Emmc chip automatic test method, apparatus and device, and storage medium

Abstract

The invention discloses an emmc chip automatic test method, device and equipment and a computer readable storage medium, and the method comprises the steps: obtaining the position information of an emmc chip to be tested placed on a test rotating plate by a mechanical arm according to the determined connection state of the test rotating plate and the mechanical arm, connecting the test rotating plate through a USB interface, and connecting the emmc chip to be tested to the test rotating plate through a USB interface; the robot is connected with the mechanical arm through a com port; if it is determined that the position information is a target position, preset work order information corresponding to the emmc chip to be tested is obtained; the to-be-tested emmc chip is tested and verified according to preset work order information, a verification result is obtained to complete automatic testing of the to-be-tested emmc chip, the work order information comprises an RDT firmware burning process, an RDT read-write testing process, an RDT testing result checking process and an RDT firmware burning detection process, and the RDT firmware burning process comprises the RDT firmware burning process, the RDT read-write testing process, the RDT testing result checking process and the RDT firmware burning detection process. The technical problems that a traditional testing process is fixed and the efficiency is low in the prior art are solved, full-automatic testing of the emmc chip is achieved, manual intervention is not needed, and the testing efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip testing, in particular to an emmc chip automatic testing method, device, equipment and computer readable storage medium. BACKGROUND

[0002] In the fields of consumer electronics, Internet of Things devices and industrial control, emmc chips as key storage components directly affect the quality of terminal products in terms of performance and reliability. With the increasing demand for storage capacity, read / write speed and stability, the testing link of emmc chips is becoming increasingly important, not only covering compatibility, durability, data integrity and other indicators, but also coping with the high-efficiency testing demand brought by large-scale production. Traditional emmc chip testing schemes have significant limitations: on the one hand, some processes rely on manual operation, including chip loading, testing parameter configuration, result recording and sorting, etc., which not only has low efficiency and is difficult to match the large-scale production rhythm, but also is prone to human operation errors (such as parameter input errors, chip placement deviations) leading to distorted test results and increasing the risk of defective products; on the other hand, even if automatic equipment is used, most schemes are still based on fixed testing processes, which cannot dynamically optimize the testing logic according to the characteristics of different types of chips and special requirements of work order batches (such as sampling ratio, key test item adjustment), resulting in poor device adaptability. In the production scene of multiple varieties and small batches, frequent shutdowns for re-debugging further reduce production efficiency. Therefore, achieving full automation and process dynamic adaptation of emmc chip testing has become a key direction to solve the pain points of traditional schemes and improve testing reliability and efficiency. SUMMARY

[0003] The present application provides an emmc chip automatic testing method, device, equipment and computer readable storage medium, which can solve the technical problems of fixed traditional testing process and low efficiency in the prior art.

[0004] In a first aspect, an emmc chip automatic testing method is provided, which comprises: According to the determination of the connection state of the test turntable and the mechanical arm, the position information of the mechanical arm placing the emmc chip to be tested on the test turntable is obtained, wherein the test turntable is connected through the USB interface and the mechanical arm is connected through the COM port; If the position information is the target position, the preset work order information corresponding to the emmc chip to be tested is obtained; According to the preset work order information, the emmc chip to be tested is tested and verified, and a verification result is obtained to complete the automatic testing of the emmc chip to be tested, wherein the work order information comprises a RDT firmware burning process, a RDT read-write testing process, a RDT testing result checking process and a RDT firmware detection process.

[0005] In combination with the first aspect, in an implementation, the testing and verifying of the emmc chip to be tested according to the preset work order information and the obtaining of the verification result comprises: According to the RDT firmware burning process, the firmware file in the work order information is burned into the emmc chip to be tested, and according to the RDT firmware detection process, the state of the emmc chip to be tested after burning is obtained; If it is determined that the state of the emmc chip to be tested after burning is the first target state, the emmc chip to be tested after burning is tested according to the RDT read-write testing process, and the state of the emmc chip to be tested after testing is obtained; If it is determined that the state of the emmc chip to be tested after testing is the second target state, the testing result of the emmc chip to be tested after testing is obtained; According to the RDT testing result checking process, the testing result is verified, and a verification result is obtained.

