Narrow-spectrum super-radiation light-emitting diode structure

Abstract

The invention relates to the field of semiconductor light-emitting devices, and discloses a narrow-spectrum super-radiation light-emitting diode structure which comprises a packaging shell, a semiconductor chip, a collimating lens, an optical filter, a converging lens and a coupling optical fiber. The collimating mirror is used for collimating light beams emitted by the semiconductor chip and adjusting light spot intensity distribution parameters of the light beams; the light filter is used for regulating and controlling spectral parameters of light beams emitted by the semiconductor chip; the converging lens is used for converging and coupling the emergent light beams passing through the light filter to the coupling optical fiber; according to the invention, by optimizing the design of an internal light path of the device and adding wavelength selection devices such as the optical filter to regulate and control the emergent spectrum of the light-emitting diode device, compared with an existing super-radiation light-emitting diode, a smaller emergent spectrum width can be realized and more abundant output spectrum patterns and customized selection of central wavelength are provided; therefore, the customized design and processing requirements of the tube core can be reduced, the processing consistency requirement of the tube core is reduced, the manufacturing difficulty and cost are reduced, and the integration level and the stability are obviously improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor light-emitting devices, and more specifically, to a narrow-spectrum superluminescent light-emitting diode structure. Background Technology

[0002] The light-emitting mechanism of superluminescent diodes (SLEDs) comprises two parts: spontaneous emission and stimulated emission. First, spontaneous emission occurs due to electrical pumping, generating a small number of photons. These photons then propagate along the emissive layer and react with excited-state electrons, resulting in stimulated emission and the generation of a large number of photons of the same wavelength, thus forming the emitted light. The energy level characteristics, such as the bandgap width of the material, determine the relatively wide spectral width of the spontaneous emission mechanism. Therefore, SLEDs have a wide emission spectral width and poor temporal coherence. Depending on the materials and manufacturing processes, the spectral width of SLEDs is typically between a few nanometers and tens of nanometers. Due to the limitations of the material's bandgap characteristics and the light-emitting mechanism, further reducing the emission spectral width of SLEDs is extremely difficult.

[0003] The output spectral characteristics of existing superluminescent diodes (SLEDs) are determined by the semiconductor die material and structure. Once the die is determined, parameters such as the output center wavelength, spectral width, and spectral distribution are difficult to further control. Some luminescence parameters, such as center wavelength and spectral width, can be adjusted to a certain extent through customized die design. However, due to the limitations of semiconductor processing technology, the yield of samples meeting customized requirements is low, resulting in excessively high time and economic costs for customized processing. Furthermore, due to the material band structure and the superluminescence mechanism, the spectral width and spectral pattern of some materials are difficult to control. Therefore, in applications with special requirements for spectral pattern, external spectral control devices such as fiber optic filters must be used, leading to complex systems, large size, and low stability. Summary of the Invention

[0004] The purpose of this invention is to provide a narrow-spectrum superluminescent light-emitting diode structure in order to solve the above-mentioned problems.

[0005] This invention provides a narrow-spectrum superluminescent light-emitting diode structure, comprising:

[0006] Encapsulation housing;

[0007] The encapsulation housing contains, in sequence, a semiconductor chip, a collimating lens, a filter, a converging lens, and a coupling fiber, with the coupling fiber located at the end of the encapsulation housing furthest from the semiconductor chip.

[0008] The collimating lens is used to collimate the light beam emitted from the semiconductor chip and adjust the beam's intensity distribution parameters.

[0009] The filter is used to control the spectral parameters of the light beam emitted from the semiconductor chip;

[0010] The converging lens is used to converge and couple the emitted light beam from the filter to the coupling fiber.

[0011] As a further optimization of the present invention, the filter includes, but is not limited to, an absorption filter and a reflection grating filter structure.

[0012] As a further optimization of the present invention, the packaging housing includes a housing and pins integrated on the housing, the semiconductor chip is electrically connected to the pins, and the other end of the coupling optical fiber extends out from the opening end of the housing.

[0013] As a further optimization of the present invention, the coupling and fixing methods of the collimating lens, filter, converging lens and the packaging housing include, but are not limited to, welding process and adhesive process.

