Substrate processing system

Abstract

The invention provides a technology for improving the measurement accuracy of a sensor arranged on a conveying arm. A substrate processing system includes a substrate processing apparatus, a transport apparatus, and a control unit. A substrate processing apparatus includes a substrate processing chamber, a substrate support, and an edge ring having a first horizontal plane and a first inclined plane. The transport device includes a transport chamber, a transport arm, an optical sensor, a lens structure, and an actuator that moves the lens structure in a horizontal direction between a first horizontal position and a second horizontal position. The control unit determines the consumption amount of the first horizontal plane on the basis of the output of the optical sensor when the lens structure is at the first horizontal position, and determines the consumption amount of the first inclined plane on the basis of the output of the optical sensor when the lens structure is at the second horizontal position.

Description

Technical Field

[0001] The exemplary embodiments of the present invention relate to a substrate processing system. Background Technology

[0002] Patent Document 1 discloses the use of a sensor on a transport arm to determine the consumption amount of consumable parts. Patent Document 2 discloses the use of an optical sensor mounted on a transport arm to detect the presence of a substrate on the upper side of the optical sensor.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: U.S. Patent Application Publication No. 2017 / 53819.

[0006] Patent document 2: Japanese Patent Application Publication No. 2022-132087. Summary of the Invention

[0007] The problem the invention aims to solve

[0008] This invention provides a technique for improving the measurement accuracy of sensors mounted on a transport arm.

[0009] Technical means for solving problems

[0010] In one exemplary embodiment of the present invention, a substrate processing system is provided, comprising a substrate processing apparatus, a transport apparatus, and a control unit. The substrate processing apparatus includes: a substrate processing chamber; and a substrate support portion disposed within the substrate processing chamber, having a substrate support surface and a ring support surface; and an edge ring disposed on the ring support portion to surround a substrate on the substrate support surface, having a first horizontal surface and a first inclined surface. The transport apparatus includes: a transport chamber; a transport arm configured to transport a substrate between the transport chamber and the substrate processing chamber; an optical sensor mounted on the transport arm; and a lens structure disposed on the optical sensor. Below, there is a second horizontal plane and a second inclined plane; and an actuator mounted on the transport arm, configured to move the lens structure horizontally between a first horizontal position and a second horizontal position, wherein the first horizontal position is the position where the second horizontal plane overlaps with the optical axis of the optical sensor, and the second horizontal position is the position where the second inclined plane overlaps with the optical axis of the optical sensor. The control unit is configured to determine the consumption of the first horizontal plane based on the output of the optical sensor when the lens structure is in the first horizontal position, and to determine the consumption of the first inclined plane based on the output of the optical sensor when the lens structure is in the second horizontal position.

[0011] Invention Effects

[0012] According to an exemplary embodiment of the present invention, a technique for improving the measurement accuracy of a sensor disposed on a transport arm can be provided. Attached Figure Description

[0013] Figure 1 This is a diagram used to illustrate an example of the structure of a substrate processing system.

[0014] Figure 2 This is a diagram illustrating a structural example of a plasma processing system.

[0015] Figure 3 This is a diagram illustrating a structural example of a capacitively coupled plasma processing device.

[0016] Figure 4A This is a stereoscopic view representing an example of a transport arm (AR).

[0017] Figure 4B yes Figure 4A An enlarged view of the portion shown as P.

[0018] Figure 5A This is a diagram illustrating an example of an angle adjustment mechanism.

[0019] Figure 5B This is a diagram illustrating an example of an angle adjustment mechanism.

[0020] Figure 6 This is a perspective view showing an example of a lens structure.

[0021] Figure 7A This is a diagram used to illustrate the first horizontal position of the lens structure.

[0022] Figure 7B This is a diagram used to illustrate the second horizontal position of the lens structure.

[0023] Figure 8A This is a diagram illustrating an example of measurements using a transport arm AR.

[0024] Figure 8B This is a diagram illustrating an example of measurements using a transport arm AR.

[0025] Figure 9 This is another example of an angle adjustment mechanism.

[0026] Figure 10 This is a diagram showing another example of a lens structure. Detailed Implementation

[0027] Hereinafter, various embodiments of the present invention will be described.

[0028] In one exemplary embodiment, the substrate processing system includes a substrate processing apparatus, a transport apparatus, and a control unit. The substrate processing apparatus includes: a substrate processing chamber; a substrate support disposed within the substrate processing chamber, having a substrate support surface and a ring support surface; and an edge ring disposed on the ring support surface to surround a substrate on the substrate support surface, having a first horizontal surface and a first inclined surface. The transport apparatus includes: a transport chamber; a transport arm configured to transport a substrate between the transport chamber and the substrate processing chamber; an optical sensor mounted on the transport arm; and a lens structure disposed below the optical sensor, having a second... A horizontal plane and a second inclined plane; and an actuator mounted on a transport arm, configured to move the lens structure horizontally between a first horizontal position and a second horizontal position, wherein the first horizontal position is the position where the second horizontal plane overlaps with the optical axis of the optical sensor, and the second horizontal position is the position where the second inclined plane overlaps with the optical axis of the optical sensor; the control unit is configured to determine the consumption of the first horizontal plane based on the output of the optical sensor when the lens structure is in the first horizontal position, and to determine the consumption of the first inclined plane based on the output of the optical sensor when the lens structure is in the second horizontal position.

[0029] In one exemplary embodiment, the optical sensor is configured to measure a first distance from the optical sensor to the first horizontal plane via a second horizontal plane when the lens structure is in a first horizontal position, and the control unit is configured to determine the consumption of the first horizontal plane based on the first distance.

[0030] In one exemplary embodiment, the optical sensor is configured to measure a second distance from the optical sensor via the second inclined surface to the first inclined surface when the lens structure is in a second horizontal position, and the control unit is configured to determine the consumption of the first inclined surface based on the second distance.

[0031] In one exemplary embodiment, the optical sensor is configured to measure the distance from the optical sensor to the first inclined surface via the second inclined surface when the lens structure is in the second horizontal position, and the control unit is configured to determine the consumption of the first inclined surface based on the distance.

[0032] In one exemplary implementation, the actuator is a piezoelectric actuator.

[0033] In one exemplary embodiment, the substrate processing system includes a substrate processing apparatus, a transport apparatus, and a control unit. The substrate processing apparatus includes: a substrate processing chamber; and a consumable component that forms part of or is disposed within the substrate processing chamber, having a first horizontal plane and a first inclined plane. The transport apparatus includes: a transport chamber; a transport arm configured to transport a substrate between the transport chamber and the substrate processing chamber; an optical sensor mounted on the transport arm; a lens structure disposed above or below the optical sensor, having a second horizontal plane and a second inclined plane; and an actuator mounted on the transport arm configured to move the lens structure horizontally between a first horizontal position and a second horizontal position, wherein the first horizontal position is a position where the second horizontal plane overlaps with the optical axis of the optical sensor, and the second horizontal position is a position where the second inclined plane overlaps with the optical axis of the optical sensor. The control unit is configured to determine the state of the consumable component based on the output of the optical sensor.

