A high-precision welding device and method for a semiconductor heating disc

Abstract

The application relates to the technical field of semiconductor heaters and discloses a high-precision welding device and method for a semiconductor heating disc, which comprises an equipment unit, a heating unit and a fixing unit, the top of the equipment unit is provided with the heating unit, the top of the equipment unit is provided with the fixing unit on one side of the heating unit, the top of the equipment unit is provided with an assembly unit on the other side of the heating unit, and the number of the heating units is at least two groups; the equipment unit comprises an equipment main body; the high-precision welding device for the semiconductor heating disc is provided with heating assembly one and heating assembly two on the two sides of the semiconductor heating disc; when the welding piece on the top of the semiconductor heating disc is brazed, the heating assembly one and the heating assembly two simultaneously heat and braze the top of the welding piece, the temperature difference between the top and the bottom of the welding piece is prevented from being large, the brazing material is prevented from being incompletely melted, and therefore the brazing effect and the brazing stability of the equipment are improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor heater technology, specifically to a high-precision welding apparatus and method for semiconductor heating plates. Background Technology

[0002] Semiconductor heaters are heating devices that can heat up quickly and are highly energy-efficient, and are widely used in home appliances, electronics, medical, metallurgy, chemical and other fields.

[0003] Chinese patent application CN116673558A discloses a temperature control structure for brazing a semiconductor heater, including a base plate, a heating wire, a solder pad, a cover plate, and a drive assembly. The heating wire is fixedly mounted on the base plate, which transfers heat to a circulating liquid through an arc-shaped closed channel, evenly distributing the temperature to the outer surface of the heating plate. A solder pad is fixedly mounted on the top of the base plate, with the heating wire located between the base plate and the solder pad. A cover plate is fixedly mounted on the solder pad, which can be connected by bolts or welding. A drive assembly is fixedly mounted inside the base plate. The drive assembly utilizes the increased temperature and the resulting metal deformation to propel the liquid flow and evenly distribute the temperature. This can also be connected by bolts or welding. However, during the brazing process, different solder thicknesses and the temperature of the heating plate is transferred from the bottom of the solder upwards. This results in a significant temperature difference between the set temperature on the heating plate and the set temperature on the top of the solder, leading to slower melting of the solder and reduced brazing efficiency. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a high-precision welding device for semiconductor heating plates.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a high-precision welding device for a semiconductor heating plate, comprising a device unit, a heating unit, and a fixing unit. The device unit has a heating unit on its top, a fixing unit located on one side of the heating unit on its top, and a component unit located on the other side of the heating unit on its top. The number of heating units is at least two. The device unit includes a main body, inside which is a semiconductor heating plate. The fixing unit includes positioning plates disposed on the top of the main body and located on both sides of the semiconductor heating plate. A rotating component is disposed inside the positioning plates, and a heating component is disposed outside the rotating component. The heating component is located inside the positioning plates, and a side fixing component is disposed outside the rotating component. The heating component includes a protective shell disposed inside the positioning plates, and the protective shell has a side fixing component inside it. A cooling pipe is fixedly provided, and a heating pipe is fixedly provided inside the protective shell. A spring fixing post is provided on the outer side of the rotating assembly one. A limiting spring post is provided at one end of the spring fixing post. A connecting plate one is provided at one end of the limiting spring post. A connecting rotating plate is movably provided on one side of the connecting plate one. A fixed plate is provided on the top of the main body of the equipment. A rotating assembly two is provided inside the fixed plate. A heating assembly two is provided inside the fixed plate. A limiting auxiliary component is provided at one end of the heating assembly two. A fixing bolt is provided inside the limiting auxiliary component. The rotating assembly one drives the protective shell and the spring fixing post below it to rotate towards the heating assembly two, so that the limiting block and the limiting auxiliary component are interlocked. At the same time, the connecting plate is aligned with the round hole at the top of the limiting auxiliary component. The fixing bolt passes through the connecting plate and the limiting auxiliary component in sequence. The welded part squeezes the connecting rotating plate, causing the limiting spring post at one end to retract and move inward towards the spring fixing post.

