Full-automatic plate laminating machine and plate conveying control system thereof

Abstract

The invention relates to the technical field of automatic plate laminating processing, in particular to a full-automatic plate laminating machine which comprises a first conveying plane, a second conveying plane, a first driving assembly, a second driving assembly, a glue coating roller, a glue control roller and a rotating assembly. The second conveying plane is located below the first conveying plane, the conveying direction of the first conveying plane intersects with the conveying direction of the second conveying plane, and the included angle formed by the first conveying plane and the second conveying plane is an acute angle. The glue spreading roller is tangent to the glue control roller, the axis of the glue spreading roller and the axis of the glue control roller are located on the same plane, a groove formed in the tangent position of the glue spreading roller and the glue control roller is used for containing hot melt glue, the first conveying plane is tangent to the outer wall of the glue spreading roller, and a first plate is driven by the first driving assembly. And the second plate is driven by the second driving assembly. According to the full-automatic laminating machine, two plates can be fully automatically laminated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automatic lamination processing of plate materials, and particularly relates to a full-automatic plate lamination machine and a plate conveying control system thereof. BACKGROUND

[0002] In the commonly seen plate finished product (i.e., a plate material with smooth surface, color or pattern) in life, it is usually obtained by laminating two plate materials, such as laminating a thin plate with pattern or color, or laminating a smooth thin plate to the surface of a raw wood plate material, so as to increase the appearance and practicability of the plate material.

[0003] However, in the existing raw wood plate material processing and production process, the existing processing technology is usually to manually apply adhesive (generally EVA hot melt adhesive) to the bottom surface of the thin plate, and then manually or by mechanical equipment to laminate the side with the adhesive to the surface of the raw wood plate material, and finally to adjust the position and finally compact, so as to obtain the plate finished product, and thus to realize the decoration of the raw wood plate material, so as to increase the appearance and practicability of the plate material; but manual intervention is still required during the lamination process, and full automation cannot be realized, thus resulting in low lamination production efficiency; at the same time, since the EVA hot melt adhesive has certain viscosity and temperature, it is difficult to uniformly apply the hot melt adhesive to the bottom surface of the thin plate during manual application, thus resulting in low adhesive quality of the final plate finished product; and during the application and lamination, if the time for application and lamination is too long, the hot melt adhesive is prone to natural cooling and solidification, thus greatly increasing the difficulty of adjusting the position of the thin plate and the raw wood plate material when they do not correspond, and also reducing the adhesive quality of the plate material, and also extremely easily causing the thin plate or the raw wood plate material to be scrapped, thus increasing the manufacturing cost.

[0004] For example, a Chinese invention patent with the publication number "CN112455058A" and the patent name "Full-automatic plate lamination production line" is to solve the problem of how to ensure that two plate materials enter the bonding station at the same time, specifically by installing an upper plate trigger sensor on the discharge side of the upper plate conveying assembly, installing a lower plate trigger sensor on the feeding side of the lower plate conveying assembly, and installing a lower plate feeding sensor on the discharge side of the lower plate conveying assembly. When the lower plate feeds, the lower plate trigger sensor is triggered, and the upper and lower plates are fed at the same time. When the lower plate feeding sensor is triggered, the upper and lower plates are fed at the same time, so as to realize the simultaneous output of the upper and lower plates; however, in this technical solution, the problem of how to automatically apply adhesive cannot be solved, and the problem of how to fully automatically apply adhesive to the plate material cannot be solved.

[0005] Therefore, how to fully automatically laminate two plate materials is a problem to be solved by technical personnel at present. SUMMARY

[0006] To overcome the problems in the related art, the present application provides a full-automatic plate laminating machine and a plate conveying control system thereof, which can fully automatically laminate two plates.

[0007] To achieve the above-mentioned purpose, the present application provides a full-automatic plate laminating machine in the first aspect, comprising: A first conveying plane, a second conveying plane, a first driving assembly, a second driving assembly, a glue applying roller, a glue controlling roller and a rotating assembly; the second conveying plane is located below the first conveying plane, the conveying direction of the first conveying plane intersects with the conveying direction of the second conveying plane, and the included angle formed by the first conveying plane and the second conveying plane is an acute angle; the glue applying roller is tangent to the glue controlling roller, the axis of the glue applying roller and the axis of the glue controlling roller are located on the same plane, and the groove formed by the tangent position of the glue applying roller and the glue controlling roller is used for placing hot melt adhesive, and the outer wall of the glue applying roller is tangent to the first conveying plane; wherein the first driving assembly is used for driving the first plate located on the first conveying plane, the second driving assembly is used for driving the second plate located on the second conveying plane, and the rotating assembly is used for driving the glue applying roller to rotate.

[0008] Preferably, the end of the second conveying plane is provided with a plate pressing assembly, and the plate pressing assembly comprises a pressing roller and a first lifting mechanism; the first lifting mechanism is connected with the pressing roller and is used for controlling the lifting height of the pressing roller; The pressing roller is located above the second conveying plane, and the outer wall of the pressing roller is tangent to the second conveying plane, and the end of the first conveying plane corresponds to the tangent position of the pressing roller and the second conveying plane.

[0009] Preferably, the first plate is a thin plate, and the thickness of the second plate is greater than the thickness of the first plate; A thin plate pre-pressing assembly is further arranged between the pressing roller and the glue applying roller, and the thin plate pre-pressing assembly comprises a pre-pressing roller and a second lifting mechanism, the pre-pressing roller is close to one side of the pressing roller, and the second lifting mechanism is connected with the pre-pressing roller and is used for controlling the lifting height of the pre-pressing roller; The pre-pressing roller is located above the first conveying plane, and the vertical distance from the axis of the pre-pressing roller to the second conveying plane is greater than the vertical distance from the axis of the pressing roller to the second conveying plane.

[0010] Preferably, it further comprises a glue applying pressing roller, a thin plate flattening assembly and a thin plate supporting and conveying assembly, the thin plate supporting and conveying assembly comprises a rotating bottom roller, a first conveying supporting roller and a second conveying supporting roller; the thin plate flattening assembly comprises a pressing plate glue roller and a third lifting mechanism; The glue-applying roller is located directly above the glue-applying roller, and the first conveying plane is located between the glue-applying roller and the glue-controlling roller. The outer wall of the glue-applying roller is tangent to the first conveying plane. The sheet conveying assembly is located below the first conveying plane, the rotating bottom roller is located between the first conveying roller and the second conveying roller, the first conveying roller is located between the rotating bottom roller and the glue-applying roller, and the first conveying plane is tangent to the rotating bottom roller, the first conveying roller and the second conveying roller; The pressure plate rubber roller is located above the first conveying plane, and the pressure plate rubber roller is aligned with the rotating bottom roller. The third lifting mechanism is used to control the lifting height of the pressure plate rubber roller.

[0011] Preferably, it further includes two glue-blocking plates, which are respectively disposed on both sides of the groove formed at the tangent point of the glue-applying roller and the glue-controlling roller; the glue-blocking plate includes a glue-blocking part, a first hollow part and a second hollow part, the glue-blocking part is used to block the two sides of the groove, and the glue-blocking part is located between the first hollow part and the second hollow part. The first hollow part and the second hollow part are both arc-shaped, and the glue-blocking part is an irregular shape; The length of the coating roller is the same as the length of the control roller. Both ends of the coating roller are fitted with a first glue-blocking flange, and both ends of the control roller are fitted with a second glue-blocking flange. The first hollow part is adapted to the outer wall of the first glue-blocking flange, and the second hollow part is adapted to the outer wall of the second glue-blocking flange. The two glue-blocking plates, together with the grooves formed at the coating roller and the control roller, form a four-sided closed groove.

[0012] Preferably, the first drive assembly includes a first support plate, a first lead screw, and a first rotating device. The first support plate includes a first pulling part and a first transmission part. The first pulling part is provided with a first strip-shaped through hole. The nut seat of the first lead screw is provided with a first pulling block. The first lead screw is located directly below the first strip-shaped through hole, and the first pulling block is located inside the first strip-shaped through hole and moves within the first strip-shaped through hole. The first rotating device is used to control the rotation of the first lead screw. The first transmission part is located on the side close to the first conveying plane and is used to guide the first plate. The end of the first support plate is connected to the beginning of the first conveying plane, and the first support plate and the first conveying plane are located on the same plane.