[0006] In combination with the first aspect, in an implementation, after the state of the emmc chip to be tested after burning is obtained, the method further comprises: If it is determined that the state of the emmc chip to be tested after burning is not the first target state, the emmc chip to be tested is tested and verified according to the preset work order information, and a verification result is obtained to complete the automatic testing of the emmc chip to be tested.

[0007] In combination with the first aspect, in an implementation, after the state of the emmc chip to be tested after testing is obtained, the method further comprises: If it is determined that the state of the emmc chip to be tested after testing is not the second target state, the emmc chip to be tested is tested and verified according to the preset work order information, and a verification result is obtained to complete the automatic testing of the emmc chip to be tested.

[0008] In combination with the first aspect, in an implementation, after the verification result is obtained, the method further comprises: The verification result is compared with a preset detection standard; If the verification result does not meet the preset detection standard, the emmc chip to be tested is tested and verified according to preset work order information, a verification result is reacquired, and the automatic testing of the emmc chip to be tested is completed.

[0009] In combination with the first aspect, in an implementation, after the position information of the robot arm placing the emmc chip to be tested on the test turntable is acquired, the method further includes: If it is determined that the position information is not the target position, the position information of the robot arm placing the emmc chip to be tested on the test turntable is reacquired. If it is determined that the position information is the target position, preset work order information corresponding to the emmc chip to be tested is acquired. The emmc chip to be tested is tested and verified according to the preset work order information, a verification result is acquired, and the automatic testing of the emmc chip to be tested is completed.

[0010] In combination with the first aspect, in an implementation, the method further includes: The test turntable is detected through a usb interface, and a virtual com port corresponding to each emmc chip slot on the test turntable is generated. The initialization state of the robot arm is acquired through the virtual com port and the robot arm. A connection confirmation signal is sent to the test turntable and the robot arm, and it is determined that the connection states of the test turntable and the robot arm are both in a communicable state.

[0011] Secondly, an emmc chip automatic testing device is provided, which includes: A first acquisition module is configured to acquire position information of a robot arm placing an emmc chip to be tested on a test turntable according to a connection state of the test turntable and the robot arm, wherein the test turntable is connected through a usb interface, and the robot arm is connected through a com port. A second acquisition module is configured to acquire preset work order information corresponding to the emmc chip to be tested if it is determined that the position information is a target position. A third acquisition module is configured to test and verify the emmc chip to be tested according to the preset work order information, acquire a verification result, and complete the automatic testing of the emmc chip to be tested, wherein the work order information includes a RDT firmware burning process, a RDT read-write testing process, a RDT test result checking process, and a RDT firmware detection process.

[0012] In a third aspect, the embodiments of the present application provide an emmc chip automatic testing device, the emmc chip automatic testing device comprises a processor, a memory, and an emmc chip automatic testing program stored in the memory and executable by the processor, wherein the emmc chip automatic testing program is executed by the processor to implement the steps of the emmc chip automatic testing method.

[0013] In a fourth aspect, the embodiments of the present application provide a computer readable storage medium, the computer readable storage medium stores an emmc chip automatic testing program, wherein the emmc chip automatic testing program is executed by a processor to implement the steps of the emmc chip automatic testing method.

[0014] The technical scheme provided by the embodiments of the present application has the following beneficial effects: By determining the connection state of the test turntable and the mechanical arm, the position information of the mechanical arm placing the emmc chip to be tested on the test turntable is obtained, wherein the test turntable is connected through a USB interface, and the mechanical arm is connected through a COM port; if the position information is determined to be a target position, the corresponding preset work order information of the emmc chip to be tested is obtained; the emmc chip to be tested is tested and verified according to the preset work order information, and a verification result is obtained to complete the automatic testing of the emmc chip to be tested, wherein the work order information comprises a RDT firmware burning process, a RDT read-write testing process, a RDT test result checking process, and a RDT firmware burning detection process, thereby solving the technical problems of fixed and low-efficiency testing process in the related art, dynamically adjusting the testing process by automatic communication between software and the mechanical arm and the test turntable, combining the work order information, realizing full-automatic testing of the emmc chip without manual intervention, and improving the testing efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 FIG. 1 is a flowchart of an emmc chip automatic testing method according to an embodiment of the present application; Figure 2 FIG. 2 is a function module schematic diagram of an emmc chip automatic testing device according to an embodiment of the present application; Figure 3 FIG. 3 is a hardware structure schematic diagram of an emmc chip automatic testing device according to an embodiment of the present application. DETAILED DESCRIPTION

[0016] In order to make the personnel in the technical field better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0017] Firstly, some technical terms in the present application are explained and described in order to facilitate the understanding of the present application by those skilled in the art.

