Self-closed-loop microsystem air cooling heat dissipation structure based on micropump

Abstract

The invention discloses a self-closed-loop microsystem air cooling heat dissipation structure based on a micropump. The self-closed-loop microsystem air cooling heat dissipation structure comprises a microchannel radiator, the micropump, a fan combination, a temperature measurement optical fiber, a control module, cooling liquid and the like. According to the invention, a heat dissipation mode of combining liquid cooling internal circulation with air cooling external circulation is adopted, the air cooling heat dissipation problem of the high-heat-flux power chip is converted into a conventional air cooling heat dissipation problem, and the air cooling heat dissipation problem of the high-heat-flux power chip in the current engineering is solved; liquid cooling internal circulation is physically isolated from the external environment, so that the risk that impurities block a flow channel in secondary heat exchange equipment is avoided, and the reliability of the equipment is improved; the micro-channel radiator adopts a three-dimensional flow channel, the size is greatly reduced, and the tree-shaped distribution network and the micro-channel heat sink are combined, so that the heat exchange capacity is improved; and a self-adaptive temperature control measure based on temperature feedback is adopted, so that the power chip works in a proper temperature range, the performance and reliability of equipment are improved, and the service life of the equipment is prolonged.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electronic device structure, and particularly relates to a self-closed loop microsystem air cooling heat dissipation structure based on a micro pump. BACKGROUND

[0002] The self-closed loop microsystem is matched with a helicopter, and requires that the device is designed to be small in size and light in weight; the self-closed loop microsystem is an electronic countermeasure device, the power chip has a high heat flux density of about 80 W / cm 2 , and needs to work continuously; the system does not provide a liquid cooling device, and needs to adopt an air cooling mode for heat dissipation, and the refrigerant air is the cabin internal environment air.

[0003] The heat dissipation capacity of a conventional forced air cooling heat dissipation is about 20 W / cm 2 , the heat flux density of the power chip of the self-closed loop microsystem is much higher than 20 W / cm 2 , and the conventional design method cannot be used for heat dissipation design. At present, the main form of heat dissipation of an airborne high heat flux density power chip is liquid cooling heat dissipation, a secondary heat exchange device is a liquid cooling source, or the helicopter fuel is directly used; an internal flow channel adopts a small channel or a micro channel structure.

[0004] The conventional liquid cooling mode can solve the problem of heat dissipation of the high heat flux density power chip, but increases the weight of the helicopter device, or involves the change of the helicopter oil route arrangement, seriously affects the safety of the helicopter, and greatly reduces the device adaptability; and does not meet the requirements of the device. The effect of the conventional air cooling heat dissipation directly depends on the environment temperature, and the device temperature changes with the environment temperature; the power chip has the highest efficiency in a certain temperature range, and the temperature that is too high or too low will reduce the device power.

[0005] Therefore, an efficient controllable temperature air cooling heat dissipation structure needs to be designed to solve the problem of air cooling heat dissipation of the airborne high heat flux density power chip. SUMMARY

[0006] The application aims to solve the problem of air cooling heat dissipation of the airborne high heat flux density power chip, and provides a self-closed loop microsystem air cooling heat dissipation structure based on a micro pump.

[0007] The application provides a self-closed loop microsystem air cooling heat dissipation structure based on a micro pump. The application converts the problem of air cooling heat dissipation of the high heat flux density power chip into a conventional air cooling heat dissipation problem through the heat dissipation form of "liquid cooling internal circulation + air cooling external circulation", solves the problem of air cooling heat dissipation of the high heat flux density power chip in the current engineering, the internal circulation is physically isolated from the external environment, and the device reliability is improved; the self-adaptive temperature control measure based on temperature feedback is adopted, the power chip works in the appropriate temperature range, and the device performance, reliability and service life are improved.

