Semiconductor device and method of controlling the same

Abstract

The application provides a semiconductor device and a control method thereof. The semiconductor device comprises a docking mechanism, a control module, a wafer conveying device and a plurality of machines. The docking mechanism comprises a plurality of adapters, a mounting base, a docking arm, a first positioning assembly and a second positioning assembly connected with the control module. Two interfaces of the plurality of adapters are respectively and detachably connected with a second gate valve of the wafer conveying device and a first gate valve of the plurality of machines. The docking arm is fixed to a moving device body. The mounting base is arranged at the end of the docking arm. The adapters are detachably arranged on the mounting base. The first positioning assembly and the second positioning assembly are arranged on the mounting base to detect the relative pose information between the adapters and the first gate valve and the second gate valve respectively, and the contact force information and the position deviation information in the docking process. The application can realize adaptive, fast, accurate, reliable and unmanned docking between the wafer conveying device and various types of machines.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment manufacturing, and in particular to a semiconductor equipment and a control method thereof. BACKGROUND

[0002] In a semiconductor manufacturing equipment, generally one machine performs one specific process, and after the process is completed, the wafer is transferred from the machine to a wafer box for transmission to another machine for the next process. However, during the process of transferring the wafer from one machine to another, the surface of the wafer is exposed to the atmosphere. In the atmospheric environment, silicon and oxygen may react to form silicon dioxide, water vapor may react with silicon to form silicon dioxide, and other gas impurities in the atmosphere may also participate in the reaction during the oxidation process to form amorphous silicon dioxide, which may contaminate the wafer when it is transferred to another machine. Even if a nitrogen-filled wafer box is used for storage, a small amount of air mixed in may still react with the wafer.

[0003] Therefore, in the case of multiple processes coexisting, different process chambers and vacuum transfer chambers are generally configured on one machine, and the wafer is transferred between different process chambers by the vacuum transfer chamber. This requirement is particularly high during the process development stage. Such a multi-process coexisting hybrid machine can achieve vacuum transfer between different chambers, but it is difficult to change after configuration, i.e., a hybrid machine can only perform a fixed multi-process flow. When different multi-process flows are needed, a suitable hybrid machine needs to be purchased, which undoubtedly increases the cost investment.

[0004] The prior art also achieves wafer transfer between different machines by movable devices, but different machines are usually produced by different manufacturers, and the standards of their interfaces, such as shape, size, height, and azimuth, are different. Designing a dedicated movable device for each type of machine is costly, complex to maintain, and has poor versatility. Moreover, the prior art generally relies on manual preliminary positioning and connection, which is inefficient and impractical in clean rooms or hazardous environments. SUMMARY

[0005] The present application aims to provide a semiconductor equipment and a control method thereof, which can enable the wafer to be transferred in a vacuum environment at all times, reducing or avoiding the risk of oxidation or contamination caused by breaking the vacuum. Moreover, the wafer transfer device can achieve adaptive, fast, accurate, reliable, and unmanned docking between multiple different types of machines.

[0006] To achieve the above object, the semiconductor device according to a first aspect of the present application comprises a docking mechanism, a control module, a wafer conveying device and a plurality of machines; the machine comprises a conveying cavity and a first gate valve arranged in the conveying cavity; the wafer conveying device comprises a moving device body, a vacuum control pipeline and a second gate valve; the vacuum control pipeline is connected with a wafer containing cavity in the moving device body; the second gate valve is arranged at an opening portion of the moving device body; the docking mechanism comprises a plurality of adapters, a mounting base, a docking arm, a first positioning assembly and a second positioning assembly, an interface portion of each of the adapters is adapted to and detachably connected with the second gate valve, and another interface portion of each of the adapters is adapted to and detachably connected with the first gate valve of each of the machines; the docking arm is fixed to a side wall of the moving device body where the second gate valve is arranged, the mounting base is arranged at a distal end of the docking arm, and the adapters are detachably arranged in the mounting base; the first positioning assembly is arranged in the mounting base and used for detecting relative pose information between the adapters and the first gate valves and the second gate valves, respectively; the second positioning assembly is arranged in the mounting base and used for detecting contact force information and position deviation information of the adapters and the first gate valves and the second gate valves during the docking process; the control module is connected with the vacuum control pipeline, the first positioning assembly, the second positioning assembly and the docking arm, respectively, and controls the vacuum control pipeline to vacuumize the wafer containing cavity, and controls the docking arm to drive the adapters to move according to the relative pose information, the contact force information and the position deviation information.

[0007] Preferably, the adapter comprises an adapter body, a first quick-change interface and a second quick-change interface, the first quick-change interface and the second quick-change interface are arranged at two symmetrical ends of the adapter body, respectively, a wafer transmission channel is arranged in the adapter body and communicates with the first quick-change interface and the second quick-change interface, the first quick-change interfaces of the adapters are identical in structure and adapted to the second gate valve, the second quick-change interfaces of the adapters are different in structure and adapted to the first gate valves of the machines one by one, the adapter is detachably arranged in the second gate valve through the first quick-change interface, and the adapter is detachably arranged in the first gate valve through the second quick-change interface.

[0008] Preferably, the first gate valve and the second gate valve are each provided with a visual identification structure; the first positioning assembly includes a visual sensor and a laser ranging sensor, which are arranged on the mounting base and used to identify the visual identification structure to detect the relative pose information between the adapter and the first gate valve and the second gate valve respectively; the second positioning assembly includes a force sensor and a position sensor, the force sensor is arranged between the mounting base and the end of the docking arm and is used to detect the contact force information generated when the adapter is in docking contact with the first gate valve and the second gate valve respectively, and the position sensor is arranged on the mounting base and is used to detect the position deviation information of the adapter during docking with the first gate valve and the second gate valve respectively; the control module is connected with the visual sensor, the laser ranging sensor, the force sensor and the position sensor respectively.

[0009] Preferably, a pose adjustment assembly is arranged between the mounting base and the adapter, the pose adjustment assembly includes a connecting base, a flexible hinge and a plurality of servo cylinders; the first end of the connecting base is connected with the mounting base, and the second end of the connecting base which is symmetrically arranged with the first end is provided with a quick-change interface male head for connecting the adapter; the flexible hinge is connected with the connecting base and the mounting base respectively; the cylinder body of the servo cylinder is fixedly arranged on the mounting base, and the push rod of the servo cylinder is connected with the connecting base; the position sensor includes a fixed scale part and a moving scale part, the fixed scale part is arranged on the mounting base, and the moving scale part is arranged on the connecting base, so as to detect the linear displacement deviation of the connecting base relative to the mounting base in X, Y and Z axis directions and the rotation angle deviation around each axis in real time; the control module is connected with the servo cylinder and controls the movement of the servo cylinder according to the linear displacement deviation and the rotation angle deviation information.

[0010] Preferably, the docking arm includes an arm segment and a joint; the arm segment includes a base, and a first arm segment, a second arm segment and a third arm segment which are connected in series from the base to the end; the joint includes a first joint, a second joint and a third joint, the first joint connects the base and the first arm segment, the second joint connects the first arm segment and the second arm segment, and the third joint connects the second arm segment and the third arm segment, the third arm segment is connected with the mounting base, and the first joint, the second joint and the third joint each include a servo motor and a reducer which are connected with the control module respectively.

[0011] Preferably, the docking mechanism further comprises a locking structure, the locking structure comprises a first locking structure and a second locking structure, the first locking structure is arranged on the first quick-change interface or the second gate valve to lock and seal the first quick-change interface of the adapter and the second gate valve; the second locking structure is arranged on the second quick-change interface or the first gate valve to lock and seal the second quick-change interface of the adapter and the first gate valve.

[0012] Preferably, the vacuum control pipeline comprises a vacuum pump and an air exhaust pipeline, two ends of the air exhaust pipeline are connected with the wafer receiving cavity and the vacuum pump respectively; the wafer conveying device further comprises a vacuum gauge, a sensor of the vacuum gauge is arranged in the wafer receiving cavity, the control module is connected with the vacuum pump, the second gate valve and a signal output end of the vacuum gauge respectively, and the control module controls the vacuum pump and the second gate valve to work cooperatively according to an electric signal output by the vacuum gauge, so that a vacuum degree in the wafer receiving cavity is within a preset range.

[0013] Preferably, the vacuum control pipeline further comprises a pressure regulating valve, the pressure regulating valve is arranged on the air exhaust pipeline, and the control module is connected with the pressure regulating valve to adjust the vacuum degree or the vacuuming speed in the wafer receiving cavity by controlling an opening degree of the pressure regulating valve.

[0014] Preferably, the semiconductor device further comprises an alarm module and / or a parameter input module; the control module is connected with the alarm module, and controls to close the pressure regulating valve and controls the alarm module to issue an alarm when the vacuum degree in the wafer receiving cavity exceeds a preset value; the parameter input module is used for inputting parameter information, the parameter information comprises performance parameters of the machine, process parameters of a process performed in the machine, real-time environmental parameters, the control module is connected with the parameter input module, and controls the vacuum pump and the second gate valve to work cooperatively according to the parameter information input by the parameter input module, so as to adjust the vacuum degree in the wafer receiving cavity.

[0015] Preferably, the machine comprises a plurality of process cavities and at least one loading cavity, or the machine comprises a plurality of process cavities; the conveying cavity comprises at least one of the process cavities and / or at least one of the loading cavities, the process cavities and the loading cavities are provided with conveying ports, and the conveying ports are provided with the first gate valves.

