Chip structure, functional device and chip packaging method

Abstract

The embodiment of the invention discloses a chip structure, a functional device and a chip packaging method. The chip structure comprises a chip body, a supporting body, an interconnection channel and a liquid filler, the supporting body plays a role in supporting the chip body, the supporting body is made of a flexible material, so that the supporting body can be bent and stretched, and in the stretching or compressing process of the supporting body, the interconnection channel deforms and is stretched or compressed, so that the liquid filler is formed. However, the interconnection channel is always filled with the liquid filler to realize connection with the chip body, that is to say, no matter the support body is bent, compressed or stretched, the chip body can be connected with the liquid filler in the interconnection channel, normal communication of the chip body can be guaranteed, and the reliability of the chip structure is further improved. And the application scene of the flexible chip is increased.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the chip technical field, and particularly relate to a chip structure, a functional device and a chip packaging method. BACKGROUND

[0002] The interconnection of the ultra-thin chip includes conventional wire bonding, screen printing and RDL rewiring technology, and after the interconnection is completed, the flexible material is used for encapsulation, so as to prepare a flexible chip. The ideal flexible chip needs to have the characteristics of bendable and stretchable, however, the flexible chip prepared by using the above interconnection technology is not stretchable, and the connection of the flexible chip is prone to delamination or even breakage when working under bending condition for a long time, thereby affecting the reliability of the flexible chip. SUMMARY

[0003] The present application aims to at least solve one of the problems in the prior art or related art.

[0004] To this end, a first aspect of the present application provides a chip structure.

[0005] A second aspect of the present application provides a functional device.

[0006] A third aspect of the present application provides a chip packaging method.

[0007] Therefore, according to the first aspect of the embodiments of the present application, a chip structure is provided, comprising:

[0008] a chip body;

[0009] a support body made of a flexible material;

[0010] an interconnection channel formed on the support body;

[0011] a liquid filler filled in the interconnection channel;

[0012] wherein the chip body is arranged on the support body, the chip body covers at least part of the interconnection channel, the liquid filler is connected to the chip body, and the liquid filler is a conductive material.

[0013] In a feasible implementation, the material for preparing the liquid filler includes a liquid metal material.

[0014] The material for preparing the support body includes at least one of polydimethylsiloxane, rubber, polyethylene terephthalate and polyethylene naphthalate.

[0015] In a feasible implementation, the chip structure further comprises:

[0016] a packaging layer connected to the support body, covering the chip body and the interconnection channel.

[0017] In an implementation, the thickness of the packaging layer is less than or equal to 50 μm; and / or

[0018] The material for preparing the packaging layer comprises at least one of polydimethylsiloxane, polymethyl methacrylate and polyimide.

[0019] According to a second aspect of the embodiments of the present application, a functional device is provided, comprising:

[0020] The chip structure according to any of the above technical solutions;

[0021] a main board connected to the interconnection channel of the chip structure.

[0022] In an implementation, a first protrusion is formed on the main board, which is used for plugging into the interconnection channel through the packaging layer of the chip structure to connect to the chip structure.

[0023] In an implementation, the chip structure is two or more.

[0024] In an implementation, a second protrusion is formed on the chip structure, which is used for plugging into the interconnection channel through the packaging layer of the other chip structure to realize the interconnection of the two chip structures.

[0025] According to a third aspect of the embodiments of the present application, a chip packaging method is provided, which is used for preparing the functional device according to any of the above technical solutions, and the preparation method comprises:

[0026] providing a substrate, and forming an interconnection pattern on the substrate;

[0027] providing a flexible support body, and pressing the support body by using the interconnection pattern on the substrate to form an interconnection channel;

[0028] injecting a liquid filler into the interconnection channel;

[0029] connecting a chip body to the support body and covering at least part of the interconnection channel.

[0030] In an implementation, the chip packaging method further comprises:

[0031] covering a packaging layer on the support body to package the liquid filler, the interconnection channel and the chip body.

[0032] In an implementation, the chip packaging method further comprises:

[0033] Cut the chip with completed packaging to obtain a chip structure;

[0034] Connect the chip structure with a mainboard or other chip structure to obtain a functional device.

