Semiconductor device corner grinding auxiliary equipment

Abstract

The invention relates to the technical field of semiconductor device processing, in particular to semiconductor device corner grinding auxiliary equipment which comprises a clamping mechanism and grinding auxiliary equipment which are arranged on a base, and the grinding auxiliary equipment is composed of a grinding assembly, a piston assembly and a liquid storage structure. A linkage assembly for driving the piston assembly and the liquid storage structure is arranged on the polishing assembly; the grinding assembly comprises a sleeve, a grinding piece for grinding the semiconductor device is arranged on the sleeve, and an electric guide rail of a sliding motor with the base is installed on the bottom side of the sleeve. According to the semiconductor device corner grinding auxiliary equipment, when the grinding pressure is suddenly increased, a spline block pushes a transmission main shaft to further compress a reset spring, the spline meshing depth is increased to drive a linkage shaft to increase the rotating speed, the frequency of a roller is pushed through a connecting rib to increase so that the frequency of a piston assembly can be synchronously increased, and the cooling liquid flow can automatically meet the heat dissipation requirement; and the advantage of self-adaptive adjustment of pressure and flow is achieved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of polishing auxiliary equipment, in particular to a semiconductor device corner polishing auxiliary equipment. BACKGROUND

[0002] In the production process of a semiconductor wafer, the outer side of the semiconductor wafer needs to be polished. According to the search, the patent file with the publication number CN214213258U discloses a semiconductor device corner polishing auxiliary equipment, which comprises a base, a support, an electric cylinder, a mounting seat, a polishing block, a fixing mechanism, a rotating mechanism, a treatment box, an exhaust fan, a support and a conveying pipe. The application can improve the conveying effect of the dust generated during polishing, and can relatively adjust the height of the support according to the size of the semiconductor wafer, improve the supporting effect and adaptability, and reduce the friction between the semiconductor wafer and the support.

[0003] According to the related technology in the above, it is found that at least the following problems exist in the technology. The application lacks an active cooling function for the polishing head. In use, the polishing block generates heat by friction, and the lack of cooling function not only causes the polishing block to overheat and wear, shortening the service life of the polishing block, but also causes thermal damage to the wafer. Since high temperature may damage the structure or performance of the semiconductor wafer, in addition, high temperature may cause the material polished to melt and adhere to the polishing block or the wafer surface, affecting the polishing quality and efficiency, so as to affect the precision and consistency of polishing. Therefore, a semiconductor device corner polishing auxiliary equipment is proposed to solve the problems in the above. SUMMARY

[0004] In view of the deficiencies of the prior art, in order to avoid overheating of the polishing head affecting the processing quality, the application provides a semiconductor device corner polishing auxiliary equipment, which has the advantages of cooling and lubrication and high efficiency, solves the problem of lack of active cooling function for the polishing head, and is prone to cause material damage.

[0005] The application provides a semiconductor device corner polishing auxiliary equipment, which adopts the following technical scheme: A semiconductor device corner polishing auxiliary equipment comprises a clamping mechanism arranged on a base and a polishing auxiliary equipment, the polishing auxiliary equipment is composed of a polishing assembly, a piston assembly and a liquid storage structure, and a linkage assembly for driving the piston assembly and the liquid storage structure is arranged on the polishing assembly; The polishing assembly comprises a sleeve, a polishing piece for polishing the semiconductor device is arranged on the sleeve, and an electric guide rail of a base sliding motor is mounted on the bottom side of the sleeve; The polishing piece comprises a transmission secondary shaft with a bearing mounted inside a sleeve, a transmission main shaft movably arranged inside the sleeve and extending into the transmission secondary shaft, a polishing block mounted at an end of the transmission main shaft, and a spline block mounted on an outer surface of the transmission main shaft, wherein a spline groove matched with the spline block is formed in the transmission secondary shaft; The piston assembly comprises a plug cylinder fixed to an outer surface of the sleeve, a piston block movably arranged inside the plug cylinder, a plug rod fixed to one side of the piston block, two check valves mounted on an outer portion of the plug cylinder, two infusion tubes mounted on the two check valves, and a spray tube mounted at an end of one of the infusion tubes, wherein an abutting piece connected with the linkage assembly is arranged at an end of the plug rod away from the piston block.

[0006] Optionally, the clamping mechanism comprises a mounting frame fixed to an upper surface of the base, a drive main shaft rotatably mounted on the mounting frame, two clamping tables arranged above and below and fixed to the drive main shaft, and a hydraulic telescopic rod mounted on the mounting frame and fixed to the upper clamping table.

[0007] The above-mentioned optional scheme has the beneficial effect that the distance between the upper clamping table and the lower clamping table can be conveniently adjusted by controlling the extension and retraction of the hydraulic telescopic rod, so that the semiconductor device of different thicknesses can be quickly clamped and released, which is simple and intuitive, can greatly improve the work efficiency, and reduce the difficulty and error of manual operation.