[0016] Preferably, the semiconductor equipment further comprises a cleaning assembly; the cleaning assembly comprises a cleaning member, a driving mechanism and an extendable connecting member, one end of the extendable connecting member is fixedly arranged on the top or sidewall of the wafer receiving cavity and connected with the driving mechanism, the other end of the extendable connecting member is connected with the cleaning member; the cleaning member comprises an electrostatic adsorption brush; the control module is connected with the driving mechanism and controls the driving mechanism to drive the extendable connecting member to extend or contract, so as to drive the cleaning member to clean the wafer.

[0017] Preferably, the semiconductor equipment further comprises a cleaning assembly; the cleaning assembly comprises a purge gas pipeline, a purge gas nozzle and a purge gas supply device, the purge gas supply device is fixedly arranged outside the moving device body, two ends of the purge gas pipeline are respectively communicated with the purge gas nozzle and the purge gas supply device, the purge gas nozzle is fixedly arranged in the wafer receiving cavity and located above the wafer supporting table in the wafer receiving cavity.

[0018] In a second aspect, a control method of the semiconductor equipment, comprising the following steps:

[0019] S1, providing the semiconductor equipment as described above;

[0020] S2, the control module controls the vacuum control pipeline to vacuumize the wafer receiving cavity;

[0021] S3, an adapter matched with a first gate valve in a target machine is equipped on the mounting base, a first positioning assembly detects relative pose information between the adapter and a second gate valve and transmits the information to the control module, a second positioning assembly detects contact force information and position deviation information between the adapter and the second gate valve during the docking process and transmits the information to the control module, and the control module controls the docking arm to drive the adapter to move according to the relative pose information, the contact force information and the position deviation information, so that the adapter and the second gate valve of the wafer conveying device complete docking.

[0022] S4, the first positioning assembly detects relative pose information between the adapter and the first gate valve and transmits the information to the control module, the second positioning assembly detects contact force information and position deviation information between the adapter and the first gate valve during the docking process and transmits the information to the control module, and the control module controls the docking arm to drive the adapter to move according to the relative pose information, the contact force information and the position deviation information, so that the adapter and the first gate valve of the machine complete docking.

[0023] Preferably, the step S2 comprises:

[0024] The control module controls the vacuum pump to start, and controls the pressure regulating valve to open after a delay of T1 time to pump the wafer receiving cavity; the vacuum gauge detects the actual vacuum value in the wafer receiving cavity and transmits it to the control module;

[0025] The control module compares and analyzes the actual vacuum value with the target vacuum set value, and controls the pressure regulating valve to close when the actual vacuum value meets the target vacuum set value.

[0026] After a delay of T2 time, the control module controls the vacuum pump to close.

[0027] Preferably, the step S3 comprises:

[0028] The visual sensor and the laser ranging sensor identify the visual identification structure on the second gate valve to detect the relative pose information between the second gate valve and the adapter; the control module controls the docking arm to move to drive the adapter on the mounting base to adjust the attitude, so that the first quick-change interface on the adapter is aligned with and docked with the second gate valve;

[0029] The force sensor detects the contact force information generated when the adapter and the second gate valve are in docking contact, and the position sensor detects the position deviation information in the docking process of the adapter and the second gate valve; the control module controls the docking arm to move to drive the adapter on the mounting base to adjust the attitude according to the contact force information and the position deviation information, until the adapter and the second gate valve reach the preset docking position to complete the docking;

[0030] The control module controls the first locking structure to lock and seal the first quick-change interface of the adapter and the second gate valve.

[0031] Preferably, the step S4 comprises:

[0032] Moving the wafer conveying device to a preset standby area in front of the conveying cavity of the target machine;

[0033] The visual sensor and the laser ranging sensor identify the visual identification structure on the first gate valve to detect the relative pose information between the first gate valve and the adapter; the control module controls the docking arm to move to drive the adapter on the mounting base to adjust the attitude, so that the second quick-change interface on the adapter is aligned with and docked with the first gate valve;

[0034] The force sensor detects contact force information generated when the adapter and the first gate valve are in butt joint contact, and the position sensor detects position deviation information during butt joint of the adapter and the first gate valve; the control module controls the adapter on the mounting base to adjust the posture according to the contact force information and the position deviation information, until the adapter and the first gate valve reach a preset butt joint position to complete butt joint.

[0035] The control module controls the second locking structure to lock and seal the second quick-change interface of the adapter and the first gate valve.

[0036] The semiconductor device and the control method have the following advantages:

[0037] (1) The vacuum control pipeline and the second gate valve are integrated on the mobile device body, so that the wafer conveying device becomes a movable "conveying cabin" with vacuum generation and vacuum maintenance, and the wafer conveying device has a vacuum control pipeline, which can be used to extract vacuum from the wafer receiving cavity at any time according to the required or set vacuum degree, so that the wafer can be conveyed in a vacuum environment at all times, thereby minimizing the number of times the wafer is exposed to the atmosphere, and reducing or avoiding the risk of oxidation or pollution caused by breaking the vacuum.

[0038] (2) The wafer conveying device can be quickly and flexibly connected to the first gate valve of multiple different types of machines through the adapter, so that the wafer conveying device can be connected to any different machine in a vacuum state. That is, for different types of target machine first gate valves, a dedicated adapter can be provided in advance, and by replacing different adapters, the wafer conveying device can be matched with different machines or new types of machines, which is conducive to realizing vacuum conveying of wafers between any two different machines. The modular adapter design of the present application makes it possible to set up a wafer conveying device to adapt to wafer conveying between different machines, which has high flexibility and universality and is suitable for conveying wafers in different multi-process flow machines. The present application significantly reduces equipment investment cost and maintenance complexity.

[0039] (3) Through coarse positioning of the first positioning assembly, fine positioning of the second positioning assembly, and active force control of the butt joint arm, reliable butt joint of the wafer conveying device and different target machines can be realized. The whole butt joint process of the present application does not require manual intervention, realizes full automation, and is suitable for unmanned clean rooms or dangerous environments; reduces production downtime caused by butt joint failure, enhances system availability, and improves overall production efficiency and equipment utilization (OEE). That is, the present application is conducive to realizing adaptive, fast, accurate, reliable, and unmanned butt joint between the wafer conveying device and multiple different types of target machines 1. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 A schematic view of a wafer transfer device and docking mechanism in a semiconductor equipment according to an embodiment of the present application.

[0041] Figure 2 A schematic view of a wafer transfer device and docking mechanism in a semiconductor equipment according to an embodiment of the present application.

[0042] Figure 3 A schematic view of a wafer transfer device and docking mechanism in a semiconductor equipment according to an embodiment of the present application.

[0043] Figure 4 A block diagram of a semiconductor equipment according to an embodiment of the present application.

[0044] Figure 5 A schematic view of a cleaning assembly in a semiconductor equipment according to an embodiment of the present application.

[0045] Figure 6 A flowchart of a control method of a semiconductor equipment according to an embodiment of the present application.

[0046] BRIEF DESCRIPTION OF DRAWINGS

[0047] 10, wafer; 1, machine table; 11, first gate valve; 12, transfer cavity; 2, wafer transfer device; 21, mobile device body; 211, wafer receiving cavity; 22, vacuum control pipeline; 221, vacuum pump; 222, air exhaust pipeline; 223, pressure regulating valve; 23, second gate valve; 24, robot; 25, vacuum gauge; 3, control module; 4, docking mechanism; 41, docking arm; 411, arm segment; 412, joint; 42, vision sensor; 43, laser ranging sensor; 44, force sensor; 45, position sensor; 46, adapter; 461, adapter body; 462, first quick-change interface; 463, second quick-change interface; 47, mounting base; 5, cleaning assembly; 51, driving mechanism; 52, telescopic connecting piece; 53, cleaning piece. DETAILED DESCRIPTION

[0048] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present application but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts should fall into the scope of the present application. Unless otherwise defined, the technical terms or scientific terms used herein should be understood as the common meanings of the technical terms or scientific terms by those skilled in the art. The similar words such as "comprise" used herein mean that the elements or objects before the words cover the elements or objects listed after the words and their equivalents, and do not exclude other elements or objects.

[0049] In order to overcome the problems in the prior art, the embodiments of the present application provide a semiconductor device and a control method thereof, which can make the wafer always be conveyed in a vacuum environment, reduce or avoid the risk of oxidation or pollution caused by breaking the vacuum, and realize adaptive, fast, accurate, reliable and unmanned docking between the wafer conveying device and various different types of machines.

[0050] In some embodiments of the present application, reference is made to Figures 1 to 4The semiconductor device comprises a docking mechanism 4, a control module 3, a wafer conveying device 2 and a plurality of machines 1. The machine 1 comprises a conveying cavity 12 and a first gate valve 11 arranged in the conveying cavity 12. The wafer conveying device 2 comprises a moving device body 21, a vacuum control pipeline 22 and a second gate valve 23. The vacuum control pipeline 22 is connected with a wafer containing cavity 211 in the moving device body 21. The second gate valve 23 is arranged at an opening portion of the moving device body 21. The docking mechanism 4 comprises a plurality of adapters 46, a mounting base 47, a docking arm 41, a first positioning assembly (not shown in the figure) and a second positioning assembly (not shown in the figure). An interface portion of the adapter 46 is adapted and detachably connected with the second gate valve 23. Another interface portion of the adapter 46 is adapted and detachably connected with the first gate valve 11 of the machine 1 one by one. The docking arm 41 is fixed to a side wall of the moving device body 21 provided with the second gate valve 23. The mounting base 47 is arranged at the end of the docking arm 41. The adapter 46 is detachably arranged in the mounting base 47. The first positioning assembly (not shown in the figure) is arranged in the mounting base 47 and is used for detecting relative pose information between the adapter 46 and the first gate valve 11 and the second gate valve 23 respectively. The second positioning assembly (not shown in the figure) is arranged in the mounting base 47 and is used for detecting contact force information and position deviation information of the adapter 46 and the first gate valve 11 and the second gate valve 23 in the docking process respectively. The control module 3 is connected with the vacuum control pipeline 22, the first positioning assembly (not shown in the figure), the second positioning assembly (not shown in the figure) and the docking arm 41 respectively, controls the vacuum control pipeline 22 to vacuumize the wafer containing cavity 211, and controls the docking arm 41 to drive the adapter 46 to move according to the relative pose information, the contact force information and the position deviation information.