[0035] Compared with the prior art, the present application has at least the following beneficial effects:

[0036] The chip structure provided by the embodiment of the present application comprises a chip body, a support body, an interconnection channel and a liquid filler. The support body supports the chip body. The support body is made of a flexible material and can be bent and stretched. During stretching or compression of the support body, the interconnection channel is deformed and stretched or compressed. The liquid filler is always filled in the interconnection channel to realize connection with the chip body. That is, the chip body can be connected with the liquid filler in the interconnection channel regardless of bending, compression or stretching of the support body, which can guarantee normal communication of the chip body and improve the reliability of the chip structure and increase the application scenarios of the flexible chip. BRIEF DESCRIPTION OF DRAWINGS

[0037] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not intended to limit the scope of the present application. Moreover, the same reference numerals are used throughout the same figures. In the drawings:

[0038] Figure 1 A schematic structural diagram of a chip structure of an embodiment provided by the present application;

[0039] Figure 2 A schematic structural diagram of a functional device of an embodiment provided by the present application;

[0040] Figure 3 A schematic step flow chart of a chip packaging method of an embodiment provided by the present application;

[0041] Figure 4 A schematic structural diagram of an interconnection pattern during execution of a chip packaging method of an embodiment provided by the present application;

[0042] Figure 5 A schematic structural diagram of an interconnection pattern from another angle during execution of a chip packaging method of an embodiment provided by the present application;

[0043] Figure 6 A schematic structural diagram of an interconnection channel forming process during execution of a chip packaging method of an embodiment provided by the present application;

[0044] Figure 7 A schematic structural view of an interconnection channel forming process during execution of a chip packaging method according to an embodiment provided in the present application;

[0045] Figure 8 A schematic structural view of a liquid filler filling process during execution of a chip packaging method according to an embodiment provided in the present application;

[0046] Figure 9 A schematic structural view of a liquid filler filling process during execution of a chip packaging method according to an embodiment provided in the present application;

[0047] Figure 10 A schematic structural view of a chip body and a support body connection during execution of a chip packaging method according to an embodiment provided in the present application;

[0048] Figure 11 A schematic structural view after a chip body and a support body connection during execution of a chip packaging method according to an embodiment provided in the present application;

[0049] Figure 12 A schematic structural view of a packaging layer setting during execution of a chip packaging method according to an embodiment provided in the present application;

[0050] Figure 13 A schematic structural view of a chip structure cutting during execution of a chip packaging method according to an embodiment provided in the present application;

[0051] Figure 14 A schematic structural view after a chip structure cutting during execution of a chip packaging method according to an embodiment provided in the present application;

[0052] Figure 15 A schematic structural view of a chip structure and a mainboard connection during execution of a chip packaging method according to an embodiment provided in the present application;

[0053] Figure 16 A schematic structural view after a chip structure and a mainboard connection during execution of a chip packaging method according to an embodiment provided in the present application.

[0054] Wherein, Figures 1 to 16 The correspondence between the reference signs and the component names in the accompanying drawings is as follows:

[0055] 110 chip body, 120 support body, 130 interconnection channel, 140 liquid filler, 150 packaging layer;

[0056] 210 mainboard, 220 first convex part;

[0057] 310 substrate, 320 interconnection pattern, 330 hard substrate;

[0058] 321 chip solder joints, 322 package solder joints. DETAILED DESCRIPTION

[0059] In order to better understand the above technical solutions, the technical solutions of the embodiments of the present application will be described in detail below through the drawings and specific embodiments. It should be understood that the specific features in the embodiments of the present application and the embodiments are detailed descriptions of the technical solutions of the embodiments of the present application, and are not limitations of the technical solutions of the present application. In the case of no conflict, the technical features in the embodiments of the present application and the embodiments can be combined with each other.

[0060] The present application considers that, compared with organic semiconductor flexible chips, inorganic semiconductor flexible chips have more excellent electrical properties, and inorganic semiconductor chip technology is mature, and the manufacturing cost is low, which is suitable for large-scale manufacturing. When the thickness of inorganic semiconductor chip is less than 50um, the ultra-thin inorganic semiconductor chip has flexibility. In order to isolate the influence of external environmental factors on the ultra-thin bare chip, the ultra-thin bare chip needs to be flexibly packaged. Among them, the interconnection of the bare chip pad and the pin of the external flexible circuit board is the key process in the packaging technology, and the form of the interconnection line directly affects the bending and stretching reliability of the packaged flexible chip.

