Photovoltaic module, manufacturing method of photovoltaic module, heterogeneous adhesive film and manufacturing system of heterogeneous adhesive film

Abstract

The invention discloses a photovoltaic module, a manufacturing method of the photovoltaic module, a heterogeneous adhesive film and a manufacturing system of the heterogeneous adhesive film, and relates to the technical field of the photovoltaic industry. The heterogeneous adhesive film is used for a back contact battery and comprises an adhesive film and a welding strip, the welding strip is embedded in one side of the adhesive film, partially protrudes out of the side surface of the adhesive film, and is broken according to a preset rule. According to the heterogeneous adhesive film, the welding strip is embedded in the adhesive film to form an integrated structure, one end, exposed out of the adhesive film, of the welding strip is used for being connected with a back contact battery, the welding strip in the heterogeneous adhesive film is broken according to a preset rule, and specifically, the welding strip can be broken after the welding strip is embedded in the adhesive film; the formed short solder strips can be matched with the design of interdigital grid lines on the back of battery pieces of the back contact batteries, at the moment, when the short solder strips are applied to a photovoltaic module, in the machining process, the adhesive film and all the short solder strips can be arranged on the corresponding back contact batteries at a time, the machining and positioning steps can be reduced, the positioning difficulty is lowered, and the production efficiency is improved. And the processing efficiency of the photovoltaic module is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of photovoltaic industry, in particular to a photovoltaic module and a manufacturing method thereof, a heterogeneous adhesive film and a manufacturing system thereof. BACKGROUND

[0002] The back contact technology of photovoltaic module, referred to as XBC technology, is one of the most technically advanced technologies in the current photovoltaic industry. With the advantages of high color value, high conversion efficiency, low cost space, etc., it is more and more concerned and favored by the market.

[0003] The XBC module is currently completed by using traditional hot infrared welding technology. The grid lines of the XBC cell are all designed on the back of the cell. In the manufacturing process, the welding strip is first segmented to form different short welding strips. Each short welding strip is placed on the back of the corresponding cell by a clamp and positioned, and then infrared welding is performed. After welding, the adhesive film is connected.

[0004] Because the welding strip needs to be segmented and arranged on the cell and positioned respectively in the manufacturing process, the operation steps are many, and the positioning difficulty is great, which seriously affects the processing efficiency.

[0005] Therefore, how to improve the processing efficiency of the photovoltaic module is a technical problem to be solved by those skilled in the art at present. SUMMARY

[0006] Therefore, the purpose of the present application is to provide a heterogeneous adhesive film for back contact cells and a manufacturing system thereof, a photovoltaic module and a manufacturing method thereof, which can improve the processing efficiency of the photovoltaic module.

[0007] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0008] A heterogeneous adhesive film for back contact cells, comprising an adhesive film and a welding strip; the welding strip is embedded in one side of the adhesive film and part of the welding strip protrudes from the surface of the side of the adhesive film, and the welding strip is disconnected according to a predetermined rule.

[0009] Preferably, the part of the welding strip embedded in the adhesive film is provided with a retreat stop structure to be clamped with the adhesive film.

[0010] Preferably, in the thickness direction of the adhesive film, the size of the adhesive film is greater than the size of the welding strip.

[0011] A photovoltaic module comprising the above-mentioned heterogeneous adhesive film and a plurality of back contact cells, the heterogeneous adhesive film is arranged on the back of at least two adjacent back contact cells and used to connect the corresponding back contact cells in series; the disconnection position of the welding strip disconnected according to the predetermined rule corresponds to the connection position of the adjacent back contact cells.

[0012] A manufacturing method of a photovoltaic module, comprising:

[0013] stacking the adhesive film and the solder ribbon, and pressing to form a composite adhesive film, wherein in the composite adhesive film, the solder ribbon is partially embedded in the adhesive film along the direction of the pressing, and the remaining part protrudes from the adhesive film;

[0014] punching the composite adhesive film to disconnect the solder ribbon according to a preset rule, thereby forming a heterogeneous adhesive film;

[0015] after forming the heterogeneous adhesive film, covering and connecting the heterogeneous adhesive film to the back surface of the back contact battery;

[0016] wherein the solder ribbon in the heterogeneous adhesive film is in surface contact with the back contact battery to electrically connect.

[0017] Preferably, the covering and connecting includes heating and pressing.

[0018] A manufacturing system for a heterogeneous adhesive film of a back contact battery, comprising a composite mechanism and a punching mechanism, the composite mechanism comprising a support platform and a pressing mechanism arranged above the support platform, the pressing mechanism and the punching mechanism being arranged in a preset direction in sequence;

[0019] the support platform is used to support the adhesive film and the solder ribbon, and the adhesive film is stacked on the solder ribbon;

[0020] the pressing mechanism is used to press the adhesive film after the adhesive film is stacked on the solder ribbon, so that the top of the solder ribbon is embedded in the adhesive film, and the bottom of the solder ribbon protrudes below the adhesive film, to form a composite adhesive film;

[0021] the punching mechanism is used to punch the composite adhesive film to disconnect the solder ribbon according to a preset rule, thereby forming a heterogeneous adhesive film.

[0022] Preferably, a guide groove extending along the preset direction is arranged on the top surface of the support platform, and the bottom end of the solder ribbon is accommodated in the guide groove.