[0051] The wafer conveying device 2 comprises a moving device body 21, a vacuum control pipeline 22 and a second gate valve 23. The vacuum control pipeline 22 is connected with a wafer containing cavity 211 in the moving device body 21. The control module 3 is connected with the vacuum control pipeline 22 and controls the vacuum control pipeline 22 to vacuumize the wafer containing cavity 211, so that the wafer conveying device 2 becomes a movable “conveying cabin” with vacuum generation and vacuum maintenance. Moreover, the wafer conveying device 2 is provided with the vacuum control pipeline 22, which can vacuumize the wafer containing cavity 211 according to the required or set vacuum degree at any time, so that the wafer 10 can be conveyed in the vacuum environment all the time, the number of times of exposure of the wafer 10 to the atmosphere is minimized, and the risk of oxidation or pollution caused by breaking the vacuum is reduced or avoided.

[0052] In addition, the machine table 1 comprises a conveying cavity 12 and a first gate valve 11 arranged in the conveying cavity 12, the second gate valve 23 is arranged in the opening portion of the moving device body 21, one interface portion of the plurality of adapters 46 is matched with and detachably connected with the second gate valve 23, and the other interface portion of the plurality of adapters 46 is matched with and detachably connected with the first gate valve 11 of the plurality of machine tables 1 one by one, so that the wafer conveying device 2 can be quickly and flexibly vacuum sealed and docked with the first gate valve 11 of the plurality of different types of machine tables 1 by replacing the adapters 46, so that the wafer conveying device 2 can be vacuum docked with any different machine table 1. That is, for the first gate valve 11 of different types of target machine tables 1, a special adapter can be prepared in advance, and by replacing different adapters, the wafer conveying device 2 can be matched with different machine tables 1 or new types of machine tables 1, which is beneficial to realize vacuum conveying of the wafer 10 between any two different machine tables 1. The modular adapter design of the present application can adapt to wafer conveying between different machine tables 1 by setting one wafer conveying device 2, which has high flexibility and universality and is suitable for conveying wafers in different multi-process flow machines, significantly reducing equipment investment cost and maintenance complexity.

[0053] Moreover, the docking arm 41 is fixed to the side wall of the moving device body 21 provided with the second gate valve 23, the mounting base 47 is arranged at the end of the docking arm 41, and the adapter 46 is detachably arranged in the mounting base 47; the first positioning assembly (not shown in the figure) is arranged in the mounting base 47 and is used for detecting the relative pose information between the adapter 46 and the first gate valve 11 and the second gate valve 23, respectively; the second positioning assembly (not shown in the figure) is arranged in the mounting base 47 and is used for detecting the contact force information and the position deviation information of the adapter 46 and the first gate valve 11 and the second gate valve 23 in the docking process, respectively; the control module 3 is connected with the first positioning assembly (not shown in the figure), the second positioning assembly (not shown in the figure) and the docking arm 41, respectively, and controls the movement of the docking arm 41 driving the adapter 46 according to the relative pose information, the contact force information and the position deviation information, so that reliable docking of the wafer conveying device 2 and different target machine tables 1 can be realized through coarse positioning of the first positioning assembly, fine positioning of the second positioning assembly and active force control of the docking arm 41. The whole docking process of the present application does not need manual intervention, realizes full automation, is suitable for unmanned production in a clean room or a dangerous environment, reduces production downtime caused by docking failure, enhances system availability, and improves overall production efficiency and equipment utilization (OEE). That is, the present application is beneficial to realize adaptive, fast, accurate, reliable and unmanned docking between the wafer conveying device 2 and a plurality of different types of target machine tables 1.

[0054] In some embodiments of the present application, the wafer storage cavity 211 is provided with a mechanical hand 24 for transferring the wafer 10, and the mechanical hand 24 is used to take and transfer the wafer 10 between the wafer storage cavity 211 of the moving device body 21 and the transfer cavity 12. Figures 1 to 3

[0055] In some embodiments of the present application, the wafer storage cavity 211 is further provided with a wafer supporting table for fixing and temporarily storing the wafer, so as to avoid the long-time clamping and moving of the wafer by the mechanical hand.

[0056] In some embodiments of the present application, the wafer storage cavity 211 is further provided with a wafer storage rack, and the wafer storage rack is provided with a plurality of wafer storage station structures for simultaneously fixing and temporarily storing a plurality of wafers, so as to avoid the long-time clamping and moving of the wafer by the mechanical hand, and the wafer transfer device 2 can transfer a plurality of wafers 10 at one time.

[0057] In some embodiments of the present application, the first gate valve 11 and the second gate valve 23 are vacuum valves, which have good sealing performance and can effectively prevent external gas from leaking into the wafer storage cavity, and are beneficial to maintaining the "leakage-free" vacuum environment in the wafer storage cavity.

[0058] In some specific embodiments of the present application, the vacuum valve includes any one of a flapper valve and a gate valve, the flapper valve is switched by rotating the valve plate around the shaft, and the valve can be quickly switched; the gate valve is switched by vertically moving the valve plate like a gate, and has good sealing performance and can be used for high vacuum and ultra-high vacuum.

[0059] In some embodiments of the present application, the first gate valve 11 and the second gate valve 23 include any one of a pneumatic vacuum valve, an electric vacuum valve and a manual vacuum valve. Further, in some specific embodiments, the first gate valve 11 and the second gate valve 23 are pneumatic vacuum valves, which have fast response and are easy to realize interlocking. In some embodiments of the present application, the first gate valve 11 and the second gate valve 23 are further provided with a safety interlocking system, so that when the vacuum degree in the wafer storage cavity 211 cannot reach the set value, the first gate valve 11 and the second gate valve 23 cannot be opened, so as to prevent the vacuum from being damaged due to misoperation. Specifically, the structure, type and adapted safety interlocking system of the vacuum valve are conventional settings in the field, and will not be described here.

[0060] In some embodiments of the present application, the transfer cavity 12 includes a cavity body, and the first gate valve 11 is arranged at the opening portion of the cavity body.

[0061] In some embodiments of the present application, the wafer storage cavity 211 is provided with a mechanical hand 24 for transferring the wafer 10, and the mechanical hand 24 is used to take and transfer the wafer 10 between the wafer storage cavity 211 of the moving device body 21 and the transfer cavity 12. Figure 4 ​The control module 3 is also connected with the first gate valve 11 and used for controlling the opening and closing of the first gate valve 11.

[0062] In some embodiments of the present application, the control module 3 is connected with the second gate valve 23 and used for controlling the opening and closing of the second gate valve 23. Figure 1 and Figure 4 The vacuum control pipeline 22 comprises a vacuum pump 221 and an air exhaust pipeline 222, two ends of the air exhaust pipeline 222 are respectively connected with the wafer accommodating cavity 211 and the vacuum pump 221, so as to vacuumize the wafer accommodating cavity 211. That is, the vacuum pump 221 is integrated on the mobile device body 21, so that the wafer conveying device 2 becomes a movable "conveying cabin" with vacuum generation and vacuum maintenance, so that the wafer accommodating cavity 211 can be vacuumized according to the demand or the set vacuum degree, so that the wafer 10 can be conveyed in the vacuum environment all the time, the number of times of exposure of the wafer 10 to the atmosphere is minimized, and the risk of oxidation or pollution caused by breaking the vacuum is reduced or avoided.

[0063] In some embodiments of the present application, the control module 3 is connected with the second gate valve 23 and used for controlling the opening and closing of the second gate valve 23. Figure 1 、 Figure 3 and Figure 4 The wafer conveying device 2 further comprises a vacuum gauge 25, a sensor of the vacuum gauge 25 is arranged in the wafer accommodating cavity 211, the control module 3 is connected with the vacuum pump 221, the second gate valve 23 and a signal output end of the vacuum gauge 25 respectively, and the control module 3 controls the vacuum pump 221 and the second gate valve 23 to work cooperatively according to the electric signal output by the vacuum gauge 25 (that is, the vacuum degree information in the wafer accommodating cavity 211 detected by the sensor of the vacuum gauge 25 is transmitted to the signal output end of the vacuum gauge 25 and converted into the corresponding electric signal), so that the vacuum degree in the wafer accommodating cavity is within the preset range. The present application integrates a vacuum monitoring and control system, so that the wafer conveying device 2 has a self-adaptive vacuum system, so as to automatically and real-timely adjust the working parameters of the vacuum pump 221 according to the process requirements of the wafer 10 and the environmental changes in the conveying process, realize accurate vacuum degree control, make the wafer 10 always convey in the controllable vacuum environment of the wafer accommodating cavity 211, and ensure the reliability and repeatability of the wafer 10 transfer process, and reduce manual intervention.

