Wafer ultrasonic dicing blade assembly tool and method of use thereof

Abstract

The application belongs to the technical field of machine tools, and particularly relates to a device for supporting a tool, in particular to a wafer ultrasonic scribing knife assembly tool, which comprises a base, a sleeve rotatably arranged on the base, a supporting ring sleeved on the sleeve and used for assembling the wafer ultrasonic scribing knife, and a pressing ring, wherein a side wall of the sleeve is provided with an extension type connecting piece, a bottom surface of the supporting ring is connected with the base through a return spring, and a top of the base is provided with a buckle. Through linkage design of the buckle and the extension type connecting piece, quick limiting and releasing of the supporting ring are realized, compared with a screw adjustment or buckle locking structure in the related art, the disassembly efficiency is improved, and meanwhile, an elastic ejection mechanism driven by the return spring replaces manual prying operation, so that the phenomenon of damaging the knife edge when the wafer ultrasonic scribing knife is pried by an auxiliary tool in the related art is avoided.

Description

Technical Field

[0001] This invention belongs to the field of machine tool technology, specifically relating to a device for supporting cutting tools, and more particularly to an assembly fixture for a wafer ultrasonic scribing tool. Background Technology

[0002] During the assembly of ultrasonic dicing blades for wafers, threaded fastening or snap-locking structures are often used. The locking mechanism needs to be repeatedly adjusted with a special wrench, which makes the disassembly of ultrasonic dicing blades for wafers too time-consuming. In addition, the disassembly process requires the use of auxiliary tools such as tweezers to pry it, which can easily lead to accidental damage to the ultrasonic dicing blades for wafers and also cause the surface of the support ring to be worn by the auxiliary tools.

[0003] Therefore, how to prevent the ultrasonic dicing blade from being easily damaged by auxiliary tools when it is removed from the assembly fixture is a technical problem that urgently needs to be solved.

[0004] It should be noted that the information disclosed in this background section is only for understanding the background technology of this application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0005] This disclosure provides at least one assembly tool for a wafer ultrasonic dicing blade and its usage method.

[0006] In a first aspect, embodiments of this disclosure provide an assembly fixture for a wafer ultrasonic dicing blade, comprising:

[0007] Base;

[0008] A sleeve, which is rotatably mounted on the base;

[0009] A support ring, which is sleeved on the sleeve and used for assembling the ultrasonic dicing blade for the wafer;

[0010] The pressure ring is used to press the assembled ultrasonic dicing blade on the wafer.

[0011] The sleeve is provided with a telescopic connector on its side wall;

[0012] The bottom surface of the support ring is connected to the base via a return spring;

[0013] The inner wall of the support ring is connected to the sleeve via a telescopic connector;

[0014] The top of the base is provided with a buckle;

[0015] During assembly, after the support ring descends to the assembly station, the sleeve rotates, causing the end of the telescopic connector to engage in the buckle, thus limiting the position of the support ring.

[0016] When it is necessary to remove the ultrasonic dicing blade from the wafer, the sleeve is rotated to release the engagement between the telescopic connector and the buckle, thereby releasing the limiting position on the support ring. The support ring then springs up under the action of the reset spring, thereby ejecting the assembled ultrasonic dicing blade from the wafer.

[0017] In one optional embodiment, the sidewall of the sleeve is provided with a strip-shaped mounting hole along the axial direction;

[0018] One end of the telescopic connector is connected to the top of the strip mounting hole, and the other end is connected to the support ring via an insert block.

[0019] In one alternative embodiment, the telescopic connector includes:

[0020] The bellows and the buffer springs;

[0021] One end of the bellows plate is connected to the top of the strip mounting hole, and the other end is set downward along the axial direction of the sleeve. The insert is set at the end of the bellows plate.

[0022] One end of the buffer spring is connected to the top of the strip mounting hole, and the other end is connected to the top surface of the insert block;

[0023] When it is necessary to remove the ultrasonic dicing blade from the wafer, the rise of the support ring is buffered by the buffer spring.

