Double-wafer megasonic cleaning and pre-bonding equipment

Abstract

The invention provides double-wafer megasonic cleaning and pre-bonding equipment which comprises a rack, a lower working chamber, an upper working chamber, a megasonic cleaning device and a bonding device, wherein the lower working chamber is arranged on a working table and is of a hollow structure with an opening in the upper end; a lower rotary adsorption device is arranged in the lower working chamber and is used for adsorbing a lower sheet and rotating the lower sheet; the upper working chamber is arranged above the lower working chamber in a liftable mode through a first lifting assembly, and the upper working chamber is of a hollow structure with an opening in the lower end. An upper rotary adsorption device is arranged in the upper working chamber and is used for adsorbing an upper sheet and rotating the upper sheet; and the megasonic cleaning device is arranged in the lower working chamber and is used for carrying out megasonic cleaning on the upper sheet and the lower sheet. According to the invention, a cleaning function and a bonding function are integrated, so that secondary pollution of the wafer in a transfer process after cleaning is avoided, and the working efficiency can be improved; according to the megasonic cleaning device, the two wafers can be comprehensively cleaned, the consistency and uniformity of cleaning of the two wafers are ensured, and the bonding quality is more reliable.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a dual wafer megasonic cleaning and pre-bonding device. BACKGROUND

[0002] With the continuous development of semiconductor technology, wafer cleaning and bonding processes play an increasingly important role in the semiconductor manufacturing process. Wafer cleaning is a key process for removing contaminants on the wafer surface, while wafer bonding is an important step for precisely combining two wafers. Currently, these two processes are usually completed by independent devices, each with certain technical limitations.

[0003] Firstly, the existing cleaning equipment is prone to damage the wafer during the cleaning process, and the cleaning effect is not thorough, often leaving particles on the wafer surface. Secondly, the wafer needs to be transferred to the bonding equipment for bonding after cleaning, which can easily cause secondary contamination on the wafer surface, affecting the subsequent bonding quality. In addition, since cleaning and bonding are completed in different devices, it is difficult to ensure the consistency of the two wafers for bonding, and it is also difficult to ensure the stability of the working environment and gas atmosphere in the bonding chamber, thereby affecting the bonding effect.

[0004] Currently, there is no integrated device in the industry that can simultaneously achieve wafer cleaning and pre-bonding functions, which cannot directly perform pre-bonding operations while ensuring cleaning effectiveness, resulting in complex process flow, low production efficiency, and increased risk of wafer contamination. Therefore, it is urgent to develop a device that can integrate cleaning and pre-bonding functions to improve the efficiency and quality of wafer processing. SUMMARY

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a dual wafer megasonic cleaning and pre-bonding device to solve the problems caused by the separation of wafer cleaning and bonding devices in the prior art.

[0006] To achieve the above-mentioned purposes and other related purposes, the present application provides a dual wafer megasonic cleaning and pre-bonding device, comprising: a rack, a workbench is arranged on the rack; a lower working chamber, arranged on the workbench, in a hollow structure with an open upper end; the lower working chamber is provided with a lower rotary adsorption device inside for adsorbing and rotating the lower wafer; an upper working chamber, the upper working chamber is arranged above the lower working chamber through a first lifting assembly and can be lifted, the upper working chamber is in a hollow structure with an open lower end; the upper working chamber is provided with an upper rotary adsorption device inside for adsorbing and rotating the upper wafer; a megasonic cleaning device, arranged in the lower working chamber, for megasonic cleaning of the upper and lower wafers; The bonding device is arranged on the workbench and is used for pressing to realize the pre-bonding of the upper and lower wafers.

[0007] In an embodiment of the present application, the megasonic cleaning device comprises a first rotating rod, a swing arm and a megasonic nozzle, the first rotating rod is arranged on the workbench and located in the lower working chamber, the first rotating rod is driven to rotate by a motor, one end of the swing arm is fixed to the top end of the first rotating rod, and the other end of the swing arm is provided with at least two megasonic nozzles for megasonic cleaning in upward and downward directions respectively.

[0008] Further, the top of the swing arm is further provided with a guide groove for guiding the nozzle wire harness.

[0009] Further, the megasonic cleaning device further comprises a second rotating rod and a mounting rod, the second rotating rod is arranged on the workbench and located in the lower working chamber, the second rotating rod is driven to rotate by a motor, one end of the mounting rod is fixed to the second rotating rod, and the other end of the mounting rod is provided with a cleaning nozzle and / or a nitrogen gas nozzle.

