Chip welding suction nozzle assembly capable of being replaced automatically

Abstract

The invention relates to the technical field of microelectronic packaging and surface mounting, in particular to an automatically replaceable suction nozzle assembly for chip welding. The chip welding suction nozzle assembly capable of being replaced automatically comprises a connecting rod, a suction nozzle piece fixing block and a suction nozzle piece. The connecting rod is provided with a chip adsorption channel and a suction nozzle piece adsorption channel; the suction nozzle piece fixing block is installed on the connecting rod and provided with a ventilation channel communicated with the chip adsorption channel, and a suction groove communicated with the suction nozzle piece adsorption channel and surrounding the ventilation channel is formed in the suction nozzle piece attaching face of the suction nozzle piece fixing block. After the suction nozzle piece adsorption channel is vacuumized, the suction nozzle piece is adsorbed by the suction groove to be tightly attached to the suction nozzle piece attaching face, and a vacuum channel of the suction nozzle piece is communicated with the ventilation channel. The suction nozzle piece at the tail end can be automatically replaced, the parallelism of the adsorption surface can be ensured, the hot-pressing surface mounting efficiency is improved, and the suction nozzle cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of microelectronic packaging and surface mount technology, specifically to an automatically replaceable chip soldering nozzle assembly. Background Technology

[0002] Chip hot press bonding machines are key equipment for chip mounting. They use vacuum nozzles to pick up chips and precisely mount them to designated positions on substrates (such as PCBs, glass, wafers, etc.). Then, a hot press process is used to achieve electrical interconnection and mechanical fixation between the chip and the substrate. In this process, the nozzle, as the component that directly contacts and carries the chip, directly affects the accuracy, quality, and efficiency of the chip mounting process.

[0003] In existing chip thermoforming equipment, nozzles are typically designed to fit only one specific chip size and shape. When a different chip specification needs to be replaced on the production line, operators must stop the machine and manually remove the original nozzle from the machine's spindle before installing a new nozzle compatible with the new chip. This process is not only cumbersome but also leads to frequent equipment downtime, severely impacting the overall thermoforming efficiency and capacity of the production line.

[0004] Furthermore, after each nozzle replacement, due to manufacturing tolerances and installation errors, a slight non-parallelism inevitably exists between the suction surface of the new nozzle and the worktable plane. Therefore, operators must perform a tedious "flattening" or "Z-axis height calibration" operation to adjust the flatness of the nozzle's suction surface and ensure uniform placement pressure. This calibration process is not only time-consuming, further reducing production line efficiency, but also requires a high level of operator skill and introduces the risk of human error, potentially affecting the coplanarity and quality stability of the placement components.

[0005] Furthermore, to meet the demands of multi-variety, small-batch production, manufacturers must equip each chip specification with one or more dedicated nozzles. This not only increases the procurement cost and inventory management pressure of nozzles but also wastes physical resources. At the same time, the storage, identification, and retrieval of a large number of nozzles increases the complexity of production preparation and the probability of errors.

[0006] Therefore, it is urgent to solve the problems that existing nozzles face when changing to different specifications of chip products on the production line. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to overcome the defects of the prior art and provide an automatically replaceable chip welding nozzle assembly that can automatically replace the end nozzle piece, and can ensure the parallelism of the adsorption surface, improve the efficiency of hot pressing and bonding, and reduce the cost of the nozzle.

[0008] To solve the above-mentioned technical problems, the technical solution of the present invention is: an automatically replaceable chip soldering nozzle assembly, comprising: The connecting rod is equipped with a chip adsorption channel and a nozzle adsorption channel; A nozzle plate fixing block is installed on the connecting rod. It is provided with an air passage that connects to the chip adsorption channel, and a suction groove that connects to the nozzle plate adsorption channel and surrounds the air passage is provided on its nozzle plate mating surface. The suction plate is drawn into the suction groove and adheres tightly to the contact surface of the suction plate after the suction channel is evacuated, and its vacuum channel is connected to the ventilation channel.

[0009] Furthermore, a portion of the nozzle plate fixing block is fitted onto the connecting rod, and at least one bolt hole is provided, with a locking bolt screwed into the bolt hole and pressing against the outer peripheral wall of the connecting rod.

[0010] Furthermore, at least one sealing ring is disposed between the connecting rod and the nozzle plate fixing block.

[0011] Furthermore, a connecting channel is provided inside the nozzle plate fixing block, and the suction groove is connected to the nozzle plate adsorption channel through the connecting channel.

[0012] Furthermore, the nozzle plate fixing block is provided with at least two positioning pins, and the nozzle plate is provided with positioning holes that cooperate with the positioning pins.

[0013] Furthermore, the nozzle plate fixing block and the nozzle plate are respectively provided with recognition holes for camera recognition.

