Panel multi-edge detection device and detection method

Abstract

The application provides a panel multi-edge detection device and a detection method, relates to the technical field of display panel detection, and realizes integrated detection of three types of defects, i.e., cracks, indentations and ICs in the multi-edge terminal area of a panel, through the design of a crack detection area, an indentation detection area and an IC detection area, in cooperation with a specific sequence of clockwise 180-degree detection of the right terminal area, counterclockwise 90-degree detection of the left terminal area and detection of the S-edge terminal area. Meanwhile, relying on multi-platform parallel bearing and three-arm cooperative transfer, combined with an acceleration-deceleration-constant speed detection motion mode, the time consumption for detecting a single panel is greatly compressed, the production rhythm is significantly improved to adapt to the efficient demand of a panel mass production line, and on the precision control, the hardware reduces vibration through a marble base, and the calibration part is accurately positioned, the software realizes concentric calibration of a camera through Mark calibration, multi-dimensional detection precision is guaranteed, and the risk of defective products flowing out is reduced.

Description

Technical Field

[0001] This application relates to the field of display panel testing technology, and in particular to a panel multi-sided testing device and testing method. Background Technology

[0002] As a core component of terminal products such as smartphones, automotive displays, and AR / VR devices, the quality of display panels directly determines the performance and user experience of these devices. With the rapid iteration of new display technologies such as MiniLED and flexible OLED, the complexity of panel manufacturing processes continues to increase, placing increasingly stringent demands on the accuracy and efficiency of detecting key defects such as terminal area cracks, surface indentations, and IC chip bonding. Against the backdrop of the continued expansion of the display industry, high-precision multi-defect simultaneous detection equipment has become a core demand for technological upgrades in the industry, and its technological level directly affects the yield rate and capacity release efficiency of panel production.

[0003] The current testing of panel terminal areas faces multiple technical bottlenecks: firstly, such as Figure 5 As shown, the terminal area includes multiple regions such as the right side, left side, and S-side. Traditional equipment often adopts a single-platform, single-pass inspection mode, requiring multiple transfer and repositioning operations to complete full-area defect coverage. This makes it difficult for the inspection cycle to match the high-efficiency production capacity requirements of modern panel production lines, becoming a key bottleneck restricting the overall efficiency improvement of the production line. Secondly, the integration of multi-defect detection is insufficient. The detection principles of cracks, indentations, and IC defects are significantly different. The corresponding detection modules have obvious compatibility problems in structural design, operating logic, and signal transmission methods. Existing technology cannot integrate the three types of detection functions into a single device. Enterprises need to configure multiple dedicated inspection devices, which not only significantly increases equipment procurement and space occupancy costs, but also requires manual or additional handling mechanisms to transfer panels between different devices, further extending the inspection cycle and increasing the risk of panel damage during transportation.

[0004] Therefore, developing a panel multi-sided inspection device and method that combines high synchronization, multi-region adaptability, and precision stability has become a key technological direction for breaking through the current bottleneck of display panel inspection technology and supporting the industrialization of new display technologies. Summary of the Invention

[0005] This invention proposes a panel multi-sided inspection device and inspection method to solve the technical problems of existing technologies that cannot perform multi-sided multi-terminal area crack, indentation and IC inspection, and have low production cycle and insufficient accuracy.

[0006] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0007] This invention provides a panel multi-sided inspection device, including a conveying mechanism, a platform component, and an inspection area;

[0008] The platform components include multiple testing platforms with load-bearing functions. The conveying mechanism transfers the panels to be tested onto the testing platforms in a preset order.

[0009] The testing area includes at least an IC testing area and an indentation testing area; the IC testing area includes an IC testing organization, and the indentation testing area includes an indentation testing organization; the testing platform and the testing area are configured in a one-to-one or many-to-one manner.

[0010] The testing platform can rotate the panel to be tested, so that multiple testing edges of the panel can be switched to enter the testing area.

[0011] The testing end of the IC testing organization and the testing end of the indentation testing organization are set facing each other; during testing, the testing platform is located between the testing end of the IC testing organization and the testing end of the indentation testing organization.

