Equipment suitable for stripping wafer into box

Abstract

The invention provides equipment suitable for wafer stripping and boxing, which comprises an equipment main body, the equipment main body comprises a frame, an inlet conveying mechanism is arranged in the frame, the inlet conveying mechanism conveys a ceramic carrier to an overturning jacking mechanism, the ceramic carrier comprises a ceramic disc and a wafer, a water spraying system is arranged above the overturning jacking mechanism, and the water spraying system is arranged above the overturning jacking mechanism. The working direction of the water spraying system faces the joint of the ceramic disc and the wafer; the wafer falls off from the ceramic disc and slides to the outlet conveying mechanism, the wafer slides into a wafer box in the pure water tank through the outlet conveying mechanism, a tray is arranged below the wafer box, a tray positioning mechanism used for adjusting and positioning the front, back, left and right positions of the wafer box is arranged on the tray, and the tray is connected with the pure water tank through a guiding vertical moving mechanism. According to the invention, the rate of finished products is reduced by reducing the risks of easy bumping, fragmentation, scratching and the like caused by manual cleaning.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and more specifically to a device suitable for wafer stripping and cassette loading. Background Technology

[0002] Wafers are the core material in semiconductor manufacturing, primarily made of high-purity single-crystal silicon, and used as the carrier and production medium for integrated circuits. To prevent scratches and breakage during wafer removal from external objects and ensure the stability and safety of the process, automated wafer removal and placement equipment is needed to reduce these issues and improve yield. Summary of the Invention

[0003] In view of the problems existing in the prior art, the present invention provides a device suitable for wafer stripping and cassette loading to solve at least one of the above-mentioned technical problems.

[0004] The technical solution of the present invention is: a device suitable for wafer detachment and cassette loading, comprising a device body, characterized in that the device body includes a frame, an inlet conveying mechanism is provided within the frame, the inlet conveying mechanism conveys a ceramic carrier to a flipping and lifting mechanism, the ceramic carrier includes a ceramic disk and a wafer, and a water spraying system is provided above the flipping and lifting mechanism, the working direction of the water spraying system being towards the junction of the ceramic disk and the wafer;

[0005] The wafer detaches from the ceramic tray and slides toward the outlet conveying mechanism. The wafer slides into the wafer box in the pure water tank through the outlet conveying mechanism. A tray is provided below the wafer box. The tray is provided with a tray positioning mechanism for adjusting and positioning the wafer box in all directions. The tray is connected to the pure water tank through a guide up-down moving mechanism.

[0006] This invention reduces the risks of damage and scratches caused by manual cleaning, which can lead to a lower yield. Initially, the wafers are vacuum-adsorbed onto a ceramic disk using a template medium. An operator pushes the ceramic disk containing the wafers into a designated position, or, in an automatic mode, a motor-driven belt conveyor automatically transports the wafers to the designated position. Then, ultrapure water is used to rinse the corners of the wafers and template medium. At a specific angle, the ultrapure water first weakens the adsorption force of the template medium, and then the pushing force of the ultrapure water separates the wafers from the ceramic disk, allowing them to slide into the corresponding wafer cassette in the ultrapure water tank. After the wafers have successfully slid into the corresponding wafer cassette, a mechanism lowers the cassette, making room for the next empty slot, and the process continues.

[0007] Further preferably, the transmission direction of the inlet transmission mechanism is perpendicular to the transmission direction of the outlet transmission mechanism.

[0008] This shortens the movement path of the wafer, thereby reducing the probability of it breaking due to impact.

[0009] In a further preferred embodiment, the tilting and lifting mechanism includes a worktable, with a cylinder located below the worktable. The cylinder tilts the worktable at a certain angle to form a ramp, and the ramp faces the outlet conveying mechanism.

[0010] The inclined worktable facilitates the detachment of wafers and their sliding towards the exit conveyor mechanism.

[0011] Further preferably, the main body of the equipment includes an electrical control system, which is installed at the lower end of the frame, and the electrical control system includes a PLC and a servo control system.

[0012] When the equipment is in operation, the ceramic carrier can be moved manually or automatically.

[0013] Further preferably, a touch screen for controlling the main body of the device is installed on the outer wall of the frame.

[0014] The automatic operation of the main body of the device is controlled via a touch screen.

[0015] Furthermore, the tilting and lifting mechanism is equipped with a limit switch to prevent the ceramic carrier from exceeding its limit and causing damage.

[0016] Further preferably, the frame is provided with feet at the bottom.

[0017] This makes the overall placement more stable.

[0018] Preferably, the pure water tank is disposed within the frame.

[0019] This ensures that the wafer is buffered by pure water during the wafer removal and placement process, reducing the risk of breakage from impacts. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0021] In the diagram: 1. Frame; 2. Inlet conveyor mechanism; 3. Touch screen; 4. Electrical control system; 5. Foot; 6. Water spray system; 7. Tilting and lifting mechanism; 8. Outlet conveyor mechanism; 9. Guide up-and-down moving mechanism; 10. Pallet positioning mechanism. Detailed Implementation

[0022] The present invention will now be further described with reference to the accompanying drawings.

