High-heat-dissipation-efficiency electronic component packaging system and method

Abstract

The invention relates to the technical field of electronic component packaging, in particular to a high-heat-dissipation-efficiency electronic component packaging system and method, and the method comprises the steps: collecting multi-source data through a data collection module; the data processing module processes the collected data to generate a standardized data set; the heat dissipation risk analysis module is used for judging a risk level and determining a parameter adjustment scheme according to a preset priority rule by calculating a real-time heat dissipation risk coefficient in a packaging process according to the standardized data set; the signal output and control module converts the real-time risk coefficient, the risk level and the optimization parameter suggestion into visual electronic signals and outputs the visual electronic signals to a user side; according to the method, the multi-source packaging heat dissipation data are integrated, the risk is quantified by using the real-time heat dissipation risk coefficient calculation formula, the problem of misjudgment caused by single data and dependence on experience in traditional packaging is effectively solved, and component performance degradation and production resource waste caused by heat dissipation risk misjudgment are reduced.

Description

Technical Field

[0001] This invention relates to the field of electronic component packaging technology, and more specifically to a high-heat-dissipation-efficiency electronic component packaging system and method. Background Technology

[0002] With the increasing integration and power of electronic components, heat dissipation control during the packaging process has become a core aspect of ensuring component performance and lifespan. As component integration and power density increase, heat dissipation during packaging has become a major bottleneck restricting product reliability. Traditional packaging systems rely on a single dimension for heat dissipation design, failing to consider the impact of the three-dimensional spatial layout of the packaging on heat distribution. Furthermore, they lack the ability to dynamically analyze real-time heat dissipation risks during packaging, often only making reactive adjustments after overheating failures occur, leading to low production efficiency and reduced product yield.

[0003] However, in actual use, the shortcomings of traditional packaging systems are more prominent. First, there is no scenario-specific and accurate heat dissipation benchmark. Risk is judged by a uniform temperature threshold without combining personalized parameters such as the chip's rated maximum junction temperature for modeling, resulting in a high misjudgment rate. For example, normal high temperature of large-volume packages is easily misjudged, while local overheating of small-volume packages is easily missed. Second, there is a lack of dynamic analysis of heat dissipation data. The status is judged only by a single temperature data, which cannot distinguish between occasional fluctuations caused by environmental interference and continuous hidden dangers caused by packaging defects, which can easily lead to unnecessary downtime or batch failures.

[0004] Therefore, there is an urgent need for a high-efficiency electronic component packaging system that can achieve multi-dimensional parameter acquisition and integration, standardized data processing, quantitative analysis of heat dissipation risks, closed-loop optimization of controllable parameters, precise output of control commands, and visual feedback of status. The three-dimensional parameter acquisition, data preprocessing, heat dissipation risk calculation, optimized parameter derivation, and signal output control steps of this invention specifically address the above-mentioned industry pain points, promote the intelligent, standardized, and efficient development of electronic component packaging processes, and reduce the problems of component performance degradation and shortened lifespan caused by poor heat dissipation. Summary of the Invention

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a high heat dissipation efficiency electronic component packaging system and method to solve the problems existing in the background art.

[0006] The present invention provides the following technical solution: The present invention provides a high heat dissipation efficiency electronic component packaging system and method, including: a data acquisition module, used to acquire three-dimensional spatial parameters, thermal conductivity parameters of materials used in the packaging process, and thermal resistance limit parameters of the chip to be packaged during the electronic component packaging process; The data processing module is used to process the collected data and generate standardized datasets; The heat dissipation risk analysis module includes a risk calculation unit and an optimization analysis unit; The risk calculation unit is used to calculate the real-time heat dissipation risk coefficient during the packaging process using a quantitative formula based on a standardized dataset, determine the risk level, and output optimization parameter suggestions for high-risk scenarios. The optimization analysis unit is used to reduce the R value to below 0.3 when the real-time heat dissipation risk coefficient is ≥0.6. Based on the real-time heat dissipation risk coefficient calculation formula, it back-calculates the optimized value of the controllable parameters affecting the real-time heat dissipation risk coefficient and determines the parameter adjustment scheme according to the preset priority rules. The signal output and control module is used to convert real-time risk coefficients, risk levels, and optimization parameter suggestions into visual electronic signals and output them to the user end. At the same time, it sends control commands to the packaging equipment according to the optimization parameter suggestions to realize real-time adjustment of packaging parameters.

