Heat dissipation assembly and electronic equipment

Abstract

The invention relates to a heat dissipation assembly and electronic equipment. The heat dissipation assembly comprises a drainage structure, a jet flow impact structure and a heat dissipation structure. The drainage structure is provided with a drainage channel. The jet flow impact structure is connected with the drainage structure, the jet flow impact structure is provided with a plurality of jet flow impact holes, the jet flow impact holes are sequentially formed in the extending direction of the drainage channel, and all the jet flow impact holes communicate with the drainage channel. The heat dissipation structure is connected with the jet flow impact structure, the heat dissipation structure is located on the side, away from the drainage structure, of the jet flow impact structure, all the jet flow impact holes are opposite to the heat dissipation structure, and the heat dissipation structure is used for abutting against the electronic component. According to the heat dissipation assembly, when the electronic component is subjected to heat dissipation, the cooling liquid enters the drainage channel and impacts the heat dissipation structure through the scattered flow impact holes, the turbulence intensity of the cooling liquid can be increased, the boundary layer of the near wall face can be damaged, accumulated heat of the near wall face can be taken away, and the good heat dissipation capacity is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment heat dissipation, in particular to a heat dissipation assembly and electronic equipment. BACKGROUND

[0002] Electronic components, electronic components, for example, power devices such as IGBT, as the core components of electronic equipment, due to the high temperature during work, the current output capacity and service life and other performances will be reduced to varying degrees. Therefore, the electronic equipment needs to reduce the working temperature of the electronic component in time to ensure that the electronic component can work normally.

[0003] In the related art, the heat dissipation mode of the electronic component includes liquid cooling mode and air cooling mode. Among them, for the liquid cooling mode, the heat dissipation principle is to take away a large amount of heat through the cooling liquid as the main heat dissipation form. However, with the gradual increase of the heat generation of the electronic component, the heat dissipation capacity of the heat dissipation assembly for the electronic component in the related art cannot meet the demand, and the heat dissipation effect is poor. SUMMARY

[0004] Therefore, it is necessary to provide a heat dissipation assembly and electronic equipment which can improve the heat dissipation effect for at least one problem in the prior art.

[0005] In one aspect, the present application provides a heat dissipation assembly, which comprises:

[0006] A flow guide structure is provided with a flow guide channel;

[0007] A jet impact structure is connected with the flow guide structure, the jet impact structure is provided with a plurality of jet impact holes, the plurality of jet impact holes are sequentially arranged along the extension direction of the flow guide channel, and each jet impact hole is in communication with the flow guide channel; and

[0008] A heat dissipation structure is connected with the jet impact structure, the heat dissipation structure is located on the side of the jet impact structure away from the flow guide structure, each jet impact hole is arranged opposite to the heat dissipation structure, and the heat dissipation structure is used for abutting against the electronic component.

[0009] In one embodiment, the flow guide structure is provided with a liquid inlet and a shunt channel; the flow guide channel is provided as at least two, the liquid inlet is in communication with the shunt channel, and at least two flow guide channels are arranged in parallel and spaced apart and are in communication with the shunt channel; each flow guide channel corresponds to a plurality of jet impact holes.

[0010] In one of the embodiments, a cavity is formed on the side of the jet impact structure facing the heat dissipation structure, the cavity is concave in the direction away from the heat dissipation structure, and the cavity is in communication with the jet impact hole.

[0011] In one of the embodiments, the jet impact structure is further provided with a first backflow channel; the flow guide structure is further provided with a second backflow channel and a liquid outlet, the cavity is in communication with the first backflow channel, the first backflow channel is in communication with the second backflow channel, and the second backflow channel is in communication with the liquid outlet.

[0012] In one of the embodiments, the at least two flow guide channels include two first flow guide channels; the flow distribution channel includes a first flow distribution section; the liquid inlet is in communication with the middle part of the first flow distribution section, and the opposite ends of the first flow distribution section are in one-to-one correspondence with one end of the two first flow guide channels, respectively.

[0013] In one of the embodiments, the at least two flow guide channels further include a second flow guide channel, the second flow guide channel is located between the two first flow guide channels; the flow distribution channel further includes a second flow distribution section, the second flow distribution section is arranged in parallel with the first flow distribution section, and the second flow guide channel is in communication with the middle part of the second flow distribution section.

