Chuck, wafer robot and wafer suction station

Abstract

The application discloses a chuck, a wafer mechanical arm and a wafer adsorption station, and relates to the technical field of semiconductor equipment. The chuck comprises a fixed disc, a movable disc and a cover body. A through groove is arranged in the fixed disc. Limiting bosses and first connecting holes are arranged on the through groove in the axial direction of the through groove. Trigger bosses and second connecting holes are arranged on the movable disc in an interval. The movable disc is slidingly arranged in the through groove. The cover body covers the fixed disc. When the movable disc is in abutment with the limiting bosses, the trigger bosses are exposed outside the fixed disc to contact the wafer. After the wafer contacts the trigger bosses, the movable disc is driven to slide relative to the fixed disc until the movable disc is in abutment with the cover body. The first connecting holes and the second connecting holes are aligned to enable the vacuum equipment to be in communication with the through groove. The vacuum equipment can adsorb and fix the wafer through the chuck. The chuck can be connected with the vacuum air path only after the wafer contacts the trigger bosses, so that the problem of wafer displacement and wafer falling during wafer transmission can be effectively avoided.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a suction cup, a wafer robotic arm, and a wafer adsorption station. Background Technology

[0002] In semiconductor wafer manufacturing, wafer robots are widely used for wafer transport. They use a wafer robotic arm (also known as an end effector) to grasp the wafer. Common types include vacuum suction type, clamping type, support type, and suction support type. Among them, the suction support type arm supports the back of the wafer on its upper surface when transporting the wafer, and at the same time, the wafer is held in place by a vacuum suction cup set on the upper surface of the arm; the arm is equipped with a vacuum passage to connect the air extraction port to the vacuum suction cup.

[0003] Adsorption-support type arms typically work in conjunction with vacuum adsorption type stations to complete wafer transfer. To ensure smooth wafer transfer, it's usually necessary to pre-close the vacuum of the transfer unit currently holding the wafer and energize the vacuum of the transfer unit receiving the wafer. This can easily lead to wafer displacement during transfer, potentially causing wafer drop accidents. The specific reasons are as follows: When the arm picks up the wafer from the adsorption station, the vacuum at the adsorption station is closed first. The arm energizes the vacuum in advance as it approaches the wafer. When the vacuum chuck on the arm approaches the back of the wafer to a certain distance, the vacuum begins to act on the wafer. However, at this point, the wafer at the adsorption station is not fixed, and the back of the wafer is not in contact with the vacuum chuck on the arm, making unpredictable wafer displacement likely. Conversely, when the arm places the wafer onto the adsorption station, the vacuum is pre-closed during the arm's movement, while the vacuum at the adsorption station is activated. Mechanical vibrations and vacuum disturbances as the back of the wafer approaches the vacuum chuck on the adsorption station can also cause wafer displacement. Summary of the Invention

[0004] The purpose of this application is to provide a suction cup, a wafer robotic arm, and a wafer adsorption station, in which the vacuum path can only be connected after the wafer comes into contact with the trigger boss, which can effectively avoid wafer displacement and wafer drop during the wafer transfer process, thereby significantly improving the stability and reliability of the wafer transfer process.

[0005] The embodiments of this application are implemented as follows:

[0006] A first aspect of this application provides a suction cup, including a fixed plate, a movable plate, and a cover. The fixed plate has a through groove. Along the axial direction of the through groove, the through groove has spaced-apart limiting bosses and first connecting holes for communicating with a vacuum device. The movable plate has spaced-apart trigger bosses and second connecting holes for communicating with the through groove. The movable plate is slidably disposed within the through groove, and the cover is closed onto the fixed plate. When the movable plate abuts against the limiting bosses, the trigger bosses protrude from the fixed plate to contact the wafer. After the wafer contacts the trigger bosses, the movable plate is driven to slide relative to the fixed plate until it abuts against the cover. The first connecting holes and the second connecting holes are aligned so that the vacuum device communicates with the through groove, and the vacuum device can adsorb and fix the wafer through the suction cup. This suction cup can only conduct the vacuum path after the wafer contacts the trigger bosses, which can effectively avoid wafer displacement and wafer drop during wafer transfer, thereby significantly improving the stability and reliability of the wafer transfer process.