[0018] EMMC (Embedded Multi Media Card) is a standard specification of embedded memory established by MMC Association mainly for products such as mobile phones or tablets. eMMC integrates a controller in the package, provides a standard interface and manages flash memory, so that mobile phone manufacturers can focus on other parts of product development and shorten the time to market.

[0019] COM port: also known as COM interface, it is an extended interface using serial communication protocol. RDT: full name is Reliability Demonstration Test, mainly used for verifying the reliability of products to ensure that there is no major failure in mass production.

[0020] In order to make the purpose, technical scheme and advantages of the present application more clear, the embodiments of the present application will be further described in detail below in combination with the drawings.

[0021] In a first aspect, the embodiments of the present application provide an emmc chip automatic test method.

[0022] In an embodiment, referring to Figure 1 , Figure 1 The flowchart of the first embodiment of the emmc chip automatic test method of the present application is shown in FIG. 1. As shown in FIG. 1, the emmc chip automatic test method comprises the following steps. Figure 1 Step S10: According to the determined connection state of the test turntable and the mechanical arm, the position information of the mechanical arm placing the emmc chip to be tested on the test turntable is obtained, wherein the test turntable is connected through the usb interface, and the mechanical arm is connected through the COM port. ​Exemplarily, the mechanical arm is connected through the COM port. The software of the terminal device communicates with the mechanical arm through the COM port to send relevant instructions. The mechanical arm can operate 1-8 emmc chips at a time. The test turntable on which the emmc chips to be tested are placed can place 8 emmc chips. The turntable is connected to the terminal device through the USB to generate a one-to-one corresponding COM port. The software of the terminal device can communicate with the emmc through the COM port. The terminal device can expand multiple test turntables on which emmc chips are placed through the USB connection to increase the number of emmc chips that can be opened and tested at the same time. After determining the connection state of the test turntable and the mechanical arm, sending instructions, controlling the mechanical arm to place the emmc chip to the corresponding test turntable, and obtaining the position information of the emmc chip to be tested on the test turntable.

[0023] Specifically, the connection state of the test turntable and the mechanical arm is determined by detecting the test turntable through the USB interface, generating a virtual COM port corresponding to each emmc chip slot on the test turntable, establishing communication with the mechanical arm through the virtual COM port, obtaining the initialization state of the mechanical arm, and sending a connection confirmation signal to the test turntable and the mechanical arm to determine that the connection state of the test turntable and the mechanical arm is in a communicable state.

[0024] Exemplarily, the test turntable is detected through the USB interface to generate a virtual COM port corresponding to each emmc chip slot on the test turntable. Communication is established with the mechanical arm through the virtual COM port to obtain the initialization state of the mechanical arm. A connection confirmation signal is sent to the test turntable and the mechanical arm to determine that the connection state of the test turntable and the mechanical arm is in a communicable state.

[0025] Step S20: If it is determined that the position information is the target position, the corresponding preset work order information of the emmc chip to be tested is obtained. Exemplarily, after obtaining the position information of the emmc chip to be tested on the test turntable, it is determined whether the position of the emmc chip to be tested on the test turntable is the target position. If it is determined that the target position is the target position, the corresponding preset work order information of the emmc chip to be tested is obtained. The preset work order information includes the RDT firmware burning process, the RDT read-write test process, the RDT test result checking process, and the RDT firmware burning detection process.

[0026] Specifically, after the position information of the robot arm placing the emmc chip to be tested on the test turntable is obtained, if it is determined that the position information is not a target position, the position information of the robot arm placing the emmc chip to be tested on the test turntable is reacquired; if it is determined that the position information is the target position, preset work order information corresponding to the emmc chip to be tested is acquired; the emmc chip to be tested is tested and verified according to the preset work order information, a verification result is acquired, and the automatic testing of the emmc chip to be tested is completed.

