Method and system for battery drop simulation

Abstract

Methods and systems are provided for battery drop simulation. A battery drop simulation method includes: generating, by at least one processor, a three-dimensional model of a battery including an adhesive member; receiving, by the at least one processor, information associated with the three-dimensional model; estimating, by the at least one processor, an adhesion coefficient of the adhesive member based on information associated with the three-dimensional model; performing, by the at least one processor, a drop simulation of the three-dimensional model based on the information associated with the three-dimensional model, the adhesion coefficient, and the drop condition information; and outputting, by the at least one processor, a drop simulation result of the drop simulation. The drop simulation result includes information about whether the adhesive member is separated due to the drop.

Description

TECHNICAL FIELD

[0001] Aspects of embodiments of the present disclosure relate to a method and system for battery drop simulation. BACKGROUND

[0002] Unlike primary batteries, which are designed not to be (re)charged, secondary (or rechargeable) batteries are batteries designed to be discharged and recharged. Low-capacity secondary batteries are used for portable small electronic devices such as smartphones, feature phones, notebook computers, digital cameras, and camcorders, while large-capacity secondary batteries are widely used as power sources to drive electric motors in hybrid and electric vehicles and for storing electric power (e.g., home and / or utility-scale power storage). A secondary battery generally includes an electrode assembly composed of a positive electrode and a negative electrode, a case that houses the electrode assembly, and electrode terminals connected to the electrode assembly.

[0003] To ensure the reliability of the safety of secondary batteries, various evaluations are being made on secondary batteries. In particular, battery safety tests against drops caused by accidents that can occur when using portable electronic devices or electric vehicles can be an important consideration factor. However, in physical property tests for safety evaluation, it can be difficult to control environmental factors to ensure continuity and reproducibility of the tests.

[0004] The above information disclosed in this Background section of the specification is for enhancing the understanding of the background of the present disclosure, and therefore, it can include information that does not constitute the related (or prior) art. SUMMARY

[0005] Embodiments of the present disclosure can relate to a method and system for battery drop simulation.

[0006] These and other aspects and features of the present disclosure will be described in the following description of embodiments of the present disclosure, taken in conjunction with the accompanying drawings, which are included herein by reference, and wherein:

[0007] According to one or more embodiments of the present disclosure, a battery drop simulation method includes generating, by at least one processor, a three-dimensional model of a battery including an adhesive member; receiving, by the at least one processor, information associated with the three-dimensional model; estimating, by the at least one processor, an adhesive coefficient of the adhesive member based on the information associated with the three-dimensional model; performing, by the at least one processor, a drop simulation of the three-dimensional model based on the information associated with the three-dimensional model, the adhesive coefficient, and drop condition information; and outputting, by the at least one processor, a drop simulation result of the drop simulation. The drop simulation result includes information on whether the adhesive member is separated due to the drop.

[0008] In an implementation, the three-dimensional model may further include a bag and an electrode core; and the information associated with the three-dimensional model may include information associated with the bag, information associated with the electrode core, and information associated with the adhesive component.

[0009] In an implementation, estimating the adhesion coefficient of the adhesive component may include: determining a preliminary adhesion coefficient of the adhesive component by at least one processor; performing a simulation analysis of the preliminary adhesion coefficient by at least one processor; and determining the adhesion coefficient by at least one processor based on the simulation analysis.

[0010] In an implementation, determining the adhesion coefficient may include: if the result of the simulation analysis is less than a threshold, then at least one processor determines the preliminary adhesion coefficient as the adhesion coefficient of the bonded component.

[0011] In an implementation, determining the adhesion coefficient may include: if the result of the simulation analysis is greater than or equal to a threshold, then at least one processor changes the initial adhesion coefficient.

[0012] In an implementation, the adhesion coefficient may include the normal failure stress coefficient and the shear failure stress coefficient.

[0013] In this implementation, the drop condition information may include drop height information, drop angle information, adhesive force information associated with the adhesive member, and shape information of the adhesive member.

[0014] In this implementation, the drop height information, drop angle information, and shape information of the adhesive member can be fixed values; and the execution of the drop simulation of the three-dimensional model can include: at least one processor evaluating whether the adhesive member separates according to changes in adhesive force information associated with the adhesive member.

[0015] In an implementation, the adhesive force information associated with the adhesive member may include first adhesive force information associated with a first region of the adhesive member and second adhesive force information associated with a second region of the adhesive member; and the first adhesive force information and the second adhesive force information may be different from each other.

[0016] In this implementation, the drop height information, the adhesive force information associated with the adhesive member, and the shape information of the adhesive member can be fixed values; and the execution of the drop simulation of the three-dimensional model can include: at least one processor evaluating whether the adhesive member separates according to the change in the drop angle information.

[0017] In this implementation, the drop height information, drop angle information, and adhesive force information associated with the adhesive member can be fixed values; and the execution of the drop simulation of the three-dimensional model can include: at least one processor evaluating whether the adhesive member separates according to changes in the shape information of the adhesive member.

[0018] In an implementation, the drop simulation results may further include information about the shape of the bag after deformation due to the drop.

[0019] In an implementation, the drop simulation results may further include stress information for each region of the bag as a result of the drop.

[0020] In one implementation, the non-transitory computer-readable recording medium may store instructions for performing a battery drop simulation method on a computer.

[0021] According to one or more embodiments of this disclosure, a battery drop simulation apparatus includes: a communication module; a memory; and at least one processor connected to the memory and configured to execute instructions stored in the memory to cause the at least one processor to: generate a three-dimensional model of the battery including adhesive members; receive information associated with the three-dimensional model; estimate the adhesion coefficient of the adhesive members based on the information associated with the three-dimensional model; perform a drop simulation of the three-dimensional model based on the information associated with the three-dimensional model, the adhesion coefficient, and drop condition information; and output the drop simulation results. The drop simulation results may include information about whether the adhesive members have separated due to the drop.

[0022] In an implementation, the three-dimensional model may further include a bag and an electrode core; and the information associated with the three-dimensional model may include information associated with the bag, information associated with the electrode core, and information associated with the adhesive component.

[0023] In an implementation, in order to estimate the adhesion coefficient of the adhesive component, the instructions may further cause at least one processor to: determine the preliminary adhesion coefficient of the adhesive component; perform a simulation analysis of the preliminary adhesion coefficient; and determine the adhesion coefficient based on the simulation analysis.

[0024] In this implementation, the drop condition information may include drop height information, drop angle information, adhesive force information associated with the adhesive member, and shape information of the adhesive member.