[0034] In one exemplary embodiment, the optical sensor is configured to measure a first distance from the optical sensor to the first horizontal plane via a second horizontal plane when the lens structure is in a first horizontal position, and the control unit is configured to determine the consumption of the first horizontal plane based on the first distance.

[0035] In one exemplary embodiment, the optical sensor is configured to measure a second distance from the optical sensor via the second inclined surface to the first inclined surface when the lens structure is in a second horizontal position, and the control unit is configured to determine the consumption of the first inclined surface based on the second distance.

[0036] In one exemplary embodiment, the optical sensor is configured to measure the distance from the optical sensor to the first inclined surface via the second inclined surface when the lens structure is in the second horizontal position, and the control unit is configured to determine the consumption of the first inclined surface based on the distance.

[0037] In one exemplary embodiment, the optical sensor is configured to measure a first distance from the optical sensor to the first horizontal plane via a second horizontal plane when the lens structure is in a first horizontal position, and the control unit is configured to determine the position of the consumable component relative to a reference position based on the first distance.

[0038] In one exemplary embodiment, the optical sensor is configured to measure a second distance from the optical sensor via the second inclined surface to the first inclined surface when the lens structure is in the second horizontal position, and the control unit is configured to determine the position of the consumable component relative to the reference position based on the first distance and the second distance.

[0039] In one exemplary embodiment, the optical sensor is configured to measure the distance from the optical sensor to the first inclined surface via the second inclined surface when the lens structure is in the second horizontal position, and the control unit is configured to determine the position of the consumable component relative to the reference position based on the distance.

[0040] In one exemplary implementation, the actuator is a piezoelectric actuator.

[0041] In one exemplary embodiment, a substrate processing system is provided, comprising a substrate processing apparatus, a transport apparatus, and a control unit. The substrate processing apparatus includes: a substrate processing chamber; and a consumable component that forms part of or is disposed within the substrate processing chamber and has a first inclined surface. The transport apparatus includes: a transport arm configured to transport a substrate between a transport chamber and the substrate processing chamber; an optical sensor mounted on the transport arm; and a lens structure disposed above or below the optical sensor and having a second inclined surface. The control unit is configured to determine the state of the consumable component based on the output of the sensor.

[0042] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in each drawing, the same or identical elements are labeled with the same reference numerals, and repeated descriptions are omitted. Unless otherwise specified, positional relationships such as up, down, left, and right are described based on the positional relationships shown in the drawings. The scale of the drawings does not represent actual scales, and actual scales are not limited to those shown in the drawings.

[0043] <Structure Example of a Substrate Processing System>

[0044] Reference Figure 1 A substrate processing system (hereinafter also referred to as "substrate processing system PS") according to one embodiment will be described. Figure 1 This is a diagram illustrating the structure of a substrate processing system (PS).

[0045] The substrate processing system PS includes vacuum transport modules TM1 and TM2, processing modules PM1 to PM12, loading interlock modules LL1 and LL2, atmospheric transport module LM, alignment unit AN, storage unit SR, etc.

[0046] Vacuum transport modules TM1 and TM2, when viewed from above, are approximately quadrilateral in shape. Processing modules PM1 to PM6 are connected to two opposite sides of vacuum transport module TM1. Loading interlocking modules LL1 and LL2 are connected to one of the other two opposite sides of vacuum transport module TM1, and a path (not shown) for connection to vacuum transport module TM2 is connected to the other side. The side of vacuum transport module TM1 connected to loading interlocking modules LL1 and LL2 is angled depending on the two loading interlocking modules LL1 and LL2. Processing modules PM7 to PM12 are connected to two opposite sides of vacuum transport module TM2. A passage (not shown) for connection to vacuum transport module TM1 is connected to one of the other two opposite sides of vacuum transport module TM2. Vacuum transport modules TM1 and TM2 have vacuum chambers with a vacuum atmosphere, and vacuum transport robots TR1 and TR2 are respectively configured inside. The vacuum chambers of vacuum transport modules TM1 and TM2 are examples of transport chambers.

[0047] Vacuum transport robots TR1 and TR2 are configured to rotate, extend, and lift. Based on motion instructions output from the control unit CU (described later), TR1 and TR2 transport objects. For example, TR1 uses forks FK11 and FK12 at its front end to hold the object and transports it between loading interlock modules LL1 and LL2, processing modules PM1-PM6, and a path (not shown). Similarly, TR2 uses forks FK21 and FK22 at its front end to hold the object and transport it between processing modules PM7-PM12 and a path (not shown). These forks are also referred to as pickers or end effectors.

[0048] The transported items include substrates and consumable components. Substrates may be, for example, semiconductor wafers or sensor wafers. Consumable components are components that are replaceably installed within processing modules PM1 to PM12 and are consumed through various processes, such as plasma processing, performed within processing modules PM1 to PM12. Consumable components may include, for example, components constituting the ring assembly 112 and the spray head 13, described later.

[0049] Processing modules PM1-PM12 each have a processing chamber and a worktable (workbench) disposed within it. The processing chamber of processing modules PM1-PM12 is an example of a substrate processing chamber. At least one of processing modules PM-PM12 can be a plasma processing system described later (see reference). Figure 2For example, at least one of the processing modules PM1 to PM12 can depressurize its internal pressure and introduce processing gas after the substrate is placed on the worktable, apply RF power to generate plasma, and use the plasma to perform plasma processing on the substrate. The vacuum transport modules TM1 and TM2 and the processing modules PM1 to PM12 are separated by an openable and closable gate valve G1.

[0050] Loading interlock modules LL1 and LL2 are configured between the vacuum transport module TM1 and the atmospheric transport module LM. Loading interlock modules LL1 and LL2 have variable internal pressure chambers capable of switching between vacuum and atmospheric pressure. Loading interlock modules LL1 and LL2 also have internal worktables. When feeding a substrate from the atmospheric transport module LM into the vacuum transport module TM1, loading interlock modules LL1 and LL2 maintain the internal pressure at atmospheric pressure, receive the substrate from the atmospheric transport module LM, depressurize the internal pressure, and feed the substrate into the vacuum transport module TM1. When feeding a substrate from the vacuum transport module TM1 to the atmospheric transport module LM, loading interlock modules LL1 and LL2 maintain the internal pressure at vacuum, receive the substrate from the vacuum transport module TM1, pressurize the internal pressure to atmospheric pressure, and feed the substrate into the atmospheric transport module LM. Loading interlock modules LL1 and LL2 are separated from the vacuum transport module TM1 by an openable / closable gate valve G2. Loading interlock modules LL1 and LL2 are separated from the atmospheric transport module LM by an openable / closable gate valve G3.