[0023] after forming the composite adhesive film, the part of the solder ribbon located in the guide groove remains below the adhesive film.

[0024] Preferably, the pressing mechanism comprises a plurality of pressing rollers arranged in sequence along the preset direction; the adhesive film and the solder ribbon move below the pressing rollers along the preset direction, and the distance between each pressing roller and the support platform gradually decreases along the direction of the movement of the adhesive film and the solder ribbon.

[0025] Preferably, it further comprises a solder ribbon feeding mechanism, an adhesive film feeding mechanism and a winding mechanism.

[0026] The welding strip feeding mechanism and the adhesive film feeding mechanism are arranged close to one end of the pressing mechanism in the arrangement direction of the punching mechanism, and the winding mechanism is arranged close to the other end of the punching mechanism.

[0027] The application provides a heterogeneous adhesive film for a back contact cell, which comprises an adhesive film and a welding strip.

[0028] In the heterogeneous adhesive film, the welding strip is embedded in the adhesive film to form an integrated structure, one end of the welding strip exposed from the adhesive film is used for connecting the back contact cell, and the welding strip in the heterogeneous adhesive film is disconnected according to a preset rule.

[0029] In addition, when connected with the back contact cell, in a preferred scheme, the welding strip does not need to be welded to the cell sheet, and the heterogeneous adhesive film is directly connected to the cell sheet by heating and pressing, at this time, the welding strip is clamped between the adhesive film and the cell sheet.

[0030] In the application of the traditional welding process, the welding temperature is usually as high as 200-300 DEG C, and when the alloyed welding point cools and shrinks, the stress on the back surface of the cell sheet is large, and various product and manufacturing problems often occur. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only embodiments of the application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of the provided drawings.

[0032] Figure 1 The schematic diagram of the first embodiment of the heterogeneous adhesive film provided by the application;

[0033] Figure 2 The partial enlarged view of Figure 1

[0034] Figure 3 ​A sectional view of a specific embodiment of the heterogeneous adhesive film provided by the present application;

[0035] Figure 4 A partial enlarged view of Figure 3 ;

[0036] Figure 5 A schematic view of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application;

[0037] Figure 6 A front view of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application.

[0038] Figure 7 A schematic view of a composite mechanism and a hole forming mechanism of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application;

[0039] Figure 8 A top view of a composite mechanism and a hole forming mechanism of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application;

[0040] Figure 9 A side view of a composite mechanism and a hole forming mechanism of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application;

[0041] Figure 10 A front view of a composite mechanism and a hole forming mechanism of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application;

[0042] Figure 11 A schematic view of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application when the lower pressing mechanism presses the adhesive film and the solder strip;

[0043] Figure 12 A schematic view of a support platform of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application;

[0044] Figure 13 A bottom view of a support platform of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application;

[0045] Figure 14 A side view of a hole forming mechanism of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application;

[0046] Figure 15 A schematic view of a partial structure of a support platform of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application;

[0047] Figure 16 A bottom view of a feeding part of a specific embodiment of the heterogeneous adhesive film manufacturing system provided by the present application;

[0048] Figure 17The schematic view of the feeding part of the isomeric adhesive film manufacturing system according to embodiment one of the present application is shown in the figure.

[0049] Figure 18 The schematic view of the winding mechanism of the isomeric adhesive film manufacturing system according to embodiment one of the present application is shown in the figure.

[0050] Reference signs:

[0051] Adhesive film 1

[0052] Solder strip 2, retreat groove 21, first butt joint surface 211, second butt joint surface 212

[0053] Compound mechanism 3, pressing mechanism 31, pressing roller 311, support platform 32, guide groove 321, bottom through hole 322, extension groove 323

[0054] Hole opening mechanism 4, punching driver 41, mounting plate 42, punch 43, punching bracket 44

[0055] Solder strip feeding mechanism 5

[0056] Adhesive film feeding mechanism 6

[0057] Winding mechanism 7, winding driver 71, winding bracket 72, winding roller 73

[0058] Second guide wheel 8

[0059] Isomeric adhesive film 9

[0060] First guide wheel 10

[0061] Mechanism frame 11 DETAILED DESCRIPTION

[0062] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0063] The core of the present application is to provide a photovoltaic module and a manufacturing method thereof, and an isomeric adhesive film for a back contact cell and a manufacturing system thereof, which can reduce the damage risk of the cell piece.

[0064] The manufacturing method of the photovoltaic module according to embodiment one of the present application comprises the following steps.

[0065] S1: Stack the adhesive film 1 and the solder strip 2, and press to form a compound adhesive film.

[0066] Specifically, the solder strip 2 is placed on the lower layer, and after the adhesive film 1 is stacked on the solder strip 2, the adhesive film 1 is pressed to form a composite adhesive film. In the composite adhesive film, the solder strip 2 is partially embedded in the adhesive film 1 along the pressing direction, and the remaining part protrudes from the adhesive film 1 to connect the back contact battery through the protruding part.

[0067] Specifically, the adhesive film 1 is a conventional photovoltaic packaging adhesive film (EVA, POE, EPE) particle material, which is manufactured by using a conventional processing method. The width of the adhesive film 1 is consistent with the required width of the adhesive film 1 of the battery piece. The battery piece is specifically a back contact battery.