[0007] The technical effects and advantages of this invention are as follows: 1. This invention integrates multi-source packaging heat dissipation data, including packaging three-dimensional spatial parameters, material thermal conductivity parameters, and chip thermal resistance limit parameters. It quantifies the risk using a real-time heat dissipation risk coefficient calculation formula and outputs risk judgment results in combination with a four-level risk level rule. This effectively solves the problem of misjudgment caused by single data and reliance on experience in traditional packaging, and reduces the performance degradation of components and waste of production resources caused by misjudgment of heat dissipation risks. 2. This invention calculates the real-time heat dissipation risk coefficient and classifies the risk level through a heat dissipation risk analysis module, which solves the shortcomings of traditional systems that lack scenario-based accurate benchmarks and have a high misjudgment rate when using a uniform threshold. It achieves no misjudgment of normal high temperature in large-volume packages and early identification of local overheating in small-volume packages, thereby effectively reducing the risk misjudgment rate. 3. This invention converts risk data into RS485 digital signals and transmits them to the PLC system and 4-20mA analog signals through a signal output and control module. This solves the shortcomings of traditional systems, such as delayed information feedback and opaque management. It allows operators to monitor the packaging status in real time, and downstream manufacturers can trace the heat dissipation process, thereby improving management transparency and product quality trust. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0009] Figure 2 This is a flowchart of the steps of the present invention. Detailed Implementation

[0010] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. In addition, the forms of the various structures described in the following embodiments are merely illustrative. The high heat dissipation efficiency electronic component packaging system and method involved in the present invention are not limited to the structures described in the following embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0011] Reference Figure 1 This invention provides a high-heat-dissipation-efficiency electronic component packaging system, comprising: The data acquisition module is used to collect three-dimensional spatial parameters of electronic components during the packaging process, thermal conductivity parameters of materials used in the packaging process, and thermal resistance limit parameters of the chip to be packaged. The data processing module is used to process the collected data and generate standardized datasets; The heat dissipation risk analysis module includes a risk calculation unit and an optimization analysis unit; The risk calculation unit is used to calculate the real-time heat dissipation risk coefficient during the packaging process using a quantitative formula based on a standardized dataset, determine the risk level, and output optimization parameter suggestions for high-risk scenarios. The optimization analysis unit is used to reduce the R value to below 0.3 when the real-time heat dissipation risk coefficient is ≥0.6. Based on the real-time heat dissipation risk coefficient calculation formula, it back-calculates the optimized value of the controllable parameters affecting the real-time heat dissipation risk coefficient and determines the parameter adjustment scheme according to the preset priority rules. The signal output and control module is used to convert real-time risk coefficients, risk levels, and optimization parameter suggestions into visual electronic signals and output them to the user end. At the same time, it sends control commands to the packaging equipment according to the optimization parameter suggestions to realize real-time adjustment of packaging parameters.

[0012] Reference Figure 2 The specific implementation of the present invention includes the following steps: S1. Collect the three-dimensional spatial parameters of electronic components during the packaging process, the thermal conductivity parameters of the materials used in the packaging process, and the thermal resistance limit parameters of the chip to be packaged through the data acquisition module. It should be explained that the acquisition of three-dimensional spatial parameters adopts high-precision structured light 3D scanning technology. This technology is equipped with a laser emitter, a CCD camera and a data processing unit. The laser emitter emits linear structured light onto the surface of the packaged workpiece to form alternating bright and dark light stripes. The CCD camera captures the light stripe image and converts it into grayscale data. The data processing unit calculates the three-dimensional coordinates (X, Y, Z) of each point on the light stripe using triangulation. Finally, it outputs the three-dimensional point cloud model of the package and key parameters such as the package volume V (m³), the heat dissipation channel cross-sectional area S (m²), and the shortest distance D from the chip center to the package surface (m). The scanning frequency is set to 50 frames / second to adapt to the cycle speed of the packaging production line, and the scanning accuracy reaches ±0.01mm. The thermal conductivity parameters of the packaging material were acquired using a laser flare thermal conductivity meter. This meter emits a short-pulse laser with a wavelength of 1064 nm and a pulse width of 10 ns, which acts on the material surface. After absorbing the laser energy, the material generates a temperature gradient inside. Simultaneously, an infrared detector captures the time-temperature change curve on the back side of the material in real time. The thermal conductivity λ of the material is calculated using the Fourier heat conduction equation, with units of W / (m·K). Before measurement, impurities on the material surface are removed using a plasma cleaning device to avoid surface roughness affecting measurement accuracy, keeping the measurement error within ±3%. The material thickness data d, in meters, is acquired simultaneously, with the sampling frequency synchronized with the packaging production line. The thermal limit parameters of the chip to be packaged are acquired through two methods working together. On one hand, it connects to the chip manufacturer's database to read the chip's rated maximum junction temperature Tmax, in °C, which is the highest operating temperature in the chip's core area without performance degradation. On the other hand, it uses a micro thermocouple sensor integrated on the chip surface using microelectromechanical systems (MEMS) technology to directly measure the initial junction temperature Tin before chip packaging, in °C, and the real-time junction temperature Tact during the packaging process, in °C. The sensor data transmission uses wireless Bluetooth to reduce the impact of wiring on the packaging process. The data acquisition module sends the collected three-dimensional spatial parameters, thermal conductivity parameters, and thermal resistance limit parameters to the subsequent data processing module according to the corresponding transmission requirements. The three-dimensional parameters are transmitted in XML format at a transmission rate of 10 Mbps to ensure data real-time performance.