[0061] As disclosed in patent CN106876286A, a very thin flexible electronic chip packaging method includes the following steps: (1) spin coating and heat curing a polymer layer on the back of a silicon wafer to obtain a flexible silicon wafer; (2) attaching the flexible silicon wafer to a blue film; (3) separating the flexible silicon wafer from the blue film by plasma etching and mechanical scribing to obtain a flexible chip; (4) peeling the flexible chip from the blue film; (5) using anisotropic conductive adhesive to complete the electrical connection between the flexible chip and the system substrate by hot pressing. The present application realizes the packaging of very thin chips in a flexible electronic system, uses thin chips to increase flexibility, and at the same time adopts special process means to reduce the possibility of fragmentation of very thin silicon wafers and chips. The interconnection formed by the packaging method has poor bending reliability, and the flexible chip does not have stretching characteristics.

[0062] For example, patent CN210925997U discloses a flexible chip packaging structure. Specifically, the flexible chip packaging structure includes: a flexible circuit board having a pad thereon; a flexible chip electrically interconnected with the pad through a lead, both the pad and the lead being formed of a metal material, wherein the lead can be stretched and deformed when the flexible circuit board is bent. Thus, in the flexible chip packaging structure, when the flexible chip and the flexible circuit board are bent greatly, the lead can be stretched and deformed, the lead is not easy to break, and the bonding points at the connection between the lead and the flexible chip and the connection between the lead and the pad are not easy to break, thereby improving the stability and reliability of the flexible chip packaging structure and the use performance of the product. The interconnection formed by the packaging method does not have the stretching property.

[0063] Therefore, according to a first aspect of the present application, a chip structure is provided, which includes: a chip body 110; a support body 120 made of a flexible material; an interconnection channel 130 formed on the support body 120; and a liquid filler 140 filled in the interconnection channel 130. The chip body 110 is arranged on the support body 120, the chip body 110 covers at least part of the interconnection channel 130, the liquid filler 140 is connected to the chip body 110, and the liquid filler 140 is a conductive material.

[0064] The chip structure provided by the present application includes the chip body 110, the support body 120, the interconnection channel 130, and the liquid filler 140. The support body 120 supports the chip body 110, is made of a flexible material, and can be bent and stretched. During stretching or compression of the support body 120, the interconnection channel 130 is deformed, stretched or compressed, but the liquid filler 140 is always filled in the interconnection channel 130 to realize connection with the chip body 110. That is, the chip body 110 can be connected to the liquid filler 140 in the interconnection channel 130 regardless of bending, compression or stretching of the support body 120, which can guarantee normal communication of the chip body 110 and improve the reliability of the chip structure and the application scenarios of the flexible chip.

[0065] In a feasible implementation, the material for preparing the liquid filler 140 includes a liquid metal material. In this way, the conductivity efficiency can be guaranteed, the probability of exosmosis of the liquid filler 140 is reduced, and the stability of the chip structure is further improved.

[0066] In some examples, the liquid metal material includes at least one of mercury, gallium, and gallium-indium alloy.

[0067] In an embodiment, the material for preparing the support 120 comprises at least one of polydimethylsiloxane (PDMS), rubber, polyethylene terephthalate (PET) and polyethylene naphthalate (PEN). In this way, the support 120 is flexible, and the use of polydimethylsiloxane (PDMS) can provide the support 120 with excellent flexibility, biocompatibility and chemical stability; the use of rubber can reduce the cost; the use of polyethylene terephthalate (PET) can improve the resistance of the support 120 to organic solvents and weather resistance; and the use of polyethylene naphthalate (PEN) can improve the chemical stability, especially the resistance to acid and alkali corrosion.

[0068] In an embodiment, the chip structure further comprises a packaging layer 150 connected to the support 120 and covering the chip body 110 and the interconnection channel 130.

[0069] In this technical solution, the chip structure can further comprise a packaging layer 150, which can cover the chip body 110 and the interconnection channel 130, and can seal the interconnection channel 130 to prevent the liquid filler 140 from overflowing, and can also protect the chip body 110.

[0070] In an embodiment, the thickness of the packaging layer 150 is less than or equal to 50 μm.

[0071] In this technical solution, it is considered that the chip structure needs to be interconnected with other structures or other chip structures in subsequent use, and in the interconnection process, the other structures or chip structures can pierce the packaging layer 150 to connect with the liquid filler 140 in the interconnection channel 130, and then the electrical conductivity of the liquid filler 140 can be used to realize the interconnection with the chip structure. The thickness of the packaging layer 150 is less than or equal to 50 μm, which facilitates the piercing of the packaging layer 150 by other structures or other chip structures.

