second silicone conveyor belt 105, ensure the conveying of the copper substrate, ensure the bonding effect of the dry film, and ensure the sealing of the subsequent vacuum environment.

[0038] After the pre-attached copper substrate passes the second arc-shaped protrusion 10501 at the right end of the second silicone conveyor belt 105, the spring 202 pushes the limiting block 201 to move down and reset. At the same time, the second silicone conveyor belt 105 pulls the second connecting roller 104, which is not connected to the external motor, to slide and reset on the machine base 1. The telescopic end of the spring telescopic rod 204 retracts again. At this time, the copper substrate is located between the two second arc-shaped protrusions 10501. Since the front and rear sides of the second limiting plate 106 are provided with sealing plates 203, the length of the sealing plates 203 is greater than the distance between the two second arc-shaped protrusions 10501, and the sealing plates... The lower end of 203 is inserted into the slot 10301 of the first limiting plate 103. At the same time, due to the close contact between the second arc-shaped protrusion 10501 and the first silicone conveyor belt 102, a sealed space is formed between the first silicone conveyor belt 102 and the second silicone conveyor belt 105 between the two second arc-shaped protrusions 10501. Therefore, when the copper substrate is located between the two second arc-shaped protrusions 10501, the external vacuum pump is controlled to draw suction from the sealed space through the suction hole 20301 on the sealing plate 203, so that the sealed space forms a negative pressure environment to ensure that the dry film adheres tightly to the surface of the copper substrate.

[0039] As the first silicone conveyor belt 102 and the second silicone conveyor belt 105 convey the copper substrate, the copper substrate will come into contact with the second arc-shaped protrusion 10501 at the left end of the second silicone conveyor belt 105, and force the second arc-shaped protrusion 10501 to deform upward to avoid it. As the copper substrate gradually passes the second arc-shaped protrusion 10501 at the left end of the second silicone conveyor belt 105 and passes the second silicone conveyor belt 105, the second silicone conveyor belt 105 will squeeze the dry film after vacuum molding again to ensure that the dry film is flat.

[0040] In summary, this invention uses a first silicone conveyor belt 102, a second silicone conveyor belt 105, and a sealed assembly to transport and vacuum-press the pre-attached copper substrate. This eliminates the need for a carrier film delivery mechanism and a leveling mechanism, optimizing the production process, reducing floor space, and providing a simple, easy-to-maintain structure. Furthermore, the vacuum pressing method of this invention enables continuous production, improving efficiency. Note that during continuous production, existing dry film pre-attachment mechanisms maintain gaps between consecutive copper substrates during batch pre-attachment, thus not affecting the sealed space. The length of the sealed space is greater than the standard length of 3-4 copper substrates, ensuring effective vacuum pressing of the pre-attached copper substrate.

[0041] After vacuum molding is completed, the copper substrate will be transported to the temporary storage mechanism along with the first silicone conveyor belt 102, waiting to be transferred for subsequent exposure and other operations.

[0042] Example 2: Based on Example 1, such as Figure 3 and Figure 4 As shown, it also includes a plurality of silicone strips 301 connected to the surface of the first silicone conveyor belt 102. The plurality of silicone strips 301 are arranged in an array along the surface of the first silicone conveyor belt 102, and the spacing between two adjacent silicone strips 301 is greater than 3-4 mm of the standard length of the copper substrate; the thickness of the silicone strips 301 is equal to the thickness of the copper substrate.

[0043] The silicone strip 301 is detachably connected to the first silicone conveyor belt 102. The widths of the first silicone conveyor belt 102 and the second silicone conveyor belt 105 are both greater than the standard width of the largest copper substrate. The operator can adjust the spacing between two adjacent silicone strips 301 according to the length of different batches of copper substrates, so that the present invention can perform vacuum molding operations on copper substrates of different sizes.

[0044] The specific operation of this embodiment is described below:

[0045] In use, the operator adjusts the rotation speed of the first silicone conveyor belt 102 and the second silicone conveyor belt 105 in advance according to the film application rate of the dry film pre-application mechanism and the rate at which the pre-application copper substrate is transported to the surface of the first silicone conveyor belt 102. This ensures that when the pre-application copper substrate is transported onto the first silicone conveyor belt 102, the left end of the copper substrate contacts or leaves a 3-4mm gap with the right end of the nearest silicone strip 301. As the copper substrate is transported by the first silicone conveyor belt 102, the left end of the next silicone strip 301 contacts or leaves a 3-4mm gap with the right end of the copper substrate. This restricts the copper substrate during transport by the two adjacent silicone strips 301, so that when the copper substrate contacts the second silicone conveyor belt 105, the silicone strip 301 takes over, preventing the left end of the pre-application dry film from lifting up when the copper substrate contacts the second silicone conveyor belt 105, which could lead to wrinkles in the pre-application dry film.

