A magnetron sputtering device

Abstract

This invention relates to the field of sputtering coating technology, specifically to a magnetron sputtering apparatus, comprising a mounting shell having a back plate for arranging a magnetron sputtering target, a base rotating around a central axis within the mounting shell, and a magnet mounted on the base. The magnetic field of the magnet acts on the magnetron sputtering target as the magnet rotates with the base. The magnet is reciprocally slidably mounted on the base along a direction parallel to the back plate. The base is provided with a sliding drive mechanism that drives the magnet to reciprocate during the rotation of the base. The magnetron sputtering apparatus of this invention, by causing the magnet to reciprocate during rotation, results in a relatively wide area where the magnetic field of a single magnet acts on the target, and relatively shallow grooves are generated on the target. The shallower grooves have less impact on the sputtering rate, resulting in a relatively uniform distribution of sputtering sources on the target surface, thereby improving the uniformity of the deposited film thickness.

Description

Technical Field

[0001] This invention relates to the field of sputtering coating technology, and more specifically to a magnetron sputtering device. Background Technology

[0002] In semiconductor manufacturing processes, magnetron sputtering is widely used to deposit thin films. During operation, magnetron sputtering bombards the target surface with high-energy argon ions, ejecting target atoms that then deposit onto the substrate to form a thin film. By placing magnets on the back of the target, closed magnetic field lines are generated, causing electrons to move in a spiral motion along these lines. This increases the probability of electrons colliding with argon gas, thereby improving thin film formation efficiency.

[0003] In traditional magnetron sputtering devices, the magnet is fixed in place, and the magnetic field of the magnet is relatively fixed with the target material. The plasma is confined to a narrow area of ​​about 5-10 cm in length on the target surface, which causes the sputtering of target atoms to be concentrated in this narrow area. This results in the target utilization rate being less than 30%. At the same time, there is a problem of large periodic fluctuations in the uniformity of the film thickness formed by target atoms on the substrate, which affects the film quality of target atoms on the substrate surface.

[0004] To address the issues of low target utilization and poor film quality caused by fixed magnets in existing magnetron sputtering devices, the industry typically employs a rotating magnet method to improve film quality. This involves rotating a permanent magnet around a fixed axis, causing it to move in a circular motion. This method forms annular etching grooves on the target surface, improving target utilization. For example, the magnetron assembly disclosed in patent CN220796648U has a vertically extending rotating axis driven by a driver. A horizontally arranged cantilever is fixedly mounted on the rotating axis, with the magnetron assembly located at the other end of the cantilever. The rotating axis drives the cantilever to rotate the magnetron assembly, which scans the entire surface of the target facing the substrate during rotation, thus achieving magnetron sputtering. Similar devices include the magnetic field regulator disclosed in patent CN215856307U.

[0005] However, the aforementioned equipment still has certain drawbacks in use: The permanent magnets in this equipment rotate along a relatively fixed path, gradually forming annular etching grooves on the target surface over prolonged use. These grooves deepen continuously, increasing the distance between the target surface and the magnet, and weakening the magnetic field at the bottom of the groove. This leads to a gradual decrease in plasma density and sputtering rate in that area. The unevenness in the groove shape caused by the non-uniform magnetic field strength results in uneven distribution of target atoms sputtered from the target surface on the substrate, affecting the uniformity of the film thickness deposited on the substrate. As the etching groove depth increases, periodic fluctuations in film uniformity occur. Even by matching different types of permanent magnet layouts to improve target utilization, this problem cannot be optimized. Summary of the Invention

[0006] This invention provides a magnetron sputtering apparatus to optimize and solve the technical problem in the prior art where the uniformity of the sputtered film fluctuates periodically due to the periodic deepening of the etching tank when the rotation path of the permanent magnet is fixed.