[0014] In one of the embodiments, the central axis of the jet impact hole is arranged at an angle with the wall surface of the heat dissipation structure; the angle between the central axis of the jet impact hole and the wall surface of the heat dissipation structure is a, and 45°≤a≤90°.

[0015] In one of the embodiments, the flow guide structure includes a flow guide plate; the jet impact structure includes a jet impact plate; the heat dissipation structure includes a heat dissipation plate; the flow guide plate, the jet impact plate and the heat dissipation plate are connected in the thickness direction of the flow guide plate.

[0016] In one of the embodiments, at least two of the flow guide structure, the jet impact structure and the heat dissipation structure are integrated structures; or, the flow guide structure, the jet impact structure and the heat dissipation structure are separate structures and can be detachably connected.

[0017] On the other hand, the application further provides an electronic device, which comprises the heat dissipation assembly.

[0018] The heat dissipation assembly and the electronic device have the advantages that when the electronic components are cooled, the cooling liquid enters the flow guide channel and impacts the heat dissipation structure through the jet impact hole, the turbulent intensity of the cooling liquid is increased, and the boundary layer near the wall surface is destroyed, so that the accumulated heat near the wall surface is taken away, and the heat dissipation capacity is good. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0020] Figure 2 A sectional view of a heat dissipation assembly according to an embodiment of the present application. Figure 1 A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0021] Figure 3 A sectional view of a heat dissipation assembly according to an embodiment of the present application. Figure 2 A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0022] Figure 4 A sectional view of a heat dissipation assembly according to an embodiment of the present application. A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0023] A sectional view of a heat dissipation assembly according to an embodiment of the present application. Figure 5 A sectional view of a heat dissipation assembly according to an embodiment of the present application. A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0024] A sectional view of a heat dissipation assembly according to an embodiment of the present application. Figure 6 A sectional view of a heat dissipation assembly according to an embodiment of the present application. A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0025] A sectional view of a heat dissipation assembly according to an embodiment of the present application. Figure 7 A sectional view of a heat dissipation assembly according to an embodiment of the present application. A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0026] A sectional view of a heat dissipation assembly according to an embodiment of the present application. Figure 8 A sectional view of a heat dissipation assembly according to an embodiment of the present application. A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0027] A sectional view of a heat dissipation assembly according to an embodiment of the present application. Figure 9 A sectional view of a heat dissipation assembly according to an embodiment of the present application. A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0028] A sectional view of a heat dissipation assembly according to an embodiment of the present application. Figure 10 A sectional view of a heat dissipation assembly according to an embodiment of the present application. A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0029] A sectional view of a heat dissipation assembly according to an embodiment of the present application. A sectional view of a heat dissipation assembly according to an embodiment of the present application.

[0030] 10, flow guide structure; 11, flow guide channel; 111, first flow guide channel; 112, second flow guide channel; 12, liquid inlet; 13, flow distribution channel; 131, first flow distribution section; 132, second flow distribution section; 14, liquid outlet; 15, second backflow channel; 20, jet impact structure; 21, jet impact hole; 22, chamber; 23, first backflow channel; 30, heat dissipation structure; 40, electronic component. DETAILED DESCRIPTION

[0031] In order to make the above objectives, characteristics and advantages of the present application more apparent, concrete embodiments of the present application will be described in detail below with reference to the drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of ways other than those specifically described herein, and the present application is not limited to the embodiments described below. It is to be understood that other embodiments can be employed and that structural and functional modifications can be made without departing from the scope of the present application.

[0032] As described in the background, the heat dissipation capacity of the heat dissipation assembly for electronic components in the related art cannot meet the demand, and the heat dissipation effect is poor. The reason for this problem is that the structure design of the heat dissipation assembly and the flow behavior of the cooling liquid in the heat dissipation cavity determine the heat dissipation performance. The principle of enhancing heat dissipation in the related art focuses on increasing the heat dissipation surface area. However, the turbulent intensity of the cooling liquid in the heat dissipation assembly is low, and the heat dissipation uniformity is low, so that the heat dissipation effect cannot be improved.

[0033] Based on the above reasons, the present application provides a heat dissipation assembly and electronic equipment which can improve the heat dissipation effect.

[0034] Reference Figures 1 to 3 , Figure 1 A cross-sectional structure diagram of the heat dissipation assembly according to an embodiment of the present application is shown. Figure 2 A Figure 1 An exploded structure diagram of the heat dissipation assembly is shown. Figure 3 A Figure 2 A structure diagram of the heat dissipation structure 30 in the heat dissipation assembly is shown. The heat dissipation assembly provided by an embodiment of the present application includes a flow guide structure 10, a jet impact structure 20 and a heat dissipation structure 30.