[0012] Furthermore, it includes a calibration unit, which includes a calibration plate with markings for identification by the detection end of the IC testing organization and the detection end of the indentation testing organization.

[0013] Furthermore, the position of the calibration plate is adjustable.

[0014] Furthermore, the IC testing mechanism and the indentation testing mechanism are switched synchronously between the calibration unit or the corresponding testing platform.

[0015] Furthermore, it includes a marble base, with the calibration unit fixed at one end of the marble base, and the IC detection mechanism and the indentation detection mechanism moving synchronously and linearly on the marble base.

[0016] Furthermore, the detection area also includes a crack detection area; the crack detection area is equipped with crack detection mechanisms, and the detection platform and crack detection mechanisms are configured in a one-to-one or many-to-one ratio.

[0017] Furthermore, the system includes a gantry crane, and the conveying mechanism comprises multiple independently moving conveying arms; the conveying arms reciprocate on the gantry crane to convey the panels to be inspected.

[0018] Furthermore, the IC detection mechanism includes an IR camera and an infrared light source, the crack detection mechanism includes an ITO detection device and a high-brightness white light source, and the indentation detection mechanism includes a line scan camera and a blue light source.

[0019] Furthermore, a testing method for a panel polygon inspection device is disclosed, including the following steps:

[0020] S1. Align the testing end of the IC testing agency with the testing end of the indentation testing agency;

[0021] S2. The IC testing unit and the indentation testing unit simultaneously perform IC testing and indentation testing on the panel under test.

[0022] S3. Based on the test results, compare them with the preset indicators to determine whether the panel to be inspected is qualified.

[0023] Furthermore, during step S1, the detection end of the IC testing mechanism and the detection end of the indentation testing mechanism move synchronously to the middle position of the calibration plate. The calibration plate is marked with a Mark. The detection end of the IC testing mechanism and the detection end of the indentation testing mechanism acquire images of the Mark. The current positional deviation value of the detection end of the IC testing mechanism and the detection end of the indentation testing mechanism is calculated by image analysis and compensated to make the detection end of the IC testing mechanism and the detection end of the indentation testing mechanism concentrically set.

[0024] Furthermore, the IC detection in step S2 includes capturing and obtaining a mark image on the glass of the panel to be inspected and a mark image on the IC through the detection end of the IC detection mechanism and the detection end of the indentation detection mechanism; analyzing and processing the mark images on the glass and the mark images on the IC; calculating the coordinate deviation between the mark on the glass and the current IC detection mechanism, and the coordinate deviation between the mark on the IC and the current indentation detection mechanism; comparing the sum of the two coordinate deviations with a preset deviation range to determine whether the IC position is qualified.

[0025] Furthermore, before step S3, a step is also included whereby a crack detection mechanism performs crack detection on the terminal area of ​​the panel to be inspected.

[0026] Furthermore, the detection motion process of the IC detection mechanism, indentation detection mechanism, and crack detection mechanism includes an acceleration zone, a deceleration zone, and a constant speed zone. The acceleration zone includes an acceleration start point and an acceleration end point, the deceleration zone includes a deceleration end point, and the constant speed zone includes a constant speed end point. The IC detection mechanism, indentation detection mechanism, and crack detection mechanism perform high-speed linear motion in the acceleration zone from the acceleration start point. After reaching the acceleration end point, they enter the deceleration zone to perform deceleration linear motion. When they reach the deceleration end point, the speed reaches the set detection speed. Subsequently, they perform detection at the detection speed in the constant speed zone until the constant speed end point.

[0027] Furthermore, when the panel to be inspected includes multiple terminal areas, the right terminal area is inspected first, then the inspection platform rotates 180 degrees clockwise to inspect the left terminal area; then it rotates 90 degrees counterclockwise to inspect the S-side terminal area.