[0046] Furthermore, in order to accommodate copper substrates of different widths and ensure the vacuum molding effect, the widths of the first silicone conveyor belt 102 and the second silicone conveyor belt 105 need to be greater than the standard width of the largest copper substrate. This would cause the sealed space to connect with the outside when the copper substrate lifts the second arc-shaped protrusion 10501 upwards, affecting the vacuum molding operation. Therefore, the silicone strip 301 is used to restrict the copper substrate, so that a single copper substrate is located in a separate small sealed space, which can prevent all copper substrates from being located in the same sealed space and affecting the vacuum molding operation.

[0047] Example 3: Based on Examples 1 and 2, as follows Figure 1 , Figure 2 , Figure 7 , Figure 8 and Figure 9As shown, it also includes a correction component, which includes a mounting base 401 fixed to the machine base 1, and the mounting base 401 is located to the right of the first silicone conveyor belt 102; a plurality of conveying rollers 402 are rotatably connected to the mounting base 401 in a straight line and equidistantly distributed manner, the length of the conveying rollers 402 is greater than the width of the first silicone conveyor belt 102, and the conveying rollers 402 are driven to rotate by an external motor; two first electric push rods 403 are connected to the mounting base 401 in a symmetrically distributed manner; the telescopic ends of the first electric push rods 403 are fixed to a plurality of connecting seats 404 in a straight line and equidistantly distributed manner through connecting plates; each connecting seat 404 is connected to a correction rod 405, each correction rod 405 is located between two adjacent conveying rollers 402, and the top of the correction rod 405 is higher than the top of the conveying roller 402.

[0048] The straightening rod 405 is rotatably connected to the connecting seat 404, which reduces the friction between the straightening rod 405 and the copper substrate.

[0049] It also includes a detection and rejection assembly, which includes several visual inspection heads 501 fixed to the mounting base 401 and arranged in a straight line at equal intervals; a first mounting plate 502 is fixed to the machine base 1, located directly above the mounting base 401, and several visual inspection heads 501 arranged in a straight line at equal intervals are also provided on the side of the first mounting plate 502 facing the mounting base 401; a rectangular groove 40101 is formed on the mounting base 401; a second mounting plate is slidably connected to the rectangular groove 40101. 504; The first electric push rod 403 located on the front side of the mounting base 401 is fixedly connected to the second mounting plate 504, and the first electric push rod 403 on the rear side is fixedly connected to the mounting base 401; Two second electric push rods 505, which are symmetrically distributed and have their telescopic ends facing upwards, are fixedly connected inside the rectangular groove 40101, and the telescopic ends of the second electric push rods 505 are fixedly connected to the second mounting plate 504; A feeding guide plate 503 is fixedly connected to the side of the machine base 1 near the rectangular groove 40101, and the top of the feeding guide plate 503 is lower than the top of the conveying roller 402.

[0050] It also includes an annular groove 40201 opened at one end of the conveyor roller 402 facing the unloading guide plate 503; the top of the mounting base 401 near the unloading guide plate 503 is lower than the top of the conveyor roller 402; a number of annular clamps 601 distributed in a straight line and equidistantly connected to the top of the mounting base 401 near the unloading guide plate 503; the annular clamps 601 are engaged at the annular groove 40201 of the conveyor roller 402, and the outer diameter of the annular clamps 601 is consistent with the outer diameter of the conveyor roller 402.

[0051] It also includes a cooler 701 that is detachably connected to the side of the machine base 1 away from the mounting base 401. The cooler 701 and the mounting base 401 are arranged opposite to each other on the machine base 1. The first silicone conveyor belt 102 passes through the cooler 701. After the pre-attached copper substrate is vacuum molded, the copper substrate will be conveyed into the cooler 701 along with the first silicone conveyor belt 102, and the cooler 701 will cool the dry film.

[0052] The specific operation of this embodiment is described below:

[0053] In this embodiment, the mounting base 401 is located between the first silicone conveyor belt 102 and the conveying unit of the dry film pre-applying mechanism. The conveying roller 402 on the mounting base 401 is used to connect the first silicone conveyor belt 102 and the conveying unit of the dry film pre-applying mechanism. After the copper substrate is pre-applied by the dry film pre-applying mechanism, the pre-applied copper substrate will first be conveyed to the conveying roller 402, which will then be used as a transition roller group to convey it to the first silicone conveyor belt 102. When the pre-applied copper substrate is conveyed to the conveying roller 402, the telescopic end of the first electric push rod 403 is controlled to push the correction rod 405 towards the pre-applied copper substrate to correct the position of the copper substrate, ensuring that the copper substrate is centered and that the copper substrate can be stably vacuum molded. Note that the conveying roller 402 does not rotate when the position of the copper substrate is corrected by the correction rod 405.