[0007] To solve the above problems, the magnetron sputtering device provided by the present invention adopts the following technical solution: A magnetron sputtering device includes a mounting shell, which has a back plate for arranging a magnetron sputtering target. The mounting shell is provided with a base that rotates around a central axis, which is perpendicular to the back plate. A magnet is provided on the base. The magnetic field of the magnet acts on the magnetron sputtering target as the magnet rotates with the base. The magnet is reciprocally slidably mounted on the base along a direction parallel to the back plate. A sliding drive mechanism is provided on the base. The sliding drive mechanism drives the magnet to reciprocate and slide during the rotation of the magnet with the base.

[0008] In the magnetron sputtering apparatus provided by this invention, the magnet in the mounting housing can not only rotate but also slide back and forth during rotation. This effectively expands the distribution area of ​​the magnetic field on the target surface. When the magnet only rotates without moving, the magnetic field acting on the target is relatively narrow. The resulting target grooves are too deep, leading to a significant decrease in sputtering rate and uneven distribution of sputtering sources on the target surface. In the magnetron sputtering apparatus provided by this invention, the magnet slides back and forth during rotation, resulting in a relatively wider area acted by a single magnet on the target. The target grooves are relatively shallow and uniform, and the uniform and shallow target grooves have less impact on the sputtering rate. This results in a relatively uniform distribution of sputtering sources on the target surface, thereby improving the uniformity of the deposited film thickness.

[0009] As a further optimization and improvement to the base, a magnet central area is arranged on the base next to the central axis, and multiple magnets are evenly distributed around the magnet central area. The reciprocating sliding direction of the magnets on the base extends radially along the magnet central area.

[0010] Its beneficial effects are: the magnets are evenly distributed around the central area of ​​the magnet and adjusted by sliding along the radial direction, which can make the magnetic field distribution on the target surface more uniform and symmetrical, so as to effectively control the formation of an overall ring-shaped coverage area.

[0011] Furthermore, the sliding drive mechanism includes cylinders arranged one for each magnet, and each cylinder drives the corresponding magnet to slide back and forth.

[0012] Its beneficial effects are as follows: by using cylinders that correspond one-to-one with each magnet as the sliding drive mechanism, the action is sensitive, clean, simple and reliable, with a low failure rate, and it is easy to control the reciprocating sliding speed and stroke of the magnets. It can accurately adjust the position of the magnets and thus accurately control the magnetic field distribution.

[0013] Furthermore, each magnet is provided with a sliding seat on the base, and the magnet is fixedly mounted on the sliding seat.

[0014] Its beneficial effects are as follows: by setting sliding seats on the base that correspond one-to-one with the magnets, it is convenient to install and remove the magnets on the base, and it can also provide stable support for the magnets, ensuring the stability and accuracy of the magnets during the reciprocating sliding process, reducing the impact of factors such as vibration on the accuracy of magnet movement, improving the reliability of the device, and also facilitating the connection of cylinders to drive the magnets to slide.

[0015] Furthermore, each of the cylinders is located on the side of the corresponding magnet facing the center region of the magnet.

[0016] Its advantages are that by placing the cylinder on the side of the magnet facing the center of the magnet, this layout can save space and make the overall structure of the magnetron sputtering device more compact.

[0017] Furthermore, the central area of ​​the magnet is provided with an air distribution plate, which has a main air inlet for connecting to the main air circuit and a branch air inlet for corresponding communication with each cylinder.

[0018] Its beneficial effects are as follows: by setting up a gas distribution plate, the gas source can be centrally distributed and controlled, the gas circuit connection can be simplified, and it is convenient to uniformly adjust and control each cylinder, which helps to improve the overall stability and reliability of the gas circuit system and ensure that each cylinder works synchronously and stably.

[0019] Furthermore, the base is provided with sliding tracks extending radially along the central area of ​​each magnet, and each magnet is slidably mounted on each sliding track so that each magnet is slidably mounted on the base.