[0006] Preferably, a friction plate is provided around the outer side of the connecting plate, and a rotating wheel assembly is provided on one side of the connecting plate, the rotating wheel assembly being located on the opposite side of the connecting plate.

[0007] Preferably, the protective shell has a rotating fixing component movably provided on its back side, and a retaining ring adapted to the rotating fixing component is fixedly provided on the back side of the protective shell.

[0008] Preferably, the rotating fixing assembly includes a connecting hinge disposed on the back side of the protective shell, one end of the connecting hinge is provided with a rotating spring post, one end of the rotating spring post is provided with a connecting plate two, a rotating shaft is provided at the bottom of one side of the connecting plate two, and a rotating plate is arranged around the outside of the rotating shaft.

[0009] Preferably, the rotating component includes a rotating shaft disposed inside the positioning plate, a rotating plate is provided at the top of the rotating shaft, a locking block is provided on the outer side of the rotating shaft, and a limiting ring is provided at the bottom of the rotating shaft, the limiting ring being located below the rotating shaft.

[0010] Preferably, the protective shell has a slot inside, which is adapted to the card block, and the bottom of the positioning plate has a limit groove, which is adapted to the limit ring.

[0011] Preferably, a connector is provided on one side of the cooling pipe and the heating pipe, and a connecting pipe is provided at one end of the connector.

[0012] Preferably, the heating unit includes a liquid distribution ring disposed inside the main body of the device, a temperature control box and an exchange box are respectively provided on both sides of the liquid distribution ring, a connecting pipe is provided on the top of the temperature control box and the exchange box, and a wire conduit is provided inside the liquid distribution ring.

[0013] Preferably, a service chassis is provided on one side of the main body of the device, a processor is provided on the top of the service chassis, an adjustment knob is provided on the front of the processor, a display panel is provided on the front of the processor located to one side of the adjustment knob, a control button is provided on the front of the processor located below the adjustment knob, and a rotary switch is provided on the front of the main body of the device.

[0014] Compared with the prior art, the present invention provides a high-precision welding apparatus and method for semiconductor heating plates, which has the following beneficial effects:

[0015] 1. A high-precision welding device for a semiconductor heating plate, wherein heating component one and heating component two are respectively provided on both sides of the semiconductor heating plate, so that when the semiconductor heating plate is brazing the workpiece on its top, heating component one and heating component two simultaneously heat and braze the top of the workpiece, thereby preventing a large temperature difference between the top and bottom of the workpiece, which would lead to incomplete melting of the brazing filler metal, thus improving the brazing effect and brazing stability of the device.

[0016] 2. This high-precision welding device for semiconductor heating plates has a rotating component on one side of the heating component. The operator can move the rotating component up and down according to the thickness of the brazing material. The rotating component drives the heating component at one end to move up and down, thereby adjusting the brazing distance between the bottom of the heating component and the top of the workpiece, so that the two are at the optimal distance, which further improves the brazing stability and increases the applicability of the equipment.

[0017] 3. This high-precision welding device for semiconductor heating plates has a spring-fixed column located below the heating component on one side of the rotating component. When the rotating component drives the heating component to rotate above the workpiece, the spring-fixed column rotates along with it, so that the connecting plate at one end of the spring-fixed column fits against one side of the workpiece. The limiting spring column provides elastic force to the connecting plate, making the two fit tightly together. Thus, when the upper and lower sides of the workpiece are heated and brazed, the two sets of workpieces are also fixed, preventing the two sets of workpieces from being inaccurately matched, which would prevent the capillary action in the brazing from being effective, and thus prevent the brazing filler metal from fully filling the joint, resulting in an unstable connection or failure. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the heating unit structure of the present invention;

[0020] Figure 3 This is a schematic diagram of the positioning plate structure of the present invention;