[0072] In an embodiment, the material for preparing the packaging layer 150 comprises at least one of polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA) and polyimide (PI).

[0073] In the technical solution, further provided is the selection of the material for preparing the encapsulation layer 150, the selection of the polydimethylsiloxane (PDMS) material can make the encapsulation layer 150 excellent in flexibility, biocompatibility and chemical stability, the selection of the polymethyl methacrylate (PMMA) can improve the mechanical strength of the encapsulation layer 150, in particular, improve the tensile and impact resistance of the encapsulation layer 150, and the selection of the polyimide (PI) material can improve the heat resistance and chemical corrosion resistance of the encapsulation layer 150.

[0074] According to a second aspect of the embodiments of the present application, a functional device is provided, which comprises the chip structure according to any one of the above technical solutions, and a mainboard 210 connected to the interconnection channel 130 of the chip structure.

[0075] The functional device provided by the embodiments of the present application comprises the chip structure according to any one of the above technical solutions, and therefore has all the beneficial effects of the chip structure according to the above technical solutions.

[0076] The functional device provided by the embodiments of the present application comprises the chip structure and the mainboard 210, and the chip structure and the mainboard 210 are interconnected, so that the function is realized. The chip structure comprises the chip body 110, the support body 120, the interconnection channel 130 and the liquid filler 140. The support body 120 supports the chip body 110. The support body 120 is made of a flexible material, so that the support body 120 can be bent and stretched. During the stretching or compression of the support body 120, the interconnection channel 130 is deformed and is stretched or compressed. However, the liquid filler 140 is always filled in the interconnection channel 130, so that the connection with the chip body 110 is realized. That is to say, no matter whether the support body 120 is bent, compressed or stretched, the chip body 110 can be connected with the liquid filler 140 in the interconnection channel 130, so that the normal communication of the chip body 110 is ensured, and the reliability of the functional device is improved.

[0077] It can be understood that the function and effect of the functional device are not limited by the present application.

[0078] In a feasible implementation, the first protrusion 220 is formed on the mainboard 210, and the first protrusion 220 is used for being inserted into the interconnection channel 130 through the encapsulation layer 150 of the chip structure, so as to be connected to the chip structure.

[0079] In the technical solution, the first protruding part 220 can be formed on the mainboard 210, the first protruding part 220 is inserted into the interconnection channel 130 through the encapsulation layer 150, and then the first protruding part 220 extends into the liquid filler 140, so that the mainboard 210 can be interconnected with the chip structure through the first protruding part 220 and the liquid filler 140. In this way, the connection relationship between the chip structure and the mainboard 210 can be established conveniently.

[0080] In some examples, the first protruding part 220 can be a stud bump formed on the mainboard 210, so that the first protruding part 220 is formed more conveniently.

[0081] In a feasible implementation, the chip structure is two or more; wherein the chip structure has a second protruding part, the second protruding part is used to insert into the interconnection channel 130 through the encapsulation layer 150 of other chip structures, so as to realize the interconnection of the two chip structures.

[0082] In the technical solution, the chip structure can also be two or more, that is, the functional device can include two or more chip structures to realize more complex or more functions, in which case the interconnection between different chip structures can be involved, and therefore a second protruding part can be formed on the chip structure, the second protruding part is used to pierce the encapsulation layer 150 of other chip structures, and based on this, the two chip structures can be connected through the second protruding part and the liquid filler 140.

[0083] In some examples, the second protruding part can be a stud bump formed on the chip structure, and specifically can be a stud bump formed on the support body 120 of the chip structure, so that the second protruding part is formed more conveniently.

[0084] It can be understood that the first protruding part 220 and the second protruding part are small in size, and therefore in the case that the first protruding part 220 and the second protruding part pierce the encapsulation layer 150, the leakage of the liquid filler 140 generally does not occur. Further, the functional device can also include an adhesive layer, in order to prevent the leakage of the liquid material, after the first protruding part 220 and the second protruding part pierce the encapsulation layer 150, the adhesive layer can be arranged to seal the leakage point after the piercing.

[0085] As shown in FIG. 3, Figure 3 According to a third aspect of the embodiments of the present application, a chip packaging method is provided, which is used to prepare the functional device according to any of the above technical solutions, and the preparation method comprises the following steps:

[0086] Step 301: providing a substrate, and forming an interconnection pattern on the substrate;

[0087] Step 302: providing a flexible support body, and pressing the support body by using the interconnection pattern on the substrate, so as to form an interconnection channel;

[0088] Step 303: injecting a liquid filler into the interconnection channel;

[0089] Step 304: connecting the chip body to the support body, and covering at least part of the interconnection channel.