[0013] Preferably, the second drive assembly includes a second support plate, a second lead screw, and a second rotating device. The second support plate includes a second pulling part and a second transmission part. The second pulling part is provided with a second strip-shaped through hole. The nut seat of the second lead screw is provided with a second pulling block. The second lead screw is located directly below the second strip-shaped through hole, and the second pulling block is located inside the second strip-shaped through hole and moves within the second strip-shaped through hole. The second rotating device is used to control the rotation of the second lead screw; the second transmission part is close to the end of the second conveying plane and is used to guide the second plate; and the second support plate is located on the same plane as the second conveying plane.

[0014] Preferably, it further includes a third rotating device; The first transmission part is also provided with a third strip-shaped through hole; The third strip-shaped through hole is also equipped with a first brush roller of the same size as the through hole; The first brush roller is controlled to rotate by the third transmission device; The width of the third strip-shaped through hole is greater than or equal to the width of the first conveying plane; The first brush roller is used to remove dust from the bottom surface of the first plate.

[0015] In a second aspect, this application also provides a sheet metal conveying control system, comprising: The fully automated board laminating machine described above, as well as the first through-beam photoelectric sensor, the second through-beam photoelectric sensor, and the control module, wherein the control module is electrically connected to the first through-beam photoelectric sensor, the second through-beam photoelectric sensor, the first drive assembly, and the second drive assembly, respectively. The first pair of photoelectric sensors is disposed on the first conveying plane and located between the beginning of the first conveying plane and the point where it is tangent to the coating roller. The first conveying plane is located between the light receiver and the light receiver of the first pair of photoelectric sensors. The second pair of photoelectric sensors is disposed on the second conveying plane and located between the beginning of the second conveying plane and the intersection point, where the intersection point refers to the point where the first and second conveying planes intersect. The second conveying plane is located between the light receiver and the light receiver of the second pair of photoelectric sensors. When the receiver of the first through-beam photoelectric sensor emits a first signal, and the receiver of the second through-beam photoelectric sensor does not emit a second signal, the control module controls the first driving component to stop driving the first plate on the first conveying plane according to the received first signal, and waits for the receiver of the second through-beam photoelectric sensor to emit a second signal. Until the receiver of the second through-beam photoelectric sensor emits a second signal, the control module controls the first driving component to drive the first plate on the first conveying plane to move forward at a first average speed according to the received second signal, and synchronously controls the second driving component to drive the second plate on the second conveying plane to move forward at a second average speed. The first average speed is a function of the second average speed.

[0016] Prior to this, when the receiver of the second photoelectric sensor emits a second signal and the receiver of the first photoelectric sensor does not emit a first signal, the control module controls the second driving component to stop driving the second plate on the second conveying plane according to the received second signal, and waits for the receiver of the first photoelectric sensor to emit a first signal. Until the receiver of the first photoelectric sensor emits a first signal, the control module controls the first driving component to drive the first plate on the first conveying plane to move forward at a first average speed according to the received first signal, and synchronously controls the second driving component to drive the second plate on the second conveying plane to move forward at a second average speed.

[0017] Preferably, when the receiver of the first photoelectric sensor emits a first signal and the receiver of the second photoelectric sensor emits a second signal, the control module controls the first driving component to drive the first plate on the first conveying plane to move forward at a first average speed, and simultaneously controls the second driving component to drive the second plate on the second conveying plane to move forward at a second average speed, based on the received first signal or the second signal.

[0018] The technical solution provided in this application may include the following beneficial effects: In this technical solution, a first drive assembly drives a first sheet material on a first conveying plane, causing the bottom surface of the first sheet material to adhere to a glue-applying roller. Then, a rotating assembly drives the glue-applying roller to rotate, applying hot melt adhesive from the groove formed at the tangent point of the glue-applying roller and the control roller to the bottom surface of the first sheet material. Next, the first drive assembly continues to drive the glue-applying first sheet material to move, while a second drive assembly drives a second sheet material on a second conveying plane to move. Since the conveying directions of the first and second conveying planes intersect at an acute angle, under the continuous drive of the first and second drive assemblies, and the continuous rotation of the rotating assembly, the glue-applying roller can evenly coat the entire bottom surface of the first sheet material with hot melt adhesive. Then, the first and second drive assemblies drive the first and second sheet materials in the same direction, respectively, causing the second sheet material to eventually intersect with the first sheet material, thereby bonding the first sheet material with hot melt adhesive to the surface of the second sheet material, ultimately achieving fully automated bonding of the two sheet materials. Attached Figure Description

[0019] The above and other objects, features and advantages of this application will become more apparent from the more detailed description of exemplary embodiments thereof in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments thereof.

[0020] Figure 1 This is a three-dimensional structural schematic diagram of a fully automated board laminating machine shown in an embodiment of this application; Figure 2 This is a side view of the fully automated board laminating machine shown in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the thin plate flattening assembly shown in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of the baffle plate shown in the embodiments of this application; Figure 5 This is another structural schematic diagram of the baffle plate shown in the embodiments of this application; In the figure: First conveying plane 10; Second conveying plane 20; First drive assembly 30, First support plate 31, First pulling part 311, First transmission part 312, First strip through hole 313, Third strip through hole 314; First lead screw 32, First rotating device 33, First pulling block 34; Third rotating device 35, First brush roller 36; Second drive assembly 40, Second support plate 41, Second pulling part 411, Second transmission part 412, Second strip through hole 413; Second lead screw 42, Second rotating device 43, Second pulling block 44; Fourth rotating device 45, Second brush roller 46 Box structure 47, preheating device 48; glue application roller 50, first glue-blocking flange 51; glue control roller 60, second glue-blocking flange 61; rotating assembly 70; plate pressing assembly 80, pressing roller 81, first lifting mechanism 82; thin plate pre-pressing assembly 90, pre-pressing roller 91; second lifting mechanism 92, glue application roller 93; thin plate flattening assembly 100, pressing plate glue roller 101, third lifting mechanism 102; thin plate conveying assembly 110, rotating bottom roller 111, first conveying roller 112, second conveying roller 113; groove A, glue-blocking plate B, glue-blocking part B1, first hollow part B2, second hollow part B3. Detailed Implementation

[0021] Preferred embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0022] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings. Example

[0023] In this embodiment, existing processing techniques often involve manually applying adhesive (usually EVA hot melt adhesive) to the bottom surface of a thin board, then manually or mechanically bonding the adhesive-coated side to the surface of the log board, followed by position adjustment and final compaction to obtain the finished board product. This decorative process enhances the aesthetics and practicality of the log board. However, manual intervention is still required during the bonding process, and full automation is not possible, leading to reduced bonding efficiency. Therefore, this embodiment provides a fully automated board bonding machine and its specific implementation method to overcome the current problem of low bonding efficiency between two boards. Specifically, the fully automated board bonding machine includes: The system comprises a first conveying plane 10, a second conveying plane 20, a first driving assembly 30, a second driving assembly 40, a glue-applying roller 50, a glue-controlling roller 60, and a rotating assembly 70. The second conveying plane 20 is located below the first conveying plane 10. The conveying direction of the first conveying plane 10 intersects with the conveying direction of the second conveying plane 20, and the angle formed by the first conveying plane 10 and the second conveying plane 20 is an acute angle (generally between 10° and 30°). The glue-applying roller 50 is tangent to the glue-controlling roller 60, and the axis of the glue-applying roller 50 and the axis of the glue-controlling roller 60 are located on the same plane. The groove A formed at the tangent point of the glue-applying roller 50 and the glue-controlling roller 60 is used to place hot melt adhesive, and the first conveying plane 10 is tangent to the outer wall of the glue-applying roller 50. The first driving assembly 30 is used to drive a first plate located on the first conveying plane, the second driving assembly 40 is used to drive a second plate located on the second conveying plane 10, and the rotating assembly 70 is used to drive the glue-applying roller 50 to rotate.