[0014] Furthermore, the automatically replaceable chip soldering nozzle assembly also includes a heating plate, which is attached to the end face of the nozzle plate fixing block away from the nozzle plate contact surface.

[0015] Furthermore, the automatically replaceable chip soldering nozzle assembly also includes a connecting sleeve, which is connected to the heating plate and has multiple heat dissipation holes.

[0016] Furthermore, the automatically replaceable chip soldering nozzle assembly also includes a heat insulation plate, which is installed inside the connecting sleeve and located on the side of the heating plate away from the nozzle fixing block.

[0017] Furthermore, the openings of the chip adsorption channel and the nozzle adsorption channel away from the nozzle fixing block are located on the end face and peripheral wall of the connecting rod, respectively.

[0018] By adopting the above technical solution, the present invention has the following beneficial effects: (1) When replacing chip products of different specifications, the vacuum in the suction groove is broken by the suction channel of the suction plate, so that the suction plate that was originally suctioned can automatically detach from the suction plate bonding surface of the suction plate fixing block under the action of gravity; then the suction channel of the suction plate is vacuumed, so that the new suction plate can be automatically suctioned onto the suction plate bonding surface. In this way, the suction plate can be automatically replaced. Compared with manual disassembly and replacement, the replacement efficiency is higher, and the trouble of frequent shutdown of the chip hot press welding machine is also avoided. (2) Since the nozzle is attached to the nozzle fixing block, the parallelism of the newly replaced nozzle can be well ensured through surface-to-surface bonding, eliminating the trouble of later adjustment and calibration, and ensuring the stability of the chip mounting quality of various specifications. (3) The nozzle plate is a very thin plate, and only one nozzle plate is needed for each type of chip, which greatly reduces the waste of physical resources; (4) The present invention achieves the connection between the nozzle plate fixing block and the nozzle plate through negative pressure. This connection method will not have any adverse effect on the chip adsorbed by the nozzle plate, and can still achieve firm adsorption of the nozzle plate under high temperature conditions, with high reliability. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the automatically replaceable chip soldering nozzle assembly of the present invention; Figure 2 This is a cross-sectional view of the automatically replaceable chip soldering nozzle assembly of the present invention; Figure 3 This is a schematic diagram of the nozzle sheet of the present invention from one perspective; Figure 4 This is a schematic diagram of the suction nozzle sheet of the present invention from another perspective; Figure 5 This is a schematic diagram of the structure of the suction nozzle fixing block of the present invention; Figure 6 This is a schematic diagram of the structure of the nozzle plate mating surface of the nozzle plate fixing block of the present invention; In the diagram, 1 is the connecting rod; 11 is the chip adsorption channel; 12 is the nozzle adsorption channel; 2 is the nozzle fixing block; 20 is the nozzle mating surface; 21 is the ventilation channel; 22 is the suction groove; 23 is the bolt hole; 24 is the connecting channel; 3 is the nozzle; 31 is the vacuum channel; 32 is the positioning hole; 4 is the sealing ring; 5 is the positioning pin; 6 is the identification hole; 7 is the heating plate; 8 is the connecting sleeve; 9 is the heat insulation plate; and 10 is the insulating plate. Detailed Implementation

[0020] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0021] like Figures 1 to 6 As shown, an automatically replaceable chip soldering nozzle assembly includes: Link 1 is provided with a chip adsorption channel 11 and a nozzle adsorption channel 12; The nozzle plate fixing block 2 is installed on the connecting rod 1. It is provided with an air passage 21 that connects to the chip adsorption channel 11, and a suction groove 22 that connects to the nozzle plate adsorption channel 12 and surrounds the air passage 21 is provided on its nozzle plate contact surface 20. The suction plate 3 is attracted to the suction groove 22 and adheres tightly to the suction plate bonding surface 20 after the suction plate adsorption channel 12 is evacuated, and its vacuum channel 31 is connected to the ventilation channel 21.

[0022] Specifically, the suction channel 12 and the suction groove 22 together form an air path for adsorbing the suction channel 3, and the chip adsorption channel 11, the ventilation channel 21 and the vacuum channel 31 of the suction channel 3 together form an air path for adsorbing the chip.

[0023] When replacing chips of different specifications, the vacuum in the suction groove 22 is broken through the suction channel 12, allowing the previously adsorbed suction nozzle 3 to automatically detach from the suction nozzle bonding surface 20 of the suction nozzle fixing block 2 under gravity. Then, a vacuum operation is performed on the suction channel 12, causing the suction nozzle bonding surface 20 to automatically adsorb the new suction nozzle 3. This achieves automatic replacement of the suction nozzle 3. Compared to manual disassembly and replacement, this method is more efficient and eliminates the inconvenience of frequent shutdowns of the chip thermoforming machine.