[0028] Furthermore, when each terminal area has multiple IC detection bits, detection begins from the leftmost IC detection bit of the terminal area.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] This invention provides a panel multi-sided inspection device and method. Through the design of crack detection area, indentation detection area, and IC detection area, and the creatively opposing arrangement of the indentation detection mechanism and the IC detection mechanism, it can inspect the panel more quickly and effectively compared to a flat inspection method, shortening the inspection line length and improving inspection efficiency. Furthermore, the calibration unit enables rapid alignment of the indentation detection mechanism and the IC detection mechanism, achieving high-precision IC position detection in subsequent IC position inspection processes, overcoming the problem of poor inspection results caused by manual installation and debugging errors. A specific sequence is prioritized: inspecting the right terminal area first, then rotating 180° clockwise to inspect the left terminal area, and finally rotating 90° counterclockwise to inspect the S-side terminal area, achieving integrated inspection of cracks, indentations, and IC defects across the panel's multi-sided terminal areas. Simultaneously, relying on parallel support from multiple inspection platforms and coordinated transport by multiple arms, combined with an "acceleration-deceleration-uniform speed" inspection motion mode, the inspection time for a single panel is significantly reduced, significantly improving production cycle time to meet the high-efficiency requirements of panel mass production lines. The addition of a marble base significantly reduces vibration during movement, effectively improving inspection accuracy. Therefore, this application can ensure detection accuracy from multiple dimensions, reduce false detections and missed detections, and reduce the risk of defective products leaving the market. Attached Figure Description

[0031] To more clearly illustrate the technical solution proposed by the present invention, a detailed description is provided below in conjunction with the embodiments and accompanying drawings. It should be understood that the accompanying drawings described below are merely some embodiments of the present invention, and those skilled in the art can make changes to these drawings under the concept of the present invention.

[0032] Figure 1 An assembly perspective view of an embodiment of the detection device provided by the present invention;

[0033] Figure 2 A top view of an embodiment of the detection device provided by the present invention;

[0034] Figure 3 An assembly perspective view of an embodiment of the indentation detection area and IC detection area provided by the present invention;

[0035] Figure 4 An assembly perspective view of an embodiment of the calibration unit provided by the present invention;

[0036] Figure 5 An assembly perspective view of an embodiment of the panel provided by the present invention.

[0037] 1. Feeding mechanism; 2. First crack detection platform; 3. Second crack detection platform; 4. First linear detection platform; 5. Second linear detection platform; 6. IC detection unit; 61. Calibration unit; 610. Support; 611. Height adjustment assembly; 612. Calibration plate; 613. Length adjustment assembly; 7. Crack detection mechanism; 8. Indentation detection mechanism; 9. Recycling mechanism; 100. First conveying arm; 101. Second conveying arm; 102. Third conveying arm; 103. Marble base; 200. Right terminal area; 201. Left terminal area; 202. S-side terminal area. Detailed Implementation

[0038] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0039] like Figure 5 As shown, a panel containing a right terminal area 200, a left terminal area 201, and an S-side terminal area 202 is displayed.

[0040] like Figure 1 , Figure 2 As shown, this embodiment provides a panel multi-sided inspection device that integrates a terminal area crack detection area, an indentation detection area, and an IC inspection area. Cracks, surface foreign objects, or corrosion on the panel located in the crack detection area can be detected; for the panel located in the IC inspection area, the appearance of the IC, such as chipped corners, chipped edges, and cracks, is detected by scanning the upper surface of the IC.

[0041] The crack detection area includes a crack detection mechanism 7, a first crack detection platform 2, and a second crack detection platform 3, employing a dual-platform parallel design to perform multi-sided full-coverage detection of the panel terminal area. The indentation and IC composite detection area is equipped with an indentation detection mechanism 8 and an IC detection mechanism. The indentation detection mechanism 8 is positioned below the first linear detection platform 4 and the second linear detection platform 5, while the IC detection mechanism is correspondingly positioned above them, thus forming a detection space between the indentation detection mechanism 8 and the IC detection mechanism. After the panel is positioned, it can be fed into the detection space by the first linear detection platform 4 and the second linear detection platform 5. The indentation detection mechanism 8 and the IC detection mechanism simultaneously complete indentation and IC detection, significantly shortening the detection cycle.