[0024] Compared to existing methods that involve manual bonding of boards, this example uses a first drive assembly to drive the first board on a first conveying plane, causing the bottom surface of the first board to adhere to the glue-applying roller. Then, a rotating assembly drives the glue-applying roller to rotate, applying the hot melt adhesive stored in the groove formed at the tangent point of the glue-applying roller and the control roller to the bottom surface of the first board. The first drive assembly then synchronously continues to move the glued first board, while a second drive assembly moves the second board on a second conveying plane. Since the conveying directions of the first and second conveying planes intersect... Furthermore, since the included angle is acute, the first plate with the same direction of movement will eventually intersect with the second plate. Therefore, under the continuous drive of the first and second drive components, and the continuous rotation of the rotating component, the glue-applying roller can evenly coat the bottom surface of the entire first plate with hot melt adhesive. Then, the first and second drive components drive the first and second plates respectively in the same direction, so that the second plate eventually intersects with the first plate. Combined with the fact that the bottom surface of the first plate has adhesive, the first plate with hot melt adhesive is automatically bonded to the surface of the second plate, achieving efficient bonding of the two plates together and improving the efficiency of plate bonding.

[0025] In practical applications, the hot melt adhesive used for bonding the first and second boards is EVA hot melt adhesive. Due to the viscosity and temperature of EVA hot melt adhesive, it is often difficult to apply it evenly to the bottom surface of the thin board during manual application, leading to a decrease in the bonding quality of the final board product. Furthermore, EVA hot melt adhesive itself often has a certain viscosity, and manual application to the entire board is time-consuming. This results in excessively long application and bonding times, causing the hot melt adhesive to cool and solidify naturally. Consequently, when the thin board and the original wood board do not align, it significantly increases the difficulty of adjusting their positions, further reducing the bonding quality and easily leading to the scrapping of either the thin board or the original wood board, thus increasing manufacturing costs. Therefore, the technical solution provided in this example not only solves all the aforementioned technical problems but also improves efficiency and enables uniform adhesive application to the first board.

[0026] However, after the two boards are bonded together, due to the excessively fast bonding speed, the hot melt adhesive has not cooled and solidified, thus failing to completely and stably bond the two boards together. Consequently, the two boards continue to move after bonding, which can easily lead to misalignment or lateral displacement, resulting in an unsatisfactory bonding effect. Therefore, to further improve the quality of board bonding, this example adds a board pressing assembly 80 at the end of the second conveying plane 20, based on the original equipment body. This board pressing assembly includes a pressing roller 81 and a first lifting mechanism 82. Then, by using the first lifting roller... The lowering mechanism 82 is connected to the pressing roller 81, controlling the lifting height of the pressing roller 81. At the same time, the pressing roller is positioned above the second conveying plane, with its outer wall tangent to the second conveying plane. Simultaneously, the end of the first conveying plane is aligned with the tangent point between the pressing roller and the second conveying plane. This allows the first board material to be directly conveyed below the pressing roller after being simultaneously glued and bonded to the second board material. Then, the first lifting mechanism pushes the pressing roller down to press the bonded first and second boards together in a timely manner, ensuring the quality of the bonded first and second boards and enabling automation.

[0027] For example, when the first plate, initially placed on the first conveying plane, is driven to the intersection by the first drive assembly, the bottom surface of the first plate has already been evenly coated with glue by the glue-applying roller. Simultaneously, the second plate, initially placed on the second conveying plane, is also driven to the intersection by the second drive assembly and is then bonded together. At this time, the pressing roller will simultaneously press the first and second plates that have just been bonded together to ensure the bonding effect of the first and second plates. Moreover, in this process, the first and second plates can be pressed together immediately after bonding, thus avoiding the problem of offset or lateral displacement caused by the plates continuing to move after bonding. This ensures the quality of the plates after bonding, achieves automation, and improves the bonding efficiency.

[0028] In addition, it should be noted that since the first plate is a thin plate and the plate itself has a certain degree of brittleness, the angle between the first conveying plane and the second conveying plane is generally within 30° during lamination, with 15° being optimal, to ensure that the plate will not break during conveying due to an excessively large angle, resulting in material waste and the inability to laminate and overlap the plates.

[0029] It should be noted that both the first and second conveying planes are virtual planes, intersecting at an acute angle. Therefore, during the conveying of the first and second boards, the glued first and second boards can move along a set path and complete the bonding process. Furthermore, when the first board moves on the first conveying plane, the rotating component drives the glue-applying roller to rotate, uniformly applying the hot melt adhesive from the groove where the glue-applying roller and the control roller intersect. Simultaneously, the second driving component drives the second board to move on the second conveying plane, providing power support for the conveying of the second board, enabling it to meet the glued first board at a preset position. And complete the bonding; specifically, the first conveying plane and the second conveying plane constitute the basic conveying structure of the fully automated board bonding machine. The two intersect at an acute angle to form a unique three-dimensional conveying layout. The included angle can be less than or equal to 45° or other acute angle values ​​can be used. A smaller included angle (such as ≤45°) helps to shorten the transmission path of the board before bonding, improve space utilization efficiency, and facilitate the compact layout of each component. Choosing other acute angles allows for flexible adjustment of the form of the conveying system according to the actual production site, board size, and process requirements, ensuring that the first board and the second board can cooperate to complete the gluing and bonding process with a reasonable movement trajectory, meeting diverse production needs.

[0030] It should also be noted that in this example, the coating roller is tangent to the control roller, and the centerlines of the coating roller and the control roller are located on the same plane. Since both the coating roller and the control roller are cylindrical, a groove can be formed at their tangency point. This groove can be used to hold hot melt adhesive (the storage capacity is small, so it needs to be continuously replenished). This allows the coating roller and the control roller to cooperate in storing and coating the hot melt adhesive. When the coating roller rotates, its surface can carry the hot melt adhesive out of the groove and apply it to the control roller. The adhesive is evenly applied to the bottom surface of the first board to ensure the stability and uniformity of the adhesive application process. Hot melt adhesive is a plastic and environmentally friendly adhesive that is solid at room temperature and melts into a viscous liquid when heated. It is widely used due to its advantages such as being solvent-free, having high bonding strength, and being simple to process. In this embodiment, the hot melt adhesive is a 100% solid fusible polymer that does not require solvents or contain water. It is solid at room temperature and melts into a flowable liquid adhesive with a certain viscosity when heated. After melting, it is a light brown semi-transparent substance. Example

[0031] In this embodiment, existing board bonding often involves bonding a thinner board to a thicker log (i.e., the second board). The thinner board serves as a decorative surface to ensure the aesthetics of the board. Specifically, the first board is thin, and the second board is thicker than the first board. However, thin boards (i.e., the first board) inherently possess certain defects, such as warping, bending, breakage, and unevenness, making it difficult to guarantee a smooth bonding process during automated bonding. This negatively impacts the bonding effect. Therefore, to overcome these problems and address the issue of uneven glue application when bonding thin boards, this embodiment also incorporates a thin board pre-pressing component 90 on the existing equipment body to pre-press the thin board. Component 90 is disposed between the pressing roller 81 and the glue-applying roller 50. The pre-pressing roller 91 of the thin plate pre-pressing component 90 is positioned on the side close to the pressing roller 81. Then, the second lifting mechanism 92 of the thin plate pre-pressing component 90 is connected to the pre-pressing roller 91. The lifting height of the pre-pressing roller is controlled by the second lifting mechanism, so that the pre-pressing roller can be located above the first conveying plane 10, and the vertical distance from the axis of the pre-pressing roller 91 to the second conveying plane 20 is greater than the vertical distance from the axis of the pressing roller 81 to the second conveying plane 20. This ensures that after the thin plate is glued, it can be pre-pressed by the pre-pressing roller before being bonded to the thick plate, preventing it from being directly crushed during bonding, which would lead to bonding failure and ultimately waste of costs.