[0068] Specifically, the composition of the solder strip 2 uses a conventional photovoltaic solder wire, and copper is used as the base material, and the outside is wrapped with metal components such as tin, lead, and bismuth.

[0069] Specifically, as shown in Figure 3 the top of the solder strip 2 penetrates into the adhesive film 1 and is embedded and fixed in the adhesive film 1, at which time the solder strip 2 and the adhesive film 1 are mechanically deformed to achieve connection. In addition, the bottom surface of the solder strip 2 is exposed to the adhesive film 1 to ensure contact with the battery piece.

[0070] In order to ensure the reliability of the connection between the adhesive film 1 and the solder strip 2, a retreat stop structure is provided on the solder strip 2 to form a clamping connection with the adhesive film 1 after being embedded in the adhesive film 1, and to form a limit in the embedding direction to avoid being pulled out in the opposite direction of the embedding direction. In this embodiment, the solder strip 2 is embedded upward into the adhesive film 1, and the retreat stop structure prevents the solder strip 2 from being pulled out downward from the adhesive film 1. The retreat stop structure can be a retreat tooth or a retreat groove.

[0071] Specifically, as shown in Figure 4 the retreat stop structure includes a retreat groove 21 provided on the side surface of the solder strip 2, at which time in the composite adhesive film: the adhesive film 1 is embedded in the retreat groove 21 and forms a clamping connection to prevent the solder strip 2 from being pulled out downward from the adhesive film 1 in the composite adhesive film. Specifically, on the solder strip 2, retreat grooves 21 are provided on both side surfaces in the extension direction (corresponding to Figure 3 the upper and lower sides in the orientation shown in the figure, and corresponding to Figure 4 the left and right sides in the orientation shown in the figure), and on the solder strip 2 in the upward and downward direction, each side surface can only have one retreat groove 21, or multiple retreat grooves 21. In addition, the retreat groove 21 can be an angular groove with two abutting surfaces, the upper first abutting surface 211 is perpendicular to the upward and downward direction to ensure the anti-pulling-out effect, and the lower second abutting surface 212 is an inclined surface relative to the upward and downward direction, and gradually moves away from the center position of the extension direction of the solder point 2 from top to bottom, having a guiding effect; or the first abutting surface 211 can also be provided as an inclined surface relative to the upward and downward direction, and gradually moves away from the center position of the extension direction of the solder point 2 from top to bottom; of course, in other embodiments, the retreat groove 21 can also be a circular arc groove, a trapezoidal groove, etc.; or in other embodiments, the side surface of the solder strip 2 can also be a flat surface without the retreat groove 21.

[0072] Specifically, such as Figure 4 As shown, the welding strip 2 (also known as welding wire) adopts a triangular welding strip. In S1, the top of the welding strip 2 is one of its apex angles, which has a guiding effect and makes it easier for the welding strip 2 to be pressed into the upper adhesive film 1.

[0073] Among them, the triangular weld strip refers to the weld strip 2 extending along its direction (corresponding to...). Figure 2 as well as Figure 6 The centerline (in the left-right direction shown in the diagram) includes three surfaces connected end-to-end, with an angle greater than 0 between each pair of adjacent surfaces, thus forming a triangular base structure. Its cross-section perpendicular to the extension direction is approximately triangular. Two surfaces of the triangular weld strip are the side surfaces of weld strip 2, i.e., the two surfaces forming the apex. The remaining surface opposite the apex is the bottom surface of weld strip 2. Anti-reverse grooves 21 can be provided on the two side surfaces of the triangular weld strip.

[0074] Specifically, in the composite adhesive film, the bottom end of the solder strip 2 remains below the adhesive film 1. At this time, as... Figure 4 As shown, the solder ribbon with anti-reverse groove 21 extends upward into the adhesive film 1, with the bottom surface of the solder ribbon exposed to the outside. The two sides of the solder ribbon 2 are in contact with the adhesive film 1, and the adhesive film 1 forms a semi-enclosed state for the solder ribbon 2, which can ensure that the solder ribbon 2 can contact the solar cell. In the photovoltaic module, the solder ribbon 2 is located between the solar cell and the adhesive film 1. The part of the solder ribbon 2 that is not enclosed by the adhesive film 1 can effectively contact the main grid line of the solar cell, ensuring the current conduction effect.

[0075] Specifically, to facilitate material selection, in the thickness direction of film 1 (corresponding to...) Figure 3 , 4 In the vertical direction (as shown in the image), the size of the adhesive film 1 is larger than the size of the solder ribbon 2. For the solder ribbon 2, this dimension in this direction can also be directly referred to as the thickness of the solder ribbon 2. In addition, this thickness direction also corresponds to the direction in which the adhesive film 1 and the solder ribbon 2 are pressed and interlocked to form an integral structure. This selection can avoid the adhesive film 1 being too thin and easily penetrated by the solder ribbon 2 during the pressing process. Regarding the embedding depth, specifically, half the thickness of the solder ribbon 2 can be embedded in the adhesive film 1. Of course, the thickness of the solder ribbon 2 embedded in the adhesive film 1 can also be greater than half the thickness of the solder ribbon 2 to ensure the reliability of the interlocking. Of course, in other embodiments, the thickness of the adhesive film 1 can also be equal to or less than the thickness of the solder ribbon 2. When the thicknesses are the same, half the thickness of the solder ribbon 2 can be embedded at half the thickness of the adhesive film 1. In addition, the number of solder ribbons 2 connected to one adhesive film 1 and the arrangement of these solder ribbons 2 can be set according to the actual needs of the battery cell. For example, there can be multiple solder ribbons 2, and each solder ribbon 2 can be arranged in parallel and evenly.