[0020] Its beneficial effects are as follows: by setting a sliding track extending radially along the center of the magnet under each magnet, each magnet can reciprocate under the guidance of the sliding track, which improves the smoothness and accuracy of the magnet sliding and extends the service life of the device.

[0021] Furthermore, a central support base is fixedly provided on the mounting shell, and an outer rotating sleeve is rotatably fitted on the central support base. The outer rotating sleeve is driven to rotate by a driver. A through hole is provided in the central support base, and a central rotating shaft is rotatably fitted in the through hole. The central rotating shaft is driven to rotate by the outer rotating sleeve. The mounting end of the central rotating shaft extends into the mounting shell, and the base is fixedly fitted to the mounting end of the central rotating shaft so that the base can be driven to rotate by the central rotating shaft.

[0022] Its beneficial effects are as follows: by setting an external rotating sleeve, driver and central rotating shaft, the base can be rotated stably, the base speed can be precisely controlled through multi-stage transmission, the operation stability and accuracy of the magnet can be improved, and the external rotating sleeve also makes it easier for operators to maintain and repair the device.

[0023] Furthermore, the central rotating shaft is provided with a venting passage for supplying air to the cylinder to control the cylinder's extension and retraction.

[0024] Its beneficial effects are as follows: by setting the ventilation air passage inside the central rotating shaft, the complexity of the sputtering device can be reduced, and the complex entanglement of the external air passage can be avoided, ensuring the stability and reliability of the air passage during the rotation of the base.

[0025] Furthermore, the end of the outer rotating sleeve facing away from the mounting shell is fitted with a pneumatic slip ring via an adapter.

[0026] Its beneficial effects are as follows: the pneumatic slip ring can realize the continuous transmission of gas in the air passage during the rotation of the outer rotating sleeve, which solves the problem of air passage connection between rotating parts and stationary parts, ensures the normal operation of the air passage system during the operation of the sputtering device, and further improves the reliability and stability of the sputtering device.

[0027] The beneficial effects of the magnetron sputtering apparatus provided by this invention are as follows: In the magnetron sputtering apparatus provided by this invention, the magnet in the mounting housing can not only rotate but also slide back and forth during rotation. This effectively expands the distribution area of ​​the magnetic field on the target surface. When the magnet only rotates without moving, the magnetic field acting on the target is relatively narrow. The resulting target groove is too deep, leading to a significant decrease in sputtering rate and uneven distribution of sputtering sources on the target surface. In the magnetron sputtering apparatus provided by this invention, the magnet slides back and forth during rotation, resulting in a relatively wide area acted by a single magnet on the target. The target groove is relatively shallow and uniform, and the uniform and shallow target groove has less impact on the sputtering rate. This results in a relatively uniform distribution of sputtering sources on the target surface, thereby improving the uniformity of the deposited film thickness. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of one embodiment of the magnetron sputtering apparatus provided by the present invention.

[0029] Figure 2 for Figure 1 Half-sectional view of the magnetron sputtering apparatus shown;

[0030] Figure 3 for Figure 2 A magnified view of a portion of point A in the middle;

[0031] Figure 4 for Figure 2 Schematic diagram of the middle base and magnet assembly;

[0032] Figure 5 for Figure 4 A magnified view of a portion of point B in the middle;

[0033] Figure 6 This is a schematic diagram of the magnetic field exerted on the target material by a magnet fixed to a base in the prior art when it first starts working;

[0034] Figure 7 for Figure 6 A schematic diagram showing the fixed magnet acting on the target material after working for a period of time while following the rotation of the base;

[0035] Figure 8 A schematic diagram of the magnetic field acting on the target material when the reciprocating sliding magnet in the magnetron sputtering apparatus provided by the present invention just starts working;

