Bare copper wire surface deoxidizing device and using method thereof

Abstract

The invention belongs to the technical field of wire grinding, and particularly relates to a bare copper wire surface deoxidizing device and a using method thereof.The bare copper wire surface deoxidizing device comprises a grinding base and a control box installed at the top of the grinding base and further comprises a mounting plate, the mounting plate is fixedly installed on the side wall of the grinding base, and a plurality of oxidation detection units are inserted into the side wall of the mounting plate; each oxidation detection unit is used for detecting the surface roughness of the bare copper wire, the multiple insulation sleeves are fixedly inserted into the side wall of the polishing base, and a detachable mounting pipe is rotationally connected to the interior of each insulation sleeve. According to the device, the oxidation state and degree of the surfaces of the multiple bare copper wires can be monitored online in real time, the grinding time is automatically controlled based on the detection result, grinding piece abrasion is reduced, resource waste is reduced, the grinding efficiency is improved, meanwhile, grinding scraps can be rapidly collected, replacement of a loss piece is reminded in time, and the oxygen removal effect of the bare copper wires is prevented from being affected.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of wire polishing, and particularly relates to a bare copper wire surface oxygen removal device and a use method thereof. BACKGROUND

[0002] When the bare copper wire is stored or processed, the surface is easy to be oxidized to form an insulating oxide layer, which not only increases the contact resistance, causes the electric conduction loss and joint overheating, but also hinders the welding bonding force, and seriously affects the reliability and service life of electronic components, power transmission and the like, so the oxide layer needs to be polished and removed to restore the excellent electric conduction performance of copper.

[0003] At present, after the bare copper wire is polished to remove the surface oxides, the surface of the bare copper wire is subjected to anti-oxidation treatment in a timely manner, which is beneficial to improve the reliability of the bare copper wire, such as a copper wire surface corrosion prevention processing device disclosed in patent publication No. CN112318237B, which removes the surface oxides of the bare copper wire by polishing; however, since the positions and degrees of oxidation of different bare copper wires are different, if the bare copper wire is uniformly polished by the polishing device, the polishing resources will be wasted, such as accelerated wear of the polishing part, increased replacement frequency of the polishing part, affected polishing and oxygen removal efficiency, and the positions of the bare copper wire which are not oxidized will be polished. SUMMARY

[0004] The application aims to provide a bare copper wire surface oxygen removal device and a use method thereof.

[0005] To achieve the above-mentioned purpose, the application adopts the following technical scheme: a bare copper wire surface oxygen removal device, comprising a polishing base and a control box installed on the top of the polishing base, further comprising: A mounting plate is fixedly installed on the side wall of the polishing base, a plurality of oxidation detection units are inserted into the side wall of the mounting plate, and each oxidation detection unit is used for detecting the surface roughness of the bare copper wire; A plurality of insulation sleeves are fixedly inserted into the side wall of the polishing base, a detachable mounting pipe is rotatably connected in the interior of each insulation sleeve, a polishing pipe is inserted into the interior of each mounting pipe, a locking assembly is installed on each mounting pipe, the polishing pipe is fixedly connected with the mounting pipe through the locking assembly, a plurality of polishing units are uniformly arranged in the interior of each polishing pipe, and the control box controls the working of the corresponding polishing unit according to the electric signal fed back by each oxidation detection unit; A driving unit is installed on the top of the polishing base, and the driving unit is used for driving the rotation of each mounting pipe; A chip removal unit is installed on the side wall of the polishing base, and the chip removal unit is used for adsorbing and collecting the waste chips generated during polishing.

[0006] Preferably, each of the oxidation detection units comprises a fixed tube fixedly inserted into the side wall of the mounting plate, the fixed tube is coaxial with the corresponding polishing tube, an annular lamp holder and an annular detection seat are fixedly installed inside the fixed tube, and the side walls of the annular lamp holder and the annular detection seat on the opposite side are both provided with an annular inclined surface, the annular inclined surface of the annular lamp holder is fixedly installed with an annular laser light strip, and the annular inclined surface of the annular detection seat is fixedly installed with an annular photosensitive resistor, the annular laser light strip emits a laser beam at an angle of 45° with the bare copper wire, and the laser beam is reflected to the photosensitive surface of the annular photosensitive resistor through the bare copper wire, and the annular laser light strip and the annular photosensitive resistor are electrically connected with the control box.