[0076] S2: Perforate the composite adhesive film to break the solder strip 2 according to the preset rules, thereby forming a heterogeneous adhesive film 9.

[0077] It should be noted that in the definition of the present embodiment, after the pressure bonding of the adhesive film 1 and the solder strip 2, a composite adhesive film is formed before punching, and after further punching, a heterogeneous adhesive film is formed.

[0078] As shown in Figure 1 and Figure 2 , the heterogeneous adhesive film 9 is applied to the BC (back contact cell) battery to realize the series connection between the back contact cells. The preset rule can be set according to the need of the interdigital arrangement between the solder strips of the BC battery, and corresponds to the position of the connection between the adjacent back contact cells. The opening mechanism 4 is arranged at a specific position, and the composite adhesive film moves along its extension direction (consistent with the extension direction of the adhesive film 1 and the solder strip 2 before and after the composite adhesive film is formed) to the lower side of the opening mechanism 4, and the composite adhesive film is periodically punched, such as the hole A in Figure 1 and Figure 2 , so that the entire solder strip 2 is divided into multiple equal-length discontinuous short solder strips, thereby realizing the composite and intermittent design of the adhesive film 1 and the solder strip 2.

[0079] Among them, when punching, the solder strip 2 and the adhesive film 1 in the composite adhesive film can be integrally punched, that is, the adhesive film 1 and the solder strip 2 are punched through, to ensure that the solder strip 2 is disconnected, and when the heterogeneous adhesive film 9 is connected to the cell sheet, the hole in the adhesive film 1 in the heterogeneous adhesive film 9 can be sealed due to the fusion of the surrounding adhesive film 1 during the lamination and heating process.

[0080] The manufacturing method of the photovoltaic module in the present embodiment first generates a heterogeneous adhesive film 9, wherein the top of the solder strip 2 is embedded in the adhesive film 1 to form an integrated structure, and the heterogeneous adhesive film 9 breaks the solder strip 2 by punching. When connected to the cell sheet, the solder strip 2 is clamped between the adhesive film 1 and the cell sheet, without the need to weld the solder strip 2 to the cell sheet, but directly laminating the adhesive film 1 to the cell sheet. The end of the solder strip 2 exposed to the adhesive film 1 contacts the cell sheet to form an electrical connection, which can avoid the problem of cell sheet warping and fragmentation caused by welding, and reduce the risk of damage to the cell sheet.

[0081] S3: After forming the heterogeneous adhesive film 9, the heterogeneous adhesive film 9 is connected to the back surface of the back contact cell.

[0082] Among them, the solder strip 2 in the heterogeneous adhesive film 9 is clamped and fixed between the cell sheet and the adhesive film 1 in the heterogeneous adhesive film 9, and the solder strip 2 in the heterogeneous adhesive film 9 contacts the surface of the back contact cell to form an electrical connection.

[0083] Among them, the connection of the heterogeneous adhesive film 9 to the back contact cell includes heating and pressing, which can be preheated first, and then pressed at a suitable temperature. The temperature during pressing can be kept the same as that of traditional lamination, which can be about 150 degrees. The solder strip 2 and the back contact cell are no longer welded, but directly fixed and connected through lamination.

[0084] The short solder strip formed after the solder strip 2 is punched is matched with the design of the back interdigital grid line of the back of the battery piece.

[0085] In the embodiment, the solder strip 2 is embedded in the isomerized adhesive film 1 to form an integrated structure, and the solder strip 2 in the isomerized adhesive film is disconnected according to a preset rule, and the short solder strip formed is matched with the design of the back interdigital grid line of the back of the back contact battery. When the back contact battery is further connected, the adhesive film 1 and all the short solder strips can be arranged on the corresponding back contact battery at one time, which can reduce the processing and positioning steps, reduce the positioning difficulty, and improve the processing efficiency of the photovoltaic module.

[0086] In addition, the application also provides an isomerized adhesive film for a back contact battery, which can be manufactured by S1 and S2 in the above-mentioned manufacturing method of the photovoltaic battery, and the specific structure can also refer to the isomerized adhesive film mentioned in the above-mentioned embodiments.

[0087] Specifically, the isomerized adhesive film includes an adhesive film 1 and a solder strip 2. The solder strip 2 is embedded in one side of the adhesive film 1, and the solder strip part protrudes from the surface of the side of the adhesive film 1. The protruding part is used to connect the back contact battery. Specifically, the adhesive film 1 is stacked on the solder strip 2 and is integrated with the solder strip 2. The solder strip 2 is disconnected according to a preset rule, and is matched with the design requirement of the interdigital of the back contact battery.

[0088] The part of the solder strip 2 embedded in the adhesive film 1 is provided with a retreat-stop structure to be clamped with the adhesive film 1, and has an anti-disengagement effect.