[0008] The present application comprises a micro-channel radiator, a micro-pump, a fan combination, a temperature measuring fiber, a control module and a cooling liquid. The cooling liquid flows through the internal flow channel of the micro-channel radiator under the action of the micro-pump, conducts the waste heat generated by the power chip to the external heat dissipation teeth of the micro-channel radiator, and the cooling liquid cooled by the heat dissipation teeth returns to the micro-pump to complete the internal circulation of heat dissipation; the fan combination applies the environmental wind to the heat dissipation teeth of the micro-channel radiator to perform forced convection heat exchange, and completes the external circulation of heat dissipation. The temperature measuring fiber is arranged at the position of the power chip to monitor the temperature of the chip in real time, so that the temperature of the chip is stabilized within the threshold range. If the temperature of the chip exceeds the threshold range, the temperature measuring fiber reports the temperature information to the control unit, and the control unit controls the flow of the micro-pump according to the temperature state to stabilize the temperature of the chip.

[0009] The micro-channel radiator is formed by welding a micro-channel heat sink layer, a distribution layer, a liquid storage layer and a heat dissipation fin layer. After welding, the internal structure forms a multi-layer three-dimensional flow channel space, realizing miniaturized design. During operation, the micro-pump drives the internal circulation of the cooling liquid from the liquid storage layer to the distribution layer. The distribution network of the distribution layer adopts a tree structure to evenly distribute the cooling liquid to each liquid outlet of the distribution layer. Due to the small size of the liquid outlet of the distribution layer, the cooling liquid is ejected at high speed to form a jet and wash the micro-channel heat sink layer. The combination of "micro-channel + jet" greatly improves the heat dissipation capacity. The cooling liquid that has completed heat exchange returns to the liquid storage layer and fully exchanges heat with the turbulence column of the heat dissipation fin layer to conduct heat to the heat dissipation teeth.

[0010] The control module is internally provided with a data acquisition module, a temperature correction module, a speed correction module and a micro-pump driving module. The temperature measuring fiber transmits an optical signal to the temperature acquisition module. The temperature acquisition module solves the optical signal and converts it into a temperature value and reports it to the temperature correction module. The temperature correction module compares the real-time temperature with the set temperature. If the temperature is higher than the set temperature, the speed correction module transmits information to increase the speed. If the temperature is lower than the set value, the speed correction module transmits information to reduce the speed. The speed correction module transmits the micro-pump speed information to the micro-pump driving module. The micro-pump driving module drives the micro-pump to operate at the required speed to realize closed-loop temperature control.

[0011] The present application has the following advantages compared with the existing heat dissipation structure:

[0012] 1. The "liquid cooling internal circulation + air cooling external circulation" heat dissipation form is adopted to convert the air cooling heat dissipation problem of high heat flux density heat source into a conventional air cooling heat dissipation problem. No additional heat dissipation device is needed, and the equipment adaptability is greatly improved.

[0013] 2. The liquid cooling internal circulation is adopted. The internal circulation is physically isolated from the external environment to avoid the problem of internal micro-channel blockage caused by external pollution, and the equipment safety is greatly improved.

[0014] 3. By adopting closed-loop thermal control based on temperature feedback, the temperature of the mounting surface of power devices can be stabilized within the set range, which improves the stability of equipment performance and indirectly extends the equipment lifespan;

[0015] 4. The microchannel heat sink adopts a three-dimensional flow channel structure, which greatly reduces the size of the equipment; the internal fluid adopts a tree-shaped distribution network, which has excellent temperature uniformity; the internal microchannel heat dissipation teeth are combined with jet heat dissipation to greatly improve heat dissipation capacity.

[0016] To more clearly illustrate the functional characteristics and structural parameters of the present invention, further explanation is provided below in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0017] Figure 1 This is a three-dimensional isometric schematic diagram of the exterior (front) of the present invention;

[0018] Figure 2 This is a three-dimensional isometric schematic diagram of the outer (reverse) side of the invention;

[0019] Figure 3 This is a three-dimensional exploded view of the microchannel heat sink components of the present invention;

[0020] Figure 4 This is a three-dimensional isometric schematic diagram of the exterior (front) of the microchannel heat sink of the present invention;

[0021] Figure 5 This is a three-dimensional isometric schematic diagram of the microchannel heat sink of the present invention (reverse side);

[0022] Figure 6 This is a three-dimensional isometric schematic diagram of the microchannel heat sink layer of the present invention;