[0021] Figure 4 For the present invention Figure 3 Enlarged schematic diagram of the structure at point A in the middle;

[0022] Figure 5 This is a schematic diagram of the positioning plate structure of the present invention;

[0023] Figure 6 This is a cross-sectional view of the positioning plate structure of the present invention;

[0024] Figure 7 This is a cross-sectional view of the heating assembly of the present invention;

[0025] Figure 8 This is a schematic diagram of the side fixing component structure of the present invention;

[0026] Figure 9 This is a side view of the positioning plate structure of the present invention;

[0027] Figure 10 This is a schematic diagram of the rotating fixing component structure of the present invention.

[0028] In the picture:

[0029] 1. Equipment Unit; 11. Equipment Body; 12. Service Chassis; 13. Processor; 14. Adjustment Knob; 15. Display Panel; 16. Control Button; 17. Rotary Switch; 2. Heating Unit; 21. Liquid Separating Ring; 22. Conduit; 23. Semiconductor Heating Plate; 24. Temperature Control Box; 25. Exchange Box; 3. Fixing Unit; 31. Positioning Plate; 32. Rotating Assembly I; 321. Rotating Shaft; 322. Rotating Plate; 323. Locking Block; 324. Limiting Ring; 33. Heating Assembly I; 331. Protective Shell; 332. Cooling Pipe; 333. Heating Pipe; 334. Slot; 335. Limiting Locking Block; 33 6. Connecting plate; 34. Side fixing assembly; 341. Spring fixing post; 342. Limiting spring post; 343. Connecting plate one; 344. Connecting rotating plate; 345. Friction plate; 346. Rotating wheel assembly; 35. Rotating fixing assembly; 351. Connecting hinge; 352. Rotating spring post; 353. Connecting plate two; 354. Rotating shaft; 355. Rotating plate; 36. Snap ring; 37. Connecting pipe; 38. Limiting groove; 39. Connector; 4. Component unit; 41. Fixing plate; 42. Rotating assembly two; 43. Heating assembly two; 44. Limiting accessory; 45. Fixing bolt; 46. Side fixing accessory. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1, please refer to Figures 1-10A high-precision welding device for a semiconductor heating plate includes a device unit 1, a heating unit 2, and a fixing unit 3. The device unit 1 has a heating unit 2 on its top, a fixing unit 3 on one side of the heating unit 2 on its top, and a component unit 4 on the other side of the heating unit 2 on its top. The number of heating units 2 is at least two. The device unit 1 includes a device body 11, inside which is a semiconductor heating plate 23. The fixing unit 3 includes positioning plates 31 located on the top of the device body 11 and on both sides of the semiconductor heating plate 23. A rotating component 32 is located inside the positioning plates 31, and a heating component 33 is located inside the positioning plates 31 on the outer side of the rotating component 32. A side fixing component 34 is located below the heating component 33 on the outer side of the rotating component 32. The heating component 33 includes a protective shell 331 inside the positioning plates 31, a cooling pipe 332 fixed inside the protective shell 331, and a heating pipe 33 fixed below the cooling pipe 332 inside the protective shell 331. 3. A spring fixing post 341 is provided on the outer side of the rotating component 32, located below the protective shell 331. One end of the spring fixing post 341 is provided with a limiting spring post 342, and one end of the limiting spring post 342 is provided with a connecting plate 343. A connecting rotating plate 344 is movably provided on one side of the connecting plate 343. A fixing plate 41 is provided on the top of the equipment body 11, located on the opposite side of the positioning plate 31. A rotating component 42 is provided inside the fixing plate 41, and a heating component 43 is provided inside the fixing plate 41. One end of the heating component 43 is provided with a limiting spring post 342. The auxiliary component 44 has a fixing bolt 45 inside; the rotating component 32 drives the protective shell 331 and the spring fixing column 341 below it to rotate towards the heating component 43, so that the limiting block 335 and the limiting auxiliary component 44 are fitted together, and the connecting plate 336 is aligned with the round hole at the top of the limiting auxiliary component 44. The fixing bolt 45 passes through the connecting plate 336 and the limiting auxiliary component 44 in sequence, while the welded part presses the connecting rotating plate 344 so that the limiting spring column 342 at one end retracts and moves into the spring fixing column 341.