[0090] The chip packaging method provided by the embodiments of the present application has all the beneficial effects of the functional device of the above technical solutions, and thus repeated description is omitted here.

[0091] As shown in Figures 4 to 16 The chip packaging method provided by the embodiments of the present application first provides a substrate 310, then forms an interconnection pattern 320 on the substrate, and thus an imprint for forming an interconnection channel 130 can be obtained; then the substrate 310 with the interconnection pattern 320 is pressed onto the support body 120, so that the interconnection channel 130 is pressed and formed on the support body 120; then a liquid filler 140 is injected into the interconnection channel 130, and then the chip body 110 is connected to the support body 120, and the chip body 110 is in contact with the liquid filler 140 in the interconnection channel 130, so that the preparation of the chip structure is completed, and the chip communicates through the liquid filler 140, which can guarantee the stable communication of the chip body 110 even if the support body 120 is stretched.

[0092] The chip packaging method provided by the embodiments of the present application forms the interconnection pattern 320 on the substrate 310, and then forms the interconnection channel 130 by pressing, which facilitates the formation of the interconnection channel 130. Subsequently, only the filling of the liquid filler 140 and the connection of the chip body 110 are needed, so that the preparation of the chip structure is completed, and the preparation process is simple and easy to implement.

[0093] As shown in Figure 12 In a feasible implementation, the chip packaging method further includes: covering an encapsulation layer 150 on the support body 120 to encapsulate the liquid filler 140, the interconnection channel 130 and the chip body 110.

[0094] In this technical solution, after the fixation of the chip is completed, the encapsulation layer 150 can be set to encapsulate the liquid filler 140, the interconnection channel 130 and the chip body 110, so as to prevent the liquid filler 140 from leaking and guarantee the stability of the functional device.

[0095] In some examples, the specific steps of forming the encapsulation layer 150 can include: encapsulating the chip body 110 and the interconnection channel 130 by using a flexible material such as PDMS, PMMA, PI, etc., to prevent the liquid filler 140 from overflowing. In order to be able to pierce the encapsulation layer 150 in the subsequent process, expose the encapsulation pad 322, and interconnect with other chips or systems, the thickness of the encapsulation layer 150 is controlled to be within 50 μm.

[0096] As shown in Figures 13 to 16 In an example, the chip packaging method further includes: cutting the packaged chip to obtain a chip structure; and connecting the chip structure to a mainboard 210 or another chip structure to obtain a functional device.

[0097] In this technical solution, after the chip body 110 is packaged, the chip can be cut by mechanical cutting or laser cutting to obtain a chip structure, and then the chip structure is connected to the mainboard 210 to obtain a functional device, and the process is easy to implement.

[0098] Specifically, in the process of connecting the chip structure to the mainboard 210 or another chip structure, a piercing solder joint can be formed on the other chip structure or the mainboard 210, and then the chip structure is attached to the other chip structure or the mainboard 210, so that the packaging layer 150 of the chip structure is pierced to form an interconnection with the other chip structure or the mainboard 210.

[0099] As shown in Figures 4 to 6 In some examples, the step of forming the interconnection pattern 320 on the substrate 310 can specifically include:

[0100] A chip interconnection stamp is etched on the hard substrate 330 by laser or chemical etching, and the interconnection stamp includes a chip solder joint 321 for connecting the chip body 110 to the support body 120, a packaging solder joint 322 for interconnecting with another chip or mainboard 210, and an interconnection channel 130. In this way, the chip solder joint 321 for fixing the chip, the packaging solder joint 322 for interconnecting with another chip or mainboard 210, and the interconnection channel 130 can be formed by pressing on the support body 120 once, making the process simpler.