[0025] In an implementation, in order to perform a drop simulation of the three-dimensional model, the instructions may further enable at least one processor to evaluate whether the adhesive component separates according to changes in drop condition information.

[0026] In an implementation, the drop simulation results may further include information about the shape of the bag after deformation due to the drop.

[0027] According to some embodiments of this disclosure, users can perform simulations to test battery safety. Therefore, it is easier to ensure the continuity and reproducibility of safety testing. Furthermore, users can freely change various variables through simulation to more easily identify whether the adhesive components detach due to battery drops.

[0028] According to some embodiments of this disclosure, users can more easily identify the appearance of bag deformation and the stress value per unit area of ​​the bag based on the results of drop simulation.

[0029] These and other aspects and features of this disclosure will be described in the following description of embodiments of this disclosure, or will become apparent from the following description of embodiments of this disclosure.

[0030] However, the aspects and features of this disclosure are not limited to those described above, and those skilled in the art will clearly understand other aspects and features not mentioned from the detailed description below. Attached Figure Description

[0031] The accompanying drawings illustrate embodiments of the present disclosure and further describe aspects and features of the disclosure together with its detailed description. Therefore, this disclosure should not be construed as limited to the drawings.

[0032] Figure 1 A battery drop simulation method according to an embodiment of the present disclosure is shown.

[0033] Figure 2 This is a schematic diagram illustrating a configuration in which an information processing system according to an embodiment of the present disclosure is connected to multiple user terminals to enable communication for performing a battery drop simulation.

[0034] Figure 3 This is a block diagram illustrating the internal structure of a user terminal and an information processing system according to embodiments of the present disclosure.

[0035] Figure 4 The figure shows a cross-section of a three-dimensional model of a battery according to an embodiment of the present disclosure.

[0036] Figure 5 This is a flowchart illustrating a method for estimating the adhesion coefficient according to an embodiment of the present disclosure.

[0037] Figure 6 This is a schematic diagram illustrating a simulation analysis according to an embodiment of the present disclosure.

[0038] Figure 7 This is a schematic diagram illustrating the results of a drop simulation according to an embodiment of the present disclosure.

[0039] Figure 8This is a schematic diagram illustrating the results of a drop simulation according to an embodiment of the present disclosure.

[0040] Figure 9 This is a schematic diagram illustrating the results of a drop simulation according to an embodiment of the present disclosure.

[0041] Figure 10 This is a graph showing the results of a drop simulation according to an embodiment of the present disclosure.

[0042] Figure 11 This is a flowchart illustrating a method according to an embodiment of the present disclosure.

[0043] Explanation of some figure labels

[0044] 110: 3D model

[0045] 120: 3D Model Related Information

[0046] 130: Coefficient of adhesion

[0047] 140: Fall Condition Information

[0048] 150: Fall Simulator

[0049] 160: Drop Simulation Results Detailed Implementation

[0050] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Based on the principle that the inventor can be his / her own lexicographer to appropriately define the concepts of terms in order to best illustrate his / her invention, the terms or words used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted as having meanings and concepts consistent with the technical spirit of the present disclosure.

[0051] The embodiments described in this specification and the configurations shown in the accompanying drawings are only some of the embodiments of this disclosure and do not represent all the technical ideas, aspects, and features of this disclosure. Accordingly, it should be understood that various equivalents and modifications are possible at the time of filing this application, which can replace or modify the embodiments described herein.

[0052] It will be understood that when a layer or element is referred to as being "between" two layers, it can be the only layer between those two layers, or one or more intermediary layers may exist. It will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to," or "linked to" another element or layer, it can be directly on, connected to, or linked to that other element or layer, or one or more intermediary elements or layers may exist. When an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly linked to" another element or layer, no intermediary element or layer exists. For example, when a first element is described as being "linked" or "connected" to a second element, the first element can be directly linked to or connected to the second element, or the first element can be indirectly linked to or connected to the second element via one or more intermediary elements.

[0053] In the accompanying drawings, the dimensions of various elements, layers, etc., may be exaggerated for clarity of illustration. The same reference numerals designate the same elements. As used herein, the term "and / or" includes any and all combinations of one or more of the items listed. Furthermore, when describing embodiments of this disclosure, the use of "may" means "one or more embodiments of this disclosure." Expressions such as "at least one of" and "any one of" modify the entire list of elements without modifying individual elements in the list when placed after the list of elements. When phrases such as "at least one of A, B, and C," "at least one selected from the group of A, B, and C," or "at least one selected from A, B, and C" are used to specify a list of elements A, B, and C, the phrase may refer to any and all suitable combinations or subsets of A, B, and C, such as A, B, C, A and B, A and C, B and C, or A and B and C. As used herein, the terms "use," "in use," and "being used" may be considered synonymous with the terms "utilizing," "being utilized," and "being exploited," respectively. As used herein, the terms “substantially,” “approximately,” and similar terms are used as approximate terms rather than terms of degree and are intended to describe the inherent biases of measurements or calculations that would be recognized by one of ordinary skill in the art.

[0054] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0055] For ease of description, spatial relative terms such as “below,” “under,” “below,” “above,” and “above” may be used herein to describe the relationship of one element or feature as shown in the figures to one or more other elements or features. It will be understood that, in addition to the orientation shown in the figures, spatial relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features would be oriented “above” or “above” other elements or features. Thus, the term “below” can include both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0056] The terminology used herein is for the purpose of describing embodiments of this disclosure and is not intended to limit this disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “an” are intended to include the plural forms as well. It will be further understood that, when used in this specification, the terms “comprising,” “including,” “containing,” and / or “including” specify the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof.

[0057] Furthermore, any numerical range disclosed and / or listed herein is intended to include all subranges with the same numerical precision contained within the listed range. For example, the range “1.0 to 10.0” is intended to include all subranges between the listed minimum value of 1.0 and the listed maximum value of 10.0 (and inclusive of the minimum value of 1.0), i.e., a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, for example, 2.4 to 7.6. Any maximum numerical limit listed herein is intended to include all smaller numerical limits contained therein, and any minimum numerical limit listed in this specification is intended to include all larger numerical limits contained therein. Therefore, the applicant reserves the right to amend this specification (including the claims) to explicitly list any subranges contained within the ranges explicitly listed herein. All such ranges are intended to be inherently described in this specification such that any amendments used to explicitly list any of these subranges will comply with the requirements of local patent law.

[0058] Referring to two compared elements, features, etc., as "identical" can mean that they are "substantially identical." Therefore, the phrase "substantially identical" can include cases with deviations considered low in the art (e.g., 5% or less). Additionally, when a parameter is said to be consistent in a given region, this can mean that it is consistent in terms of the mean.