[0032] The worker places the brazing filler metal at the connection between the two sets of weldments. Depending on the thickness of the weldment, the worker moves the rotating plate 322 upwards. At this time, the locking block 323 on the outside of the cooling pipe 332 engages with the locking groove 334 inside the protective shell 331. As the rotating shaft 321 moves upwards, it simultaneously moves the protective shell 331 and the spring fixing post 341 below it upwards together until one end of the spring fixing post 341 is at the thickest point of the weldment. At this point, the worker stops moving the rotating plate 322 upwards. Then, according to the size of the weldment, the connecting hinge 351 is rotated out and connected to the protective shell 331. The rotating cooling pipe 332, perpendicular to each other, causes the protective shell 331 and the spring fixing post 341 to rotate towards the weldment. The height difference between the protective shell 331 and the spring fixing post 341 remains constant. When the connecting rotating plate 344 at one end of the spring fixing post 341 contacts both sides of the weldment, the weldment generates a reaction force on the connecting rotating plate 344. This causes the connecting rotating plate 344 and the rotating wheel assembly 346 to rotate on one side of the connecting plate 343 while pressing against the limiting spring post 342, causing the limiting spring post 342 to move inward towards the spring fixing post 341 until the rotating plate 322 rotates 90 degrees. At this point, the limiting spring post 342 is perpendicular to the side of the weldment, and the reaction force generated by the weldment on the limiting spring post 342 fixes the rotating shaft 321 at one end of the spring fixing post 341 inside the positioning plate 31. The weld seam of the two sets of weldments is also located between the connecting rotating plate 344 and the friction plate 345, and the protective shell 331 above the spring fixing post 341 is located directly above the weld seam of the two sets of weldments. Similarly, rotating the rotating component 42 inside the fixing plate 41 causes the heating component 43 to rotate outward by 90°, thereby heating the limiting auxiliary part 44 at one end of the heating component 43 and the limiting clip at one end of the protective shell 331. Block 335 and connecting plate 336 are fitted together. Then, fixing bolt 45 is inserted into limiting accessory 44 through the round hole at the top of connecting plate 336, so that fixing bolt 45 is located between limiting block 335 and limiting accessory 44. Thus, fixing bolt 45 fixes heating component 2 43 and protective shell 331 together. In this way, when the upper and lower sides of the weldment are heated and brazed at the same time, the two sets of welded parts are also fixed to prevent the two sets of welded parts from being inaccurately matched, which would prevent the capillary action in the brazing from playing a role, and thus prevent the brazing filler metal from fully filling the joint, resulting in an unstable connection or failure.

[0033] Furthermore, a friction plate 345 is provided around the outer side of the connecting plate 344, and a rotating wheel assembly 346 is provided on one side of the connecting plate 343 opposite to the connecting plate 344. The structure of the rotating wheel assembly 346 is the same as the structure of the connecting plate 344 and the friction plate 345 combined together. The friction plate 345 increases the friction between the connecting plate 344 and the edge of the weldment, so that the friction plate 345 is tightly fitted to the edge of the weldment under the elastic force of the limiting spring post 342. At the same time, the rotating wheel assembly 346 together with it limits and fixes one side of the weldment, thereby fixing the two sets of weldments together and providing sufficient capillary tension for subsequent brazing.

[0034] Furthermore, a rotating fixing component 35 is movably provided on the back side of the protective shell 331, and a retaining ring 36 adapted to the rotating fixing component 35 is fixed on the back side of the protective shell 331. The other side of the weldment is fixed by the rotating fixing component 35, so that the two sets of weldments are tightly fixed together. At the same time, the retaining ring 36 fixes the rotating fixing component 35, so that the rotating fixing component 35 is movably engaged with the retaining ring 36.