[0042] The equipment is equipped with a gantry-type conveying mechanism, which achieves the orderly flow of panels through three sets of independent conveying arms. The first conveying arm 100 is responsible for loading panels onto the crack detection platform, conveying the first panel from the loading mechanism 1 to the second crack detection platform 3, and simultaneously conveying the second panel from the loading mechanism 1 to the first crack detection platform 2. The second conveying arm 101 is used for transferring panels after crack detection, conveying the first panel from the second crack detection platform 3 to the second linear detection platform 5, and the second panel from the first crack detection platform 2 to the first linear detection platform 4. The third conveying arm 102 is responsible for the sorting of panels after detection; qualified panels are conveyed to downstream equipment, while defective panels are conveyed to the recycling mechanism 9. The three sets of independent conveying arms work together to achieve seamless connection between "loading-detection-unloading," effectively improving production cycle time and increasing detection efficiency.

[0043] Of course, the indentation detection mechanism 8 and the IC detection mechanism are synchronized and can reciprocate linearly between the first linear detection platform 4 and the second linear detection platform 5. For example... Figure 3As shown, the indentation detection mechanism 8 and the IC detection mechanism are located on a marble base 103. A linear unit is installed on the marble base 103 to drive the indentation detection mechanism 8 and the IC detection mechanism to move synchronously between the first linear detection platform 4 and the second linear detection platform 5. The IC detection mechanism includes an IC detection unit 6, which uses an IR camera, while the indentation detection mechanism 8 uses a line scan camera. Utilizing the low vibration characteristics of marble, the imaging accuracy of the cameras inside the IC detection unit 6 and the indentation detection mechanism 8 can be effectively guaranteed. However, after maintenance, replacement, or adjustment, due to visual or installation errors, the center positions of the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 may not reach the required concentricity even after proper installation and adjustment. Since the position detection of IC chips and panels is highly dependent on the concentricity of the IR camera and the line scan camera, even small errors in panel installation and testing can significantly reduce the product pass rate and increase the probability and cost of after-sales service. Therefore, this application provides a precision calibration section 61 in front of the marble base 103. Specifically, the precision calibration section 61 includes a support 610, a height adjustment component 611, a length adjustment component 613, and a calibration plate 612. The height adjustment component 611 includes an L-shaped arm, on the first arm of which a waist-shaped adjustment groove is provided in the vertical direction. An adjustment screw passes through the waist-shaped adjustment groove and screws into the support 610 (the adjustment screw is not shown in the attached drawing). After loosening the adjustment screw, the L-shaped arm can be moved to adjust the relative height between the L-shaped arm and the support 610. Similarly, the length adjustment component 613 includes an adjustment plate, on which a waist-shaped adjustment groove is provided. An adjustment screw passes through the waist-shaped adjustment groove and screws into the second arm of the L-shaped arm. The calibration plate 612 is installed on the end of the adjustment plate away from the L-shaped arm. The position of the calibration plate 612 can be precisely adjusted by the height adjustment component 611 and the length adjustment component 613.Calibration marks are provided on both the upper and lower surfaces of the calibration plate 612 to better adapt to the calibration of the IC detection unit 6 and the indentation detection mechanism 8. Each time the camera is reinstalled or the model is changed, the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 are moved synchronously to the set positions on the upper and lower surfaces of the calibration plate 612. (When moving to the set positions, the system records the coordinate values ​​of the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 in machine world coordinates. Since the two are preferably moved synchronously, the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 are then calibrated.) (The coordinate values ​​of the line scan camera of mechanism 8 are the same), and at the same time, the marks located on the upper and lower surfaces of calibration plate 612 are photographed (it should be noted that the marks located on the upper and lower surfaces of calibration plate 612 are completely coincident in orthographic projection). By analyzing and processing the images captured by the two cameras, the deviation values ​​of the IR camera of IC detection unit 6 and the line scan camera of indentation detection mechanism 8 from the marks can be obtained. By compensating for the deviation values ​​of each from the marks in the coordinate values ​​of the world coordinate system, the concentric calibration of the IR camera and the line scan camera before detection can be achieved, and the deviation can be eliminated.

[0044] When the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 photograph the marks on the glass and the IC, respectively, since the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 are located above and below the panel, they photograph the marks on the glass and the IC. The images of the glass marks and IC marks photographed by the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 are processed through image analysis to obtain the deviation values ​​between the glass marks and the IC marks and the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8. Since the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 have already undergone alignment, the cumulative value of the deviation values ​​between the glass marks and the IR camera of the IC detection unit 6, and the IC marks and the line scan camera of the indentation detection mechanism 8, is considered acceptable if it does not exceed the deviation range; otherwise, it is considered defective. The third conveying arm 102 transports the acceptable products to the downstream equipment, while the defective products are transported to the recycling mechanism 9.