[0036] Figure 9 for Figure 8 The diagram shows a reciprocating magnet acting on a target material after working for a period of time while following the rotation of the base.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. Pneumatic slip ring; 2. Adapter sleeve; 3. Outer rotating sleeve; 4. Magnetron sputtering target; 5. Mounting shell; 51. Back plate; 6. Drive belt; 7. Rotary motor; 8. Magnet; 9. Base; 10. Gas distribution plate; 101. Main air inlet; 102. Sub-air inlet; 11. Cylinder; 12. Sliding rail; 13. External air inlet; 14. Upper air nozzle; 15. Middle air nozzle; 16. Central rotating shaft; 17. Air passage; 18. Lower air nozzle; 19. Central support seat; 20. Thrust bearing;

[0039] 21. Magnetic field lines; 22. Sputtered particle distribution area; 23. Groove; 24. First position; 25. Second position. Detailed Implementation

[0040] The main concept of this invention lies in moving the magnet 8 back and forth in other directions, based on the existing magnetron sputtering apparatus where the magnet 8 rotates around the center of rotation. This effectively expands the distribution area of ​​the magnetic field of the magnet 8 on the surface of the magnetron sputtering target, thereby avoiding the formation of narrow and deep grooves 23 on the surface of the magnetron sputtering target 4 during long-term operation. This prevents the uniformity of the target atoms' distribution on the substrate surface during sputtering, thus improving the film quality of the target atoms on the substrate. Furthermore, controlling multiple magnets 8 to move back and forth simultaneously in an orderly and coordinated manner, so that the magnetic field covers the magnetron sputtering target 4, can further improve the film uniformity and the utilization rate of the magnetron sputtering target 4.

[0041] The principles and spirit of the present invention will be explained in detail below with reference to several representative embodiments.

[0042] Embodiment 1 of the magnetron sputtering apparatus provided by the present invention:

[0043] like Figures 1 to 5 As shown, the magnetron sputtering device provided in this embodiment includes a mounting shell 5, in which a magnet 8 and other components are installed. A rotary sliding drive mechanism for driving the magnet 8 to rotate is installed on the mounting shell 5.

[0044] Specifically, the mounting shell 5 is a cylindrical insulating shell structure. The mounting shell 5 has mounting sides and supporting sides arranged opposite to each other. The mounting sides of the mounting shell 5 are used to fix and mount the magnetron sputtering target 4. An outer rotating sleeve 3 and a rotary motor 7 are mounted on the supporting side. The rotary motor 7 is fixedly mounted on the supporting side of the mounting shell 5, and the outer rotating sleeve 3 is rotatably mounted on the mounting shell 5. The rotary motor 7 drives the outer rotating sleeve 3 to rotate via a transmission belt 6. In this embodiment, the mounting shell 5 includes an integrally formed circular basin. A back plate 51 is bolted to the opening of the circular basin. The corresponding outer surface of the back plate 51 forms the mounting side of the mounting shell 5, and the corresponding outer surface of the circular basin forms the supporting side of the mounting shell 5. Here, both the circular basin and the back plate 51 are made of insulating material to avoid affecting the magnetic field of the magnet 8 inside the mounting shell 5.

[0045] A central support base 19 is fixedly mounted on the mounting side of the mounting housing 5 by screws. A through hole is provided at the center of the central support base 19, and a central rotating shaft 16 is rotatably mounted within the through hole. The central rotating shaft 16 is arranged perpendicular to the back plate 51 of the mounting housing 5. Thrust bearings 20 are installed at both the upper and lower ends of the through hole of the central support base 19, and the central rotating shaft 16 is rotatably mounted within the thrust bearings 20. One end of the central rotating shaft 16 is the mounting end, which extends into the mounting housing 5. A base 9 is fixedly mounted to the mounting end of the central rotating shaft 16 by bolts, and a magnet 8 is mounted on the base 9. The other end of the central rotating shaft 16 is fixedly connected to the outer rotating sleeve 3 so that it rotates synchronously with the outer rotating sleeve 3. When the magnetron sputtering device is in use, the central rotating shaft 16 drives the base 9 to rotate, and the base 9 rotates along with the magnet 8.

