Glass substrate structure and semiconductor packaging substrate
By creating through slots, corner holes, and protective grooves on the glass substrate and filling them with insulating resin, the problem of glass substrate cracking caused by differences in thermal expansion coefficients was solved, achieving higher structural stability and reliability.
Patent Information
- Application Number
- CN202511241122.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-01
- Publication Date
- 2025-12-09
AI Technical Summary
During the manufacturing and cutting process, glass substrates may experience transverse cracking due to stress caused by differences in the coefficients of thermal expansion, forming microcracks that affect the structural integrity and reliability of the glass substrate.
Cutting through grooves, cutting corner holes, and protective grooves are made on the glass substrate and filled with insulating resin. The insulating resin forms a protective layer during the cutting process, preventing the spread of microcracks and reducing the area in direct contact with the cutting blade.
This effectively avoids stress cracking of glass substrates during the cutting process, reduces processing steps, and improves the structural stability and reliability of glass substrates.
Smart Images
Figure CN121096992A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor packaging technology, and more specifically to a glass substrate structure and a semiconductor packaging substrate. Background Technology
[0002] In the glass substrate processing and manufacturing process, the substrate insulating layer material uses ABF (Ajinomoto Buildup Film) with a coefficient of thermal expansion (CTE) of 20 × 10⁻⁶. -6 The coefficient of thermal expansion of copper circuits is approximately m / K, and its coefficient of thermal expansion is 17 × 10⁻⁶. -6 For the wiring layers on both sides of the FCBGA substrate core, which are composed of ABF and Cu lines, the equivalent thermal expansion coefficient of the multilayer wiring is 17×10 m / K. -6 m / K ~ 20 × 10 -6 The coefficient of thermal expansion of the glass core (material such as glass BF33) of the glass-based FCBGA substrate is between m / K, while the coefficient of thermal expansion of the glass core is 3×10. -6 Because of the large difference in thermal expansion coefficients between the multilayer wiring layers of the FCBGA substrate and the glass core in the middle region, significant stress is generated at the interface between the glass and the wiring layers. Under the tensile stress generated by the multilayer wiring layers, the glass core will crack laterally. Therefore, during the manufacturing and dicing processes, microcracks are generated at the edges of the diced glass. Under the stress between the wiring layers and the glass core, the glass core cracks, leading to the failure of the glass substrate.
[0003] Currently, after cutting the glass substrate, additional equipment is needed to coat the sides of the glass core with organic resin and solidify the structure to prevent moisture intrusion, avoid hydrogen ions in the moisture from accelerating glass crack growth, and reduce the growth of microcracks at the edges and inside the glass that could lead to cracking. This process is complex. Summary of the Invention
[0004] The purpose of this invention is to provide a glass substrate structure and a semiconductor packaging substrate for preventing cracking of the glass core board when cutting the glass substrate.
[0005] To achieve the above objectives, the present invention provides the following technical solution:
[0006] In a first aspect, the present invention provides a glass substrate structure, comprising:
[0007] A glass core board has a first side and a second side facing each other. Both the first side and the second side are covered with wiring lines. The glass core board has multiple arrayed glass core board units. There is a gap between two adjacent glass core board units. Each glass core board unit has a through-slot, a corner hole, a protective groove, and a conductive through-hole that runs through the first side and the second side. The through-slot is located at the edge of the glass core board unit. The corner hole and the protective groove are located at the corner of the glass core board unit. The corner hole and the protective groove are spaced apart from the through-slot. Each protective groove covers the space between two adjacent through-slots on the surface of the glass core board unit. The corner hole is located between two adjacent through-slots. The coverage length of each protective groove on the surface of the glass core board unit is greater than the distance between the end of the through-slot and the corner hole. The through-slot, corner hole, and protective groove are all used to fill insulating resin. The conductive through-hole is used to form an electrical connection with the wiring lines.
[0008] Optionally, in the above glass substrate structure, the distance between the end of the cutting groove and the cutting corner hole is 1mm to 5mm;
[0009] The distance between the protective groove and the cutting groove in the direction perpendicular to the edge extension direction of the cutting groove is 0.5mm to 2mm.
[0010] Optionally, in the above glass substrate structure, the protective groove is connected to the cutting corner hole.
[0011] Optionally, in the above glass substrate structure, the cross-sectional shape of the protective groove on the plane of the glass core unit includes Y-shape or V-shape.
[0012] Optionally, in the above glass substrate structure, the protective groove and the corner cutting hole are arranged alternately. The protective groove is composed of multiple first protective holes at the corner of the glass core board. The multiple first protective holes are arranged in multiple rows in an array, and the first protective holes in adjacent rows are staggered. Each first protective hole penetrates the first surface and the second surface of the glass core board, and the distance between two adjacent first protective holes is smaller than the aperture of the first protective hole.
