GIS visual window preparation method and device, equipment and storage medium

Abstract

The invention provides a GIS visible window preparation method, device and equipment and a storage medium, and the method comprises the following steps: firstly carrying out surface metallization treatment on sapphire transparent ceramic by using Ag-Cu-Ti soldering paste under vacuum, raising the temperature to a first high temperature, carrying out heat preservation, and then carrying out furnace cooling; then the kovar alloy and the sapphire are welded with the same soldering paste under the same conditions; and then the Al-Si-Mg brazing filler metal is used for welding the aluminum alloy and the kovar alloy under vacuum, the temperature is increased to a second low temperature lower than the first high temperature, heat preservation is conducted, and then furnace cooling is conducted. The SF6 leakage resistant sealing interface is formed through the steps. According to the method, the visual window is integrally prepared, the interior of the GIS can be directly observed, fault judgment accuracy and operation and maintenance efficiency are improved, power failure time is shortened, and stable operation of equipment is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of GIS visual windows, and particularly relates to a GIS visual window preparation method, device, equipment and storage medium. BACKGROUND

[0002] A GIS device is composed of key components such as circuit breakers, disconnectors, grounding switches, transformers, arresters, busbars, connecting pieces and outgoing terminal ends. All these components are completely enclosed in a metal grounded shell, and a certain pressure of SF6 insulation gas is filled in the shell to achieve electrical insulation and arc extinguishing functions.

[0003] However, GIS devices face a series of inherent challenges and problems during operation. First, due to factors such as leakage of SF6 gas, infiltration of external moisture, presence of conductive impurities and aging of insulators, flashover faults may occur inside the GIS, seriously affecting the safe and stable operation of the power grid. Second, the fully sealed structure of the GIS makes fault location and maintenance extremely difficult. Once a fault occurs, a large amount of time is spent on fault location, and the outage maintenance time is longer than that of conventional devices, the outage range is wide, and many non-fault elements are involved, which has a great impact on the operation of the power grid.

[0004] Among the existing operation and maintenance means, infrared thermal imaging, ultrasonic partial discharge, ultra-high frequency partial discharge and gas component detection technologies are widely used in routine detection of devices to determine abnormal points. Among them, X-ray imaging detection as a visual detection method can visually diagnose the fault part of the GIS. However, this method has obvious limitations: on the one hand, the complexity of the field environment and the difficulty of setting up the X-ray machine make it difficult to effectively take X-ray photographs; on the other hand, the internal structure of the GIS is complex, and when multiple components overlap, it is difficult to accurately determine the abnormal or fault position from the film information, which reduces the detection efficiency.

[0005] In addition, after the occurrence of internal faults in the GIS, the power supply repair time is very tight. Accurate fault point judgment needs to rely on the comprehensive application of ultrasonic, ultra-high frequency, infrared, gas component analysis and X-ray detection and other means. However, even if these means are used, the recovery power supply time after the fault is still urgent, and the fault point judgment may not be intuitive enough, which may lead to misjudgment and further prolong the outage time. SUMMARY

[0006] The purpose of the present application is to overcome the defects in the prior art, and to provide a GIS visual window preparation method, device, equipment and storage medium.

[0007] The present application provides a GIS visual window preparation method, comprising: Performing surface metallization on sapphire transparent ceramic includes: treating the sapphire transparent ceramic under vacuum conditions using Ag-Cu-Ti solder paste, heating it to a first high temperature and holding it at that temperature, and then slowly cooling it in the furnace under the vacuum conditions; Performing a sapphire-kovar alloy welding sequence includes: welding the kovar alloy and the sapphire transparent ceramic under vacuum conditions using Ag-Cu-Ti solder paste, heating to the first high temperature and holding at that temperature, and then slowly cooling it in the furnace under the vacuum conditions. Performing a Kovar alloy-aluminum alloy welding sequence includes: welding the aluminum alloy and the Kovar alloy under vacuum conditions using Al-Si-Mg brazing filler metal, heating to a second low temperature and holding at that temperature, the second low temperature being lower than the first high temperature, and then slowly cooling in the furnace under the vacuum conditions; The surface metallization treatment, the sapphire-kovar alloy welding sequence, and the kovar alloy-aluminum alloy welding sequence form a sealing interface resistant to SF6 leakage.