[0051] The atmospheric transport module LM is configured opposite to the vacuum transport module TM1. The atmospheric transport module LM can be, for example, an EFEM (Equipment Front End Module). The atmospheric transport module LM is cuboid in shape and has an FFU (Fan Filter Unit), which is an atmospheric transport chamber maintained at atmospheric pressure. Two loading interlocking modules LL1 and LL2 are connected to one side of the atmospheric transport module LM along its long side. Loading ports LP1 to LP4 are connected to the other side of the atmospheric transport module LM along its long side. Containers C for holding multiple (e.g., 25) substrates are placed in loading ports LP1 to LP4. Container C can be, for example, a FOUP (Front-Opening Unified Pod). An atmospheric transport robot TR3 is configured within the atmospheric transport module LM to transport the objects.

[0052] The atmospheric transport robot TR3 can move along the long side of the atmospheric transport module LM and is capable of rotation, extension, retraction, and lifting. The atmospheric transport robot TR3 transports the object based on motion instructions output by the control unit CU (described later). For example, the atmospheric transport robot TR3 uses the fork FK31 located at the front end to hold the object and transports it between loading ports LP1~LP4, loading interlock modules LL1, LL2, the aligner AN, and the storage unit SR.

[0053] The aligner AN is connected to one side of the atmospheric transport module LM along its short side. However, the aligner AN can also be connected to one side of the atmospheric transport module LM along its long side. Alternatively, the aligner AN can be located inside the atmospheric transport module LM. The aligner AN includes a support platform, optical sensors (neither shown), etc. The aligner described here is a device for detecting the position of the transported object.

[0054] The support platform is a platform capable of rotating about a vertically extending axis, on which the substrate is supported. The support platform is rotated by a drive device (not shown). The drive device is controlled by a control unit CU, described later. When the support platform rotates due to power from the drive device, the substrate mounted on the support platform also rotates.

[0055] An optical sensor detects the edge of the substrate during its rotation. Based on the edge detection, the optical sensor detects the offset of the angular position of the notch (or other marking) of the substrate relative to a reference angular position and the offset of the center position of the substrate relative to the reference position. The optical sensor outputs the offset of the angular position of the notch and the offset of the center position of the substrate to the control unit CU (described later). Based on the offset of the angular position of the notch, the control unit CU calculates the rotation amount of the rotating support stage used to correct the angular position of the notch to the reference angular position. The control unit CU controls the drive device (not shown) to rotate the rotating support stage by this rotation amount. Thus, the angular position of the notch can be corrected to the reference angular position. In addition, based on the offset of the center position of the substrate, the control unit CU controls the position of the fork FK31 of the atmospheric transport robot TR3 when receiving the substrate from the aligner AN, so that the center position of the substrate is aligned with a predetermined position on the fork FK31 of the atmospheric transport robot TR3.

[0056] The storage unit SR is connected to the side of the atmospheric transport module LM along its long side. However, the storage unit SR can also be connected to the side of the atmospheric transport module LM along its short side. Alternatively, the storage unit SR can be located inside the atmospheric transport module LM. The storage unit SR stores the transported object.

[0057] The substrate processing system (PS) is connected to the control unit (CU) via a communication interface. In one embodiment, part or all of the control unit (CU) may be included in the substrate processing system (PS). The control unit (CU) may be, for example, a computer. The control unit (CU) includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), auxiliary storage devices, etc. The CPU performs actions based on programs stored in the ROM or auxiliary storage devices, controlling various parts of the substrate processing system (PS). For example, the control unit (CU) outputs action instructions to vacuum transport robots TR1, TR2, atmospheric transport robot TR3, etc. The action instructions include alignment instructions between the forks FK11, FK12, FK21, FK22, and FK31 used to transport the object and the transport location of the object.

[0058] <Structural Example of a Plasma Processing System>

[0059] Reference Figure 2 An example of a plasma processing system that can be used as at least one of the processing modules PM1 to PM12 will be described. Figure 2 This is a diagram illustrating an example of the structure of a plasma processing system. In one embodiment, the plasma processing system includes a plasma processing device 1 and a control unit 2.

[0060] In one embodiment, the plasma processing apparatus 1 includes a plasma processing chamber 10, a substrate support 11, and a plasma generation unit 12. The plasma processing chamber 10 has a plasma processing space. Furthermore, the plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space and at least one gas outlet for discharging gas from the plasma processing space. The gas supply port is connected to the gas supply unit 20 (described later), and the gas outlet is connected to the exhaust system 40 (described later). The substrate support 11 is disposed within the plasma processing space and has a substrate support surface for supporting a substrate.

[0061] The plasma generation unit 12 is configured to generate plasma from at least one process gas supplied to the plasma processing space. The plasma formed in the plasma processing space can be capacitively coupled plasma (CCP), inductively coupled plasma (ICP), electron-cyclotron-resonance plasma (ECR), helicon wave plasma (HWP), or surface wave plasma (SWP), etc. Alternatively, various types of plasma generation units, including AC (Alternating Current) plasma generation units and DC (Direct Current) plasma generation units, can be used. In one embodiment, the AC signal (AC power) used in the AC plasma generation unit has a frequency in the range of 100 kHz to 10 GHz. Therefore, the AC signal includes RF (radio frequency) signals and microwave signals. In one embodiment, the RF signal has a frequency in the range of 100 kHz to 150 MHz.

[0062] The control unit 2 processes computer-executable commands that cause the plasma processing apparatus 1 to perform the various steps described herein. The control unit 2 is capable of controlling various elements of the plasma processing apparatus 1 to perform the various steps described herein. In one embodiment, part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 is implemented, for example, by a computer 2a. The processing unit 2a1 is configured to perform various control operations by reading a program from the storage unit 2a2 and executing the read program. The program may be pre-stored in the storage unit 2a2 or retrieved via a medium when needed. The retrieved program is stored in the storage unit 2a2 and read and executed by the processing unit 2a1 from the storage unit 2a2. The medium may be various storage media readable by the computer 2a, or a communication line connected to the communication interface 2a3. The processing unit 2a1 is a central processing unit (CPU). The storage unit 2a2 may include random access memory (RAM), read-only memory (ROM), hard disk drive (HDD), solid-state drive (SSD), or a combination thereof. The communication interface 2a3 may also communicate with the plasma processing device 1 via a communication line such as a LAN (Local Area Network). Furthermore, Figure 1 The control unit CU can also perform some or all of the functions of the control unit 2.

[0063] Reference Figure 3 Hereinafter, a structural example of a capacitively coupled plasma processing device, which is one example of plasma processing device 1, will be described. Figure 3 This is a diagram illustrating a structural example of a capacitively coupled plasma processing device.