[0035] The flow guide structure 10 is provided with a flow guide channel 11.

[0036] The jet impact structure 20 is connected with the flow guide structure 10, and the jet impact structure 20 is provided with a plurality of jet impact holes 21. The plurality of jet impact holes 21 are sequentially arranged along the extension direction of the flow guide channel 11, and each jet impact hole 21 is in communication with the flow guide channel 11.

[0037] The heat dissipation structure 30 is connected with the jet impact structure 20, and the heat dissipation structure 30 is located on the side of the jet impact structure 20 away from the flow guide structure 10. Each jet impact hole 21 is oppositely arranged with the heat dissipation structure 30, and the heat dissipation structure 30 is used for abutting against the electronic component 40.

[0038] The heat dissipation assembly described above, when dissipating heat from the electronic component 40, the cooling liquid enters the flow guide channel 11 and impacts the heat dissipation structure 30 through the flow guide impact holes, which can increase the turbulent intensity of the cooling liquid and destroy the boundary layer near the wall surface, thereby taking away the accumulated heat near the wall surface, and has good heat dissipation capacity.

[0039] It should be noted that the number of the flow channels 11 corresponding to the communicating jet impact holes 21 in the embodiment is, for example, two, three, five, ten or more, which is not limited herein and can be flexibly adjusted and set according to actual needs. The shape of the jet impact hole 21 includes, but is not limited to, a circular hole, a waist-shaped hole, a polygonal hole or other irregularly shaped hole, which can be selected according to actual needs.

[0040] The plurality of jet impact holes 21 can be arranged at equal intervals along the extension direction of the flow channel 11, or can be arranged at unequal intervals. When the plurality of jet impact holes 21 are arranged at unequal intervals along the extension direction of the flow channel 11, they are arranged, for example, in a gradually changing manner, that is, the spacing between adjacent two jet impact holes 21 decreases or increases, which is not limited herein.

[0041] The opening size of the jet impact hole 21 can be the same or different, and for example, increases or decreases along the extension direction of the flow channel 11, which is not limited herein.

[0042] The flow channel 11 includes, but is not limited to, a straight channel, a broken line channel or a curved channel. In order to improve the jet impact effect, the flow channel 11 is specifically a straight channel.

[0043] It should be noted that the number of the flow channels 11 is, for example, one, two, three or more, which can be flexibly adjusted and set according to actual needs, which is not limited herein. The more the number of the flow channels 11 is, the more uniform the heat dissipation of the heat dissipation structure 30 is, and thus the overall heat dissipation performance is improved.

[0044] When the flow channel 11 is one, the flow channel 11 is arranged, for example, at the middle part of the flow guide structure 10.

[0045] When the number of the flow channels 11 is at least two, the at least two flow channels 11 are arranged in parallel at intervals. The at least two flow channels 11 can be arranged in various distribution manners such as symmetrically, asymmetrically or mirror image, which can be flexibly adjusted and set according to actual needs, which is not limited herein.

[0046] The cross-sectional area of the flow channel 11 can be consistent or gradually changed along the extension direction thereof.

[0047] For example, the cross-sectional area of the flow channel 11 can be constant, linearly or non-linearly increased or decreased along the flow direction, which is not limited herein and can be adjusted and set as required. When the cross-sectional area of the flow channel 11 is constant along the flow direction under the premise that the cross-sectional area of the jet impact hole 21 is the same, the cooling uniformity is relatively low. When the cross-sectional area of the jet impact hole 21 is increased along the flow direction under the premise that the cross-sectional area of the flow channel 11 is constant along the flow direction, the cooling liquid distribution uniformity can be improved, thereby improving the cooling uniformity.

[0048] For example, the cross-sectional area of the jet impact hole 21 at different coordinate positions can be constant, linearly or non-linearly increased or decreased, which is not limited herein and can be adjusted and set as required. When the cross-sectional area of the jet impact hole 21 at different coordinate positions is constant under the premise that the cross-sectional area of the flow channel 11 is constant along the flow direction, the cooling uniformity is relatively low. When the cross-sectional area of the jet impact hole 21 is increased along the flow direction under the premise that the cross-sectional area of the flow channel 11 is constant along the flow direction, the cooling liquid distribution uniformity can be improved, thereby improving the cooling uniformity.