[0008] Optionally, the surface metallization treatment performed on the sapphire transparent ceramic includes: Under the vacuum conditions, the Ti element in the Ag-Cu-Ti solder paste undergoes a redox reaction with the sapphire surface to generate a metal transition layer.

[0009] Optionally, in performing the sapphire-kovar alloy welding sequence, slow furnace cooling under the vacuum conditions includes: Maintaining the vacuum conditions and controlling the cooling rate to be less than a set threshold, a directional compressive stress field is formed at the interface between sapphire and Kovar alloy.

[0010] Optionally, the Kovar alloy-aluminum alloy welding sequence includes: The Al-Si-Mg solder is placed in foil form between the Kovar alloy and the aluminum alloy; The second low-temperature heating causes Mg to diffuse into the Kovar alloy side, forming an intermetallic compound layer.

[0011] Optionally, the sapphire-Kovar alloy welding sequence includes: Welding is performed on the transition layer generated by the metallization process; The Ag-Cu-Ti solder paste undergoes a eutectic reaction with the transition layer at the first high temperature, forming a composition gradient interface.

[0012] Optionally, in the Kovar alloy-aluminum alloy welding sequence, slow furnace cooling under vacuum conditions includes: Maintain the vacuum conditions for cooling when the temperature is above the set temperature; Inert gas is introduced to accelerate cooling when the temperature is below the set temperature.

[0013] Optionally, the surface metallization treatment performed on the sapphire transparent ceramic includes: The Ag-Cu-Ti solder paste was sprayed onto the sapphire surface in the form of microspheres. The heating process causes Ti elements to diffuse directionally along the gaps between microspheres to the sapphire interface.

[0014] This application also provides a GIS viewport creation device, comprising: The first control module controls the surface metallization process performed on the sapphire transparent ceramic, including: treating the sapphire transparent ceramic under vacuum conditions using Ag-Cu-Ti solder paste, heating it to a first high temperature and holding it at that temperature, and then slowly cooling it in the furnace under the vacuum conditions. The second control module controls the execution of the sapphire-kovar alloy welding sequence, including: welding the kovar alloy and the sapphire transparent ceramic under vacuum conditions using Ag-Cu-Ti solder paste, heating to the first high temperature and holding at that temperature, and then slowly cooling it in the furnace under the vacuum conditions. The third control module controls the execution of the Kovar alloy-aluminum alloy welding sequence, including: welding the aluminum alloy and the Kovar alloy under vacuum conditions using Al-Si-Mg brazing filler metal, heating to a second low temperature and holding at that temperature, the second low temperature being lower than the first high temperature, and then slowly cooling in the furnace under the vacuum conditions. The surface metallization treatment, the sapphire-kovar alloy welding sequence, and the kovar alloy-aluminum alloy welding sequence form a sealing interface resistant to SF6 leakage.

[0015] This application also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and the processor, when executing the computer program, controls the execution of the method as described above.

[0016] This application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed in a computer, causes the computer to control the execution of the above-described method.