[0035] Furthermore, the rotating fixing assembly 35 includes a connecting hinge 351 disposed on the back side of the protective shell 331. One end of the connecting hinge 351 is provided with a rotating spring post 352, and one end of the rotating spring post 352 is provided with a connecting plate 353. A rotating shaft 354 is provided at the bottom of one side of the connecting plate 353, and a rotating plate 355 is arranged around the outside of the rotating shaft 354. By rotating the spring post 352, elastic force is provided to the connecting plate 353 and the rotating shaft 354 on one side, so that the rotating plate 355 provides elastic force to the weldment when fixing it, and limits and fixes it on the other side of the weldment.

[0036] Furthermore, the rotating assembly 32 includes a rotating shaft 321 disposed inside the positioning plate 31. A rotating plate 322 is provided on the top of the rotating shaft 321, a locking block 323 is provided on the outside of the rotating shaft 321, and a limiting ring 324 is provided at the bottom of the rotating shaft 321. The limiting ring 324 limits the maximum distance the rotating shaft 321 can rise, thereby limiting the maximum distance the protective shell 331 can rise. This ensures that the semiconductor heating plate 23 and the heating tube 333 can only be brazed to the weldment whose material thickness is located between the top of the semiconductor heating plate 23 and the connecting rotating plate 344, thereby ensuring the stability of its brazing.

[0037] Furthermore, the protective shell 331 has a slot 334 inside that matches the locking block 323, and the bottom of the positioning plate 31 has a limiting groove 38 that matches the limiting ring 324. The locking block 323 and the slot 334 fit together, so that when the rotating shaft 321 moves upward, it will drive the protective shell 331 and its bottom side fixing component 34 to move upward, so that the distance between the protective shell 331 and the side fixing component 34 remains unchanged. Then, when the side fixing component 34 fixes one side of the weldment, the heating tube 333 inside the protective shell 331 will stably braze the brazing filler metal above the weldment, thereby improving the brazing stability of the equipment.

[0038] Furthermore, the heating unit 2 includes a liquid distribution ring 21 disposed inside the main body 11 of the equipment. A temperature control box 24 and an exchange box 25 are respectively disposed on both sides of the liquid distribution ring 21. A connecting pipe 37 is disposed on the top of both the temperature control box 24 and the exchange box 25. A wire conduit 22 is disposed inside the liquid distribution ring 21. A connector 39 is disposed at one end of the cooling pipe 332 and the heating pipe 333. A connecting pipe 37 is disposed at one end of the connector 39. The connector 37 is connected to the exchange box 25, so that after the heating pipe 333 is brazed, the cooling water inside the temperature control box 24 passes through the liquid distribution ring 21 and the exchange box 25 in sequence, and then enters the connector 39 from the connecting pipe 37 at the top of the temperature control box 24 and the exchange box 25, and enters the cooling pipe 332 and the second heating component 43, thereby cooling and absorbing heat above the weldment.

[0039] Furthermore, a service chassis 12 is provided on one side of the main body 11 of the equipment. A processor 13 is provided on the top of the service chassis 12. An adjustment knob 14 is provided on the front of the processor 13. A display panel 15 is located on the side of the adjustment knob 14 on the front of the processor 13. A control button 16 is located below the adjustment knob 14 on the front of the processor 13. The heating temperature of the semiconductor heating plate 23 and the heating temperature of the heating tube 333 are set in advance through the control button 16. The brazing temperature is displayed in real time through the display panel 15, so that the staff can adjust the brazing temperature at any time through the adjustment knob 14.

[0040] It should be noted that the structure of rotating component 2 42 is the same as that of rotating component 1 32, the structure of heating component 2 43 is the same as that of the combination of positioning plate 31, heating component 1 33, and side fixing component 34, and the structure of side fixing accessory 46 is the same as that of rotating fixing component 35.