[0064] The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. Additionally, the plasma processing apparatus 1 includes a substrate support 11 and a gas inlet. The gas inlet is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas inlet includes a spray head 13. The substrate support 11 is disposed within the plasma processing chamber 10. The spray head 13 is disposed above the substrate support 11. In one embodiment, the spray head 13 constitutes at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the spray head 13, the sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 is grounded. The spray head 13 and the substrate support 11 are electrically insulated from the housing of the plasma processing chamber 10.

[0065] The substrate support portion 11 includes a main body portion 111 and a ring assembly 112. The main body portion 111 has a central region 111a for supporting a substrate W and an annular region 111b for supporting the ring assembly 112. A wafer is an example of a substrate W. The annular region 111b of the main body portion 111 surrounds the central region 111a of the main body portion 111 when viewed from above. The substrate W is disposed on the central region 111a of the main body portion 111, and the ring assembly 112 is disposed on the annular region 111b of the main body portion 111 in such a way that it surrounds the substrate W on the central region 111a of the main body portion 111. Therefore, the central region 111a is also referred to as a substrate support surface for supporting the substrate W, and the annular region 111b is also referred to as an annular support surface for supporting the ring assembly 112.

[0066] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive component. The conductive component of the base 1110 can function as a lower electrode. The electrostatic chuck 1111 is disposed on the base 1110. The electrostatic chuck 1111 includes a ceramic component 1111a and an electrostatic electrode 1111b disposed within the ceramic component 1111a. The ceramic component 1111a has a central region 111a. In one embodiment, the ceramic component 1111a also has an annular region 111b. Furthermore, other components surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating component, may also have an annular region 111b. In this case, the ring assembly 112 may be disposed on either the annular electrostatic chuck or the annular insulating component, or on both the electrostatic chuck 1111 and the annular insulating component. Additionally, at least one RF / DC electrode coupled to the RF power supply 31 and / or DC power supply 32 (described later) may also be disposed within the ceramic component 1111a. In this case, at least one RF / DC electrode serves as a lower electrode. When a bias RF signal and / or DC signal (described later) are supplied to at least one RF / DC electrode, the RF / DC electrode is also referred to as a bias electrode. Furthermore, the conductive components of the base 1110 and at least one RF / DC electrode may also function as multiple lower electrodes. Additionally, the electrostatic electrode 1111b may also function as a lower electrode. Therefore, the substrate support portion 11 includes at least one lower electrode.

[0067] The ring assembly 112 includes one or more annular components. In one embodiment, the one or more annular components include one or more edge rings and at least one cover ring. The edge rings are formed of a conductive or insulating material, and the cover rings are formed of an insulating material.

[0068] Additionally, the substrate support 11 may also include a temperature control module configured to adjust at least one of the electrostatic chuck 1111, the ring assembly 112, and the substrate to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path 1110a, or a combination thereof. A heat transfer fluid such as brine or gas flows in the flow path 1110a. In one embodiment, the flow path 1110a is formed within the base 1110, and one or more heaters are disposed within the ceramic component 1111a of the electrostatic chuck 1111. Furthermore, the substrate support 11 may also include a heat transfer gas supply section configured to supply heat transfer gas to the gap between the back surface of the substrate W and the central region 111a.

[0069] The spray head 13 is configured to introduce at least one process gas from the gas supply unit 20 into the plasma processing space 10s. The spray head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and a plurality of gas inlets 13c. The process gas supplied to the gas supply port 13a is introduced into the plasma processing space 10s through the gas diffusion chamber 13b and the plurality of gas inlets 13c. Additionally, the spray head 13 includes at least one upper electrode. Furthermore, in addition to the spray head 13, the gas inlet unit may also include one or more side gas injectors (SGIs) mounted on one or more openings formed in the sidewall 10a.

[0070] The gas supply unit 20 may also include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one type of process gas from a corresponding gas source 21 to the spray head 13 via a corresponding flow controller 22. Each flow controller 22 may, for example, include a mass flow controller or a pressure-controlled flow controller. Furthermore, the gas supply unit 20 may also include at least one flow modulation device for modulating or pulsed the flow rate of the at least one type of process gas.

[0071] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is configured to supply at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. This causes at least one processing gas supplied to the plasma processing space 10s to form plasma. Therefore, the RF power supply 31 can function as at least a part of the plasma generation unit 12. Furthermore, by supplying a bias RF signal to at least one lower electrode, a bias potential can be generated on the substrate W, introducing ionic components from the formed plasma into the substrate W.

[0072] In one embodiment, the RF power supply 31 includes a first RF generation unit 31a and a second RF generation unit 31b. The first RF generation unit 31a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit, and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 10MHz to 150MHz. In one embodiment, the first RF generation unit 31a may also be configured to generate multiple source RF signals with different frequencies. The generated one or more source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0073] The second RF generation unit 31b is coupled to at least one lower electrode via at least one impedance matching circuit, and is configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than that of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generation unit 31b may also be configured to generate multiple bias RF signals with different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. In addition, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0074] Alternatively, the power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generating unit 32a and a second DC generating unit 32b. In one embodiment, the first DC generating unit 32a is connected to at least one lower electrode and is configured to generate a first DC signal. The generated first DC signal is applied to at least one lower electrode. In one embodiment, the second DC generating unit 32b is connected to at least one upper electrode and is configured to generate a second DC signal. The generated second DC signal is applied to at least one upper electrode.

[0075] In various embodiments, the first and second DC signals can also be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulses can have rectangular, trapezoidal, triangular, or combinations thereof pulse waveforms. In one embodiment, a waveform generation unit for generating a sequence of voltage pulses based on the DC signals is connected between the first DC generation unit 32a and at least one lower electrode. Therefore, the first DC generation unit 32a and the waveform generation unit constitute a voltage pulse generation unit. When the second DC generation unit 32b and the waveform generation unit constitute a voltage pulse generation unit, the voltage pulse generation unit is connected to at least one upper electrode. The voltage pulses can have positive or negative polarity. Additionally, the sequence of voltage pulses can also include one or more positive voltage pulses and one or more negative voltage pulses within one cycle. Furthermore, the first and second DC generation units 32a and 32b can also be provided based on the RF power supply 31, and the first DC generation unit 32a can also be provided instead of the second RF generation unit 31b.

[0076] The exhaust system 40 can be connected, for example, to a gas outlet 10e located at the bottom of the plasma processing chamber 10. The exhaust system 40 may also include a pressure regulating valve and a vacuum pump. The pressure regulating valve is used to regulate the pressure within the plasma processing space 10s. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0077] <Example of a conveyor arm structure>

[0078] Reference Figure 4A and Figure 4B The following describes a delivery arm (hereinafter also referred to as "delivery arm AR") of one embodiment. Figure 4A This is a stereoscopic view representing an example of a transport arm (AR). Figure 4B yes Figure 4A An enlarged view of the portion shown as P.