[0007] As one possible implementation, it also includes an elastic element, the two ends of which are connected to the movable disk and the cover respectively. When the movable disk abuts against the cover, the elastic element is compressed and stores energy, and the elastic element is used to provide a restoring force for the movable disk.

[0008] As one possible implementation, the movable disc is provided with a receiving groove on the side near the cover, and one end of the elastic member is fixedly connected to the bottom of the receiving groove.

[0009] In one possible implementation, a guide post is provided on the side of the cover near the movable disc, and the other end of the elastic element is sleeved on the guide post. The height of the guide post is less than or equal to the depth of the receiving groove.

[0010] In one possible implementation, the movable disc includes a disc body and a trigger boss and an abutment ring disposed on the side of the disc body away from the cover body. The trigger boss and the abutment ring are coaxial and spaced apart. The second connecting hole is located on the abutment ring. The abutment ring is used to abut against the limiting boss, and the disc body is used to abut against the cover body.

[0011] In one possible implementation, an annular groove is provided on the side wall of the abutment ring, and the second connecting hole is opened at the bottom of the annular groove. The first connecting hole and the second connecting hole are aligned and connected through the annular groove, and the diameter of the annular groove is larger than the diameter of the first connecting hole and the diameter of the second connecting hole.

[0012] As one possible implementation, along the radial direction of the through groove, there are multiple first connecting holes and multiple second connecting holes, with each of the multiple first connecting holes and multiple second connecting holes corresponding one-to-one.

[0013] As one possible implementation, along the radial direction of the through groove, the fixed disk extends outward with a flange on the side away from the cover, the flange being used for fixed connection with the arm body of the wafer robotic arm or the station body of the wafer adsorption station.

[0014] A second aspect of this application provides a wafer robotic arm, including an arm body and the aforementioned suction cup. The arm body has a first air channel, a first suction port, and a fixing hole. The suction cup is fixed to the arm body via the fixing plate. The first connecting hole communicates with a vacuum device through the first air channel and the first suction port. The fixing hole is used for connection with a wafer robot. This suction cup only opens the vacuum path after the wafer contacts the trigger boss, effectively preventing wafer displacement and chipping during wafer transfer, thereby significantly improving the stability and reliability of the wafer transfer process.

[0015] A third aspect of this application provides a wafer adsorption station, including a station body and the aforementioned suction cup. The station body has a second air channel and a second suction port. The suction cup is fixed to the station body by a fixing plate. The first connecting hole communicates with the vacuum equipment through the second air channel and the second suction port. This suction cup only opens the vacuum path after the wafer contacts the trigger boss, effectively preventing wafer displacement and chipping during wafer transfer, thereby significantly improving the stability and reliability of the wafer transfer process.

[0016] The beneficial effects of the embodiments of this application include:

[0017] The suction cup includes a fixed plate, a movable plate, and a cover. The fixed plate has a through groove. Along the axial direction of the through groove, there are spaced-out limiting bosses and first connecting holes for communicating with a vacuum device. The movable plate has spaced-out triggering bosses and second connecting holes for communicating with the through groove. The movable plate is slidably disposed in the through groove, and the cover is closed to the fixed plate. When the movable plate abuts against the limiting bosses, the triggering bosses protrude from the fixed plate to contact the wafer. After the wafer contacts the triggering bosses, the movable plate is driven to slide relative to the fixed plate until the movable plate abuts against the cover, and the first and second connecting holes are aligned so that the vacuum device communicates with the through groove. The vacuum device can then adsorb and fix the wafer through the suction cup. The suction cup provided in this application only opens the gas channel when the wafer fully contacts the trigger boss and pushes the movable disk into place. At this time, the wafer has naturally settled in place, and the adsorption force provided by the vacuum equipment can be evenly applied to the back of the wafer. This can effectively avoid wafer displacement and wafer drop during the wafer transfer process, thereby significantly improving the stability and reliability of the wafer transfer process. It features a simple structure, high reliability, and strong compatibility. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is one of the structural schematic diagrams of the suction cup provided in the embodiments of this application;

[0020] Figure 2 This is a second schematic diagram of the suction cup structure provided in the embodiments of this application;