[0027] Specifically, if it is determined that the position information is not a target position, the position information of the robot arm placing the emmc chip to be tested on the test turntable is reacquired; if it is determined that the position information is the target position, preset work order information corresponding to the emmc chip to be tested is acquired; the preset work order information includes a RDT firmware burning process, a RDT read-write test process, a RDT test result checking process and a RDT firmware burning detection process. The firmware file in the work order information is burned into the emmc chip to be tested according to the RDT firmware burning process, and the state of the emmc chip to be tested after burning is acquired according to the RDT firmware burning detection process; if the state of the emmc chip to be tested after burning is determined to be a first target state, i.e., a RDT mode, the emmc chip to be tested after burning is tested according to the RDT read-write test process, and the state of the emmc chip to be tested after burning is queried; if the state of the emmc chip to be tested after burning is determined to be a second target state, a test result of the emmc chip to be tested after testing is acquired; the test result is verified according to the RDT test result checking process, and a verification result is acquired. If the emmc chip position meets the detection standard, the automatic testing of the emmc chip to be tested is completed.

[0028] Step S30: the emmc chip to be tested is tested and verified according to the preset work order information, a verification result is acquired, and the automatic testing of the emmc chip to be tested is completed, wherein the work order information includes a RDT firmware burning process, a RDT read-write test process, a RDT test result checking process and a RDT firmware burning detection process.

[0029] Exemplarily, the emmc chip to be tested is tested and verified through the burning RDT firmware procedure, the RDT read-write test procedure, the RDT test result checking procedure and the burning RDT firmware detection procedure in the work order information, the verification result is obtained, and the automatic testing of the emmc chip to be tested is completed. Before the automatic testing of the emmc chip to be tested is completed, the verification result is obtained, the test result is compared with the detection standard, and if the emmc chip position meets the detection standard, the automatic testing of the emmc chip to be tested is completed. Specifically, after the verification result is obtained, the verification result is compared with the preset detection standard, if the verification result does not meet the preset detection standard, the emmc chip to be tested is tested and verified according to the preset work order information, the verification result is re-obtained, and the automatic testing of the emmc chip to be tested is completed.

[0030] Exemplarily, after the verification result is obtained, the verification result is compared with the preset detection standard, if the verification result does not meet the preset detection standard, the emmc chip to be tested is tested and verified according to the preset work order information, the verification result is re-obtained, and the automatic testing of the emmc chip to be tested is completed. The firmware file in the work order information is burned into the emmc chip to be tested according to the burning RDT firmware procedure, and the state of the emmc chip to be tested after burning is obtained according to the burning RDT firmware detection procedure. If the state of the emmc chip to be tested after burning is determined to be the first target state, i.e. the RDT mode, the emmc chip to be tested after burning is tested according to the RDT read-write test procedure, and the state of the emmc chip to be tested after burning is queried. If the state of the emmc chip to be tested after burning is determined to be the second target state, i.e. the RDT read-write test is completed, the test result of the emmc chip to be tested after testing is obtained. The test result is verified according to the RDT test result checking procedure, and the verification result is obtained. The test result is compared with the detection standard, and if the emmc chip position meets the detection standard, the automatic testing of the emmc chip to be tested is completed.

[0031] Specifically, the testing and verifying the to-be-tested emmc chip according to the preset work order information to obtain a verification result comprises: burning a firmware file in the work order information into the to-be-tested emmc chip according to a burning RDT firmware procedure, and obtaining a state of the to-be-tested emmc chip after burning according to a burning RDT firmware detection procedure; if it is determined that the state of the to-be-tested emmc chip after burning is a first target state, testing the to-be-tested emmc chip after burning according to an RDT read-write testing procedure, and obtaining a state of the to-be-tested emmc chip after testing; if it is determined that the state of the to-be-tested emmc chip after testing is a second target state, obtaining a testing result of the to-be-tested emmc chip after testing; verifying the testing result according to an RDT testing result checking procedure to obtain a verification result.