[0014] As a further optimization of the present invention, the collimating lens, the filter, and the converging lens are all externally connected to a limiting mechanism, which is used to limit the position parameters of the collimating lens, the filter, or the converging lens within the package housing.

[0015] As a further optimization of the present invention, the limiting mechanism includes a polygonal outer frame, a plurality of through screw holes provided on the polygonal outer frame, a plurality of sliding grooves provided at the corners of the polygonal outer frame, a slider slidably connected to the inner wall of the sliding groove, a damping block fixedly connected to the slider, and a spring connected between the spring and the inner wall of the sliding groove. The polygonal outer frame is provided with a mounting groove for mounting a collimating lens, a filter, or a converging lens. The damping block is used to contact the inner wall of the encapsulation housing, and the spring is used to apply a set value of elastic force to the slider.

[0016] As a further optimization of the present invention, it also includes a plurality of spacing adjustment mechanisms, which are detachably connected to a limiting mechanism outside the collimating lens, and are used to adjust the distance between the collimating lens and the semiconductor chip.

[0017] The spacing adjustment mechanism includes a limiting rod, one end of which is provided with a thread that mates with a through screw hole.

[0018] As a further optimization of the present invention, it also includes a plurality of spacing adjustment mechanisms II, which are detachably connected between the limiting mechanism located outside the collimating lens and the limiting mechanism located outside the filter, and between the limiting mechanism located outside the filter and the limiting mechanism located outside the converging lens. The spacing adjustment mechanisms II are used to adjust the distance between the filter and the collimating lens or between the filter and the converging lens.

[0019] As a further optimization of the present invention, the second spacing adjustment mechanism includes a second limiting rod, and both ends of the second limiting rod are provided with threads that cooperate with the through screw hole.

[0020] The beneficial effects of this invention are as follows: By optimizing the internal optical path design of the device and adding wavelength selection devices such as filters, this invention can regulate the emission spectrum of the light-emitting diode device. Compared with existing superluminescent light-emitting diodes, it can achieve a smaller emission spectral width and provide a richer selection of output spectral types and center wavelengths. This can reduce the need for customized design and processing of the die, reduce the requirements for die processing consistency, reduce manufacturing difficulty and cost, and significantly improve the integration and stability of the system design. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This invention employs a welding process. Figure 1 A partial sectional view;

[0023] Figure 3 This invention employs a limiting mechanism. Figure 1 A partial sectional view;

[0024] Figure 4 This is a view showing the interaction between the limiting mechanism and the packaging shell of the present invention;

[0025] Figure 5 This is the invention Figure 4 A magnified view of point A in the middle.

[0026] In the diagram: 1. Encapsulation housing; 101. Housing; 2. Semiconductor chip; 3. Collimating lens; 4. Filter; 5. Converging lens; 6. Limiting mechanism; 601. Polygonal outer frame; 602. Through-hole screw hole; 603. Slide groove; 604. Slider; 605. Spring; 606. Damping block; 7. Gap adjustment mechanism one; 8. Gap adjustment mechanism two; 9. Coupled optical fiber. Detailed Implementation

[0027] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed merely to enable those skilled in the art to better understand and implement the subject matter described herein. Furthermore, features described in some examples may be combined in other examples.

[0028] like Figures 1 to 2 As shown, a narrow-spectrum superluminescent light-emitting diode structure includes:

[0029] Encapsulation housing 1;

[0030] The encapsulation housing 1 contains, in sequence, a semiconductor chip 2, a collimating lens 3, a filter 4, a converging lens 5, and a coupling fiber 9. The coupling fiber 9 is located at the end of the encapsulation housing 1 that is furthest from the semiconductor chip 2.

[0031] The collimating lens 3 is used to collimate the light beam emitted from the semiconductor chip 2 and adjust the beam intensity distribution parameters.

[0032] Filter 4 is used to control the spectral parameters of the light beam emitted from semiconductor chip 2;

[0033] The converging lens 5 is used to converge and couple the outgoing beam from the filter 4 to the coupling fiber 9.