[0017] The beneficial effects of this application are: This application provides a method for preparing a GIS viewing window, comprising: performing a surface metallization treatment on sapphire transparent ceramic, including: treating the sapphire transparent ceramic under vacuum conditions using Ag-Cu-Ti solder paste, heating to a first high temperature and holding at that temperature, and then slowly cooling it in the furnace under vacuum conditions; performing a sapphire-Kovar alloy welding sequence, including: welding Kovar alloy and the sapphire transparent ceramic under vacuum conditions using Ag-Cu-Ti solder paste, heating to the first high temperature and holding at that temperature, and then slowly cooling it in the furnace under vacuum conditions; performing a Kovar alloy-aluminum alloy welding sequence, including: welding aluminum alloy and the Kovar alloy under vacuum conditions using Al-Si-Mg solder, heating to a second low temperature and holding at that temperature, the second low temperature being lower than the first high temperature, and then slowly cooling it in the furnace under vacuum conditions; and forming a sealing interface resistant to SF6 leakage through the surface metallization treatment, the sapphire-Kovar alloy welding sequence, and the Kovar alloy-aluminum alloy welding sequence. This application utilizes a transparent ceramic and other materials to create an integrated viewing window, allowing direct observation of the GIS interior, improving fault diagnosis accuracy and maintenance efficiency, shortening power outage time, forming an SF6-resistant sealing interface, and ensuring stable equipment operation. Attached Figure Description

[0018] Fig. 1 This is a schematic diagram of the GIS viewport creation process in this application; Fig. 2 This is a schematic diagram of the GIS visual window combination sequence in this application; Fig. 3 This is a schematic diagram of the GIS visual window in this application. Detailed Implementation

[0019] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it is to be understood that various forms of implementation of the present disclosure are intended and should not be limited to the embodiments set forth herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0020] This application provides a method for preparing a GIS viewing window, which is applied to the field of gas-insulated metal-enclosed switchgear to solve the problem of difficult flashover fault location inside GIS. Based on the high-pressure sealing requirements of the GIS environment, the method performs the following steps: The GIS viewing window is prepared by preparing a transparent or semi-transparent window on the shell to directly observe the internal condition and improve the efficiency of fault diagnosis.

[0021] Please refer to Figs. 1-3 As shown, this application provides a method for preparing a GIS viewport to ensure the formation of a sealed interface resistant to SF6 leakage, comprising: S101, Perform surface metallization treatment on sapphire transparent ceramic 101, including treating the sapphire transparent ceramic 101 under vacuum conditions using Ag-28Cu-2Ti 104 solder paste.

[0022] Specifically, this application relates to metallizing a sapphire surface using Ag-28Cu-2Ti 104 solder paste in a vacuum environment, including: a vacuum degree of less than Pa, heating time 80 minutes, temperature rise from 25℃ to 930℃, hold at 930℃ for 20 minutes, then slowly cool to room temperature under vacuum conditions, cooling time approximately 6.5 hours.

[0023] The heating and cooling control described above involves a heating process that causes the Ti element in the solder paste to undergo a redox reaction with the sapphire surface, generating a metal transition layer. This transition layer enhances the interfacial bonding strength, laying the foundation for subsequent soldering.

[0024] Among them, the vacuum degree is less than Pa ensures an oxygen-free environment to prevent oxidation; heating time of 80 minutes ensures uniform temperature rise; gradient heating from 25℃ to 930℃ avoids thermal shock; holding at 930℃ for 20 minutes promotes complete reaction; slow cooling for about 6.5 hours reduces thermal stress and forms a stable interface.

[0025] Surface metallization is achieved through redox reactions, with a metal transition layer serving as an intermediate layer to improve the adhesion between sapphire and subsequent metals.

[0026] For example, titanium (Ti) reacts with oxides on the sapphire surface at high temperatures to form a titanium compound layer, enhancing sealing performance. This step is fundamental to window fabrication, ensuring the solderability of the sapphire surface and meeting the high-pressure sealing requirements of GIS (Gas Insulated Geological Components).

[0027] In the surface metallization process, Ag-28Cu-2Ti 104 solder paste is sprayed onto the sapphire surface in the form of microspheres. Through a heating process, Ti elements diffuse directionally along the gaps between the microspheres to the sapphire interface. The microsphere spraying provides uniform coverage, while the gaps allow for the directional migration of Ti elements, thus improving the metallization effect.