[0064] In the embodiment, the control module 3 controls the vacuum pump 221 and the second gate valve 23 to work cooperatively according to the electrical signal output by the vacuum gauge 25, including: the control module 3 controls to close the second gate valve 23, then controls to open the vacuum pump 221, and then controls to open the second gate valve 23 and the first gate valve 11 of the machine table 1 after the vacuum degree in the wafer receiving cavity 211 reaches a preset range, and then controls to open the second gate valve 23 and the first gate valve 11, and controls to close the vacuum pump 221 during the docking. The control module 3 can control the vacuum pump 221 to work and make the vacuum degree in the wafer receiving cavity 211 equal to the vacuum degree in the conveying cavity of the machine table 1, so as to avoid affecting the process environment in the conveying cavity due to the difference between the vacuum degree in the wafer receiving cavity 211 and the vacuum degree in the conveying cavity of the machine table 1. After the wafer is conveyed into the wafer receiving cavity 211, the control module 3 can also control to close the second gate valve 23 and control the vacuum pump 221 to work to adjust the vacuum degree in the wafer receiving cavity 211 during the conveying process of the wafer, so that the vacuum degree in the wafer receiving cavity 211 meets the requirement of the vacuum degree during the conveying process of the wafer, so as to avoid affecting the quality of the wafer; or the control module 3 controls the vacuum pump 221 to work and makes the vacuum degree in the wafer receiving cavity 211 equal to the vacuum degree in the conveying cavity of the machine table 1 of the next process. Specifically, the control module 3 controls the vacuum pump 221 and the second gate valve 23 to work cooperatively according to the electrical signal output by the vacuum gauge 25, which can be set according to actual conditions and requirements, and will not be described here.

[0065] In some specific embodiments of the application, the number of vacuum gauges 25 is multiple, which are arranged at different positions of the wafer receiving cavity 211 to monitor the vacuum degree at different positions of the wafer receiving cavity 211 in real time, and confirm that the wafer 10 is always conveyed in the controllable vacuum environment of the wafer receiving cavity 211.

[0066] In some specific embodiments of the present application, the semiconductor device further comprises a parameter input module for inputting parameter information, wherein the parameter information comprises performance parameters of the machine, process parameters of a process performed in the machine, real-time environmental parameters, etc. The control module is connected with the parameter input module and cooperates with the vacuum pump 221 and the second gate valve 23 to adjust the vacuum degree in the wafer storage cavity 211 according to the parameter information input by the parameter input module. Thus, the control module 3 not only controls the vacuum pump 221 and the second gate valve 23 to work cooperatively based on the vacuum degree information in the wafer storage cavity 211, but also controls the vacuum pump 221 and the second gate valve 23 to work cooperatively based on the performance of the machine 1, the process performed in the machine 1 (for example, a higher vacuum degree is required for an oxidation machine), real-time environment, etc. Thus, the wafer conveying device 2 can adjust the vacuum degree in the wafer storage cavity 211 in real time according to the process requirements of the wafer 10 and the environmental changes in the conveying process, which is beneficial to avoid affecting the quality of the wafer due to the vacuum degree in the conveying process.

[0067] In some embodiments of the present application, with reference to Figure 1 、 Figure 3 and Figure 4 , the vacuum control pipeline 22 further comprises a pressure regulating valve 223 arranged in the air exhaust pipeline 222. The control module 3 is connected with the pressure regulating valve 223 to adjust the vacuum degree or the vacuum pumping rate in the wafer storage cavity 211 by controlling the opening degree of the pressure regulating valve 223. Thus, the working parameters of the pressure regulating valve 223 can be automatically adjusted according to the process requirements of the wafer and the environmental changes in the conveying process, so as to realize precise vacuum degree control. Moreover, after the air in the wafer storage cavity 211 is exhausted by the vacuum pump 221, the pressure regulating valve 223 is controlled to be closed by the control module 3, so that the wafer storage cavity 211 can be kept in a vacuum state, thereby avoiding long-time working of the vacuum pump 221.

[0068] In some specific embodiments of the present application, when the vacuumizing instruction is received, the control module 3 controls to start the vacuum pump 221, and after the vacuum pump 221 reaches the normal rotating speed (for example, a delay T1 time, T1 is set according to specific requirements), the pressure regulating valve 223 is controlled to be opened to perform air extraction in the wafer receiving cavity 211; the control module 3 compares and analyzes the actual vacuum degree value detected by the vacuum gauge 25 in real time with the target vacuum degree set value, and when the actual vacuum degree value reaches and stabilizes at the target vacuum degree set value, the control module 3 controls to close the pressure regulating valve 223 to isolate the wafer receiving cavity 211 from the vacuum pump 221, and after a delay T2 time (T2 time is set according to specific requirements), the control module 3 controls to close the vacuum pump 221, so that the wafer receiving cavity 211 can realize pressure maintaining and wafer conveying. That is, when the vacuum pump 221 is closed, the pressure regulating valve 223 should be closed first to prevent air backflow, so as to maintain the vacuum degree in the wafer receiving cavity 211.

[0069] In some embodiments of the present application, the semiconductor equipment further comprises an alarm module, the control module 3 is connected with the alarm module and automatically controls to close the pressure regulating valve 223 and controls the alarm module to issue an alarm when the vacuum degree in the wafer receiving cavity 211 exceeds a preset value, so as to prevent the wafer conveying device from air leakage and other sudden situations, which is beneficial to protect the wafer conveying device. The preset value can be set according to actual machine application and process.

[0070] In some embodiments of the present application, referring to Figure 3 , the machine 1 comprises a plurality of process cavities and at least one loading cavity. In another embodiment of the present application, the machine 1 comprises a plurality of process cavities.

[0071] In some embodiments of the present application, referring to Figure 3 , the conveying cavity 12 comprises at least one process cavity and / or at least one loading cavity, and the process cavity and the loading cavity are provided with a conveying port, and the first gate valve 11 is arranged on the conveying port. One or more process cavities and / or one or more loading cavities can be selected according to the process requirement of the original semiconductor equipment, and the first gate valve 11 is arranged on the conveying port, so that the original equipment is changed little, and the equipment compatibility modification cost is reduced.

[0072] In some specific embodiments of the present application, as Figure 3One of the processing chambers of the original semiconductor equipment is selected as the transfer chamber, and a transfer port is opened. The first valve 11 is installed at the transfer port. When the wafer needs to be transferred to the next machine, the second valve 23 of the wafer transfer device 2 is connected to the first valve 11, and the wafer is transferred from the loading chamber to the wafer storage chamber 211 by the robot 24.

[0073] In some embodiments of the present application, one of the processing chambers of the original semiconductor equipment is selected as the transfer chamber, and a transfer port is opened. The first valve 11 is installed at the transfer port.

[0074] In some embodiments of the present application, the machine 1 further comprises a machine robot arranged in the wafer transfer chamber. The machine robot is used to transfer the wafer from the processing chamber or the loading chamber to the transfer chamber. Other components of the machine 1 and related structures are conventional arrangements in the art, and will not be described here.

[0075] In some embodiments of the present application, the machine 1 further comprises a machine robot arranged in the wafer transfer chamber. The machine robot is used to transfer the wafer from the processing chamber or the loading chamber to the transfer chamber. Other components of the machine 1 and related structures are conventional arrangements in the art, and will not be described here. Figures 1 to 3The adapter 46 comprises an adapter body 461, a first quick-change interface 462 and a second quick-change interface 463, the first quick-change interface 462 and the second quick-change interface 463 are respectively arranged at two symmetrical ends of the adapter body 461, and a wafer transmission channel is arranged in the adapter body 461 and communicates the first quick-change interface 462 and the second quick-change interface 463, the first quick-change interfaces 462 of a plurality of adapters 46 are structurally identical and matched with the second gate valve 23, the second quick-change interfaces 463 of a plurality of adapters 46 are structurally different and matched with the first gate valve 11 of a plurality of target machines 1 one by one, and the adapter 46 is detachably arranged on the second gate valve 23 through the first quick-change interface 462. That is, one end of the adapter 46 is detachably arranged on the second gate valve 23 through a standard interface matched with the second gate valve 23; the other end of the adapter 46 is provided with a customized interface matched with the first gate valve 11 of the target machine 1, so as to be matched with different target machines 1, so that the wafer conveying device 2 can quickly and flexibly be vacuum sealed and docked with the first gate valve 11 of a plurality of different types of machines 1 by replacing the adapter 46. Through the modular adapter design, one wafer conveying device 2 can be arranged to adapt to wafer conveying between different machines 1, which significantly reduces equipment investment cost and maintenance complexity, has high flexibility, and can be matched with different target machines 1 or new types of machines 1 by replacing different adapters.

[0076] In some specific embodiments of the present application, the first quick-change interface and the second quick-change interface are any one of a mechanical buckle, an electromagnetic lock and a pneumatic lock. The specific structure, mounting mode and mechanism of the mechanical buckle, the electromagnetic lock and the pneumatic lock are conventional settings in the art, which will not be described here.

[0077] In some specific embodiments of the present application, the mounting base is arranged on the end flange of the docking arm.

[0078] In some embodiments of the present application, the semiconductor equipment further comprises a mechanical arm and a navigation system connected with the control module 3 respectively, the control module 3 can navigate (such as SLAM and laser navigation) and control the mechanical arm to move the wafer conveying device 2 to a required target position according to the information fed back by the navigation system, such as the control module 3 controlling the mechanical arm to move the wafer conveying device 2 and the docking mechanism 4 to a preset standby area in front of the target machine 1.