[0079] The transport arm AR is configured to transport objects such as substrates and consumable components between a transport chamber and a substrate processing chamber. In one embodiment, the transport arm AR serves as... Figure 1 The substrate processing system shown uses forks FK11, FK12, FK21, FK22, or FK31. In one embodiment, the transport arm AR is... Figure 1 The vacuum chambers of the vacuum transport modules TM1 and TM2 and the processing chambers of the processing modules PM1 to PM12 shown (including...) Figure 2 , Figure 3 The object is transported between the plasma processing chambers 10 shown.

[0080] In one implementation, such as Figure 4A As shown, the transport arm AR has a proximal end 50 and a distal end 52. The transport arm AR can be coupled to a transport device (e.g., at the proximal end 50). Figure 1 The drive mechanism is connected to the vacuum transport robots TR1, TR2, and atmospheric transport robots TR3, etc. In one embodiment, the transport arm AR can use the drive mechanism to perform one or more of the following actions: translation (horizontal movement in the XY plane), lifting (vertical movement in the Z-axis direction), and rotation (rotation about the X, Y, and Z axes).

[0081] In one embodiment, the object to be transported is placed on the distal end 52 of the transport arm AR. The distal end 52 is configured in a generally U-shape and may have two mutually separated ends 52A and 52B. In one embodiment, a plurality of pads PD are provided on the surface of the distal end 52. The plurality of pads PD contact the lower surface of the object to be transported (e.g., a substrate) to hold the object to be transported. In one embodiment, one or more suction holes may be provided on the distal end 52. The suction holes may be connected to an exhaust device such as a vacuum pump. In this case, the object to be transported is vacuum-adsorbed onto the transport arm AR via the suction holes.

[0082] The delivery arm AR includes one or more optical sensors 54. In one embodiment, such as Figure 4A and Figure 4B As shown, the optical sensor 54 is disposed along the side (XZ plane) of the distal end 52 (ends 52A, 52B).

[0083] In one embodiment, the optical sensor 54 is a distance sensor. For example, the optical sensor 54 may be configured to illuminate a measurement object and measure the distance to the measurement object. In one example, the optical sensor 54 is a confocal color sensor. The confocal color sensor measures the distance to the measurement object based on the wavelength of the light focused and reflected on the measurement object. In one embodiment, the optical sensor 54 is a light intensity sensor. For example, the optical sensor 54 may be configured to illuminate a measurement object and measure the intensity of the light reflected from the measurement object. In one embodiment, the optical sensor 54 has the functions of both a distance sensor and a light intensity sensor.

[0084] Generally speaking, to maintain the measurement accuracy of an optical sensor, the light emitted from the optical sensor needs to be incident on the surface of the object being measured within a specified angle range (hereinafter, this range will also be referred to as the "measurable range"). The measurable range varies depending on the type and size of the optical sensor, but in the case of small optical sensors that can be mounted on a transport arm, there is a tendency for the measurable range to be narrow. Therefore, depending on the surface shape and placement of the object being measured, the measurable range of the optical sensor may be exceeded. As a result, the measurement accuracy of the optical sensor decreases or the measurement itself becomes difficult. On the other hand, adjusting the orientation and position of the transport arm according to the surface shape and placement of the object being measured requires complex control or additional structures, and it is also necessary to avoid collisions with other structures, which is not easy.

[0085] Regarding this, as explained below, one embodiment of the transport arm AR also includes a mechanism for adjusting the angle of light emitted from the optical sensor 54 (hereinafter also referred to as the "angle adjustment mechanism"). This suppresses any reduction in the measurement accuracy of the optical sensor 54. In one embodiment, the measurable range of the optical sensor 54 can be 90°±5°, 90°±3°, 90°±1.5°, or 90°±1.0°. For example, when using a confocal color sensor as the optical sensor 54, the measurable range is, for example, 90°±1.5°.

[0086] <Example of the structure of an angle adjustment mechanism>

[0087] Reference Figures 5A to 7B The structure of the angle adjustment mechanism will be explained here. Figure 5A and Figure 5B This is a diagram illustrating an example of an angle adjustment mechanism. Figure 5A Viewed from the Y1 direction Figure 4B A schematic diagram of the end 52A of the transport arm AR. Figure 5B Viewed from the X1 direction Figure 4B A schematic diagram of the end 52A of the transport arm AR. Figure 6 This is a three-dimensional diagram showing an example of a lens structure. Figure 7A This is a diagram used to illustrate the first horizontal position of the lens structure. Figure 7B This diagram illustrates the second horizontal position of the lens structure. Additionally, the same angle adjustment mechanism as end 52A can be provided at end 52B of the transport arm AR.

[0088] like Figure 5A and Figure 5B As shown, the angle adjustment mechanism includes a lens structure 56 and an actuator 58. In one embodiment, the lens structure 56 is disposed below the optical sensor 54 in the vertical direction (z-axis direction). The lens structure 56 is positioned to overlap with the optical sensor 54 when viewed from above. In one embodiment, as... Figure 5A and Figure 5B As shown, the optical sensor 54 may have an optical head 540 that emits measurement light downwards. In this case, the lens structure 56 may be disposed below the optical head 540.

[0089] The lens structure 56 includes a horizontal surface 560 and an inclined surface 562 at an angle relative to the horizontal surface 560. The horizontal surface 560 and the inclined surface 562 are examples of a second horizontal surface and a second inclined surface, respectively. The lens structure 56 can have various shapes when viewed from above, such as rectangular, polygonal, circular, elliptical, etc. In one example, the lens structure 56 is rectangular when viewed from above. In one embodiment, the lens structure 56 can be made of a material with a specified refractive index, such as optical glass or acrylic glass.

[0090] The lens structure 56 is mounted on the optical sensor 54 in a manner that allows it to move parallel to the optical sensor 54. In one embodiment, such as Figure 5B As shown, one or more tracks 542 extending along the long side direction (x-axis direction) can be provided on the lower surface of the optical sensor 54. Furthermore, one or more grooves 564 extending along the long side direction (x-axis direction) can be provided on the upper surface of the lens structure 56 (see [reference]). Figure 5B and Figure 6 The slot 564 of the lens structure 56 can be fitted into the track 542 on the lower surface of the optical sensor 54, and the lens structure 56 can be movably mounted along the track 542 in the long side direction (x-axis direction).

