High-precision three-dimensional piezoelectric nanometer positioning table

Abstract

The invention relates to the technical field of precise positioning tables, and discloses a high-precision three-dimensional piezoelectric nanometer positioning table which comprises a flexible hinge mechanism, an X-axis piezoelectric driving mechanism, a Y-axis piezoelectric driving mechanism and a Z-axis piezoelectric driving mechanism. The two X-axis piezoelectric driving mechanisms and the two Y-axis piezoelectric driving mechanisms are distributed in a cross shape. And the four Z-axis piezoelectric driving mechanisms are arrayed between the X-axis piezoelectric driving mechanism and the Y-axis piezoelectric driving mechanism. And the four Z-axis piezoelectric driving mechanisms jointly drive the moving surface to linearly move along the Z axis. And the two X-axis piezoelectric driving mechanisms and the two Y-axis piezoelectric driving mechanisms respectively drive the moving surface to linearly move along the X axis and the Y axis. According to the high-precision three-dimensional piezoelectric nanometer positioning table, piezoelectric ceramic serves as a driving source, the innovative design of a flexible hinge mechanism is combined, ultrahigh-precision X-axis, Y-axis and Z-axis three-dimensional precise movement is achieved through multi-path independent control and checking, and the high-precision three-dimensional piezoelectric nanometer positioning table has the advantages of being high in resolution, rapid in response, compact in structure and large in stroke.

Description

Technical Field

[0001] This invention belongs to the field of precision positioning stage technology, and more specifically, relates to a high-precision three-dimensional piezoelectric nanopositioning stage. Background Technology

[0002] As scientific exploration delves deeper into the microscopic world, more and more scientific fields have an extreme demand for precise positioning, such as ensuring nanometer-level stable focusing of laser beams, achieving precise wafer alignment in semiconductor testing, and performing super-resolution microscopic imaging in biomedicine. These application scenarios all share the same core requirement—a precision positioning stage with multiple degrees of freedom, high precision, and fast response.

[0003] A piezoelectric positioning stage is a mechanical structure that uses piezoelectric drive technology to achieve precise positioning. It utilizes the inverse piezoelectric effect of piezoelectric ceramics, causing minute displacements when the ceramics are energized, thus achieving precise positioning. Currently, piezoelectric positioning stages can be classified into single-degree-of-freedom and multi-degree-of-freedom types according to their degrees of freedom, and into direct-drive and amplification types according to the presence or absence of a displacement amplification mechanism. In recent years, thanks to advancements in piezoelectric ceramic manufacturing processes and technologies, commercially available piezoelectric ceramic sheets are characterized by miniaturization, high reliability, and stability, making them ideal for various precision adjustments and precision instrument applications. However, multi-degree-of-freedom precision positioning stages are often complex in structure and large in size. This makes integration with other positioning systems difficult, and also results in high motion coupling, low repeatability, short stroke, and insufficient resolution and response speed.

[0004] Based on the above, the current problem to be solved is to provide a high-precision three-dimensional piezoelectric nanopositioning stage with high repeatability, high resolution, small size, and large stroke. Summary of the Invention

[0005] The purpose of this invention is to provide a high-precision three-dimensional piezoelectric nanopositioning stage, which aims to solve the problems of complex structure, large size, low repeatability, low resolution, slow response speed and short stroke of existing multi-degree-of-freedom positioning stages.

[0006] The present invention is implemented as follows: a high-precision three-dimensional piezoelectric nanopositioning stage, comprising a flexible hinge mechanism and an X-axis piezoelectric drive mechanism, a Y-axis piezoelectric drive mechanism and a Z-axis piezoelectric drive mechanism disposed on the flexible hinge mechanism;

[0007] Two X-axis piezoelectric drive mechanisms are arranged parallel to the Y-axis, and two Y-axis piezoelectric drive mechanisms are arranged parallel to the X-axis, forming a cross-shaped distribution. Four Z-axis piezoelectric drive mechanisms are arrayed between the X-axis and Y-axis piezoelectric drive mechanisms. A movable surface is connected above each Z-axis piezoelectric drive mechanism, and the four Z-axis piezoelectric drive mechanisms jointly drive the movable surface to move linearly along the Z-axis.

[0008] The two X-axis piezoelectric drive mechanisms and the two Y-axis piezoelectric drive mechanisms are connected in series with the Z-axis piezoelectric drive mechanism and the moving surface through a flexible hinge mechanism. The X-axis piezoelectric drive mechanism and the Y-axis piezoelectric drive mechanism respectively drive the moving surface to move linearly along the X-axis and Y-axis.