[0024] In one alternative embodiment, the insert extends radially inward to form a latching block that is adapted to the snap fastener;

[0025] The insert extends radially outward to form a connecting block that engages with the supporting ring;

[0026] The support ring and the connecting block are fitted with a slot.

[0027] In one optional embodiment, the buckle includes a connecting post and a limiting strip;

[0028] The limiting strip is disposed above the base and is connected to the base via the connecting post;

[0029] The bottom surface of the limiting strip and the top surface of the base form a limiting space for the locking block to engage.

[0030] In one optional embodiment, the assembly fixture for the wafer ultrasonic dicing blade further includes:

[0031] The piston rod is inserted into the sleeve;

[0032] The side wall of the sleeve is provided with multiple air blowing holes;

[0033] The side wall of the piston rod abuts against the inner wall of the sleeve.

[0034] In one alternative embodiment, after the ultrasonic dicing blade is assembled, the piston rod descends, compressing the space within the sleeve to blow gas out from the air vent to clean the ultrasonic dicing blade on the support ring.

[0035] Secondly, this disclosure also provides a method of using the assembly fixture for a wafer ultrasonic dicing blade as described above, the method comprising:

[0036] Press down on the support ring to lower it to the assembly station;

[0037] Rotate the sleeve to engage the end of the telescopic connector with the buckle, thus limiting the position of the support ring;

[0038] The ultrasonic dicing blade for the wafer is assembled on the support ring;

[0039] The pressure ring is fitted onto the sleeve and the ultrasonic dicing blade on the wafer is squeezed.

[0040] When it is necessary to remove the ultrasonic dicing blade from the wafer, remove the pressure ring, and by rotating the sleeve, release the snap-fit ​​between the telescopic connector and the buckle. The support ring will spring up under the action of the return spring, thereby causing the assembled ultrasonic dicing blade to pop out.

[0041] In one optional embodiment, the assembly fixture for the wafer ultrasonic dicing blade further includes:

[0042] The piston rod is inserted into the sleeve;

[0043] The side wall of the sleeve is provided with multiple air blowing holes;

[0044] The side wall of the piston rod abuts against the inner wall of the sleeve;

[0045] After pressing the support ring to lower it to the assembly station, and before assembling the wafer ultrasonic dicing blade, the method of use further includes:

[0046] Pull the piston rod so that the end of the piston rod is at the upper part of the sleeve;

[0047] After the ultrasonic dicing blade for wafers is assembled, the method of use further includes:

[0048] Pressing the piston rod blows gas out of the air hole to clean the ultrasonic dicing blade on the support ring.

[0049] In one alternative embodiment, after the ultrasonic dicing blade is removed from the wafer, the method of use further includes:

[0050] Pull the piston rod again so that the end of the piston rod is at the top of the sleeve;

[0051] Pressing the piston rod blows gas out of the air hole to clean the support ring.

[0052] The beneficial effects of this invention are that the assembly fixture and working method for the ultrasonic dicing blade of this wafer achieve rapid limiting and release of the supporting ring through the linkage design of the snap-fit ​​and telescopic connector. Compared with the threaded adjustment or snap-fit ​​locking structure in related technologies, it improves the disassembly efficiency. At the same time, the elastic pop-out mechanism driven by the reset spring replaces the manual prying operation, avoiding the damage to the blade edge that occurs when using auxiliary fixtures to pry the ultrasonic dicing blade of the wafer in related technologies.

[0053] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and the drawings.

[0054] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0055] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0056] Figure 1 This is a schematic diagram of the assembly tooling for a wafer ultrasonic dicing blade provided in an embodiment of the present disclosure;

[0057] Figure 2 A cross-sectional view of the assembly tooling for a wafer ultrasonic dicing blade provided in an embodiment of this disclosure;

[0058] Figure 3 Another cross-sectional view of the assembly tooling for a wafer ultrasonic dicing blade provided in an embodiment of this disclosure;

[0059] Figure 4 A flowchart illustrating the usage method of the assembly fixture for a wafer ultrasonic dicing blade provided in this embodiment of the disclosure.