[0089] The thickness of the adhesive film 1 and the thickness of the solder strip 2 can be set to be the same.

[0090] In such an isomerized adhesive film, the solder strip 2 is embedded in the adhesive film 1 to form an integrated structure, and the solder strip 2 in the isomerized adhesive film 1 is disconnected according to a preset rule, and the short solder strip formed can be matched with the design of the back interdigital grid line of the back of the back contact battery. When connected with the battery piece, the solder strip 2 does not need to be welded to the battery piece, but can be directly laminated and connected to the battery piece. At this time, the solder strip 2 is clamped between the adhesive film 1 and the battery piece, which can avoid the problem of broken pieces caused by the warping of the battery piece after welding, and reduce the damage risk of the battery piece.

[0091] In addition, the application also provides a photovoltaic module, which can be manufactured by the above-mentioned manufacturing method of the photovoltaic module, or includes the isomerized adhesive film provided in the above-mentioned embodiments.

[0092] Specifically, in the photovoltaic module, the isomerized adhesive film and a plurality of back contact batteries are included, the isomerized adhesive film is arranged on the back of at least two adjacent back contact batteries and is used to connect the corresponding back contact batteries in series. The disconnected position of the solder strip 2 disconnected according to a preset rule corresponds to the connection of the adjacent back contact batteries, so as to meet the design requirement of the interdigital grid line of the battery.

[0093] In addition, besides the heterogeneous adhesive film for back contact cells, the photovoltaic module and the manufacturing method thereof, the application further provides a manufacturing system of the heterogeneous adhesive film for back contact cells, which can be applied to the manufacturing system of the heterogeneous adhesive film for back contact cells and the manufacturing method of the photovoltaic module.

[0094] As shown in Figures 5 to 18 The manufacturing system of the heterogeneous adhesive film comprises a mechanism frame 11, a feeding mechanism, a compounding mechanism 3, a punching mechanism 4 and a winding mechanism 7. The feeding mechanism comprises a solder strip feeding mechanism 5 and an adhesive film feeding mechanism 6.

[0095] As shown in Figure 5 and Figure 6 The compounding mechanism 3 comprises a support platform 32 and a pressing mechanism 31 arranged above the support platform 32, and the pressing mechanism 31 and the punching mechanism 4 are sequentially arranged in a preset direction. The support platform 32 is fixedly arranged on the mechanism frame 11 and is supported by the mechanism frame 11.

[0096] Specifically, the mechanism frame 11 is made of aluminum alloy, which provides a mounting platform for other components and reserves various mounting holes thereon to ensure that the components are firmly mounted on the mechanism frame 11.

[0097] Specifically, the support platform 32 is made of metal and provides a work platform for the compounding of the solder strip 2 and the adhesive film 1 and the generation of the heterogeneous adhesive film 9. During the manufacturing process, the support platform 32 supports the adhesive film 1 and the solder strip 2, and the adhesive film 1 is stacked on the solder strip 2.

[0098] Specifically, the pressing mechanism 31 is used to press the adhesive film 1 after the adhesive film 1 is stacked on the solder strip 2 to form a compounded adhesive film. At this time, under the action of pressure, the solder strip 2 is embedded in the adhesive film 1 at the top of the compounded adhesive film to realize integration, and the bottom of the solder strip 2 protrudes below the adhesive film 1 for connecting the back contact cells.

[0099] The solder strip 2 has a stop groove 21 on the side surface. In the compounded adhesive film, the adhesive film 1 is embedded in the stop groove 21 and forms a clamping connection, and the bottom surface of the solder strip 2 is exposed to the adhesive film 1. In the heterogeneous adhesive film 9, the part of the solder strip 2 exposed or protruding from the adhesive film 1 can effectively contact the main grid line of the cell sheet to ensure the current conduction effect.

[0100] Specifically, the punching mechanism 4 is used to punch the compounded adhesive film to disconnect the solder strip 2 according to a preset rule, thereby forming the heterogeneous adhesive film 9.

[0101] In this heterogeneous adhesive film manufacturing system for back-contact batteries, a heterogeneous adhesive film 9 can be generated through the processing of the composite mechanism 3 and the perforation mechanism 4. The top of the solder ribbon 2 is embedded in the adhesive film 1 to form an integral structure. The heterogeneous adhesive film 9 breaks the solder ribbon 2 by perforation. Therefore, when connecting with the battery cell, there is no need to weld the solder ribbon 2 to the battery cell. The adhesive film 1 can be directly laminated and connected to the battery cell. At this time, the solder ribbon 2 is sandwiched between the adhesive film 1 and the battery cell. The end of the solder ribbon 2 exposed in the adhesive film 1 contacts the battery cell for electrical connection. This can avoid the problem of battery cell warping and fragmentation caused by welding and reduce the risk of damage to the battery cell.

[0102] On support platform 32, such as Figures 11 to 13 As shown, a guide groove 321 extending in a preset direction is provided on the top surface of the support platform 32. The guide groove 321 is a straight groove, and the bottom end of the welding strip 2 is accommodated in the guide groove 321.

[0103] It should be noted that the preset direction is the same as the extension direction and movement direction of the heterogeneous adhesive film 9, the composite adhesive film, and the solder strip 2 and adhesive film 1 before and after forming the heterogeneous adhesive film 9 and the composite adhesive film.