[0032] Specifically, the testing and verifying the to-be-tested emmc chip according to the preset work order information to obtain a verification result comprises: burning a firmware file in the work order information into the to-be-tested emmc chip according to a burning RDT firmware procedure, and obtaining a state of the to-be-tested emmc chip after burning according to a burning RDT firmware detection procedure; if it is determined that the state of the to-be-tested emmc chip after burning is a first target state, testing the to-be-tested emmc chip after burning according to an RDT read-write testing procedure, and obtaining a state of the to-be-tested emmc chip after testing; if it is determined that the state of the to-be-tested emmc chip after testing is a second target state, obtaining a testing result of the to-be-tested emmc chip after testing; verifying the testing result according to an RDT testing result checking procedure to obtain a verification result.

[0033] Specifically, the testing and verifying the to-be-tested emmc chip according to the preset work order information to obtain a verification result comprises: burning a firmware file in the work order information into the to-be-tested emmc chip according to a burning RDT firmware procedure, and obtaining a state of the to-be-tested emmc chip after burning according to a burning RDT firmware detection procedure; if it is determined that the state of the to-be-tested emmc chip after burning is a first target state, testing the to-be-tested emmc chip after burning according to an RDT read-write testing procedure, and obtaining a state of the to-be-tested emmc chip after testing; if it is determined that the state of the to-be-tested emmc chip after testing is a second target state, obtaining a testing result of the to-be-tested emmc chip after testing; verifying the testing result according to an RDT testing result checking procedure to obtain a verification result.

[0034] Exemplarily, if it is determined that the state of the to-be-tested emmc chip after burning is not the RDT mode, the firmware file in the work order information is burned into the to-be-tested emmc chip according to the RDT firmware burning procedure, and the state of the to-be-tested emmc chip after burning is obtained according to the RDT firmware detection procedure; if it is determined that the emmc state after burning is queried, if it is determined that the state of the to-be-tested emmc chip is the first target state, i.e., the RDT mode, the to-be-tested emmc chip after burning is tested according to the RDT read-write test procedure, and the state of the emmc chip RDT read-write test is queried, if the RDT state is the completed state, i.e., it is determined that the state of the to-be-tested emmc chip after testing is the second target state, the test result of the to-be-tested emmc chip after testing is obtained; the test result is verified according to the RDT test result checking procedure, and a verification result is obtained. According to the detection standard, if the emmc chip position meets the detection standard, the automatic testing of the to-be-tested emmc chip is completed.

[0035] Specifically, after the state of the to-be-tested emmc chip after testing is obtained, the method further includes: if it is determined that the state of the to-be-tested emmc chip after testing is not the second target state, the to-be-tested emmc chip is tested and verified according to the preset work order information, a verification result is obtained, and the automatic testing of the to-be-tested emmc chip is completed.

[0036] Exemplarily, if it is determined that the RDT state of the to-be-tested emmc chip after testing is not the completed state, the firmware file in the work order information is burned into the to-be-tested emmc chip according to the RDT firmware burning procedure, and the state of the to-be-tested emmc chip after burning is obtained according to the RDT firmware detection procedure; if it is determined that the emmc state after burning is queried, if it is determined that the state of the to-be-tested emmc chip is the first target state, i.e., the RDT mode, the to-be-tested emmc chip after burning is tested according to the RDT read-write test procedure, and the state of the emmc chip RDT read-write test is queried, if the RDT state is the completed state, i.e., it is determined that the state of the to-be-tested emmc chip after testing is the second target state, the test result of the to-be-tested emmc chip after testing is obtained; the test result is verified according to the RDT test result checking procedure, and a verification result is obtained. According to the detection standard, if the emmc chip position meets the detection standard, the automatic testing of the to-be-tested emmc chip is completed.

[0037] In the embodiment, the position information of the emmc chip to be tested placed on the test turntable by the mechanical arm is acquired by determining the connection state of the test turntable and the mechanical arm, the test turntable is connected through a USB interface, and the mechanical arm is connected through a COM port; if the position information is determined as a target position, preset work order information corresponding to the emmc chip to be tested is acquired; the emmc chip to be tested is tested and verified according to the preset work order information, and a verification result is acquired to complete the automatic testing of the emmc chip to be tested, wherein the work order information includes a RDT firmware burning process, a RDT read-write testing process, a RDT testing result checking process and a RDT firmware burning detection process, thereby solving the technical problems of a fixed and low-efficiency traditional testing process in the related art, dynamically adjusting the testing process by automatic communication between software and the mechanical arm and the test turntable in combination with the work order information, realizing full-automatic testing of the emmc chip without manual intervention, and improving the testing efficiency.