[0007] Preferably, each of the polishing units comprises a plurality of arc-shaped blocks arranged inside the polishing tube, and each of the arc-shaped blocks is uniformly distributed in a ring shape about the axis of the polishing tube, the inner arc surface of each of the arc-shaped blocks is provided with a detachable arc-shaped polishing cotton pad, the polishing tube is fixedly inserted with a plurality of magnetic separation cylinders corresponding to the positions of the arc-shaped blocks, the inside of each of the magnetic separation cylinders is slidably provided with a magnetic separation plate, a group of slide rods are fixedly arranged between each of the magnetic separation plates and the arc-shaped block on the same side, each of the slide rods is slidably connected with the cylinder end of the magnetic separation cylinder on the same side, a group of non-magnetic springs are fixedly arranged between each of the magnetic separation plates and the inner side wall of the magnetic separation cylinder on the same side, and a permanent magnet is fixedly connected to the end of each of the magnetic separation plates away from the arc-shaped block on the same side, a plurality of electromagnetic elements corresponding to the positions of the permanent magnets are fixedly inserted into the inner tube wall of the mounting tube, and the control box controls the operation of each of the electromagnetic elements according to the electrical signal fed back by the annular photosensitive resistor.

[0008] Preferably, the driving unit comprises a driving motor fixedly installed at the top of the polishing base, and the output end of the driving motor is drivingly connected with a driving gear, the outer tube wall of each of the mounting tubes is fixedly sleeved with a driven gear, and the adjacent two driven gears are meshed with each other, the driving gear is meshed with one of the driven gears, and the driving motor is electrically connected with the control box.

[0009] Preferably, the scrap removal unit comprises a collection box fixedly inserted into the side wall of the polishing base, the inner tube wall of each of the mounting tubes is provided at the end away from the mounting plate with a sealing cover, the end of each of the sealing covers is provided with a wire hole, the side wall of each of the sealing covers is fixedly inserted with a collection tube in communication with the collection box, a filter screen is fixedly installed inside the collection box, and each of the collection tubes is arranged above the filter screen, a suction pump is fixedly installed on the side wall of the polishing base, an accumulation recording mechanism is arranged between the air suction end of the suction pump and the bottom of the collection box, and the suction pump is in communication with the collection box through the accumulation recording mechanism.

[0010] Preferably, the cumulative recording mechanism includes multiple Y-shaped tubes fixedly inserted into the bottom of the collection box. A hollow plate is fixedly installed on the side wall of the grinding base. Multiple gas flow meters are fixedly connected to the top of the hollow plate. One lower end of the Y-shaped tube is connected to the hollow plate, and the other lower end of the Y-shaped tube is connected to the hollow plate through a gas flow meter. A normally open proportional solenoid valve is fixedly installed inside one branch of the Y-shaped tube, and a normally closed proportional solenoid valve is fixedly installed inside the other branch of the Y-shaped tube. The normally closed proportional solenoid valve is located at the inlet end of the gas flow meter. The suction end of the suction pump is connected to the hollow plate. The control box controls the corresponding normally open and normally closed proportional solenoid valves to work according to the electrical signals fed back by each annular photoresistor. The gas flow meter is electrically connected to the control box.

[0011] Preferably, each of the fixed tubes has two rubber rings installed inside, and the annular lamp holder and the annular detection seat are disposed between the two rubber rings, with the inner wall of the rubber rings in sliding contact with the surface of the bare copper wire.

[0012] The above-mentioned method of using a bare copper wire surface deoxidation device includes the following steps: S1. Pass the bare copper wire through the corresponding fixed tube, the arc-shaped polishing pads inside the polishing tube and the sealing cover in sequence, and finally extend it out from the wire passage hole of the sealing cover and connect it to the external winding equipment. S2. Start the control box and external winding equipment. The control box will control the oxidation detection unit and drive unit to work. The oxidation detection unit will feed back an electrical signal to the control box based on the degree of oxidation of the bare copper wire. S3. The control box controls the operation of each grinding unit based on the electrical signal fed back by the oxidation detection unit. S4. The control box starts the chip removal unit, which collects the waste chips generated during grinding. S5. After all the bare copper wires have been wound up by the external winding equipment, shut down the control box.