[0104] like Figure 11 As shown, the concave guide groove 321 can accommodate the bottom of the solder ribbon 2. Therefore, during the manufacturing process, after the composite adhesive film is formed, the portion of the solder ribbon 2 located in the guide groove 321 can remain below the adhesive film 1, while the remaining portion of the solder ribbon 2 protrudes above the guide groove 321. The solder ribbon 2 can move linearly within the guide groove 321 to prevent displacement and ensure that the solder ribbon 2 is vertical enough to enter the adhesive film 1. Simultaneously, it ensures that the bottom of the solder ribbon 2, during the bonding process between the solder ribbon 2 and the adhesive film 1, is not completely enclosed by the adhesive film 1 but can be exposed outside the adhesive film 1. This ensures that when connecting the solar cells in the future, the bottom of the solder ribbon 2 can form an ohmic contact with the main grid lines of the solar cells.

[0105] Specifically, the welding strip 2 passes through the guide groove 321 at its first end in a preset direction (corresponding to...). Figure 8 The left end of the guide groove 321 is inserted into the guide groove 321. An extension groove 323 is also provided on the end face of the support platform 32 near the first end of the guide groove 321 in a preset direction. The first end of the guide groove 321 is connected to and intersects with the extension groove 323, so that during feeding, part of the welding strip 2 can enter the extension groove 323 for positioning, and then enter the guide groove 321 again through the extension groove 323, improving the stability of the welding strip 2 feeding. Additionally, as... Figure 13 As shown, the extension groove 323 also extends to the bottom surface of the support platform 32. Specifically, it extends along a preset direction on the bottom surface of the support platform 32 and is located near the end of the support platform 32 where the welding strip 2 enters the guide groove 321.

[0106] Specifically, the number of guide grooves 321 can be set according to the number of solder strips 2 that the adhesive film 1 needs to be connected, and a plurality of guide grooves 321 are arranged along a direction perpendicular to the preset direction, for example, 10 guide grooves 321.

[0107] In the pressing mechanism, as shown in Figures 6 to 10 , the pressing mechanism 31 includes a plurality of pressing rollers 311 arranged in sequence along the preset direction.

[0108] Specifically, as shown in Figure 10 , the adhesive film 1 and the solder strip 2 move below the pressing rollers 311 along the preset direction, and the spacing between each pressing roller 311 and the support platform 32 gradually decreases along the direction in which the adhesive film 1 and the solder strip 2 advance, so that each pressing roller 311 gradually increases the pressing degree on the adhesive film 1 and the solder strip 2 as the adhesive film 1 and the solder strip 2 advance.

[0109] Among them, the bottom of each pressing roller 311 can be tangent to a set surface at the same time, and the set surface and the top surface of the support platform 32 form an included angle, and when the direction in which the adhesive film 1 and the solder strip 2 move from back to front is taken as the front and back reference, the included angle opens to the back, so that Figure 10 in the right direction, the right side is the front, and the included angle opens to the left, so that each pressing roller 311 gradually increases the pressing degree on the adhesive film 1 and the solder strip 2 as the adhesive film 1 and the solder strip 2 advance, ensuring that the solder strip 2 can be gradually and effectively embedded inside the adhesive film 1.

[0110] Among them, the spacing between the pressing roller 311 and the support platform 32 can be set according to the pressing needs, for example, the first pressing roller 311 is 5mm away from the support platform 32 in height, and the last one is only 2mm away.

[0111] Among them, the pressing roller 311 is made of stainless steel. The pressing roller 311 is rotatably connected to a pressing roller shaft, and the pressing roller shaft is supported and fixed above the support platform 32 by a pressing roller support.

[0112] In the opening mechanism 4, as shown in Figures 8 to 15 , the opening mechanism 4 is arranged above the support platform 32, the bottom of the opening mechanism 4 is provided with a punch 43, and a bottom through hole 322 is arranged through the support platform 32. The punch 43 can punch holes in the composite adhesive film and extend into the bottom through hole 322. The punch 43 penetrates the composite adhesive film to break the solder strip 2 in the composite adhesive film 1 at the corresponding position, and the bottom through hole 322 cooperates with the punch 43 to form a shearing force to ensure that the solder strip 2 is broken. Since the welding of adjacent battery sheets of the BC battery is grid line interdigital interlaced welding, periodic punching is achieved by the opening mechanism 4 in a mechanical punching mode, and continuous solder strip 2 is periodically broken, which can meet the design requirements of the battery interdigital.

[0113] The opening mechanism 4 comprises a punching driver 41, a mounting plate 42, a punch 43, and a punching support 44. The punching support 44 is fixed above the support platform 32, the punching driver 41 is connected to the punching support 44, the bottom end of the punching driver 41 is connected to the mounting plate 42, the punch 43 is fixed below the mounting plate 42, and the punching driver 41 drives the punch 4 to move up and down. The punching driver 41 is specifically a pneumatic cylinder, a hydraulic cylinder, a motor, etc.

[0114] Of course, in other embodiments, the opening mechanism 4 can also use laser cutting and the like. In addition, the opening mechanism 4 can also directly punch the solder strip side after the composite adhesive film leaves the support platform 32, instead of punching through the adhesive film side.