[0009] Furthermore, the flexible hinge mechanism includes, from the inside out, a first connecting part, a second connecting part, and a third connecting part; a first flexible hinge arm parallel to the Y-axis is provided between the first connecting part and the second connecting part, and a second flexible hinge arm parallel to the X-axis is provided between the second connecting part and the third connecting part;

[0010] The fixed end of the Z-axis piezoelectric drive mechanism is connected to the first connecting part, and the moving end of the Z-axis piezoelectric drive mechanism is connected to the moving surface; the fixed end of the X-axis piezoelectric drive mechanism is connected to the second connecting part, and the moving end of the X-axis piezoelectric drive mechanism is connected to the first connecting part; the fixed end of the Y-axis piezoelectric drive mechanism is connected to the third connecting part, and the moving end of the Y-axis piezoelectric drive mechanism is connected to the second connecting part.

[0011] Furthermore, the first flexible hinge arm and the second flexible hinge arm are both straight beam type flexible hinges.

[0012] Furthermore, the first connecting part is configured as an H-shape.

[0013] Furthermore, the second connecting portion includes a rectangular frame and an extension end disposed in the middle of the rectangular frame, the extension end extending toward the first connecting portion.

[0014] Furthermore, the X-axis piezoelectric drive mechanism includes a first amplifying body and a first piezoelectric ceramic disposed within the first amplifying body, wherein the central axis of the first piezoelectric ceramic forms an angle α with the Y-axis, 0 < α < 90°.

[0015] Furthermore, the Y-axis piezoelectric drive mechanism includes a first amplification body and a first piezoelectric ceramic disposed within the first amplification body, wherein the central axis of the first piezoelectric ceramic forms an angle α with the X-axis, 0 < α < 90°.

[0016] Furthermore, the Z-axis piezoelectric drive mechanism includes a second amplification body and a second piezoelectric ceramic disposed within the second amplification body, wherein the central axis of the second piezoelectric ceramic forms an angle β with the Z-axis, 0 < β < 90°.

[0017] Furthermore, the outer periphery of the movable surface is provided with an upper cover, and a platform is connected below the upper cover. The four edges of the flexible hinge mechanism are connected to the platform, and the bottom of the platform is provided with a bottom cover.

[0018] Furthermore, the X-axis piezoelectric drive mechanism, the Y-axis piezoelectric drive mechanism, and the Z-axis piezoelectric drive mechanism are equipped with strain sensors.

[0019] The advantages of the high-precision three-dimensional piezoelectric nanopositioning stage provided by this invention are as follows:

[0020] The high-precision three-dimensional piezoelectric nanopositioning stage of this invention uses piezoelectric ceramics as the driving source, combined with the innovative design of a flexible hinge mechanism, and achieves ultra-high precision three-dimensional motion of the X-axis, Y-axis and Z-axis through multi-channel independent control and verification of the X-axis piezoelectric drive mechanism, Y-axis piezoelectric drive mechanism and Z-axis piezoelectric drive mechanism. It also features high resolution and fast response.

[0021] The X-axis piezoelectric drive mechanism, Y-axis piezoelectric drive mechanism, and Z-axis piezoelectric drive mechanism of this invention adopt an amplified mechanism drive and a three-in-series structure, which features a large stroke, low motion coupling, and high repeatability and positioning accuracy. The two X-axis piezoelectric drive mechanisms and two Y-axis piezoelectric drive mechanisms are arranged in a cross shape, and the four Z-axis piezoelectric drive mechanisms are arrayed between the X-axis and Y-axis piezoelectric drive mechanisms, resulting in a reasonable and compact overall structural layout.

[0022] The flexible hinge mechanism, from the inside out, comprises a first connecting part, a first flexible hinge arm, a second connecting part, a second flexible hinge arm, and a third connecting part. It features a simple and compact structure, low motion coupling, and fast response speed. The flexible hinge mechanism is integrally molded, significantly reducing the height of the mechanism series connection, enabling the miniaturization of the high-precision three-dimensional piezoelectric nanopositioning stage, and facilitating its manufacturing.