[0045] In addition, each inspection area uses a different combination of camera and light source. The crack inspection unit 7 uses an ITO camera with a high-brightness white light source to enhance the contrast between cracks and foreign objects. The IC inspection unit 6 uses an IR camera with an infrared light source to identify internal circuit defects of ICs through penetration. The indentation inspection unit 8 uses a line scan camera with a blue light source to highlight the concave and convex features of particles and ensure the accuracy of various defect identifications.

[0046] The detection has Figure 5During the process of installing the first and second panels in the structure shown, both the first and second panels are fixed to the first crack detection platform 2, the second crack detection platform 3, the first linear detection platform 4, and the second linear detection platform 5 by adsorption. The right terminal area 200, the left terminal area 201, and the S-side terminal area 202 are all exposed on the platform surface, ensuring unobstructed camera operation and avoiding missed or false detections due to obstruction. The preferred adsorption method is vacuum adsorption. This can be achieved by evenly distributing adsorption holes in the adsorption area of ​​the platform, with these holes connected to a vacuum generator. When the panel is placed in the adsorption area, the vacuum generator is activated, creating a vacuum in the adsorption holes and adsorbing the panel onto the adsorption area.

[0047] Meanwhile, the detection sequence is set as follows: the right terminal area 200 is detected first, followed by the detection platform. Preferably, a rotary motor is installed below the first crack detection platform 2, the second crack detection platform 3, the first linear detection platform 4, and the second linear detection platform 5. The rotary motor drives the platform to rotate, rotating the panel 180 degrees clockwise to detect the left terminal area 201. Finally, the panel is rotated 90 degrees counterclockwise to detect the S-side terminal area 202. After the S-side terminal area 202 is detected, whether it is the operation of the second conveying arm 101 transferring the panel to the linear detection platform or the operation of the third conveying arm 102 separating qualified / defective panels, no additional rotation is required, and the panel can be directly grasped. This specific detection sequence optimizes the rotation path of the panel and reduces unnecessary rotation. In addition, when the first crack detection platform 2, the second crack detection platform 3, the first linear detection platform 4, and the second linear detection platform 5 are reset after completing a single detection, no rotation operation is required, further shortening the platform reset time and improving the overall detection efficiency.

[0048] This embodiment provides a panel multi-sided inspection method, which uses the panel multi-sided inspection equipment of Embodiment 1, and includes the following steps:

[0049] S1, Mark Calibration and Visual Compensation

[0050] The IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 are moved to the middle position of the calibration plate 612, and the marks located on the upper and lower surfaces of the calibration plate 612 are photographed simultaneously to obtain the mark images on the calibration plate 612. By analyzing and processing the images captured by the two cameras, the deviation values ​​of each of the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 from the marks can be obtained. By compensating for the deviation values ​​of each from the marks at the current coordinate values, the concentric calibration of the IR camera and the line scan camera before detection can be achieved, eliminating the deviation and making the line scan camera and the IR camera concentrically set. This step ensures the consistency of the image acquisition positions for subsequent IC detection and indentation detection, laying the foundation for subsequent synchronous detection.

[0051] S2. Crack detection in panel terminal area

[0052] The crack detection mechanism 7 performs ITO (In-The-Oxide) inspection on the panel terminal areas located on the first crack detection platform 2 and the second crack detection platform 3. ITO inspection includes crack detection, foreign object detection, and corrosion detection. Of course, the ITO inspection method can be selected from existing technologies according to actual needs, such as: 1. Thermal imaging-based inspection methods; 2. Machine vision-based inspection systems; 3. High-resolution linear CCD camera inspection systems; 4. LCD screen ITO line AOI inspection machines. For example, when inspecting the first panel, the right terminal area 200 of the first panel is inspected first. Then, the rotating motors of the first crack detection platform 2 and the second crack detection platform 3 drive the platforms to rotate, rotating the first panel 180 degrees clockwise to inspect the left terminal area 201. Finally, the panel is rotated 90 degrees counterclockwise to inspect the S-side terminal area 202. After the inspection of the S-side terminal area 202 is completed, the second transport arm 101 directly transfers the first panel to the linear inspection platform. It should be noted that when any terminal area (right terminal area 200, left terminal area 201 and S-side terminal area 202) has multiple ICs, the ITO detection starts from the leftmost terminal area in the first panel and scans the terminal area in sequence.