[0013] Compared with existing technologies, when adopting the above technical solution, to ensure the structural connection strength of the glass core board unit, the corner cutting holes and protective grooves located at the corners are spaced apart from the cutting through grooves. Furthermore, each glass core board unit has cutting through grooves and corner cutting holes filled with insulating resin along its edge. This ensures that during the dicing process of the glass substrate structure, the cutting blade will preferentially cut the insulating resin filling the cutting through grooves and corner cutting holes at the edge of the corresponding glass core board unit. Since the width of the cutting through groove is greater than the width of the cutting path formed by the cutting blade when cutting the glass substrate, the cutting path is located in the cutting through groove during cutting. After cutting, the filling resin near the glass core board unit in the cutting through groove is retained as an edge protection layer for the glass core board. When cutting to the portion of the glass core board structure between the cutting through groove and the corner cutting hole, the glass at the interval between the cutting through groove and the corner cutting hole is exposed after cutting. The resulting microcracks propagate from the corner of the glass core board unit towards the center, extending to the filling insulating resin. The protective groove area of the grease prevents the micro-cracks generated during the cutting from spreading further towards the center of the glass core unit, thus avoiding glass cracking. Compared to the traditional method of cutting glass substrates, where the cutting blade directly contacts the glass material inside the substrate and organic resin is applied to the exposed glass core surface to prevent cracking, this application reduces the direct contact area between the cutting blade and the glass core during the cutting process by creating internally filled cutting grooves, corner holes, and protective grooves in the glass core inside the substrate. This allows the filling resin near the glass core unit in the cutting groove to remain after cutting, serving as a protective layer for the glass core. The protective groove also prevents micro-cracks generated by the cutting blade cutting the edge of the glass core area from spreading towards the center of the glass core unit. This eliminates the need for further resin coating to protect the glass cut surface of the substrate, reducing the risk of cracks at the edges and inside the glass after cutting the substrate structure and reducing processing steps.
[0014] In a second aspect, the present invention also provides a glass substrate structure, comprising:
[0015] A glass core board has a first side and a second side facing each other. Both the first side and the second side are covered with wiring lines. The glass core board has multiple arrayed glass core board units. There is a gap between two adjacent glass core board units. Each glass core board unit has multiple cutting slots, multiple protective slots, and conductive through holes that penetrate the first side and the second side. The multiple cutting slots are arranged around the edge of the glass core board unit. There is a connection interval between two adjacent cutting slots. A protective slot is arranged on the side of each connection interval near the conductive through hole. The protective slots are spaced apart from the cutting slots. Each protective slot covers the connection interval between two adjacent cutting slots on the surface of the glass core board unit. The coverage length of each protective slot on the surface of the glass core board unit is greater than the coverage length of the connection interval between two adjacent cutting slots on the surface of the glass core board unit. The cutting slots and protective slots are filled with insulating resin. The conductive through holes are used to form an electrical connection with the wiring lines.
[0016] Optionally, in the above glass substrate structure, the connection interval between two adjacent cut slots is 1mm to 5mm.
[0017] Optionally, in the above glass substrate structure, the distance between the protective groove and the cutting groove in the direction perpendicular to the edge extension direction of the cutting groove is 0.5mm to 2mm, and the coverage length of the protective groove on the surface of the glass core board unit is 1 to 3 times the distance between the ends of two adjacent cutting grooves.
[0018] Optionally, in the above glass substrate structure, each protective groove is a rectangular through hole parallel to the edge of the glass core plate.
[0019] Alternatively, each protective groove on the glass core board consists of multiple second protective holes. The multiple second protective holes are arranged in at least two rows along a direction parallel to the edge of the glass core board. The second protective holes in two adjacent rows are staggered in a direction parallel to the edge of the glass core board. Each second protective hole penetrates the first and second surfaces of the glass core board, and the distance between two adjacent second protective holes is less than the diameter of the second protective hole.
[0020] Compared with existing technologies, when adopting the above technical solution, to ensure the structural connection strength of the glass core board unit, multiple cutting slots are spaced apart along the edge. Since each glass core board unit has a cutting slot filled with insulating resin along its edge, during the dicing process of the glass substrate structure, the cutting blade will preferentially cut the insulating resin filled in the cutting slot at the edge of the corresponding glass core board unit. Because the width of the cutting slot is greater than the width of the cutting path formed by the cutting blade when cutting the glass substrate, the cutting path is located in the cutting slot during cutting. After cutting, the filling resin near the glass core board unit in the cutting slot is retained as a protective layer for the glass core board. When cutting to the portion of the glass core board structure between two adjacent cutting slots, the glass at the connection interval between the two adjacent cutting slots on the glass core board is exposed after cutting. The resulting microcracks propagate from the edge of the glass core board unit towards its center, extending to the insulating resin filling at the interval between the two adjacent cutting slots. The protective groove area of the grease prevents the micro-cracks generated by the cutting from spreading to the center of the glass core unit, thus avoiding glass cracking. Compared with the traditional method of cutting glass substrates, where the cutting blade directly contacts the glass material inside the glass substrate and organic resin is applied to the exposed glass core surface to prevent cracking, this application reduces the cutting area where the cutting blade directly contacts the glass core during the cutting process by creating a cutting groove and a protective groove filled with insulating resin inside the glass core. This allows the filling resin near the glass core unit in the cutting groove to remain after cutting, serving as a protective layer for the glass core. The protective groove also prevents the micro-cracks generated by the cutting blade cutting the edge of the glass core area from spreading to the center of the glass core unit. There is no need to apply resin to protect the glass cut surface of the glass substrate, reducing the risk of cracks at the edges and inside the glass after cutting the glass substrate structure and reducing processing steps.