[0041] Working principle: In use, the operator first sets the heating temperature of the semiconductor heating plate 23 and the heating temperature of the heating tube 333 in advance using the control button 16 according to the type of brazing filler metal. Then, the workpiece to be brazed is placed on top of the semiconductor heating plate 23, and the brazing filler metal is placed at the connection between the two sets of workpieces. Then, according to the thickness of the workpiece, the rotating plate 322 is rotated upward. At this time, the locking block 323 on the outside of the cooling tube 332 engages with the locking groove 334 inside the protective shell 331. As the rotating shaft 321 moves upward, it simultaneously drives the protective shell 331 and the spring fixing post 341 below it to move upward together until one end of the spring fixing post 341 is at the highest point of the workpiece thickness. At this time, the upward movement is stopped. The rotating plate 322 is then rotated, and the connecting hinge 351 is rotated to be perpendicular to the protective shell 331 according to the size of the weldment. The rotating cooling pipe 332 will cause the protective shell 331 and the spring fixing post 341 to rotate towards the weldment. The height difference between the protective shell 331 and the spring fixing post 341 is constant. When the connecting rotating plate 344 at one end of the spring fixing post 341 contacts both sides of the weldment, the weldment will generate a reaction force on the connecting rotating plate 344. This causes the connecting rotating plate 344 and the rotating wheel assembly 346 to rotate on one side of the connecting plate 343 and press against the limiting spring post 342, causing the limiting spring post 342 to move inward into the spring fixing post 341 until the rotating plate 322 rotates 90°. At this time, the limiting spring post 342... 42 is perpendicular to the side of the weldment, and the reaction force generated by the weldment on the limiting spring post 342 fixes the rotating shaft 321 at one end of the spring fixing post 341 inside the positioning plate 31. The weld seam of the two sets of weldments is located between the connecting rotating plate 344 and the friction plate 345, and the protective shell 331 above the spring fixing post 341 is located directly above the weld seam of the two sets of weldments. At the same time, rotating component 42 inside the fixing plate 41 is rotated, causing heating component 43 to rotate outward by 90°. Then, the limiting auxiliary part 44 at one end of the heating component 43 and the limiting block 335 and connecting plate 336 at one end of the protective shell 331 are fitted together. Then, the fixing bolt 45 is inserted into the limiting auxiliary part 44 along the round hole at the top of the connecting plate 336. The fixing bolt 45 is positioned between the limiting block 335 and the limiting accessory 44, thus fixing the heating component 43 and the protective shell 331 together. Simultaneously, the height of the rotating shaft 354 is flush with the height of the connecting rotating plate 344. When the limiting ring 324 drives the protective shell 331 to rotate perpendicular to the weldment, the outer side of the weldment at the top of the semiconductor heating plate 23 will press outward against the rotating plate 355. This, in turn, causes the rotating plate 355 to move outward along the rotating spring column 352. During the rotation of the protective shell 331, the rotating plate 355 will rotate along the edge of the weldment. When the protective shell 331 and the heating component 43 are connected by the fixing bolt 45, the connecting hinge 351 continues to rotate.The rotating spring column 352 is perpendicular to the protective shell 331. Due to its own elasticity, the rotating plate 355 is tightly fitted against the outer side of the weldment, thus fixing the weldment from the side. The side fixing accessory 46 has the same structure as the rotating fixing assembly 35. Similarly, the side fixing accessory 46 is rotated out around the back of the second heating assembly 43 to fix one side of the other weldment. In summary, the side fixing assembly 34, the rotating fixing assembly 35, the second heating assembly 43, and the side fixing accessory 46 simultaneously fix the two sets of weldments from all sides, ensuring a tight fit between the weld joints and providing capillary tension for subsequent brazing, resulting in a more secure and robust weld.