[0034] It should be noted that during the design and production of this structure, the internal optical path is designed, and the collimating lens 3 is designed to collimate and shape the light beam emitted from the semiconductor chip 2 into the required light spot intensity distribution. After the beam is collimated, the filter 4 is set after the collimating lens 3 to control the spectrum of the emitted beam. The converging lens 5 is designed after the filter 4, and finally the emitted beam is converged and coupled to the coupling fiber 9 through the converging lens 5.

[0035] During the production and packaging process, the semiconductor chip 2 is aligned and fixed inside the packaging housing 1. According to different coupling requirements and coupling processes, the collimating lens 3, the filter 4, the converging lens 5, and the coupling fiber 9 are aligned and fixed respectively.

[0036] Then, the packaging shell 1 is packaged to complete the device fabrication.

[0037] The distance between the semiconductor chip 2 and the collimating lens 3 depends on the focal length and working distance of the collimating lens 3. The end face of the semiconductor chip 2 must be located on the front focal plane of the collimating lens 3. When selecting the collimating lens 3, the divergence angle of the semiconductor chip 2 must be considered to ensure that the size of the collimated spot meets the requirements of the aperture of the subsequent optical elements and the numerical aperture of the coupling fiber 9.

[0038] After passing through the collimating lens 3, the beam divergence is reduced, and the same light field distribution can be maintained within a certain propagation distance. Therefore, there is no strict requirement for the distance between the collimating lens 3 and the converging lens 5, and the filter 4 can be placed at any position between the collimating lens 3 and the converging lens.

[0039] The distance between the converging lens 5 and the coupling fiber 9 depends on the focal length and working distance of the converging lens 5. The end face of the coupling fiber 9 must be located on the back focal plane of the converging lens 5. When selecting the converging lens 5, the size of the collimated spot and the numerical aperture of the coupling fiber 9 must be considered to ensure that the converging beam meets the numerical aperture requirements of the coupling fiber 9.

[0040] In an optional embodiment of the present invention, the filter 4 includes, but is not limited to, an absorptive filter and a reflective grating filter structure.

[0041] It should be noted that by using wavelength selection devices such as absorption filters and reflection grating filter structures to control the output spectrum of semiconductor chip 2, a smaller output spectral width can be achieved and a richer selection of output spectral types and center wavelengths can be provided. This can reduce the need for customized design and processing of the die, reduce the requirements for die processing consistency, and reduce manufacturing difficulty and cost.

[0042] Furthermore, compared with common external fiber optic filter devices' spectral modulation methods, integrating wavelength selection devices such as absorption filters and reflection grating filter structures inside the package housing 1 significantly improves the integration and stability of the system design.

[0043] In an optional embodiment of the invention, such as Figure 2 and Figure 3 As shown, the package housing 1 includes a housing 101, pins integrated on the housing 101, a semiconductor chip 2 electrically connected to the pins, and the other end of the coupling optical fiber 9 protruding from the opening end of the housing 101.

[0044] It should be noted that after the semiconductor chip 2, collimating lens 3, filter 4, converging lens 5 and coupling fiber 9 are installed into the housing 101, and the other end of the coupling fiber 9 passes through the opening end of the housing 101, the housing 101 can then be encapsulated. The encapsulation type of the housing 1 includes, but is not limited to, butterfly encapsulation, TO encapsulation, etc.

[0045] In an optional embodiment of the invention, such as Figure 2 As shown, the coupling and fixing methods of the collimating lens 3, filter 4, converging lens 5 and the packaging housing 1 include, but are not limited to, welding and adhesive bonding processes.

[0046] It should be noted that the fixing of collimating lens 3, filter 4, converging lens 5 and coupling fiber 9 needs to be carried out simultaneously with coupling power measurement, and there is no single method for fixing each optical device.

[0047] Taking laser welding as an example, a metal frame needs to be installed on the collimating lens 3, filter 4, and converging lens 5. After applying current to the semiconductor chip 2 to achieve light output, the output power of the coupling fiber 9 is measured, and the positions of the coupling fiber 9, collimating lens 3, and converging lens 5 are adjusted to achieve the maximum fiber output power. After finding the position of each optical element corresponding to the optimal output power, each optical element is fixed to the metal base by laser welding. The equipment used is a general coupling device, which usually comes with a laser welding assembly.