[0010] In an embodiment of the present application, the workbench is further provided with a first water blocking device matched with the megasonic cleaning device, the first water blocking device comprises a nozzle water blocking cover, the nozzle water blocking cover is installed on the workbench by a second lifting assembly and realizes lifting movement, the nozzle water blocking cover is located on the inner side of the first rotating rod / second rotating rod, and after being lifted to a suitable position, the nozzle water blocking cover can shield the nozzle to avoid pollution of the nozzle in the subsequent spin-drying and bonding process, so as to ensure the cleanliness of the nozzle.

[0011] In an embodiment of the present application, the lower working chamber is further provided with a supporting device, the supporting device comprises a plurality of rotating shafts uniformly arranged on the outer periphery of the lower rotating adsorption device, the top end of the rotating shaft is connected with one end of an upper wafer placing claw, and the other end of the upper wafer placing claw is provided with a placing column; the lower rod part of the rotating shaft is provided with a synchronous pulley, all the synchronous pulleys are connected in transmission by a synchronous belt, and the bottom end of one of the rotating shafts is connected with the motor through a coupling; the rotating shaft is driven to rotate by the motor, and the other rotating shafts are driven to rotate together by the synchronous belt.

[0012] Further, a freewheeling idler wheel is arranged between the adjacent two rotating shafts, and the idler wheel is in abutment with the synchronous belt.

[0013] Further, the upper wafer placing claw is in an arc shape, and the reciprocating rotation of the rotating shaft can drive the opening and closing of the upper wafer placing claw. When the upper wafer placing claw is closed, the placing column thereon can form a support point for bearing the upper wafer; when the upper wafer placing claw is opened, the upper wafer loses the bearing of the support column and falls onto the lower wafer.

[0014] In an embodiment of the present application, the outer periphery of the lower rotary adsorption device is further provided with a second water blocking device, which comprises a placement column protection cover, the placement column protection cover is arc-shaped, the number of the placement column protection cover is consistent with the number of the placement columns, and the placement column protection cover is used for shielding the placement columns; the placement column protection cover is fixed on a circular ring, the circular ring is arranged around the outer periphery of the lower rotary adsorption device, and a rotary motor for driving the circular ring to rotate is arranged below the circular ring. The second water blocking device can protect the placement columns during wafer cleaning, avoid the placement columns from being splashed with water, and ensure that the upper wafer can be stably placed on the placement columns.

[0015] In an embodiment of the present application, the lower rotary adsorption device comprises a lower suction disc, a fixed frame and a lower motor module, the lower suction disc is rotatably arranged above the fixed frame, the lower motor module is fixed in the fixed frame, and the bottom of the lower suction disc is provided with a lower vacuum chamber, the lower vacuum chamber is connected with the output end of the lower motor module through a shaft coupling.

[0016] Further, the upper surface of the lower suction disc is provided with a plurality of telescopic positioning columns, and the positioning columns are elastically telescopic along the radial direction.

[0017] In an embodiment of the present application, the upper rotary adsorption device comprises a connecting plate, an upper motor module and an upper suction disc, the upper motor module is installed on the connecting plate, the upper suction disc is provided with an upper vacuum chamber connected therewith, and the upper vacuum chamber is connected with the output end of the upper motor module through a shaft coupling.

[0018] Further, a lampshade is further arranged above the upper suction disc, the lampshade is semispherical, a plurality of infrared lamp bulbs are arranged on the lampshade, and the lampshade is transparent or translucent.

[0019] Further, the upper working chamber is arranged around the connecting plate and extends downward, and the first lifting assembly is connected with the connecting plate. The outer periphery of the lampshade is sealingly connected with the upper working chamber through a sealing ring. Specifically, the first lifting assembly comprises a moving rod and an up-down moving motor module, the moving rod penetrates through the workbench, the top end of the moving rod is connected with the connecting plate, the lower end of the moving rod is connected with the up-down moving motor module, the up-down moving motor module drives the moving rod to move up and down, and the up-down moving motor module is arranged below the workbench.

[0020] In an embodiment of the present application, the bonding device comprises a third lifting assembly, a rotary motor module, a connecting rod and a pressure head, one end of the connecting rod is provided with the pressure head arranged downward, the other end of the connecting rod is connected with the rotary motor module, and the rotary motor module and the connecting rod are controlled to move up and down by the third lifting assembly.

[0021] In an embodiment of the present application, the workbench is further provided with an alignment device; the alignment device comprises a bottom plate, an X-axis fine adjustment platform, a Y-axis fine adjustment platform, an alignment top rod and a first cylinder, the Y-axis fine adjustment platform is arranged on the bottom plate, the X-axis fine adjustment platform is arranged on the Y-axis fine adjustment platform through an adapter plate, a mounting plate is arranged on the X-axis fine adjustment platform, the alignment top rod and the first cylinder are mounted on the mounting plate, and the alignment top rod is driven to move up and down by the first cylinder.