[0054] Furthermore, during the process of conveying the copper substrate to the first silicone conveyor belt 102 via the conveyor roller 402 as an intermediate component, the pre-attached dry film on the copper substrate is inspected by the vision inspection head 501. The inspection scope includes position, damage, and wrinkles. The data detected by the vision inspection head 501 is transmitted to the background display system (such as an industrial control computer) and compared by the program. When a quality problem is found in the pre-attached dry film on the copper substrate, the program automatically controls the second electric push rod 505 to drive the second mounting plate 504 to descend, causing the first electric push rod located in front of the mounting base 401 to... 403 drives the connected components to descend, avoiding the copper substrate rejection operation. At the same time, the first electric push rod 403 on the rear side of the control mounting base 401 pushes the correction rod 405 towards the pre-attached copper substrate, causing the copper substrate with unqualified pre-attached dry film to fall into the unloading guide plate 503. The unloading guide plate 503 then guides the copper substrate to be discharged into the collection frame of the peripheral device, thus realizing the rejection of the copper substrate with unqualified pre-attached dry film. The above description of starting the electrical components through program control and transmitting data to the background display system are all existing technologies and will not be elaborated here.

[0055] Furthermore, to avoid the front of the mounting base 401 obstructing the removal of the copper substrate, the mounting base 401 is positioned so that its top edge is closer to the top edge of the unloading guide plate 503 than the top edge of the conveying roller 402, thus avoiding obstruction of the removal of the copper substrate. To ensure the rotational stability of the conveying roller 402, an annular clamp 601 is provided at the front of the mounting base 401, and an annular groove 40201 is formed on the conveying roller 402, so that the outer diameter of the annular clamp 601 is consistent with the outer diameter of the conveying roller 402. This ensures the rotational stability of the conveying roller 402 while avoiding obstruction of the removal of the copper substrate.

[0056] Although the invention has been described with reference to exemplary embodiments, it should be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims should be given the broadest interpretation so as to cover all variations and equivalent structures and functions.

Claims

1. A smart film-applying device for printed circuit board production, comprising an organic platform (1); characterized in that: It also includes a first connecting roller (101); at least two first connecting rollers (101) are rotatably connected to the machine base (1); all the first connecting rollers (101) are connected to a first silicone conveyor belt (102); a first limiting plate (103) is connected to the machine base (1), the first limiting plate (103) is located between the two first connecting rollers (101), and the two ends of the first limiting plate (103) are in close contact with the adjacent first connecting rollers (101), and the first limiting plate (103) is in contact with the inner side of the first silicone conveyor belt (102); at least two second connecting rollers (104) are rotatably connected to the machine base (1), the second connecting rollers (104) are located above the first connecting rollers (101), and the distance between the two second connecting rollers (104) is less than the distance between the two first connecting rollers (101), and the two second connecting rollers (104) are connected to the machine base (102). The midpoint between 04) is directly opposite the midpoint between the two first connecting rollers (101); all the second connecting rollers (104) are connected to a second silicone conveyor belt (105), the widths of the first silicone conveyor belt (102) and the second silicone conveyor belt (105) are equal; a second limiting plate (106) is connected on the machine base (1), the second limiting plate (106) is located between the two second connecting rollers (104), and the two ends of the second limiting plate (106) are in close contact with the adjacent second connecting rollers (104), and the second limiting plate (106) is in contact with the inner side of the second silicone conveyor belt (105); one of the first connecting rollers (101) and the second connecting roller (104) are respectively connected to the output end of an external motor; heaters are provided on both the first limiting plate (103) and the second limiting plate (106) for softening the photoresist layer of the dry film; The second limiting plate (106) is connected to a sealing component for forming a closed space.