[0021] Thirdly, the present invention provides a semiconductor packaging substrate, comprising:
[0022] Glass substrate, wherein the glass substrate has a glass substrate structure as described in any of the above.
[0023] An insulating layer covers the first and second surfaces of the glass core board, and the insulating layer has metallized blind holes.
[0024] Multiple wiring layers, each with wiring lines, are sequentially covered on the side of the insulating layer away from the glass core. Electrical connections are formed between the metallized blind vias, wiring lines, and conductive vias.
[0025] The beneficial effects of the semiconductor packaging substrate provided in the third aspect are the same as those of the glass substrate structure described in the first aspect and the glass substrate structure described in the second aspect, and will not be repeated here. Attached Figure Description
[0026] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:
[0027] Figure 1 This is a schematic diagram of the structure of a semiconductor packaging substrate provided in an embodiment of the present invention;
[0028] Figure 2 for Figure 1 A schematic diagram of the first type of glass substrate structure in the AA-direction cross-section;
[0029] Figure 3 for Figure 2 A structural schematic diagram of a glass core panel unit;
[0030] Figure 4 for Figure 1 A schematic diagram of the second type of glass substrate structure in the AA-direction cross-section;
[0031] Figure 5 for Figure 4 A structural schematic diagram of a glass core panel unit;
[0032] Figure 6 for Figure 1 A schematic diagram of the third type of glass substrate structure in the AA-direction cross-section;
[0033] Figure 7 for Figure 6 A schematic diagram of the structure of a glass core board unit.
[0034] Figure label:
[0035] 1-Glass core board; 11-Cut through slot; 12-Cut corner hole; 13-Protective groove; 131-First protective hole; 14-Conductive through hole; 15-Alignment mark; 2-Insulating layer; 3-Metallized blind hole; 4-Wiring layer; 5-Solder resist layer; 6-Solder ball; 7-Buffer layer. Detailed Implementation
[0036] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.
[0037] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.
[0039] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0041] like Figures 1-3As shown, an embodiment of the present invention provides a glass substrate structure including a glass core plate 1. The glass core plate 1 has a first side and a second side facing each other. Both the first side and the second side are covered with wiring lines. The glass core plate 1 has a plurality of arrayed glass core plate units. There is a gap between two adjacent glass core plate units. Each glass core plate unit has a through-cut groove 11, a corner hole 12, a protective groove 13 and a conductive through-hole 14 that penetrate the first side and the second side. The through-cut groove 11 is located at the edge of the glass core plate unit. The corner hole 12 and the protective groove 13 are both located at the corner of the glass core plate unit. The corner hole 12 and the protective groove 13 are spaced apart from the through-cut groove 11. The coverage length of the protective groove 13 on the surface of the glass core plate unit is greater than the distance between the end of the through-cut groove 11 and the corner hole 12. The through-cut groove 11, the corner hole 12 and the protective groove 13 are all used to fill insulating resin. The conductive through-hole 14 is used to form an electrical connection with the wiring lines.
[0042] In specific implementation, such as Figure 2 As shown, to ensure the structural connection strength of the glass core board unit, the corner cutting holes 12 and protective grooves 13 located at the corners are spaced apart from the cutting through grooves 11. Since each glass core board unit has cutting through grooves 11 and corner cutting holes 12 filled with insulating resin along its edge, during the dicing process of the glass substrate structure, the cutting blade will preferentially cut the insulating resin filling the cutting through grooves 11 and corner cutting holes 12 at the edge of the corresponding glass core board unit. When cutting to the portion of the glass core board 1 structure between the cutting through grooves 11 and corner cutting holes 12, the resulting microcracks propagate from the corner of the glass core board unit towards the center, extending to the area of the protective groove 13 filled with insulating resin. The insulating resin inside the protective groove 13 can prevent the microcracks generated by the dicing from continuing to propagate towards the glass core board. The glass core plate unit diffuses at its center. Compared to the traditional method of cutting glass substrates, where the cutting blade directly contacts the glass material inside the glass substrate and organic resin is coated on the exposed glass core plate 1 surface to prevent cracking, this application reduces the cutting area where the cutting blade directly contacts the glass core plate 1 during the cutting process by opening a cutting through groove 11, a cutting corner hole 12, and a protective groove 13 filled with insulating resin inside the glass core plate 1. The protective groove 13 prevents microcracks generated by the cutting blade cutting the edge of the glass core plate 1 from spreading to the center area of the glass core plate unit. There is no need to coat the glass substrate with resin to protect the glass cutting surface, reducing the risk of cracks at the edges and inside the glass after cutting the glass substrate structure and reducing processing steps.