[0091] The lens structure 56 can be mounted to the optical sensor 54 in various ways. For example, the slot and guide rail described above may not be provided in the long side direction (x-axis direction), but in the short side direction (y-axis direction). In this case, the lens structure 56 is configured to be movable along the track 542 in the short side direction (y-axis direction). Alternatively, for example, the slot and guide rail described above may be arranged in a cross shape along both the long and short sides. In this case, the lens structure 56 is configured to be movable along the cross-shaped track of the optical sensor 54 in both the long and short sides. Alternatively, for example, the slot may be provided in the optical sensor 54, and the track may be provided in the lens structure 56. Furthermore, for example, the lens structure 56 may be mounted to the optical sensor 54 via other components that can move parallel to the optical sensor 54.

[0092] In one embodiment, actuator 58 is disposed below optical sensor 54. Actuator 58 provides the driving force required to move lens structure 56 by converting electrical energy supplied via wiring 580 into mechanical motion. Actuator 58 is configured such that its driving direction coincides with the direction of movement of lens structure 56 (e.g., the x-axis direction). Multiple actuators 58 may be provided when lens structure 56 moves in multiple directions (e.g., the x-axis and y-axis directions).

[0093] In one embodiment, the actuator 58 may be a piezoelectric actuator. In this case, the actuator 58 is mounted on the lens structure 56 such that the extension and contraction direction of the piezoelectric element coincides with the movement direction (e.g., the x-axis direction) of the lens structure 56.

[0094] Driven by actuator 58 (e.g., extension or retraction of a piezoelectric actuator), lens structure 56 can move below optical sensor 54 at least between a first horizontal position and a second horizontal position. Figure 7A As shown, the first horizontal position is the position where the horizontal plane 560 of the lens structure 56 overlaps with the optical axis A1 of the optical sensor 54 (in Figure 7A In the diagram, optical axis A1 is the direction of light travel after it is emitted from the optical head 540 of the optical sensor 54. (For example...) Figure 7B As shown, the second horizontal position is the position where the inclined surface 562 of the lens structure 56 overlaps with the optical axis A1 of the optical sensor 54.

[0095] <An example of measurement using a conveyor arm>

[0096] Reference Figure 8A and Figure 8B This is an example illustrating a measurement performed using a transport arm (AR). Figure 8A and Figure 8BThis diagram illustrates an example of a measurement performed using a transport arm AR. Here, the measurement is performed using the optical sensor 54 of the transport arm AR. Figure 3 The following description will use a component P of the plasma processing apparatus 1 as an example. In one embodiment, component P may be a consumable component such as ring assembly 112. In one embodiment, the measurement of component P may be the measurement of the distance from optical sensor 54 to component P.

[0097] In one embodiment, the transport arm AR is introduced into the plasma processing chamber 10 (hereinafter also referred to as "chamber 10") of the plasma processing apparatus 1. The transport arm AR then moves within the chamber 10 in a horizontal direction (parallel to the XY plane).

[0098] Figure 8A This is an example of measuring the horizontal plane PA of component P. Horizontal plane PA is an example of the first horizontal plane. When measuring horizontal plane PA, as follows... Figure 8A As shown, the lens structure 56 is positioned in a first horizontal position via an actuator 58. Light L1 emitted from the optical head 540 of the optical sensor 54 travels in a straight line through the horizontal surface 560 of the lens structure 56. Thus, light L1 is incident at an angle θ1 relative to the horizontal surface PA of component P. The angle θ1 is approximately 90°, and in one example is 90°±5°, 90°±3°, 90°±1.5°, or 90°±1.0°. In one embodiment, the optical sensor 54 uses light L1 to detect the distance from the optical sensor 54 to the horizontal surface PA (hereinafter also referred to as the "first distance") and outputs it to the control unit 2.

[0099] Figure 8B This is an example of measuring the inclined surface PB of component P. The inclined surface PB is a surface that has an angle relative to the horizontal plane PA. The inclined surface PB is an example of a first inclined surface. When measuring the inclined surface PB, as... Figure 8B As shown, the lens structure 56 is positioned in a second horizontal position via an actuator 58. Light L2 emitted from the optical head 540 of the optical sensor 54 is refracted by the inclined surface 562 of the lens structure 560. Thus, light L2 is incident on the inclined surface PB of the ring assembly at an angle θ2. The angle θ2 is approximately 90°, and in one example is 90°±5°, 90°±3°, 90°±1.5°, or 90°±1.0°. In one embodiment, the optical sensor 54 uses light L2 to detect the distance from the optical sensor 54 to the inclined surface PB (hereinafter also referred to as the "second distance") and outputs it to the control unit 2.

[0100] In one embodiment, the control unit 2 can determine the state of component P based on the output from the optical sensor 54. The state of component P can be the amount of consumption of component P, or it can be the position (position offset) of component P relative to a reference position.

[0101] In one embodiment, the control unit 2 can determine the consumption of component P based on the output from the optical sensor 54. For example, a first distance can be measured and stored at the moment component P is initially placed in the chamber 10, and the consumption of component P can be determined by comparing it with the first distance measured again after a predetermined time. Alternatively, for example, instead of comparing the first distance or based on the comparison of the first distance, a second distance can be measured and stored at the moment component P is placed in the chamber 10, and compared with the second distance measured again after a predetermined time, thereby determining the consumption of component P.

[0102] In one embodiment, the control unit 2 can determine the position of the component P relative to a reference position (including position offset from the reference position) based on the output from the optical sensor 54. For example, when the component P is placed in the chamber 10, a first distance and / or a second distance can be measured, and the position and / or position offset of the component P relative to the reference position can be determined based on the measurement results.

[0103] In one embodiment, the transport arm AR has an angle adjustment mechanism, so that light irradiated from the optical sensor 54 is incident on the inclined plane PB at an angle within the measurable range (e.g., about 90°) in the same manner as on the horizontal plane PA. This suppresses the reduction in measurement accuracy of the optical sensor 54 on the inclined plane PB. In another embodiment, the transport arm AR has an angle adjustment mechanism that allows light refracted from the optical sensor 54. This allows light to be irradiated onto the component P located further away from the transport arm AR. That is, the measurement area of ​​the optical sensor 54 can be expanded.

[0104] <Variation Example>

[0105] Figure 9 This diagram illustrates another example of an angle adjustment mechanism. In one embodiment, the angle adjustment mechanism may be positioned above the optical sensor. Figure 9 In the example shown, the optical sensor 54 includes an exposure head 540A that emits light upward in the vertical direction (z-axis direction). A lens structure 56 is disposed above the exposure head 540A. An actuator 58 is disposed above the optical sensor 54. Thus, the optical sensor 54 is able to measure a component P located above the transport arm AR. Component P can be, for example, the spray head 13 of the plasma processing apparatus 1.

[0106] exist Figure 9 In the example shown, the upper surface (position in the z-axis direction) of the lens structure 56 is located lower than the upper surface of the pad PD. Therefore, when the transport object (e.g., substrate W) is placed on the pad PD, contact between the lens structure 56 and the transport object can be suppressed.