[0060] In the diagram: 100, base; 110, return spring; 120, buckle; 121, connecting post; 122, limit strip; 200, sleeve; 210, strip mounting hole; 220, air blowing hole; 300, support ring; 310, slot; 400, telescopic connector; 410, bellows plate; 411, insert block; 411a, locking block; 411b, connecting block; 420, buffer spring; 500, wafer ultrasonic dicing blade; 600, piston rod; 700, pressure ring. Detailed Implementation

[0061] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0062] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0063] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0064] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0065] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise expressly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0066] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0067] Research has found that existing technologies use threaded fastening or snap-locking structures, requiring repeated adjustment of the locking mechanism with a special wrench, which results in excessively long disassembly times for the ultrasonic dicing blade on the wafer. Furthermore, the disassembly process requires the use of auxiliary tools such as tweezers for prying, which can easily lead to accidental damage to the ultrasonic dicing blade on the wafer and cause wear on the surface of the support ring due to the auxiliary tools.

[0068] Based on the above research, this disclosure provides an assembly fixture and its working method for a wafer ultrasonic dicing blade. Through the linkage design of the snap-fit ​​120 and the telescopic connector 400, the support ring 300 is quickly limited and released. Compared with the threaded adjustment or snap-fit ​​locking structure in related technologies, the disassembly efficiency is improved. At the same time, the elastic pop-out mechanism driven by the return spring 110 replaces the manual prying operation, avoiding the damage to the blade edge that occurs when using auxiliary fixtures to pry the wafer ultrasonic dicing blade 500 in related technologies.

[0069] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0070] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0071] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0072] Please see Figure 1 and Figure 2 This disclosure provides an assembly fixture for a wafer ultrasonic dicing blade, comprising: a base 100; a sleeve 200 rotatably mounted on the base 100; a support ring 300 sleeved on the sleeve 200 and used for assembling a wafer ultrasonic dicing blade 500; and a pressure ring 700 for pressing the assembled wafer ultrasonic dicing blade 500; wherein, the side wall of the sleeve 200 is provided with a telescopic connector 400; the bottom surface of the support ring 300 is connected to the base 100 via a return spring 110; the inner wall of the support ring 300 is connected to the sleeve 200 via the telescopic connector 400; the base 100... The top of the 00 is provided with a buckle 120; during assembly, after the support ring 300 descends to the assembly station, the sleeve 200 rotates (driven by external force), causing the end of the telescopic connector 400 to engage in the buckle 120, thus limiting the support ring 300; when it is necessary to remove the wafer ultrasonic dicing blade 500, the sleeve 200 rotates to release the engagement between the telescopic connector 400 and the buckle 120, releasing the limitation on the support ring 300, and the support ring 300 bounces up under the action of the return spring 110, so as to eject the assembled wafer ultrasonic dicing blade 500.

[0073] During disassembly, the pressure ring 700 is first removed, and then the support ring 300 is quickly limited and released through the linkage design of the buckle 120 and the telescopic connector 400. Compared with the threaded adjustment or buckle locking structure in related technologies, the disassembly efficiency is improved. At the same time, the elastic pop-out mechanism driven by the reset spring 110 replaces the manual prying operation, avoiding the damage to the blade edge that occurs when using auxiliary tooling to pry the wafer ultrasonic dicing blade 500 in related technologies.

[0074] Specifically, after the ultrasonic dicing blade 500 is assembled on the sleeve, the pressure ring 700 is placed on the sleeve, and then the pressure ring 700 is pressed by an external pressing mechanism to press the ultrasonic dicing blade 500, thus completing the assembly.

[0075] Please see Figure 2The sleeve 200 has an axially oriented strip-shaped mounting hole 210 on its side wall. One end of the telescopic connector 400 is connected to the top of the strip-shaped mounting hole 210, and the other end is connected to the support ring 300 via an insert block 411. The strip-shaped mounting hole 210 provides an axial guide path for the telescopic connector 400, ensuring a more precise and stable connection between the insert block 411 and the support ring 300, thus avoiding the assembly misalignment problem of the wafer ultrasonic dicing blade 500 caused by connector wobbling in traditional tooling.