[0008] Optionally, the sleeve is hollow, a drive motor is fixed to a side of the sleeve close to the polishing block, and two transmission gears engaged with each other are mounted on an outer surface of the drive motor output shaft and the transmission main shaft.

[0009] The above-mentioned optional scheme has the beneficial effect that the drive motor can accurately control the rotating speed of the transmission main shaft through the transmission gears, and the operator can flexibly adjust the rotating speed of the polishing block according to the actual polishing situation, so that the rotating speed can be reduced to obtain a smoother surface when the semiconductor device is finely polished, and the rotating speed can be increased to improve the polishing efficiency when rough polishing is performed, so that the flexible control mode can meet the needs of different polishing processes and improve the applicability of the equipment.

[0010] Optionally, a return spring is rotatably mounted between an outer surface of the transmission main shaft and an inner wall of the sleeve, the transmission main shaft is driven by the transmission secondary shaft through the connection of the spline block and the spline groove after being extended into the transmission secondary shaft by the contact and pressure of the electric guide rail displacement and the device, and a pressure sensing module is mounted at an end of the transmission main shaft close to the spline groove.

[0011] The beneficial effect of the above optional scheme is that the transmission main shaft is extended into the transmission secondary shaft through the contact and pressure of the electric guide rail displacement and the device, and the transmission secondary shaft is driven through the connection of the spline block and the spline groove. The close cooperation of the spline block and the spline groove can ensure the accurate transmission of power between the transmission main shaft and the transmission secondary shaft, and there will be no slip or transmission error, so as to ensure that the polishing block can rotate at the predetermined speed and direction, and realize the accurate polishing of the semiconductor device.

[0012] Optionally, the linkage assembly comprises a linkage shaft rotatably installed at the end of the sleeve, the linkage shaft is in spline connection with the end of the transmission secondary shaft, and the outer surface of the linkage shaft is fixedly connected with a connection rib arranged in an inclined manner.

[0013] The beneficial effect of the above optional scheme is that the frequency of the roller is increased by the connection rib, so that the piston assembly frequency is increased synchronously, the cooling liquid flow is automatically matched with the heat dissipation demand, and the advantages of pressure and flow self-adaptive adjustment are achieved.

[0014] Optionally, the nozzle comprises two expansion pipes, a throat pipe is fixedly connected between the two expansion pipes, the two expansion pipes are arranged in a trumpet shape, and one of the expansion pipes faces the polishing block, and a buffer spring is installed between the outer surface of the plug rod and the end of the plug barrel.

[0015] The beneficial effect of the above optional scheme is that when the fluid passes through the nozzle, the flow rate increases and the pressure decreases at the throat pipe. According to the Venturi effect, more cooling and lubricating medium can be sprayed at a high speed to the contact area between the polishing block and the semiconductor device, effectively taking away a large amount of heat generated during polishing, reducing the local temperature, preventing the device from being damaged due to overheating, and providing sufficient lubrication for the polishing area, reducing friction, and improving the polishing effect.

[0016] Optionally, the abutting piece comprises a connecting shaft fixed to the plug rod extending out of one end of the plug barrel, the end of the connecting shaft is fixedly connected with a wheel frame, the outer shape of the wheel frame is in the shape of a Chinese character 'fang', and the concave surface of the wheel frame is arranged downward, wherein the two downward ends of the wheel frame are rotatably installed with first rollers abutting against the left and right sides of the connection rib.

[0017] The beneficial effect of the above optional scheme is that the first roller abuts against the connection rib, the inclined connection rib rotates with the shaft, periodically pushes the abutting piece, and pushes the plug rod to move into the plug barrel through the wheel frame and the connecting shaft, the piston block compresses the inner cavity of the plug barrel, generates hydraulic pressure, and realizes the delivery of the liquid.

[0018] Optionally, the number of the abutting pieces is two, the two abutting pieces are distributed upward and downward, the liquid storage structure comprises a liquid storage barrel fixed to one side of the electric guide rail, the inside of the liquid storage barrel is provided with a stirring assembly, and the stirring assembly is connected with the outer surface of the bottom wheel frame.

[0019] The beneficial effect of the above optional scheme is that the stirring assembly in the liquid storage structure is connected with the outer surface of the bottom wheel frame, when the device is running, the bottom wheel frame will rotate or move with the movement of the related components, and then drive the stirring assembly to work, which ingeniously uses the existing moving parts of the device, without the need for additional driving devices to drive the stirring assembly, simplifying the structure of the device, reducing the manufacturing cost and energy consumption.