[0022] In an embodiment of the present application, the lower suction disc is provided with a positioning block, and the upper sheet and the lower sheet are provided with positioning grooves matched with the positioning block; the workbench is provided below with an inclination device for inclining and lifting the workbench, and the inclination device is located at the opposite position of the positioning block.

[0023] Further, the positioning block can elastically stretch and contract along the radial direction of the lower suction disc.

[0024] Further, the inclination device comprises a cylinder stand, a second cylinder, a single-axis joint and a double-ear support, the second cylinder is arranged on the cylinder stand, the output end of the second cylinder is provided with the single-axis joint, the top end of the single-axis joint is provided with the double-ear support, and the double-ear support is connected with the bottom of the workbench.

[0025] As described above, the double-sheet megasonic cleaning and pre-bonding device of the present application has the following beneficial effects: 1. The present application integrates the cleaning and bonding functions, avoids the secondary pollution of the wafer during the transfer process after cleaning, and improves the work efficiency; the megasonic cleaning device can comprehensively clean the two wafers and ensure the consistency and uniformity of the cleaning of the two wafers, so that the bonding quality is more reliable.

[0026] 2. The support device of the present application realizes point contact with the upper sheet through the placement column, and compared with the surface contact or line contact of the conventional support device, the contact area is extremely small, which can significantly reduce the friction and extrusion on the surface of the upper sheet, effectively avoid the indentation or scratch, and the structure of the support device is simple and novel, the synchronous transmission design ensures the coordinated action of the placement column, improves the operation stability, and the action of folding or opening is more flexible, so that the contact process of the upper sheet with the lower sheet after falling is more stable, and the stable transfer of the upper sheet is ensured.

[0027] 3. The first water blocking device of the present application protects and shields the nozzle to prevent the cleaning liquid from splashing on the nozzle during spin-drying and polluting the nozzle, and keeps the nozzle clean. At the same time, the second water blocking device of the present application shields and protects the placement column, avoids the cleaning liquid remaining on the placement column during megasonic cleaning, and reduces the risk of transferring the impurities remaining on the surface of the placement column to the upper sheet.

[0028] 4、The application adopts multi-stage alignment mechanism, and the tilt device cooperates with the positioning block to align the upper and lower pieces in one direction, and the alignment device aligns the upper and lower pieces in another direction, so that the micron-level alignment precision is realized, and the high-precision bonding requirement is met.

[0029] The double wafer megasonic cleaning and pre-bonding apparatus of the application can be used to produce semiconductor-on-insulator substrates such as SOI (silicon-on-insulator) and POI (piezoelectric substrate-on-insulator); it can also be used to package other types of semiconductor or micro-mechanical devices. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is an external structure diagram of the double wafer megasonic cleaning and pre-bonding apparatus disclosed in the embodiments of the application.

[0031] Figure 2 It is an internal structure diagram of the double wafer megasonic cleaning and pre-bonding apparatus disclosed in the embodiments of the application.

[0032] Figure 3 It is a structure diagram of the upper working chamber of the double wafer megasonic cleaning and pre-bonding apparatus disclosed in the embodiments of the application.

[0033] Figure 4 It is a structure diagram of the upper rotary adsorption device disclosed in the embodiments of the application.

[0034] Figure 5 It is a structure diagram of the lower rotary adsorption device disclosed in the embodiments of the application.

[0035] Figure 6 It is a structure diagram of the megasonic cleaning device disclosed in the embodiments of the application.

[0036] Figure 7 It is a structure diagram of the first water blocking device in the non-water blocking state disclosed in the embodiments of the application.

[0037] Figure 8 It is a structure diagram of the first water blocking device in the water blocking state disclosed in the embodiments of the application.

[0038] Figure 9 It is a structure diagram of the support device disclosed in the embodiments of the application.

[0039] Figure 10 It is a structure diagram of the second water blocking device in the water blocking state disclosed in the embodiments of the application.

[0040] Figure 11 It is a structure diagram of the bonding device disclosed in the embodiments of the application.

[0041] Figure 12 It is a structure diagram of the alignment device disclosed in the embodiments of the application.

[0042] Figure 13 Structure diagram of the upper working chamber disclosed in the embodiment of the present application.

[0043] Figure 14 Structure diagram of the tilting device disclosed in the embodiment of the present application.

[0044] Figure 15 Workflow diagram of the double wafer megasonic cleaning and pre-bonding device disclosed in the embodiment of the present application.