[0107] Figure 10 This diagram illustrates another example of a lens structure. In one embodiment, the lens structure may include tilted surfaces at multiple angles. Figure 10 In the example shown, the lens structure 56A includes a horizontal plane 560A and three inclined planes 562A to 562C with different angles relative to the horizontal plane 560A. Figure 5A and Figure 9 Similarly, in the example shown, the lens structure 56A can be movably configured below (above) the optical sensor 54 (54A). In this case, the lens structure 56A can be configured to move between at least a first horizontal position, a second horizontal position, a third horizontal position, and a fourth horizontal position below (above) the optical sensor 54 (54A). The first horizontal position is the position where the horizontal plane 560A of the lens structure 56A overlaps with the optical axis of the optical sensor 54 (54A). The second to fourth horizontal positions are the positions where the inclined surfaces 562A to 562C of the lens structure 56A overlap with the optical axis of the optical sensor 54 (54A), respectively. According to this structure, the angle of the light emitted from the optical sensor 54 (54A) can be adjusted more precisely, thereby further improving the measurement accuracy.

[0108] Embodiments of the present invention also include the following methods.

[0109] (Note 1)

[0110] A substrate processing system includes a substrate processing apparatus, a transport apparatus, and a control unit, wherein...

[0111] The substrate processing apparatus includes:

[0112] Substrate processing chamber;

[0113] A substrate support portion, disposed within the substrate processing chamber, has a substrate support surface and a ring support surface; and

[0114] An edge ring, disposed on the ring support portion in such a manner as to surround the substrate on the substrate support surface, has a first horizontal surface and a first inclined surface.

[0115] The conveying device includes:

[0116] Transport chamber;

[0117] A transport arm configured to transport a substrate between the transport chamber and the substrate processing chamber;

[0118] Optical sensors mounted on the transport arm;

[0119] A lens structure, disposed below the optical sensor, has a second horizontal plane and a second inclined plane; and

[0120] An actuator, mounted on the transport arm, is configured to move the lens structure horizontally between a first horizontal position and a second horizontal position, wherein the first horizontal position is the position where the second horizontal plane overlaps with the optical axis of the optical sensor, and the second horizontal position is the position where the second inclined plane overlaps with the optical axis of the optical sensor.

[0121] The control unit is configured to determine the consumption of the first horizontal surface based on the output of the optical sensor when the lens structure is in the first horizontal position, and to determine the consumption of the first tilted surface based on the output of the optical sensor when the lens structure is in the second horizontal position.

[0122] (Note 2)

[0123] As described in Appendix 1, in the substrate processing system, wherein...

[0124] The optical sensor is configured to measure a first distance from the optical sensor, via the second horizontal plane, to the first horizontal plane when the lens structure is in the first horizontal position.

[0125] The control unit is configured to determine the consumption of the first horizontal plane based on the first distance.

[0126] (Note 3)

[0127] As described in Appendix 2, in the substrate processing system, wherein...

[0128] The optical sensor is configured to measure a second distance from the optical sensor, via the second inclined surface, to the first inclined surface when the lens structure is in the second horizontal position.

[0129] The control unit is configured to determine the consumption of the first inclined surface based on the second distance.

[0130] (Note 4)

[0131] As described in Appendix 1, in the substrate processing system, wherein...

[0132] The optical sensor is configured to measure the distance from the optical sensor, via the second inclined surface, to the first inclined surface when the lens structure is in the second horizontal position.

[0133] The control unit is configured to determine the consumption of the first inclined surface based on the distance.

[0134] (Note 5)

[0135] The substrate processing system as described in any one of Annexes 1 to 4, wherein the actuator is a piezoelectric actuator.

[0136] (Note 6)

[0137] A substrate processing system includes a substrate processing apparatus, a transport apparatus, and a control unit, wherein...

[0138] The substrate processing apparatus includes:

[0139] Substrate processing chamber; and

[0140] A consumable component, which forms part of or is disposed within the substrate processing chamber, has a first horizontal surface and a first inclined surface.

[0141] The conveying device includes:

[0142] Transport chamber;

[0143] A transport arm configured to transport a substrate between the transport chamber and the substrate processing chamber;

[0144] Optical sensors mounted on the transport arm;

[0145] A lens structure, disposed above or below the optical sensor, has a second horizontal plane and a second inclined plane; and

[0146] An actuator, mounted on the transport arm, is configured to move the lens structure horizontally between a first horizontal position and a second horizontal position, wherein the first horizontal position is the position where the second horizontal plane overlaps with the optical axis of the optical sensor, and the second horizontal position is the position where the second inclined plane overlaps with the optical axis of the optical sensor.

[0147] The control unit is configured to determine the state of the consumable component based on the output of the optical sensor.

[0148] (Note 7)

[0149] The substrate processing system as described in Appendix 6, wherein...

[0150] The optical sensor is configured to measure a first distance from the optical sensor, via the second horizontal plane, to the first horizontal plane when the lens structure is in the first horizontal position.

[0151] The control unit is configured to determine the consumption of the first horizontal plane based on the first distance.

[0152] (Note 8)

[0153] The substrate processing system as described in Appendix 7, wherein...

[0154] The optical sensor is configured to measure a second distance from the optical sensor, via the second inclined surface, to the first inclined surface when the lens structure is in the second horizontal position.

[0155] The control unit is configured to determine the consumption of the first inclined surface based on the second distance.

[0156] (Note 9)

[0157] The substrate processing system as described in Appendix 6, wherein...

[0158] The optical sensor is configured to measure the distance from the optical sensor, via the second inclined surface, to the first inclined surface when the lens structure is in the second horizontal position.

[0159] The control unit is configured to determine the consumption of the first inclined surface based on the distance.

[0160] (Postscript 10)

[0161] The substrate processing system as described in Appendix 6, wherein...

[0162] The optical sensor is configured to measure a first distance from the optical sensor, via the second horizontal plane, to the first horizontal plane when the lens structure is in the first horizontal position.

[0163] The control unit is configured to determine the position of the consumable component relative to a reference position based on the first distance.

[0164] (Postscript 11)

[0165] As described in Appendix 10, in the substrate processing system, wherein...

[0166] The optical sensor is configured to measure a second distance from the optical sensor, via the second inclined surface, to the first inclined surface when the lens structure is in the second horizontal position.

[0167] The control unit is configured to determine the position of the consumable component relative to the reference position based on the first distance and the second distance.

[0168] (Postscript 12)

[0169] The substrate processing system as described in Appendix 6, wherein...

[0170] The optical sensor is configured to measure the distance from the optical sensor to the first inclined surface via the second inclined surface when the lens structure is in the second horizontal position.

[0171] The control unit is configured to determine the position of the consumable component relative to a reference position based on the distance.