[0079] In some embodiments of the present application, reference is made to Figures 1 to 4The first gate valve 11 and the second gate valve 23 are each provided with a visual identification structure, the first positioning assembly includes a visual sensor 42 and a laser ranging sensor 43, the visual sensor 42 and the laser ranging sensor 43 are arranged on the mounting base 47, and are used to identify the visual identification structure to detect the relative pose information between the adapter 46 and the first gate valve 11 and the second gate valve 23 respectively; the second positioning assembly includes a force sensor 44 and a position sensor 45, the force sensor 44 is arranged between the mounting base 47 and the end of the docking arm 41 and is used to detect the contact force information generated when the adapter 46 and the first gate valve 11 and the second gate valve 23 are in docking contact respectively, and the position sensor 45 is arranged on the mounting base 47 and is used to detect the position deviation information of the adapter 46 and the first gate valve 11 and the second gate valve 23 during docking, and the control module 3 is connected with the visual sensor 42, the laser ranging sensor 43, the force sensor 44 and the position sensor 45 respectively, and is used to calculate the pose deviation between the adapter 46 and the first gate valve 11 and the second gate valve 23 respectively in real time according to the relative pose information, the contact force information and the position deviation information, and control the movement of the docking arm 41 to complete the docking of the adapter 46 and the second gate valve 23, and the docking of the adapter 46 and the first gate valve 11.

[0080] In the embodiment, the docking arm 41 is initially located at a fixed "mounting position", which is accurately aligned with the second gate valve 23 on the mobile device body 21. The operator or the upper computer system selects the adapter 46 that needs to be equipped and matches the first gate valve 11 in the target machine 1, and after the mounting base 47 is equipped with the adapter 46, the visual sensor 42 and the laser ranging sensor 43 are used to obtain the macro pose deviation between the second gate valve 23 and the current adapter 46, the control module 3 controls the docking arm 41 to drive the adapter 46 on the mounting base 47 to make a first large-scale attitude adjustment, so that the first quick-change interface 462 on the adapter 46 is roughly aligned with the second gate valve 23, so that the adapter 46 and the second gate valve 23 are preliminarily aligned, the coarse positioning is completed, and the docking is performed. Then, the force sensor 44 is used to measure the force and torque when the adapter 46 contacts the second gate valve 23, the contact state is judged, the position sensor 45 is used to monitor the position deviation information of the adapter 46 and the second gate valve 23 during the docking process, and the control module 3 adjusts the movement of the docking arm 41 to gradually reduce the pose error according to the real-time monitoring of the force and the attitude during the docking process by the sensor, until the adapter 46 and the second gate valve 23 reach the preset docking position, so as to eliminate the pose deviation, realize accurate positioning, and establish a transmission channel from the wafer storage cavity 211 to the adapter.

[0081] In this embodiment, after the control module 3 controls the robot arm to move the wafer transfer device 2 together with the docking mechanism 4 to the preset standby area in front of the target machine 1, the visual sensor 42 and the laser ranging sensor 43 are used to obtain the macro pose deviation between the first gate valve 11 and the current adapter 46, and the control module 3 controls the docking arm 41 to drive the adapter 46 on the mounting base 47 to perform a second large-scale pose adjustment (at this time, if the pose adjustment is not large, the wafer transfer device 2 can not move, and when the pose adjustment is large, the control module 3 needs to control the robot arm to drive the wafer transfer device 2 and the docking mechanism 4 to move synchronously according to the relative pose information), so that the second quick-change interface 463 on the adapter 46 is roughly aligned with the first gate valve 11, so as to realize the preliminary alignment of the adapter 46 and the first gate valve 11, complete the coarse positioning and docking. Then, the force sensor 44 is used to measure the force and torque when the adapter 46 contacts the first gate valve 11, the contact state is judged, and the position deviation information of the adapter 46 and the first gate valve 11 during the docking process is obtained by the position sensor 45. The control module 3 controls the motion of the fine adjustment docking arm according to the real-time monitoring of the force and pose during the docking process by the sensor, gradually reduces the pose error, and finally realizes the preset docking position of the adapter 46 and the first gate valve 11, so as to eliminate the pose deviation and realize accurate positioning.

[0082] In this embodiment, the docking of the adapter 46 and the second gate valve 23 is a relatively fixed and highly repeatable “home” action. It can be completed by relying on the high repeat positioning accuracy of the docking arm 41 and the compliant compensation of the end. The docking of the adapter 46 and the first gate valve 11 is a variable and intelligent perception “out task” action. Because the absolute coordinates of the position of each machine 1 have a slight deviation, and may change with thermal expansion and cold contraction. Through the coarse positioning of the first positioning assembly and the fine positioning of the second positioning assembly and the active force control, reliable docking with different target machines 1 can be realized. The whole docking process of the present application does not need manual intervention, realizes full automation, is suitable for unmanned production environment; reduces the production stop caused by docking failure, enhances the system availability, and improves the overall production efficiency and equipment utilization (OEE). That is, the present application is beneficial to realize adaptive, fast, accurate, reliable and unmanned docking between the wafer transfer device 2 and multiple different types of target machines 1.

[0083] In some embodiments of the present application, the docking mechanism 4 further comprises a locking structure, which comprises a first locking structure and a second locking structure. The first locking structure is arranged on the first quick-change interface or the second gate valve. After the adapter and the second gate valve reach a preset docking position, the first locking structure is controlled to lock and seal the first quick-change interface of the adapter and the second gate valve. The second locking structure is arranged on the second quick-change interface or the first gate valve. After the second quick-change interface on the adapter is aligned with the first gate valve, the second locking structure is controlled to lock and seal the second quick-change interface of the adapter and the first gate valve. That is, after the adapter 46 and the second gate valve 23 and the first gate valve 11 are confirmed to be aligned, a locking action is performed under the control of the control module 3, so as to establish a closed vacuum wafer 10 transmission channel from the wafer conveying device 2 to the cavity of the machine table 1.

[0084] In some embodiments of the present application, after the locking of the adapter and the second gate valve 23 and the first gate valve 11 is completed, the control module controls the second gate valve 23 to be opened, the first gate valve 11 to be kept closed, and the vacuum control pipeline 22 to be controlled to vacuumize the wafer conveying cavity 211 in the wafer conveying device 2 and the wafer transmission channel in the adapter connected thereto, and then the first gate valve 11 is opened, so as to realize the vacuum environment required for the wafer 10 to be transmitted from the conveying cavity to the wafer conveying cavity 211. After the wafer 10 is transmitted, the locking structure between the first gate valve 11 and the adapter is loosened, the docking arm is slightly retreated, the adapter is separated from the first gate valve 11, and the docking arm can carry the adapter back to the “mounting position” of the device body 21 or put the adapter back to the adapter storage rack and then take another adapter to dock the next machine table 1.

[0085] In some embodiments of the present application, the locking structure comprises a mechanical locking structure, an electromagnetic locking structure or a pneumatic locking structure. The mechanical locking structure is, for example, a bolt driven by electricity, a hook claw or a wedge mechanism, which realizes physical interlocking. The electromagnetic locking structure generates strong attraction by excitation and adheres to the magnetic conductive plate on the target interface. The pneumatic locking structure generates negative pressure by vacuumizing and is adsorbed on the smooth plane of the target interface.

[0086] In some specific embodiments of the present application, after the pose deviation and the contact force both reach a preset perfect docking threshold, the locking structure (such as an international standard ISO-K or CF flange clamp) on the first gate valve 11 and the second quick-change interface of the adapter is driven (pneumatically or electrically), so as to rigidly lock and compress the sealing ring, and form a vacuum seal.

[0087] In some embodiments of the present application, the control module 3 can calculate the pose deviation between the adapter and the second gate valve 23, and the pose deviation between the adapter and the current first gate valve 11 in real time through built-in algorithms such as image recognition, point cloud registration, force-position hybrid control, etc., to control the movement of each joint in the docking arm.

[0088] In some embodiments of the present application, the outer edge part of the first gate valve 11 and the second gate valve 23 is provided with the visual recognition structure, which includes a Retro-reflective marker or a coded visual target. The retro-reflective marker is a special reflective material that strongly reflects light only in the direction of the light source, forming a high-contrast bright spot with extremely strong anti-environmental light interference ability. The coded target, such as AprilTag, QR code or DataMatrix code, can not only provide position information, but also provide a unique identity code to instantly identify "which number of the first gate valve of the machine tool", and calculate the precise six-degree-of-freedom pose of the camera relative to the target, i.e. the visual recognition structure.

[0089] In some embodiments of the present application, the visual sensor 42 includes a camera and a ring light source structure. The ring light source structure illuminates the visual recognition structure, and the camera captures images and quickly calculates the pose through built-in algorithms. The laser ranging sensor 43 can provide redundant distance verification or assist in positioning when part of the visual recognition structure is blocked.

[0090] In some embodiments of the present application, the force sensor 44 includes a six-dimensional force / torque sensor for detecting the contact force and torque information in three-dimensional space between the adapter 46 and the second gate valve 23 during docking, and the contact force and torque information in three-dimensional space between the adapter 46 and the first gate valve 11 during docking, i.e. six-dimensional force / torque that detects three-directional forces (Fx, Fy, Fz) and three-directional torques (Mx, My, Mz) at the same time.