[0013] Compared with existing technologies, the advantages of a bare copper wire surface deoxidation device and its application method are as follows: 1. Through the cooperation of the set grinding base, control box, mounting plate and oxidation detection unit, the oxidation of multiple bare copper wire surfaces can be monitored in real time and the degree of oxidation can be monitored online. Through the cooperation of the set insulating sleeve, mounting tube, grinding tube, locking assembly, multiple grinding units and drive unit, the grinding time of the bare copper wire surface can be automatically controlled based on the degree of oxidation of the bare copper wire surface, thereby reducing the wear of grinding parts, reducing waste and improving grinding efficiency.

[0014] 2. The chip removal unit can quickly collect the chips generated during the polishing process, preventing them from accumulating inside the polishing tube and affecting the polishing effect on the bare copper wire.

[0015] 3. Through the cumulative recording mechanism set in the waste chip unit, the air source during chip removal can be used, and based on the detection results of the oxidation detection unit, personnel can be promptly reminded to replace worn grinding parts, so as to avoid excessive wear of grinding parts and failure to replace them in time, which would affect the deoxidation effect on bare copper wires. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a bare copper wire surface deoxidation device provided by the present invention; Figure 2 This is a schematic diagram of the oxidation detection unit of a bare copper wire surface deoxidation device provided by the present invention; Figure 3 This is a schematic diagram of the internal structure of the polishing base of a bare copper wire surface deoxidation device provided by the present invention; Figure 4 This invention provides a device for deoxidizing the surface of bare copper wires. Figure 3 Enlarged view of the structure of section A; Figure 5 This is a three-dimensional connection structure diagram of the insulating sleeve, mounting tube, and polishing tube of a bare copper wire surface deoxidation device provided by the present invention; Figure 6 This is a three-dimensional structural diagram of the polishing tube of a bare copper wire surface deoxidation device provided by the present invention; Figure 7 This is a schematic diagram of the internal structure of the magnetic shielding cylinder of a bare copper wire surface deoxidation device provided by the present invention; Figure 8 This is a side view of the grinding tube of a bare copper wire surface deoxidation device provided by the present invention; Figure 9 This is a side view of the discharge end of the grinding base of a bare copper wire surface deoxidation device provided by the present invention. Figure 10 This is a schematic diagram of the cumulative recording mechanism of a bare copper wire surface deoxidation device provided by the present invention.

[0017] In the diagram: 1 Grinding base, 2 Control box, 3 Mounting plate, 4 Oxidation detection unit, 41 Fixing tube, 42 Ring lamp holder, 43 Ring detection seat, 44 Ring laser light strip, 45 Ring photoresistor, 5 Insulating sleeve, 6 Mounting tube, 7 Grinding tube, 8 Locking assembly, 9 Grinding unit, 91 Arc block, 92 Arc grinding pad, 93 Magnetic shielding cylinder, 94 Magnetic shielding plate, 95 Slide rod, 96 Non-magnetic spring, 97 Permanent magnet, 98 Electromagnetic component, 10 Drive unit, 101 Drive motor, 102 Moving gear, 103 Stationary gear, 11 Chip removal unit, 111 Collection box, 112 Sealing cover, 113 Through hole, 114 Collection tube, 115 Filter screen, 116 Suction pump, 12 Accumulation recording mechanism, 121 Y-shaped tube, 122 Hollow plate, 123 Gas flow meter, 124 Normally open proportional solenoid valve, 125 Normally closed proportional solenoid valve, 13 Rubber ring. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0019] like Figures 1-10 As shown, a bare copper wire surface deoxidation device includes a polishing base 1 and a control box 2 installed on the top of the polishing base 1. It also includes a mounting plate 3, which is fixedly installed on the side wall of the polishing base 1. Multiple oxidation detection units 4 are inserted into the side wall of the mounting plate 3, and each oxidation detection unit 4 is used to detect the surface roughness of the bare copper wire. Each oxidation detection unit 4 includes a fixing tube 41 fixedly inserted into the side wall of the mounting plate 3, and the fixing tube 41 is coaxial with the corresponding polishing tube 7. An annular lamp holder 42 and an annular detection seat 43 are fixedly installed inside the fixing tube 41. Both the sidewalls of the ring lamp holder 42 and the ring detection seat 43 are provided with ring-shaped inclined surfaces. The ring-shaped laser light strip 44 is fixedly installed on the ring-shaped inclined surface of the ring lamp holder 42, and the ring-shaped photoresistor 45 is fixedly installed on the ring-shaped inclined surface of the ring detection seat 43. The ring-shaped laser light strip 44 emits a laser beam at a 45° angle to the bare copper wire. The laser beam is reflected by the bare copper wire to the photosensitive surface of the ring-shaped photoresistor 45. Both the ring-shaped laser light strip 44 and the ring-shaped photoresistor 45 are electrically connected to the control box 2. Within a certain range of light intensity, the greater the light intensity received by the ring-shaped photoresistor 45, the smaller its own resistance.