[0023] This invention can be configured in either an open-loop or closed-loop version. The closed-loop version with a strain sensor eliminates the hysteresis and creep characteristics of piezoelectric ceramics, enabling real-time position detection and feedback, and further achieving nanometer-level precision positioning control, making it ideal for high-precision positioning applications. Attached Figure Description

[0024] Figure 1 A schematic diagram of the three-dimensional structure of the high-precision three-dimensional piezoelectric nanopositioning stage provided by this invention;

[0025] Figure 2A top view of the combination of the flexible hinge mechanism, the X-axis piezoelectric drive mechanism, the Y-axis piezoelectric drive mechanism, and the Z-axis piezoelectric drive mechanism provided by the present invention;

[0026] Figure 3 The present invention provides Figure 2 A magnified view of a portion of the image;

[0027] Figure 4 A three-dimensional structural schematic diagram of the Z-axis piezoelectric drive mechanism provided by the present invention;

[0028] Figure 5 A top view of the flexible hinge mechanism provided by this invention;

[0029] In the figure: 1- Flexible hinge mechanism; 11- First connecting part; 12- Second connecting part; 121- Rectangular frame; 122- Extension end; 13- Third connecting part; 14- First flexible hinge arm; 15- Second flexible hinge arm; 2- X-axis piezoelectric drive mechanism; 3- Y-axis piezoelectric drive mechanism; 4- Z-axis piezoelectric drive mechanism; 5- Moving surface; 6- Top cover; 7- Platform; 8- Strain sensor; a- First magnifying body; b- First piezoelectric ceramic; c- Second magnifying body; d- Second piezoelectric ceramic. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0031] The implementation of the present invention will be described in detail below with reference to specific embodiments.

[0032] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this invention, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this invention. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0033] Reference Figure 1-5 The image shown is a preferred embodiment of the present invention.

[0034] The high-precision three-dimensional piezoelectric nanopositioning stage includes a movable surface 5, an upper cover 6, a stage body 7, and a bottom cover, as shown in the reference. Figure 1The upper cover 6 is located on the outer periphery of the movable surface 5. The platform 7 is located below the upper cover 6 and is connected to the upper cover 6 by screws. The bottom of the platform 7 has a groove. The bottom cover is located in the groove and is connected to the platform 7 by screws.

[0035] The movable surface 5, the upper cover 6, the platform 7, and the bottom cover form a cavity structure. Within the cavity structure are a flexible hinge mechanism 1, an X-axis piezoelectric drive mechanism 2, a Y-axis piezoelectric drive mechanism 3, and a Z-axis piezoelectric drive mechanism 4, as shown in the reference diagram. Figure 2 The X-axis piezoelectric drive mechanism 2, the Y-axis piezoelectric drive mechanism 3, and the Z-axis piezoelectric drive mechanism 4 are mounted on the flexible hinge mechanism 1. The four edges of the flexible hinge mechanism 1 are connected to the platform 7, and preferably the flexible hinge mechanism 1 and the platform 7 are integrally formed.

[0036] The X, Y, and Z axes are spatial rectangular coordinate axes. Two X-axis piezoelectric drive mechanisms 2 are arranged parallel to the Y-axis. Two Y-axis piezoelectric drive mechanisms 3 are arranged parallel to the X-axis. The two X-axis piezoelectric drive mechanisms 2 and the two Y-axis piezoelectric drive mechanisms 3 are arranged in a cross shape. Four Z-axis piezoelectric drive mechanisms 4 are evenly distributed between adjacent X-axis piezoelectric drive mechanisms 2 and Y-axis piezoelectric drive mechanisms 3. The overall layout is reasonable and simple.

[0037] A movable surface 5 is connected above the Z-axis piezoelectric drive mechanism 4. The four parallel Z-axis piezoelectric drive mechanisms 4 jointly drive the movable surface 5 to move linearly along the Z-axis. Two X-axis piezoelectric drive mechanisms 2 and two Y-axis piezoelectric drive mechanisms 3 are connected in series with the Z-axis piezoelectric drive mechanisms 4 and the movable surface 5 via a flexible hinge mechanism 1. The two X-axis piezoelectric drive mechanisms 2 jointly drive the movable surface 5 to move linearly along the X-axis. The two Y-axis piezoelectric drive mechanisms 3 jointly drive the movable surface 5 to move linearly along the Y-axis. By connecting the X-axis piezoelectric drive mechanisms 2, Y-axis piezoelectric drive mechanisms 3, and Z-axis piezoelectric drive mechanisms 4 in series via the flexible hinge mechanism 1, three-dimensional precise positioning is achieved while maintaining low motion coupling and high repeatability accuracy.

[0038] The flexible hinge mechanism 1 includes, from the inside out, a first connecting part 11, a second connecting part 12, and a third connecting part 13, as shown in the figure. Figure 5 A first flexible hinge arm 14, parallel to the Y-axis, is provided between the first connecting part 11 and the second connecting part 12. A second flexible hinge arm 15, parallel to the X-axis, is provided between the second connecting part 12 and the third connecting part 13. The first flexible hinge arm 14 and the second flexible hinge arm 15 are respectively designed as straight beam type flexible hinges. The first connecting part 11, the second connecting part 12, the third connecting part 13, the first flexible hinge arm 14, and the second flexible hinge arm 15 are integrally formed. The flexible hinge mechanism 1 has a reasonable, simple, and compact structure and is easy to manufacture.