[0053] S3, Synchronous IC Detection and Indentation Detection

[0054] The panel that has completed crack detection is transported to the first linear detection platform 4 and the second linear detection platform 5 via a transfer arm. The IC detection mechanism and the indentation detection mechanism 8 are activated. The IR camera performs IC detection and indentation detection on the panel simultaneously from above and the line scan camera from below. During the detection process, the IR camera and the line scan camera scan sequentially from the left side of the leftmost terminal area of ​​the second panel. Because the mark on the glass of the panel overlaps with the mark on the IC, and the light source cannot pass through, the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 are located above and below the panel, respectively, and take pictures of the mark on the glass and the mark on the IC. The marks on the glass and the IC captured by the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 are processed through image analysis to obtain the deviation values ​​between the marks on the glass and the marks on the IC and the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8. Since the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 have already undergone alignment operations. If the deviation values ​​between the glass mark and the IC mark and the IR camera of the IC detection unit 6 and the line scan camera of the indentation detection mechanism 8 do not exceed the deviation range, the product is considered qualified; otherwise, it is considered defective.

[0055] S4. Judgment of Test Results

[0056] Based on the detection data obtained in steps S2 and S3, the panel is judged to have cracks, indentations and IC defects by using preset algorithms and thresholds, thereby determining whether the panel is a defective product. If it is defective, the third conveying arm 102 will convey it to the recycling mechanism 9; otherwise, it will be conveyed to the downstream equipment.

[0057] During the detection motion in steps S2 and S3, the crack detection mechanism 7, IC detection unit 6, and indentation detection mechanism 8 employ an optimized motion control strategy. The detection motion process includes an acceleration zone, a deceleration zone, and a constant speed zone. The acceleration zone includes a starting point and an acceleration endpoint, the deceleration zone includes a deceleration endpoint, and the constant speed zone includes a constant speed endpoint. The ITO detection device, line scan camera, or IR camera starts from the starting point and performs high-speed linear motion within the acceleration zone. After reaching the acceleration endpoint, it enters the deceleration zone for deceleration linear motion. Upon reaching the deceleration endpoint, the speed reaches a preset detection speed. Subsequently, it performs stable detection at this detection speed within the constant speed zone. After reaching the constant speed endpoint, it re-enters the acceleration zone for high-speed linear motion to the next detection starting point. This "acceleration-deceleration-constant speed" mode ensures the motion stability within the detection zone to obtain clear images and shortens the movement time outside the detection zone through high-speed motion, thereby improving overall detection efficiency.

[0058] The panel multi-sided inspection equipment and method provided in this embodiment achieve integrated and highly efficient inspection of three types of defects in the multi-sided terminal area of ​​the panel through the integrated design of three inspection areas: cracks, indentations, and ICs, as well as the operation mode of multi-platform parallel inspection and three-arm collaborative conveying. Specific inspection sequences and optimized motion control strategies further reduce the inspection time per panel. Simultaneously, the stable structure and precise calibration mechanism based on the marble base 103 ensure high accuracy and reliability of the inspection process, effectively reducing false detection and missed detection rates, and meeting the high-speed and high-precision requirements of modern panel production lines for inspection equipment.