[0059] Throughout this specification, unless otherwise stated, each element may be singular or plural.

[0060] Placing any element "above (or below)" or "above (or below)" another element can mean that the arbitrary element can contact the upper (or lower) surface of the element, and that another element can be located between the element and the arbitrary element placed above (or below) the element.

[0061] Additionally, it will be understood that when a component is referred to as a “link,” “connect,” or “attached” to another component, these components can be directly “linked,” “attached,” or “attached” to each other, or another component can be “between” these components.

[0062] Throughout this specification, unless otherwise stated, when “A and / or B” is mentioned, it means A, B, or A and B. That is, “and / or” includes any or all combinations of the enumerated items. Unless otherwise stated, when “C to D” is mentioned, it means C or more and D or fewer.

[0063] As used herein, the terms "module" or "unit" can refer to a software component or a hardware component, and a "module" or "unit" can perform a specific task. However, a "module" or "unit" is not limited to software or hardware. A "module" or "unit" can reside on an addressable storage medium and can drive one or more processors. Thus, by way of example, a "module" or "unit" can include at least one of various suitable components, processes, functions, attributes, procedures, subroutines, program code segments, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables, such as software components, object-oriented software components, class components, and task components. Components and modules or units can be combined with each other to form a smaller number of larger components and modules or units while maintaining or substantially maintaining the same functionality, or they can be divided into a larger number of smaller components and modules or units.

[0064] According to embodiments of this disclosure, a "module" or "unit" may be implemented using a processor and memory. A "processor" may include a general-purpose processor, a central processing unit (CPU), a microprocessor, a digital signal processor (DSP), a controller, a microcontroller, and / or a state machine, etc. In some embodiments, a "processor" may refer to an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a field-programmable gate array (FPGA), etc. A "processor" may refer to, for example, a combination of a DSP and a microprocessor, a combination of multiple microprocessors, a combination of one or more microprocessors combined with a DSP core, or a combination of other processing devices. Additionally, the term "memory" may include any suitable electronic component capable of storing electronic information. "Memory" may refer to various suitable types of processor-readable media such as random access memory (RAM), read-only memory (ROM), non-volatile random access memory (NVRAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable PROM (EEPROM), flash memory, magnetic or optical data memory, and / or registers. If the processor can read information from and / or write information to the memory, the memory can communicate electronically with the processor. The memory integrated into the processor can communicate electronically with the processor.

[0065] As used herein, the term "system" may include, but is not limited to, at least one of server devices and cloud devices. For example, a system may consist of one or more server devices. As an example, a system may consist of one or more cloud devices. As another example, a system may operate in conjunction with server devices and cloud devices.

[0066] As used herein, the term "display" can refer to any suitable display device associated with a computing device. For example, the term "display" can refer to a specific display device that is controlled by or capable of displaying information / data provided by the computing device.

[0067] Figure 1 A battery drop simulation method according to an embodiment of the present disclosure is illustrated. In this embodiment, a processor (e.g., at least one processor of an information processing system) can generate a three-dimensional model (3D model) 110 of the battery. The three-dimensional model 110 may include adhesive components, pouches, and electrode cores, etc. Reference will be made below. Figure 4 A more detailed description of an example of 3D model 110.

[0068] In an implementation, the processor may receive 3D model-related information 120. 3D model-related information 120 may include, but is not limited to, information associated with a bag (e.g., the bag's high-speed tensile strength and / or its thickness), information associated with an electrode core (e.g., the electrode core's hardness), information associated with an adhesive member (e.g., the material of the adhesive member), battery cell design information (e.g., battery cell size, weight, thickness, and / or adhesive application area), and information associated with a group in which the 3D model 110 and the clamps are combined (e.g., connected or attached) with each other (e.g., the shape of the group, its weight, and / or the shape of the straps used in the group).

[0069] In this implementation, the processor can estimate the adhesion coefficient 130 of the bonded component based on 3D model-related information 120. More specifically, the processor can determine the preliminary adhesion coefficient of the bonded component. Furthermore, the processor can perform a simulation analysis based on the determined preliminary adhesion coefficient. Additionally, the processor can determine the adhesion coefficient 130 based on the simulation analysis. Reference will be made below. Figure 5 A more detailed example of the method used to estimate the coefficient of adhesion 130 is described.

[0070] In this implementation, drop simulation of the 3D model 110 can be performed by inputting 3D model-related information 120, estimated adhesion coefficient 130, and drop condition information 140 into a drop simulator 150. The drop condition information 140 may include drop height information, drop angle information, adhesive force information related to the adhesive member, shape information of the adhesive member, and adhesive position of the adhesive member. Therefore, the drop simulator 150 can perform drop simulation of the 3D model 110 based on the drop condition information 140 and can generate a drop simulation result 160 associated with the simulation data. The processor can then obtain the drop simulation result 160 from the drop simulator 150 and output it to a display. In this case, the drop simulation result 160 may include information about whether the adhesive member has separated due to the drop, information about the deformed shape of the bag, and information about the stress per unit area of ​​the bag.

[0071] In this configuration, users can perform simulations to test battery safety. Therefore, users can more easily ensure the continuity and reproducibility of safety testing. Furthermore, users can freely change various suitable variables through simulation to more easily identify whether the adhesive components have separated due to battery drops.

[0072] Figure 2 This is a schematic diagram illustrating a configuration of an information processing system 230 according to an embodiment of the present disclosure, wherein the system is connected to a plurality of user terminals 210_1, 210_2, and 210_3 to enable communication for performing a battery drop simulation. Reference Figure 2Multiple user terminals 210_1, 210_2, and 210_3 can be connected to an information processing system 230 that can provide battery drop simulation services via network 220. The multiple user terminals 210_1, 210_2, and 210_3 may include terminals of users receiving battery drop simulation services.

[0073] In an implementation, the information processing system 230 may include one or more server devices and / or databases or one or more distributed computing devices and / or distributed databases based on cloud computing services, capable of storing, providing, and executing computer executable programs (e.g., downloadable applications) and data related to providing battery drop simulation services.

[0074] The battery drop simulation service provided by the information processing system 230 can be delivered to users via a battery drop simulation application, web browser, web browser extension, etc., installed on multiple user terminals 210_1, 210_2, and 210_3. For example, through the battery drop simulation application, the information processing system 230 can provide information or perform corresponding processing corresponding to requests for the output of battery drop simulation results received from user terminals 210_1, 210_2, and 210_3.