[0032] Specifically, after the thin sheet is coated with glue on its bottom surface by the glue-coating roller, it needs to be conveyed to the intersection of the first conveying plane and the second conveying plane. However, since the first conveying plane and the second conveying plane have a certain angle, the thin sheet itself is brittle and prone to warping, bending, breaking, and unevenness. If it is directly pressed, it will inevitably break during the bonding process, resulting in adverse consequences. Therefore, in this example, the pre-pressing roller of the thin sheet pre-pressing assembly is set on the side close to the pressing roller, and the vertical distance from the axis of the pre-pressing roller to the second conveying plane is set to be greater than the vertical distance from the axis of the pressing roller to the second conveying plane. This pre-presses and flattens the glued thin sheet before bonding, ensuring the quality of the sheet bonding.

[0033] Furthermore, it should be noted that the thin material mentioned above has certain defects, such as easy warping, easy bending and breakage, and unevenness. Therefore, whether before, during, or after applying glue, or during lamination, the thin board will exhibit these problems, and is very likely to lead to lamination failure. To overcome the problems caused by thin board lamination, this example, in addition to the original equipment body, also includes a glue-applying roller 93, a thin board flattening assembly 100, and a thin board conveying assembly 110. The thin board conveying assembly... Component 110 includes a rotating bottom roller 111, a first conveying roller 112, and a second conveying roller 113. The thin plate flattening assembly 100 includes a pressure plate rubber roller 101 and a third lifting mechanism 102. In this example, the glue-applying roller 93 is positioned directly above the glue-applying roller 50, so that its first conveying plane 10 is located between the glue-applying roller 93 and the glue-controlling roller 60. Simultaneously, the outer wall of the glue-applying roller 93 is set to be tangent to the first conveying plane 10, thus enabling the thin plate conveying assembly 110 to... The first conveying plate 10 is located below the first conveying plane 10. Additionally, in this example, the rotating bottom roller 111 is positioned between the first conveying roller 112 and the second conveying roller 113, with the first conveying roller 112 positioned between the rotating bottom roller 111 and the coating roller 50, ensuring the thin plate can be continuously driven for conveying. Simultaneously, in this example, the first conveying plane 10 is tangent to the rotating bottom roller 111, the first conveying roller 112, and the second conveying roller 113, ensuring the first sheet material (i.e., the thin plate) can be accurately conveyed onto the coating roller for coating. Furthermore, in this example, the pressure plate coating roller 101 is positioned above the first conveying plane 10, aligning with the rotating bottom roller 111, ensuring the first sheet material can be leveled before coating. The lifting height of the pressure plate coating roller is controlled by the third lifting mechanism 102 to accommodate thin plates of different thicknesses and to slowly level the thin plate.

[0034] For example, when the first drive assembly drives the first sheet material (thin sheet) to move on the first conveying plane, the first sheet material passes through the first conveying roller, the rotating bottom roller, and the second conveying roller in sequence. The first and second conveying rollers support the first sheet material. Then, the rotating bottom roller and the pressure plate roller cooperate to level the first sheet material supported by the first and second conveying rollers, solving the problems of the first sheet material (thin sheet) being prone to warping, bending, breaking, and unevenness. After leveling, the leveled first sheet material is immediately fed into the space between the glue application roller and the glue control roller through the first conveying roller. The glue application roller and the glue control roller apply glue evenly to the first sheet material while providing power (i.e., the friction generated between the glue application roller, the first sheet material, and the glue control roller conveys the first sheet material). This allows the leveled and glued first sheet material to be conveyed to the pressing roller for bonding and pressing, thereby achieving fully automated high-quality bonding of the first and second sheets material and improving the efficiency of sheet material coating. Example

[0035] In the actual fully automated board lamination process, the groove formed at the tangent of the coating roller and the control roller is used to place hot melt adhesive. Therefore, before the hot melt adhesive is evenly adhered to the coating roller, the control roller needs to apply the hot melt adhesive placed in the groove onto the coating roller. For this purpose, hot melt adhesive needs to be placed in the groove in advance so that the hot melt adhesive can be evenly adhered to the coating roller when the control roller rotates, thereby achieving the even application of hot melt adhesive to the first board (thin board). For example, a box for storing hot melt adhesive can be set above the groove, and a control valve can be set to drip the hot melt adhesive in the box into the groove. Then, the control roller is rotated, which in turn drives the coating roller to rotate. At this time, the hot melt adhesive is still in the groove and spread evenly across the entire coating roller. The rotation of the control roller can make the hot melt adhesive evenly adhere to the entire coating roller.

[0036] Therefore, to ensure the stable storage of the hot melt adhesive in the groove, this example also includes two adhesive baffles B, respectively positioned on both sides of the groove formed at the tangent point of the coating roller 50 and the control roller 60. Each adhesive baffle B includes an adhesive-blocking portion B1, a first hollow portion B2, and a second hollow portion B3. The adhesive-blocking portion B1 serves to separate the two sides of the groove, and is located between the first hollow portion B2 and the second hollow portion B3. Both the first hollow portion B2 and the second hollow portion B3 are arc-shaped. The glue-blocking part is irregularly shaped; wherein, the length of the glue-applying roller 50 is the same as the length of the glue-controlling roller 60, and both ends of the glue-applying roller are fitted with a first glue-blocking flange 51, and both ends of the glue-controlling roller 60 are fitted with a second glue-blocking flange 61, the first hollow part B2 is adapted to the outer wall of the first glue-blocking flange 51, and the second hollow part B3 is adapted to the outer wall of the second glue-blocking flange 61; the two glue-blocking plates B, together with the grooves A formed at the glue-applying roller 50 and the glue-controlling roller 61, together form a four-sided closed groove.

[0037] Specifically, in this example, baffle plates are installed on both sides of the groove, and the glue-applying roller is set to the same length as the glue-controlling roller. First baffle flanges are fitted onto both ends of the glue-applying roller, and second baffle flanges are fitted onto both ends of the glue-controlling roller. The baffle plates are irregularly shaped, with a baffle portion, a first hollow portion, and a second hollow portion. The second hollow portion is shaped to fit the outer wall of the second baffle flange, and the first hollow portion is shaped to fit the outer wall of the first baffle flange. This ensures that when the hot melt adhesive drips into the groove... The two baffle plates, together with the grooves formed at the glue-applying roller and the glue-controlling roller, constitute a four-sided closed groove. This groove is used to store a large amount of hot melt adhesive to be applied and to prevent the hot melt adhesive from leaking out on both sides, thus avoiding waste and increasing production costs. At the same time, since the groove has become a four-sided closed groove, the hot melt adhesive will flow and spread evenly throughout the groove after standing for a period of time. Under the rotation of the glue-applying roller, the hot melt adhesive will evenly cover the entire glue-applying roller and the glue-controlling roller, so that the glue-applying roller can completely and evenly apply the hot melt adhesive to the first board, ensuring the quality of board bonding.

[0038] In addition, it should be noted that, in order to ensure that the hot melt adhesive does not leak in the groove, both the coating roller and the control roller used in this example are glue rollers, and the two are tangent to each other, so that the hot melt adhesive can adhere to the coating roller and to the first plate. At the same time, in order to facilitate the application of glue to the first plate, the rotation direction of the coating roller in this example is the same as that of the control roller, with the coating roller rotating clockwise and the control roller rotating counterclockwise, and the tangent direction of the control roller and the coating roller is vertical. Example

[0039] In this embodiment, to ensure fully automated conveying and bonding of the first and second boards, a first drive assembly drives the first board to be conveyed on the first conveying plane, and a second drive assembly drives the second board to be conveyed on the second conveying plane, thereby achieving automated bonding of the two boards. In this example, the first drive assembly 30 includes a first support plate 31, a first lead screw 32, and a first rotating device 33. The first support plate 31 supports the first plate to be conveyed, and the first rotating device 33 drives the first lead screw 32 to rotate. The first support plate 31 includes a first pulling part 311 and a first transmission part 312. In this example, a first strip-shaped through hole 313 is provided on the first pulling part 311, and a first pulling block 34 is provided on the nut seat of the first lead screw 32. The first lead screw 32 is positioned directly below the first strip-shaped through hole 313, so that the first pulling block 34 is located inside the first strip-shaped through hole 313 and can move within the first strip-shaped through hole 313. Then, the rotation of the first lead screw is controlled by the first rotating device 33, and the first transmission part 312 is positioned near the first conveying plate. One side of the conveying plane 10 is used to guide the first plate and to align the end of the first support plate 31 with the beginning of the first conveying plane 10, so that the first support plate 31 and the first conveying plane 10 are on the same plane. Specifically, the first screw is rotated clockwise by the first rotating device to reset the first pulling block to the beginning, and the first plate is placed on the first support plate. Then, the first screw is rotated counterclockwise by the first rotating device to drive the first pulling block to move to its end in the first strip-shaped through hole. The first plate on the first support plate is pushed to move on the first conveying plane by the first pulling block, and the first plate is conveyed to the thin plate conveying assembly for leveling and then gluing. This ensures that the first plate can be transported automatically, and achieves fully automated leveling and gluing of the first plate during transportation, as well as facilitating subsequent bonding and lamination with the second plate.