[0023] Figure 7 This is a three-dimensional isometric schematic diagram of the microchannel heat dissipation teeth of the present invention;

[0024] Figure 8 This is a three-dimensional isometric schematic diagram of the fluid distribution layer (front) of the present invention;

[0025] Figure 9 This is a three-dimensional isometric schematic diagram of the fluid distribution layer (reverse side) of the present invention;

[0026] Figure 10 This is a three-dimensional isometric schematic diagram of the liquid storage layer of the present invention;

[0027] Figure 11 This is a three-dimensional isometric schematic diagram of the heat dissipation fin layer of the present invention;

[0028] Figure 12 This is the control principle diagram of the present invention.

[0029] Among them, 1-microchannel heat sink, 1-1-microchannel heat sink layer, 1-1-1-heat dissipation channel, 1-1-2-microchannel heat dissipation teeth.

[0030] 1-2-Fluid distribution layer, 1-2-1-Water distribution channel, 1-2-1-1-Distribution layer inlet, 1-2-1-2-Distribution layer outlet.

[0031] 1-2-2-Water collection channel, 1-2-2-1-Wall penetration hole, 1-2-2-2-Distribution layer return port,

[0032] 1-3-Liquid storage layer, 1-3-1-Liquid outlet static pressure chamber, 1-3-1-1-Liquid storage layer outlet,

[0033] 1-3-2-Return hydrostatic chamber, 1-3-2-1-Return port of storage layer, 1-3-2-2-Guide block,

[0034] 1-4-Heat dissipation fin layer, 1-4-1-Rhomboid turbulence column,

[0035] 1-5-Fiber optic mounting slot, 1-6-Heat dissipation fins, 1-7-Liquid inlet, 1-8-Liquid outlet, 1-9-Liquid injection port;

[0036] 2-Micro pump; 3-Fan assembly; 4-Temperature measuring fiber optic cable;

[0037] 5-Control module, 5-1-Data acquisition module, 5-2-Temperature correction module, 5-3-Speed ​​correction module, 5-Micro pump drive module;

[0038] 6-Coolant. Detailed Implementation

[0039] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] The self-closed-loop microsystem air-cooled heat dissipation structure based on micropumps includes a microchannel heat sink (1), a micropump (2), a fan assembly (3), a temperature measuring fiber (4), a control module (5), and a coolant (6).

[0041] like Figure 1 , Figure 2 As shown, the microchannel heat sink (1) has a temperature measuring fiber (4) embedded on the front end and a micro pump (2) and a fan assembly (3) installed on the rear end.

[0042] The power chip requiring heat dissipation is mounted on the front end of the microchannel heat sink (1). The micropump (2) drives the coolant (6) to flow inside the microchannel heat sink (1), transferring the heat from the power chip on the front end of the microchannel heat sink (1) to the heat dissipation fins on the rear end. The fan assembly (3) applies ambient air to the heat dissipation fins on the rear end of the microchannel heat sink (1) for forced air cooling. The temperature measuring fiber (4) and the micropump (2) are connected to the control module (5). The temperature measuring fiber (4) transmits the temperature information to the control module (5) in real time. The control module (5) adjusts the speed of the micropump (2) in real time according to the temperature information to stabilize the surface temperature of the power chip mounting within the set range.

[0043] like Figure 3 , Figure 4 , Figure 5 As shown, the microchannel heat sink (1) is formed by sequentially stacking and welding a microchannel heat sink layer (1-1), a fluid distribution layer (1-2), a liquid storage layer (1-3), and a heat dissipation fin layer (1-4). The front end of the microchannel heat sink (1) is provided with an optical fiber mounting groove (1-5) to ensure that the temperature measuring optical fiber (4) does not protrude from the surface and avoid affecting the mounting of the power chip. The rear end is provided with heat dissipation fins (1-6) to increase the external heat exchange area and improve the heat dissipation capacity. The rear end is also provided with an inlet (1-7) and an outlet (1-8) to connect with the outlet and return port of the micropump (2). The top of the rear end is provided with a liquid injection port (1-9) for adding coolant (6).