[0046] The aforementioned outer rotating sleeve 3 is rotatably mounted on the outside of the central support base 19. A bearing is installed between the outer rotating sleeve 3 and the central support base 19 to achieve rotational assembly between the two. The bottom of the central support base 19 has an outer flange with multiple screw mounting holes along its circumference. During assembly, fastening screws are inserted into these holes to fix the central support base 19 to the mounting shell 5. In practice, transmission teeth are provided on the outer circumferential surface of the outer rotating sleeve 3. The output end of the driver fixed to the mounting shell 5 drives the outer rotating sleeve 3 to rotate via a transmission belt 6. The power source for the driver is a rotary motor 7, which is connected to a speed-changing structure. The output end of the speed-changing structure serves as the output end of the driver, driving the outer rotating sleeve 3 to rotate via the transmission belt 6.

[0047] In this embodiment, as Figure 4 and Figure 5As shown, the base 9 is eccentrically fixed on the central rotating shaft 16. A magnet central area is arranged on the base 9, located beside the central rotating shaft 16. Multiple magnets 8 are evenly distributed around the magnet central area on the base 9. The evenly distributed magnets 8 around the magnet central area can make the magnetic field distribution on the target surface more uniform and symmetrical, so as to effectively control the formation of an overall annular coverage area. In this embodiment, there are 8 magnets 8. In other embodiments, the number of magnets 8 can be any number, as long as the magnetic field of the magnets 8 can effectively cover the target material. A sliding track 12 is provided on the base 9 corresponding to each magnet 8, extending radially along the magnet central area. The extension direction of the sliding track 12 is parallel to the back plate 51 of the mounting shell 5. A sliding seat is slidably mounted on each sliding track 12, and a magnet 8 is mounted on each sliding seat. Furthermore, a sliding drive mechanism is provided on the base 9 for each sliding seat. This mechanism drives the sliding seat, carrying the magnet 8, to reciprocate radially along the central area of ​​the magnet. The sliding drive mechanism includes a cylinder 11, located on the side of the corresponding magnet 8 facing the central area. The telescopic end of the cylinder 11 extending outside the cylinder body is fixedly connected to the sliding seat, allowing the cylinder 11 to reciprocate along with the sliding seat and magnet 8. During operation, the central rotating shaft 16 drives the base 9 to rotate. The magnetic field of the magnet 8 acts on the corresponding magnetron sputtering target 4 as the magnet 8 rotates with the base 9. During this rotation, the cylinder 11 drives the sliding seat and magnet 8 to reciprocate, effectively expanding the magnetic field coverage of the magnet 8. Using the cylinder 11 as the sliding drive mechanism allows for precise control of the reciprocating sliding speed and stroke of each magnet 8, enabling precise adjustment of the magnet 8's position. It is also clean, simple, reliable, and provides good stability. In addition, the sliding base provides stable support for the magnet 8, and also facilitates the installation and removal of each magnet 8 on the base 9, improving the convenience of use and maintenance.