[0040] Similarly, this example also applies to the automated conveying of the second sheet material. For instance, the second drive assembly 40 in this example includes a second support plate 41, a second lead screw 42, and a second rotating device 43. The second support plate 41 includes a second pulling part 411 and a second transmission part 412. The second pulling part 411 is provided with a second strip-shaped through hole 413. The nut seat of the second lead screw 42 is provided with a second pulling block 44. The second lead screw 42 is located directly below the second strip-shaped through hole 413, and the second pulling block 44 is located inside the second strip-shaped through hole 413 and moves within it. The second rotating device 43 is used to control the rotation of the second lead screw 42. The second transmission part 411 is close to the end of the second conveying plane 20 and is used to guide the second sheet material. The second support plate 41 and the second conveying plane 20 are located on the same plane.

[0041] Specifically, in this example, the second rotating device rotates the second lead screw clockwise to reset the second pulling block to its starting end. Then, the second plate is placed on the second support plate. The second rotating device then rotates the second lead screw counterclockwise to drive the second pulling block to move towards its end in the second strip-shaped through hole. The second pulling block pushes the second plate on the second support plate to move on the second conveying plane until the second plate is conveyed to be bonded to the first plate after being coated with glue, ensuring that the second plate can be transported automatically.

[0042] Furthermore, it should be noted that since the boards accumulate a large amount of dust during transportation and generate a large amount of burrs and debris during processing, both the first and second boards often have a large amount of dust, burrs, wood debris, and other impurities on their surfaces before lamination or gluing. Therefore, cleaning is necessary before lamination to ensure the quality of the boards after lamination. To this end, this example also provides a third strip-shaped through hole 314 on the first transmission part 312 and a third rotating device 35. At the same time, this example also provides a first brush roller 36 with the same area as the third strip-shaped through hole 314 on the third strip-shaped through hole 314. The rotation of the first brush roller 36 is controlled by the third transmission device 35, and the first drive assembly 30 drives the first board. When moving on the first conveying plane 10, the first brush roller is controlled to rotate by the third transmission device to remove dust from the bottom surface of the first board. After dust removal, the first board is continuously driven to level it, and then glue is applied to the bottom surface of the first board, realizing fully automatic integrated dust removal, leveling and glue application of the first board. At the same time, to ensure the dust removal effect, the width of the third strip-shaped through hole is set to be greater than or equal to the width of the first conveying plane. The third strip-shaped through hole is perpendicular to the first strip-shaped through hole and is located on the side close to the thin plate flattening component. In addition, to prevent dust, burrs and wood chips from contaminating the first board again, a dust collection device (not shown in the figure) is also set to collect the dust, burrs and wood chips that are cleaned off by the first brush roller.

[0043] Conversely, to ensure a continuous supply of clean second boards on the second conveying plane 20, this example can also include a fourth rotating device 45 and a second brush roller 46 above the second conveying plane 20. By positioning the second brush roller 46 above the second conveying plane 20 and fixing it to the side near the end of the second support plate 41, making it tangent to the second conveying plane 20, the rotation of the second brush roller is controlled by the fourth rotating device 45, thus achieving automated cleaning of the surface of the second board. Simultaneously, to prevent secondary contamination of the second board by dust, burrs, and wood chips, this example can also include a box structure 47. The housing structure 47 has an opening. By placing the second brush roller 46 on the opening of the housing structure 47, and then using a dust extraction device (not shown in the figure) to absorb the dust, burrs, wood chips, and other impurities that are cleaned and detached by the second brush roller 46, the interior of the housing structure 47 can be recovered. Moreover, after dust removal and before bonding, in order to improve the quality of board bonding, this example also includes a preheating device 48. By placing the preheating device 48 above the second conveying plane, the second board is preheated during the transportation process, thereby preventing the hot melt adhesive from cooling down rapidly during bonding, ensuring that the second board can be smoothly bonded to the first board, and improving the bonding quality of the boards. Example

[0044] During the fully automated lamination process of the boards, when the first board is glued and then laminated with the second board at the intersection of the two conveying planes, the lack of effective compaction means makes it difficult to ensure the tightness of the adhesion between the two boards. This can easily lead to problems such as weak bonding and gaps, which in turn affect the quality and performance of the finished board. To address this technical problem, this example provides a board pressing assembly 80 at the end of the second conveying plane. The board pressing assembly 80 includes a pressing roller 81 and a first lifting mechanism 82. The first lifting mechanism 82 is connected to the pressing roller 81 and is used to control the lifting height of the pressing roller 81. The pressing roller 81 is located above the second conveying plane, and its outer wall is tangent to the second conveying plane. The end of the first conveying plane corresponds to the point where the pressing roller 81 is tangent to the second conveying plane. Thus, by setting the plate pressing assembly 80 at the end of the second conveying plane, the glued and bonded plates can be subjected to appropriate pressure when passing through the pressing roller 81, ensuring that the first plate and the second plate are tightly bonded, effectively improving the plate bonding quality and solving the technical problem of insufficient compaction after bonding during the implementation process.

[0045] In this embodiment, the sheet metal pressing assembly is located on the left side of the equipment. It adopts a modular design, and the main frame of the assembly consists of two long side plates. These two long side plates are shown in the figure as flat plates of identical size and shape, arranged parallel to each other and horizontally aligned. Between the two long side plates are a pair of parallel short side plates. To achieve height adjustment, vertically sliding sliders are specially designed on the long side plates. The left slider is connected to the left short side plate, and the right slider is connected to the right short side plate. The pressing roller is installed between the two short side plates. The upper ends of the two short side plates are connected to a threaded shaft via a flat plate. Rotating the roller drives the threaded shaft to move up and down. The lifting and lowering of the pressing roller is achieved. Specifically, if the first plate is a thin plate with a thickness less than that of the second plate, due to its low rigidity and easy deformation, warping or displacement may occur during the pressing process after gluing and conveying to the pressing station. Therefore, before pressing with the pressing roller, the thin plate needs to be pre-pressed to allow it to initially adhere to the second plate, eliminating warping or displacement. Then, the pressing roller performs final pressing to ensure that the thin plate and the second plate are fully and tightly bonded. The height of the pre-pressing roller can be adjusted by the second lifting mechanism to accommodate thin plates of different thicknesses, further improving the bonding accuracy and stability, and effectively solving the technical problem of uneven pressing that easily occurs when bonding thin and thick plates.