[0020] Optionally, the stirring assembly comprises a transmission sleeve rotatably installed in the inside of the liquid storage cylinder, the inside of the liquid storage cylinder is provided with a stirring shaft extending to the top side thereof and penetrating through the inside of the transmission sleeve, the outer surface of the transmission sleeve is fixed with a linkage gear, and the outside of the linkage gear is engaged with a tooth plate fixed with the outer surface of the bottom wheel frame.

[0021] The beneficial effect of the above optional scheme is that the power of the stirring assembly comes from the movement of the bottom wheel frame, and the movement state of the bottom wheel frame is associated with the overall operation of the device, when the working frequency, load and other factors of the device change, the movement speed and amplitude of the bottom wheel frame will also change accordingly, thereby driving the stirring assembly to work at different speeds and stirring modes, and through the automatic adjustment of the stirring function, the stirring effect of the liquid in the liquid storage cylinder can be adjusted in real time according to the actual demand, ensuring the uniform distribution of the components of the liquid and improving the use performance of the liquid.

[0022] Optionally, the outer surface of the bottom wheel frame is provided with an adjusting member connected with the stirring shaft, the adjusting member comprises a sliding plate fixed to the outer surface of the bottom wheel frame, a rotating head is rotatably installed at the top end of the stirring shaft, a linkage rod is fixed in the inside of the rotating head, a second roller is rotatably installed at one end of the linkage rod, and an inclined sliding groove is formed in the inside of the sliding plate and in rolling cooperation with the second roller.

[0023] The beneficial effect of the above optional scheme is that the inclined sliding groove formed in the sliding plate is in rolling cooperation with the second roller, when the bottom wheel frame rotates to drive the sliding plate to move, the second roller rolls in the inclined sliding groove, which will make the linkage rod drive the top end of the stirring shaft to make complex movement, thereby making the stirring shaft not only rotate, but also move up and down and swing within a certain range, so as to realize more comprehensive and sufficient stirring of the liquid in the liquid storage cylinder, compared with the traditional single rotation stirring, the multi-dimensional stirring mode can make the components in the liquid mix more uniformly, improving the stirring effect.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: 1. The spline block pushes the transmission main shaft to further compress the return spring when the polishing pressure suddenly increases, enhances the spline engagement depth, drives the linkage shaft to rotate at a higher speed, pushes the roller through the connecting rib to increase the frequency, synchronously increases the piston assembly frequency, realizes the automatic matching of cooling liquid flow to meet the heat dissipation demand, and has the advantages of pressure and flow self-adaptive adjustment.

[0025] 2. The present application can make the plug rod produce high-frequency pulse motion by rotating the inclined connecting rib to make the roller bear periodic impact force, and can present intermittent strong injection of cooling mist by outputting pulsating liquid flow through the piston assembly and cooperating with the nozzle of the Venturi structure, which not only effectively flushes the debris adhered to the polishing block, but also can expand the cooling range, improve the cooling efficiency, lubricate the contact surface, reduce friction and wear, prolong the service life of the polishing block and the device, and improve the processing quality.

[0026] 3. The present application can make the linkage shaft rotate, the liquid storage structure works through the bottom linkage, the wheel frame of the bottom abutting piece drives the tooth plate to reciprocate left and right, the tooth plate engages the linkage gear to drive the transmission sleeve to rotate, and the oblique sliding groove cooperates with the second roller to realize the lifting of the stirring shaft, so that the stirring shaft rotates and reciprocates up and down, and the cooling liquid is fully stirred, the cooling liquid is effectively prevented from precipitating, the performance of the cooling liquid is stable, the cooling and lubricating system is always in good working condition, and the reliability of the entire polishing process is improved. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is a sectional view of the overall structure of the present application; Figure 2 is a structural schematic view of the clamping mechanism of the present application; Figure 3 is a structural schematic view of the polishing auxiliary equipment of the present application; Figure 4 is a structural schematic view of the polishing assembly of the present application; Figure 5 is a structural schematic view of the piston assembly of the present application; Figure 6 is a structural schematic view of the nozzle of the present application; Figure 7 is a structural schematic view of the liquid storage structure of the present application; Figure 8 is a structural schematic view of the present application Figure 7 is an enlarged structural schematic view of A shown in the present application.

[0028] BRIEF DESCRIPTION OF DRAWINGS 1, base; 2, clamping mechanism; 21, mounting frame; 22, drive spindle; 23, clamping table; 24, hydraulic telescopic rod; 3, polishing auxiliary equipment; 4, polishing assembly; 41, sleeve; 42, polishing piece; 421, transmission auxiliary shaft; 422, transmission main shaft; 423, polishing block; 424, drive motor; 425, transmission gear; 426, spline block; 427, spline groove; 428, return spring; 429, pressure sensing module; 5, linkage assembly; 51, linkage shaft; 52, connecting rib; 6, piston assembly; 61, plug cylinder; 62, piston block; 63, plug rod; 64, check valve; 65, infusion tube; 66, spray pipe; 661, throat pipe; 662, expansion pipe; 67, buffer spring; 68, connecting shaft; 69, wheel carrier; 610, first roller; 7, liquid storage structure; 71, liquid storage cylinder; 72, transmission sleeve; 73, stirring shaft; 731, rotating head; 74, toothed plate; 75, linkage gear; 76, sliding plate; 77, linkage rod; 78, second roller; 79, inclined chute; 8, electric guide rail. DETAILED DESCRIPTION

[0029] The following will be described in detail in combination with the accompanying drawings Figures 1 to 8 The application is further described in detail.