[0042] After the workpiece is fixed, select appropriate brazing filler metal according to different welding requirements. Place the filler metal at the weld joint or wrap it around the weld joint before fixing the workpiece. Then, start the semiconductor heating plate 23 and heating tube 333 to heat the upper and lower sides of the workpiece simultaneously, melting the filler metal at the weld joint. This ensures stable brazing and prevents a large temperature difference between the upper and lower sides of the workpiece and the set temperature of the heating plate, which would slow down the melting of the filler metal and lead to unstable brazing efficiency. After brazing, stop heating the semiconductor heating plate 23 and heating tube 333. Control the cooling water inside the temperature control box 24 to pass through the liquid distribution ring 21 and the exchange box 25 in sequence, and then enter the connector 39 from the connecting pipe 37 at the top of the temperature control box 24 and the exchange box 25, and then enter the cooling pipe 332 and the second heating component 43 to cool and absorb heat from the upper part of the workpiece. After cooling, remove the fixing bolt 4. 5. Separate the limiting accessory 44 from the connecting plate 336, and then separate the protective shell 331 from the heating component 43. Next, the operator holds the rotating plate 322 and rotates the rotating shaft 321, causing the protective shell 331 to rotate inward into the positioning plate 31. During the rotation of the protective shell 331, the connecting hinge 351 will also rotate synchronously with the protective shell 331 until the protective shell 331 rotates to one side of the rotating spring column 352 and engages with the retaining ring 36. At this time, the rotation of the protective shell 331 will drive the rotating spring column 352 to rotate together until the rotating plate 355 at one end of the rotating spring column 352 separates from the outside of the weldment. Then the rotating spring column 352 retracts, causing the rotating plate 355 to move along the edge of the weldment until the protective shell 331 is completely retracted into the positioning plate 31. Similarly, the heating component 43 retracts into the fixing plate 41. At this time, the weldment can be removed and the next work process can be carried out.

[0043] Example 2: A high-precision welding method for semiconductor heating plates, using the aforementioned high-precision welding device for semiconductor heating plates, with the specific process as follows:

[0044] S1. Pretreatment: Clean the heating plate and electrode rod to ensure that the surface is free of oil and impurities in order to improve the brazing quality.

[0045] S2. Assembly: Place the electrode rod correctly on the heating plate, ensuring good contact between the electrode rod and the heating plate to form a good connection during brazing.

[0046] S3. Apply flux and brazing filler metal. Apply flux evenly to the contact surfaces of the heating plate and electrode rod to remove the oxide layer and prevent re-oxidation during brazing. Place the brazing filler metal in the brazing area. The brazing filler metal is usually a metal wire or a pre-made metal sheet.

[0047] S4. Control the rotating component 32 to move the heating component 33 until the side fixing component 34 is level with the side of the weldment. Rotate the rotating component 32 to position the heating component 33 above the weldment. Similarly, rotate the rotating component 42 to make the heating component 43 fit together with the heating component 33. Move the weldment up and down so that the brazing filler metal at the weld is directly below the heating component 33 and the heating component 43. At this time, the side fixing component 34, the rotating fixing component 35, and the side fixing accessory 46 limit and fix the weldment around its sides.

[0048] S5. Brazing: When the filler metal melts, it flows into the joint gap, fills and wets the contact surface, and forms a metallurgical bond.

[0049] S6. Cooling: After stopping heating, allow the semiconductor heating plate 23, heating component 1 33 and heating component 2 43 to cool naturally or use the cooling pipe 332 to accelerate the cooling process until the solder is completely solidified.

[0050] S7. Inspect the quality of the brazed joints. If necessary, grind or clean them to remove excess brazing filler metal and flux residue.