[0023] Reference Figure 1As shown, a device for wafer detachment and cassette loading includes a main body, which includes a frame 1. An inlet conveying mechanism 2 is provided within the frame. The inlet conveying mechanism conveys a ceramic carrier to a flipping and lifting mechanism 7. The ceramic carrier includes a ceramic disk and a wafer. A water spraying system 6 is provided above the flipping and lifting mechanism, with the working direction of the water spraying system facing the junction of the ceramic disk and the wafer. The wafer detaches from the ceramic disk and slides towards an outlet conveying mechanism 8. The wafer slides into a wafer cassette in a pure water tank through the outlet conveying mechanism. A tray is provided below the wafer cassette, and a tray positioning mechanism 10 is provided on the tray for adjusting and positioning the front, back, left, and right positions of the wafer cassette. The tray is connected to the pure water tank through a guide up-and-down moving mechanism 9.

[0024] This invention reduces the risks of damage and scratches caused by manual cleaning, which can lead to a lower yield. Initially, the wafers are vacuum-adsorbed onto a ceramic disk using a template medium. An operator pushes the ceramic disk containing the wafers into a designated position, or, in an automatic mode, a motor-driven belt conveyor automatically transports the wafers to the designated position. Then, ultrapure water is used to rinse the corners of the wafers and template medium. At a specific angle, the ultrapure water first weakens the adsorption force of the template medium, and then the pushing force of the ultrapure water separates the wafers from the ceramic disk, allowing them to slide into the corresponding wafer cassette in the ultrapure water tank. After the wafers have successfully slid into the corresponding wafer cassette, a mechanism lowers the cassette, making room for the next empty slot, and the process continues.

[0025] Further optimization involves arranging the inlet conveyor mechanism perpendicular to the outlet conveyor mechanism. This shortens the wafer's movement path, thereby reducing the probability of breakage due to impacts.

[0026] Further optimized, the tilting and lifting mechanism includes a worktable with a cylinder underneath. The cylinder tilts the worktable at a certain angle to form a ramp, which faces the exit conveyor mechanism. The ramp of the worktable facilitates the wafer's detachment and sliding towards the exit conveyor mechanism.

[0027] Further preferably, the main body of the equipment includes an electrical control system 4, which is installed at the lower end of the frame. The electrical control system includes a PLC and a servo control system. When the equipment is working, the ceramic carrier can be moved manually or automatically.

[0028] Further preferably, a touch screen 3 for controlling the main body of the device is installed on the outer wall of the frame. The automatic operation of the main body of the device is controlled by the touch screen.

[0029] Further optimization involves incorporating a limit switch into the tilting and lifting mechanism to prevent damage to the ceramic carrier caused by exceeding its limit.

[0030] Further optimization involves providing feet 5 at the bottom of the frame to ensure greater stability when placed.

[0031] Further optimization involves placing the pure water tank within the frame. This ensures that the wafers are buffered by pure water during the wafer removal and placement process, reducing the risk of breakage from impacts.

[0032] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A device for wafer stripping and cassette loading, comprising a main body, characterized in that, The main body of the equipment includes a frame, and an inlet conveying mechanism is provided inside the frame. The inlet conveying mechanism conveys a ceramic carrier to a tilting and lifting mechanism. The ceramic carrier includes a ceramic disk and a wafer. A water spraying system is provided above the tilting and lifting mechanism. The working direction of the water spraying system is towards the junction of the ceramic disk and the wafer. The wafer detaches from the ceramic tray and slides toward the outlet conveying mechanism. The wafer slides into the wafer box in the pure water tank through the outlet conveying mechanism. A tray is provided below the wafer box. The tray is provided with a tray positioning mechanism for adjusting and positioning the wafer box in all directions. The tray is connected to the pure water tank through a guide up-down moving mechanism.

2. The device for wafer stripping and cassette loading according to claim 1, characterized in that, The transmission direction of the inlet transmission mechanism is perpendicular to the transmission direction of the outlet transmission mechanism.

3. The device for wafer stripping and cassette loading according to claim 1, characterized in that, The tilting and lifting mechanism includes a worktable, and a cylinder is provided below the worktable. The cylinder tilts the worktable at a certain angle to form a ramp, and the ramp faces the outlet conveying mechanism.

4. The device for wafer stripping and cassette loading according to claim 1, characterized in that, The main body of the equipment includes an electrical control system, which is installed at the lower end of the frame. The electrical control system includes a PLC and a servo control system.

5. The device for wafer stripping and cassette loading according to claim 1, characterized in that, A touchscreen for controlling the main body of the device is installed on the outer wall of the frame.

6. The device for wafer stripping and cassette loading according to claim 1, characterized in that, The tilting and lifting mechanism is equipped with a limit switch.

7. The device for wafer stripping and cassette loading according to claim 1, characterized in that, The frame is equipped with feet at the bottom.

8. The device for wafer stripping and cassette loading according to claim 1, characterized in that, The pure water tank is housed within the frame.

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