[0028] S102, Perform the sapphire-Kovar alloy 102 soldering sequence, including soldering Kovar alloy 102 and the sapphire transparent ceramic 101 under vacuum conditions using Ag-28Cu-2Ti 104 solder paste.

[0029] Specifically, the top layer is sapphire transparent ceramic 101, the middle layer is Ag-28Cu-2Ti 104 active solder paste, and the bottom layer is 4J29 Kovar alloy 102, without any load applied.

[0030] The welding process is carried out in a vacuum environment, with a vacuum level of less than [missing information]. Pa, heating time 80 minutes, temperature rise from 25℃ to 930℃, hold at 930℃ for 20 minutes, then slowly cool to room temperature under vacuum conditions, cooling time approximately 6.5 hours.

[0031] Soldering is performed on the transition layer generated by metallization. A first high temperature induces a eutectic reaction between the Ag-28Cu-2Ti 104 solder paste and the transition layer, forming a compositional gradient interface. Slow cooling is maintained under vacuum conditions, with the cooling rate controlled below a set threshold (e.g., less than 1°C / min), creating a directional compressive stress field at the interface between the sapphire and Kovar 102 alloys. The vacuum level is less than... Pa prevents oxidation contamination; heating time of 80 minutes ensures uniform temperature; holding at 930℃ for 20 minutes triggers eutectic reaction, and the solder paste and transition layer fuse to form a gradient interface (such as a copper-titanium alloy layer), enhancing interface toughness; slow cooling for about 6.5 hours and a slow cooling rate reduce the risk of cracking; directional compressive stress field is generated by thermal shrinkage difference, compressing the sapphire-Kovar 102 interface and improving sealing strength.

[0032] A robust bond is achieved through eutectic reaction and stress control, while a compositional gradient interface ensures material compatibility and prevents leakage. For example, at 930°C, Ag-Cu in the solder paste eutectically liquefies with the transition layer titanium compounds, solidifying upon cooling to form a gradient alloy that enhances leak resistance. This sequence constructs the window core structure, and the welding of sapphire to Kovar alloy 102 provides the foundation for the subsequent connection of aluminum alloy 103.

[0033] During the cooling process of the sapphire-Kovar 102 welding sequence, vacuum conditions are maintained, and the cooling rate is controlled to be less than a set threshold (e.g., 0.5°C / min) to create a directional compressive stress field at the interface. The set threshold is based on the difference in the thermal expansion coefficients of the materials, and the compressive stress field improves the interface sealing performance.

[0034] S103, Perform the Kovar alloy 102-aluminum alloy 103 welding sequence, including welding aluminum alloy 103 and Kovar alloy 102 under vacuum conditions using Al-Si-Mg 105 brazing filler metal.

[0035] Specifically, the top layer is 4J29 Kovar alloy 102 with sapphire soldered to it, the middle layer is Al-Si-Mg 105 solder foil, and the bottom layer is 5052 aluminum alloy 103 without any load applied.

[0036] The welding process is carried out in a vacuum environment, with a vacuum level of less than [missing information]. The process involves heating at 25°C for 40 minutes, raising the temperature to 585°C, holding at 585°C for 13 minutes, and then slowly cooling the furnace to room temperature under vacuum for approximately 5 hours. Al-Si-Mg 105 brazing filler metal is placed in foil form between Kovar alloy 102 and aluminum alloy 103. A second low-temperature heating process causes Mg to diffuse towards Kovar alloy 102, forming an intermetallic compound layer. During cooling, slow cooling is maintained under vacuum conditions above a set temperature (e.g., 300°C), while cooling is accelerated below the set temperature by introducing an inert gas (e.g., nitrogen). The vacuum level is less than [a certain value]. Pa ensures a clean environment; a heating time of 40 minutes enables rapid temperature rise; the temperature rise from 25°C to 585°C prevents the aluminum alloy 103 from melting; holding at 585°C for 13 minutes promotes Mg diffusion; slow cooling for about 5 hours reduces thermal deformation; Mg diffusion forms an intermetallic compound layer (such as Mg-Si alloy), strengthening the interface bonding; inert gas accelerates cooling and optimizes efficiency.