[0044] like Figure 6 , Figure 7 As shown, multiple sets of strip-shaped heat dissipation channels (1-1-1) are arranged on the inner surface of the microchannel heat sink layer (1-1). Microchannel heat dissipation teeth (1-1-2) are arranged inside the heat dissipation channels (1-1-1). The heat dissipation coefficient is greatly improved through the scale effect of the microchannel, so as to achieve efficient heat dissipation.

[0045] like Figure 8 , Figure 9 As shown, the two surfaces of the fluid distribution layer (1-2) are the water distribution channel (1-2-1) and the water collection channel (1-2-2), respectively. The water distribution channel (1-2-1) adopts a tree topology structure, that is, each branch node is divided into 2 paths and is expanded in multiple levels to finally form a complete distribution network, ensuring that the coolant (6) entering from the liquid inlet (1-2-1-1) of the distribution layer is evenly distributed to each liquid outlet (1-2-1-2) of the distribution layer. The liquid outlet (1-2-1-2) of the distribution layer is distributed between the water collection channels (1-2-2). The coolant (6) that has completed the heat dissipation cycle is collected by the water collection channel (1-2-2) and flows out through the wall hole (1-2-2-1) and the liquid return port (1-2-2-2) of the distribution layer. The liquid inlet (1-2-1-1) and the liquid return port (1-2-2-2) of the distribution layer are symmetrically arranged.

[0046] like Figure 10 As shown, the liquid storage layer (1-3) is provided with an outlet static pressure chamber (1-3-1) and a return static pressure chamber (1-3-2); the volume of the liquid static pressure chamber (1-3-1) is smaller than that of the return static pressure chamber (1-3-2); the outlet static pressure chamber (1-3-1) is provided with a liquid storage layer outlet (1-3-1-1); the return static pressure chamber (1-3-2) is provided with a liquid storage layer return port (1-3-2-1). In order to ensure that the coolant (6) is in full contact with the heat dissipation fin layer (1-4) in the return static pressure chamber (1-3-2), the return static pressure chamber (1-3-2) is provided with guide blocks (1-3-2-2) arranged at intervals on the left and right sides, so that the coolant flows according to the design path.

[0047] like Figure 11 As shown, a rhomboid turbulence column (1-4-1) is provided on the inner surface of the heat dissipation fin layer (1-4), and the shape of the return liquid static pressure chamber (1-3-2) matches the shape of the rhomboid turbulence column (1-4-1); the rhomboid turbulence column (1-4-1) is immersed in the return liquid static pressure chamber (1-3-2), which increases the contact area between the heat dissipation fin layer (1-4) and the coolant (6), thereby improving the heat dissipation capacity.

[0048] The flow direction of the liquid-cooled internal circulation coolant (6) in this equipment is as follows: the micro pump (2) drives the coolant (6) from the return liquid static pressure chamber (1-3-2) into the outlet liquid static pressure chamber (1-3-1), and then through the liquid storage layer outlet (1-3-1-1) and the distribution layer inlet (1-2-1-1) into the water distribution channel (1-2-1) for distribution. After distribution, the coolant (6) enters the heat dissipation channel (1-1-1) through the distribution layer outlet (1-2-1-2), flows at high speed through the micro-channel heat dissipation teeth (1-1-2) and then enters the water collection channel (1-2-2). After the coolant (6) is collected, it enters the return liquid static pressure chamber (1-3-2) through the wall penetration hole ((1-2-2-1) and the distribution layer return liquid outlet (1-2-2-2), thus completing the internal cooling circulation.

[0049] The external air-cooled circulation of this equipment is as follows: the rhomboid turbulence column (1-4-1) is in full contact with the coolant (6) in the return liquid static pressure chamber (1-3-2), and conducts heat to the heat dissipation fins (1-6). The fan assembly (3) applies ambient air to the heat dissipation fins (1-6) to perform forced air cooling and heat dissipation, thereby realizing the external heat dissipation of the equipment.