[0115] In the solder strip feeding mechanism 5 and the adhesive film feeding mechanism 6, as shown in Figure 16 and Figure 17 , the solder strip feeding mechanism 5 can be arranged below the adhesive film feeding mechanism 6 and located on the same side of the support platform 32 in a preset direction, for simultaneously feeding the adhesive film 1 and the solder strip 2 to the support platform 32, as shown in Figure 17 , after entering the support platform 32, the solder strip 2 and the adhesive film 1 are in close proximity, waiting for the pressing roller 311 to press the solder strip 2 and the adhesive film 1 together.

[0116] Specifically, the solder strip feeding mechanism 5 is an independent feeding platform, comprising a plurality of placement racks, on which the solder strip 2 is placed in sequence according to design requirements, and the solder strip feeding mechanism 5 is connected to the mechanism frame 11 through a connecting support.

[0117] Specifically, the adhesive film feeding mechanism 6 is integrated on the adhesive film production line, ensuring that the adhesive film 1 that has not completely cooled and hardened is extruded from the film head and participates in the heterogeneous adhesive film manufacturing process, so that the adhesive film feeding mechanism 6 can directly use the film head extrusion mechanism of the traditional adhesive film production line.

[0118] In the winding mechanism 7, as shown in Figure 18 , it is used for winding the formed heterogeneous adhesive film 9, facilitating the collection of the heterogeneous adhesive film 9. Specifically, the solder strip feeding mechanism 5 and the adhesive film feeding mechanism 6 are arranged near the lower pressing mechanism 31 at both ends in the arrangement direction of the lower pressing mechanism 31 and the opening mechanism 4, and the winding mechanism 7 is arranged near the opening mechanism 4.

[0119] Specifically, the winding mechanism 7 comprises a winding driver 71, a winding support 72, and a winding roller 73. The winding driver 71 is specifically a servo motor, and the winding support 72 is fixed to the mechanism frame 11 or the support platform 32. The winding roller 73 penetrates through the winding support 72 and is connected to the output end of the winding driver 71, and the winding driver 71 drives the winding roller 73 to rotate. The winding roller 73 is nested with the winding core of the isomeric adhesive film 9. Under the driving of the winding driver 71, the manufactured isomeric adhesive film 9 is wound at a certain speed. Specifically, the driving of the winding driver 71 of the winding mechanism 7 can drive the ribbon 2 and the adhesive film 1 to move forward along the preset direction on the support platform 32. In addition, a rotary driver can also be arranged in the ribbon feeding mechanism 5 and the adhesive film feeding mechanism 6 as needed to cooperate with the winding mechanism 7 to drive the ribbon 2 and the adhesive film 1 to move forward along the preset direction.

[0120] Specifically, to improve the stability of the movement of the ribbon 2, the adhesive film 1, and the isomeric adhesive film 9, on the two sides of the support platform 32 in the arrangement direction of the pressing mechanism 31 and the punching mechanism 4, a first guide wheel 10 is arranged on the side close to the pressing mechanism 31 to press and tension the adhesive film 1 before the adhesive film 1 is combined with the ribbon 2 to form a composite adhesive film, and a second guide wheel 8 is arranged on the side close to the punching mechanism 4 to press and tension the isomeric adhesive film 9 between the punching mechanism 4 and the winding mechanism 7. Figure 6

[0121] The working principle of the isomeric adhesive film manufacturing system for the back contact battery in the embodiment includes:

[0122] The whole roll of the ribbon 2 is placed on the ribbon feeding mechanism 5, the ribbon 2 is drawn out from the ribbon feeding mechanism 5, penetrates through the guide groove 321 of the combining mechanism 3, penetrates through the bottom of the punch 43 of the punching mechanism 4, and is wound on the winding roller 73 of the winding mechanism 7 to complete the laying of the ribbon 2; the adhesive film 1 is drawn out from the outlet of the adhesive film feeding mechanism 6, penetrates through the bottom surface of the compression roller 311 of the combining mechanism 3, penetrates through the bottom of the punch 43 of the punching mechanism 4, and is wound on the winding roller 73 of the winding mechanism 7 to complete the laying of the adhesive film 1;

[0123] The manufacturing system is started, and the winding roller 73 is wound under the driving of the winding driver 71, thereby driving the adhesive film 1 and the ribbon 2 to move forward along the preset direction;

[0124] When the adhesive film 1 and the ribbon 2 pass through the combining mechanism 3, the top of the ribbon 2 is gradually embedded into the adhesive film 1 under the common extrusion of the compression roller 311 and the support platform 32 to form a composite adhesive film. Due to the concave design of the guide groove 321, the ribbon 2 moves directionally and can ensure that the lower part of the ribbon 2 is not completely wrapped by the adhesive film 1, thereby providing a guarantee for the subsequent contact with the main grid line of the battery piece.

[0125] ​When the composite adhesive film is perforated by the perforating mechanism 4, the perforating driver 41 is operated to drive the punch 43 to perforate the adhesive film 1 at a specific position. During the perforating process, the winding driver 71 can be temporarily stopped, and then restarted after the perforating process.

[0126] The device continuously operates until the adhesive film 1 in the current roll is finished.