[0045] Element number explanation 100, rack; 110, shell; 120, air filtering device; 130, workbench; 140, lower working chamber; 150, upper working chamber; 160, first lifting assembly; 161, moving rod; 162, up-and-down moving motor module; 200, upper rotary adsorption device; 210, upper cover; 220, connecting plate; 230, upper vacuum chamber; 240, upper suction disc; 250, lamp cover; 260, infrared lamp bulb; 270, sealing ring; 300, lower rotary adsorption device; 310, lower suction disc; 320, lower vacuum chamber; 330, fixed frame; 340, lower motor module; 350, positioning column; 360, positioning block; 400, megasonic cleaning device; 410, first rotary rod; 420, swing arm; 430, megasonic nozzle; 440, guide groove; 450, second rotary rod; 460, mounting rod; 470, cleaning nozzle; 480, nitrogen gas nozzle; 490, first water blocking device; 491, nozzle water blocking cover; 492, second lifting assembly; 500, supporting device; 510, rotating shaft; 520, wafer placing claw; 530, placing column; 540, synchronous pulley; 550, synchronous belt; 560, coupling; 570, motor; 580, idler; 590, second water blocking device; 591, placing column protection cover; 592, circular ring; 593, rotary motor; 600, bonding device; 610, third lifting assembly; 620, rotary motor module; 630, connecting rod; 640, pressing head; 700, alignment device; 710, bottom plate; 720, X-axis fine adjustment platform; 730, Y-axis fine adjustment platform; 740, adapter plate; 750, alignment top rod; 760, first air cylinder; 800, tilting device; 810, air cylinder vertical plate; 820, second air cylinder; 830, single-axis joint; 840, double-ear support; 910, upper wafer; 920, lower wafer. DETAILED DESCRIPTION

[0046] The following will illustrate the embodiments of the present application by specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the disclosure. It should be noted that the following examples and features in the examples can be combined with each other without conflict.

[0047] Please refer to Figures 1-3 The present application provides a kind of double piece megasonic cleaning, pre-bonding equipment, including rack 100, workbench 130 is provided on rack 100, shell 110 is also covered on rack 100, shell 110 is covered in whole equipment, air filter device 120 is provided on the top of shell 110. Lower working chamber 140 is arranged on workbench 130, and is hollow cylindrical structure with upper end opening, and lower rotating adsorption device 300 is arranged in lower working chamber 140, for adsorbing lower piece 920 and rotating. Upper working chamber 150 is arranged above lower working chamber 140 by first lifting assembly 160, and upper working chamber 150 is hollow cylindrical structure with lower end opening;When upper working chamber 150 is lowered in place, it can be implemented with lower working chamber 140 The cooperation of docking, closes the working chamber. Upper working chamber 150 is provided with upper rotating adsorption device 200, for adsorbing upper piece 910 and rotating. Upper and lower working chamber is preferably made of transparent or translucent material, which is convenient for observing the cleaning and bonding of wafer in the chamber.

[0048] Workbench 130 is also provided with megasonic cleaning device 400, bonding device 600, support device 500, alignment device 700, megasonic cleaning device 400 is arranged in lower working chamber 140, for megasonic cleaning of upper and lower pieces;Alignment device 700 is used for aligning upper and lower pieces;Bonding device 600 is used for pressing upper piece when upper and lower pieces are aligned, so that upper piece is bonded with lower piece;Support device 500 is used for supporting upper piece above lower piece, or releasing upper piece to make it fall into contact with lower piece. Inclination device 800 is also provided below workbench 130, which tilts and lifts workbench 130, for assisting alignment of upper and lower pieces. The specific structure of the above device will be described below in conjunction with the drawings of the specification.

[0049] Reference Figure 4 Upper rotating adsorption device 200 includes connecting plate 220, upper motor module and upper suction cup 240, upper motor module is installed on connecting plate 220 and is covered with upper cover 210, upper suction cup 240 is provided with upper vacuum chamber 230 connected therewith, and upper vacuum chamber 230 is connected with the output end of upper motor module through coupling. Upper motor module drives upper suction cup 240 to rotate, and adsorbs upper piece 910 through the negative pressure generated by upper vacuum chamber 230, so that the stable rotation of upper piece 910 can be realized. The upper cover 250 is covered on the upper side of the upper suction cup 240, and the upper cover 250 is in the shape of a hemisphere protruding upward. The upper cover 250 is provided with a plurality of infrared lamp bulbs 260, and the upper cover 250 is transparent or translucent. The infrared lamp bulbs 260 can heat the upper piece 910 and the lower piece 920 below them, promote the evaporation of water on the surface of the wafer, and realize drying.

[0050] The upper working chamber 150 is arranged on the connecting plate 220 and extends downward, and the outer periphery of the lampshade 250 is sealed and matched with the upper working chamber 150 through the sealing ring 270. The sealing ring 270 can prevent the cleaning liquid from entering the inside of the lampshade 250, and protect the infrared lamp bulb from being corroded or damaged.