[0030] The embodiment of the application discloses a semiconductor device corner polishing auxiliary equipment. Figures 1 to 8 A semiconductor device corner polishing auxiliary equipment, comprising a clamping mechanism 2 and a polishing auxiliary equipment 3 arranged on a base 1, wherein the clamping mechanism 2 comprises a mounting frame 21 fixed to the upper surface of the base 1, a drive spindle 22 rotatably arranged on the mounting frame 21, two clamping tables 23 arranged above the drive spindle 22, the top end of the drive spindle 22 is fixed to the top clamping table 23, and a hydraulic telescopic rod 24 is arranged on the mounting frame 21 and fixed to the top clamping table 23. By controlling the extension and retraction of the hydraulic telescopic rod 24, the distance between the top clamping table 23 and the bottom clamping table 23 can be conveniently adjusted, the semiconductor device of different thicknesses can be quickly clamped and released, the method is simple and intuitive, the work efficiency can be greatly improved, and the difficulty and error of manual operation can be reduced.

[0031] In this embodiment, the polishing auxiliary device 3 is composed of a polishing assembly 4, a piston assembly 6 and a liquid storage structure 7, the polishing assembly 4 is provided with a linkage assembly 5 for driving the piston assembly 6 and the liquid storage structure 7; the polishing assembly 4 includes a sleeve 41, the sleeve 41 is provided with a polishing piece 42 for polishing the semiconductor device, and the bottom side of the sleeve 41 is installed with an electric guide rail 8 of the sliding motor of the base 1; the polishing piece 42 includes a transmission secondary shaft 421 installed in the inside of the sleeve 41, the inside of the sleeve 41 is movably provided with a transmission main shaft 422 extending into the inside of the transmission secondary shaft 421, the end of the transmission main shaft 422 is installed with a polishing block 423, the outer surface of the transmission main shaft 422 is installed with a spline block 426, and the inside of the transmission secondary shaft 421 is provided with a spline groove 427 matched with the spline block 426. Specifically, the inside of the sleeve 41 is provided in a hollow shape, the side of the sleeve 41 close to the polishing block 423 is fixed with a driving motor 424, and the output shaft of the driving motor 424 is installed with two transmission gears 425 on the outer surface of the transmission main shaft 422 and engaged with each other. The driving motor 424 can accurately control the rotating speed of the transmission main shaft 422 through the transmission gears 425, and the operator can flexibly adjust the rotating speed of the polishing block 423 according to the actual polishing condition. When fine polishing of the semiconductor device is performed, the rotating speed can be reduced to obtain a smoother surface, and when rough polishing is performed, the rotating speed can be increased to improve the polishing efficiency. Through the flexible control mode, the needs of different polishing processes can be met, and the applicability of the device is improved.

[0032] Specifically, the reset spring 428 is installed between the outer surface of the transmission main shaft 422 and the inner wall of the sleeve 41, mainly realizing automatic reset of the transmission main shaft and clutching of power transmission; before the electric guide rail 8 drives the polishing assembly 4 to approach the semiconductor device, the transmission main shaft 422 is in an extended state under the pre-tightening force of the reset spring 428.

[0033] Specifically, the reset spring 428 is installed between the outer surface of the transmission main shaft 422 and the inner wall of the sleeve 41, mainly realizing automatic reset of the transmission main shaft and clutching of power transmission; before the electric guide rail 8 drives the polishing assembly 4 to approach the semiconductor device, the transmission main shaft 422 is in an extended state under the pre-tightening force of the reset spring 428.