[0043] like Figure 2 and Figure 3As shown, specifically, in this embodiment, the distance between the end of the cutting groove 11 and the cutting corner hole 12 is 1mm to 5mm. For example, the distance L1 between the end of the cutting groove 11 and the cutting corner hole 12 can be 1mm, 1.2mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 5mm, etc. With this configuration, when the distance L1 between the end of the cutting groove 11 and the cutting corner hole 12 is greater than 1mm, the area of the glass connection structure between the end of the cutting groove 11 and the cutting corner hole 12 meets the structural support strength for the central area of the glass core unit, avoiding the risk of breakage at the interval between the end of the cutting groove 11 and the cutting corner hole 12; when the distance L1 between the end of the cutting groove 11 and the cutting corner hole 12 is less than 5mm, it ensures that the length of the glass connection structure in contact between the end of the cutting groove 11 and the cutting corner hole 12 during the cutting process is short, reducing the length of cracks generated at the edge of the corresponding glass core unit. Considering that both excessively large and excessively small spacing L1 between the end of the cutting groove 11 and the cutting corner hole 12 will have adverse effects, the spacing L1 between the end of the cutting groove 11 and the cutting corner hole 12 is selected to be 1mm to 5mm. This ensures both the connection strength between the end of the cutting groove 11 and the cutting corner hole 12 and a short contact length between the cutting blade and the glass connection structure, further reducing the risk of cracks at the glass edge of the glass substrate.
[0044] like Figure 2 and Figure 3 As shown, specifically in this embodiment, the protective groove 13 is connected to the cutting corner hole 12. With this configuration, the operator can directly fill the integrated structure formed by the connection between the protective groove 13 and the cutting corner hole 12 with insulating resin, reducing processing steps. It is sufficient to ensure that the coverage length L2 of the protective groove 13 on the glass core board 1 is greater than the distance L1 between the end of the cutting groove 11 and the cutting corner hole 12. When the cutting blade cuts into the gap area between the end of the cutting groove 11 and the cutting corner hole 12, the direct contact between the cutting blade and the glass in the gap area easily generates microcracks. As the microcracks extend towards the center area of the glass core board unit, because the coverage length L2 of the protective groove 13 on the glass core board 1 is greater than the distance L1 between the end of the cutting groove 11 and the cutting corner hole 12, the microcracks cannot continue to extend towards the center area of the glass core board unit, thus protecting the internal structure of the glass core board unit.
[0045] like Figure 3As shown, specifically in this embodiment, the distance between the protective groove 13 and the cutting groove 11 in the direction perpendicular to the edge extension direction of the cutting groove 11 is 0.5mm to 2mm. For example, the distance L3 between the protective groove 13 and the cutting groove 11 in the direction perpendicular to the edge extension direction of the cutting groove 11 can be 0.5mm, 0.8mm, 1mm, 1.2mm, 1.5mm, 1.7mm, 1.8mm, 2mm, etc., and the operator can select different distances L3 between the protective groove 13 and the cutting groove 11 according to the actual size of the glass core board unit being processed. With this configuration, during the glass connection process between the end of the cutting groove 11 and the cutting corner hole 12, when the distance L3 between the protective groove 13 and the cutting groove 11 in the direction perpendicular to the edge extension direction of the cutting groove 11 is greater than 0.5mm, the glass connection structure area of the protective groove 13 and the cutting groove 11 meets the structural support strength for the central area of the glass core unit, avoiding the risk of breakage at the interval between the protective groove 13 and the cutting groove 11; when the distance L3 between the protective groove 13 and the cutting groove 11 in the direction perpendicular to the edge extension direction of the cutting groove 11 is less than 2mm, after a micro-crack occurs in the glass connection structure between the end of the cutting groove 11 and the cutting corner hole 12 during the cutting process, the protective groove 13 can promptly prevent the micro-crack from continuing to extend to the central area of the glass core unit, reducing the length of the crack generated in the corner area of the corresponding glass core unit. Considering that both excessively large and excessively small spacing L3 between the protective groove 13 and the cutting groove 11 in the direction perpendicular to the edge extension direction of the cutting groove 11 will have adverse effects, the spacing L3 between the protective groove 13 and the cutting groove 11 in the direction perpendicular to the edge extension direction of the cutting groove 11 is selected to be 0.5mm to 2mm. This ensures the connection strength between the protective groove 13 and the cutting groove 11, extending the service life of the glass substrate, and also ensures that the protective groove 13 can promptly block the propagation of microcracks after the cutting blade contacts the glass connection structure, further reducing the risk of cracks in the glass substrate.