[0024] Furthermore, since the nozzle plate 3 is adsorbed onto the nozzle plate bonding surface 20 of the nozzle plate fixing block 2, the parallelism of the newly replaced nozzle plate 3 can be well ensured through surface bonding, eliminating the trouble of later adjustment and calibration, and ensuring the stability of the chip mounting quality of various specifications.

[0025] Furthermore, the nozzle plate 3 is a very thin plate, for example, 2mm thick. Only one nozzle plate 3 is needed for each type of chip, which greatly reduces the waste of physical resources.

[0026] Finally, this embodiment uses negative pressure to achieve adsorption of the nozzle plate 3, thereby connecting the nozzle plate fixing block 2 and the nozzle plate 3. This connection method will not have any adverse effects on the chip adsorbed by the nozzle plate 3, and it can still achieve firm adsorption of the nozzle plate 3 at high temperatures (such as 200°C or even 400°C required for hot pressing welding), resulting in high reliability.

[0027] In this embodiment, there are multiple ways to achieve the installation between the nozzle plate fixing block 2 and the connecting rod 1. For example, such as... Figure 1 and Figure 2As shown, a portion of the nozzle plate fixing block 2 is fitted onto the connecting rod 1, and at least one bolt hole 23 is provided. A locking bolt is screwed into the bolt hole 23 and abuts against the outer peripheral wall of the connecting rod 1, thus achieving the installation between the nozzle plate fixing block 2 and the connecting rod 1. Preferably, two bolt holes 23 are provided opposite each other in the radial direction of the connecting rod 1. This ensures that the connecting rod 1 is centered within the nozzle plate fixing block 2, better achieving a balanced weight distribution on both sides of the entire nozzle assembly.

[0028] In this embodiment, as Figure 2 As shown, preferably, at least one sealing ring 4 is disposed between the connecting rod 1 and the suction plate fixing block 2. This prevents air leakage and ensures a tight seal. More preferably, as shown... Figure 2 As shown, one of the sealing rings 4 is disposed between the end face of the insertion nozzle plate fixing block 2 of the connecting rod 1 and the nozzle plate fixing block 2. The opening of the chip adsorption channel 11 near the end of the nozzle plate 3 is directly opposite the space enclosed by the sealing ring 4. The sealing ring 4 not only seals the air passage used for adsorbing the chip, but also provides a certain degree of freedom for the insertion depth of the connecting rod 1 through its deformation.

[0029] In this embodiment, as Figure 2 As shown, a connecting channel 24 can be provided within the nozzle plate fixing block 2, and the suction groove 22 is connected to the nozzle plate adsorption channel 12 through the connecting channel 24. Specifically, the peripheral wall of the end of the connecting rod 1 inserted into the nozzle plate fixing block 2 has an opening for the nozzle plate adsorption channel 12. The connecting channel 24 includes a horizontal channel and a vertical channel that are interconnected. The horizontal channel connects to the opening of the nozzle plate adsorption channel 12, and the vertical channel connects to the suction groove 22. The suction groove 22 can have one, two, or three rings, etc. Figure 5 In the structure shown, the suction groove 22 has two interconnected rings arranged from the inside to the outside, which can achieve stable adsorption of the nozzle plate 3.

[0030] In this embodiment, preferably, as follows: Figure 3 and Figure 5 As shown, the nozzle plate fixing block 2 is provided with at least two positioning pins 5, and the nozzle plate 3 is provided with positioning holes 32 that cooperate with the positioning pins 5. Thus, during the automatic suction of the nozzle plate 3, the positioning pins 5 and positioning holes 32 can be used to position the nozzle plate 3, ensuring that the nozzle plate 3 is suctioned to the desired position on the nozzle plate contact surface 20. The two positioning pins 5 can be located on a diagonal line of the nozzle plate contact surface 20 of the nozzle plate fixing block 2.

[0031] Furthermore, considering that during the automatic adsorption of the nozzle assembly into the nozzle piece 3, the camera of the chip thermoforming machine automatically calibrates the position to achieve alignment between the nozzle piece mating surface 20 and the nozzle piece 3, in order for the chip thermoforming machine to better calibrate the position of the nozzle piece mating surface 20 and the nozzle piece 3, and to better achieve alignment between the nozzle piece mating surface 20 and the nozzle piece 3, preferably, as follows: Figure 3 , Figure 5 and Figure 6 As shown, the nozzle plate fixing block 2 and the nozzle plate 3 are respectively provided with recognition holes 6 for camera recognition. More preferably, the recognition holes 6 on the nozzle plate fixing block 2 and the nozzle plate 3 are aligned with each other.