[0013] S2. The data processing module processes the collected data to generate a standardized dataset; It should be explained that the standardized dataset specifically includes: V 标 S 标 D 标 , λ 标 Tmax and Tact 标 The three-dimensional spatial parameters correspond to the output standardized package volume V. 标 Standardized heat dissipation channel cross-sectional area S 标and the shortest distance D from the center of the standardized chip to the package surface 标 The thermal conductivity parameters of the packaging material correspond to the output standardized thermal conductivity λ. 标 The chip's thermal limit parameters correspond to the chip's rated maximum junction temperature Tmax and standardized real-time junction temperature Tact. 标 .

[0014] Further explanation is needed regarding the processing steps: First, a wavelet thresholding denoising algorithm is used, with twice the data standard deviation as the denoising threshold. This is applied to filter outomas caused by scanning jitter in the 3D point cloud data, measurement jumps caused by power supply fluctuations in the thermal conductivity data, and noise caused by electromagnetic interference in the temperature data, ensuring the stability of the original data. Second, data correction is performed using preset standard samples. For example, the V value is calibrated using a standard block of known volume, the λ value is calibrated using quartz glass with known thermal conductivity, and the Tact value is calibrated using a standard blackbody with known temperature. Finally, a linear correction formula λ is applied. 校准 =λ 原始 ×0.98+0.5 eliminates systematic errors and ensures data accuracy; finally, the dimensions of different dimensional parameters are uniformly converted to the International System of Units (SI), such as converting the original volume unit from cm³ to m³ and the distance unit from mm to m, ultimately integrating them into a system containing V. 标 S 标 D 标 , λ 标 Tmax, Tact 标 The standardized dataset is used, and the latency of the entire data processing process is controlled within 50ms to ensure that it matches the real-time requirements of the packaging production line. After the data processing module is completed, it will transmit the standardized dataset to the heat dissipation risk analysis module to provide reliable input for subsequent risk calculation.

[0015] S3. Based on the standardized dataset, calculate the real-time heat dissipation risk coefficient during the packaging process using the heat dissipation risk analysis module, and determine the risk level. When the real-time heat dissipation risk coefficient is ≥0.6, generate an optimization analysis. It should be explained that the formula for calculating the real-time heat dissipation risk factor R is: R = (Tact 标 ×V 标 ×D 标 )÷(λ) 标 ×S 标 ×Tmax)×k, Where R represents the real-time thermal risk factor, used to quantify the degree of thermal imbalance during packaging; the larger the R value, the higher the thermal risk. 标 This is the standardized real-time junction temperature of the chip, reflecting the actual temperature state of the core area of ​​the chip during the packaging process; V 标The standardized package volume represents the volume; a larger volume results in higher heat accumulation efficiency per unit time. 标 This is the shortest distance from the center of the standardized chip to the package surface. The longer this distance, the longer the heat conduction path and the lower the heat dissipation efficiency; λ 标 The thermal conductivity of the standardized packaging material is expressed in W / (m·K). A higher value indicates a stronger ability to transfer heat. 标 The cross-sectional area of ​​the standardized heat dissipation channel is the largest, and the higher the efficiency of heat dissipation from the inside of the package to the outside; Tmax is the rated maximum junction temperature of the chip, which is the upper limit of the chip without performance degradation and serves as the core threshold for risk assessment; k is the environmental correction coefficient, used to correct the impact of the packaging environment on heat dissipation. It is obtained through experimental calibration, where k=1.0 in a static air environment and k=0.8 when the air flow rate reaches 1m / s. All parameters are taken from the standardized dataset transmitted by the data processing module to ensure the accuracy and relevance of the formula calculation.