[0037] Reliable welding is achieved through Mg diffusion and foil morphology, with the intermetallic compound layer acting as a barrier to enhance resistance to SF6 penetration. For example, at 585°C, Mg migrates from the brazing filler metal to the Kovar alloy 102 side, forming a hard alloy layer that seals the micropores. This sequence completes the window assembly, and the connection between Kovar alloy 102 and aluminum alloy 103 ensures the overall structural seal, meeting the high-pressure requirements of GIS.

[0038] In the Kovar alloy 102-aluminum alloy 103 welding sequence, Mg element diffuses towards the Kovar alloy 102 side through a second low-temperature heating to form an intermetallic compound layer. The Mg diffusion is triggered at 585°C to form a compound layer (such as Al-Mg-Si), which improves the interface strength and sealing performance.

[0039] During the cooling process of the Kovar 102-Aluminum Alloy 103 welding sequence, vacuum cooling is maintained at temperatures above a set point (e.g., 300°C), while inert gas (e.g., argon) is introduced to accelerate cooling at temperatures below the set point. The set temperature is based on the material's phase transformation point, and the inert gas prevents oxidation and accelerates cooling to improve production efficiency.

[0040] Through the aforementioned surface metallization treatment, sapphire-Kovar 102 welding sequence, and Kovar 102-aluminum alloy 103 welding sequence, a sealing interface resistant to SF6 leakage is formed. This entire method ensures the reliable sealing of the GIS viewing window, enabling direct observation of the internal conditions, solving the problem of fault location, and comprehensively guaranteeing the long-term stability of the window in a high-pressure SF6 environment.

[0041] This application also provides a GIS viewport creation device, comprising: The first control module controls the surface metallization process of the sapphire transparent ceramic 101, including: treating the sapphire transparent ceramic 101 under vacuum conditions with Ag-Cu-Ti solder paste, heating it to a first high temperature and holding it at that temperature, and then slowly cooling it in the furnace under the vacuum conditions. The second control module controls the execution of the sapphire-kovar alloy 102 welding sequence, including: welding Kovar alloy 102 and the sapphire transparent ceramic 101 under vacuum conditions using Ag-Cu-Ti solder paste, heating to the first high temperature and holding at that temperature, and then slowly cooling in the furnace under the vacuum conditions. The third control module controls the execution of the Kovar alloy 102-aluminum alloy 103 welding sequence, including: welding aluminum alloy 103 and Kovar alloy 102 under vacuum conditions using Al-Si-Mg105 brazing filler metal, heating to a second low temperature and holding at that temperature, the second low temperature being lower than the first high temperature, and then slowly cooling in the furnace under the vacuum conditions. The surface metallization treatment, the sapphire-Kovar 102 welding sequence, and the Kovar 102-aluminum alloy 103 welding sequence form a sealing interface resistant to SF6 leakage.

[0042] This application also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and the processor, when executing the computer program, controls the execution of the method as described above.

[0043] This application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed in a computer, causes the computer to control the execution of the above-described method.

[0044] The above description of the embodiments is provided to enable those skilled in the art to understand and apply this application. Those skilled in the art will readily make various modifications to the above embodiments and apply the general principles described herein to other embodiments without inventive effort. Therefore, this application is not limited to the above embodiments, and any improvements and modifications made to this application based on the disclosure thereof should be within the scope of protection of this application.