[0051] With reference to Figure 13 The first lifting assembly 160 is connected with the connecting plate 220. The first lifting assembly 160 comprises a moving rod 161 and an up-down moving motor module 162. The moving rod 161 penetrates through the workbench 130, the top end of the moving rod 161 is connected with the connecting plate 220, and the lower end of the moving rod 161 is connected with the up-down moving motor module 162. The up-down moving motor module 162 drives the lifting movement of the moving rod 161, and is fixedly arranged below the workbench 130.

[0052] With reference to Figure 5 The lower rotary adsorption device 300 comprises a lower suction disc 310, a fixing frame 330 and a lower motor module 340. The lower suction disc 310 is rotatably arranged above the fixing frame 330, and the lower motor module 340 is fixedly arranged in the fixing frame 330. The bottom of the lower suction disc 310 is provided with a lower vacuum chamber 320, and the lower vacuum chamber 320 is connected with the output end of the lower motor module 340 through a coupling. The lower motor module 340 drives the rotation of the lower suction disc 310, and the lower suction disc 310 is adsorbed to the lower sheet 920 through the negative pressure generated by the lower vacuum chamber 320, so as to realize the stable rotation of the lower sheet 920.

[0053] Further, the upper surface of the lower suction disc 310 is uniformly provided with three telescopic positioning columns 350, and the positioning columns 350 can be elastically telescoped along the radial direction. The telescopic positioning columns 350 can adapt to lower sheets 920 of different sizes, and ensure the accurate positioning of the lower sheet 920 in the adsorption process.

[0054] With reference to Figures 6-8The megasonic cleaning device 400 comprises a first rotating rod 410, a swing arm 420 and a megasonic nozzle 430. The first rotating rod 410 is rotatably arranged on the workbench 130 and located in the lower working chamber 140. The first rotating rod 410 is driven to rotate by a motor. One end of the swing arm 420 is fixedly connected to the top end of the first rotating rod 410. Two megasonic nozzles 430 are arranged at the other end of the swing arm 420. The two megasonic nozzles 430 are used for megasonic cleaning in upward and downward directions respectively. The megasonic nozzles 430 are located between the upper and lower rotary adsorption devices. This design enables the megasonic nozzles 430 to clean the upper wafer 910 and the lower wafer 920 simultaneously, thereby improving the cleaning efficiency. A guide groove 440 is arranged at the top of the swing arm 420, which is used for guiding the nozzle wire harness. The guide groove 440 can effectively prevent the nozzle wire harness from being entangled or damaged during the rotation of the swing arm 420, thereby ensuring the normal operation of the megasonic cleaning device 400. A drain port for draining liquid is arranged on the workbench 130. The drain port is located on the inner side of the lower working chamber 140 and is used for draining the sewage after cleaning.

[0055] The megasonic cleaning device 400 further comprises a second rotating rod 450 and a mounting rod 460. The second rotating rod 450 is rotatably arranged on the workbench 130 and located in the lower working chamber 140. The second rotating rod 450 is driven to rotate by a motor. One end of the mounting rod 460 is fixedly connected to the second rotating rod 450. The other end of the mounting rod 460 is provided with a cleaning nozzle 470 and a nitrogen nozzle 480. The cleaning nozzle 470 and the nitrogen nozzle 480 are arranged in an upward-downward direction and located between the upper and lower rotary adsorption devices 300. The cleaning nozzle 470 can spray cleaning liquid to clean the upper wafer 910 and the lower wafer 920. The nitrogen nozzle 480 can spray nitrogen to dry the cleaned wafers, thereby accelerating the drying time and further improving the cleaning effect.

[0056] Further, the workbench 130 is provided with a first water blocking device 490 cooperating with the megasonic cleaning device 400. The first water blocking device 490 comprises a nozzle water blocking cover 491. The nozzle water blocking cover 491 is installed on the workbench 130 by a second lifting assembly 492 and is capable of lifting. The nozzle water blocking cover 491 is located on the inner side of the first rotating rod 410 and can block the megasonic nozzle 430 after being lifted to a suitable position. During the drying process of the wafer, the first rotating rod 410 drives the megasonic nozzle 430 to rotate outward, so that the nozzle is transferred to the outer side of the upper and lower rotary adsorption devices. Then, the nozzle water blocking cover 491 of the first water blocking device 490 is lowered to block the nozzle, thereby preventing the cleaning liquid from splashing onto the nozzle during spin-drying and polluting the nozzle, and keeping the nozzle clean.