[0016] It needs to be explained that the risk level assessment rules are as follows: Based on the real-time heat dissipation risk coefficient R, the heat dissipation risk during the packaging process is divided into four levels. When R < 0.3, it is considered low risk. At this stage, the heat dissipation capacity of the packaging system is sufficient, and heat can be dissipated in time without overheating risk. When 0.3 ≤ R < 0.6, it is considered medium risk. At this time, the heat balance is in a critical state, and the chip temperature change trend needs to be continuously monitored to prevent the risk from escalating further. When 0.6 ≤ R < 0.8, it is considered high risk. At this stage, heat has begun to accumulate in the package, which may cause fluctuations in chip performance and affect the normal operation of components. When R ≥ 0.8, it is considered extremely high risk. At this stage, the heat balance is severely imbalanced, and if not intervened in time, it will cause chip damage in a short period of time.

[0017] It needs to be further explained that when the real-time heat dissipation risk coefficient is ≥0.6, the heat dissipation risk analysis module automatically triggers optimization analysis. The optimization analysis unit within the module, based on the real-time heat dissipation risk coefficient calculation formula and combined with the cost and efficiency of parameter adjustment, conducts the derivation of controllable parameter optimization values ​​and formulates adjustment schemes, providing a clear basis for subsequent packaging parameter adjustments.

[0018] S4. With the goal of reducing the real-time heat dissipation risk coefficient to below 0.3, the optimization values ​​of the controllable parameters affecting the real-time heat dissipation risk coefficient are deduced based on the real-time heat dissipation risk coefficient calculation formula, the parameter adjustment scheme is determined according to the preset priority rules, and optimization parameter suggestions are generated. It should be explained that controllable parameters refer to key parameters that can be changed during the packaging process through equipment adjustments, material replacements, or structural design optimizations, and that directly affect the real-time heat dissipation risk factor R. Specifically, these include the heat dissipation channel cross-sectional area S, the thermal conductivity λ of the packaging material, and the shortest distance D from the chip center to the packaging surface. All three parameters are derived from the S parameter in the standardized dataset. 标 , λ 标 and D 标 Its adjustment logic is directly related to the formula for calculating the real-time heat dissipation risk factor: increasing S 标 or λ 标 It can increase the rate of heat loss and reduce D 标 Both methods can shorten the heat conduction path and reduce the R value.

[0019] It needs further explanation that the specific method for back-deriving the optimized value of the controllable parameters is as follows: using the target risk coefficient R'=0.3 as a baseline, fix the Tact data in the standardized dataset. 标 V 标 Tmax and the environmental correction factor k are used to derive optimized values ​​for each individual controllable parameter. If the cross-sectional area of ​​the heat dissipation channel is adjusted, substituting R'=0.3 into the formula and reversing the process, the optimized formula for calculating the cross-sectional area of ​​the heat dissipation channel is obtained as follows: Sopt=(Tact) 标 ×V 标 ×D 标 ×k)÷(λ) 标 ×0.3×Tmax), Where Sppt is the optimized heat dissipation channel cross-sectional area, and Tact... 标 For the standardized chip real-time junction temperature, V 标 D represents the standardized package volume. 标 The shortest distance λ from the center of the standardized chip to the package surface 标 Tmax is the standardized thermal conductivity of the packaging material, Tmax is the rated maximum junction temperature of the chip, which is the upper temperature limit at which the chip will not experience performance degradation, and k is the environmental correction factor, which is used to correct the impact of the packaging environment on heat dissipation. If the thermal conductivity of the packaging material is adjusted, the formula for calculating the optimized thermal conductivity can be derived similarly: λopt=(Tact 标 ×V 标 ×D 标 ×k)÷(S) 标 ×0.3×Tmax), Where λopt is the optimized thermal conductivity, S 标 This refers to the standardized cross-sectional area of ​​the heat dissipation channel; If the shortest distance from the chip center to the package surface is adjusted, the derivation logic is the same as above, and the optimized distance Dopt can be obtained by transforming the formula.