[0091] Since the adapter has been docked with the second gate valve 23 before the adapter is docked with the first gate valve 11, the wafer conveying device 2 will interfere with the adjustment of the adapter 46 when the control module 3 controls the docking arm 41 to drive the adapter 46 to adjust the posture. In some embodiments of the present application, a pose adjustment assembly is arranged between the mounting base and the adapter, the pose adjustment assembly comprising a connecting base, a flexible hinge and a plurality of servo cylinders, a first end of the connecting base being connected with the mounting base, a second end of the connecting base arranged symmetrically with the first end being provided with a quick-change interface male head for connecting the adapter; the flexible hinge is connected with the mounting base and the connecting base respectively; the cylinder body of the servo cylinder is fixedly arranged on the mounting base, and the push rod of the servo cylinder is connected with the connecting base; the position sensor comprises a fixed scale and a moving scale, the fixed scale is arranged on the mounting base, and the moving scale is arranged on the connecting base, for real-time detection of linear displacement deviation of the connecting base relative to the mounting base in X, Y and Z axis directions and rotation angle deviation around each axis; the control module is connected with the servo cylinder, and controls the movement of the servo cylinder according to the linear displacement deviation and the rotation angle deviation information, so as to drive the adapter to move through the pose adjustment assembly, so that the adapter and the first gate valve 11 are flexibly docked, and the adapter and the first gate valve 11 can realize adaptive pose adjustment when they are docked, avoiding the interference of the wafer conveying device 2 with the adjustment of the mounting base. That is, the position sensor measures the slight deformation of the connecting base caused by contact force and initial deviation, and then the pose adjustment assembly is used for fine adjustment to complete the precise and flexible docking of the adapter and the first gate valve 11. This embodiment combines sensor and active flexible control, can automatically compensate positioning error and equipment manufacturing tolerance, realizes reliable docking, reduces collision risk, has high precision and high reliability; enables micro-motion adjustment, eliminates pose deviation, and realizes sub-millimeter level docking precision. Moreover, the influence of mechanical error and system vibration is effectively eliminated, and the success rate of docking and sealing reliability are guaranteed.

[0092] In this embodiment, during the preparation phase, each servo cylinder is given an initial thrust, which balances the weight of the connecting base and the adapter, and keeps the entire mechanism in a preset "zero position" (at which point the flexible hinge is in a non-deformed state). During the docking and orientation adjustment phase, when the contact force is transmitted to the connecting base through the connecting base, it attempts to displace the connecting base, resulting in slight elastic deformation of the flexible hinge. The force sensor detects the contact force information, and the position sensor detects the position deviation information, namely the linear displacement deviation and the rotation angle deviation around each axis. During the compensation phase, the control module 3 controls the corresponding cylinder to extend or retract based on the feedback from the force sensor and the position sensor, actively "yielding" or "blocking," thereby assisting the flexible hinge in completing the orientation adjustment and absorbing the deviation. Several servo cylinders are set up to facilitate different adjustment actions on different areas of the adapter, which helps to achieve smooth docking between the adapter and the first gate valve 11, and enables adaptive orientation adjustment when the adapter docks with the first gate valve 11, avoiding interference from the wafer transfer device 2 affecting the adjustment of the mounting base.

[0093] In some embodiments of the present invention, the position sensor is an optical grating ruler or a magnetic grating ruler.

[0094] In some embodiments of the present invention, the connecting base can be a rigid metal base, such as an aluminum alloy base or a stainless steel base.

[0095] In some embodiments of the present invention, the flexible hinge is a multi-degree-of-freedom flexible hinge. In some specific embodiments of the present invention, the flexible hinge includes a parallel plate flexible hinge and a spherical flexible hinge. The flexible hinge utilizes the elastic deformation of the material to provide the required micro-motion degrees of freedom (typically 3-6 degrees of freedom).

[0096] In some specific embodiments of the present invention, the mounting base and the connecting base are connected by a parallel plate flexible hinge. The parallel plate flexible hinge is integrally formed from two sets of four parallel flexible thin plates and three rigid blocks. The flexible thin plates are made of spring steel, with a thickness of 0.1mm to 0.5mm, a length of 10mm to 30mm, and a width consistent with the width of the connecting base. The upper rigid block of the parallel plate flexible hinge is fixed to the lower surface of the mounting base by screws, and its lower rigid block is connected to the connecting base by screws. When the adapter contacts the first gate valve 11 and is subjected to a lateral force or torque, this force forces the connecting base to displace, thereby causing the flexible thin plate to undergo elastic bending deformation, thus providing rotational freedom about an axis (Rx) parallel to the plate direction, and small translational freedom along the X and Y directions, achieving adaptive attitude adjustment. The preload is provided by the elastic restoring force of the flexible thin plate itself.

[0097] In some embodiments of the present application, referring to Figure 1 and Figure 2 The docking arm 41 comprises a plurality of joints 412 and a plurality of arm segments 411 connected in series, and adjacent arm segments 411 are connected through the joints 412.

[0098] In some embodiments of the present application, referring to Figure 1 and Figure 2 The arm segment 411 comprises a base, and a first arm segment, a second arm segment and a third arm segment connected in series from the base to the end, and adjacent arm segments are connected through joints; the joint 412 is a rotary joint, comprising a first joint, a second joint and a third joint, each of the first joint, the second joint and the third joint comprises a servo motor and a reducer connected with the control module, the first joint connects the base and the first arm segment, and the first joint drives the first arm segment to rotate around the first joint as the rotation center; the second joint connects the first arm segment and the second arm segment, and the second joint drives the second arm segment to rotate around the second joint as the rotation center; the third joint connects the second arm segment and the third arm segment, the third arm segment is rotationally arranged with the mounting base, and the third joint drives the third arm segment to rotate around the third joint as the rotation center. The multi-arm design allows the adapter to dock with different machines 1 with large differences in mounting position and angle, so that the docking arm can independently or cooperatively move each arm segment according to the position and angle of the second gate valve and the first gate valve to flexibly adjust the pose (i.e. position and attitude) of the adapter, thereby ensuring the accuracy and reliability of the adapter docking with the first gate valve and the second gate valve, and greatly improving the versatility of the equipment and the flexibility of the production line layout.

[0099] In some specific embodiments of the present application, each of the joints further comprises an absolute encoder and a brake connected to the control module respectively; wherein the servo motor serves as a power source, the stator of which is fixed in the previous arm joint or the base, and the output shaft of which is connected to the reducer; the reducer adopts a precision harmonic reducer or a planetary reducer, the input end of which is connected to the output shaft of the servo motor, and the output end of which is connected to the next arm joint, for increasing the output torque and improving the motion accuracy; the absolute encoder is built-in in the servo motor or independently arranged, for real-time feedback of the rotation angle of each joint; the brake is arranged at the tail of the servo motor, for locking the joint when power is off, to prevent the arm from moving due to gravity or external force. In some specific embodiments of the present application, the first joint drives the first arm joint to make rotational motion around the first vertical axis (Z axis), that is, the docking arm drives the adapter to make pitching motion, which is defined as the first degree of freedom; the second joint drives the second arm joint to make rotational motion around the first horizontal axis (Y axis), that is, the docking arm drives the adapter to make yawing motion, which is defined as the second degree of freedom; the third joint drives the third arm joint to make rotational motion around the axis of the second arm joint (X axis), that is, the docking arm drives the adapter to make yawing motion, which is defined as the third degree of freedom, so that the docking arm independently or cooperatively moves in multiple degrees of freedom (at least including movement in X, Y and Z directions and rotation around the Z axis), and this structure forms a classic articulated robot arm, which has three rotational degrees of freedom sufficient to make the adapter on the mounting base at the end of the docking arm reach a specified point (X, Y and Z coordinates) in the three-dimensional space.

[0100] In some embodiments of the present application, the third arm joint is rotatably connected to the mounting base through a bearing or a rotating member.

[0101] In some embodiments of the present application, with reference to Figure 4 and Figure 5The semiconductor device further comprises a cleaning assembly 5, which comprises a cleaning piece 53, a driving mechanism 51, and a telescopic connecting piece 52, one end of the telescopic connecting piece 52 is fixedly arranged on the top or sidewall of the wafer accommodating cavity 211 and connected with the driving mechanism 51, and in the retracted state, the telescopic connecting piece 52 is accommodated on the top or sidewall of the wafer accommodating cavity 211, i.e. above or beside the wafer 10 carrying table, the other end of the telescopic connecting piece 52 is connected with the cleaning piece 53, and the control module 3 is connected with the driving mechanism 51 and controls the driving mechanism 51 to drive the telescopic connecting piece 52 to extend or retract, so as to drive the cleaning piece 53 to clean the wafer 10. That is, the telescopic connecting piece 52 is driven by the driving mechanism 51 and can move between the standby position (in the retracted state, accommodated above or beside the wafer 10 carrying table, to avoid the robot 24 and the wafer 10) and the working position (in the extended state, to drive the cleaning piece 53 to align the surface of the wafer 10).