[0020] Multiple insulating sleeves 5 are fixedly inserted into the side wall of the grinding base 1, and each insulating sleeve 5 is rotatably connected to a detachable mounting tube 6. Each mounting tube 6 has a grinding tube 7 inserted inside, and each mounting tube 6 is equipped with a locking assembly 8. The grinding tube 7 is fixed to the mounting tube 6 by the locking assembly 8. The locking assembly 8 includes components such as a flange, bolts, and square snap-fit ​​blocks. The flange is fixed to the end of the mounting tube 6 by bolts, and the end of the grinding tube 7 has a slot that matches the square snap-fit ​​block. The square snap-fit ​​block is installed on the side wall of the flange. After the flange is fixed to the mounting tube 6, the grinding tube 7 can be fixed by snapping the square snap-fit ​​block into the slot. Furthermore, the cross-section of the grinding tube 7 is two separable semicircles, that is, the grinding tube 7 can be divided into two halves, which facilitates the replacement of the arc-shaped grinding cotton pad 92 inside.

[0021] Multiple grinding units 9 are evenly distributed inside each grinding tube 7. The control box 2 controls the corresponding grinding unit 9 to work based on the electrical signals fed back by each oxidation detection unit 4. Each grinding unit 9 includes multiple arc-shaped blocks 91 disposed inside the grinding tube 7. The arc-shaped blocks 91 are evenly distributed in a ring about the axis of the grinding tube 7. A detachable arc-shaped grinding cotton pad 92 is installed on the inner arc surface of each arc-shaped block 91. Multiple magnetic shielding cylinders 93 corresponding to the positions of the arc-shaped blocks 91 are fixedly inserted into the tube wall of the grinding tube 7. A magnetic shielding plate 94 is slidably disposed inside each magnetic shielding plate 94. A set of sliding rods 95 is fixedly disposed between each magnetic shielding plate 94 and the arc-shaped block 91 on the same side. Each sliding rod 95 is slidably connected to the cylinder end of the magnetic shielding cylinder 93 on the same side. A set of non-magnetic springs is fixedly disposed between each magnetic shielding plate 94 and the inner wall of the magnetic shielding cylinder 93 on the same side. Each of the springs 96 and the ends of each magnetic shielding plate 94 away from the arc-shaped block 91 on the same side are fixedly connected to a permanent magnet 97. Multiple electromagnetic components 98 corresponding to the positions of the permanent magnets 97 are fixedly inserted into the inner wall of the mounting tube 6. The control box 2 controls the operation of each electromagnetic component 98 according to the electrical signal fed back by the annular photoresistor 45. A magnetic shielding structure is set on the outer side of each electromagnetic component 98 to avoid interference between adjacent electromagnetic components 98. Secondly, a power take-off guide rail assembly (not shown in the figure) is set between the inner wall of the insulating sleeve 5 and the mounting tube 6. Specifically, it includes an annular power supply guide rail and a power take-off guide rail wheel, an elastic element, and a power take-off post installed on the outer wall of the mounting tube 6. The power take-off guide rail wheel rolls on the power supply guide rail, and the elastic element makes the power take-off post contact the wheel wall of the power take-off guide rail wheel. The control box 2 supplies power to the electromagnetic components 98 through the power supply guide rail, the power take-off guide rail wheel, and the power take-off post without affecting the normal rotation of the electromagnetic components 98.

[0022] The drive unit 10 is installed on the top of the grinding base 1 and is used to drive each mounting tube 6 to rotate. The drive unit 10 includes a drive motor 101 fixedly installed on the top of the grinding base 1, and the output end of the drive motor 101 is connected to a moving gear 102. Each mounting tube 6 has a stationary gear 103 fixedly sleeved on its outer tube wall, and two adjacent stationary gears 103 mesh with each other. The moving gear 102 meshes with one of the stationary gears 103. The drive motor 101 is electrically connected to the control box 2.