[0075] Multiple user terminals 210_1, 210_2, and 210_3 can communicate with the information processing system 230 via network 220. Network 220 enables communication between the multiple user terminals 210_1, 210_2, and 210_3 and the information processing system 230. Depending on the installation environment, network 220 may include wired networks such as Ethernet, wired home networks (e.g., powerline communication), telephone line communication, or RS serial communication; wireless networks such as mobile communication networks, wireless LANs (e.g., WLANs), Wi-Fi, Bluetooth, or ZigBee; or suitable combinations thereof. Any suitable communication scheme can be used, and both communication schemes utilizing the communication networks that network 220 may include (e.g., mobile communication networks, wired internet, wireless internet, broadcast networks, and / or satellite networks, etc.) and communication schemes utilizing short-range wireless communication between user terminals 210_1, 210_2, and 210_3 can be used.

[0076] exist Figure 2In this disclosure, user terminal 210_1 as a mobile phone terminal, user terminal 210_2 as a tablet terminal, and user terminal 210_3 as a PC terminal are shown as representative examples of user terminals, but this disclosure is not limited thereto, and user terminals 210_1, 210_2, and 210_3 may include any suitable computing device capable of wired and / or wireless communication and capable of installing and executing battery drop simulation applications or web browsers. For example, user terminals may include AI speakers, smartphones, mobile phones, navigation aids, computers (e.g., laptop computers or tablet PCs), digital broadcasting terminals, personal digital assistants (PDAs), portable multimedia players (PMPs), game consoles, wearable devices, Internet of Things (IoT) devices, virtual reality (VR) devices, augmented reality (AR) devices, and / or set-top boxes. Additionally, although in Figure 2 In the diagram, three user terminals 210_1, 210_2 and 210_3 are shown communicating with the information processing system 230 via network 220, but this disclosure is not limited thereto, and different numbers of user terminals may be configured to communicate with the information processing system 230 via network 220.

[0077] exist Figure 2 The configuration in which a user request (e.g., a request to output the results of a battery drop simulation) is transmitted to the information processing system 230 via user terminals 210_1, 210_2, and 210_3 is shown as an example, but this disclosure is not limited thereto. Furthermore, without going through user terminals 210_1, 210_2, and 210_3, the user request can be provided to the information processing system 230 via an input device associated with the information processing system 230, so that the result of processing the user request (e.g., the results of a battery drop simulation) can be provided to the user via an output device (e.g., a display) associated with the information processing system 230.

[0078] Figure 3 This is a block diagram illustrating the internal structure of a user terminal 210 and an information processing system 230 according to embodiments of the present disclosure. The user terminal 210 can refer to any suitable computing device capable of executing applications and / or web browsers and capable of wired / wireless communication. The user terminal 210 may include, for example, those referenced above. Figure 2 The user terminal 210_1 described is a mobile phone terminal, the user terminal 210_2 is a tablet terminal, and / or the user terminal 210_3 is a PC terminal. (See reference) Figure 3 User terminal 210 may include memory 312, processor 314, communication module 316, and input / output interface 318. Information processing system 230 may include memory 332, processor 334, communication module 336, and input / output interface 338. For example... Figure 3As shown, user terminal 210 and information processing system 230 can exchange information and / or data with each other via network 220 using their communication modules 316 and 336. Additionally, input / output device 320 can input information and / or data to user terminal 210 via input / output interface 318, or output information and / or data generated from user terminal 210.

[0079] Memory 312 or 332 may include any suitable non-transitory computer-readable recording medium. According to embodiments, memory 312 or 332 may include a permanent mass storage device such as read-only memory (ROM), a disk drive, a solid-state drive (SSD), or flash memory. As another example, a permanent mass storage device such as ROM, SSD, flash memory, or disk drive may be included in the user terminal 210 and / or information processing system 230 as a separate permanent storage device from the memory. Additionally, memory 312 or 332 may store an operating system and at least one program code.

[0080] Software components can be loaded from a computer-readable recording medium separate from memory 312 or 332. The separate computer-readable recording medium may include a recording medium directly connectable to user terminal 210 or information processing system 230, and may include, for example, computer-readable recording media such as floppy disk drives, magnetic disks, magnetic tapes, DVD / CD-ROM drives, or memory cards. As another example, software components may be loaded onto memory 312 or 332 via communication modules 316 or 336 instead of a computer-readable recording medium. For example, at least one program may be loaded onto memory 312 or 332 based on a computer program installed by a developer via network 220 or a file distribution system distributing installation files for an application.

[0081] Processor 314 or 334 can process instructions of a computer program by performing basic arithmetic, logic, and input / output operations. Instructions can be provided to processor 314 or 334 by memory 312 or 332 or communication module 316 or 336. For example, processor 314 or 334 can execute received instructions based on program code stored in a recording device such as memory 312 or 332.

[0082] Communication modules 316 and 336 can provide configuration or functionality for user terminal 210 and information processing system 230 to communicate with each other via network 220, and can also provide configuration or functionality for user terminal 210 and / or information processing system 230 to communicate with other user terminals or other systems (e.g., a separate cloud system). For example, under the control of communication module 316, requests or data (e.g., battery drop simulation output requests) generated by processor 314 of user terminal 210 according to program code stored in a recording device such as memory 312 can be transmitted to information processing system 230 via network 220. Similarly, control signals or commands provided under the control of processor 334 of information processing system 230 can be transmitted on network 220 via communication module 336 and can be received by user terminal 210 through communication module 316.

[0083] Input / output interface 318 can provide an interface with input / output device 320. As an example, the input device may include suitable means such as a camera including an audio sensor and / or an image sensor, a keyboard, a microphone, or a mouse. The output device may include suitable means such as a display, a speaker, or a haptic feedback device. As another example, input / output interface 318 may be a means for engaging with a device having a structure or function integrated into a single unit for performing input and output (e.g., a touchscreen). For example, when the processor 314 of user terminal 210 processes instructions of a computer program loaded onto memory 312, a service screen based on information and / or data provided by information processing system 230 or another user terminal can be displayed on a monitor through input / output interface 318. Figure 3 In this diagram, the input / output device 320 is shown as not being included in the user terminal 210; however, this disclosure is not limited thereto, and the input / output device 320 may be implemented as a single device with the user terminal 210. Furthermore, the input / output interface 338 of the information processing system 230 may be a device for engaging with inputs or outputs that can be connected to or included in the information processing system 230. Figure 3 In the present invention, input / output interface 318 or 338 is shown as a component separate from processor 314 or 334, but the present disclosure is not limited thereto, and input / output interface 318 or 338 may be included in processor 314 or 334.