[0039] Specifically, the fixed end of the Z-axis piezoelectric drive mechanism 4 is connected to the first connecting part 11 by bolts. The moving end of the Z-axis piezoelectric drive mechanism 4 is connected to the moving surface 5 by bolts. Preferably, the Z-axis piezoelectric drive mechanism 4 includes a second amplified body c and a second piezoelectric ceramic d disposed within the second amplified body c, as shown in Figure 1. Figure 4 The central axis of the second piezoelectric ceramic d forms an angle β with the Z-axis, where 0 < β < 90°. When a voltage is applied, the second piezoelectric ceramic d elongates, pushing the moving surface 5 to move linearly along the positive Z-axis. When the voltage is removed, the second piezoelectric ceramic d returns to its original length, pushing the moving surface 5 to move linearly along the negative Z-axis.

[0040] Example 1: The fixed end of the X-axis piezoelectric drive mechanism 2 is connected to the second connecting part 12 by bolts. The moving end of the X-axis piezoelectric drive mechanism 2 is connected to the first connecting part 11 by bolts. Preferably, the X-axis piezoelectric drive mechanism 2 includes a first amplified body a and a first piezoelectric ceramic b disposed within the first amplified body a, as shown in the figure. Figure 3 The central axis of the first piezoelectric ceramic b forms an angle α with the Y-axis, where 0 < α < 90°. When voltage is applied, the first piezoelectric ceramic b elongates, the first flexible hinge arm 14 deforms, and the first connecting part 11 moves linearly along the positive X-axis. The first connecting part 11 drives the Z-axis piezoelectric drive mechanism 4 and the moving surface 5 mounted thereon to move linearly along the positive X-axis. When the voltage is removed, the first piezoelectric ceramic b returns to its original length, pushing the first connecting part 11 to move linearly along the negative X-axis. The first connecting part 11 then drives the Z-axis piezoelectric drive mechanism 4 and the moving surface 5 to move linearly along the negative X-axis.

[0041] Example 2: The fixed end of the Y-axis piezoelectric drive mechanism 3 is connected to the third connecting part 13 by bolts. The moving end of the Y-axis piezoelectric drive mechanism 3 is connected to the second connecting part 12 by bolts. Preferably, the Y-axis piezoelectric drive mechanism 3 includes a first enlarged body a and a first piezoelectric ceramic b disposed within the first enlarged body a. The central axis of the first piezoelectric ceramic b forms an angle α with the X-axis, 0 < α < 90°. When voltage is applied, the first piezoelectric ceramic b elongates, the second flexible hinge arm 15 deforms, and the second connecting part 12 drives the first flexible hinge arm 14, the first connecting part 11, the Z-axis piezoelectric drive mechanism 4, and the moving surface 5 to move linearly along the positive Y-axis. When the voltage is removed, the first piezoelectric ceramic b returns to its length, pushing the second connecting part 12, the first flexible hinge arm 14, the first connecting part 11, the Z-axis piezoelectric drive mechanism 4, and the moving surface 5 to move linearly along the negative Y-axis.

[0042] Preferably, the first connecting portion 11 is configured in an I-shape. The second connecting portion 12 includes a rectangular frame 121 and an extension end 122 located in the middle of the rectangular frame 121. The extension end 122 extends toward the middle of the I-shape of the first connecting portion 11. This makes the overall structure layout reasonable and compact, occupying little space.

[0043] The X-axis piezoelectric drive mechanism 2, Y-axis piezoelectric drive mechanism 3, and Z-axis piezoelectric drive mechanism 4 are equipped with strain sensors 8. The strain sensors 8 provide real-time position detection and feedback, eliminating the hysteresis and creep characteristics of piezoelectric ceramics and achieving nanometer-level precision positioning control. The closed-loop version of this invention offers higher repeatability and is suitable for various high-precision applications.

[0044] This invention is not intended to limit the scope of the invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the invention should be included within the scope of protection of the invention.