[0023] The chip removal unit 11 is installed on the side wall of the grinding base 1, and is used to adsorb and collect the waste chips generated during grinding. The chip removal unit 11 includes a collection box 111 fixedly inserted into the side wall of the grinding base 1. The inner wall of each mounting tube 6 is threaded with a sealing cover 112 at the end away from the mounting plate 3, and each sealing cover 112 has a through hole 113 at its end. A collection tube 114 connected to the collection box 111 is fixedly inserted into the side wall of each sealing cover 112. A filter screen 115 is fixedly installed inside, and each collection pipe 114 is set above the filter screen 115. A suction pump 116 is fixedly installed on the side wall of the grinding base 1. An accumulation recording mechanism 12 is set between the suction end of the suction pump 116 and the bottom of the collection box 111. The suction pump 116 is connected to the collection box 111 through the accumulation recording mechanism 12. A discharge pipe is inserted into the side wall of the collection box 111. The end of the discharge pipe is threaded with a sealing cap to facilitate the transfer of collected waste chips for processing.

[0024] The cumulative recording mechanism 12 includes multiple Y-shaped tubes 121 fixedly inserted into the bottom of the collection box 111. A hollow plate 122 is fixedly installed on the side wall of the grinding base 1. Multiple gas flow meters 123 are fixedly connected to the top of the hollow plate 122. One lower end of the Y-shaped tube 121 is connected to the hollow plate 122, and the other lower end of the Y-shaped tube 121 is connected to the hollow plate 122 through the gas flow meter 123. A normally open proportional solenoid valve 124 is fixedly installed inside one branch of the Y-shaped tube 121. Another branch has a normally closed proportional solenoid valve 125 fixedly installed inside. The normally closed proportional solenoid valve 125 is located at the inlet end of the gas flow meter 123. The suction end of the suction pump 116 is connected to the hollow plate 122. The control box 2 controls the corresponding normally open proportional solenoid valve 124 and normally closed proportional solenoid valve 125 to work according to the electrical signals fed back by each annular photoresistor 45. The gas flow meter 123 is electrically connected to the control box 2. The gas flow meter 123 can feed back an electrical signal to the control box 2 after the gas flow reaches the threshold.

[0025] Each fixed tube 41 has two rubber rings 13 installed inside, and the annular lamp holder 42 and the annular detection seat 43 are set between the two rubber rings 13. The inner wall of the rubber ring 13 slides in contact with the surface of the bare copper wire. The rubber ring 13 can not only block the influence of external light on the detection of bare copper wire, but also scrape off dust, oil and other dirt on the surface of the bare copper wire.