[0021] Figure 3 This is a schematic diagram of the structure of the fixed disk provided in an embodiment of this application;

[0022] Figure 4 This is a schematic diagram of the structure of the active disk provided in an embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the structure of the cover provided in an embodiment of this application;

[0024] Figure 6 This is one of the structural schematic diagrams of the wafer robotic arm provided in the embodiments of this application;

[0025] Figure 7 This is the second schematic diagram of the structure of the wafer robotic arm provided in the embodiments of this application;

[0026] Figure 8This is one of the structural schematic diagrams of the wafer adsorption station provided in the embodiments of this application;

[0027] Figure 9 This is the second schematic diagram of the wafer adsorption station provided in the embodiments of this application.

[0028] Icons: 100-Suction cup; 110-Fixing plate; 110a-Positioning boss; 110b-First connecting hole; 110c-Limiting boss; 110d-Through groove; 110e-Flanged edge; 120-Moving plate; 121-Plate body; 122-Abutting ring; 120a-Annular groove; 120b-Second connecting hole; 120c-Triggering boss; 120d-Receiving groove; 130-Elastic element; 140-Cover body; 140a-Guide post; 1000-Wafer robotic arm; 200-Arm body; 210-First air passage; 220-First suction port; 230-Fixing hole; 2000-Wafer adsorption station; 300-Station body; 310-Second air passage; 320-Second suction port; 3000-Wafer. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. Similar reference numerals and letters in the following drawings indicate similar items. Once an item is defined in one drawing, it does not need to be further defined in other drawings.

[0030] The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and should not be construed as limiting this application. The terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to connections within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] Please refer to the reference. Figures 1 to 5This application provides a suction cup 100, including a fixed plate 110, a movable plate 120, and a cover 140. The fixed plate 110 has a through groove 110d. Along the axial direction of the through groove 110d, a limiting boss 110c and a first connecting hole 110b for communicating with a vacuum device are provided at intervals on the through groove 110d. The movable plate 120 has a trigger boss 120c and a second connecting hole 120b for communicating with the through groove 110d. The movable plate 120 is slidably disposed within the through groove 110d. The body 140 covers the fixed disk 110. When the movable disk 120 abuts against the limiting boss 110c, the trigger boss 120c protrudes from the fixed disk 110 to contact the wafer 3000. After the wafer 3000 contacts the trigger boss 120c, the movable disk 120 is driven to slide relative to the fixed disk 110 until the movable disk 120 abuts against the cover 140. The first connecting hole 110b and the second connecting hole 120b are aligned so that the vacuum equipment is connected to the through groove 110d. The vacuum equipment can use the suction cup 100 to hold and fix the wafer 3000. The suction cup 100 can only conduct the vacuum path after the wafer 3000 contacts the trigger boss 120c, which can effectively avoid the problem of wafer 3000 displacement and dropping during the wafer transfer process, thereby significantly improving the stability and reliability of the wafer 3000 transfer process.

[0033] It should be noted that the suction cup 100 includes a fixed plate 110, a movable plate 120, and a cover 140. The fixed plate 110 has a through groove 110d (such as a cylindrical cavity) that serves as a sliding track for the movable plate 120. The movable plate 120 is slidably disposed within the fixed plate 110, and the two can be fitted with a clearance to ensure smooth sliding of the movable plate 120. The cover 140 covers the side of the fixed plate 110 away from the suction surface of the suction cup 100, thus distancing the through groove 110d away from the suction cup 100. One side of the suction surface of the suction cup 100 is closed, and the cover 140 serves as a limiting structure when the movable disk 120 moves toward the side away from the suction surface of the suction cup 100, so as to ensure that when the movable disk 120 and the cover 140 abut against each other, the first connecting hole 110b on the fixed disk 110 and the second connecting hole 120b on the movable disk 120 are aligned. The cover 140 and the fixed disk 110 can be connected by threads, and a sealing ring can be provided at the connection between the cover 140 and the fixed disk 110 to ensure that no vacuum leakage occurs at the connection between the two.