[0046] like Figure 2 and Figure 3As shown, specifically, in this embodiment, the cross-sectional shape of the protective groove 13 on the plane of the glass core board unit includes a Y-shape or a V-shape. Specifically, the cross-sectional shape refers to the profile of the cross-section formed by horizontally cutting the protective groove 13 with a plane parallel to the plane of the glass core board unit; the Y-shaped protective groove 13 has three strip-shaped through-slots extending in different directions. One of these slots, facing the corner of the glass core board 1 structure, connects the Y-shaped protective groove 13 with the corresponding corner cutting hole 12 to form an integral structure. The other two slots extending in different directions are parallel to the edge extension direction of the corresponding glass core board 1 structure. The V-shaped protective groove 13 has two strip-shaped through-slots extending in different directions. The intersection area of the through grooves faces the corner of the glass core board 1 structure, and the intersection area of the two through grooves is connected with the corresponding cutting corner hole 12 to form an integral structure. Of course, the cross-sectional shape of the protective groove 13 can also adopt other structures, as long as the coverage length L2 of the protective groove 13 on the glass core board 1 is greater than the distance L1 between the end of the cutting through groove 11 and the cutting corner hole 12. With this setting, it can be ensured that the protective groove 13 can promptly block the continued propagation of microcracks to the center area of the glass core board unit after the cutting blade contacts the glass connection structure, thereby reducing the risk of cracking of the glass substrate.
[0047] like Figure 4 and Figure 5As shown, in some embodiments, the protective groove 13 and the corner cutting hole 12 are spaced apart. The protective groove 13 at the corner of the glass core plate 1 is composed of a plurality of first protective holes 131. The plurality of first protective holes 131 are arranged in multiple rows at intervals, and the first protective holes 131 in adjacent rows are staggered. Each first protective hole 131 penetrates the first surface and the second surface of the glass core plate 1, and the distance between two adjacent first protective holes 131 is less than the aperture of the first protective hole 131. Specifically, the operator can select the distance L4 between two adjacent first protective holes 131 to be less than the aperture d of the first protective hole 131 according to the actual size of each glass core plate unit on the glass substrate being processed. As long as the distance L4 between two adjacent first protective holes 131 and the aperture d of the first protective hole 131 can provide sufficient connection strength for the corner of the corresponding glass core plate unit, no specific limitation is made here. The array arrangement of multiple first protective holes 131 at the corners of the glass core board 1 can be T-shaped, rectangular, Y-shaped, or other distribution shapes. Of course, other array arrangements of the multiple first protective holes 131 at the corners of the glass core board 1 are also possible, as long as the length L5 of the area covered by the multiple first protective holes 131 on the glass core board 1 is greater than the distance L1 between the end of the cutting groove 11 and the cutting corner hole 12. With this arrangement, since the multiple first protective holes 131 are arrayed at the corners of the glass core board unit, and the distance L4 between two adjacent first protective holes 131 is less than the aperture d of the first protective hole 131, an interwoven covering area is formed at the corners of the glass core board unit to block the propagation of multi-directional cracks. This ensures that microcracks generated during the glass connection process between the end of the cutting groove 11 and the cutting corner hole 12 will be blocked by a first protective hole 131 filled with insulating resin, regardless of the direction of propagation, thus reducing the risk of cracking in the glass substrate.
[0048] like Figure 6 and Figure 7As shown, the present invention also provides another glass substrate structure, including a glass core plate 1. The glass core plate 1 has a first surface and a second surface facing each other. Both the first surface and the second surface are covered with wiring lines. The glass core plate 1 has a plurality of arrayed glass core plate units. There is a gap between two adjacent glass core plate units. Each glass core plate unit has a multi-segment cutting groove 11, a multi-segment protective groove 13, and a conductive through hole 14 that penetrate the first surface and the second surface. The multi-segment cutting groove 11 is arranged around the edge of the glass core plate unit, and there is a connection between two adjacent cutting grooves 11. Each connection interval has a corresponding protective groove 13 on the side near the conductive through hole 14. The protective groove 13 is spaced apart from the cutting through groove 11. Each protective groove 13 covers the connection interval of two adjacent cutting through grooves 11 on the surface of the glass core board unit, and the coverage length of each protective groove 13 on the surface of the glass core board unit is greater than the coverage length of the connection interval of two adjacent cutting through grooves 11 on the surface of the glass core board unit. Both the cutting through groove 11 and the protective groove 13 are used to fill the insulating resin. The conductive through hole 14 is used to form an electrical connection with the wiring line.