[0046] During the adhesive application process, if the adhesive is applied to the first sheet material solely by the contact between the adhesive roller and the first conveying plane, it is often difficult to ensure that the hot melt adhesive adheres evenly and tightly to the bottom surface of the thin sheet (i.e., the first sheet material), thus affecting the bonding effect of the sheet material. Therefore, to solve this technical problem, this example can also adjust the height according to the actual situation of the first sheet material, pressing the thin sheet flat from above to further ensure the flatness of the thin sheet material during conveying and adhesive application. In addition, when hot melt adhesive overflows, it not only wastes adhesive but may also contaminate other parts of the laminating machine, affecting the normal operation of the equipment. Meanwhile, overflowing hot melt adhesive may adhere to non-adhesive areas of the board, resulting in an untidy board surface, affecting the subsequent bonding quality, and may even interfere with the normal conveying trajectory of the board due to adhesive dripping onto the conveying plane. To solve this technical problem, this example sets two adhesive baffles on both sides of the adhesive application roller and the adhesive control roller, so that when they are tangent, they can form a four-sided closed storage space. The adhesive baffles separate the two sides of the groove, so that the adhesive baffles and the adhesive application curved surfaces of the adhesive application roller and the adhesive control roller form a four-sided closed adhesive storage space, thereby preventing adhesive leakage.

[0047] In addition, during the board bonding process, residual impurities often lead to a decline in bonding quality. Specifically, if dust, debris, or other impurities adhere to the bottom surface of the first board, it will hinder the close contact between the hot melt adhesive and the board surface, resulting in insufficient bonding strength and even local delamination. At the same time, impurity particles may cause wear on the surface of the glue roller, affecting the uniform application of hot melt adhesive and further aggravating bonding defects. To address this, when the first board moves on the first transmission unit, the rotating brush roller can effectively remove dust, debris, and other impurities from the bottom surface of the board. Boards have high rigidity at room temperature, and sudden pressure can easily lead to local stress concentration, causing micro-cracks or warping. Preheating the board can eliminate board stress and effectively enhance its plasticity. Moreover, the adhesive must reach the activation temperature (e.g., 100~120℃ for EVA hot melt adhesive) to have fluidity and thus fully wet the board surface. If the activation temperature is not reached before use, the adhesive will not dissolve, resulting in uneven and insufficient glue application when applying it to the board.

[0048] In practical applications, the storage space in the groove formed by the tangent of the coating roller and the control roller is limited, and insufficient hot melt adhesive is easily caused after coating. Therefore, frequent replenishment of hot melt adhesive is required. To address this, a glue replenishment device can be installed above the first conveying plane. The glue replenishment device includes a glue bucket and a glue outlet. The glue bucket has a closed space for storing glue, and the glue outlet corresponds to the groove formed by the tangent of the coating roller and the control roller. When the glue in the groove is used up, the hot melt adhesive in the glue bucket can drip onto the groove to automatically replenish the hot melt adhesive. In addition, the method of applying hot melt adhesive to the first board by rotating the coating roller can easily cause glue to drip onto the second board or other locations, resulting in waste of hot melt adhesive. Therefore, in this example, a recycling device can also be installed below the coating roller and the control roller, above the second conveying plane, and positioned between the coating roller and the second conveying plane to recycle the hot melt adhesive and prevent it from dripping onto the second board, thus affecting the bonding quality. Example

[0049] In this embodiment, because the conveying speeds of the first and second plates are different, the time required for pre-processing the first plate and the second plate are also different, as are the conveying distances of the first and second plates. Therefore, when automatically bonding the two plates, it is extremely easy for the two plates to fail to be fully bonded at the same position and starting point, resulting in a decrease in the bonding quality and an increase in manufacturing costs. Moreover, if the two plates cannot be fully bonded, the bonded plates need to be cut and corrected, leading to a waste of plate material. At the same time, the added cutting and correction process not only reduces production efficiency but also increases the cost of bonding the plates and reduces the quality of the bonding.

[0050] Therefore, how to accurately control the bonding of boards is the core issue in improving the quality of board bonding. This example improves upon the existing fully automated board bonding machine to achieve high-quality and high-efficiency fully automated board bonding.

[0051] Specifically, this example provides a sheet material conveying control system, which includes: a fully automated sheet material laminating machine as described above, a first through-beam photoelectric sensor, a second through-beam photoelectric sensor (not shown in the figure), and a control module (not shown in the figure). The control module (not shown in the figure) is electrically connected to the first through-beam photoelectric sensor (not shown in the figure), the second through-beam photoelectric sensor (not shown in the figure), the first drive assembly 30, and the second drive assembly 40, respectively. The first through-beam photoelectric sensor is disposed on the first conveying plane and located between the beginning of the first conveying plane and the tangent point of the glue coating roller. The first conveying plane is located where the light receiver of the first through-beam photoelectric sensor and the light collector of the first through-beam photoelectric sensor are in direct light interaction. The second photoelectric sensor is disposed on the second conveying plane and located between the beginning and the intersection of the second conveying plane. The intersection refers to the intersection of the first and second conveying planes, and the second conveying plane is located between the light receiver and the light receiver of the second photoelectric sensor. When bonding the first and second plates, the plate conveying control system achieves precise bonding of the plates, and solves the problems of inaccurate bonding caused by the difference in conveying speed of the first and second plates, the difference in the time required for pre-processing the first and second plates, and the difference in the conveying distance of the first and second plates.

[0052] Specifically, in this example, the first pair of photoelectric sensors is positioned between the beginning of the first conveying plane and the tangent point of the coating roller. Simultaneously, the receiver and receiver of the first pair of photoelectric sensors are positioned above and below the first conveying plane, respectively, so that the first conveying plane is precisely between the light rays from the receiver and receiver of the first pair of photoelectric sensors. The fixed position of the first pair of photoelectric sensors can be any position between the beginning of the first conveying plane and the tangent point of the coating roller, and the vertical distance from the light rays from the receiver and receiver of the first pair of photoelectric sensors to the intersection of the first and second conveying planes is set as L1. Similarly, in this example, the second pair of photoelectric sensors is also positioned on the second conveying plane, between the beginning of the second conveying plane and the intersection point (referring to the intersection of the first and second conveying planes). Therefore, the second pair of photoelectric sensors can be positioned at any location within the range. Furthermore, in this example, the second pair of photoelectric sensors... The position is determined, and the vertical distance from the light receiver of the second photoelectric sensor to the intersection point is set to L2. Therefore, L1 and L2 are functionally related. In this example, a signal is emitted when the first plate passes the first photoelectric sensor or when the second plate passes the second photoelectric sensor, thereby determining the position of the plate and enabling precise control of the bonding of the first and second plates. For example, when the receiver of the first photoelectric sensor emits a first signal, it indicates that the first plate has reached the fixed position of the first photoelectric sensor and the straight-line distance L1 from the first plate to the intersection point can be accurately determined. When the receiver of the second photoelectric sensor emits a second signal, it indicates that the second plate has reached the fixed position of the second photoelectric sensor and the straight-line distance L2 from the second plate to the bonding point can be accurately determined. Therefore, the conveying speed of the first and second plates can be determined by algorithm so that they can reach the intersection point synchronously and accurately for bonding.

[0053] Furthermore, it should be noted that because the first and second boards differ in board type, processing steps, and conveying distance, the adjustment factors required for each pair of boards during continuous board bonding are different. This results in three different scenarios: First, the first board reaches the position of the first photoelectric sensor before the second board reaches the position of the second photoelectric sensor; second, the second board reaches the position of the second photoelectric sensor before the first board reaches the position of the first photoelectric sensor; third, the first and second boards reach the positions of their respective photoelectric sensors simultaneously. Therefore, to ensure accurate bonding of each pair of boards and improve the bonding quality, this example implements intelligent control for all three scenarios to ensure automated, intelligent bonding of the two boards. For example: In the first scenario, where the receiver of the first through-beam photoelectric sensor emits a first signal but the receiver of the second through-beam photoelectric sensor does not emit a second signal, it indicates that the second plate has not yet reached the position of the second through-beam photoelectric sensor and the first plate has reached the position of the first through-beam photoelectric sensor. Therefore, in this example, the control module controls the first driving component to stop driving the first plate on the first conveying plane based on the received first signal, and waits for the receiver of the second through-beam photoelectric sensor to emit a second signal. Once the receiver of the second through-beam photoelectric sensor emits a second signal, it indicates that the second plate has reached the bonding position. The control module then controls the first driving component to drive the first plate on the first conveying plane at a first flat position based on the received second signal. The first and second plates are driven forward at a uniform speed, and the second drive component is synchronously controlled to drive the second plate on the second conveying plane forward at a second average speed, so that the first and second plates can reach the same position at the same time and be bonded together, ensuring the bonding quality of the plates; wherein, the first average speed V1 and the second average speed V2 are in a functional relationship, specifically L1 / V1=L2 / V2, and when the positions of the first and second photoelectric sensors are located on the same vertical line, the specific functional relationship is V1 / V2=cosx, where x is the angle formed by the first and second conveying planes; in practical applications, the positions of the first and second photoelectric sensors are often set on the same vertical line to facilitate precise control.