[0026] The operating principle of the present invention is explained as follows: The bare copper wire is passed through the corresponding fixed tube 41, the arc-shaped polishing cotton pads 92 inside the polishing tube 7 and the sealing cover 112 in sequence, and finally extends out from the wire passage hole 113 of the sealing cover 112 and connects to the external winding equipment. The control box 2 and the external winding equipment are started. After the control box 2 is started, it controls the ring laser light strip 44 and the ring photoresistor 45 to work. The ring laser light strip 44 emits a 45° laser beam, which is reflected by the bare copper wire to the ring photoresistor 45. If the surface of the bare copper wire is oxidized, its surface roughness increases and its color deepens (for example, a rose-red bare copper wire is oxidized to a dark red or brownish-black bare copper wire). At this time, because the roughness increases the diffuse reflection of light and the darker color increases the absorption of light, the light intensity reflected from the surface of the bare copper wire to the ring photoresistor 45 becomes smaller after the bare copper wire is oxidized. At this time, the resistance of the ring photoresistor 45 increases, so the electrical signal strength fed back to the control box 2 by the ring photoresistor 45 becomes lower. The more severe the oxidation, the lower the electrical signal strength fed back to the control box 2 by the ring photoresistor 45. Based on the electrical signal fed back by the ring photoresistor 45, control box 2 controls the number of working groups of polishing units 9 within the same polishing tube 7. Taking a feedback electrical signal of 20 mA as an example, control box 2 controls one group of polishing units 9 near the feed end of polishing tube 7 to work. When the electrical signal is 19 mA, control box 2 controls two groups of polishing units 9 at the feed end of polishing tube 7 to work, and so on. When the electrical signal is 18 mA, control box 2 controls three groups of polishing units 9 to work. Simultaneously, control box 2 controls two or more polishing units within the same polishing tube 7. During operation, each grinding unit 9 operates sequentially, with each grinding unit 9 operating for 2 seconds. Taking a 20 mA electrical signal as an example, after the bare copper wire, detected by the annular photoresistor 45 and the annular laser strip 44, enters the grinding tube 7 through the fixing tube 41, the control box 2 controls one group of grinding units 9 to operate for 2 seconds. When the electrical signal is 19 mA, the control box 2 controls two groups of grinding units 9 to operate, following the direction from the feed end to the discharge end of the grinding tube 7, first controlling the grinding unit 9 on the feed end side to operate for 2 seconds. After the current grinding unit 9 finishes its work, the next grinding unit 9 is controlled to work for 2 seconds, and so on. The annular photoresistor 45 updates its feedback electrical signal to the control box 2 every 2 seconds. Each time the control box 2 receives a feedback electrical signal from the annular photoresistor 45, it generates a set of control commands. Simultaneously, the control box 2 controls the multiple grinding units 9 within each grinding tube 7 to work according to the time sequence and the generated commands. After each grinding unit 9 completes its current grinding command, it immediately executes the next command. The external winding equipment... The speed of winding the bare copper wire is 3 cm per second. By detecting the degree of oxidation of the bare copper wire and controlling the number of working steps of the polishing unit 9 based on the degree of oxidation, the contact time between the polishing unit 9 and the bare copper wire can be minimized while ensuring the deoxidation effect. This reduces the wear on the arc-shaped polishing pad 92 inside the polishing unit 9 (wherein, since the gap between the fixed tube 41 and the polishing tube 7 is 6 cm, when the control box 2 generates the first polishing command, it will send the command to the polishing unit 9 after a 2-second delay to ensure accurate coverage of the oxidized area). After the control box 2 is started, it will synchronously control the drive motor 101 to work. The drive motor 101 drives one of the stationary gears 103 to rotate through the moving gear 102. Since the adjacent stationary gears 103 mesh, each stationary gear 103 rotates synchronously. At this time, each mounting tube 6 will drive the grinding tube 7 to rotate synchronously through the locking component 8, so that each grinding unit 9 rotates synchronously. By rotating and grinding, the oxides of the bare copper wire are effectively and quickly removed. When the grinding unit 9 is working, the control box 2 controls the corresponding electromagnetic component 98 to work. The electromagnetic component 98 will generate a magnetic repulsion force on the permanent magnet 97. At this time, the permanent magnet 97 will drive the arc block 91 to move towards the bare copper wire through the magnetic shielding plate 94 and the slide rod 95, so that the arc grinding pad 92 abuts against the outer surface of the bare copper wire. With the rotation action, the oxides on the surface of the bare copper wire can be fully removed. Secondly, after the control box 2 is started, it will also control the suction pump 116 to work. The suction pump 116 generates negative pressure suction in each sealing cover 112 through the hollow plate 122, Y-shaped tube 121, collection box 111 and each collection pipe 114, so that negative pressure suction can also be generated at the feed end of each grinding tube 7 (a sealing ring is installed at the through hole 113, and the bare copper wire passes through the inside of the sealing ring. The sealing ring can prevent external air from entering the sealing cover 112 through the through hole 113). This generates airflow in the grinding tube 7. Under the action of the airflow, the waste generated by grinding enters the collection box 111 through the sealing cover 112 and the collection pipe 114, and is intercepted in the collection box 111 by the filter screen 115. Meanwhile, each time control box 2 receives an electrical signal from the annular photoresistor 45, it controls the energizing intensity of the normally open proportional solenoid valve 124 and normally closed proportional solenoid valve 125 within the corresponding Y-tube 121 according to the signal. When the bare copper wire surface is not oxidized and does not require polishing, the normally closed proportional solenoid valve 125 and normally open proportional solenoid valve 124 are not energized. At this time, all the air entering the Y-tube 121 flows through the normally open proportional solenoid valve 124. When the bare copper wire is oxidized, and the more severe the oxidation, the greater the surface roughness of the bare copper wire, and the greater the wear on the arc-shaped polishing pad 92. At this time, the current flowing into the normally open proportional solenoid valve 124 and normally closed proportional solenoid valve 125 is greater, thus making the normally open proportional solenoid valve 124 open less, while the normally closed proportional solenoid valve 125 opens more. As the flow rate increases, the airflow at the normally closed proportional solenoid valve 125 increases, and the flow rate measured by the gas flow meter 123 increases accordingly. When the gas flow meter 123 reaches the threshold, it will send an electrical signal to the control box 2. At this time, the control box 2 will immediately sound an alarm to remind personnel to replace the arc-shaped polishing pad 92. Since the first set of polishing units 9 at the feed end of the polishing tube 7 is the first to come into contact with the oxidation position of the bare copper wire, the wear of this set of polishing units 9 is the highest. After receiving the alarm signal, the staff needs to remove the polishing tube 7 in time and replace the arc-shaped polishing pad 92 of the polishing unit 9. At the same time, since the arc-shaped polishing pad 92 closest to the discharge end of the polishing tube 7 is the least worn, the arc-shaped polishing pad 92 near the discharge end can be replaced as appropriate.