[0034] At this time, the spline block 426 on the transmission main shaft 422 is disengaged from the spline groove 427 inside the transmission secondary shaft 421. Therefore, although the driving motor 424 can drive the transmission main shaft 422 to rotate idly through the transmission gear 425, power cannot be transmitted to the transmission secondary shaft 421 and the polishing block 423, which is equivalent to a neutral state, ensuring the safety of the device during movement and avoiding accidental polishing; When the electric guide rail 8 pushes the entire polishing assembly forward, so that the polishing block 423 contacts the edge of the semiconductor device, the polishing block 423 will be subjected to a reverse force from the workpiece, which will overcome the elastic force of the return spring 428 and push the entire transmission main shaft 422 to shrink into the interior of the transmission secondary shaft 421. As the transmission main shaft 422 shrinks, the spline block 426 thereon will gradually embed and eventually fully engage with the spline groove 427 of the transmission secondary shaft 421. At this point, the power transmission path is connected, and the power of the driving motor 424 can be transmitted through the transmission main shaft 422 and the spline connection, finally driving the transmission secondary shaft 421 and the polishing block 423 to perform effective polishing work. The pressure sensing module 429 monitors the pressure in real time during this contact and compression process to ensure that the pressure is within a safe and effective range; Finally, when the polishing is completed or needs to be paused, the electric guide rail 8 drives the polishing assembly 4 to retreat away from the workpiece. Once the polishing block 423 is disengaged from the workpiece, the reverse force that forced the transmission main shaft 422 to shrink disappears. At this time, the return spring 428, which stores elastic potential energy, begins to release, and its restoring force will push the transmission main shaft 422 back to the initial extended position. As the transmission main shaft 422 returns to its original position, the spline block 426 and the spline groove 427 are disengaged again, the power transmission is cut off, the polishing block 423 stops rotating, and the device returns to a safe initial standby state; In addition, the pressure sensing module 429 can monitor the pressure received by the transmission main shaft 422 when it contacts the device in real time. During polishing, pressure is a key parameter. Excessive pressure may cause damage to the device or over-polishing, while insufficient pressure may affect the polishing effect and efficiency. The pressure sensing module 429 can feed back the detected pressure signal to the control system in real time, allowing the operator to timely understand the pressure changes during polishing.

[0035] To realize the linkage of the structure, the linkage assembly 5 includes a linkage shaft 51 rotatably mounted at the end of the sleeve 41, the linkage shaft 51 is connected with the end of the transmission pair shaft 421 by spline, and the outer surface of the linkage shaft 51 is fixedly connected with a connection rib 52 arranged in an inclined manner. Specifically, the frequency of the roller is increased by pushing the connection rib 52, so that the piston assembly 6 is synchronized to increase the frequency, the cooling liquid flow is automatically matched with the heat dissipation demand, and the advantages of self-adaptive adjustment of pressure and flow are achieved. Among them, the connection rib 52 arranged in an inclined manner can affect the airflow or liquid flow distribution around the linkage shaft 51 to some extent, which is helpful to coordinate the movement and material flow in different directions for some polishing processes that need to be cooled or lubricated, and ensures the smooth progress of the whole polishing process.

[0036] To realize polishing cooling, the piston assembly 6 includes a plug barrel 61 fixed to the outer surface of the sleeve 41, a piston block 62 is slidably arranged in the plug barrel 61, one side of the piston block 62 is fixed with a plug rod 63, two check valves 64 are mounted on the outer surface of the plug barrel 61, two liquid delivery pipes 65 are mounted on the two check valves 64, and a spray pipe 66 is mounted at one end of one of the liquid delivery pipes 65, and the end of the plug rod 63 away from the piston block 62 is provided with an abutting piece connected with the linkage assembly 5. The spray pipe 66 includes two expansion pipes 662, a throat pipe 661 is fixedly connected between the two expansion pipes 662, the two expansion pipes 662 are arranged in a horn shape, and one of the two expansion pipes 662 faces the polishing block 423, and a buffer spring 67 is mounted between the outer surface of the plug rod 63 and the end of the plug barrel 61. It should be noted that when the fluid passes through the spray pipe 66, the flow rate increases and the pressure decreases at the throat pipe 661, according to the Venturi effect, more cooling and lubricating medium can be sprayed to the contact area of the polishing block 423 and the semiconductor device at a high speed, effectively taking away a large amount of heat generated during polishing, reducing the local temperature, preventing the device from being damaged due to overheating, and at the same time providing sufficient lubrication for the polishing area, reducing friction, and improving polishing effect.

[0037] In addition, the two expansion pipes 662 are arranged in a horn shape, and one of the two expansion pipes 662 faces the polishing block 423, which can expand the spraying range of the cooling and lubricating medium, so that the medium can more evenly cover the polishing area, ensuring that each contact point of the polishing block 423 and the device can be fully cooled and lubricated. Compared with the traditional straight pipe spraying, the horn-shaped expansion pipe 662 can improve the efficiency and quality of cooling and lubrication, and reduce the polishing quality problems caused by insufficient local cooling or uneven lubrication.

[0038] Further, the working principle of the buffer spring 67 is explained as follows: first, the buffer spring 67 is installed between the outer surface of the plug rod 63 and the end of the plug barrel 61, which ensures the stable and continuous operation of the piston assembly and converts the rotary motion into stable linear reciprocating motion; when the linkage shaft 51 rotates, the inclined connecting rib 52 on the linkage shaft 51 will periodically contact and push the first roller 610 on the abutting piece, and the pushing force will be transmitted to the plug rod 63 through the wheel frame 69 and the connecting shaft 68, trying to push it into the plug barrel 61, at this time, the buffer spring 67 is compressed and plays the following key roles: For example, the buffer and stability effect, the pushing of the connecting rib on the roller is instantaneous and impact, and the buffer spring 67 can absorb this part of the impact energy, so that the start of the plug rod 63 and the piston block 62 becomes gentle, avoiding the violent shaking of the piston and the pressure impact of the hydraulic system. This ensures the stability of the cooling liquid flow.