[0020] It should be explained that the preset priority rules are set based on the cost and efficiency of parameter adjustment: the first priority is to increase the cross-sectional area S of the heat dissipation channel, which only requires adjusting the structural dimensions of the packaging mold, without changing materials or reconstructing the production line. This has the lowest adjustment cost and the fastest response speed, and the mold parameters can be reset within 10 minutes. The second priority is to replace the material with a high thermal conductivity material λ, which requires switching the raw material type of the material supply equipment. The cost is moderate, but the heat conduction efficiency can be improved immediately after the material is replaced, which is suitable for most packaging scenarios. The third priority is to reduce the shortest distance D from the chip center to the packaging surface, which requires redesigning the chip layout in the package and adjusting the chip positioning equipment on the production line. This is not only more expensive, but the adjustment cycle is also as long as 1-2 hours. This priority is only used when the first two options cannot be implemented due to equipment limitations or process requirements.

[0021] It needs to be further explained that the final generated optimization parameter recommendations should include three parts: first, the optimization target value of each controllable parameter; second, the priority order of parameter adjustment and the corresponding implementation method; and third, the expected effect after adjustment, to ensure that the subsequent signal output and control module can accurately execute parameter adjustments based on the recommendations.

[0022] S5. The real-time risk coefficient, risk level and optimization parameter suggestions are converted into visual electronic signals and output to the user terminal through the signal output and control module. At the same time, control commands are sent to the packaging equipment according to the optimization parameter suggestions to realize the real-time adjustment of packaging parameters.

[0023] It needs to be explained that the signal output and control module converts the real-time risk coefficient R, risk level, and optimization parameter suggestions transmitted by the heat dissipation risk analysis module into two standardized electronic signals: one is a digital signal, which is transmitted to the PLC control system of the packaging production line using the RS485 communication protocol. The system's operation interface will display the specific value of R, the color code corresponding to the risk level, and details of the optimization parameter suggestions in real time, making it convenient for operators to monitor the packaging status in real time; the other is an analog signal, which is transmitted to the audible and visual alarm device of the production line in the form of a 4-20mA current signal. When R < 0.6, a 4-12mA current signal is output, and the alarm device is in standby mode; when R ≥ 0.6, a 12-18mA current signal is output, and the device emits a yellow warning light and intermittent alarm sound; when R ≥ 0.8, an 18-20mA current signal is output, and the device switches to a red bright light and a continuous alarm sound, forcibly reminding the operator to intervene urgently.

[0024] Further explanation is needed regarding the signal output and control module. Based on the priority and specific values ​​of the optimized parameters, it sends precise control commands to the corresponding packaging equipment: For the first priority adjustment of the heat dissipation channel cross-sectional area, it sends mechanical parameter commands to the packaging mold adjustment equipment. This changes the forming gap of the heat dissipation channel by driving the hydraulic push rod within the mold, ensuring the actual cross-sectional area reaches Sopt, with adjustment accuracy controlled within ±0.01mm, consistent with the scanning accuracy of the data acquisition module. For the second priority adjustment of the material thermal conductivity, it sends a raw material switching command to the material supply equipment, controlling the equipment to close the raw material delivery pipeline and open the supply valve for high thermal conductivity material, while simultaneously adjusting the material coating thickness to match the optimized parameters. For the third priority adjustment of the packaging distance, it sends a coordinate correction command to the chip layout and positioning equipment. This moves the chip stage via a servo motor, shortening the distance from the chip center to the packaging surface to Dopt. During the adjustment process, it receives position data from the data acquisition module in real time, ensuring the adjustment error does not exceed ±0.01mm.

[0025] The transmission delay of all control commands is controlled within 50ms, keeping it synchronized with the delay of the data processing module to achieve real-time closed loop and ensure that the packaging process is always in a low-risk heat dissipation state.