[0049] For example, the flow guide structure 10 is provided with a liquid inlet 12 and a distribution channel 13. The flow channel 11 is provided in at least two, the liquid inlet 12 and the distribution channel 13 are communicated, and the at least two flow channels 11 are arranged in parallel and spaced apart and communicated with the distribution channel 13. Each flow channel 11 corresponds to a plurality of jet impact holes 21. When the heat dissipation assembly is working, the cooling liquid enters the flow guide structure 10 through the liquid inlet 12 and is transported to each flow channel 11 by the distribution channel 13. The cooling liquid in each flow channel 11 is jetted to the heat dissipation structure 30 through the corresponding plurality of jet impact holes 21. Thus, under the flow guiding effect of the flow guide structure 10, the multi-stage flow equalization effect can be achieved, thereby improving the heat dissipation uniformity and further improving the overall heat dissipation performance, that is, the local temperature can be prevented from being too high to reduce the heat dissipation performance.

[0050] When the flow channel 11 is provided in at least two, the flow channel 11 can be arranged in stages. The stages of the flow channel 11 include but are not limited to one stage, two stages or more stages, and the specific number of stages can be adjusted and set as required, which is not limited herein. When the number of stages of the flow channel 11 is greater, the number of distribution channels 13 is correspondingly greater, the flow equalization effect is better, and the heat dissipation uniformity can be improved. Conversely, when the number of stages of the flow channel 11 is smaller, the number of distribution channels 13 is correspondingly smaller.

[0051] Please refer to Figure 10 , Figure 10 The flow channel 11 is shown to be one-stage distribution (corresponding to Figure 6 and Figure 7Different device junction temperature curve and the flow channel 11 is two-stage distribution (corresponding to Figure 8 and Figure 9 Different device junction temperature curve, by comparison and analysis, the uniformity of different device junction temperature of the flow channel 11 is two-stage distribution is higher than that of the flow channel 11 is one-stage distribution.

[0052] Please refer to Figure 1 and Figure 2 , for example, the side of the jet impact structure 20 facing the heat dissipation structure 30 is formed with a chamber 22 recessed away from the heat dissipation structure 30. That is, the side of the chamber 22 facing the heat dissipation structure 30 has an opening. The chamber 22 communicates with the jet impact hole 21. In this way, the cooling liquid of the jet impact hole 21 impacts the heat dissipation structure 30 after passing through the chamber 22, the chamber 22 can buffer the cooling liquid, and can increase the contact area of the cooling liquid and the heat dissipation structure 30, which can help to improve the heat dissipation uniformity and improve the heat dissipation capacity. In addition, the cooling liquid impacts the heat dissipation structure 30 and flows back into the chamber 22, and is discharged outwardly from the chamber 22.

[0053] Please refer to Figures 4 to 9 , on the basis of the foregoing embodiment, the jet impact structure 20 is further provided with a first backflow channel 23. The cooling liquid in the chamber 22 is discharged outwardly through the first backflow channel 23. Optionally, when the jet impact structure 20 is provided with the liquid outlet 14, the cooling liquid in the first backflow channel 23 can be directly discharged outwardly through the liquid outlet 14.

[0054] Of course, the liquid outlet 14 can also be provided, for example, in the flow guide structure 10. For example, the flow guide structure 10 is further provided with a liquid outlet 14 and a second backflow channel 15. The first backflow channel 23 communicates with the second backflow channel 15, and the second backflow channel 15 communicates with the liquid outlet 14. In this way, the cooling liquid in the chamber 22 is discharged to the second backflow channel 15 through the first backflow channel 23, and is discharged to the liquid outlet 14 through the second backflow channel 15, and is discharged outwardly through the liquid outlet 14.

[0055] Among them, the projection of the first backflow channel 23 and the second backflow channel 15 on the heat dissipation structure 30 in the thickness direction of the heat dissipation structure 30 includes but is not limited to regular shapes such as rectangle, circle, triangle or pentagon and irregular shapes. In this embodiment, the orthographic projection of the first backflow channel 23 and the second backflow channel 15 on the heat dissipation structure 30 is, for example, a rectangle. The first backflow channel 23 and the second backflow channel 15 are arranged in position along the thickness direction of the heat dissipation structure 30 and communicate with each other.