[0102] During the processing and conveying of the wafer 10, the surface of the wafer 10 can adsorb particles, organic matter and other pollutants. In the traditional process, cleaning is an independent process and needs to be carried out in a dedicated cleaning machine 1, which increases the production cycle, equipment cost and the risk of wafer 10 being contaminated by multiple handling. The wafer conveying device 2 of the embodiment integrates the cleaning assembly 5 in the conveying cavity, i.e. integrates the cleaning process into the conveying process, so that the cleaning function is integrated in the wafer 10 conveying path, the surface of the wafer 10 can be directly cleaned during the conveying of the wafer 10, the particles and impurities on the surface of the wafer 10 can be effectively removed, and the "one-step" conveying and cleaning is realized, so that the wafer 10 is prevented from being exposed to a non-clean environment and secondary pollution caused by multiple loading and unloading, and the wafer conveying device 2 is especially suitable for advanced processes with extremely high cleanliness requirements; moreover, the independent cleaning step is eliminated, the production cycle is significantly shortened, and the production efficiency is greatly improved; the wafer 10 can be cleaned in time, so that the pollutants possibly generated after the previous process step can be effectively removed, a clean wafer 10 surface is provided for the next key process step, and the product yield is improved; at the same time, the need for a large independent cleaning machine 1 is reduced, the clean room space and equipment investment of the semiconductor factory are saved, and the cost is reduced.

[0103] In some embodiments of the application, the driving mechanism 51 adopts a high-precision linear motor or a screw sliding table module to control the telescopic connecting piece 52 to extend or retract, so as to drive the cleaning piece to move up and down and clean.

[0104] In some embodiments of the present application, the cleaning member 53 comprises an electrostatic adsorption brush, which is a non-contact cleaning member and can effectively avoid damaging the wafer. The electrostatic adsorption brush is connected to a power supply to generate an electrostatic field by applying a bias voltage, which can effectively adsorb and remove charged particles on the surface. The voltage applied by the electrostatic adsorption brush needs to be controlled within a certain range to prevent the wafer from being adsorbed onto the electrostatic adsorption brush due to excessively high voltage.

[0105] In some embodiments of the present application, the cleaning assembly comprises a purge gas pipeline, a purge gas nozzle, and a purge gas supply device. The purge gas supply device is fixedly arranged outside the mobile device body. The two ends of the purge gas pipeline are in communication with the purge gas nozzle and the purge gas supply device, respectively. The purge gas nozzle is fixedly arranged in the wafer receiving cavity and located above the wafer carrying table in the wafer receiving cavity. The purge gas sprayed by the purge gas nozzle blows off the particles on the surface of the wafer, and the particles and possible volatiles are directly discharged through the vacuum control pipeline 22, which is conducive to preventing secondary pollution and completely removing the particles and impurities on the surface of the wafer 10.

[0106] In some embodiments of the present application, the purge gas supply device provides inert gas to purge and remove dust from the wafer. The inert gas includes nitrogen and the like.

[0107] In some embodiments of the present application, the cleaning assembly 5 further comprises a particle sensor arranged in the wafer receiving cavity 211 and connected to the control module 3. The particle sensor is used to monitor the number of particles on the surface of the wafer 10 before and after cleaning to evaluate the cleaning effect.

[0108] In some embodiments of the present application, referring to Figure 6 , the control method of the semiconductor equipment comprises the following steps:

[0109] S1, providing a semiconductor equipment;

[0110] S2, the control module controls the vacuum control pipeline to evacuate the wafer receiving cavity;

[0111] S3, an adapter compatible with the first gate valve in the target machine is equipped on the mounting base. The first positioning assembly detects the relative pose information between the adapter and the second gate valve and transmits it to the control module. The second positioning assembly detects the contact force information and the position deviation information of the adapter and the second gate valve during the docking process and transmits them to the control module. The control module controls the docking arm to drive the adapter to move according to the relative pose information, the contact force information, and the position deviation information, so that the adapter and the second gate valve of the wafer conveying device complete docking.

[0112] S4, the first positioning assembly detects relative position information between the adapter and the first gate valve and transmits the relative position information to the control module, the second positioning assembly detects contact force information and position deviation information of the adapter and the first gate valve during the docking process and transmits the contact force information and the position deviation information to the control module, and the control module controls the docking arm to drive the adapter to move according to the relative position information, the contact force information and the position deviation information, so that the adapter is docked with the first gate valve of the machine table.

[0113] In some embodiments of the application, the step S2 comprises:

[0114] The control module controls the vacuum pump to be started, and after a delay of T1, controls the pressure regulating valve to be opened to pump the wafer storage cavity; the vacuum gauge detects an actual vacuum degree value in the wafer storage cavity and transmits the actual vacuum degree value to the control module.

[0115] The control module compares and analyzes the actual vacuum degree value with a target vacuum degree set value, and when the actual vacuum degree value meets the target vacuum degree set value, the control module controls the pressure regulating valve to be closed to isolate the wafer storage cavity from the vacuum pump.

[0116] After a delay of T2, the control module controls the vacuum pump to be closed.

[0117] In some embodiments of the application, the step S3 comprises:

[0118] The visual sensor and the laser ranging sensor recognize a visual recognition structure on the second gate valve to detect relative position information between the second gate valve and the adapter; and the control module controls each joint in the docking arm to drive the adapter on the mounting base to adjust the attitude according to the relative position information, so that the first quick-change interface on the adapter is aligned with the second gate valve and is docked.

[0119] The force sensor detects contact force information generated when the adapter and the second gate valve are in contact during docking, and the position sensor detects position deviation information of the adapter and the second gate valve during the docking process; and the control module controls each joint in the docking arm to drive the adapter on the mounting base to adjust the attitude according to the contact force information and the position deviation information, until the first quick-change interface of the adapter is aligned with the second gate valve to complete the docking.

[0120] The control module controls the first locking structure to lock and seal the first quick-change interface of the adapter and the second gate valve.

[0121] In some embodiments of the application, the step S4 comprises:

[0122] moving the wafer transfer device to a preset standby area in front of the transfer cavity of the target machine;

[0123] The visual sensor and the laser ranging sensor identify a visual identification structure on the first gate valve to detect relative pose information between the first gate valve and the adapter; the control module controls the movement of each joint in the docking arm to drive the adapter on the mounting base to adjust the pose, so that the second quick-change interface on the adapter is aligned with and docked with the first gate valve;

[0124] The force sensor detects contact force information generated when the adapter and the first gate valve are in docking contact, and the position sensor detects position deviation information during the docking process of the adapter and the first gate valve; the control module controls the movement of each joint in the docking arm to drive the adapter on the mounting base to adjust the pose according to the contact force information and the position deviation information, until the adapter and the first gate valve reach a preset docking position to complete docking;

[0125] The control module controls the second locking structure to lock and seal the second quick-change interface of the adapter and the first gate valve.

[0126] In some embodiments of the present application, the step of moving the wafer transfer device to a preset standby area in front of the transfer cavity of the target machine includes: a navigation system detects the position of the target machine and transmits it to the control module, and the control module 3 can control the mechanical arm to move the wafer transfer device 2 to a preset standby area in front of the transfer cavity of the target machine according to the information fed back by the navigation system.

[0127] In some embodiments of the present application, the control method of the semiconductor equipment further includes a cleaning step, and the cleaning step includes:

[0128] The robot places the wafer on the wafer support table;

[0129] The control module controls the driving mechanism to drive the telescopic connecting piece to elongate to lower the cleaning piece to the working position;

[0130] The control module starts the cleaning piece to perform cleaning operation according to a preset program, for example, the cleaning piece can move along the radius direction of the wafer (or the wafer rotates) to realize scanning cleaning of the entire wafer surface; the particulate matter sensor feeds back the cleaning effect in real time, and the control module can adaptively adjust the cleaning parameters (such as cleaning time and intensity) accordingly;

[0131] After cleaning is completed, the control module controls the driving mechanism to drive the telescopic connecting piece to retract the cleaning piece to the standby position, and the robot takes away the wafer for subsequent transfer.

[0132] In some embodiments of the present application, the semiconductor device further comprises a pre-treatment module, which comprises a plasma treatment unit or other surface pre-treatment unit, for surface pre-treatment of the wafer during the transfer process, further removing possible oxide layer to improve the efficiency and quality of the subsequent process.

[0133] While the embodiments of the application have been illustrated and described in detail, it will be readily apparent to those skilled in the art that various modifications and changes can be made therein without departing from the scope and spirit of the application as described in the claims. Moreover, the application described herein can have other embodiments and be practiced or carried out in various ways.

Claims

1. A semiconductor device, characterized in that, include: Several machine tools, including a conveying cavity and a first gate valve disposed in the conveying cavity; A wafer transfer device includes a moving device body, a vacuum control pipeline, and a second gate valve; the vacuum control pipeline is connected to a wafer receiving cavity inside the moving device body; the second gate valve is disposed at an opening of the moving device body. The docking mechanism includes several adapters, a mounting base, a docking arm, a first positioning component, and a second positioning component. One interface of each adapter is adapted to and detachably connected to the second gate valve, and another interface of each adapter is adapted to and detachably connected to the first gate valves of several machine tools. The docking arm is fixed to the side wall of the mobile device body where the second gate valve is located. The mounting base is located at the end of the docking arm, and the adapter is detachably mounted on the mounting base. The first positioning component is mounted on the mounting base and is used to detect the relative position information between the adapter and the first and second gate valves, respectively. The second positioning component is mounted on the mounting base and is used to detect the contact force information and position deviation information between the adapter and the first and second gate valves, respectively, during the docking process. The control module is connected to the vacuum control pipeline, the first positioning component, the second positioning component, and the docking arm, respectively. It controls the vacuum control pipeline to evacuate the wafer housing cavity and controls the docking arm to drive the adapter to move according to the relative pose information, the contact force information, and the position deviation information.