[0054] In the second scenario, where the receiver of the second through-beam photoelectric sensor emits a second signal while the receiver of the first through-beam photoelectric sensor does not emit a first signal, it indicates that the first substrate has not yet reached the position of the first through-beam photoelectric sensor and the second substrate has reached the position of the second through-beam photoelectric sensor. Therefore, a new control process needs to be established. The control module, based on the received second signal, controls the second driving component to stop driving the second substrate on the second conveying plane and waits for the receiver of the first through-beam photoelectric sensor to emit a first signal. Once the receiver of the first through-beam photoelectric sensor emits the first signal, the control module, based on the received first signal, controls the first driving component to drive the first substrate on the first conveying plane forward at a first average speed, and simultaneously controls the second driving component to drive the second substrate on the second conveying plane forward at a second average speed. This ensures that the first and second substrates can reach the same position at the same time for bonding, guaranteeing the bonding quality of the substrates.

[0055] In the third scenario, when the receiver of the first through-beam photoelectric sensor emits a first signal and the receiver of the second through-beam photoelectric sensor emits a second signal simultaneously, it indicates that both the first and second plates have synchronously reached the positions of the first and second through-beam photoelectric sensors. Therefore, in this example, the control module controls the first driving component to drive the first plate on the first conveying plane to move forward at a first average speed based on the received first or second signal, and simultaneously controls the second driving component to drive the second plate on the second conveying plane to move forward at a second average speed, so that the first and second plates can reach the same position at the same time for bonding, ensuring the bonding quality of the plates.

[0056] It should be noted that, since the first and second plates are conveyed on their respective conveying planes, one plate may arrive at the bonding station first while the other has not yet arrived. If the first plate arrives first, the hot melt adhesive may cool down and solidify during the waiting process, thus affecting the bonding effect. If the second plate arrives first, the beginnings of the first and second plates may not be fully aligned, thus affecting the bonding effect and reducing production efficiency. Therefore, if the two plates cannot arrive at the bonding position simultaneously, it will directly cause them to shift in position during bonding, thereby increasing manufacturing costs and reducing bonding efficiency, and in severe cases, even causing the plates to be scrapped. Specifically, during the operation of the plate conveying control system, the control module will acquire the signals fed back by the first and second photoelectric sensors in real time, and control the first and second drive components based on these signals, so that the first and second plates move forward at the first average speed and the second average speed, respectively. This functional relationship is set based on the process requirements of plate conveying, equipment operating parameters, or other relevant factors.

[0057] Taking the aforementioned sheet material conveying control system as an example, determining the functional relationship between the first average speed and the second average speed aims to ensure that the two sheets can arrive at the bonding station accurately and simultaneously. In practical applications, determining this functional relationship also requires consideration of the sheet material's inertia. When the first drive assembly drives the first sheet material forward at the first average speed, and the second drive assembly drives the second sheet material forward at the second average speed, the first and second sheets material do not stop immediately when they leave the first and second drive assemblies at their respective average speeds; instead, they continue to slide due to inertia. Furthermore, the magnitude of inertia varies significantly between sheets of different materials and weights. For example, heavier solid wood sheets have greater mass and stronger inertia, resulting in a longer sliding distance and slower speed decay after the drive stops. Lighter plastic sheets, on the other hand, have less mass and weaker inertia, resulting in a shorter sliding distance and faster speed decay. This difference in inertia directly affects the sliding distance and speed of the sheets, thus impacting the final bonding accuracy.

[0058] Furthermore, due to the angle between the first and second conveying planes, the first plate will gain additional acceleration under gravity on the first conveying plane, resulting in accelerated descent. The greater the slope and the heavier the plate, the greater the acceleration. For example, when the first plane conveys a heavy marble plate and a light glass plate, the marble plate, with its large mass leading to high inertia, experiences significant gravitational acceleration on the inclined plane. In contrast, the glass plate, with its smaller mass and lower inertia, experiences weaker gravitational acceleration. Therefore, when determining the functional relationship between the first and second average velocities, the system needs to comprehensively consider the sliding distance and velocity changes of the two plates after they leave the first and second drive components, respectively, due to inertia and gravity. Thus, all of the above factors must be taken into account when calculating the average velocity.

[0059] In practical applications, the relationship between the two can be obtained by collecting data through multiple experiments: under specific conditions of conveyor plane tilt angle, board material and weight, different combinations of first and second average speeds are set for testing. The time, sliding distance and final position deviation of the two boards from leaving the first and second drive components to arriving at the bonding station are recorded in each experiment. By analyzing these data, a corresponding model of speed and actual bonding effect is established, thereby clarifying the functional relationship between the first and second average speeds. Through statistical analysis of a large amount of experimental data, a corresponding model of the relationship between different tilt angles, different board types and the first and second average speeds is established to ensure that the two boards can arrive at the bonding station at the same time, realize high-precision automated bonding operation, and meet the strict requirements of the production process for board bonding.

[0060] In addition, when the first plate and the second plate reach the positions of the first and second photoelectric sensors respectively, a baffle mechanism can be set at the positions of the first and second photoelectric sensors respectively. The baffle mechanism controls its blocking plate to directly block the first plate on the first conveying plane and the second plate on the second conveying plane respectively, until the first plate and the second plate both reach the positions of the first and second photoelectric sensors. Then, the baffle mechanism controls its blocking plate to detach from the first and second conveying planes. Then, the control module controls the first drive component to drive the first plate on the first conveying plane to move forward at a first average speed, and synchronously controls the second drive component to drive the second plate on the second conveying plane to move forward at a second average speed, ensuring that the first plate and the second plate can reach the same position and fit together at the same time, so as to overcome the inertia problem generated when the first plate and the second plate move (all of which belong to the prior art, and the specific technical details will not be described here).

[0061] Specifically, this example effectively solves the above-mentioned problems by adding a sheet material conveying control system consisting of a first through-beam photoelectric sensor, a second through-beam photoelectric sensor, and a control module. Through-beam photoelectric sensors located at the beginning of the first and second conveying planes are used to monitor the feeding status of the two sheets in real time. Based on the signals fed back from the sensors, the control module controls the operation of the first and second drive components: when only the first sheet material is in place, the first drive component is paused, waiting for the second sheet material; if the second sheet material arrives first, the control module controls the second drive component to pause, waiting for the first sheet material; when both sheets material are in place, the control module controls the first and second drive components to synchronously drive the two sheets material forward at speeds that are functionally related, ensuring that they arrive at the bonding station simultaneously and achieve synchronous bonding.

[0062] It should be noted that in this example, the working principle of the through-beam photoelectric sensor is to separate the emitter and receiver to increase the detection distance. The through-beam photoelectric switch, which consists of an emitter and a receiver, can have a detection distance of several meters to tens of meters. In practical applications, the emitter and receiver need to be installed on both sides of the path of the object being detected. When the object passes through, it will block the light path. At this time, the receiver will activate and output a switch control signal.

[0063] The solution of this application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of each embodiment have different emphases; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments. Those skilled in the art should also understand that the actions and modules involved in the specification are not necessarily essential to this application. Furthermore, it is understood that the steps in the method of this application embodiment can be adjusted, combined, and deleted according to actual needs, and the modules in the device of this application embodiment can be combined, divided, and deleted according to actual needs.