[0048] In addition, a gas distribution plate 10 is arranged in the central area of ​​the magnet. The gas distribution plate 10 is provided with a main air inlet 101 and multiple branch air inlets 102 corresponding to each cylinder 11. The main air inlet 101 is used to connect to the main air circuit, and the branch air inlets 102 are used to connect to the corresponding cylinders 11 one by one through the branch air circuit. By setting up the gas distribution plate 10, the gas source can be centrally distributed and controlled, the air circuit connection can be simplified, and the unified adjustment and control of each cylinder 11 can be facilitated. This is beneficial to improving the overall stability and reliability of the air circuit system and ensuring that each cylinder 11 works synchronously and stably. It is worth noting that a ventilation passage 17 is provided along the axial direction of the central rotating shaft 16. An adapter sleeve 2 is fixedly installed at the end of the outer rotating sleeve 3 facing away from the mounting shell 5. A pneumatic slip ring 1 is fixedly mounted on the adapter sleeve 2. The pneumatic slip ring 1 has an external air port 13 and an internal air port. The external air port 13 is used to connect to the air source through an external air passage, and the internal air port is used to connect to the upper air nozzle 14 on the adapter sleeve 2. The pneumatic slip ring 1 enables a stable connection between the stationary external air port 13 and the rotating upper air nozzle 14, solving the air passage connection problem between rotating and stationary components, achieving continuous gas transmission within the ventilation passage 17, and ensuring the normal operation of the air passage system during the sputtering device's operation. Furthermore, the ventilation passage 17 inside the central rotating shaft 16 reduces the complexity of the magnetron sputtering device, avoids complex entanglement between air passages, and ensures the stability and reliability of the air passage during the rotation of the base 9.

[0049] Correspondingly, the two ends of the ventilation passage 17 extend to the two ends of the central rotating shaft 16. An intermediate air inlet 15 is provided at the end of the ventilation passage 17 facing the adapter sleeve 2, and a lower air inlet 18 is provided at the end of the ventilation passage 17 extending into the mounting housing 5. The intermediate air inlet 15 is connected to the upper air inlet 14 through a corresponding pipeline, and the lower air inlet 18 is connected to the main air inlet 101 of the air distribution plate 10 through a corresponding pipeline. In use, the working gas in the air source reaches the cylinder 11 through the external air passage, the pneumatic slip ring 1, the ventilation passage 17, and the air distribution plate 10, controlling the cylinder 11 to perform extension and retraction, thereby controlling the sliding seat and the magnet 8 to slide and retract on the base 9.

[0050] It should be noted that, for example Figure 6 and Figure 7 As shown, in the existing magnetron sputtering device, the magnet 8 is fixed on the base 9 and rotates synchronously with the base 9. Since the magnet 8 is stationary, the magnetic field lines 21 of the magnet 8 will form a ring-shaped raceway region. Due to the highly concentrated sputtering effect in the magnetically confined sputtered particle distribution area 22, the target material in this area will be continuously and rapidly removed. As the working time progresses, the concentrated raceway region will form a V-shaped groove 23, such as... Figure 7As shown, as the groove 23 deepens, the magnetic field strength at the bottom of the groove 23 gradually weakens, leading to a decrease in plasma concentration and sputtering rate in this area. In other words, as the groove 23 deepens, the sputtering rate gradually decreases, resulting in a significant narrowing of the sputtering angle of particles affected by the magnetic field. Furthermore, since the magnet 8 is fixed on the base 9, the annular raceway region formed by the magnetic field of the magnet 8 is not uniformly distributed relative to the target material. This uneven distribution of the magnetic field leads to uneven distribution of the grooves 23 on the target material, which in turn results in uneven distribution of sputtering sources on the target surface, ultimately affecting the uniformity of the deposited film thickness. In other words, as the groove 23 on the target material deepens, the combined effect of the decreased sputtering rate and the uneven shape of the groove 23 leads to even worse film thickness uniformity.

[0051] In contrast to the existing methods of fixing the magnet 8, the magnetron sputtering apparatus provided by this invention uses a cylinder 11 to drive the magnet 8 to reciprocate between a first position 24 and a second position 25. The magnetic field of the magnet 8 covers a wider area during its rotation, such as... Figure 8 and Figure 9 As shown, after working for a period of time, the magnetic field of magnet 8 will cause the plasma to impact the target surface and create a wider groove 23. This not only expands the high-efficiency sputtering area of ​​the target, but also effectively improves the utilization rate of the target. At the same time, it avoids the formation of narrow and deep V-shaped grooves 23, effectively reducing the divergence problem of sputtering atomic angle caused by the consumption of the target. This makes the sputtering particle rate and area of ​​each region of the target in the early and middle and late stages of sputtering relatively similar, resulting in relatively uniform deposition of the film and effectively controlling the periodic fluctuation problem of film thickness uniformity.