[0027] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A device for deoxidizing the surface of bare copper wire, comprising a polishing base (1) and a control box (2) mounted on top of the polishing base (1), characterized in that, Also includes: Mounting plate (3) is fixedly installed on the side wall of the polishing base (1). Multiple oxidation detection units (4) are installed on the side wall of the mounting plate (3), and each oxidation detection unit (4) is used to detect the surface roughness of bare copper wire. Multiple insulating sleeves (5) are fixedly inserted into the side wall of the grinding base (1), and each insulating sleeve (5) is rotatably connected to a detachable mounting tube (6). Each mounting tube (6) is fitted with a grinding tube (7), each mounting tube (6) is fitted with a locking component (8), and the grinding tube (7) is fixed relative to the mounting tube (6) by the locking component (8). Multiple grinding units (9) are evenly distributed inside each grinding tube (7), and the control box (2) controls the corresponding grinding unit (9) to work according to the electrical signal fed back by each oxidation detection unit (4). A drive unit (10) is installed on the top of the grinding base (1), and the drive unit (10) is used to drive each mounting tube (6) to rotate; A chip removal unit (11) is installed on the side wall of the grinding base (1), and the chip removal unit (11) is used to adsorb and collect the waste chips generated during grinding.

2. The device for deoxidizing the surface of bare copper wire according to claim 1, characterized in that, Each of the oxidation detection units (4) includes a fixed tube (41) fixedly inserted into the side wall of the mounting plate (3), and the fixed tube (41) is coaxial with the corresponding grinding tube (7). The fixed tube (41) is fixedly installed with an annular lamp holder (42) and an annular detection seat (43). The side walls of the annular lamp holder (42) and the annular detection seat (43) facing each other are provided with annular inclined surfaces. The annular laser light strip (44) is fixedly installed on the annular inclined surface of the annular lamp holder (42), and the annular photoresistor (45) is fixedly installed on the annular inclined surface of the annular detection seat (43). The annular laser light strip (44) emits a laser beam at a 45° angle to the bare copper wire. The laser beam is reflected by the bare copper wire to the photosensitive surface of the annular photoresistor (45). The annular laser light strip (44) and the annular photoresistor (45) are both electrically connected to the control box (2).

3. The device for deoxidizing the surface of bare copper wire according to claim 2, characterized in that, Each of the grinding units (9) includes multiple arc-shaped blocks (91) disposed inside the grinding tube (7), and each arc-shaped block (91) is evenly distributed in a ring about the axis of the grinding tube (7). Each arc-shaped block (91) has a detachable arc-shaped grinding pad (92) installed on its inner arc surface. Multiple magnetic shielding cylinders (93) corresponding to the positions of the arc-shaped blocks (91) are fixedly inserted into the wall of the grinding tube (7), and each magnetic shielding cylinder (93) has a magnetic shielding plate (94) slidably disposed inside its interior. Each magnetic shielding plate (94) is fixedly disposed with a set of sliding plates between itself and the arc-shaped block (91) on the same side. The rod (95) and each sliding rod (95) are slidably connected to the end of the magnetic shielding cylinder (93) on the same side. Each magnetic shielding plate (94) and the inner wall of the magnetic shielding cylinder (93) on the same side are fixedly provided with a set of non-magnetic springs (96). Each magnetic shielding plate (94) is fixedly connected to a permanent magnet (97) at the end away from the arc block (91) on the same side. The inner wall of the mounting tube (6) is fixedly inserted with multiple electromagnetic components (98) corresponding to the position of the permanent magnet (97). The control box (2) controls the operation of each electromagnetic component (98) according to the electrical signal fed back by the ring photoresistor (45).