[0057] Reference Figures 9-10The lower working chamber 140 is provided with a supporting device 500, the supporting device 500 comprises three rotating shafts 510 which are uniformly arranged on the outer periphery of the lower rotary adsorption device 300, the top end of the rotating shaft 510 is connected with one end of an upper sheet placing grab 520, and the other end of the upper sheet placing grab 520 is provided with a placing column 530; the lower rod part of the rotating shaft 510 is provided with a synchronous pulley 540, three synchronous pulleys 540 are provided with a synchronous belt 550 outside, the synchronous pulleys are connected through the synchronous belt 550, the bottom end of one of the rotating shafts 510 is connected with a motor 570 through a shaft coupling 560, the rotating shaft 510 is driven to rotate by the motor 570, and the three rotating shafts 510 are driven to rotate through the synchronous belt 550. The adjacent two rotating shafts 510 are provided with idlers 580 which rotate freely, the idlers 580 are matched and tensioned with the synchronous belt 550, the setting of the idlers 580 can ensure the tension of the synchronous belt 550, prevent the synchronous belt 550 from being loose or slipping during transmission, and improve the stability and reliability of transmission.

[0058] The present application realizes point contact by the top end of the placing column 530 contacting the upper sheet 910, compared with the surface contact or line contact of the conventional supporting device 500, the contact area is extremely small, the friction and extrusion on the surface of the upper sheet 910 can be significantly reduced, and the indentation or scratch can be effectively avoided.

[0059] Further, the upper sheet placing grab 520 is in the shape of a circular arc rod, the placing column 530 is in the shape of a conical column, and the upper end diameter of the placing column 530 is greater than the lower end diameter.

[0060] Further, the outer periphery of the lower rotary adsorption device 300 is provided with a second water blocking device 590, the second water blocking device 590 comprises placing column protection covers 591 which are in the shape of an arch, the number of the placing column protection covers 591 is consistent with the number of the placing columns 530, and the placing column protection covers 591 are used for shielding the placing columns 530. The placing column protection covers 591 are fixed on a circular ring 592 which surrounds the periphery of the lower rotary adsorption device 300, and a rotary motor 593 which drives the circular ring 592 to rotate is arranged below the circular ring 592. The placing column protection covers 591 can prevent cleaning liquid from being sprayed on the placing columns 530, and avoid corrosion or pollution of the placing columns 530. Since the supporting device 500 of the present application realizes point contact by the placing columns 530, the structure size of the placing columns 530 is extremely small, and most of the structures of the supporting device 500 are in a suspended state, therefore, the placing columns 530 can be easily shielded and protected by the second water blocking device 590, cleaning liquid remaining on the placing columns 530 during megasonic cleaning is avoided, and the risk of transferring impurities on the surface of the placing columns 530 to the upper sheet is reduced.

[0061] ReferenceFigure 11 The bonding device 600 comprises a third lifting assembly 610, a rotary motor module 620, a connecting rod 630, and a pressing head 640. The connecting rod 630 is in the shape of a circular arc rod. One end of the connecting rod 630 is provided with the downwardly arranged pressing head 640. The other end of the connecting rod 630 is connected with the rotary motor module 620. The rotary motor module 620 and the connecting rod 630 are controlled to move up and down by the third lifting assembly 610. The bonding device 600 can exert pressure on the upper sheet 910 through the pressing head 640 to realize the pre-bonding of the upper sheet 910 and the lower sheet 920.

[0062] The bonding device 600 is arranged on the workbench 130 and located outside the lower work chamber 140. During cleaning, the connecting rod 630 is located outside the closed chamber and does not extend into the chamber. During the bonding process after cleaning, the connecting rod 630 is driven to rotate by the rotary motor module, extends into the lower work chamber 140, and places the pressing head 640 above the center position of the upper sheet 910. Then, the third lifting assembly drives the pressing head 640 to press down, thereby realizing the pre-bonding of the upper and lower sheets 920.

[0063] Reference is made to Figure 12 The workbench 130 is provided with an alignment device 700. The alignment device 700 comprises a bottom plate 710, an X-axis fine adjustment platform 720, a Y-axis fine adjustment platform 730, an alignment top rod 750, and a first cylinder 760. The Y-axis fine adjustment platform 730 is arranged on the bottom plate 710. The X-axis fine adjustment platform 720 is arranged on the Y-axis fine adjustment platform 730 through an adapter plate 740. An installation plate is arranged on the X-axis fine adjustment platform 720. The alignment top rod 750 and the first cylinder 760 are installed on the installation plate. The alignment top rod 750 is driven to move up and down by the first cylinder 760. The alignment device 700 can adjust the position of the alignment top rod 750 through the X-axis fine adjustment platform 720 and the Y-axis fine adjustment platform 730. The alignment top rod 750 is driven by the cylinder to push the upper sheet 910 or the lower sheet 920, thereby realizing the accurate alignment of the upper and lower sheets 920.