2. The semiconductor device according to claim 1, characterized in that, The adapter includes an adapter body, a first quick-switch interface, and a second quick-switch interface. The first quick-switch interface and the second quick-switch interface are respectively provided at two symmetrical ends of the adapter body. The adapter body has a wafer transmission channel connecting the first quick-switch interface and the second quick-switch interface. The first quick-switch interface structures of several adapters are the same and adapted to the second gate valve. The second quick-switch interface structures of several adapters are different and are adapted to the first gate valves in several machines one by one. The adapter is detachably mounted to the second gate valve through the first quick-switch interface, and the adapter is detachably mounted to the first gate valve through the second quick-switch interface.

3. The semiconductor device according to claim 1, characterized in that, Both the first gate valve and the second gate valve are equipped with a visual recognition structure; The first positioning component includes a visual sensor and a laser rangefinder, which are disposed on the mounting base and are used to identify the visual recognition structure to detect the relative pose information between the adapter and the first gate valve and the second gate valve, respectively. The second positioning component includes a force sensor and a position sensor. The force sensor is disposed between the mounting base and the end of the docking arm and is used to detect the contact force information generated when the adapter makes docking contact with the first gate valve and the second gate valve, respectively. The position sensor is disposed on the mounting base and is used to detect the position deviation information of the adapter with the first gate valve and the second gate valve, respectively, during the docking process. The control module is connected to the vision sensor, the laser rangefinder, the force sensor, and the position sensor, respectively.

4. The semiconductor device according to claim 3, characterized in that, A pose adjustment component is provided between the mounting base and the adapter. The pose adjustment component includes a connecting base, a flexible hinge, and several servo cylinders. The first end of the connecting base is connected to the mounting base, and the second end of the connecting base, which is symmetrically arranged with respect to the first end, is provided with a quick-connect male connector for connecting the adapter; the flexible hinge is connected to the connecting base and the mounting base respectively; the cylinder body of the servo cylinder is fixedly mounted on the mounting base, and the push rod of the servo cylinder is connected to the connecting base; The position sensor includes a fixed scale part and a movable scale part. The fixed scale part is disposed on the mounting base, and the movable scale part is disposed on the connecting base, so as to detect in real time the linear displacement deviation of the connecting base relative to the mounting base in the X, Y, and Z axis directions and the rotation angle deviation around each axis. The control module is connected to the servo cylinder and controls the movement of the servo cylinder based on the linear displacement deviation and the rotation angle deviation information.

5. The semiconductor device according to claim 1, characterized in that, The docking arm includes: The arm segment includes a base, and a first arm segment, a second arm segment, and a third arm segment connected in series from the base to the end; The joint includes a first joint, a second joint, and a third joint. The first joint connects the base to the first arm segment, the second joint connects the first arm segment to the second arm segment, and the third joint connects the second arm segment to the third arm segment. The third arm segment is connected to the mounting base. The first joint, the second joint, and the third joint each include a servo motor and a reducer that are respectively connected to the control module.

6. The semiconductor device according to claim 2, characterized in that, The docking mechanism further includes a locking structure, which includes a first locking structure and a second locking structure. The first locking structure is disposed at the first quick-change port or the second gate valve to lock and seal the first quick-change port of the adapter with the second gate valve. The second locking structure is disposed at the second quick-change port or the first gate valve to lock and seal the second quick-change port of the adapter with the first gate valve.

7. The semiconductor device according to claim 1, characterized in that, The vacuum control pipeline includes a vacuum pump and an evacuation pipeline, with the two ends of the evacuation pipeline connected to the wafer housing cavity and the vacuum pump, respectively. The wafer transfer device also includes a vacuum gauge, with the sensor of the vacuum gauge disposed within the wafer housing cavity. The control module is connected to the vacuum pump, the second gate valve, and the signal output terminal of the vacuum gauge, respectively. The control module controls the vacuum pump and the second gate valve to work together according to the electrical signal output by the vacuum gauge, so that the vacuum level within the wafer housing cavity is within a preset range.

8. The semiconductor device according to claim 7, characterized in that, The vacuum control pipeline also includes a pressure regulating valve, which is located in the evacuation pipeline. The control module is connected to the pressure regulating valve to adjust the vacuum level or evacuation rate in the wafer housing cavity by controlling the opening of the pressure regulating valve.

9. The semiconductor device according to claim 8, characterized in that, It also includes an alarm module and / or a parameter input module; The control module is connected to the alarm module, and when the vacuum level in the wafer housing cavity exceeds a preset value, it controls the pressure regulating valve to close and controls the alarm module to issue an alarm. The parameter input module is used to input parameter information, which includes the performance parameters of the machine, the process parameters of the process performed in the machine, and the real-time environmental parameters. The control module is connected to the parameter input module and controls the vacuum pump and the second gate valve to work together according to the parameter information input by the parameter input module in order to adjust the vacuum level in the wafer housing cavity.

10. The semiconductor device according to claim 1, characterized in that, The machine tool includes several process chambers and at least one loading chamber, or the machine tool includes several process chambers; the conveying chamber includes at least one of the process chambers and / or at least one of the loading chambers, the process chambers and the loading chambers are provided with conveying ports, and the conveying ports are provided with the first gate valve.

11. The semiconductor device according to claim 1, characterized in that, It also includes cleaning components; The cleaning assembly includes a cleaning component, a drive mechanism, and a retractable connector. One end of the retractable connector is fixedly disposed on the top or side wall of the wafer receiving cavity and connected to the drive mechanism, and the other end of the retractable connector is connected to the cleaning component. The cleaning component includes an electrostatic adsorption brush. The control module is connected to the drive mechanism and controls the drive mechanism to extend or retract the retractable connector, thereby driving the cleaning component to perform a cleaning operation on the wafer.

12. The semiconductor device according to claim 1, characterized in that, It also includes cleaning components; The cleaning assembly includes a purge gas pipeline, a purge gas nozzle, and a purge gas supply device. The purge gas supply device is fixedly installed outside the mobile device body. The two ends of the purge gas pipeline are respectively connected to the purge gas nozzle and the purge gas supply device. The purge gas nozzle is fixedly installed inside the wafer housing cavity and is located above the wafer carrier stage inside the wafer housing cavity.

13. A method for controlling a semiconductor device, characterized in that, Includes the following steps: S1. Providing a semiconductor device as described in any one of claims 1 to 12; S2, The control module controls the vacuum control pipeline to evacuate the wafer housing cavity; S3. An adapter adapted to the first gate valve in the target machine is mounted on a mounting base. The first positioning component detects the relative pose information between the adapter and the second gate valve and transmits it to the control module. The second positioning component detects the contact force information and position deviation information between the adapter and the second gate valve during the docking process and transmits them to the control module. The control module controls the docking arm to move the adapter according to the relative pose information, the contact force information and the position deviation information, so that the adapter and the second gate valve of the wafer transfer device can complete the docking. S4. The first positioning component detects the relative pose information between the adapter and the first gate valve and transmits it to the control module. The second positioning component detects the contact force information and position deviation information between the adapter and the first gate valve during the docking process and transmits them to the control module. The control module controls the docking arm to move the adapter according to the relative pose information, the contact force information and the position deviation information, so that the adapter and the first gate valve of the machine are docked.

14. The control method for a semiconductor device according to claim 13, characterized in that, Step S2 includes: The control module controls the start of the vacuum pump and, after a delay of T1 time, controls the opening of the pressure regulating valve to evacuate the wafer housing cavity; the vacuum gauge detects the actual vacuum level in the wafer housing cavity and transmits it to the control module. The control module compares and analyzes the actual vacuum value with the target vacuum setting value, and when the actual vacuum value meets the target vacuum setting value, the control module controls the pressure regulating valve to be closed. After a delay of time T2, the control module shuts down the vacuum pump.

15. The control method for a semiconductor device according to claim 13, characterized in that, Step S3 includes: A visual sensor and a laser rangefinder identify the visual recognition structure on the second gate valve to detect the relative pose information between the second gate valve and the adapter; the control module controls the docking arm to move according to the relative pose information to drive the adapter on the mounting base to adjust its attitude so that the first quick-connect interface on the adapter is aligned with the second gate valve and docked. A force sensor detects the contact force information generated when the adapter and the second gate valve are in contact during docking, and a position sensor detects the position deviation information of the adapter and the second gate valve during the docking process; the control module controls the docking arm to move according to the contact force information and the position deviation information to drive the adapter on the mounting base to adjust its attitude until the adapter and the second gate valve reach the preset docking position to complete the docking; The control module controls the first locking structure to lock and seal the first quick-change interface of the adapter with the second gate valve.

16. The control method for a semiconductor device according to claim 15, characterized in that, Step S4 includes: Move the wafer transfer device to the preset standby area in front of the transfer cavity of the target machine; The visual sensor and the laser rangefinder identify the visual recognition structure on the first gate valve to detect the relative pose information between the first gate valve and the adapter; the control module controls the docking arm to move according to the relative pose information to drive the adapter on the mounting base to adjust its posture so that the second quick-connect interface on the adapter is aligned with the first gate valve and docked. The force sensor detects the contact force information generated when the adapter and the first gate valve are in contact during docking, and the position sensor detects the position deviation information between the adapter and the first gate valve during the docking process. The control module controls the docking arm to move according to the contact force information and the position deviation information to drive the adapter on the mounting base to adjust its attitude until the adapter and the first gate valve reach the preset docking position to complete the docking. The control module controls the second locking structure to lock and seal the second quick-change interface of the adapter with the first gate valve.

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