[0050] like Figure 12As shown, the control module (5) includes a data acquisition module (5-1), a temperature correction module (5-2), a speed correction module (5-3), and a micropump drive module (5-4). The temperature measuring fiber (4) transmits the optical signal to the data acquisition module (5-1), which calculates the optical signal into a temperature value and transmits the temperature value to the temperature correction module (5-2). The temperature correction module (5-2) compares the current temperature value with the set temperature. If the temperature is higher than the set value, it transmits the information to the speed correction module (5-3) to increase the speed. If the temperature is lower than the set value, it transmits the information to the speed correction module (5-3) to decrease the speed. The speed correction module (5-3) transmits the micropump speed information to the micropump drive module (5-4), which drives the micropump (2) to run at the required speed to achieve closed-loop temperature control.

[0051] The micropump (2) drives the coolant (6) to circulate liquid-cooled internally within the microchannel radiator (1). After the heat is transferred to the heat dissipation teeth (1-6), the fan assembly (4) performs forced air cooling to achieve external heat dissipation. The temperature-measuring fiber (4) transmits the temperature information to the control module (5), which adjusts the speed of the micropump (2) to achieve closed-loop temperature control. This structure improves the heat dissipation capacity of the equipment by combining internal and external circulation, and achieves constant temperature operation of the power devices through closed-loop temperature control.

[0052] The microchannel radiator (1) is formed by welding multiple layers of microchannel heat sink layer (1-1), fluid distribution layer (1-2), liquid storage layer (1-3) and heat dissipation fin layer (1-4), forming a three-dimensional flow channel inside, which reduces the size of the equipment.

[0053] The fluid distribution layer (1-2) adopts a tree-shaped distribution network to ensure uniform flow distribution, thereby improving the temperature uniformity of the equipment.

[0054] The distribution layer outlet (1-2-1-2) and the microchannel heat dissipation teeth (1-1-2) work together to form a "microchannel + jet" heat dissipation structure, which greatly improves the heat dissipation capacity.

[0055] The temperature-measuring fiber (4) monitors the surface temperature in real time and transmits the temperature information to the control module (5); the control module (5) calculates the temperature information and adjusts the speed of the micro-pump (2) according to the preset control strategy to achieve closed-loop temperature control.

[0056] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A self-closed-loop microsystem air-cooled heat dissipation structure based on a micropump, characterized in that, The structure includes a microchannel heat sink (1), a micropump (2), a fan assembly (3), a temperature measuring fiber (4), a control module (5), and a coolant (6); The microchannel heat sink (1) has a temperature measuring fiber (4) embedded on the front end and a micro pump (2) and a fan assembly (3) installed on the rear end. The power chip is mounted on the front end of the microchannel heat sink (1). The micro pump (2) drives the coolant (6) to flow inside the microchannel heat sink (1), transferring the heat from the power chip on the front end of the microchannel heat sink (1) to the heat sink fins on the rear end. The fan assembly (3) applies ambient air to the heat sink fins on the rear end of the microchannel heat sink (1) for forced air cooling. The temperature measuring fiber (4) and the micro pump (2) are connected to the control module (5). The temperature measuring fiber (4) transmits the temperature information to the control module (5) in real time. The control module (5) adjusts the speed of the micro pump (2) in real time according to the temperature information to stabilize the surface temperature of the power chip mounting within the set range.

2. The structure according to claim 1, characterized in that, The microchannel heat sink (1) is formed by sequentially stacking and welding together a microchannel heat sink layer (1-1), a fluid distribution layer (1-2), a liquid storage layer (1-3), and a heat dissipation fin layer (1-4); The microchannel radiator (1) has an optical fiber mounting slot (1-5) on its front end face; a heat dissipation fin (1-6) on its rear end face; an inlet (1-7) and an outlet (1-8) on its rear end face, which are connected to the outlet and return port of the micro pump (2); and an injection port (1-9) on the top of its rear end face, which is used for adding coolant (6). Multiple sets of strip-shaped heat dissipation channels (1-1-1) are arranged on the inner surface of the microchannel heat sink layer (1-1-1), and microchannel heat dissipation teeth (1-1-2) are arranged inside the heat dissipation channels (1-1-1).