4. The device for deoxidizing the surface of bare copper wire according to claim 3, characterized in that, The drive unit (10) includes a drive motor (101) fixedly installed on the top of the grinding base (1), and the output end of the drive motor (101) is connected to a moving gear (102). The outer wall of each of the mounting tubes (6) is fixedly sleeved with a stationary gear (103), and two adjacent stationary gears (103) mesh with each other. The moving gear (102) meshes with one of the stationary gears (103). The drive motor (101) is electrically connected to the control box (2).

5. The device for deoxidizing the surface of bare copper wire according to claim 4, characterized in that, The chip removal unit (11) includes a collection box (111) fixedly inserted into the side wall of the grinding base (1). Each of the mounting pipes (6) has a sealing cover (112) threaded onto the end of its inner wall away from the mounting plate (3). Each sealing cover (112) has a through hole (113) at its end. Each sealing cover (112) has a collection pipe (114) fixedly inserted into its side wall, which is connected to the collection box (111). A filter screen (115) is fixedly installed inside the collection box (111). Each collection pipe (114) is positioned above the filter screen (115). A suction pump (116) is fixedly installed on the side wall of the grinding base (1). An accumulation recording mechanism (12) is provided between the suction end of the suction pump (116) and the bottom of the collection box (111). The suction pump (116) is connected to the collection box (111) through the accumulation recording mechanism (12).

6. The device for deoxidizing the surface of bare copper wire according to claim 5, characterized in that, The cumulative recording mechanism (12) includes multiple Y-shaped tubes (121) fixedly inserted into the bottom of the collection box (111). A hollow plate (122) is fixedly installed on the side wall of the grinding base (1). Multiple gas flow meters (123) are fixedly connected to the top of the hollow plate (122). One lower end of the Y-shaped tube (121) is connected to the hollow plate (122), and the other lower end of the Y-shaped tube (121) is connected to the hollow plate (122) through the gas flow meter (123). A normally open valve is fixedly installed inside one branch of the Y-shaped tube (121). A proportional solenoid valve (124) is provided, and a normally closed proportional solenoid valve (125) is fixedly installed inside another branch of the Y-shaped tube (121). The normally closed proportional solenoid valve (125) is located at the inlet end of the gas flow meter (123). The suction end of the suction pump (116) is connected to the hollow plate (122). The control box (2) controls the corresponding normally open proportional solenoid valve (124) and normally closed proportional solenoid valve (125) to work according to the electrical signals fed back by each annular photoresistor (45). The gas flow meter (123) is electrically connected to the control box (2).

7. The device for deoxidizing the surface of bare copper wire according to claim 2, characterized in that, Each of the fixed tubes (41) has two rubber rings (13) installed inside, and the annular lamp holder (42) and the annular detection seat (43) are arranged between the two rubber rings (13). The inner wall of the rubber ring (13) slides in contact with the surface of the bare copper wire.

8. The method of using the bare copper wire surface deoxidation device according to claim 5, characterized in that, The usage method includes the following steps: S1. Pass the bare copper wire through the corresponding fixed tube (41), the arc-shaped polishing pads (92) inside the polishing tube (7) and the sealing cover (112) in sequence, and finally extend it out from the wire hole (113) of the sealing cover (112) and connect it to the external winding equipment. S2. Start the control box (2) and the external winding equipment. The control box (2) will control the oxidation detection unit (4) and the drive unit (10) to work. The oxidation detection unit (4) will feed back an electrical signal to the control box (2) based on the degree of oxidation of the bare copper wire. S3, the control box (2) controls the operation of each grinding unit (9) based on the electrical signal fed back by the oxidation detection unit (4); S4. The control box (2) starts the chip removal unit (11) to work, and the chip removal unit (11) collects the waste chips generated during grinding; S5. After all the bare copper wires have been wound up by the external winding equipment, shut down the control box (2).

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