Claims

1. A method for creating a GIS viewport, characterized in that, include: Performing surface metallization on sapphire transparent ceramic includes: treating the sapphire transparent ceramic under vacuum conditions using Ag-Cu-Ti solder paste, heating it to a first high temperature and holding it at that temperature, and then slowly cooling it in the furnace under the vacuum conditions; Performing a sapphire-kovar alloy welding sequence includes: welding the kovar alloy and the sapphire transparent ceramic under vacuum conditions using Ag-Cu-Ti solder paste, heating to the first high temperature and holding at that temperature, and then slowly cooling it in the furnace under the vacuum conditions. Performing a Kovar alloy-aluminum alloy welding sequence includes: welding the aluminum alloy and the Kovar alloy under vacuum conditions using Al-Si-Mg brazing filler metal, heating to a second low temperature and holding at that temperature, the second low temperature being lower than the first high temperature, and then slowly cooling in the furnace under the vacuum conditions; The surface metallization treatment, the sapphire-kovar alloy welding sequence, and the kovar alloy-aluminum alloy welding sequence form a sealing interface resistant to SF6 leakage.

2. The method according to claim 1, characterized in that, The surface metallization treatment of sapphire transparent ceramic includes: Under the vacuum conditions, the Ti element in the Ag-Cu-Ti solder paste undergoes a redox reaction with the sapphire surface to generate a metal transition layer.

3. The method according to claim 1, characterized in that, In performing the sapphire-Kovar alloy welding sequence, slow furnace cooling under the vacuum conditions includes: Maintaining the vacuum conditions and controlling the cooling rate to be less than a set threshold, a directional compressive stress field is formed at the interface between sapphire and Kovar alloy.

4. The method according to claim 1, characterized in that, The Kovar alloy-aluminum alloy welding sequence includes: The Al-Si-Mg solder is placed in foil form between the Kovar alloy and the aluminum alloy; The second low-temperature heating causes Mg to diffuse into the Kovar alloy side, forming an intermetallic compound layer.

5. The method according to claim 1, characterized in that, The sapphire-Kovar alloy welding sequence includes: Welding is performed on the transition layer generated by the metallization process; The Ag-Cu-Ti solder paste undergoes a eutectic reaction with the transition layer at the first high temperature, forming a composition gradient interface.

6. The method according to claim 1, characterized in that, In the Kovar alloy-aluminum alloy welding sequence, slow furnace cooling under vacuum conditions includes: Maintain the vacuum conditions for cooling when the temperature is above the set temperature; Inert gas is introduced to accelerate cooling when the temperature is below the set temperature.

7. The method according to claim 1, characterized in that, The surface metallization treatment of sapphire transparent ceramic includes: The Ag-Cu-Ti solder paste was sprayed onto the sapphire surface in the form of microspheres; The heating process causes Ti elements to diffuse directionally along the gaps between microspheres to the sapphire interface.

8. A GIS viewport creation device, characterized in that, include: The first control module controls the surface metallization process performed on the sapphire transparent ceramic, including: treating the sapphire transparent ceramic under vacuum conditions using Ag-Cu-Ti solder paste, heating it to a first high temperature and holding it at that temperature, and then slowly cooling it in the furnace under the vacuum conditions. The second control module controls the execution of the sapphire-kovar alloy welding sequence, including: welding the kovar alloy and the sapphire transparent ceramic under vacuum conditions using Ag-Cu-Ti solder paste, heating to the first high temperature and holding at that temperature, and then slowly cooling it in the furnace under the vacuum conditions. The third control module controls the execution of the Kovar alloy-aluminum alloy welding sequence, including: welding the aluminum alloy and the Kovar alloy under vacuum conditions using Al-Si-Mg brazing filler metal, heating to a second low temperature and holding at that temperature, the second low temperature being lower than the first high temperature, and then slowly cooling in the furnace under the vacuum conditions. The surface metallization treatment, the sapphire-kovar alloy welding sequence, and the kovar alloy-aluminum alloy welding sequence form a sealing interface resistant to SF6 leakage.

9. An electronic device, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program, and the processor, when executing the computer program, controls the execution of the method as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, It stores a computer program that, when executed in a computer, causes the computer to control the execution of the method according to any one of claims 1-7.

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