[0038] In a second aspect, the embodiment of the present application further provides an emmc chip automatic testing device.

[0039] In an embodiment, the emmc chip automatic testing device comprises Figure 2 , Figure 2 FIG. 1 is a schematic diagram of functional modules of an emmc chip automatic testing device according to an embodiment of the present application. As shown in FIG. 1, the emmc chip automatic testing device comprises: Figure 2 A first acquisition module 10 is configured to acquire position information of an emmc chip to be tested placed on a test turntable by a mechanical arm according to a determined connection state of the test turntable and the mechanical arm, wherein the test turntable is connected through a USB interface, and the mechanical arm is connected through a COM port; A second acquisition module 20 is configured to acquire preset work order information corresponding to the emmc chip to be tested if the position information is determined as a target position. A third acquisition module 30 is configured to test and verify the emmc chip to be tested according to the preset work order information, acquire a verification result, and complete the automatic testing of the emmc chip to be tested, wherein the work order information includes a RDT firmware burning process, a RDT read-write testing process, a RDT testing result checking process and a RDT firmware burning detection process.

[0040] Further, in an embodiment, the third acquisition module 30 is configured to: burn a firmware file in the work order information into the emmc chip to be tested according to the RDT firmware burning process, and acquire a state of the emmc chip to be tested after burning according to the RDT firmware burning detection process. ​If it is determined that the state of the emmc chip to be tested after the burning is the first target state, the emmc chip to be tested after the burning is tested according to the RDT read-write test flow, and the state of the emmc chip to be tested after the test is obtained; If it is determined that the state of the emmc chip to be tested after the test is the second target state, the test result of the emmc chip to be tested after the test is obtained. The test result is verified according to the RDT test result checking flow, and a verification result is obtained.

[0041] Further, in an embodiment, the emmc chip automatic testing device further includes a new module for: If it is determined that the state of the emmc chip to be tested after the burning is not the first target state, the emmc chip to be tested is tested and verified according to the preset work order information, a verification result is obtained, and the emmc chip automatic testing is completed.

[0042] Further, in an embodiment, the emmc chip automatic testing device further includes a new module for: If it is determined that the state of the emmc chip to be tested after the test is not the second target state, the emmc chip to be tested is tested and verified according to the preset work order information, a verification result is obtained, and the emmc chip automatic testing is completed.

[0043] Further, in an embodiment, the emmc chip automatic testing device further includes a new module for: The verification result is compared with a preset detection standard. If the verification result does not meet the preset detection standard, the emmc chip to be tested is tested and verified according to the preset work order information, a verification result is re-obtained, and the emmc chip automatic testing is completed.

[0044] If it is determined that the position information is not the target position, the position information of the mechanical arm placing the emmc chip to be tested on the test transfer plate is re-obtained. If it is determined that the position information is the target position, the preset work order information corresponding to the emmc chip to be tested is obtained. The emmc chip to be tested is tested and verified according to the preset work order information, a verification result is obtained, and the emmc chip automatic testing is completed.

[0045] Further, in an embodiment, the first obtaining module 10 is used for: Detecting the test turn plate through the USB interface, generating a virtual COM port corresponding to each EMCC chip slot on the test turn plate; Establishing communication with the mechanical arm through the virtual COM port, and obtaining the initialization state of the mechanical arm; Sending a connection confirmation signal to the test turn plate and the mechanical arm, and determining that the connection states of the test turn plate and the mechanical arm are both in a communicable state.

[0046] The functions of each module in the EMCC chip automatic testing device correspond to the steps in the EMCC chip automatic testing method, and the functions and implementation processes will not be repeated here.

[0047] In a third aspect, the embodiments of the present application provide an EMCC chip automatic testing device. The EMCC chip automatic testing device can be a terminal device with a Windows system and a data processing function.