[0064] Reference is made to Figure 14 The workbench 130 is further provided with an inclination device 800 below the workbench 130 for tilting and lifting the workbench 130, thereby assisting in the alignment of the upper and lower sheets 920. The inclination device 800 comprises a cylinder stand plate 810, a second cylinder 820, a single-axis joint 830, and a double-ear support 840. The second cylinder 820 is arranged on the cylinder stand plate 810. The output end of the second cylinder 820 is provided with the single-axis joint 830. The top end of the single-axis joint 830 is provided with the double-ear support 840. The double-ear support 840 is connected with the bottom of the workbench 130. The inclination device 800 can drive the workbench 130 to incline through the cylinder.

[0065] Meanwhile, reference is made to Figure 5The lower suction cup 310 is equipped with a positioning block 360, and the upper piece 910 and lower piece 920 are equipped with positioning grooves that match the positioning block 360. Below the worktable 130 is a tilting device 800 that tilts and lifts the worktable 130. The tilting device 800 is positioned relative to the positioning block 360. After the entire worktable 130 is lifted by the tilting device 800, the upper piece 910 and lower piece 920 move towards the positioning block 360, allowing the positioning block 360 to engage with the positioning grooves on the upper piece 910 and lower piece 920, thereby achieving precise positioning of the upper piece 910 and lower piece 920.

[0066] Furthermore, the positioning block 360 can elastically extend and retract along the radial direction of the lower suction cup 310. The elastic extension and retraction of the positioning block 360 can adapt to upper pieces 910 and lower pieces 920 of different sizes, improving the accuracy and adaptability of positioning.

[0067] The workflow of this dual-chip mega-sound cleaning and pre-bonding equipment is as follows: Figure 15 As shown: First, the upper piece placement gripper 520 of the support device is in a retracted state, and the upper piece 910 is placed on the placement column 530. The first lifting component 160 drives the upper suction cup 240 to descend and pick up the upper piece 910, and then rises back to its original position. The upper piece placement gripper 520 of the support device 500 opens, and the second water-blocking device 590 rotates to shield and protect the placement column 530. The lower piece 920 is placed on the lower suction cup 310 and positioned by the positioning column 350. Then, the first lifting component 160 drives the upper working chamber 150 to descend, so that the upper and lower working chambers 140 close. The upper and lower rotating adsorption devices drive the upper and lower pieces to rotate, and at the same time, the two mega-sound nozzles perform a comprehensive scan and cleaning of the upper piece 910 and the lower piece 920 respectively.

[0068] After cleaning, the rotating rod rotates to move the nozzle to the outside of the upper and lower rotating adsorption devices 300. At this time, the first water-blocking device 490 descends to block the nozzle. Then, the upper and lower rotating adsorption devices 300 continue to drive the upper and lower plates to rotate for spin drying. At the same time, the infrared lamp on the upper rotating adsorption device 200 is turned on to irradiate and accelerate drying.

[0069] After drying, the upper piece of the supporting device is placed in the placing grab 520, and the upper piece 910 is placed on the placing column 530 after the upper suction disc 240 is lowered; then the tilting device 800 cooperates with the positioning block 360 to align the upper and lower pieces in one direction, and the aligning device 700 aligns the upper and lower pieces in another direction. After the upper and lower pieces are aligned, the upper suction disc is raised to open the upper working chamber 150, the connecting rod 630 of the bonding device extends into the chamber, the pressing head 640 is placed in the center position of the upper piece 910, the upper piece placing grab 520 is opened to make the upper piece 910 fall on the lower piece 920, and the pressing head 640 is pressed from the center position of the upper piece 910 at this time, so that the upper and lower pieces are pre-bonded. The wafer after pre-bonding can reach the maximum bonding strength through subsequent annealing process.

[0070] Through the cooperation of the above structure, the double-piece megasonic cleaning and pre-bonding equipment can efficiently complete the megasonic cleaning and pre-bonding of the upper and lower pieces, and improve the production efficiency and product quality.

[0071] In summary, the present application integrates cleaning and bonding functions in one, avoids secondary pollution of wafers during the transfer process after cleaning, and improves work efficiency; the megasonic cleaning device can clean two wafers comprehensively and ensure the consistency and uniformity of the cleaning of the two wafers, so that the bonding quality is more reliable. Therefore, the present application effectively overcomes the various shortcomings in the prior art and has high industrial utilization value.

[0072] In the specification, the terms such as "upper", "lower", "left", "right", "front", "back", "middle" and "one" are only for the convenience of clear description, and are not used to limit the scope of the application. The change or adjustment of the relative relationship is also considered as the implementation scope of the application without substantial change in technical content.

[0073] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. All equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.