[0049] In specific implementation, such as Figure 6As shown, to ensure the structural connection strength of the glass core board unit, multiple cutting slots 11 are spaced apart along the edge, and each glass core board unit has a cutting slot 11 filled with insulating resin along its edge. This ensures that during the dicing process of the glass substrate structure, the cutting blade will preferentially cut the insulating resin filled in the cutting slot 11 at the edge of the corresponding glass core board unit. Since the width of the cutting slot 11 is greater than the width of the cutting path formed by the cutting blade when cutting the glass substrate, the cutting path is located in the cutting slot 11 during cutting. After cutting, the filling resin near the glass core board unit in the cutting slot 11 is retained as an edge protection layer for the glass core board 1. When cutting to the portion of the glass core board 1 structure between two adjacent cutting slots 11, the glass at the connection interval between two adjacent cutting slots 11 on the glass core board 1 is exposed after cutting. The resulting microcracks propagate from the edge of the glass core board unit towards the center of the glass core board unit, extending to the protective groove 1 filled with insulating resin corresponding to the interval between two adjacent cutting slots 11. In the third region, the insulating resin inside the protective groove 13 can prevent the micro-cracks generated by the cutting from spreading further to the center of the glass core board unit, thus avoiding glass cracking. Compared with the traditional method of cutting glass substrates, where the cutting blade directly contacts the glass material inside the glass substrate and organic resin is coated on the exposed surface of the glass core board 1 to prevent glass cracking, this application reduces the cutting area where the cutting blade directly contacts the glass core board 1 during the cutting process by opening the cutting through groove 11 and the protective groove 13 filled with insulating resin inside the glass core board 1. This allows the filling resin near the glass core board unit in the cutting through groove 11 to remain after cutting, serving as an edge protection layer for the glass core board 1. The protective groove 13 prevents the micro-cracks generated by the cutting blade cutting the edge of the glass core board 1 from spreading to the center of the glass core board unit. There is no need to coat the glass substrate with resin to protect the glass cut surface, reducing the risk of cracks at the edges and inside of the glass after cutting the glass substrate structure and reducing processing steps.
[0050] like Figure 6 and Figure 7As shown, specifically in this embodiment, the connection interval between two adjacent cutting slots 11 is 1mm to 5mm. For example, the connection interval L6 between two adjacent cutting slots 11 can be 1mm, 1.1mm, 1.3mm, 1.5mm, 1.6mm, 1.8mm, 2mm, 3mm, 3.5mm, 4mm, 5mm, etc. The operator can select cutting slots 11 with different length intervals according to the edge size of each glass core board unit on the actual glass substrate being processed. That is, two, three, or five cutting slots 11 can be provided on the edge of the corresponding glass core board unit, as long as the connection interval L6 between two adjacent cutting slots 11 can provide sufficient connection strength for the edge of the corresponding glass core board unit. In this design, two adjacent cutting slots 11 at the corner of the corresponding glass core board unit are connected to form an L-shaped slot. When the connection interval L6 between two adjacent cutting slots 11 is greater than 1mm, the area of the glass connection structure formed between the two adjacent cutting slots 11 at the edge of the corresponding glass core board unit meets the structural support strength for the central area of the glass core board unit, avoiding the risk of breakage at the interval between the two adjacent cutting slots 11. When the connection interval L6 between two adjacent cutting slots 11 is less than 5mm, it can be ensured that the length of the glass connection structure contacted by the cutting blade at the connection interval between the two adjacent cutting slots 11 during the cutting process is short, reducing the length of cracks generated at the edge of the corresponding glass core board unit. Considering that both excessively large and excessively small connection intervals L6 between two adjacent cutting slots 11 will have adverse effects, the connection interval L6 between two adjacent cutting slots 11 is selected to be 1mm to 5mm. This ensures the connection strength between two adjacent cutting slots 11 at the edge of the glass core unit, extending the service life of the glass substrate, while also ensuring a short contact length between the cutting blade and the glass connection structure, further reducing the risk of cracks at the glass edge of the glass substrate.
[0051] like Figure 6 and Figure 7As shown, specifically, in this embodiment, the distance between the protective groove 13 and the cutting groove 11 in the direction perpendicular to the edge extension direction of the cutting groove 11 is 0.5mm to 2mm. For example, the distance L3 between the protective groove 13 and the cutting groove 11 in the direction perpendicular to the edge extension direction of the cutting groove 11 can be 0.5mm, 1mm, 1.2mm, 1.5mm, 1.8mm, 2mm, etc. The operator can select different distances L3 between the protective groove 13 and the cutting groove 11 according to the actual size of the glass core board unit being processed. As long as the connection strength between the protective groove 13 and the cutting groove 11 is guaranteed, and the protective groove 13 can promptly block the propagation of microcracks after the cutting blade contacts the glass connection structure, this setting reduces the length of crack propagation from the edge area of the corresponding glass core board unit to the center area, ensuring the stability and reliability of the glass substrate structure.
[0052] like Figure 6 and Figure 7 As shown, specifically, in this embodiment, the coverage length of the protective groove 13 on the surface of the glass core board unit is 1 to 3 times the distance between the ends of two adjacent cutting slots 11. For example, the coverage length L2 of the protective groove 13 on the surface of the glass core board unit is 1, 1.2, 1.3, 1.5, 1.7, 1.8, 2, 2.5, 3 times, etc., of the distance L6 between the ends of two adjacent cutting slots 11, as long as the coverage length L2 of the protective groove 13 on the surface of the glass core board unit is greater than the distance L6 between the ends of two adjacent cutting slots 11. With this configuration, when the cutting blade cuts to the connection interval between two adjacent cutting slots 11, the direct contact between the cutting blade and the glass at the connection interval can easily generate microcracks. As the microcracks extend towards the central area of the glass core unit, the protective groove 13 covers the surface of the glass core unit with a length L2 that is always greater than the distance L6 between the ends of the two adjacent cutting slots 11. This prevents the microcracks from continuing to extend towards the central area of the glass core unit, thus protecting the internal structure of the glass core unit.