[0039] At the same time, the pre-tightening force of the spring can always keep the first roller 610 tightly attached to the surface of the connecting rib 52, ensuring the continuity of the movement and avoiding the loss of movement due to manufacturing gaps or slight vibrations; Secondly, in the process of continuous compression of the buffer spring 67, the plug rod 63 stably pushes the piston block 62 to move in the plug barrel 61, compresses the cavity volume, and thus the cooling liquid is pressed out through the check valve 64 and the liquid delivery pipe 65, and finally sprayed by the spray pipe 66 to the polishing point; It also has a reset and liquid suction function. When the linkage shaft 51 continues to rotate, the slope of the connecting rib 52 passes the highest point, and the pushing force on the first roller 610 gradually decreases until it disappears. At this time, the compressed buffer spring 67 begins to release energy, and the restoring force will push the plug rod 63, the connecting shaft 68 and the wheel frame 69, so that the first roller 610 tightly attached to the surface of the connecting rib 52 quickly and stably returns to its original position. The pull of the plug rod 63 drives the piston block 62 to move reversely in the plug barrel 61, so that the cavity of the plug barrel 61 forms a negative pressure, and under the action of the negative pressure, the other check valve 64 opens to suck the cooling liquid in the liquid storage structure 7 into the cavity of the plug barrel 61, preparing for the next liquid discharge.

[0040] Specifically, the abutting member includes a connecting shaft 68 fixed to the plug rod 63 extending out of one end of the plug barrel 61, and the end of the connecting shaft 68 is fixed with a wheel carrier 69, the wheel carrier 69 is in the shape of a Chinese character and its concave surface is downward, wherein the two downward ends of the wheel carrier 69 are each rotationally installed with a first roller 610 abutting against the left and right sides of the connecting rib 52. By abutting the first roller 610 against the connecting rib 52, the inclined connecting rib 52 rotates with the shaft, periodically pushes the abutting member and pushes the plug rod 63 through the wheel carrier 69 and the connecting shaft 68 to move into the plug barrel 61, the piston block 62 compresses the inner cavity of the plug barrel 61, generates hydraulic pressure, and realizes the delivery of the liquid. The number of abutting members is two, and the two abutting members are distributed up and down, and the liquid storage structure 7 includes a liquid storage barrel 71 fixed to one side of the electric guide rail 8, and the inside of the liquid storage barrel 71 is provided with a stirring assembly, and the stirring assembly is connected with the outer surface of the bottom wheel carrier 69.

[0041] In order to further improve the cooling effect, the stirring assembly in the liquid storage structure 7 is connected with the outer surface of the bottom wheel carrier 69, when the equipment is running, the bottom wheel carrier 69 will rotate or move with the movement of the related parts, and then drive the stirring assembly to work, ingeniously using the existing moving parts of the equipment, without additional driving device to drive the stirring assembly, simplifying the structure of the equipment, reducing the manufacturing cost and energy consumption. Specifically, the stirring assembly includes a transmission sleeve 72 rotationally installed in the inside of the liquid storage barrel 71, the inside of the liquid storage barrel 71 is provided with a stirring shaft 73 extending to the top side thereof and penetrating the inside of the transmission sleeve 72, the outer surface of the transmission sleeve 72 is fixed with a linkage gear 75, and the outside of the linkage gear 75 is engaged with a toothed plate 74 fixed to the outer surface of the bottom wheel carrier 69. The power source of the stirring assembly comes from the movement of the bottom wheel carrier 69, and the movement state of the bottom wheel carrier 69 is associated with the overall operation of the equipment, when the working frequency, load and other conditions of the equipment change, the movement speed and amplitude of the bottom wheel carrier 69 will also change accordingly, thereby driving the stirring assembly to work at different speeds and stirring modes. Through the automatic adjustment of the stirring function, the stirring effect of the liquid in the liquid storage barrel 71 can be adjusted in real time according to the actual demand, ensuring the uniform distribution of the composition of the liquid and improving the use performance of the liquid.