[0032] In this embodiment, preferably, as follows: Figure 2 As shown, the openings of the chip adsorption channel 11 and the nozzle adsorption channel 12 away from the nozzle fixing block 2 are located on the end face and peripheral wall of the connecting rod 1, respectively.

[0033] In this way, it is easier to arrange the components of the chip hot press welding machine that are respectively connected to the chip adsorption channel 11 and the nozzle adsorption channel 12.

[0034] In some examples, such as Figure 1 and Figure 2 As shown, the automatically replaceable chip soldering nozzle assembly also includes a heating plate 7, which is attached to the end face of the nozzle plate fixing block 2 away from the nozzle plate bonding surface 20.

[0035] When the electrical interconnection and mechanical fixation between the chip and the substrate are achieved through the hot pressing process, the heating plate 7 is heated, and the heat is transferred to the nozzle plate 3 through the nozzle plate fixing block 2. Thus, the nozzle plate 3 accurately transfers heat to the chip and the substrate on which the chip is mounted, realizing hot pressing mounting and eliminating the trouble of the peripheral substrate heating mechanism.

[0036] In some examples, such as Figure 1 and Figure 2 As shown, the automatically replaceable chip soldering nozzle assembly also includes a connecting sleeve 8, which connects to the heating plate 7 and has multiple heat dissipation holes 81. The connecting sleeve 8 and the heating plate 7 can be connected by crimping, bolting, or other methods.

[0037] Specifically, connecting the connecting sleeve 8 to the chip thermoforming machine facilitates the installation of the entire nozzle assembly on the chip thermoforming machine. The connecting sleeve 8 provides convenience for this installation. Furthermore, the connecting sleeve 8 has multiple heat dissipation holes 81, which improves heat dissipation and reduces the heat transferred from the heating plate 7 to the chip thermoforming machine.

[0038] In some examples, such as Figure 1 and Figure 2As shown, the automatically replaceable chip soldering nozzle assembly also includes a heat insulation plate 9, which is installed inside the connecting sleeve 8 and located on the side of the heating plate 7 away from the nozzle fixing block 2.

[0039] Specifically, the heat insulation plate 9 can further reduce the heat transferred from the heating plate 7 to the chip hot press welding machine.

[0040] In some examples, such as Figure 2 As shown, an insulating plate 10 is also provided between the heat insulation plate 9 and the top plate of the connecting sleeve 8.

[0041] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. An automatically replaceable chip soldering nozzle assembly, characterized in that it comprises: a connecting rod (1) provided with a chip suction channel (11) and a nozzle blade suction channel (12); a nozzle blade fixing block (2) mounted on the connecting rod (1) and provided with a ventilation channel (21) communicating with the chip suction channel (11) and a suction groove (22) surrounding the ventilation channel (21) and communicating with the nozzle blade suction channel (12) on the nozzle blade abutting surface (20); a nozzle blade (3) which is suctioned to the nozzle blade abutting surface (20) by the suction groove (22) after the nozzle blade suction channel (12) is vacuumized, and whose vacuum channel (31) communicates with the ventilation channel (21).

2. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that a part of the nozzle blade fixing block (2) is sleeved on the connecting rod (1), and at least one bolt hole (23) is further provided, and a locking bolt is screwed in the bolt hole (23) and abuts against the outer peripheral wall of the connecting rod (1).

3. The automatically replaceable chip soldering nozzle assembly according to claim 2, characterized in that at least one sealing ring (4) is arranged between the connecting rod (1) and the nozzle blade fixing block (2).

4. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that a communication channel (24) is arranged in the nozzle blade fixing block (2), and the suction groove (22) communicates with the nozzle blade suction channel (12) through the communication channel (24).

5. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that the nozzle blade fixing block (2) is provided with at least two positioning pins (5), and the nozzle blade (3) is provided with positioning holes (32) matched with the positioning pins (5).

6. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that the nozzle blade fixing block (2) and the nozzle blade (3) are respectively provided with identification holes (6) for camera identification.

7. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that it further comprises a heating plate (7) abutting against the end surface of the nozzle blade fixing block (2) away from the nozzle blade abutting surface (20).

8. The automatically replaceable chip soldering nozzle assembly according to claim 7, characterized in that it further comprises a connecting sleeve (8) connected with the heating plate (7) and provided with a plurality of heat dissipation holes (81).

9. The automatically replaceable chip soldering nozzle assembly according to claim 8, characterized in that it further comprises a heat insulation plate (9) mounted in the connecting sleeve (8) and located on the side of the heating plate (7) away from the nozzle blade fixing block (2).

10. The automatically replaceable chip soldering nozzle assembly according to claim 1, characterized in that ​ The openings of the chip adsorption channel (11) and the nozzle piece adsorption channel (12) away from the nozzle piece fixing block (2) are respectively located on the end face and the peripheral wall of the connecting rod (1).

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