[0048] Reference Figure 3 , Figure 3 The figure is a schematic diagram of the hardware structure of the EMCC chip automatic testing device involved in the embodiments of the present application. In the embodiments of the present application, the EMCC chip automatic testing device can include a processor, a memory, a communication interface, and a communication bus.

[0049] The communication bus can be of any type and is used to interconnect the processor, the memory, and the communication interface.

[0050] The communication interface includes an input / output (I / O) interface, a physical interface, and a logical interface, and other interfaces for interconnecting devices inside the EMCC chip automatic testing device, and interfaces for interconnecting the EMCC chip automatic testing device with other devices (such as other computing devices or user devices). The physical interface can be an Ethernet interface, a fiber interface, an ATM interface, etc.; the user device can be a display (Display), a keyboard (Keyboard), etc.

[0051] The memory can be various types of storage media, such as random access memory (RAM), read-only memory (ROM), non-volatile RAM (NVRAM), flash memory, optical storage, hard disks, programmable ROM (PROM), erasable PROM (EPROM), electrically erasable PROM (EEPROM), etc.

[0052] The processor can be a general-purpose processor, which can invoke an emmc chip automatic test program stored in the memory and execute the emmc chip automatic test method provided in the embodiments of the present application. For example, the general-purpose processor can be a central processing unit (CPU). The method executed when the emmc chip automatic test program is invoked can refer to the embodiments of the emmc chip automatic test method of the present application, which will not be described here.

[0053] Those skilled in the art can understand that the hardware structure shown in the above-mentioned Figure 3 The hardware structure shown in the above-mentioned

[0054] In a fourth aspect, the embodiments of the present application further provide a computer readable storage medium.

[0055] The computer readable storage medium of the present application stores an emmc chip automatic test program, wherein when the emmc chip automatic test program to be tested is executed by a processor, the steps of the emmc chip automatic test method as described above are implemented.

[0056] The method implemented when the emmc chip automatic test program is executed can refer to the embodiments of the emmc chip automatic test method of the present application, which will not be described here.

[0057] It should be noted that the above-mentioned serial numbers of the embodiments of the present application are only for description, and do not represent the advantages and disadvantages of the embodiments.

[0058] The terms "include" and "have" and any variations thereof in the specification and claims of the present application and the above-mentioned drawings are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device. The terms "first", "second" and "third" and the like descriptions are used to distinguish different objects, and do not represent the order or limit the types of "first", "second" and "third".

[0059] In the description of the embodiments of the present application, "exemplary", "for example", "e.g." or "for instance" are used on the basis that a person of ordinary skill in the art will be able to bring to mind many examples of a given implementation as the implementation described in the embodiments of the present application is exemplary. Any embodiment or design scheme described as "exemplary", "for example" or "for instance" in the embodiments of the present application should not be interpreted as being more preferred than other embodiments or design schemes. Rather, the use of "exemplary", "for example", "e.g." or "for instance" is intended to present concepts in a particular manner.

[0060] In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in the text only describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two.

[0061] In some processes described in the embodiments of the present application, a plurality of operations or steps are included in a specific order, but it should be understood that these operations or steps can be executed or executed in parallel without the order in which they appear in the embodiments of the present application. The serial number of the operation is only used to distinguish different operations, and the serial number itself does not represent any execution order. In addition, these processes can include more or fewer operations, and these operations or steps can be executed in sequence or in parallel, and these operations or steps can be combined.

[0062] From the above description of the embodiments, those skilled in the art can clearly understand that the above-mentioned embodiment method can be realized by means of software and necessary general hardware platform, of course, it can also be realized by hardware, but in many cases the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes a plurality of instructions for making a terminal device execute the method described in each embodiment of the present application.

[0063] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the specification and drawings of the present application, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An automated testing method for eMMC chips, characterized in that, The automated testing method for the eMMC chip under test includes: Based on the connection status of the test board and the robotic arm, the position information of the robotic arm placing the eMMC chip to be tested on the test board is obtained, wherein the test board is connected via a USB interface and the robotic arm is connected via a COM port. If the location information is determined to be the target location, then the preset work order information corresponding to the eMMC chip to be tested is obtained; The eMMC chip to be tested is tested and verified according to the pre-set work order information, and the verification results are obtained to complete the automated testing of the eMMC chip to be tested. The work order information includes the RDT firmware burning process, the RDT read and write test process, the RDT test result check process, and the RDT firmware burning detection process.