[0056] Please refer to Figure 6 and Figure 7For example, the at least two flow channels 11 include two first flow channels 111. The flow distribution channel 13 includes a first flow distribution section 131. The liquid inlet 12 is in communication with a middle portion of the first flow distribution section 131, and opposite ends of the first flow distribution section 131 are in one-to-one correspondence with one end of the two first flow channels 111, respectively. In this way, the cooling liquid enters the first flow distribution section 131 from the liquid inlet 12, is distributed by the first flow distribution section 131 to one end of the two first flow channels 111, and is ejected to the heat dissipation structure 30 through the jet impact holes 21 during the flow along the first flow channels 111.

[0057] For example, the at least two flow channels 11 include two first flow channels 111. The flow distribution channel 13 includes a first flow distribution section 131. The liquid inlet 12 is in communication with a middle portion of the first flow distribution section 131, and opposite ends of the first flow distribution section 131 are in one-to-one correspondence with one end of the two first flow channels 111, respectively. In this way, the cooling liquid enters the first flow distribution section 131 from the liquid inlet 12, is distributed by the first flow distribution section 131 to one end of the two first flow channels 111, and is ejected to the heat dissipation structure 30 through the jet impact holes 21 during the flow along the first flow channels 111. Figure 8 Figure 9 For example, the at least two flow channels 11 include two first flow channels 111. The flow distribution channel 13 includes a first flow distribution section 131. The liquid inlet 12 is in communication with a middle portion of the first flow distribution section 131, and opposite ends of the first flow distribution section 131 are in one-to-one correspondence with one end of the two first flow channels 111, respectively. In this way, the cooling liquid enters the first flow distribution section 131 from the liquid inlet 12, is distributed by the first flow distribution section 131 to one end of the two first flow channels 111, and is ejected to the heat dissipation structure 30 through the jet impact holes 21 during the flow along the first flow channels 111.

[0058] For example, the center axis of the jet impact hole 21 is arranged at an angle to the wall surface of the heat dissipation structure 30. The angle between the center axis of the jet impact hole 21 and the wall surface of the heat dissipation structure 30 is a, and 45°≤a≤90°.

[0059] Optionally, a includes but is not limited to 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, or 90°, etc.

[0060] For example, the flow guide structure 10 includes a flow guide plate. The jet impact structure 20 includes a jet impact plate. The heat dissipation structure 30 includes a heat dissipation plate. The flow guide plate, the jet impact plate, and the heat dissipation plate are connected in a stacking manner along the thickness direction of the flow guide plate.

[0061] It should be noted that the wall surface of the heat dissipation structure 30 facing the jet impact plate in the embodiment includes but is not limited to a smooth surface, a rough surface, a Pin Fin, or a special-shaped flow channel, etc., which can be flexibly adjusted and arranged according to actual needs, and is not limited herein.

[0062] For example, the at least two flow channels 11 include two first flow channels 111. The flow distribution channel 13 includes a first flow distribution section 131. The liquid inlet 12 is in communication with a middle portion of the first flow distribution section 131, and opposite ends of the first flow distribution section 131 are in one-to-one correspondence with one end of the two first flow channels 111, respectively. In this way, the cooling liquid enters the first flow distribution section 131 from the liquid inlet 12, is distributed by the first flow distribution section 131 to one end of the two first flow channels 111, and is ejected to the heat dissipation structure 30 through the jet impact holes 21 during the flow along the first flow channels 111. Figure 1 Figure 2 In some embodiments, at least two of the flow guide structure 10, the jet impact structure 20, and the heat dissipation structure 30 are integrated structures. Specifically, the flow guide structure 10, the jet impact structure 20, and the heat dissipation structure 30 are all, for example, integrated structures. ​​

[0063] In some other embodiments, the flow guide structure 10, the jet impact structure 20 and the heat dissipation structure 30 are separate structures and can be detachably connected. In this way, the flow guide structure 10, the jet impact structure 20 and the heat dissipation structure 30 can be manufactured separately, which can reduce the manufacturing difficulty. After the flow guide structure 10, the jet impact structure 20 and the heat dissipation structure 30 are manufactured respectively, they can be spliced together by various ways including but not limited to bonding, riveting, clamping, welding and the like.

[0064] Please refer to Figures 1 to 3 In another embodiment, the present application also provides an electronic device, which is for example a computer, a tablet, a controller and various types, which are not limited here. The electronic device includes the heat dissipation assembly of any of the above embodiments.