[0042] To improve the stirring effect, an adjusting component connected to the stirring shaft 73 is provided on the outer surface of the bottom wheel frame 69. The adjusting component includes a sliding plate 76 fixed to the outer surface of the bottom wheel frame 69. A rotating head 731 is rotatably mounted on the top of the stirring shaft 73. A linkage rod 77 is fixed inside the rotating head 731. A second roller 78 is rotatably mounted on one end of the linkage rod 77. An inclined groove 79 is opened inside the sliding plate 76 to roll with the second roller 78. Through the rolling cooperation between the inclined groove 79 on the sliding plate 76 and the second roller 78, when the bottom wheel frame 69 rotates and drives the sliding plate 76 to move, the second roller 78 rolls in the inclined groove 79, which causes the linkage rod 77 to drive the top of the stirring shaft 73 to make complex movements. This allows the stirring shaft 73 to not only rotate, but also move up and down and swing within a certain range, thereby achieving more comprehensive and thorough stirring of the liquid in the liquid storage cylinder 71. Compared with the traditional single rotation stirring, the multi-dimensional stirring method can mix the components in the liquid more evenly and improve the stirring effect.

[0043] To further explain, the two abutting parts are distributed vertically, with the wheel frame 69 in the two abutting parts being the top wheel frame 69 and the bottom wheel frame 69, respectively. The wheel frame 69 in the top abutting part is connected to the piston 62 in the piston assembly through the connecting shaft 68 to achieve liquid delivery linkage; while the wheel frame 69 in the bottom abutting part is connected to the toothed plate 74 and the sliding plate 76, so that the bottom abutting part cooperates with the liquid storage structure 7 to achieve stirring linkage, thereby enabling the piston assembly 6 to better use the liquid in the liquid storage structure 7 for cooling treatment.

[0044] Combined with appendix Figures 1 to 8 The working principle of the above embodiments is as follows: First, place the semiconductor device on the bottom clamping stage 23. Then, push the top clamping stage 23 down through the hydraulic telescopic rod 24 to clamp the device in cooperation with the bottom clamping stage 23. Next, drive the spindle 22 to rotate the clamping stage 23 so that the edges and corners of the device can evenly contact the polishing block 423. The electric guide rail 8 drives the sleeve 41 to move towards the device, so that the grinding block 423 contacts the edge of the device. The grinding pressure pushes the transmission main shaft 422 to slide into the transmission secondary shaft 421. The spline block 426 on the transmission main shaft 422 is embedded into the spline groove 427 of the transmission secondary shaft 421 to realize power transmission. When the transmission pair shaft 421 rotates, it drives the linkage shaft 51 to rotate through the spline, at this time, the inclined connecting rib 52 on the linkage shaft 51 rotates with the shaft, periodically pushes the first roller 610 on the abutting piece, after the first roller 610 is pressed, the plunger rod 63 is pushed to move into the plug cylinder 61 through the wheel frame 69 and the connecting shaft 68, the piston block 62 compresses the inner cavity of the plug cylinder 61, generates hydraulic pressure, at this time, the high-pressure cooling liquid in the plug cylinder 61 flows to the jet pipe 66 through the check valve 64 and the liquid delivery pipe 65, through the Venturi structure of the jet pipe 66, the high-pressure liquid flow is accelerated when passing through the throat pipe 661, forming a low-pressure area, low-pressure air is sucked in, mixed and atomized in the expansion pipe 662, and the cooling mist is sprayed to the contact point of the polishing block 423 and the device, providing cooling and lubrication for the polishing part; In addition, when the linkage shaft 51 rotates, the liquid storage structure 7 works through the bottom linkage, the wheel frame 69 of the bottom abutting piece drives the tooth plate 74 to reciprocate left and right, at this time, the tooth plate 74 engages the linkage gear 75 to drive the transmission sleeve 72 to rotate, and when the tooth plate 74 reciprocates left and right, the inclined sliding groove 79 cooperates with the second roller 78 to realize the lifting of the stirring shaft 73, and then realizes the rotation and reciprocating motion of the stirring shaft 73, effectively prevents the cooling liquid from precipitating, and ensures the stable performance of the liquid.

[0045] The above are preferred embodiments of the present application, which do not limit the protection scope of the present application, therefore: any equivalent changes made on the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A semiconductor device corner polishing assist apparatus characterized by comprising: Including setting up on the base (1) clamping mechanism (2) and polishing auxiliary equipment (3), the polishing auxiliary equipment (3) is by polishing assembly (4), piston assembly (6) and liquid storage structure (7) are composed, the polishing assembly (4) is provided with the linkage assembly (5) of driving piston assembly (6) and liquid storage structure (7) on, the polishing assembly (4) includes sleeve (41), the sleeve (41) is provided with the polishing piece (42) of polishing to semiconductor device, the bottom of sleeve (41) is installed with the electric guide rail (8) of sliding motor with base (1); The polishing piece (42) includes a transmission secondary shaft (421) mounted in the sleeve (41), a transmission main shaft (422) movably disposed in the sleeve (41) and extending into the transmission secondary shaft (421), a polishing block (423) mounted at an end of the transmission main shaft (422), a spline block (426) mounted on an outer surface of the transmission main shaft (422), and a spline groove (427) formed in the transmission secondary shaft (421) and matched with the spline block (426). The piston assembly (6) includes a plug cylinder (61) fixed to an outer surface of the sleeve (41), a piston block (62) slidably disposed in the plug cylinder (61), a plug rod (63) fixed to one side of the piston block (62), two check valves (64) mounted on an outer portion of the plug cylinder (61), two liquid delivery tubes (65) mounted on the two check valves (64), a spray pipe (66) mounted at an end of one of the liquid delivery tubes (65), and an abutting piece connected with the linkage assembly (5) provided at an end of the plug rod (63) away from the piston block (62). The clamping mechanism (2) includes a mounting frame (21) fixed to an upper surface of the base (1), a drive main shaft (22) rotatably mounted on the mounting frame (21), two clamping tables (23) distributed above and below and mounted on the drive main shaft (22), and a hydraulic telescopic rod (24) mounted on the mounting frame (21) and fixed to the top clamping table (23).