2. The automated testing method for eMMC chips as described in claim 1, characterized in that, The step of testing and verifying the eMMC chip under test according to the preset work order information and obtaining the verification results includes: According to the RDT firmware burning process, the firmware file in the work order information is burned into the eMMC chip to be tested, and according to the RDT firmware burning detection process, the status of the eMMC chip to be tested after burning is obtained. If it is determined that the state of the eMMC chip to be tested after programming is the first target state, then the eMMC chip to be tested after programming is tested according to the RDT read and write test process, and the state of the eMMC chip to be tested after testing is obtained. If the state of the eMMC chip under test after the test is determined to be the second target state, then the test result of the eMMC chip under test after the test is obtained. The test results are verified according to the RDT test result verification process to obtain the verification results.

3. The automated testing method for eMMC chips as described in claim 2, characterized in that, After obtaining the state of the eMMC chip to be tested after programming, the process also includes: If it is determined that the state of the eMMC chip to be tested after programming is not the first target state, then the eMMC chip to be tested is tested and verified according to the preset work order information, and the verification result is obtained to complete the automated testing of the eMMC chip to be tested.

4. The automated testing method for eMMC chips as described in claim 2, characterized in that, After obtaining the state of the eMMC chip under test after the test, the method further includes: If it is determined that the state of the eMMC chip under test after testing is not the second target state, then the eMMC chip under test is tested and verified according to the preset work order information, and the verification result is obtained to complete the automated testing of the eMMC chip under test.

5. The automated testing method for eMMC chips as described in claim 1, characterized in that, After obtaining the verification result, the process also includes: The verification results are compared with the preset detection standards; If the verification result does not meet the preset detection standard, the eMMC chip to be tested will be tested and verified according to the preset work order information, and the verification result will be obtained again to complete the automated testing of the eMMC chip to be tested.

6. The automated testing method for eMMC chips as described in claim 1, characterized in that, After obtaining the position information of the robotic arm placing the eMMC chip to be tested on the test turntable, the process includes: If it is determined that the position information is not the target position, the position information of the robotic arm placing the eMMC chip to be tested on the test turntable is obtained again. If the location information is determined to be the target location, then the preset work order information corresponding to the eMMC chip to be tested is obtained; The eMMC chip to be tested is tested and verified according to the pre-set work order information, and the verification results are obtained to complete the automated testing of the eMMC chip to be tested.

7. The automated testing method for eMMC chips as described in claim 1, characterized in that, The determination of the connection status between the test turntable and the robotic arm includes: The test board is tested via USB interface, and virtual COM ports corresponding to each EMMC chip slot on the test board are generated. The virtual COM port is used to establish communication with the robotic arm and obtain the initialization status of the robotic arm. A connection confirmation signal is sent to the test turntable and the robotic arm to confirm that the connection status of the test turntable and the robotic arm is in a communicable state.

8. An automated testing device for eMMC chips, characterized in that, The automated testing device for the eMMC chip to be tested includes: The first acquisition module is used to acquire position information of the robotic arm placing the eMMC chip to be tested on the test turntable based on the connection status of the test turntable and the robotic arm. The test turntable is connected via a USB interface and the robotic arm is connected via a COM port. The second acquisition module is used to acquire the preset work order information corresponding to the eMMC chip under test if the location information is determined to be the target location. The third acquisition module is used to test and verify the eMMC chip under test according to the preset work order information, and obtain the verification results to complete the automated testing of the eMMC chip under test. The work order information includes the RDT firmware burning process, the RDT read and write test process, the RDT test result checking process, and the RDT firmware burning detection process.

9. An automated testing device for eMMC chips, characterized in that, The automated testing equipment for the eMMC chip under test includes a processor, a memory, and an automated testing program for the eMMC chip stored in the memory and executable by the processor. When the automated testing program for the eMMC chip under test is executed by the processor, it implements the steps of the automated testing method for the eMMC chip as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores an automated test program for an eMMC chip, wherein when the automated test program for the eMMC chip under test is executed by a processor, it implements the steps of the automated test method for an eMMC chip as described in any one of claims 1 to 7.

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