[0065] Specifically, the electronic device further includes electronic components 40. The electronic components 40 are for example power devices, which include but are not limited to IGBT and the like. The electronic components 40 are for example one, two or more. The electronic components 40 are in abutment with the heat dissipation structure 30. The heat generated by the electronic components 40 during operation can be timely transferred to the heat dissipation structure 30 and taken away by the heat dissipation structure 30.

[0066] The above electronic device, when dissipating heat from the electronic components 40, the cooling liquid enters the flow guide channel 11 and impacts the heat dissipation structure 30 through the flow distribution impact holes, which can increase the turbulence intensity of the cooling liquid and destroy the boundary layer near the wall surface, thereby taking away the accumulated heat near the wall surface, and has good heat dissipation capacity.

[0067] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0068] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example two, three and the like, unless otherwise specifically limited.

[0069] In the present application, unless specifically defined otherwise, if there appears the terms "mount", "connect", "connection", "fixed", etc., these terms should be interpreted broadly. For example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0070] In the present application, unless specifically defined otherwise, if there appears the terms "mount", "connect", "connection", "fixed", etc., these terms should be interpreted broadly. For example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0071] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be a middle element. If an element is referred to as "connected to" another element, it can be directly connected to the other element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.

[0072] The technical features of the above-described embodiments can be combined in any manner. In order to make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present application.

[0073] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be noted that for those skilled in the art, without departing from the concept of the present application, some modifications and improvements can be made, which are within the scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A heat dissipating assembly, characterized by, The heat dissipation assembly comprises: a flow guide structure provided with a flow guide channel; a jet impact structure connected with the flow guide structure, the jet impact structure being provided with a plurality of jet impact holes arranged in sequence along the extension direction of the flow guide channel, and each jet impact hole being in communication with the flow guide channel; and a heat dissipation structure connected with the jet impact structure, the heat dissipation structure being located on the side of the jet impact structure away from the flow guide structure, each jet impact hole being arranged opposite to the heat dissipation structure, and the heat dissipation structure being used for abutting against the electronic component.

2. The heat dissipation assembly of claim 1, wherein, The flow guide structure is provided with an inlet and a shunt channel, the flow guide channel is provided as at least two, the inlet is in communication with the shunt channel, and at least two flow guide channels are arranged in parallel and in interval and are in communication with the shunt channel, and each flow guide channel corresponds to a plurality of jet impact holes.

3. The heat dissipation assembly of claim 2, wherein, The side of the jet impact structure facing the heat dissipation structure is formed with a cavity recessed in the direction away from the heat dissipation structure, and the cavity is in communication with the jet impact hole.

4. The heat dissipation assembly of claim 3, wherein, The jet impact structure is further provided with a first backflow channel, the flow guide structure is further provided with a second backflow channel and an outlet, the cavity is in communication with the first backflow channel, the first backflow channel is in communication with the second backflow channel, and the second backflow channel is in communication with the outlet.

5. The heat dissipation assembly of claim 3, wherein, At least two flow guide channels include two first flow guide channels, the shunt channel includes a first shunt section, the inlet is in communication with the middle part of the first shunt section, and the opposite ends of the first shunt section are in one-to-one correspondence with one end of the two first flow guide channels.

6. The heat dissipating assembly of claim 5, wherein, At least two flow guide channels further include a second flow guide channel, the second flow guide channel being located between the two first flow guide channels, and the shunt channel further includes a second shunt section, the second shunt section being arranged in parallel with the first shunt section, and the second flow guide channel being in communication with the middle part of the second shunt section.

7. The heat dissipating assembly according to any one of claims 1 to 6, wherein, The central axis of the jet impact hole is arranged at an angle with the wall surface of the heat dissipation structure, and the angle between the central axis of the jet impact hole and the wall surface of the heat dissipation structure is a, 45°≤a≤90°.

8. The heat dissipating assembly according to any one of claims 1 to 6, wherein, The flow guide structure includes a flow guide plate, the jet impact structure includes a jet impact plate, the heat dissipation structure includes a heat dissipation plate, and the flow guide plate, the jet impact plate and the heat dissipation plate are connected in stack along the thickness direction of the flow guide plate.

9. The heat dissipating assembly according to any one of claims 1 to 6, wherein, At least two of the flow guide structure, the jet impact structure and the heat dissipation structure are integrated structures, or the flow guide structure, the jet impact structure and the heat dissipation structure are separate structures and can be detachably connected.

10. An electronic device, comprising: The electronic device comprises the heat dissipation assembly according to any one of claims 1 to 9.

Images