[0053] like Figure 6 and Figure 7As shown, specifically in this embodiment, each protective groove 13 is a rectangular through hole parallel to the edge of the glass core board 1. Specifically, the width L7 of the protective groove 13 in the direction perpendicular to the edge extension direction of the cutting through groove 11 is 0.5mm to 2mm. For example, the width L7 of the protective groove 13 in the direction perpendicular to the edge extension direction of the cutting through groove 11 can be 0.5mm, 1mm, 1.2mm, 1.5mm, 1.7mm, 1.9mm, 2mm, etc. The operator can select the width L7 of the protective groove 13 in the direction perpendicular to the edge extension direction of the cutting through groove 11 according to the actual size of the glass core board unit being processed. Of course, each protective groove 13 can also adopt a waist-shaped through hole or other through hole structure parallel to the edge of the glass core board 1, as long as it can be ensured that the propagation of microcracks can be blocked in time after the cutting blade contacts the glass connection structure. This setting reduces the risk of cracking of the glass substrate structure during the cutting process and ensures the stability and reliability of the glass substrate structure.
[0054] In some embodiments, each protective groove 13 consists of a plurality of second protective holes on the glass core plate 1. These second protective holes are arranged in at least two rows at intervals along a direction parallel to the edge of the glass core plate 1. Adjacent rows of second protective holes are staggered along the direction parallel to the edge of the glass core plate 1. Each second protective hole penetrates both the first and second surfaces of the glass core plate 1, and the distance between two adjacent second protective holes is less than the diameter of the second protective hole. Specifically, the arrangement along the direction parallel to the edge of the glass core plate 1 can be in two, three, or four rows, etc. There are no specific limitations on the distance between two adjacent second protective holes or the diameter of the second protective holes, as long as the coverage length of the staggered second protective holes on the glass core plate 1 is greater than the connection interval L6 between the corresponding two adjacent cutting grooves 11. With this configuration, multiple second protective holes are staggered at the connection interval between two adjacent cutting slots 11 to form a continuous coverage area that can prevent microcracks from spreading to the central area of the glass core unit. When the cutting blade cuts to the connection interval between two adjacent cutting slots 11, the microcracks generated by the direct contact between the cutting blade and the glass at the connection interval extend towards the central area of the glass core unit. Since the continuous coverage area of the protective groove 13 on the surface of the glass core unit is always larger than the distance L6 between the ends of the two adjacent cutting slots 11, the microcracks cannot continue to extend towards the central area of the glass core unit after spreading to the protective groove 13, thus protecting the internal structure of the glass core unit.
[0055] Meanwhile, the present invention also provides a semiconductor packaging substrate, comprising: a glass substrate, an insulating layer 2 and a plurality of wiring layers 4.
[0056] The glass substrate is a glass substrate structure as described in any of the above embodiments; the insulating layer 2 covers the first and second surfaces of the glass core plate 1, and the insulating layer 2 has metallized blind holes 3; each wiring layer 4 has wiring lines, and multiple wiring layers 4 sequentially cover the side of the insulating layer 2 away from the glass core plate 1, and an electrical connection is formed between the metallized blind holes 3, the wiring lines and the conductive vias 14.
[0057] In specific implementation, such as Figure 1 As shown, after the glass substrate is processed, the operator uses a cutting blade to cut along the cutting groove 11 at the edge of each glass core board unit. During the cutting process, the filling resin near the glass core board unit in the cutting groove 11 or the cutting corner hole 12 is retained as the edge protection layer of the glass core board 1. Only the glass located at the interval between the cutting groove 11 and the cutting corner hole 12 or at the interval between two adjacent cutting grooves 11 is cut and exposed. The cracks generated by cutting the glass in this area cannot extend to the center area of the glass core board unit after reaching the protective groove 13. Most of the cutting trajectory is within the area of the filled insulating resin. After the cutting is completed, the glass structure in the gap between the remaining two adjacent glass core board units is retained only after the glass core board unit is cut to continue the metallization blind hole 3 and wiring. The semiconductor packaging substrate in this application reduces the direct contact area between the cutting blade and the glass core board 1 during the cutting process by using a cutting groove 11 and a protective groove 13 at the edge of the glass substrate itself. This allows the filling resin in the cutting groove 11 near the glass core board unit to remain after cutting, serving as an edge protection layer for the glass core board 1. This eliminates the need for a resin coating process after cutting, thus protecting the glass cut surface without the need for a resin coating process. In the event of cracks in the glass substrate during cutting, this avoids the risk of cracking at the edge and inside of the glass after cutting, reducing the number of processing steps.