[0051] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision welding apparatus for semiconductor heating plates, comprising an equipment unit, a heating unit, and a fixing unit, characterized in that: The top of the device unit is provided with a heating unit, and the top of the device unit is provided with a fixing unit located on one side of the heating unit. The number of heating units is at least two sets. The device unit includes a main body, inside which is a semiconductor heating plate. The fixing unit includes a positioning plate disposed on the top of the main body and located on one side of the semiconductor heating plate. The positioning plate contains a first rotating component, and a first heating component is disposed outside the first rotating component. The first heating component is located inside the positioning plate and includes a protective shell disposed inside the positioning plate. A cooling pipe is fixed inside the protective shell, and a heating pipe is also fixed inside the protective shell. A spring fixing post is disposed outside the first rotating component, with a limiting spring post at one end and a connecting plate at the other end. A connecting rotating plate is movably disposed on one side of the first connecting plate. A fixing plate is disposed on the top of the main body and located on the other side of the semiconductor heating plate. A second rotating component is disposed inside the fixing plate, and a second heating component is disposed inside the fixing plate. A limiting auxiliary component is disposed at one end of the second heating component, and a fixing bolt is disposed inside the limiting auxiliary component. The structure of the second rotating component is the same as that of the first rotating component. The rotating assembly includes a rotating shaft disposed inside the positioning plate, a rotating plate being provided at the top of the rotating shaft, a locking block being provided on the outer side of the rotating shaft, and a limiting ring being provided at the bottom of the rotating shaft, the limiting ring being located below the rotating shaft; The protective shell has a slot inside, which is adapted to the card block. The bottom of the positioning plate has a limit groove, which is adapted to the limit ring. According to the thickness of the weldment, the rotating plate is held and moved upward, and the card block and the slot are engaged together. Then, during the upward movement of the rotation axis, the protective shell and the spring fixing column below it are moved upward together. The protective shell is provided with a limiting block at one end, and a connecting plate is provided at the top of the limiting block; The rotating component one drives the protective shell and the spring fixing post below it to rotate towards the heating component two. Similarly, the rotating component two inside the fixing plate rotates, so that the limiting block and the limiting auxiliary are fitted together. At the same time, the connecting plate is aligned with the round hole at the top of the limiting auxiliary. The fixing bolt passes through the connecting plate and the limiting auxiliary in sequence, while the welded part squeezes the connecting rotating plate, causing the limiting spring post at one end to retract and move into the spring fixing post.

2. The high-precision welding device for a semiconductor heating plate according to claim 1, characterized in that: A friction plate is provided around the outer side of the connecting plate.

3. The high-precision welding device for a semiconductor heating plate according to claim 2, characterized in that: The protective shell has a rotating fixing component movably mounted on its back side, and a retaining ring adapted to the rotating fixing component is fixedly mounted on the back side of the protective shell.

4. A high-precision welding device for a semiconductor heating plate according to claim 3, characterized in that: The rotating fixing assembly includes a connecting hinge disposed on the back side of the protective shell. One end of the connecting hinge is provided with a rotating spring post, and one end of the rotating spring post is provided with a connecting plate two. A rotating shaft is provided at the bottom of one side of the connecting plate two, and a rotating plate is arranged around the outside of the rotating shaft.

5. A high-precision welding apparatus for a semiconductor heating plate according to claim 4, characterized in that: The cooling pipe and the heating pipe are connected on one side, and a connecting pipe is provided at one end of the connecting pipe.

6. A high-precision welding apparatus for a semiconductor heating plate according to claim 5, characterized in that: The heating unit includes a liquid distribution ring disposed inside the main body of the device. A temperature control box and an exchange box are respectively provided on both sides of the liquid distribution ring. A connecting pipe is provided on the top of both the temperature control box and the exchange box. A wire conduit is provided inside the liquid distribution ring.

7. A high-precision welding apparatus for a semiconductor heating plate according to claim 6, characterized in that: A service chassis is provided on one side of the main body of the device, a processor is provided on the top of the service chassis, an adjustment knob is provided on the front of the processor, a display panel is provided on the front of the processor located to one side of the adjustment knob, a control button is provided on the front of the processor located below the adjustment knob, and a rotary switch is provided on the front of the main body of the device.

8. A high-precision welding method for semiconductor heating plates, using a high-precision welding apparatus for semiconductor heating plates as described in any one of claims 1-7.

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