[0084] User terminal 210 or information processing system 230 may include, as mentioned above, references Figure 3The components described are numerous. In an embodiment, user terminal 210 may be implemented to include at least one of the input / output devices 320 described above. Additionally, user terminal 210 may further include other components such as a transceiver, a Global Positioning System (GPS) module, a camera, various sensors, and a database. For example, if user terminal 210 is a smartphone, it may include those components typically included in smartphones. For example, user terminal 210 may be implemented to further include suitable components such as an accelerometer sensor, a gyroscope sensor, a microphone module, a camera module, various physical buttons, buttons using a touch panel, input / output ports, and a vibrator for vibration.

[0085] When the battery drop simulation service program or application is running, processor 314 can receive text, images, video, voice, and / or actions via suitable input devices such as a touchscreen, keyboard, camera including an audio sensor and / or image sensor, and microphone connected to input / output interface 318. Processor 314 can store the received text, images, video, voice, and / or actions in memory 312, or it can provide them to information processing system 230 over network 220 via communication module 316.

[0086] The processor 314 of user terminal 210 can manage, process, and / or store information and / or data received from input / output device 320, another user terminal, information processing system 230, and / or multiple external systems. The information and / or data processed by processor 314 can be provided to information processing system 230 over network 220 via communication module 316. The processor 314 of user terminal 210 can transmit information and / or data to input / output device 320 for output via input / output interface 318. For example, processor 314 can output received information and / or data to or display on a screen associated with user terminal 210.

[0087] The processor 334 of the information processing system 230 can manage, process, and / or store information and / or data received from multiple user terminals 210 and / or multiple external systems. The information and / or data processed by the processor 334 can be provided to the user terminals 210 on the network 220 via the communication module 336.

[0088] Figure 4The illustration shows a cross-section of a three-dimensional model 410 of a battery according to an embodiment of the present disclosure. In the embodiment, the three-dimensional model 410 may include an electrode core 420, a pouch 430 surrounding (e.g., surrounding its periphery) the electrode core 420, and an adhesive member 450 attached to the pouch 430. The interface 440 between the pouch 430 and the adhesive member 450 may be a surface to which the adhesive force of the adhesive member 450 is applied, and may be related to the adhesive coefficient of the adhesive member 450. Additionally, the pouch 430 may be connected to a clamp 460 via the adhesive member 450.

[0089] In an embodiment, the adhesive member 450 may include a first adhesive member attached to the bag 430 and a second adhesive member disposed between the first adhesive member and the clamp 460. As an example, when the materials of the bag 430 and the clamp 460 are different from each other, the materials of the first adhesive member and the second adhesive member may be different from each other. For example, the material of the first adhesive member may be a material that adheres well to the material of the bag 430, and the material of the second adhesive member may be a material that adheres well to both the material of the first adhesive member and the material of the clamp 460. Furthermore, at least one of the first adhesive member and the second adhesive member may be a double-sided adhesive member.

[0090] exist Figure 4 In the illustration, the thicknesses of the core 420, bag 430, interface 440, adhesive member 450 and clamp 460 are shown, but the present disclosure is not limited thereto, and the thicknesses may be modified in various ways depending on their materials.

[0091] Figure 5 This is a flowchart illustrating a method for estimating the adhesion coefficient according to an embodiment of the present disclosure. In the embodiment, the method for estimating the adhesion coefficient may be performed by at least one processor (e.g., Figure 3 The processor (334) executes the process. A method for estimating the adhesion coefficient can be initiated, and the processor can determine the preliminary adhesion coefficient of the adhesive member included in the three-dimensional model of the battery (step S510). Depending on the direction of the adhesion coefficient evaluation (e.g., in a direction perpendicular or parallel to the surface of the adhesive member), the adhesion coefficient can include a normal failure stress coefficient and a shear failure stress coefficient. Furthermore, the preliminary adhesion coefficient can be assumed to be a certain number.

[0092] Subsequently, the processor can perform a simulation analysis on the preliminary adhesion coefficient (step S520). The simulation analysis can refer to a comparison and analysis between the adhesive force of the bonded component evaluated in a laboratory environment and the adhesive force of the bonded component realized in a simulation. Therefore, the processor can calculate the ratio of the adhesive force of the bonded component evaluated in the laboratory environment to the adhesive force of the bonded component realized in the simulation. For example, peel tests and lap shear tests can be performed to evaluate the adhesive force of the bonded component in the laboratory environment, but the tests are not limited to these.

[0093] Subsequently, the processor can determine whether the result of the simulation analysis (e.g., the difference between the adhesive force of the adhesive component evaluated in the experimental environment and the adhesive force of the adhesive component implemented in the simulation) is less than a threshold (e.g., a preset or predetermined threshold such as 5%) (step S530). In other words, the processor can determine whether the adhesive force of the adhesive component implemented in the simulation is sufficiently matched with the adhesive force of the adhesive component evaluated in the experimental environment.

[0094] If the simulation analysis result is greater than or equal to a threshold (e.g., when the simulation analysis result is greater than or equal to a threshold), the processor can change the initial adhesion coefficient (step S532). Furthermore, the processor can perform a simulation analysis on the changed initial adhesion coefficient. This process can be repeated until the simulation analysis result is less than a threshold (e.g., yes at S530). If the simulation analysis result is less than a threshold (e.g., when the simulation analysis result is less than a threshold), the processor can determine the initial adhesion coefficient as the adhesion coefficient of the adhesive member to be included in the 3D model (step S540).

[0095] Figure 6 This is a schematic diagram illustrating a simulation analysis according to an embodiment of the present disclosure. In the embodiment, the processor (e.g., Figure 3 The processor 334 can determine the preliminary adhesion coefficient of the adhesive member 620. Additionally, the processor can perform a simulation analysis of the preliminary adhesion coefficient to determine the adhesion coefficient of the adhesive member 620.

[0096] In this implementation, the processor can receive adhesive force information of the adhesive member 620 evaluated in a test environment to perform simulation analysis. For example, the adhesive member 620 can be attached to a specific area (w*h) of the bag 610 to evaluate the adhesive force of the adhesive member 620. In this case, the lateral length (w) and longitudinal length (h) of the specific area (w*h) can be modified in various ways as needed or desired. Additionally, the vertical adhesive force of the adhesive member 620 can be calculated using a peel test or similar method. Furthermore, the surface-direction adhesive force of the adhesive member 620 can be calculated using an overlap shear test or similar method.