[0076] Please continue reading. Figure 2 The telescopic connector 400 includes: a bellows plate 410 and a buffer spring 420; one end of the bellows plate 410 is connected to the top of the strip mounting hole 210, and the other end is arranged downward along the axial direction of the sleeve 200; the insert block 411 is arranged at the end of the bellows plate 410; one end of the buffer spring 420 is connected to the top of the strip mounting hole 210, and the other end is connected to the top surface of the insert block 411; when it is necessary to remove the wafer ultrasonic dicing blade 500, the buffer spring 420 buffers the rise of the support ring 300.

[0077] The buffer spring 420 provides a progressive buffering force when the support ring 300 springs up, thereby creating a difference in the rising speed between the support ring 300 and the wafer ultrasonic dicing blade 500, which separates the support ring 300 from the wafer ultrasonic dicing blade 500.

[0078] Please continue reading. Figure 2 The insert 411 extends radially inward to form a locking block 411a that is adapted to the buckle 120; the insert 411 extends radially outward to form a connecting block 411b that is inserted into the support ring 300; a slot 310 is provided at the fitting point between the support ring 300 and the connecting block 411b.

[0079] The interlocking design of the card block 411a and the buckle 120 achieves the limiting function, and the insertion of the connecting block 411b and the slot 310 ensures the rigid connection between the support ring 300 and the sleeve 200, thus ensuring the stability of the wafer ultrasonic dicing blade 500 during the assembly process.

[0080] Specifically, the buckle 120 includes a connecting post 121 and a limiting strip 122; the limiting strip 122 is disposed above the base 100 and is connected to the base 100 through the connecting post 121; the bottom surface of the limiting strip 122 and the top surface of the base 100 form a limiting space for the buckle block 411a to be engaged.

[0081] Please see Figure 1 and Figure 3The assembly tooling for the ultrasonic wafer dicing blade further includes: a piston rod 600, which is inserted into the sleeve 200; the side wall of the sleeve 200 is provided with a plurality of air holes 220; the side wall of the piston rod 600 abuts against the inner wall of the sleeve 200.

[0082] Specifically, after the ultrasonic dicing blade 500 is assembled, the piston rod 600 descends, squeezing the space inside the sleeve 200 to blow gas out from the air hole 220 to clean the ultrasonic dicing blade 500 on the support ring 300.

[0083] The piston rod 600 drives the airflow to blow out from the air hole 220, which can automatically remove dust and debris from the surface of the ultrasonic wafer dicing blade 500 after assembly. The blowing is achieved by utilizing the internal space of the tooling, without the need for an external air source, thus reducing energy consumption.

[0084] The 220-degree annular air vent layout ensures that the airflow evenly covers the entire area of ​​the ultrasonic dicing blade 500. Air is blown from the center of the ultrasonic dicing blade 500 outwards. Compared with the single-sided airflow method used in related technologies, this method can more thoroughly clean the dust and debris on the ultrasonic dicing blade 500. At the same time, it also prevents the accumulation of debris and dust in the gap between the ultrasonic dicing blade 500 and the tooling.

[0085] Please see Figure 4 This disclosure also provides a method for using the assembly fixture for the ultrasonic dicing blade for wafers as described above. Through the linkage design of the snap-fit ​​120 and the telescopic connector 400, the support ring 300 can be quickly limited and released. Compared with the threaded adjustment or snap-fit ​​locking structure in the related technology, the disassembly efficiency is improved. At the same time, the elastic pop-out mechanism driven by the return spring 110 replaces the manual prying operation, avoiding the phenomenon of damage to the blade edge when using auxiliary fixtures to pry the ultrasonic dicing blade 500 for wafers in the related technology.