[0034] Along the axial direction of the through groove 110d, a limiting boss 110c and a first connecting hole 110b are provided at intervals on the through groove 110d. The limiting boss 110c is a protrusion (such as an annular protrusion or multiple arc-shaped protrusions) provided on the inner wall of the through groove 110d. The limiting boss 110c is located on the side of the through groove 110d near the adsorption surface of the suction cup 100, and is used to limit the initial position of the movable disk 120 when it is not in contact with the wafer 3000, while ensuring that the trigger boss 120c can expose the fixed disk 1 when the movable disk 120 is in the initial position. 10. The first connecting hole 110b is a radial through hole set on the inner wall of the through groove 110d. The first connecting hole 110b is located on the side of the through groove 110d away from the adsorption surface of the suction cup 100, and is used to communicate with the vacuum equipment. The position of the first connecting hole 110b should be precisely aligned with the position of the second connecting hole 120b of the movable disk 120 when the movable disk 120 abuts against the cover 140, so that the first connecting hole 110b and the second connecting hole 120b are connected to form a gas channel for conducting the vacuum equipment and the wafer 3000.

[0035] Along the axial direction of the through groove 110d, the movable disk 120 is provided with trigger bosses 120c and second connecting holes 120b at intervals. The trigger bosses 120c are protrusions (such as cylindrical bosses or frustoconical bosses) provided on the movable disk 120. The trigger bosses 120c are located on the side of the movable disk 120 near the adsorption surface of the chuck 100. The trigger bosses 120c are used to directly contact the back side of the wafer 3000. When the wafer 3000 is placed on the chuck 100, the gravity of the wafer 3000 can push the trigger bosses 120c to slide relative to the fixed disk 110, thereby driving the movable disk 120 to slide along the through groove 110d. The second connecting hole 120b is a radial through hole provided on the movable disk 120. When the movable disk 120 is in the initial position, the first connecting hole... When 110b and the second connecting hole 120b are misaligned, the gas channel is blocked. The early opening of the vacuum equipment will not affect the position of the wafer 3000. When the wafer 3000 contacts the trigger boss 120c, the weight of the wafer 3000 can push the trigger boss 120c to slide relative to the fixed disk 110, so as to drive the movable disk 120 to slide along the through groove 110d. The first connecting hole 110b and the second connecting hole 120b gradually approach each other until the movable disk 120 abuts against the cover 140. At this time, the movable disk 120 stops sliding. The wafer 3000 is in contact with the adsorption surface of the suction cup 100, and the first connecting hole 110b and the second connecting hole 120b are aligned. The gas channel is open, and the vacuum equipment can adsorb the wafer 3000.

[0036] In actual use, the movable disk 120, under the action of the reset force (such as the elastic force provided by the elastic element 130), abuts against the limiting boss 110c, and the trigger boss 120c exposes the adsorption surface of the fixed disk 110 (i.e., the adsorption surface of the suction cup 100). The second connecting hole 120b is completely misaligned with the first connecting hole 110b. At this time, the gas channel is blocked, the vacuum equipment is in standby state, and there is no adsorption force output. When the wafer 3000 is placed on the suction cup 100, the wafer 3000 first contacts the trigger boss 120c. The gravity of the wafer 3000 (or the placement force applied by the handling device) overcomes the reset force of the movable disk 120, pushing the trigger boss 120c to drive the movable disk 120 to slide along the through groove 110d toward the cover 140. During this process, the second connecting hole 120b gradually moves closer to the first connecting hole 110b, but is not completely aligned. The gas channel is still in a semi-blocked state, and the negative pressure of the vacuum equipment is maintained. The current pressure is insufficient to hold the wafer 3000. When the wafer 3000 is fully positioned (i.e., in contact with the adsorption surface of the suction cup 100), the movable disk 120 slides to abut against the cover 140. At this time, the second connecting hole 120b and the first connecting hole 110b are precisely aligned, the gas channel is fully open, and the negative pressure of the vacuum equipment is transmitted to the wafer 3000 through the first connecting hole 110b, the second connecting hole 120b, and the through groove 110d, instantly generating an adsorption force to firmly fix the wafer 3000. After the wafer 3000 is transferred, the vacuum equipment stops working, the pressure of the gas channel returns to atmospheric pressure, and the movable disk 120 slides in the opposite direction along the through groove 110d under the action of the reset force, so that the movable disk 120 is removed from the cover 140 and abuts against the limiting boss 110c again, triggering the boss 120c to expose the adsorption surface of the suction cup 100 again, waiting for the next wafer 3000 transfer, thus completing one wafer 3000 transfer action.