[0097] The first graph 630 illustrates an example of the vertical adhesive force of the bonded member 620 evaluated in a test environment. In an implementation, the processor can input the average vertical adhesive force of the bonded member 620 evaluated in the test environment and an initial adhesion coefficient, and can compare them with the average vertical adhesive force of the bonded member 620 achieved in a simulation. If the comparison result is less than a threshold (e.g., a preset or predetermined threshold such as 5%) (e.g., when the comparison result is less than this threshold), the processor can determine the initial adhesion coefficient as a first adhesion coefficient 632 associated with the vertical adhesive force of the bonded member 620. In other words, the first adhesion coefficient 632 may be a normal failure stress coefficient.

[0098] The second graph 640 illustrates an example of the surface-direction adhesive force of the bonded member 620 evaluated in a test environment. In an embodiment, the processor can input the maximum surface-direction adhesive force of the bonded member 620 evaluated in the test environment and an initial adhesion coefficient, and compare them with the maximum surface-direction adhesive force of the bonded member 620 achieved in a simulation. If the comparison result is less than a threshold (e.g., a preset or predetermined threshold such as 5%) (e.g., when the comparison result is less than this threshold), the initial adhesion coefficient can be determined as a second adhesion coefficient 642 associated with the surface-direction adhesive force of the bonded member 620. In other words, the second adhesion coefficient 642 can be a shear failure stress coefficient.

[0099] Figure 7 This is a schematic diagram illustrating drop simulation results according to embodiments of the present disclosure. In these embodiments, drop condition information may include drop height information, drop angle information, adhesive force information associated with the adhesive member, and shape information of the adhesive member. The drop height information, drop angle information, and shape information of the adhesive member may be fixed values. In this case, the effects caused by the adhesive force of the adhesive member can be identified through drop simulation.

[0100] In the implementation, the processor (e.g., Figure 3The processor 334 can evaluate whether the bonded member separates based on changes in adhesive force information associated with the bonded member. The adhesive force information associated with the bonded member may include adhesive composition information, adhesive size information, and adhesive density information. More specifically, the bonded member can be attached to the target object 710 in the simulation. In this case, the adhesive of the bonded member can be applied at regular intervals, in the form of dots. As another example, the adhesive of the bonded member can be applied to all areas (e.g., perfect bonding). Additionally, the adhesive force information associated with the bonded member may include first adhesive force information associated with a first region 712 of the bonded member and second adhesive force information associated with a second region 714 of the bonded member. The first and second adhesive force information may differ from each other. Whether the bonded member separates based on the adhesive force can be indicated as shown in Table 1 below.

[0101] Table 1:

[0102] Case 1 Case 2 Case 3 First region 1.2 1.2 Perfect fit Second region 0.7 0.8 Perfect fit Result Not good Good Good

[0103] Table 1 shows the situation when the shape of the adhesive component is fixed (e.g., see below for reference). Figure 9 In a more detailed description of the first shape 912, with a drop height of 1.48 m and a drop angle of 0°, it is determined whether the adhesive components separate based on their adhesive force. Referring to Table 1, the adhesive force of the adhesive components varies depending on the difference in diameter of the adhesive applied to the second region 714, and accordingly, whether the adhesive components of the target object 710 separate can be identified through drop simulation. Furthermore, the adhesive force (e.g., contact force) based on adhesive force, adhesive area, and time in each of these cases can be identified using graph 720.

[0104] Figure 8 This is a schematic diagram illustrating drop simulation results according to an embodiment of the present disclosure. In the embodiment, drop condition information may include drop height information, drop angle information, adhesive force information associated with the adhesive member, and shape information of the adhesive member. The drop height information, the adhesive force information associated with the adhesive member, and the shape information of the adhesive member may be fixed values. In this case, the effects caused by the drop angle of the three-dimensional model 810 can be identified through drop simulation.

[0105] In the implementation, the processor (e.g., Figure 3 The processor 334 can evaluate whether the adhesive component separates according to the change in drop angle information. More specifically, the processor can determine by simulation whether the adhesive component separates according to the angle θ formed between the falling 3D model 810 and the ground. Whether the adhesive component separates according to the drop angle θ can be indicated as shown in Table 2 below.

[0106] Table 2:

[0107] Case 1 Case 2 Case 3 Case 4 Case 5 Case 6 Drop angle (°) 0 26 -26 90 -90 180 Result Good Good Good Good Good Not good

[0108] Table 2 shows the situation when the shape of the bonded component is fixed (e.g., referenced below). Figure 9 The first shape 912, described in more detail, has a drop height of 1.4m, applied to the above reference. Figure 7 When the diameter of the adhesive applied to the first region 712 is 1.2 mm and the diameter of the adhesive applied to the second region 714 is 0.7 mm, the adhesive components separate according to the adhesive force of the adhesive components. Referring to Table 2, the impact applied to the 3D model 810 varies depending on the drop angle θ of the 3D model 810, and accordingly, whether the adhesive components of the 3D model 810 separate can be identified by drop simulation. In addition, the adhesive force (e.g., contact force) according to angle, adhesive area, and time in each of cases 1 and 6 can be identified by graph 820.

[0109] Figure 9 This is a schematic diagram illustrating drop simulation results according to embodiments of the present disclosure. In these embodiments, drop condition information may include drop height information, drop angle information, adhesive force information associated with the adhesive member, and shape information of the adhesive member. The drop height information, drop angle information, and adhesive force information associated with the adhesive member may be fixed values. In this case, the effects caused by the shape information of the adhesive member can be identified through drop simulation.

[0110] In the implementation, the processor (e.g., Figure 3 The processor 334 can evaluate whether the adhesive components separate according to changes in the shape information of the adhesive components. More specifically, the processor can pre-configure the shapes 912, 914, and 916 of multiple adhesive components and can determine through simulation whether the adhesive components separate according to the shape of the adhesive components attached to the dropped 3D model. Whether the adhesive components separate according to the shape of the adhesive components can be indicated as shown in Table 3 below.

[0111] Table 3:

[0112] Case 1 Case 2 Case 3 Shape type First shape Second shape Third shape Result Good Good Good

[0113] Table 3 shows the results when the drop height is 1.4m and the drop angle is 0°, applied to the above reference... Figure 7When the diameter of the adhesive applied to the first region 712 is 1.2 mm and the diameter of the adhesive applied to the second region 714 is 0.7 mm, the question is whether the adhesive components separate according to their shape. Referring to Table 3, the impact applied to the 3D model varies depending on the shape of the adhesive components attached to the 3D model, and accordingly, whether the adhesive components of the 3D model separate can be identified through drop simulation. Furthermore, the adhesive force (e.g., contact force) based on the shape of the adhesive component, the adhesive area, and the time can be identified using graph 920.