Claims

1. A dual-chip mega-sound cleaning and pre-bonding device, characterized in that, include: A frame, on which a worktable is mounted; The lower working chamber is set on the worktable and has a hollow structure with an opening at the top; the lower working chamber is equipped with a lower rotating adsorption device for adsorbing the lower sheet and rotating it; An upper working chamber is provided, which is vertically and vertically positioned above the lower working chamber via a first lifting assembly. The upper working chamber has a hollow structure with an opening at the lower end. An upper rotating adsorption device is provided inside the upper working chamber for adsorbing the upper sheet and rotating it. The mega-sound cleaning device is located in the lower working chamber and is used to perform mega-sound cleaning on the upper and lower films; The bonding device, located on the worktable, is used to press down to achieve pre-bonding of the upper and lower wafers.

2. The dual-wafer mega-sound cleaning and pre-bonding equipment according to claim 1, characterized in that, The megaphonic cleaning device includes a first rotating rod, a swing arm, and megaphonic nozzles. The first rotating rod is rotatably mounted on the workbench and located in the lower working chamber. The first rotating rod is driven to rotate by a motor. One end of the swing arm is fixed to the top of the first rotating rod, and the other end of the swing arm is provided with at least two megaphonic nozzles, which perform megaphonic cleaning in the up and down directions respectively.

3. The dual-wafer mega-sound cleaning and pre-bonding equipment according to claim 2, characterized in that, The mega-sound cleaning device further includes a second rotating rod and a mounting rod. The second rotating rod is rotatably mounted on the worktable and located in the lower working chamber. The second rotating rod is driven to rotate by a motor. One end of the mounting rod is fixed to the second rotating rod, and the other end of the mounting rod is provided with a cleaning nozzle and / or a nitrogen nozzle.

4. The dual-chip mega-sound cleaning and pre-bonding equipment according to claim 2 or 3, characterized in that, The workbench is also equipped with a first water-blocking device that works in conjunction with the megaphone cleaning device. The first water-blocking device includes a nozzle water-blocking cover. The nozzle water-blocking cover is installed on the workbench via a second lifting assembly and can move up and down. The nozzle water-blocking cover is located inside the first rotating rod / second rotating rod and can block the nozzle after being raised and lowered to a suitable position.

5. The dual-wafer mega-sound cleaning and pre-bonding equipment according to claim 1, characterized in that, The lower working chamber is also equipped with a support device, which includes several rotating shafts evenly arranged around the outer periphery of the lower rotating adsorption device. The top end of the rotating shaft is connected to one end of the upper plate placement gripper, and the other end of the upper plate placement gripper is equipped with a placement column. The lower part of the rotating shaft is equipped with a synchronous pulley, and all the synchronous pulleys are connected by a synchronous belt. The bottom end of one of the rotating shafts is connected to a motor through a coupling.

6. The dual-wafer mega-sound cleaning and pre-bonding equipment according to claim 5, characterized in that, An idler wheel that rotates freely is provided between two adjacent shafts, and the idler wheel is engaged with the timing belt for tensioning.

7. The dual-wafer mega-sound cleaning and pre-bonding equipment according to claim 5, characterized in that, The lower rotating adsorption device is also provided with a second water-blocking device on its outer periphery. The second water-blocking device includes a placement column protective cover. The placement column protective cover is arched, and the number of placement column protective covers is the same as the number of placement columns, which is used to block the placement columns. The placement column protective cover is fixed on a ring, and the ring surrounds the lower rotating adsorption device. A rotary motor that drives the ring to rotate is provided below the ring.

8. The dual-wafer mega-sound cleaning and pre-bonding equipment according to claim 1, characterized in that, The lower rotary adsorption device includes a lower suction cup, a fixed frame, and a lower motor module. The lower suction cup is rotatably mounted above the fixed frame, and the lower motor module is fixed inside the fixed frame. The bottom of the lower suction cup is provided with a lower vacuum chamber, which is connected to the output end of the lower motor module through a coupling. The upper surface of the lower suction cup is provided with several retractable positioning posts, which elastically extend and retract radially.

9. The dual-wafer mega-sound cleaning and pre-bonding device according to claim 8, characterized in that, The lower suction cup is provided with a positioning block, and the upper and lower plates are provided with positioning grooves that match the positioning block; a tilting device is provided below the worktable to tilt and lift the worktable, and the tilting device is located at the relative position of the positioning block; the positioning block can elastically extend and retract along the radial direction of the lower suction cup.

10. The dual-wafer mega-sound cleaning and pre-bonding equipment according to claim 1, characterized in that, The upper rotating adsorption device includes a connecting plate, an upper motor module, and an upper suction cup. The upper motor module is mounted on the connecting plate. The upper suction cup is provided with an upper vacuum chamber that is connected to it. The upper vacuum chamber is connected to the output end of the upper motor module through a coupling. A lampshade is also provided above the upper suction cup. The lampshade is hemispherical and has multiple infrared bulbs.

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