2. The intelligent film-applying device for printed circuit board production according to claim 1, characterized in that: The sealing assembly includes two limiting blocks (201) slidably connected to a second limiting plate (106); each limiting block (201) has a first arc-shaped protrusion (20101) facing downwards; a second silicone conveyor belt (105) forms a second arc-shaped protrusion (10501) under the constraint of the first arc-shaped protrusion (20101); at least three springs (202) are fixedly connected between each limiting block (201) and the second limiting plate (106); two sealing plates (203) are fixedly connected to the second limiting plate (106), the length of which is greater than the distance between the two second arc-shaped protrusions (10501); the first silicone conveyor belt (102) and the second silicone conveyor belt (105) are connected together. All are in close contact with the sealing plate (203); the width of the first limiting plate (103) is greater than the width of the second limiting plate (106); two slots (10301) are provided on the first limiting plate (103), and the sealing plate (203) is inserted into the slots (10301) on the adjacent side; a number of suction holes (20301) are provided on the sealing plate (203), and the suction holes (20301) are located vertically between the first silicone conveyor belt (102) and the second silicone conveyor belt (105), and horizontally between the two second arc-shaped protrusions (10501). The interior of the sealing plate (203) is hollow, and the sealing plate (203) is connected to an external vacuum pump; a tensioning unit for keeping the second silicone conveyor belt (105) taut is connected to the second limiting plate (106).

3. The intelligent film-applying device for printed circuit board production according to claim 2, characterized in that: The tensioning unit includes two spring telescopic rods (204) fixed to the second limiting plate (106). The telescopic ends of the two spring telescopic rods (204) face the second connecting roller (104) which is not connected to the external motor, and the telescopic ends of the spring telescopic rods (204) are rotatably connected to the second connecting roller (104). The second connecting roller (104) which is not connected to the external motor is slidably disposed in the limiting groove (1001).

4. The intelligent film-applying device for printed circuit board production according to claim 1, characterized in that: It also includes a plurality of silicone strips (301) connected to the surface of the first silicone conveyor belt (102), and the spacing between two adjacent silicone strips (301) is greater than 3-4 mm of the standard length of the copper substrate; the thickness of the silicone strips (301) is equal to the thickness of the copper substrate.

5. The intelligent film-applying device for printed circuit board production according to claim 4, characterized in that: The silicone strip (301) is detachably connected to the first silicone conveyor belt (102), and the widths of the first silicone conveyor belt (102) and the second silicone conveyor belt (105) are both greater than the standard width of the largest copper substrate.

6. The intelligent film-applying device for printed circuit board production according to claim 1, characterized in that: It also includes a correction component, which includes a mounting base (401) fixed on the machine base (1) and the mounting base (401) is located to the right of the first silicone conveyor belt (102); a plurality of conveying rollers (402) are rotatably connected to the mounting base (401), the length of the conveying rollers (402) is greater than the width of the first silicone conveyor belt (102); two first electric push rods (403) are connected to the mounting base (401); a plurality of connecting seats (404) are fixed to the telescopic ends of the first electric push rods (403) through connecting plates; a correction rod (405) is connected to each connecting seat (404), each correction rod (405) is located between two adjacent conveying rollers (402), and the top of the correction rod (405) is higher than the top of the conveying roller (402).

7. A smart film-applying device for printed circuit board production according to claim 6, characterized in that: The straightening rod (405) is rotatably connected to the connecting seat (404).

8. A smart film-applying device for printed circuit board production according to claim 6, characterized in that: It also includes a detection and rejection assembly, which includes several visual inspection heads (501) fixed to the mounting base (401); a first mounting plate (502) is fixed to the machine base (1), the first mounting plate (502) is located directly above the mounting base (401), and several visual inspection heads (501) are also provided on the side of the first mounting plate (502) facing the mounting base (401); a rectangular groove (40101) is provided on the mounting base (401); a second mounting plate (504) is slidably connected to the rectangular groove (40101); the mounting base ( One of the first electric push rods (403) on 401) is fixedly connected to the second mounting plate (504), and the other first electric push rod (403) is fixedly connected to the mounting base (401); at least two second electric push rods (505) with their telescopic ends facing upward are fixedly connected in the rectangular groove (40101), and the telescopic ends of the second electric push rods (505) are fixedly connected to the second mounting plate (504); a feeding guide plate (503) is fixedly connected to the side of the machine base (1) near the rectangular groove (40101), and the top of the feeding guide plate (503) is lower than the top of the conveying roller (402).

9. A smart film-applying device for printed circuit board production according to claim 6, characterized in that: It also includes an annular groove (40201) opened on the end of the conveyor roller (402) facing the unloading guide plate (503); the top of the mounting base (401) near the unloading guide plate (503) is lower than the top of the conveyor roller (402); several annular clamps (601) are detachably connected to the top of the mounting base (401) near the unloading guide plate (503); the annular clamps (601) are engaged in the annular groove (40201) of the conveyor roller (402), and the outer diameter of the annular clamps (601) is the same as the outer diameter of the conveyor roller (402).

10. A smart film-applying device for printed circuit board production according to claim 1, characterized in that: It also includes a cooler (701) that is detachably connected to the side of the machine (1) away from the mounting base (401), and a first silicone conveyor belt (102) passes through the cooler (701).

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