[0114] Figure 10 These are diagrams illustrating drop simulation results according to embodiments of the present disclosure. First image 1010 shows an example of the shape of a bag deformed due to a drop, and second image 1020 shows an example of the stress per unit area in the bag due to a drop. In embodiments, drop simulation results may include information about whether adhesive members have separated due to a drop, information about the shape of the bag deformed due to a drop, and information about the stress per unit area in the bag due to a drop. Therefore, users can more easily identify the appearance of bag deformation and the stress value per unit area in the bag through the results of drop simulation.

[0115] Figure 11 This is a flowchart illustrating a method 1100 according to an embodiment of the present disclosure. In this embodiment, method 1100 may be executed by at least one processor. Method 1100 may begin, and the processor may generate a three-dimensional model of the battery including adhesive components (step S1110). The three-dimensional model may further include a pouch and an electrode core.

[0116] Subsequently, the processor can receive information associated with the three-dimensional model, or in other words, 3D model-related information (step S1120). The 3D model-related information may include information related to the bag, information related to the pole core, and information related to the adhesive component.

[0117] The processor can estimate the adhesion coefficient of the bonded component based on relevant information from the 3D model (step S1130). More specifically, the processor can determine the preliminary adhesion coefficient of the bonded component. Additionally, the processor can perform a simulation analysis based on the determined preliminary adhesion coefficient. The processor can then determine the adhesion coefficient based on the simulation analysis. The adhesion coefficient may include the normal failure stress coefficient and the shear failure stress coefficient.

[0118] Based on 3D model information, adhesion coefficient, and drop condition information, the processor can perform a drop simulation of the 3D model (step S1140). Additionally, the processor can output the drop simulation results (step S1150). The drop condition information may include drop height information, drop angle information, adhesive force information associated with the adhesive member, and shape information of the adhesive member. Furthermore, the drop simulation results may include information about whether the adhesive member separates due to the drop.

[0119] In one implementation, if the result of the simulation analysis is less than a threshold (e.g., a preset or predetermined threshold) (e.g., when the result of the simulation analysis is less than the threshold), the processor can determine the initial adhesion coefficient as the adhesion coefficient of the bonded component. As another example, if the result of the simulation analysis is greater than or equal to the threshold (e.g., when the result of the simulation analysis is greater than or equal to the threshold), the processor can change the initial adhesion coefficient.

[0120] In this implementation, the drop height information, drop angle information, and shape information of the adhesive member can be fixed values. In this case, the processor can assess whether the adhesive member separates due to a change in the adhesive force information associated with the adhesive member. The adhesive force information associated with the adhesive member may include first adhesive force information associated with a first region of the adhesive member and second adhesive force information associated with a second region of the adhesive member. Furthermore, the first adhesive force information and the second adhesive force information may be different from each other.

[0121] In this implementation, the drop height information, the adhesive force information associated with the adhesive member, and the shape information of the adhesive member can be fixed values. In this case, the processor can assess whether the adhesive member separates due to a change in the drop angle information.

[0122] In this implementation, the drop height information, drop angle information, and adhesive force information associated with the adhesive member can be fixed values. In this case, the processor can assess whether the adhesive member separates due to changes in the shape information of the adhesive member.

[0123] In this implementation, the drop simulation results may further include information about the shape of the pouch deformed due to the drop. Additionally, the drop simulation results may further include stress information for each region of the pouch caused by the drop.

[0124] Method 1100 can be provided as a computer program stored in a computer-readable recording medium for execution on a computer. The medium can be used for continuous storage of executable programs on a computer, or for temporary storage of them for execution or download. Furthermore, the medium can be various recording or storage devices in the form of a single piece of hardware or a combination of several pieces of hardware, and the medium can be directly connected to a computer system or can be distributed over a network. Examples of the medium can include magnetic media such as hard disks, floppy disks, and magnetic tapes that can store program instructions; optical recording media such as CD-ROMs and DVDs; and magneto-optical media such as floppy disks, ROMs, RAMs, or flash memory. Additionally, examples of other media can include recording or storage media managed by an application store that distributes applications or by a site or server that supplies or distributes various other software.

[0125] The methods, operations, or techniques of embodiments of this disclosure can be implemented in various suitable ways. For example, these methods, operations, or techniques can be implemented in hardware, firmware, software, or a combination thereof. Those skilled in the art will understand that the various illustrative logic blocks, modules, circuits, and algorithmic processes described in connection with this disclosure can be implemented in electronic hardware, computer software, or a combination thereof. To clearly illustrate this substitution between hardware and software, various illustrative components, blocks, modules, circuits, and processes have been generally described above according to their functions. Whether such functionality is implemented in hardware or software depends on the specific application and the design requirements imposed on the overall system. Those skilled in the art can implement the described functions in various suitable ways for a specific application, but such implementation should not be construed as departing from the spirit and scope of this disclosure.

[0126] In a hardware implementation, the processing unit for performing the technology can be implemented using one or more ASICs, DSPs, GPUs, digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, electronic devices, other electronic units designed to perform the functions described in this disclosure, computers, or combinations thereof.

[0127] Therefore, the various example logic blocks, modules, and circuits described in connection with this disclosure can be implemented, or executed by, a general-purpose processor, DSP, ASIC, FPGA, programmable logic device, discrete gates, transistor logic, discrete hardware components, other devices designed to perform the functions described herein, or any combination thereof. A general-purpose processor may be a microprocessor, but alternatively, the processor may be any processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices such as DSPs and microprocessors, multiple microprocessors, one or more microprocessors combined with a DSP core, or any other configuration.

[0128] In firmware and / or software implementations, the technology can be implemented as instructions stored in a computer-readable medium such as random access memory (RAM), read-only memory (ROM), non-volatile random access memory (NVRAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable PROM (EEPROM), flash memory, optical disc (CD), or magnetic or optical data storage device. The instructions can be executed by one or more processors and can cause one or more processors to perform specific aspects of the functions described in this disclosure.

[0129] When implemented in software, the technology can be stored in or transmitted via a computer-readable medium as one or more instructions or code. A computer-readable medium includes both computer storage media and communication media by encompassing any medium that facilitates the transfer of a computer program from one place to another. The storage medium can be any available medium accessible to a computer. As a non-limiting example, such computer-readable media may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to transmit or store the required program code in the form of instructions or data structures and is accessible to a computer. Additionally, random access to the computer-readable medium may be suitably provided.