[0037] Traditional suction cups require the vacuum path to be opened in advance. When the wafer 3000 is not fully aligned, localized adsorption force or mechanical vibration can cause the wafer 3000 to shift or fall off. However, the suction cup 100 provided in this application only opens the gas channel after the wafer 3000 fully contacts the trigger boss 120c and pushes the movable disk 120 into place. At this time, the wafer 3000 has naturally settled into position, and the adsorption force provided by the vacuum equipment can be evenly applied to the back of the wafer 3000. This can effectively avoid the problem of wafer 3000 shifting or falling off during the wafer transfer process, thereby significantly improving the stability and reliability of the wafer 3000 transfer process. It has the characteristics of simple structure, high reliability, and strong compatibility.

[0038] As one possible implementation method, such as Figure 1 and Figure 2As shown, the suction cup 100 also includes an elastic element 130. The two ends of the elastic element 130 are connected to the movable disk 120 and the cover 140 respectively. When the movable disk 120 abuts against the cover 140, the elastic element 130 is compressed and stores energy. The elastic element 130 is used to provide a restoring force for the movable disk 120.

[0039] It should be noted that the suction cup 100 also includes an elastic element 130 (such as a compression spring). Both ends of the elastic element 130 are connected to the movable disk 120 and the cover 140, respectively. When the movable disk 120 abuts against the limiting boss 110c, the elastic element 130 can be in a pre-compressed state, so that the elastic force provided by the elastic element 130 pushes the movable disk 120 to reliably abut against the limiting boss 110c, triggering the boss 120c to stably protrude from the fixed disk 110. The second connecting hole 120b and the first connecting hole 110b... The reliably staggered arrangement ensures reliable blockage of the gas passage, and even under mechanical vibration, the preload of the elastic element 130 ensures that the movable disk 120 will not wobble, thereby improving the stability of the movable disk 120 in its initial position. When the wafer 3000 is placed on the chuck 100, the weight of the wafer 3000 (or the placement force applied by the handling device) overcomes the elastic force of the elastic element 130, pushing the trigger boss 120c to drive the movable disk 120 to slide towards the cover 140. The elastic element 130 moves with the movable disk 120. As the disk 120 slides and gradually compresses, its elasticity increases. During this process, the elastic force of the elastic element 130 acts as a "reverse resistance," ensuring that the movable disk 120 will only slide into place when the wafer 3000 is fully in position and sufficient pressure is applied, thus avoiding accidental triggering caused by slight contact. When the movable disk 120 abuts against the cover 140, the elastic element 130 reaches its maximum compression, and the energy storage state remains stable. At this time, the first connecting hole 110b and the second connecting hole 120b are precisely aligned, the gas channel is opened, and the wafer... The wafer 3000 is firmly adsorbed, and the compressive force of the elastic element 130 does not affect the stability of the adsorption (i.e., the adsorption force is much greater than the elastic force of the elastic element 130). After the wafer 3000 is transferred, the vacuum equipment stops working, the pressure on the movable disk 120 disappears, the elastic element 130 releases the stored energy, and pushes the movable disk 120 to slide in the opposite direction along the through groove 110d, detach from the cover 140 and re-hold the limiting boss 110c, triggering the boss 120c to be exposed again, thus completing one wafer 3000 transfer action.

[0040] As one possible implementation method, such as Figure 1 and Figure 2 , Figure 4 As shown, the movable disc 120 is provided with a receiving groove 120d on the side near the cover 140, and one end of the elastic member 130 is fixedly connected to the bottom of the receiving groove 120d.

[0041] It should be noted that a receiving groove 120d is provided on the side of the movable disk 120 near the cover 140. The receiving groove 120d can be a cylindrical groove opened on the end face of the movable disk 120 near the cover 140. The diameter of the receiving groove 120d is slightly larger than the diameter of the elastic member 130, so as to limit the radial displacement of the elastic member 130 through the receiving groove 120d. The depth of the receiving groove 120d needs to ensure that the elastic member 130 can be embedded in the receiving groove 120d, so as to provide axial positioning and guiding function for the elastic member 130 through the receiving groove 120d. One end of the elastic member 130 is fixedly connected to the bottom of the receiving groove 120d so that the elastic member 130 is reliably connected to the movable disk 120.