[0058] It should be noted that the semiconductor packaging substrate also has a structure of solder mask layer 5, solder balls 6, and buffer layer 7. Solder mask layer 5 is located on the side of wiring layer 4 away from the glass substrate. During processing, the exposed metal pads on the surface of solder mask layer 5 are formed into solder balls 6 through a ball-planting process. Simultaneously, the glass core board 1 has alignment marks 15 to facilitate cutting of the glass core board units by operators. Buffer layer 7 is located within the conductive vias 14 of the glass core board 1, used to reduce stress at the contact interface between the conductive vias 14 and the glass core board 1, preventing via cracking and ensuring the structural reliability and stability of the semiconductor packaging substrate.
[0059] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0060] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. A glass substrate structure, characterized in that, include: A glass core board has a first side and a second side facing each other. Both the first side and the second side are covered with wiring lines. The glass core board has multiple arrayed glass core board units. There is a gap between two adjacent glass core board units. Each glass core board unit has a through-slot, a corner hole, a protective groove, and a conductive through-hole that penetrate the first side and the second side. The through-slot is located at the edge of the glass core board unit. The corner hole and the protective groove are located at the corner of the glass core board unit. The protective groove and the corner hole are spaced apart from the through-slot. Each protective groove covers the space between two adjacent through-slots on the surface of the glass core board unit. The corner hole is located between two adjacent through-slots. The coverage length of each protective groove on the surface of the glass core board unit is greater than the distance between the end of the through-slot and the corner hole. The through-slot, the corner hole, and the protective groove are all filled with insulating resin. The conductive through-hole is used to form an electrical connection with the wiring lines.
2. The glass substrate structure according to claim 1, characterized in that, The distance between the end of the cutting through groove and the cutting corner hole is 1mm to 5mm; The distance between the protective groove and the cutting groove in a direction perpendicular to the edge extension direction of the cutting groove is 0.5mm to 2mm.
3. The glass substrate structure according to claim 1, characterized in that, The protective groove is connected to the cutting corner hole.
4. The glass substrate structure according to claim 3, characterized in that, The cross-sectional shape of the protective groove on the plane of the glass core board unit includes Y-shape or V-shape.
5. The glass substrate structure according to claim 1, characterized in that, The protective groove is spaced apart from the cutting corner hole. The protective groove is composed of multiple first protective holes at the corner of the glass core board. The multiple first protective holes are arranged in multiple rows in an array, and the first protective holes in adjacent rows are staggered. Each first protective hole penetrates the first and second surfaces of the glass core board, and the distance between two adjacent first protective holes is smaller than the diameter of the first protective hole.
6. A glass substrate structure, characterized in that, include: A glass core board has a first side and a second side facing each other. Both the first side and the second side are covered with wiring lines. The glass core board has multiple arrayed glass core board units. There is a gap between two adjacent glass core board units. Each glass core board unit has multiple cutting slots, multiple protective slots, and conductive through holes that penetrate the first side and the second side. The multiple cutting slots are arranged around the edge of the glass core board unit. There is a connection interval between two adjacent cutting slots. Each connection interval has a corresponding protective slot on the side near the conductive through hole. The protective slots are spaced apart from the cutting slots. Each protective slot covers the connection interval between two adjacent cutting slots on the surface of the glass core board unit. The coverage length of each protective slot on the surface of the glass core board unit is greater than the coverage length of the connection interval between two adjacent cutting slots on the surface of the glass core board unit. The cutting slots and protective slots are filled with insulating resin. The conductive through holes are used to form an electrical connection with the wiring lines.
7. The glass substrate structure according to claim 6, characterized in that, The connection interval between two adjacent cutting slots is 1mm to 5mm.
8. The glass substrate structure according to claim 6, characterized in that, The distance between the protective groove and the cutting groove in a direction perpendicular to the edge extension direction of the cutting groove is 0.5mm to 2mm, and the coverage length of the protective groove on the surface of the glass core board unit is 1 to 3 times the distance between the ends of two adjacent cutting grooves.
9. The glass substrate structure according to claim 6, characterized in that, Each of the aforementioned protective grooves is a rectangular through hole parallel to the edge of the glass core board; Alternatively, each of the protective grooves on the glass core board is composed of a plurality of second protective holes. The plurality of second protective holes are arranged in at least two rows at intervals along a direction parallel to the edge of the glass core board. The second protective holes in two adjacent rows are staggered in a direction parallel to the edge of the glass core board. Each second protective hole penetrates the first and second surfaces of the glass core board, and the distance between two adjacent second protective holes is less than the aperture of the second protective hole.
10. A semiconductor packaging substrate, characterized in that, include: A glass substrate, wherein the glass substrate is the glass substrate structure as described in any one of claims 1 to 5 or the glass substrate structure as described in any one of claims 6 to 9; An insulating layer covers the first and second surfaces of the glass core plate, and the insulating layer has metallized blind holes. Multiple wiring layers, each having the wiring lines, the multiple wiring layers sequentially covering the side of the insulating layer away from the glass core, and an electrical connection is formed between the metallized blind vias, the wiring lines and the conductive vias.