[0048] If an adhesive bonding process is used, there is no need to install metal frames on each optical component; the laser welding steps described above can be replaced with dispensing and curing.

[0049] In an optional embodiment of the invention, such as Figures 3 to 5 As shown, the collimating lens 3, the filter 4, and the converging lens 5 are all externally connected to a limiting mechanism 6, which is used to limit the position parameters of the collimating lens 3 or the filter 4 within the encapsulation housing 1.

[0050] The limiting mechanism 6 includes a polygonal outer frame 601, a plurality of through screw holes 602 provided on the polygonal outer frame 601, a plurality of sliding grooves 603 provided at the corners of the polygonal outer frame 601, a slider 604 slidably connected to the inner wall of the sliding groove 603, a damping block 606 fixedly connected to the slider 604, and a spring 605 connected between the spring 605 and the inner wall of the sliding groove 603. The polygonal outer frame 601 is provided with a mounting groove for mounting a collimating lens 3, a filter 4, or a converging lens 5. The damping block 606 is used to contact the inner wall of the encapsulation housing 1, and the spring 605 is used to apply a set value of elastic force to the slider 604.

[0051] It should be noted that, as mentioned above, when the collimating lens 3 and the filter 4 are placed inside the encapsulation housing 1 and their positions are limited and fixed, the damping block 606 at the corner of the polygonal outer frame 601 is squeezed to move towards the inside of the slide groove 603. At this time, the spring 605 is in a compressed state. When the damping block 606 has completely moved into the area of ​​the opening end of the housing 101, the limiting mechanism 6 can be pushed into the housing 101. When it is pushed into the set position, it stops. The damping block 606 contacts the inner wall of the housing 101 and generates a corresponding limiting force under the elastic force of the spring 605, so that the damping block 606 and the polygonal outer frame 601 are stably limited and fixed in the set position inside the housing 101.

[0052] In an optional embodiment of the invention, such as Figures 3 to 5 As shown, it also includes several spacing adjustment mechanisms 7, which are detachably connected to the limiting mechanism 6 outside the collimating lens 3. The several spacing adjustment mechanisms 7 are used to adjust the distance between the collimating lens 3 and the semiconductor chip 2.

[0053] The spacing adjustment mechanism 7 includes a limiting rod, one end of which is provided with a thread that mates with the through screw hole 602.

[0054] It also includes several spacing adjustment mechanisms 2 8, which are detachably connected between the limiting mechanism 6 located outside the collimating lens 3 and the limiting mechanism 6 located outside the filter 4, and between the limiting mechanism 6 located outside the filter 4 and the limiting mechanism 6 located outside the converging lens 5. The spacing adjustment mechanism 2 8 is used to adjust the distance between the filter 4 and the collimating lens 3 or between the filter 4 and the converging lens 5.

[0055] The spacing adjustment mechanism 28 includes a limiting rod 2, both ends of which are provided with threads 2 that cooperate with the through screw hole 602.

[0056] It should be noted that, as mentioned above, in order to reduce the cumbersome use of additional measuring tools, a spacing adjustment mechanism 1 7 or a spacing adjustment mechanism 2 8 is detachably connected to the corresponding polygonal outer frame 601. The length of the spacing adjustment mechanism 1 7 or the spacing adjustment mechanism 2 8 on the outside can be adjusted according to the depth of the through screw hole 602 on the polygonal outer frame 601. This achieves the effect of adjusting the distance between the collimating lens 3 and the semiconductor chip 2, the distance between the filter 4 and the collimating lens 3, and the distance between the filter 4 and the converging lens 5. Moreover, several polygonal outer frames 601 can be connected into a whole by the spacing adjustment mechanism 1 7 and the spacing adjustment mechanism 2 8. This reduces the installation time of the collimating lens 3, the filter 4, and the converging lens 5 when the corresponding polygonal outer frame 601 is pushed into the housing 101, effectively improving production efficiency and the adjustment accuracy of the emitted beam.