[0127] Compared with the traditional device, the manufacturing system in the embodiment can solve the problems of battery piece fragmentation caused by traditional thermal infrared welding of XBC components, and is beneficial to reduce the problem of battery piece scratching caused by traditional packaging process, and the manufacturing problem caused by various harsh process conditions required in component end packaging.

[0128] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be intervening elements. When an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements can be present. In addition, the term "comprising" is used herein to mean that the elements listed after the term encompass items that are the same as those listed and items that are different from those listed but perform the same function.

[0129] The terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate an orientation or position as shown by the drawings, which are for purposes of convenience and brevity and are not a limitation on the scope of the present application, unless otherwise noted. In addition, the terms "first", "second", "third", are used only to describe different instances of an element and do not imply relative importance or a number of instances of the indicated technical features.

[0130] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0131] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0132] The above describes in detail the heterogeneous adhesive film for the back contact cell, the manufacturing system thereof, the photovoltaic module and the manufacturing method thereof. The principles and implementation manners of the present application are described by using specific examples, and the above description of the examples is only used to help understand the method of the present application and the core idea thereof. It should be pointed out that, for those skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A heterogeneous adhesive film for back contact batteries, characterized in that, It includes an adhesive film (1) and a solder ribbon (2); the solder ribbon (2) is embedded on one side of the adhesive film (1) and the solder ribbon part protrudes from the surface of the adhesive film (1) on that side, and the solder ribbon (2) is broken according to a preset rule.

2. The heterogeneous adhesive film according to claim 1, characterized in that, The portion of the welding strip (2) embedded in the adhesive film (1) is provided with a backstop structure to engage with the adhesive film (1).

3. The heterogeneous adhesive film according to claim 1, characterized in that, In the thickness direction of the adhesive film (1), the size of the adhesive film (1) is larger than the size of the solder strip (2).

4. A photovoltaic module, characterized in that, The invention includes a heterogeneous adhesive film as described in any one of claims 1 to 3 and a plurality of back contact batteries, wherein the heterogeneous adhesive film is disposed on the back side of at least two adjacent back contact batteries and is used to connect the respective back contact batteries in series. The disconnection position formed by the break of the welding strip (2) according to the preset rule corresponds to the connection point of the adjacent back contact battery.

5. A method for manufacturing a photovoltaic module, characterized in that, include: The adhesive film (1) and the solder ribbon (2) are stacked and pressure is applied to form a composite adhesive film. In the composite adhesive film, the solder ribbon (2) is partially embedded in the adhesive film (1) along the direction of pressure, and the remaining part protrudes from the adhesive film (1). The composite adhesive film is perforated so that the solder strip (2) is broken according to a preset rule, thereby forming a heterogeneous adhesive film (9). After the heterogeneous adhesive film (9) is formed, the heterogeneous adhesive film (9) is coated and attached to the back of the back contact battery; The solder strip (2) in the heterogeneous adhesive film (9) is in contact with the surface of the back contact battery for electrical connection.

6. The manufacturing method according to claim 5, characterized in that, The covering connection includes heating and pressurization.

7. A manufacturing system for a heterogeneous adhesive film for a back contact battery, characterized in that, It includes a composite mechanism (3) and an opening mechanism (4). The composite mechanism (3) includes a support platform (32) and a pressing mechanism (31) located above the support platform (32). The pressing mechanism (31) and the opening mechanism (4) are arranged sequentially along a preset direction. The support platform (32) is used to support the adhesive film (1) and the solder strip (2), and the adhesive film (1) is stacked on the solder strip (2); The pressing mechanism (31) is used to press down the adhesive film (1) after the adhesive film (1) is stacked on the solder strip (2), so that the top of the solder strip (2) is embedded in the adhesive film (1) and the bottom protrudes from the adhesive film (1) to form a composite adhesive film. The perforation mechanism (4) is used to perforate the composite adhesive film so that the solder strip (2) breaks according to a preset rule, thereby forming a heterogeneous adhesive film (9).

8. The manufacturing system for a heterogeneous adhesive film for a back contact battery according to claim 7, characterized in that, The top surface of the support platform (32) is provided with a guide groove (321) extending along the preset direction, and the bottom end of the welding strip (2) is accommodated in the guide groove (321); After the composite adhesive film is formed, the portion of the solder strip (2) located in the guide groove (321) remains under the adhesive film (1).

9. The manufacturing system for a heterogeneous adhesive film for a back contact battery according to claim 7, characterized in that, The pressing mechanism (31) includes a plurality of pressure rollers (311) arranged sequentially along the preset direction; the adhesive film (1) and the welding strip (2) move below the pressure rollers (311) along the preset direction, and the distance between each pressure roller (311) and the support platform (32) gradually decreases along the direction of the adhesive film (1) and the welding strip (2).

10. The manufacturing system for a heterogeneous adhesive film for a back contact battery according to any one of claims 7 to 9, characterized in that, It also includes a welding strip feeding mechanism (5), an adhesive film feeding mechanism (6), and a winding mechanism (7); At both ends of the arrangement direction of the pressing mechanism (31) and the opening mechanism (4), the welding strip feeding mechanism (5) and the adhesive film feeding mechanism (6) are located near the pressing mechanism (31), and the winding mechanism (7) is located near the opening mechanism (4).

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