[0052] Furthermore, since multiple magnets 8 are evenly distributed around the central area of ​​the magnet, during long-term operation, a relatively wide annular groove 23 will be formed on the surface of the target material corresponding to each magnet 8. Each annular groove 23 is concentrically arranged on the surface of the target material with the central axis of rotation 16 as the center, and the diameter increases from the inside to the outside. The edges of each annular groove 23 are interconnected, which makes each groove 23 on the surface of the target material tend to be flat, further reducing the divergence of sputtered atomic angles and enhancing the uniformity of film thickness.

[0053] The working principle of the magnetron sputtering device provided by this invention is summarized as follows:

[0054] In use, the magnetron sputtering device provided by this invention uses a rotary motor 7 to drive an outer rotating sleeve 3 to rotate around a central support base 19 via a transmission belt 6. Since the central rotating shaft 16 is fixedly connected to the outer rotating sleeve 3, the rotation of the outer rotating sleeve 3 will drive the central rotating shaft 16 to rotate synchronously, thereby driving the base 9 inside the mounting housing 5 to rotate. When the base 9 rotates around the axis of the central rotating shaft 16, each magnet 8 located on the base 9 also rotates synchronously. At the same time, driven by the cylinders 11 corresponding to each magnet 8, each magnet 8 moves synchronously back and forth along the radial direction of the magnet's central area.

[0055] Compared to the existing technology where the magnet 8 rotates in a single direction, the magnet 8 in this device can reciprocate on the mounting surface while rotating, thereby expanding the coverage area of ​​the magnetic field of a single magnet 8 on the target surface. Under the combined action of the magnetic fields of multiple magnets 8, the shape of the groove 23 generated on the target surface will tend to be flat, thereby improving the uniformity of sputtered atoms covering the substrate surface. At the same time, the magnetic field will cover a large area of ​​the target, which can improve the utilization rate of the target.

[0056] Embodiment 2 of the magnetron sputtering apparatus provided by the present invention:

[0057] The main difference between this embodiment and Embodiment 1 is that in Embodiment 1, a cylinder is arranged for each magnet to drive the magnet to slide back and forth. In Embodiment 2, a cylinder can be arranged in the center area of ​​the magnet. The extension end of the cylinder is fixedly equipped with a drive ring. The drive ring is arranged parallel to the back plate. The cylinder controls the drive ring to extend and retract in a direction perpendicular to the back plate. A connecting rod is set between the drive ring and each mounting seat on which the magnet is installed. One end of each connecting rod is hinged to the drive ring, and the other end is hinged to the corresponding mounting seat. During the process of the cylinder driving the drive ring to move back and forth, the corresponding mounting seat can be driven to slide back and forth with the magnet through each connecting rod, thus controlling the synchronous sliding of each magnet.

[0058] Embodiment 3 of the magnetron sputtering apparatus provided by the present invention:

[0059] The main difference between this embodiment and Embodiment 1 is that, in Embodiment 1, a cylinder is installed inside the mounting housing as a power source to drive the reciprocating sliding of each magnet. In Embodiment 3, each cylinder can be replaced with a servo motor or an electric push rod. By precisely controlling the servo motor or electric push rod, the sliding position of the magnet can be precisely controlled, and the position can be adjusted according to the shape of the groove formed by the target material.

[0060] Accordingly, if the power source is replaced with a servo motor, care should be taken to ensure the motor's magnetic seal protection to prevent the motor's magnetic field from affecting the magnetic field on the target surface. Additionally, a through hole can be provided on the central shaft to accommodate electrical wiring.