[0057] The above description of this embodiment is not limited to the specific implementation described above. The specific implementation described above is merely illustrative and not restrictive. Those skilled in the art can make many other forms based on the guidance of this embodiment, all of which are within the protection scope of this embodiment.

Claims

1. A narrow-spectrum superluminescent light-emitting diode structure, characterized in that, include: Encapsulation housing (1); The encapsulation housing (1) is provided with a semiconductor chip (2), a collimating lens (3), a filter (4), a converging lens (5) and a coupling fiber (9) in sequence inside the encapsulation housing (1). The coupling fiber (9) is located at the end of the encapsulation housing (1) away from the semiconductor chip (2). The collimating lens (3) is used to collimate the light beam emitted from the semiconductor chip (2) and adjust the light beam intensity distribution parameters. The filter (4) is used to control the spectral parameters of the light beam emitted from the semiconductor chip (2); The converging lens (5) is used to converge and couple the outgoing beam from the filter (4) to the coupling fiber (9).

2. The narrow-spectrum superluminescent light-emitting diode structure according to claim 1, characterized in that, The filter (4) includes, but is not limited to, an absorptive filter and a reflective grating filter structure.

3. The narrow-spectrum superluminescent light-emitting diode structure according to claim 1, characterized in that, The encapsulation housing (1) includes a housing (101) and pins integrated on the housing (101). The semiconductor chip (2) is electrically connected to the pins, and the other end of the coupling optical fiber (9) extends out from the opening of the housing (101).

4. The narrow-spectrum superluminescent light-emitting diode structure according to claim 1, characterized in that, The coupling and fixing methods of the collimating lens (3), filter (4), converging lens (5) and the packaging housing (1) include, but are not limited to, welding process and adhesive process.

5. The narrow-spectrum superluminescent light-emitting diode structure according to claim 1, characterized in that, The collimating lens (3), filter (4) and converging lens (5) are all externally connected to a limiting mechanism (6), which is used to limit the position parameters of the collimating lens (3), filter (4) or converging lens (5) within the encapsulation housing (1).

6. The narrow-spectrum superluminescent light-emitting diode structure according to claim 5, characterized in that, The limiting mechanism (6) includes a polygonal outer frame (601), a plurality of through screw holes (602) provided on the polygonal outer frame (601), a plurality of sliding grooves (603) provided at the corners of the polygonal outer frame (601), a slider (604) slidably connected to the inner wall of the sliding groove (603), a damping block (606) fixedly connected to the slider (604), and a spring (605) connected between the spring (605) and the inner wall of the sliding groove (603). The polygonal outer frame (601) is provided with a mounting groove for mounting a collimating lens (3), a filter (4), or a converging lens (5). The damping block (606) is used to contact the inner wall of the encapsulation housing (1), and the spring (605) is used to apply a set value of elastic force to the slider (604).

7. A narrow-spectrum superluminescent light-emitting diode structure according to claim 6, characterized in that, It also includes several pitch adjustment mechanisms (7), which are detachably connected to the limiting mechanism (6) outside the collimating lens (3). The pitch adjustment mechanisms (7) are used to adjust the distance between the collimating lens (3) and the semiconductor chip (2).

8. The narrow-spectrum superluminescent light-emitting diode structure according to claim 7, characterized in that, The spacing adjustment mechanism (7) includes a limiting rod, one end of which is provided with a thread that mates with a through screw hole (602).

9. A narrow-spectrum superluminescent light-emitting diode structure according to claim 8, characterized in that, It also includes several spacing adjustment mechanisms (8), which are detachably connected between the limiting mechanism (6) located outside the collimating lens (3) and the limiting mechanism (6) located outside the filter (4), and between the limiting mechanism (6) located outside the filter (4) and the limiting mechanism (6) located outside the converging lens (5). The spacing adjustment mechanism (8) is used to adjust the distance between the filter (4) and the collimating lens (3) or between the filter (4) and the converging lens (5).

10. A narrow-spectrum superluminescent light-emitting diode structure according to claim 9, characterized in that, The second spacing adjustment mechanism (8) includes a second limiting rod, and both ends of the second limiting rod are provided with threads that cooperate with the through screw hole (602).

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