[0026] Secondly: The accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this invention can be combined with each other. In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-heat-dissipation-efficiency electronic component packaging system, characterized in that, include: The data acquisition module is used to collect three-dimensional spatial parameters of electronic components during the packaging process, thermal conductivity parameters of materials used in the packaging process, and thermal resistance limit parameters of the chip to be packaged. The data processing module is used to process the collected data and generate standardized datasets; The heat dissipation risk analysis module includes a risk calculation unit and an optimization analysis unit; The risk calculation unit is used to calculate the real-time heat dissipation risk coefficient during the packaging process using a quantitative formula based on a standardized dataset, determine the risk level, and output optimization parameter suggestions for high-risk scenarios. The optimization analysis unit is used to reduce the R value to below 0.3 when the real-time heat dissipation risk coefficient is ≥0.

6. Based on the real-time heat dissipation risk coefficient calculation formula, it back-calculates the optimized value of the controllable parameters affecting the real-time heat dissipation risk coefficient and determines the parameter adjustment scheme according to the preset priority rules. The formula for calculating the real-time heat dissipation risk factor is as follows: R=(Tact) 标 ×V 标 ×D 标 )÷(λ 标 ×S 标 ×Tmax)×k, Where R represents the real-time heat dissipation risk factor; Tact 标 For the standardized chip's real-time junction temperature; V 标 D represents the standardized package volume. 标 This is the shortest distance from the center of the standardized chip to the package surface. λ 标 The thermal conductivity of the standardized packaging material is expressed in W / (m·K); S 标 This refers to the standardized cross-sectional area of ​​the heat dissipation channel; Tmax is the chip's rated maximum junction temperature, which is the upper limit of the temperature at which the chip will not experience performance degradation; k is an environmental correction factor used to correct for the impact of the packaging environment on heat dissipation. It is obtained through experimental calibration, where k=1.0 in a still air environment and k=0.8 when the air flow rate reaches 1m / s. The specific method for optimizing the controllable parameters that affect the real-time heat dissipation risk coefficient is as follows: using the target risk coefficient R'=0.3 as a benchmark, fix the Tact data in the standardized dataset. 标 V 标 Tmax and the environmental correction factor k are used to derive optimized values ​​for each individual controllable parameter. If the cross-sectional area of ​​the heat dissipation channel is adjusted, substituting R'=0.3 into the formula and reversing the process, the optimized formula for calculating the cross-sectional area of ​​the heat dissipation channel is obtained as follows: Whisper=(Tact 标 ×V 标 ×D 标 ×k)÷(λ 标 ×0.3×Tmax) Where Sppt is the optimized heat dissipation channel cross-sectional area, and Tact... 标 For the standardized chip real-time junction temperature, V 标 D represents the standardized package volume. 标 The shortest distance λ from the center of the standardized chip to the package surface 标 Tmax is the standardized thermal conductivity of the packaging material, Tmax is the rated maximum junction temperature of the chip, which is the upper temperature limit at which the chip will not experience performance degradation, and k is the environmental correction factor, which is used to correct the impact of the packaging environment on heat dissipation. If the thermal conductivity of the packaging material is adjusted, the formula for calculating the optimized thermal conductivity can be derived similarly: λopt=(Tact 标 ×V 标 ×D 标 ×k)÷(S 标 ×0.3×Tmax), Where λopt is the optimized thermal conductivity, S 标 This refers to the standardized cross-sectional area of ​​the heat dissipation channel; If the shortest distance from the chip center to the package surface is adjusted, the derivation logic is the same as above, and the optimized distance Dopt can be obtained by transforming the formula. The preset priority rules are as follows: The first priority is to increase the cross-sectional area S of the heat dissipation channel, which only requires adjusting the structural dimensions of the packaging mold and does not require changing materials or reconstructing the production line; the second priority is to replace the material with a high thermal conductivity material λ, which requires switching the raw material type of the material supply equipment; the third priority is to reduce the shortest distance D from the chip center to the packaging surface, which requires redesigning the chip layout within the package and adjusting the chip positioning equipment on the production line. The signal output and control module is used to convert real-time risk coefficients, risk levels, and optimization parameter suggestions into visual electronic signals and output them to the user end. At the same time, it sends control commands to the packaging equipment according to the optimization parameter suggestions to realize real-time adjustment of packaging parameters.