[0172] (Postscript 13)

[0173] The substrate processing system as described in any one of Annexes 6 to 12, wherein the actuator is a piezoelectric actuator.

[0174] (Postscript 14)

[0175] A substrate processing system includes a substrate processing apparatus, a transport apparatus, and a control unit, wherein...

[0176] The substrate processing apparatus includes:

[0177] Substrate processing chamber; and

[0178] A consumable component, which forms part of or is disposed within the substrate processing chamber, has a first inclined surface.

[0179] The conveying device includes:

[0180] A transport arm configured to transport a substrate between the transport chamber and the substrate processing chamber;

[0181] Optical sensors mounted on the transport arm; and

[0182] A lens structure, disposed above or below the optical sensor, has a second inclined surface.

[0183] The control unit is configured to determine the state of the consumable component based on the output of the sensor.

[0184] The above embodiments are described for illustrative purposes only and are not intended to limit the scope of the present invention. Various modifications can be made to the above embodiments without departing from the scope and spirit of the present invention. For example, some components of one embodiment can be added to other embodiments. Furthermore, some components of one embodiment can be replaced with corresponding components of other embodiments.

[0185] Explanation of reference numerals in the attached figures

[0186] 1……Plasma processing device, 2……Control unit, 10……Plasma processing chamber, 11……Substrate support unit, 54……Optical sensor, 56……Lens structure, 58……Actuator, AR……Transport arm, CU……Control unit, P……Component, PA……Horizontal plane, PB……Inclined plane, PS……Substrate processing system.

Claims

1. A substrate processing system including a substrate processing apparatus, a transport apparatus, and a control section, characterized by, the substrate processing apparatus including: a substrate processing chamber; a substrate support section disposed in the substrate processing chamber, having a substrate support surface and a ring support surface; and an edge ring disposed on the ring support section in a manner to surround a substrate on the substrate support surface, having a first horizontal surface and a first inclined surface, the transport apparatus including: a transport chamber; a transport arm configured to transport a substrate between the transport chamber and the substrate processing chamber; an optical sensor mounted to the transport arm; a lens structure disposed below the optical sensor, having a second horizontal surface and a second inclined surface; and an actuator mounted to the transport arm, configured to move the lens structure in a horizontal direction between a first horizontal position in which the second horizontal surface overlaps an optical axis of the optical sensor and a second horizontal position in which the second inclined surface overlaps the optical axis of the optical sensor, the control section configured to determine a consumption amount of the first horizontal surface based on an output of the optical sensor when the lens structure is in the first horizontal position, and determine a consumption amount of the first inclined surface based on an output of the optical sensor when the lens structure is in the second horizontal position.

2. The substrate processing system according to claim 1, characterized in that: the optical sensor is configured to measure a first distance from the optical sensor to the first horizontal surface via the second horizontal surface when the lens structure is in the first horizontal position, the control section is configured to determine the consumption amount of the first horizontal surface based on the first distance.

3. The substrate processing system according to claim 2, characterized in that: the optical sensor is configured to measure a second distance from the optical sensor to the first inclined surface via the second inclined surface when the lens structure is in the second horizontal position, the control section is configured to determine the consumption amount of the first inclined surface based on the second distance.

4. The substrate processing system according to claim 1, characterized in that: the optical sensor is configured to measure a distance from the optical sensor to the first inclined surface via the second inclined surface when the lens structure is in the second horizontal position, the control section is configured to determine the consumption amount of the first inclined surface based on the distance.

5. The substrate processing system according to claim 1, characterized in that: the actuator is a piezoelectric actuator.

6. A substrate processing system including a substrate processing apparatus, a transport apparatus, and a control section, characterized by, the substrate processing apparatus including: a substrate processing chamber; and a consumable component constituting a part of the substrate processing chamber or disposed in the substrate processing chamber, having a first horizontal surface and a first inclined surface, the transport apparatus including: a transport chamber; a transport arm configured to transport a substrate between the transport chamber and the substrate processing chamber; and an optical sensor mounted to the transport arm. a transport arm configured to transport a substrate between the transport chamber and the substrate processing chamber; an optical sensor mounted to the transport arm; a lens structure disposed above or below the optical sensor, having a second horizontal surface and a second inclined surface; and an actuator mounted to the transport arm, configured to move the lens structure in a horizontal direction between a first horizontal position in which the second horizontal surface overlaps an optical axis of the optical sensor and a second horizontal position in which the second inclined surface overlaps the optical axis of the optical sensor, the control section configured to determine a state of the consumable component based on an output of the optical sensor.

7. The substrate processing system of claim 6, wherein: the optical sensor is configured to measure a first distance from the optical sensor to the first horizontal surface via the second horizontal surface when the lens structure is in the first horizontal position, the control section is configured to determine an amount of consumption of the first horizontal surface based on the first distance.

8. The substrate processing system of claim 7, wherein: the optical sensor is configured to measure a second distance from the optical sensor to the first inclined surface via the second inclined surface when the lens structure is in the second horizontal position, the control section is configured to determine an amount of consumption of the first inclined surface based on the second distance.

9. The substrate processing system of claim 6, wherein: the optical sensor is configured to measure a distance from the optical sensor to the first inclined surface via the second inclined surface when the lens structure is in the second horizontal position, the control section is configured to determine an amount of consumption of the first inclined surface based on the distance.

10. The substrate processing system of claim 6, wherein: the optical sensor is configured to measure a first distance from the optical sensor to the first horizontal surface via the second horizontal surface when the lens structure is in the first horizontal position, the control section is configured to determine a position of the consumable component relative to a reference position based on the first distance.

11. The substrate processing system of claim 10, wherein: the optical sensor is configured to measure a second distance from the optical sensor to the first inclined surface via the second inclined surface when the lens structure is in the second horizontal position, the control section is configured to determine a position of the consumable component relative to the reference position based on the first distance and the second distance.

12. The substrate processing system of claim 6, wherein: the optical sensor is configured to measure a distance from the optical sensor to the first inclined surface via the second inclined surface when the lens structure is in the second horizontal position, the control section is configured to determine a position of the consumable component relative to a reference position based on the distance.

13. The substrate processing system according to claim 6, wherein: the actuator is a piezoelectric actuator.

14. A substrate processing system comprising a substrate processing apparatus, a transport apparatus, and a control section, wherein: the substrate processing apparatus includes: a substrate processing chamber; and a consumable component that constitutes a part of the substrate processing chamber or is disposed in the substrate processing chamber, has a first inclined surface, the transport apparatus includes: a transport arm configured to transport a substrate between the transport chamber and the substrate processing chamber; an optical sensor mounted to the transport arm; and a lens structure disposed above or below the optical sensor, has a second inclined surface, the control section is configured to determine a state of the consumable component based on an output of the sensor.

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