[0061] Embodiment 4 of the magnetron sputtering apparatus provided by the present invention:

[0062] The main difference between this embodiment and Embodiment 1 is that in Embodiment 1, the outer circumferential surface of the outer rotating sleeve has a circumferentially extending rack, and the rotary motor is connected to the rack via a transmission belt to drive the outer rotating sleeve to rotate. In this embodiment, the rotary motor directly drives the outer rotating sleeve to rotate via a gear transmission structure, or it can drive the outer rotating sleeve to rotate via a chain transmission mechanism or a belt transmission mechanism.

[0063] Embodiment 5 of the magnetron sputtering apparatus provided by the present invention:

[0064] The main difference between this embodiment and Embodiment 1 is that in Embodiment 1, each magnet is distributed in a circular pattern in the central area of ​​the magnet and moves back and forth along the radial direction of the central area of ​​the magnet. In Embodiment 5, each magnet is arranged linearly and uniformly or linearly staggeredly on the base plate with the central axis of rotation as the center, and moves back and forth along the radial direction of the central axis of rotation.

[0065] In other embodiments, the magnets may also be arranged in other shapes such as elliptical or rectangular, as long as the magnetic field of the magnets can uniformly cover the target material.

[0066] Based on the above description in this specification, those skilled in the art will also understand that the terms used, such as "upper," "lower," "front," "back," "left," "right," "top," "bottom," "inner," and "outer," which indicate orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings of this specification. The aforementioned orientation or positional relationship terms should not be understood or interpreted as limiting the present invention.

[0067] In addition, in the description of this specification, "multiple" means at least two, such as two, three or more, etc., unless otherwise expressly and specifically defined.

Claims

1. A magnetron sputtering apparatus, comprising a mounting housing having a back plate for arranging a magnetron sputtering target, a base rotating about a central axis perpendicular to the back plate within the mounting housing, and a magnet mounted on the base, the magnetic field of which acts on the magnetron sputtering target as the magnet rotates with the base, characterized in that... The magnet is reciprocally slidably arranged on the base along a direction parallel to the back plate, and a sliding driving mechanism is arranged on the base to drive the magnet to reciprocally slide during rotation of the base and the magnet. A magnet center area is arranged on the base beside the central axis, and a plurality of magnets are evenly arranged around the magnet center area, and the reciprocally sliding direction of the magnets on the base extends along the radial direction of the magnet center area. The sliding driving mechanism comprises a cylinder corresponding to each magnet, and each cylinder drives the corresponding magnet to reciprocally slide. Each cylinder is located on the side of the corresponding magnet facing the magnet center area. The magnet center area is provided with a gas distribution disc, and the gas distribution disc is provided with a main gas passage and a distribution gas passage corresponding to each cylinder.

2. The magnetron sputtering device of claim 1, wherein The base is provided with a sliding seat corresponding to each magnet, and the magnet is fixedly installed on the sliding seat.

3. The magnetron sputtering device of claim 1, wherein The base is provided with a sliding track extending along the radial direction of the magnet center area corresponding to each magnet, and the magnet is slidably arranged on the sliding track to reciprocally slide on the base.

4. The magnetron sputtering device according to any one of claims 1 to 3, characterized in that The mounting shell is fixedly provided with a center support seat, and an outer rotating sleeve is rotatably arranged outside the center support seat, and the outer rotating sleeve is driven to rotate by a driver, a through hole is arranged in the center support seat, a center rotating shaft is rotatably arranged in the through hole, and the center rotating shaft is driven to rotate by the outer rotating sleeve, the mounting end of the center rotating shaft extends into the mounting shell, and the base is fixedly arranged on the mounting end of the center rotating shaft to drive the base to rotate by the center rotating shaft.

5. The magnetron sputtering device of claim 4, wherein A gas passage is arranged in the center rotating shaft to supply gas to the cylinder to control the extension and retraction of the cylinder.

6. The magnetron sputtering device of claim 5, wherein The end of the outer rotating sleeve away from the mounting shell is assembled with a pneumatic slip ring through an adapter sleeve.

Images