2. The high heat dissipation efficiency electronic component packaging system according to claim 1, characterized in that: The standardized dataset specifically includes: V 标 S 标 D 标 , λ 标 Tmax and Tact 标 The three-dimensional spatial parameters correspond to the output standardized package volume V. 标 Standardized heat dissipation channel cross-sectional area S 标 and the shortest distance D from the center of the standardized chip to the package surface 标 The thermal conductivity parameters of the packaging material correspond to the output standardized thermal conductivity λ. 标 The chip's thermal limit parameters correspond to the chip's rated maximum junction temperature Tmax and standardized real-time junction temperature Tact. 标 .

3. The high heat dissipation efficiency electronic component packaging system according to claim 1, characterized in that: The controllable parameters refer to key parameters that can be changed during the packaging process through equipment adjustments, material replacements, or structural design optimizations, and that can affect the real-time heat dissipation risk factor R. Specifically, these include the heat dissipation channel cross-sectional area S, the thermal conductivity λ of the packaging material, and the shortest distance D from the chip center to the packaging surface. All three parameters are derived from the S parameter in the standardized dataset. 标 , λ 标 and D 标 .

4. The high heat dissipation efficiency electronic component packaging system according to claim 1, characterized in that: The proposed optimization parameters include three parts: first, the target values ​​for each controllable parameter; second, the priority order of parameter adjustments and the corresponding implementation methods; and third, the expected effects after adjustment.

5. The high heat dissipation efficiency electronic component packaging system according to claim 1, characterized in that: The conversion to visual electronic signals includes two standardized electronic signals: one is a digital signal, which is transmitted to the PLC control system of the packaging production line using the RS485 communication protocol. The system's operation interface will display the specific value of R, the color code corresponding to the risk level, and details of optimization parameter suggestions in real time; the other is an analog signal, which is transmitted to the audible and visual alarm device of the production line in the form of a 4-20mA current signal. When R < 0.6, a 4-12mA current signal is output, and the alarm device is in standby mode; when R ≥ 0.6, a 12-18mA current signal is output, and the alarm device emits a yellow warning light and intermittent beep; when R ≥ 0.8, an 18-20mA current signal is output, and the device switches to a red bright light and continuous alarm sound.

6. The high heat dissipation efficiency electronic component packaging system according to claim 1, characterized in that: The control commands specifically include: for the first priority adjustment of the heat dissipation channel cross-sectional area, sending mechanical parameter commands to the packaging mold adjustment equipment, changing the forming gap of the heat dissipation channel by driving the hydraulic push rod in the mold, so that the actual cross-sectional area reaches Sopt, and the adjustment accuracy is consistent with the scanning accuracy of the data acquisition module; for the second priority adjustment of the material thermal conductivity, sending a raw material switching command to the material supply equipment, controlling the equipment to close the raw material delivery pipeline and open the supply valve of the high thermal conductivity material, while adjusting the material coating thickness to a value that matches the optimized parameters; for the third priority adjustment of the packaging distance, sending a coordinate correction command to the chip layout and positioning equipment, driving the chip stage to move through the servo motor, shortening the distance from the chip center to the packaging surface to Dopt.

7. A high-heat-dissipation-efficiency electronic component packaging method, characterized in that, The method is applicable to the high heat dissipation efficiency electronic component packaging system according to any one of claims 1-6, and specifically includes the following steps: S1. Collect the three-dimensional spatial parameters of electronic components during the packaging process, the thermal conductivity parameters of the materials used in the packaging process, and the thermal resistance limit parameters of the chip to be packaged through the data acquisition module. S2. The data processing module processes the collected data to generate a standardized dataset; S3. Based on the standardized dataset, calculate the real-time heat dissipation risk coefficient during the packaging process using the heat dissipation risk analysis module, and determine the risk level. When the real-time heat dissipation risk coefficient is ≥0.6, generate an optimization analysis. S4. With the goal of reducing the real-time heat dissipation risk coefficient to below 0.3, the optimization values ​​of the controllable parameters affecting the real-time heat dissipation risk coefficient are deduced based on the real-time heat dissipation risk coefficient calculation formula, the parameter adjustment scheme is determined according to the preset priority rules, and optimization parameter suggestions are generated. S5. The real-time risk coefficient, risk level and optimization parameter suggestions are converted into visual electronic signals and output to the user terminal through the signal output and control module. At the same time, control commands are sent to the packaging equipment according to the optimization parameter suggestions to realize the real-time adjustment of packaging parameters.

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