[0064] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A fully automated board laminating machine, characterized in that, include: A first conveying plane, a second conveying plane, a first drive assembly, a second drive assembly, a glue-applying roller, a glue-controlling roller, and a rotating assembly; The second conveying plane is located below the first conveying plane, the conveying direction of the first conveying plane intersects the conveying direction of the second conveying plane, and the angle formed by the first conveying plane and the second conveying plane is an acute angle; The glue-applying roller is tangent to the glue-controlling roller, and the axis of the glue-applying roller and the axis of the glue-controlling roller are located on the same plane. The groove formed at the tangent point of the glue-applying roller and the glue-controlling roller is used to place hot melt glue, and the first conveying plane is tangent to the outer wall of the glue-applying roller. The first driving component is used to drive the first plate located on the first conveying plane, the second driving component is used to drive the second plate located on the second conveying plane, and the rotating component is used to drive the coating roller to rotate.

2. The fully automated board laminating machine according to claim 1, characterized in that, The second conveying plane has a plate pressing assembly at its end. The plate pressing assembly includes a pressing roller and a first lifting mechanism. The first lifting mechanism is connected to the pressing roller and is used to control the lifting height of the pressing roller. The pressing roller is located above the second conveying plane, and the outer wall of the pressing roller is tangent to the second conveying plane. The end of the first conveying plane corresponds to the point where the pressing roller is tangent to the second conveying plane.

3. The fully automated board laminating machine according to claim 2, characterized in that, The first plate is a thin plate, and the thickness of the second plate is greater than the thickness of the first plate; A thin plate pre-pressing assembly is also provided between the pressing roller and the coating roller. The thin plate pre-pressing assembly includes a pre-pressing roller and a second lifting mechanism. The pre-pressing roller is located on the side close to the pressing roller. The second lifting mechanism is connected to the pre-pressing roller and is used to control the lifting height of the pre-pressing roller. The pre-pressing roller is located above the first conveying plane, and the vertical distance from the axis of the pre-pressing roller to the second conveying plane is greater than the vertical distance from the axis of the pressing roller to the second conveying plane.

4. The fully automated board laminating machine according to claim 3, characterized in that, It also includes a glue-applying roller, a thin plate flattening assembly, and a thin plate conveying assembly. The thin plate conveying assembly includes a rotating bottom roller, a first conveying roller, and a second conveying roller. The thin plate flattening assembly includes a pressure plate glue roller and a third lifting mechanism. The glue-applying roller is located directly above the glue-applying roller, and the first conveying plane is located between the glue-applying roller and the glue-controlling roller. The outer wall of the glue-applying roller is tangent to the first conveying plane. The thin plate conveying assembly is located below the first conveying plane, the rotating bottom roller is located between the first conveying roller and the second conveying roller, the first conveying roller is located between the rotating bottom roller and the glue coating roller, and the first conveying plane is tangent to the rotating bottom roller, the first conveying roller and the second conveying roller; The pressure plate rubber roller is located above the first conveying plane, and the pressure plate rubber roller is aligned with the rotating bottom roller. The third lifting mechanism is used to control the lifting height of the pressure plate rubber roller.

5. The fully automated board laminating machine according to claim 1, characterized in that, It also includes two glue-blocking plates, which are respectively disposed on both sides of the groove formed at the tangent point of the glue-applying roller and the glue-controlling roller; the glue-blocking plate includes a glue-blocking part, a first hollow part and a second hollow part, the glue-blocking part is used to block the two sides of the groove, and the glue-blocking part is located between the first hollow part and the second hollow part. The first hollow part and the second hollow part are both arc-shaped, and the glue-blocking part is an irregular shape; The length of the coating roller is the same as the length of the control roller. Both ends of the coating roller are fitted with a first glue-blocking flange, and both ends of the control roller are fitted with a second glue-blocking flange. The first hollow part is adapted to the outer wall of the first glue-blocking flange, and the second hollow part is adapted to the outer wall of the second glue-blocking flange. The two glue-blocking plates, together with the grooves formed at the coating roller and the control roller, form a four-sided closed groove.

6. The fully automated board laminating machine according to claim 1, characterized in that, The first drive assembly includes a first support plate, a first lead screw, and a first rotating device. The first support plate includes a first pulling part and a first transmission part. The first pulling part is provided with a first strip-shaped through hole. The nut seat of the first lead screw is provided with a first pulling block. The first lead screw is located directly below the first strip-shaped through hole, and the first pulling block is located inside the first strip-shaped through hole and moves within the first strip-shaped through hole. The first rotating device is used to control the rotation of the first lead screw. The first transmission part is located on the side close to the first conveying plane and is used to guide the first plate. The end of the first support plate is connected to the beginning of the first conveying plane, and the first support plate and the first conveying plane are located on the same plane.

7. The fully automated board laminating machine according to claim 1, characterized in that, The second drive assembly includes a second support plate, a second lead screw, and a second rotating device. The second support plate includes a second pulling part and a second transmission part. The second pulling part is provided with a second strip-shaped through hole. The nut seat of the second lead screw is provided with a second pulling block. The second lead screw is located directly below the second strip-shaped through hole, and the second pulling block is located inside the second strip-shaped through hole and moves within the second strip-shaped through hole. The second rotating device is used to control the rotation of the second lead screw; the second transmission part is located near the end of the second conveying plane and is used to guide the second plate; and the second support plate is located on the same plane as the second conveying plane.

8. A fully automated board laminating machine according to claim 6, characterized in that, It also includes a third rotating device; The first transmission part is also provided with a third strip-shaped through hole; The third strip-shaped through hole is also provided with a first brush roller of the same size as the through hole; The first brush roller is controlled to rotate by the third transmission device; The width of the third strip-shaped through hole is greater than or equal to the width of the first conveying plane; The first brush roller is used to remove dust from the bottom surface of the first plate.

9. A sheet metal conveying control system, characterized in that, include: The fully automated board laminating machine as described in any one of claims 1 to 8, and the first through-beam photoelectric sensor, the second through-beam photoelectric sensor and the control module, wherein the control module is electrically connected to the first through-beam photoelectric sensor, the second through-beam photoelectric sensor, the first drive assembly and the second drive assembly respectively; The first through-beam photoelectric sensor is disposed on the first conveying plane and located between the beginning of the first conveying plane and the point where it is tangent to the coating roller. The first conveying plane is located between the light receiver and the light receiver of the first through-beam photoelectric sensor. The second through-beam photoelectric sensor is disposed on the second conveying plane and located between the beginning of the second conveying plane and the intersection point, which refers to the intersection point of the first and second conveying planes. The second conveying plane is located between the light receiver and the light receiver of the second through-beam photoelectric sensor. When the receiver of the first through-beam photoelectric sensor emits a first signal, and the receiver of the second through-beam photoelectric sensor does not emit a second signal, the control module controls the first driving component to stop driving the first plate on the first conveying plane according to the received first signal, and waits for the receiver of the second through-beam photoelectric sensor to emit a second signal. Until the receiver of the second through-beam photoelectric sensor emits a second signal, the control module controls the first driving component to drive the first plate on the first conveying plane to move forward at a first average speed according to the received second signal, and synchronously controls the second driving component to drive the second plate on the second conveying plane to move forward at a second average speed. The first average velocity is a function of the second average velocity.

10. A sheet metal conveying control system according to claim 9, characterized in that, When the receiver of the second through-beam photoelectric sensor emits a second signal, and the receiver of the first through-beam photoelectric sensor does not emit a first signal, the control module controls the second driving component to stop driving the second plate on the second conveying plane according to the received second signal, and waits for the receiver of the first through-beam photoelectric sensor to emit a first signal. Until the receiver of the first through-beam photoelectric sensor emits a first signal, the control module controls the first driving component to drive the first plate on the first conveying plane to move forward at a first average speed according to the received first signal, and synchronously controls the second driving component to drive the second plate on the second conveying plane to move forward at a second average speed. When the receiver of the first through-beam photoelectric sensor emits a first signal, and the receiver of the second through-beam photoelectric sensor emits a second signal at the same time, the control module controls the first driving component to drive the first plate on the first conveying plane to move forward at a first average speed according to the received first signal or the second signal, and simultaneously controls the second driving component to drive the second plate on the second conveying plane to move forward at a second average speed.

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