2. The semiconductor device corner polishing assist apparatus according to claim 1, characterized by: The sleeve (41) is hollow, a drive motor (424) is fixed to one side of the sleeve (41) close to the polishing block (423), and two transmission gears (425) engaged with each other are mounted on an output shaft of the drive motor (424) and an outer surface of the transmission main shaft (422).

3. The semiconductor device corner polishing assist apparatus according to claim 1, characterized by: A reset spring (428) is rotatably mounted between the outer surface of the transmission main shaft (422) and the inner wall of the sleeve (41), the transmission main shaft (422) is displaced by the electric guide rail (8) to contact and press the device, extends into the transmission secondary shaft (421), and drives the transmission secondary shaft (421) through the connection of the spline block (426) and the spline groove (427), and a pressure sensing module (429) is mounted at one end of the transmission main shaft (422) close to the spline groove (427).

4. The semiconductor device corner polishing assist apparatus according to claim 1, characterized by: ​ 5. The semiconductor device corner polishing assist apparatus according to claim 1, characterized by: The linkage assembly (5) comprises a linkage shaft (51) rotatably mounted at the end of the sleeve (41), the linkage shaft (51) is in spline connection with the end of the transmission pair shaft (421), and the outer surface of the linkage shaft (51) is fixedly connected with a connecting rib (52) arranged in an inclined manner.

6. The semiconductor device corner polishing assist apparatus according to claim 1, wherein: The nozzle (66) comprises two expansion pipes (662), the two expansion pipes (662) are fixedly connected with a throat pipe (661), the two expansion pipes (662) are arranged in a trumpet shape, and one of the expansion pipes (662) faces the polishing block (423), and the outer surface of the plug rod (63) and the end of the plug barrel (61) are provided with a buffer spring (67).

7. The semiconductor device corner polishing assist apparatus according to claim 5, characterized by: The abutting piece comprises a connecting shaft (68) fixed to one end of the plug rod (63) extending out of the plug barrel (61), the end of the connecting shaft (68) is fixed with a wheel carrier (69), the wheel carrier (69) is in the shape of a Chinese character and its concave surface is arranged downward, wherein the two downward ends of the wheel carrier (69) are rotatably provided with first rollers (610) abutting against the left and right sides of the connecting rib (52).

8. The semiconductor device corner polishing assist apparatus according to claim 7, wherein: The number of the abutting pieces is two, and the two abutting pieces are distributed above and below, the liquid storage structure (7) comprises a liquid storage barrel (71) fixed to one side of the electric guide rail (8), the inside of the liquid storage barrel (71) is provided with a stirring assembly, and the stirring assembly is connected with the outer surface of the bottom wheel carrier (69).

9. The semiconductor device corner polishing assist apparatus of claim 8, wherein: The stirring assembly comprises a transmission sleeve (72) rotatably mounted in the inside of the liquid storage barrel (71), the inside of the liquid storage barrel (71) is provided with a stirring shaft (73) extending to the top side thereof and penetrating through the inside of the transmission sleeve (72), the outer surface of the transmission sleeve (72) is fixed with a linkage gear (75), and the outside of the linkage gear (75) is engaged with a toothed plate (74) fixed to the outer surface of the bottom wheel carrier (69).

10. The semiconductor device corner polishing assist apparatus of claim 8, wherein: The outer surface of the bottom wheel carrier (69) is provided with an adjusting piece connected with the stirring shaft (73), the adjusting piece comprises a sliding plate (76) fixed to the outer surface of the bottom wheel carrier (69), the top end of the stirring shaft (73) is rotatably provided with a rotating head (731), the inside of the rotating head (731) is fixed with a linkage rod (77), one end of the linkage rod (77) is rotatably provided with a second roller (78), and the inside of the sliding plate (76) is provided with an inclined sliding groove (79) in rolling connection with the second roller (78).

Images