Non-linear expansion and contraction abnormal coefficient compensation method for high-level PCB and PCB

CN121126705AActive Publication Date: 2025-12-12GUANGZHOU TERMBRAY ELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202511395151.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-28
Publication Date
2025-12-12
Estimated Expiration
2045-09-28

AI Technical Summary

Technical Problem

In traditional PCB manufacturing, the nonlinear expansion and contraction anomalies of high-layer and multi-layer boards cannot be accurately compensated for to the hole position accuracy of each layer through a unified linear compensation method, resulting in low alignment accuracy and affecting electrical performance reliability.

Method used

A non-linear jigsaw puzzle design is adopted, which modifies the non-linear expansion and contraction model into a linear expansion and contraction model. Through multiple measurements and baking, the expansion and contraction coefficient is adjusted multiple times. Combined with the LDI positioning hole drilling process, the dimensional stability and hole position accuracy of the core board are improved.

Benefits of technology

It improves the hole position accuracy and electrical performance reliability of PCB boards, ensures precise alignment of circuits on each layer, reduces hole position errors after lamination, and improves production yield.

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Abstract

The invention relates to the field of PCBs (printed circuit boards), in particular to a nonlinear expansion and contraction abnormal coefficient compensation method for a high-level PCB, which comprises the following steps of: adding a step S0 before an original step S1, and revising nonlinear expansion and contraction into a linear expansion and contraction model by adopting a nonlinear puzzle design; a step S34 is added between the original steps S3 and S4, first measurement is carried out on each layer of core board, the steps S2 and S3 are repeated, and S4 is continued; and a step S45 is added between the original steps S4 and S5, second measurement is carried out on each layer of core board, the steps S2-S4 are repeated, and S5 is continued. Through the non-linear jigsaw design, the non-linear expansion and contraction of the core board are revised into linear expansion and contraction, the size stability of the PCB is improved through multiple times of baking, and it is guaranteed that the subsequent expansion and contraction are not too large. The expansion and shrinkage coefficient is measured for multiple times, the expansion and shrinkage performance of each layer of core board can be continuously corrected, so that each layer of core board can obtain special expansion and shrinkage compensation according to the design copper thickness requirement, the core boards with irregular graphic design are compensated to be consistent, and the precision of hole sites is improved.
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Citation Information

Patent Citations

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    CN106413292A

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    CN106852030A

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    CN115135008A

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