[0059] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0060] The above description represents specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for detecting multiple sides of a panel, characterized in that, It includes an IC testing mechanism, an indentation testing mechanism (8) and a calibration plate (612). The upper and lower surfaces of the calibration plate (612) are provided with Mark marks that are completely superimposed in orthographic projection. The testing end of the IC testing mechanism and the testing end of the indentation testing mechanism (8) are arranged facing each other. It includes the following steps: S1. The detection end of the IC detection mechanism is aligned with the detection end of the indentation detection mechanism (8). Step S1 includes the IC detection end and the detection end of the indentation detection mechanism (8) moving synchronously or separately to the position of the calibration plate (612). The calibration plate (612) is located between the detection end of the IC detection mechanism and the detection end of the indentation detection mechanism (8). The detection end of the IC detection mechanism and the detection end of the indentation detection mechanism (8) respectively acquire the image of the Mark mark. The positional deviation value between the detection end of the IC detection mechanism and the detection end of the indentation detection mechanism (8) and the Mark mark on the calibration plate (612) is calculated from the image of the Mark mark and compensated so that the detection end of the IC detection mechanism and the detection end of the indentation detection mechanism (8) have the same reference zero point. S2. The detection end of the IC detection mechanism and the detection end of the indentation detection mechanism (8) perform IC detection and indentation detection on the panel to be inspected, and the panel to be inspected is located between the detection end of the IC detection mechanism and the detection end of the indentation detection mechanism (8). S3. Based on the comparison of the test results with the preset indicators, determine whether the panel to be inspected is qualified; the IC test in step S2 includes taking and obtaining the mark image on the glass of the panel to be inspected and the mark image on the IC through the detection end of the IC test mechanism and the detection end of the indentation test mechanism (8), and analyzing and processing the mark image on the glass and the mark image on the IC. The coordinate deviations between the mark on the glass and the current IC detection mechanism, and the coordinate deviations between the mark image on the IC and the current indentation detection mechanism (8) are calculated respectively. The sum of the above two coordinate deviations is compared with the preset deviation range to determine whether the IC position is qualified.

2. The panel polygon detection method as described in claim 1, characterized in that, In step S1, the IC detection mechanism and the indentation detection mechanism (8) move synchronously to the calibration plate (612); the detection end of the IC detection mechanism and the detection end of the indentation detection mechanism (8) respectively acquire the image of the Mark mark, and calculate the positional deviation value between the detection end of the IC detection mechanism and the detection end of the indentation detection mechanism (8) and the Mark mark by analyzing the image of the Mark mark and make compensation, so as to adjust the detection end of the IC detection mechanism and the detection end of the indentation detection mechanism (8) to be coaxial.

3. The panel polygon detection method as described in claim 2, characterized in that, When the panel under test includes multiple terminal areas, the test begins with the terminal area on the right. Then, the panel under test is rotated 180 degrees clockwise to test the terminal area on the left; then it is rotated 90 degrees counterclockwise to test the terminal area in the middle.

4. The panel polygon detection method as described in claim 3, characterized in that, When each terminal area has multiple IC detection bits, the detection begins from the leftmost IC detection bit of the terminal area.

5. The panel polygon detection method as described in claim 4, characterized in that, Multiple panels to be inspected are arranged in parallel. The IC testing mechanism and the indentation testing mechanism (8) switch synchronously and sequentially between the calibration plate (612) and the panels to be inspected.

6. The panel polygon detection method as described in claim 5, characterized in that, Before step S3, there is also a step of crack detection mechanism (7) performing crack detection on the terminal area of ​​the panel to be inspected.

7. The panel polygon detection method as described in claim 6, characterized in that, The detection motion process of the IC detection mechanism, the indentation detection mechanism (8) and the crack detection mechanism (7) includes an acceleration zone, a deceleration zone and a uniform speed zone. The acceleration zone includes an acceleration start point and an acceleration end point. The deceleration zone includes a deceleration end point. The uniform speed zone includes a uniform speed end point. The IC detection mechanism, the indentation detection mechanism (8), and the crack detection mechanism (7) move at high speed in the acceleration zone from the acceleration starting point. After reaching the acceleration endpoint, they enter the deceleration zone to move at deceleration. When they reach the deceleration endpoint, their speed reaches the set detection speed. Then, they perform detection at the detection speed in the uniform speed zone until the uniform speed endpoint.

8. The panel polygon detection method as described in claim 7, characterized in that, The IC detection mechanism includes an IR camera and an infrared light source; the crack detection mechanism (7) includes an ITO detection device and a high-brightness white light source; and the indentation detection mechanism (8) includes a line scan camera and a blue light source.

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