[0130] For example, if software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted-pair cable, digital subscriber line (DSL), or wireless technologies such as infrared, radio waves, and microwaves, these coaxial cables, fiber optic cables, twisted-pair cables, DSL, or wireless technologies such as infrared, radio waves, and microwaves can be included in the definition of media. As used herein, disks and optical discs include CDs, laser discs, optical discs, digital versatile optical discs (DVDs), floppy disks, and Blu-ray discs, wherein disks typically reproduce data magnetically, while optical discs reproduce data optically using lasers. Combinations of the above media should also be included within the scope of computer-readable media.

[0131] Software modules can be configured to reside in RAM, flash memory, ROM, EPROM, EEPROM, registers, hard disks, removable disks, CD-ROMs, or any other known form of storage medium. An exemplary storage medium can be coupled to a processor, allowing the processor to read information from or write information to the storage medium. The processor and storage medium can reside in an ASIC. The ASIC can reside in the user terminal. Alternatively, the processor and storage medium can reside as separate components in the user terminal.

[0132] Although the above embodiments have been described as using aspects of the subject matter disclosed herein on one or more independent computer systems, this disclosure is not limited thereto and can also be implemented in conjunction with any computing environment such as a network or distributed computing environment. Furthermore, aspects of the subject matter of this disclosure can be implemented using multiple processing chips or devices, and storage can similarly be implemented across multiple devices. These devices may include PCs, network servers, and portable devices.

[0133] Although this disclosure has been described above with respect to its embodiments, it is not limited thereto. Those skilled in the art will be able to make various modifications and variations thereto within the spirit of this disclosure and within the equivalents of the appended claims.

Claims

1. A battery drop simulation method, comprising: A three-dimensional model of the battery, including adhesive components, is generated by at least one processor; The at least one processor receives information associated with the three-dimensional model; The at least one processor estimates the adhesion coefficient of the adhesive component based on the information associated with the three-dimensional model; The at least one processor performs a drop simulation of the three-dimensional model based on the information associated with the three-dimensional model, the adhesion coefficient, and the drop condition information; as well as The drop simulation results are output by the at least one processor. The drop simulation results include information about whether the adhesive component separates due to the drop.

2. The battery drop simulation method according to claim 1, wherein: The three-dimensional model further includes a bag and an electrode core; and The information associated with the three-dimensional model includes information associated with the bag, information associated with the pole core, and information associated with the adhesive member.

3. The battery drop simulation method according to claim 1, wherein, The estimation of the adhesion coefficient of the adhesive component includes: The initial adhesion coefficient of the adhesive member is determined by the at least one processor; The simulation analysis of the preliminary adhesion coefficient is performed by the at least one processor; and The adhesion coefficient is determined by the at least one processor based on the simulation analysis.

4. The battery drop simulation method according to claim 3, wherein, The determination of the adhesion coefficient includes: if the result of the simulation analysis is less than a threshold, then the at least one processor determines the preliminary adhesion coefficient as the adhesion coefficient of the adhesive component.

5. The battery drop simulation method according to claim 3, wherein, The determination of the adhesion coefficient includes: if the result of the simulation analysis is greater than or equal to a threshold, then the at least one processor changes the initial adhesion coefficient.

6. The battery drop simulation method according to claim 1, wherein, The adhesion coefficient includes the normal failure stress coefficient and the shear failure stress coefficient.

7. The battery drop simulation method according to claim 1, wherein, The drop condition information includes drop height information, drop angle information, adhesive force information associated with the adhesive component, and shape information of the adhesive component.

8. The battery drop simulation method according to claim 7, wherein: The drop height information, the drop angle information, and the shape information of the adhesive component are fixed values; and The execution of the drop simulation of the three-dimensional model includes: the at least one processor evaluating whether the adhesive member separates according to changes in the adhesive force information associated with the adhesive member.

9. The battery drop simulation method according to claim 8, wherein: The adhesive force information associated with the adhesive member includes first adhesive force information associated with a first region of the adhesive member and second adhesive force information associated with a second region of the adhesive member; and The first adhesive force information and the second adhesive force information are different from each other.

10. The battery drop simulation method according to claim 7, wherein: The drop height information, the adhesive force information associated with the adhesive member, and the shape information of the adhesive member are fixed values; and The execution of the drop simulation of the three-dimensional model includes: the at least one processor evaluating whether the adhesive component separates according to the change in the drop angle information.

11. The battery drop simulation method according to claim 7, wherein: The drop height information, the drop angle information, and the adhesive force information associated with the adhesive member are fixed values; and The execution of the drop simulation of the three-dimensional model includes: the at least one processor evaluating whether the adhesive member separates according to the change in the shape information of the adhesive member.

12. The battery drop simulation method according to claim 2, wherein, The drop simulation results further include information about the shape of the bag after deformation due to the drop.

13. The battery drop simulation method according to claim 2, wherein, The drop simulation results further include stress information for each region of the bag due to the drop.

14. A non-transitory computer-readable recording medium storing instructions for executing the battery drop simulation method according to any one of claims 1 to 13 on a computer.

15. A battery drop simulation device, comprising: Communication module; Memory; as well as At least one processor is connected to the memory and configured to execute instructions stored in the memory to cause the at least one processor to: A three-dimensional model of the battery, including the adhesive components; Receive information associated with the three-dimensional model; Based on the information associated with the three-dimensional model, the adhesion coefficient of the adhesive component is estimated; Based on the information associated with the three-dimensional model, the adhesion coefficient, and the drop condition information, a drop simulation of the three-dimensional model is performed; as well as Output the drop simulation results. The drop simulation results include information about whether the adhesive component separates due to the drop.

16. The battery drop simulation device according to claim 15, wherein: The three-dimensional model further includes a bag and an electrode core; and The information associated with the three-dimensional model includes information associated with the bag, information associated with the pole core, and information associated with the adhesive member.

17. The battery drop simulation device according to claim 15, wherein, In order to estimate the adhesion coefficient of the adhesive component, the instruction causes the at least one processor to: Determine the preliminary adhesion coefficient of the adhesive component; Perform a simulation analysis of the preliminary adhesion coefficient; and Based on the simulation analysis, the adhesion coefficient is determined.

18. The battery drop simulation device according to claim 15, wherein, The drop condition information includes drop height information, drop angle information, adhesive force information associated with the adhesive component, and shape information of the adhesive component.

19. The battery drop simulation device according to claim 18, wherein, In order to perform the drop simulation of the three-dimensional model, the instructions cause the at least one processor to evaluate whether the adhesive component separates according to the change of the drop condition information.

20. The battery drop simulation device according to claim 16, wherein, The drop simulation results further include information about the shape of the bag after deformation due to the drop.

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