[0042] As one possible implementation method, such as Figure 1 and Figure 2 , Figure 5 As shown, a guide post 140a is provided on the side of the cover 140 near the movable plate 120, and the other end of the elastic member 130 is sleeved on the guide post 140a. The height of the guide post 140a is less than or equal to the depth of the receiving groove 120d.

[0043] It should be noted that a guide post 140a is provided on the side of the cover 140 near the movable disk 120. The guide post 140a can be a cylindrical protrusion protruding from the end face of the cover 140 near the movable disk 120. The diameter of the guide post 140a is slightly smaller than the diameter of the elastic element 130 to ensure that the elastic element 130 can be smoothly fitted onto the guide post 140a, and the radial displacement of the elastic element 130 can be limited by the guide post 140a. The height of the guide post 140a is less than or equal to the depth of the receiving groove 120d to ensure that when the movable disk 120 abuts against the cover 140, the guide post 140a will not have a rigid collision with the bottom of the receiving groove 120d. The receiving groove 120d and the guide post 140a work together to provide dual positioning for the deformation of the elastic element 130, ensuring that the extension and contraction of the elastic element 130 always proceeds along the axial direction of the guide post 140a, thereby providing installation positioning and movement guidance for the elastic element 130.

[0044] As one possible implementation method, such as Figure 1 and Figure 2 , Figure 4 As shown, the movable disc 120 includes a disc body 121 and a trigger boss 120c and an abutment ring 122 disposed on the side of the disc body 121 away from the cover 140. The trigger boss 120c and the abutment ring 122 are coaxial and spaced apart. The second connecting hole 120b is located on the abutment ring 122. The abutment ring 122 is used to abut against the limiting boss 110c, and the disc body 121 is used to abut against the cover 140.

[0045] It should be noted that the movable disk 120 includes a disk body 121, a trigger boss 120c, and an abutment ring 122. A receiving groove 120d is provided on the side of the disk body 121 closest to the cover 140, and the trigger boss 120c and abutment ring 122 are provided on the side of the disk body 121 furthest from the cover 140. Furthermore, the trigger boss 120c and abutment ring 122 are coaxial and spaced apart. The trigger boss 120c is located in the central region of the disk body 121, and the abutment ring 122 is located in the edge region of the disk body 121, ensuring that the wafer 3000 makes corresponding contact with the trigger boss 120c and that the abutment ring 122 abuts against the limiting boss 110c. The vacuum equipment provides negative pressure that can be transmitted to the wafer 3000 through the first connecting hole 110b, the second connecting hole 120b, the annular space between the trigger boss 120c and the abutment ring 122, and the through groove 110d, instantly generating an adsorption force to firmly fix the wafer 3000. The second connecting hole 120b is located on the side wall of the abutment ring 122. The top surface of the abutment ring 122 away from the cover 140 is used to abut against the bottom surface of the limiting boss 110c near the cover 140, and the bottom surface of the disk 121 near the cover 140 is used to abut against the top surface of the cover 140 near the movable disk 120, so as to meet the needs of precise transmission of the wafer 3000.

[0046] As one possible implementation method, such as Figure 1 and Figure 2 , Figure 4 As shown, an annular groove 120a is provided on the side wall of the abutment ring 122, and a second connecting hole 120b is opened at the bottom of the annular groove 120a. The first connecting hole 110b and the second connecting hole 120b are aligned and connected through the annular groove 120a. The diameter of the annular groove 120a is larger than the diameter of the first connecting hole 110b and the diameter of the second connecting hole 120b.