[0101] As shown in Figures 6 to 7 In some examples, the step of pressing on the support body 120 to form the interconnection channel 130 using the interconnection pattern 320 on the substrate 310 can specifically include:

[0102] First, spin the flexible substrate 310 material with tensile properties such as PDMS, rubber, PET, PEN, etc. on the hard substrate 330, and do not solidify the substrate 310 after the spin coating is completed. Then, the pattern of the interconnection stamp is imprinted on the flexible substrate 310. Before the imprinting, the stamp is sprayed with a release agent for subsequent demolding. During the imprinting process, according to the solidification characteristics of the substrate 310 material, appropriate pressure and temperature can be added to promote the solidification of the substrate 310 material to form the support body 120. Finally, remove the stamp to complete the transfer preparation of the interconnection pattern to form the chip pads 321 for fixing the chip, the packaging pads 322 for interconnection with other chips or mainboards 210, and the interconnection channels 130 on the support body 120. In this way, the processing of the support body 120 is completed, which is easy to implement.

[0103] As shown in Figures 8 to 9 In some examples, the step of injecting the liquid filler 140 into the interconnection channel 130 includes injecting a liquid metal material into the interconnection channel 130 to fill the interconnection channel 130 to form a flexible substrate of the liquid metal interconnection channel 130.

[0104] In some examples, the step of connecting the chip body 110 to the support body 120 and covering at least part of the interconnection channel 130 includes:

[0105] The chip body 110 is attached to the support body 120 to ensure that the pads of the chip body 110 are interconnected with the chip pads 321 on the support body 120. In this way, the fixation of the chip body 110 is more reliable.

[0106] In the present application, the terms "first", "second", "third" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance; the term "multiple" refers to two or more, unless otherwise explicitly limited. The terms "mounting", "connecting", "connecting", "fixing" and the like should be broadly understood, for example, "connecting" can be fixed connection, or detachable connection, or integrally connected; "connected" can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0107] In the description of the present application, it should be understood that the terms "up", "down", "left", "right", "front", "back" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or units referred to must have a particular direction, be constructed and operated in a particular orientation, therefore, cannot be understood as a limitation on the present application.

[0108] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "certain embodiments", and the like is intended to indicate that the described implementation, feature, structure, material or characteristic is included in at least one embodiment or example of the application. The illustrative representations of the above terms in the specification are not necessarily referring to the same embodiment or example. Moreover, the described implementation, feature, structure, material or characteristic can be combined in any one or more embodiments or examples in a suitable manner.

[0109] The above only is the preferred embodiment of the present application, and is not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A chip structure, characterized in that, include: Chip body; A support body made of a flexible material; An interconnection channel is formed on the support structure; Liquid filler, the liquid filler being filled within the interconnecting channels; The chip body is disposed on the support, the chip body covers at least a portion of the interconnect channel, and the liquid filler is connected to the chip body. The liquid filler is a conductive material.

2. The chip structure according to claim 1, characterized in that, The materials used to prepare the liquid filler include: liquid metal materials; The materials used to prepare the support include at least one of polydimethylsiloxane, rubber, polyethylene terephthalate, and polyethylene naphthalate.

3. The chip structure according to claim 1, characterized in that, Also includes: An encapsulation layer is connected to the support body and covers the chip body and the interconnect channel.

4. The chip structure according to claim 3, characterized in that, The thickness of the encapsulation layer is less than or equal to 50 μm; and / or The materials used to prepare the encapsulation layer include at least one of polydimethylsiloxane, polymethyl methacrylate, and polyimide.

5. A functional device, characterized in that, include: The chip structure as described in any one of claims 1 to 4; A motherboard, which is connected to the interconnect channel of the chip structure.

6. The functional device according to claim 5, characterized in that, A first protrusion is formed on the motherboard, which is used to pass through the encapsulation layer of the chip structure and insert into the interconnect channel to connect to the chip structure.

7. The functional device according to claim 5, characterized in that, The chip structure consists of two or more chips; The chip structure has a second protrusion, which is used to pass through the packaging layer of other chip structures and be inserted into the interconnect channel to achieve interconnection between the two chip structures.

8. A chip packaging method, characterized in that, The method for preparing the functional device as described in any one of claims 5 to 7 comprises: Provide a substrate on which interconnect patterns are formed; A flexible support is provided, and interconnecting channels are formed by pressing interconnecting patterns on the substrate onto the support. Inject liquid filler into the interconnecting channels; The chip body is connected to the support and covers at least a portion of the interconnect channels.

9. The chip packaging method according to claim 8, characterized in that, Also includes: An encapsulation layer is applied to the support to encapsulate the liquid filler, the interconnect channels, and the chip body.

10. The chip packaging method according to claim 9, characterized in that, Also includes: The packaged chip is cut to obtain the chip structure; Connect the chip structure to the motherboard or other chip structures to obtain functional devices.

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