Claims

1. A high-precision three-dimensional piezoelectric nanopositioning stage, characterized in that, It includes a flexible hinge mechanism (1) and an X-axis piezoelectric drive mechanism (2), a Y-axis piezoelectric drive mechanism (3) and a Z-axis piezoelectric drive mechanism (4) disposed on the flexible hinge mechanism (1). Two X-axis piezoelectric drive mechanisms (2) are arranged parallel to the Y-axis, and two Y-axis piezoelectric drive mechanisms (3) are arranged parallel to the X-axis. The two X-axis piezoelectric drive mechanisms (2) and the two Y-axis piezoelectric drive mechanisms (3) are arranged in a cross shape. Four Z-axis piezoelectric drive mechanisms (4) are arrayed between the X-axis piezoelectric drive mechanisms (2) and the Y-axis piezoelectric drive mechanisms (3). A moving surface (5) is connected above the Z-axis piezoelectric drive mechanism (4), and the four Z-axis piezoelectric drive mechanisms (4) jointly drive the moving surface (5) to move linearly along the Z-axis. Two X-axis piezoelectric drive mechanisms (2) and two Y-axis piezoelectric drive mechanisms (3) are connected in series with the Z-axis piezoelectric drive mechanism (4) and the moving surface (5) through a flexible hinge mechanism (1). The X-axis piezoelectric drive mechanism (2) and the Y-axis piezoelectric drive mechanism (3) respectively drive the moving surface (5) to move linearly along the X-axis and Y-axis.

2. The high-precision three-dimensional piezoelectric nanopositioning stage according to claim 1, characterized in that, The flexible hinge mechanism (1) includes a first connecting part (11), a second connecting part (12) and a third connecting part (13) from the inside out; a first flexible hinge arm (14) parallel to the Y axis is provided between the first connecting part (11) and the second connecting part (12), and a second flexible hinge arm (15) parallel to the X axis is provided between the second connecting part (12) and the third connecting part (13). The fixed end of the Z-axis piezoelectric drive mechanism (4) is connected to the first connecting part (11), and the moving end of the Z-axis piezoelectric drive mechanism (4) is connected to the moving surface (5); the fixed end of the X-axis piezoelectric drive mechanism (2) is connected to the second connecting part (12), and the moving end of the X-axis piezoelectric drive mechanism (2) is connected to the first connecting part (11); the fixed end of the Y-axis piezoelectric drive mechanism (3) is connected to the third connecting part (13), and the moving end of the Y-axis piezoelectric drive mechanism (3) is connected to the second connecting part (12).

3. The high-precision three-dimensional piezoelectric nanopositioning stage according to claim 1, characterized in that, The first flexible hinge arm (14) and the second flexible hinge arm (15) are both straight beam type flexible hinges.

4. The high-precision three-dimensional piezoelectric nanopositioning stage according to claim 1, characterized in that, The first connecting part (11) is configured as an I-shaped part.

5. The high-precision three-dimensional piezoelectric nanopositioning stage according to claim 4, characterized in that, The second connecting part (12) includes a rectangular frame (121) and an extension end (122) located in the middle of the rectangular frame (121), the extension end (122) extending toward the first connecting part (11).

6. The high-precision three-dimensional piezoelectric nanopositioning stage according to claim 1, characterized in that, The X-axis piezoelectric drive mechanism (2) includes a first amplified body (a) and a first piezoelectric ceramic (b) disposed in the first amplified body (a). The central axis of the first piezoelectric ceramic (b) forms an angle α with the Y-axis, where 0 < α < 90°.

7. The high-precision three-dimensional piezoelectric nanopositioning stage according to claim 1, characterized in that, The Y-axis piezoelectric drive mechanism (3) includes a first amplified body (a) and a first piezoelectric ceramic (b) disposed in the first amplified body (a). The central axis of the first piezoelectric ceramic (b) forms an angle α with the X-axis, where 0 < α < 90°.

8. The high-precision three-dimensional piezoelectric nanopositioning stage according to claim 1, characterized in that, The Z-axis piezoelectric drive mechanism (4) includes a second amplified body (c) and a second piezoelectric ceramic (d) disposed in the second amplified body (c). The central axis of the second piezoelectric ceramic (d) forms an angle β with the Z-axis, where 0 < β < 90°.

9. The high-precision three-dimensional piezoelectric nanopositioning stage according to claim 1, characterized in that, The outer periphery of the movable surface (5) is provided with an upper cover (6), and a platform (7) is connected below the upper cover (6). The four edges of the flexible hinge mechanism (1) are connected to the platform (7), and the bottom of the platform (7) is provided with a bottom cover.

10. The high-precision three-dimensional piezoelectric nanopositioning stage according to claim 1, characterized in that, The X-axis piezoelectric drive mechanism (2), the Y-axis piezoelectric drive mechanism (3) and the Z-axis piezoelectric drive mechanism (4) are equipped with strain sensors (8).

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