[0047] It should be noted that an annular groove 120a is provided on the side wall of the abutment ring 122. The annular groove 120a is a full-circle groove opened on the outer wall of the abutment ring 122. Its cross-sectional shape can be U-shaped or rectangular. The second connecting hole 120b is opened at the bottom of the annular groove 120a. In this way, the second connecting hole 120b and the first connecting hole 110b of the fixed plate 110 do not need to be strictly aligned point-to-point. As long as the first connecting hole 110b falls within the radial range of the annular groove 120a, indirect communication can be achieved through the annular groove 120a, thereby greatly reducing the processing and assembly accuracy requirements. The annular groove 120a serves as an intermediate confluence cavity, which can evenly distribute airflow to each of the second connection holes 120b. Even if the alignment of a certain second connection hole 120b with the first connection hole 110b is slightly off, it can be compensated for by the redistribution of airflow through the annular groove 120a, ensuring that the adsorption force of each area of ​​the wafer 3000 is uniform, avoiding wafer 3000 shifting, chip falling off, and warping of the thin wafer 3000 due to uneven force.

[0048] As one possible implementation method, such as Figures 1 to 4 As shown, along the radial direction of the through groove 110d, there are multiple first connecting holes 110b and multiple second connecting holes 120b, with each of the multiple first connecting holes 110b and multiple second connecting holes 120b corresponding one-to-one. For example, the number of first connecting holes 110b and second connecting holes 120b is equal, ranging from 3 to 10, and they are arranged at equal angular intervals along the circumference of the through groove 110d (e.g., 4 holes at 90° intervals) to ensure symmetrical radial force.

[0049] As one possible implementation method, such as Figures 1 to 3 As shown, along the radial direction of the through groove 110d, the fixed disk 110 extends outward from the side away from the cover 140 with a flange 110e, which is used to fix and connect with the arm body 200 of the wafer robotic arm 1000 or the station body 300 of the wafer adsorption station 2000.

[0050] It should be noted that, along the radial direction of the through groove 110d, a flange 110e extends outward from the side of the fixed disk 110 away from the cover 140 (i.e., the side away from the through groove 110d). The top surface of the flange 110e away from the cover 140, the top surface of the fixed disk 110 away from the cover 140, and the top surface of the limiting boss 110c away from the cover 140 can be flush to jointly form the adsorption surface of the suction cup 100, thereby increasing the area of ​​the adsorption surface of the suction cup 100. At the same time, the flange 110e can also serve as the adsorption surface of the suction cup 100 for connection with external devices (such as the arm body 200 of the wafer robotic arm 1000 or the wafer adsorption station 200). The fixing part of the station body 300 is fixedly connected. For example, the bottom surface of the flange 110e near the cover 140 can be fixed to the mounting cavity of the external device by adhesive or fasteners. In order to improve the accuracy of the suction cup 100 during installation, a positioning boss 110a can also be provided on the outer wall of the fixing plate 110. For example, the positioning boss 110a is located between the flange 110e and the first connecting hole 110b. It can play a reliable positioning role and avoid interference with the connection between the flange 110e and the mounting cavity, the connection between the first connecting hole 110b and the air passage of the external device and the connection between the second connecting hole 120b.

[0051] Please refer to the reference again. Figure 6 and Figure 7In a second aspect of this application, a wafer robotic arm 1000 is provided, including an arm body 200 and the aforementioned suction cup 100. The arm body 200 has a first air channel 210, a first suction port 220, and a fixing hole 230. The suction cup 100 is fixed to the arm body 200 by a fixing plate 110. The first connecting hole 110b communicates with a vacuum device through the first air channel 210 and the first suction port 220. The fixing hole 230 is used to connect with a wafer 3000 robot. In this way, the negative pressure provided by the vacuum device can be transmitted to the wafer 3000 through the first suction port 220, the first air channel 210, the first connecting hole 110b, the second connecting hole 120b, the annular space between the trigger boss 120c and the abutment ring 122, and the through groove 110d, thereby instantly generating an adsorption force to firmly fix the wafer 3000. The suction cup 100 can only conduct the vacuum path after the wafer 3000 contacts the trigger boss 120c, which can effectively avoid the problem of wafer 3000 displacement and wafer drop during the wafer transfer process, thereby significantly improving the stability and reliability of the wafer 3000 transfer process.