3. The structure according to claim 2, characterized in that, The two surfaces of the fluid distribution layer (1-2) are the water distribution channel (1-2-1) and the water collection channel (1-2-2), respectively. The water distribution channel (1-2-1) adopts a tree topology structure, that is, each branch node is divided into two paths and is expanded in multiple levels to finally form a complete distribution network, ensuring that the coolant (6) entering from the liquid inlet (1-2-1-1) of the distribution layer is evenly distributed to each liquid outlet (1-2-1-2) of the distribution layer. The liquid outlet (1-2-1-2) of the distribution layer is distributed between the water collection channels (1-2-2). The coolant (6) that has completed the heat dissipation cycle is collected by the water collection channel (1-2-2) and flows out through the wall hole (1-2-2-1) and the liquid return port (1-2-2-2) of the distribution layer. The liquid inlet (1-2-1-1) and the liquid return port (1-2-2-2) of the distribution layer are symmetrically arranged.

4. The structure according to claim 3, characterized in that, The liquid storage layer (1-3) is provided with an outlet static pressure chamber (1-3-1) and a return static pressure chamber (1-3-2); the volume of the liquid static pressure chamber (1-3-1) is smaller than that of the return static pressure chamber (1-3-2); the outlet static pressure chamber (1-3-1) is provided with a liquid storage layer outlet (1-3-1-1); the return static pressure chamber (1-3-2) is provided with a liquid storage layer return port (1-3-2-1); the return static pressure chamber (1-3-2) is provided with guide blocks (1-3-2-2) arranged at intervals on the left and right sides to make the coolant flow along the designed path.

5. The structure according to claim 4, characterized in that, A rhomboid turbulence column (1-4-1) is provided on the inner surface of the heat dissipation fin layer (1-4). The shape of the return liquid static pressure chamber (1-3-2) matches the shape of the rhomboid turbulence column (1-4-1). The rhomboid turbulence column (1-4-1) is immersed in the return liquid static pressure chamber (1-3-2), which increases the contact area between the heat dissipation fin layer (1-4) and the coolant (6), thereby improving the heat dissipation capacity.

6. The structure according to claim 5, characterized in that, The coolant (6) flows as follows: the micro pump (2) drives the coolant (6) from the return static pressure chamber (1-3-2) into the outlet static pressure chamber (1-3-1), and then through the liquid storage layer outlet (1-3-1-1) and the distribution layer inlet (1-2-1-1) into the water distribution channel (1-2-1) for distribution. The distributed coolant (6) then enters the heat dissipation channel (1-1-1) through the distribution layer outlet (1-2-1-2), flows at high speed through the micro-channel heat dissipation teeth (1-1-2) and enters the water collection channel (1-2-2). After the coolant (6) is collected, it enters the return static pressure chamber (1-3-2) through the wall penetration hole ((1-2-2-1) and the distribution layer return port (1-2-2-2), thus completing the internal cooling circulation.

7. The structure according to claim 5, characterized in that, The rhomboid turbulence column (1-4-1) is in full contact with the coolant (6) in the return liquid static pressure chamber (1-3-2), and conducts heat to the heat dissipation fins (1-6). The fan assembly (3) applies ambient wind to the heat dissipation fins (1-6) for forced air cooling, thereby achieving external heat dissipation of the equipment.

8. The structure according to claim 1, characterized in that, The control module (5) includes a data acquisition module (5-1), a temperature correction module (5-2), a speed correction module (5-3), and a micro-pump drive module (5-4); The temperature-measuring fiber (4) transmits the optical signal to the data acquisition module (5-1). The data acquisition module (5-1) calculates the optical signal into a temperature value and transmits the temperature value to the temperature correction module (5-2). The temperature correction module (5-2) compares the current temperature value with the set temperature. If the temperature is higher than the set value, it transmits the information to the speed correction module (5-3) to increase the speed. If the temperature is lower than the set value, it transmits the information to the speed correction module (5-3) to decrease the speed. The speed correction module (5-3) transmits the micropump speed information to the micropump drive module (5-4). The micropump drive module (5-4) drives the micropump (2) to run at the required speed to achieve closed-loop temperature control.

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