[0052] Please refer to the reference again. Figure 8 and Figure 9 In a third aspect of this application, a wafer adsorption station 2000 is provided, including a station body 300 and the aforementioned suction cup 100. The station body 300 has a second air channel 310 and a second suction hole 320. The suction cup 100 is fixed to the station body 300 by a fixing plate 110. The first connecting hole 110b is connected to a vacuum device through the second air channel 310 and the second suction hole 320. In this way, the negative pressure provided by the vacuum device can be transmitted to the wafer 3000 through the second suction hole 320, the second air channel 310, the first connecting hole 110b, the second connecting hole 120b, the annular space between the trigger boss 120c and the abutment ring 122, and the through groove 110d, thereby instantly generating an adsorption force to firmly fix the wafer 3000. The suction cup 100 can only conduct the vacuum path after the wafer 3000 contacts the trigger boss 120c, which can effectively avoid the problem of wafer 3000 displacement and wafer drop during the wafer transfer process, thereby significantly improving the stability and reliability of the wafer 3000 transfer process.

[0053] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0054] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A suction cup, characterized in that The chuck comprises a fixed disc, a movable disc and a cover, the fixed disc is provided with a through groove, a limiting boss and a first connecting hole for communicating with a vacuum device are arranged on the through groove in the axial direction of the through groove, the movable disc is provided with a trigger boss and a second connecting hole for communicating with the through groove, the movable disc is slidingly arranged in the through groove, and the cover covers the fixed disc; when the movable disc abuts against the limiting boss, the trigger boss is exposed outside the fixed disc to contact a wafer, after the wafer contacts the trigger boss, the movable disc is driven to slide relative to the fixed disc until the movable disc abuts against the cover, the first connecting hole and the second connecting hole are aligned to enable the vacuum device to communicate with the through groove, and the vacuum device can adsorb and fix the wafer through the chuck. The movable disc comprises a disc body, the trigger boss and an abutting ring arranged on the side of the disc body away from the cover, the trigger boss and the abutting ring are coaxial and arranged at intervals, the second connecting hole is located on the abutting ring, the abutting ring is used for abutting against the limiting boss, and the disc body is used for abutting against the cover.

2. The suction cup of claim 1, wherein, Further comprising an elastic member, two ends of the elastic member are connected with the movable disc and the cover respectively, when the movable disc abuts against the cover, the elastic member is compressed to store energy, and the elastic member is used for providing a restoring force for the movable disc.

3. The suction cup of claim 2, wherein, The side of the movable disc close to the cover is provided with a containing groove, and one end of the elastic member is fixedly connected with the groove bottom of the containing groove.

4. The suction cup of claim 3, wherein, The side of the cover close to the movable disc is provided with a guide column, the other end of the elastic member is sleeved on the guide column, and the height of the guide column is less than or equal to the depth of the containing groove.

5. The suction cup of claim 1, wherein, An annular groove is arranged on the side wall of the abutting ring, the second connecting hole is arranged on the groove bottom of the annular groove, the first connecting hole and the second connecting hole are aligned and communicated through the annular groove, and the aperture of the annular groove is greater than the apertures of the first connecting hole and the second connecting hole.

6. The suction cup of claim 1, wherein, In the radial direction of the through groove, the number of the first connecting holes is multiple, and the number of the second connecting holes is multiple, and the multiple first connecting holes and the multiple second connecting holes are one-to-one corresponding.

7. The suction cup of claim 1, wherein, In the radial direction of the through groove, the side of the fixed disc away from the cover extends outwardly with a flange, and the flange is used for fixedly connecting with an arm body of a wafer robot or a work station body of a wafer adsorption work station.

8. A wafer robot, characterized by The chuck comprises a fixed disc, a movable disc and a cover, the fixed disc is provided with a through groove, a limiting boss and a first connecting hole for communicating with a vacuum device are arranged on the through groove in the axial direction of the through groove, the movable disc is provided with a trigger boss and a second connecting hole for communicating with the through groove, the movable disc is slidingly arranged in the through groove, and the cover covers the fixed disc; when the movable disc abuts against the limiting boss, the trigger boss is exposed outside the fixed disc to contact a wafer, after the wafer contacts the trigger boss, the movable disc is driven to slide relative to the fixed disc until the movable disc abuts against the cover, the first connecting hole and the second connecting hole are aligned to enable the vacuum device to communicate with the through groove, and the vacuum device can adsorb and fix the wafer through the chuck.

9. A wafer chucking station, characterized by, The work station body is provided with a second air passage and a second air suction hole, and the first connecting hole is communicated with the vacuum equipment through the second air passage and the second air suction hole.

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