[0086] Specifically, the method of use includes:

[0087] S110: Press the support ring 300 to lower the support ring 300 to the assembly station;

[0088] S120: Rotate the sleeve 200 so that the end of the telescopic connector 400 is engaged with the buckle 120 to limit the support ring 300;

[0089] S130: Assemble the wafer ultrasonic dicing blade 500 on the support ring 300;

[0090] S140: Place the pressure ring 700 onto the sleeve and squeeze the wafer ultrasonic dicing blade 500;

[0091] S140: When it is necessary to remove the ultrasonic dicing blade 500 from the wafer, remove the pressure ring 700, and release the snap-fit ​​between the telescopic connector 400 and the buckle 120 by rotating the sleeve 200. The support ring 300 bounces up under the action of the reset spring 110, so as to drive the assembled ultrasonic dicing blade 500 to pop out.

[0092] Please see Figure 1 and Figure 3 The assembly fixture for the ultrasonic dicing blade also includes: a piston rod 600, which is inserted into the sleeve 200; the side wall of the sleeve 200 is provided with a plurality of air blowing holes 220; the side wall of the piston rod 600 abuts against the inner wall of the sleeve 200; after pressing the support ring 300 to lower the support ring 300 to the assembly position, and before assembling the ultrasonic dicing blade 500, the method of use further includes: pulling the piston rod 600 so that the end of the piston rod 600 is located at the upper part of the sleeve 200; after the ultrasonic dicing blade 500 is assembled, the method of use further includes: pressing the piston rod 600 to blow gas out from the air blowing holes 220 to clean the ultrasonic dicing blade 500 on the support ring 300.

[0093] The piston rod 600 drives the airflow to blow out from the air hole 220, which can automatically remove dust and debris from the surface of the ultrasonic wafer dicing blade 500 after assembly. The blowing is achieved by utilizing the internal space of the tooling, without the need for an external air source, thus reducing energy consumption.

[0094] The 220-degree annular air vent layout ensures that the airflow evenly covers the entire area of ​​the ultrasonic dicing blade 500. Air is blown from the center of the ultrasonic dicing blade 500 outwards. Compared with the single-sided airflow method used in related technologies, this method can more thoroughly clean the dust and debris on the ultrasonic dicing blade 500. At the same time, it also prevents the accumulation of debris and dust in the gap between the ultrasonic dicing blade 500 and the tooling.

[0095] It should be noted that after the ultrasonic dicing blade 500 is removed, the method of use further includes: pulling the piston rod 600 again so that the end of the piston rod 600 is located above the sleeve 200; pressing the piston rod 600 to blow gas out from the air hole 220 to clean the support ring 300.

[0096] In summary, this invention provides an assembly fixture for a wafer ultrasonic dicing blade and its usage method. The assembly fixture includes: a base 100; a sleeve 200 rotatably mounted on the base 100; and a support ring 300 sleeved on the sleeve 200 for assembling a wafer ultrasonic dicing blade 500. The sleeve 200 has a telescopic connector 400 on its side wall; the bottom surface of the support ring 300 is connected to the base 100 via a return spring 110; and the inner wall of the support ring 300 is connected to the sleeve 200 via the telescopic connector 400. The base 100 has a buckle 120 on its top. During assembly, after the support ring 300 descends to the assembly station, the sleeve 200 rotates, causing the end of the telescopic connector 400 to engage with the buckle 120, thus limiting the support ring 300. When it is necessary to remove the wafer ultrasonic dicing blade 500, the sleeve 200 rotates to release the engagement between the telescopic connector 400 and the buckle 120, thereby releasing the limitation on the support ring 300. The support ring 300 then springs up under the action of the return spring 110, thereby causing the assembled wafer ultrasonic dicing blade 500 to pop out. The linkage design of the buckle 120 and the telescopic connector 400 enables the rapid limiting and release of the support ring 300. Compared with the threaded adjustment or buckle locking structure in related technologies, this improves disassembly efficiency. At the same time, the elastic pop-out mechanism driven by the reset spring 110 replaces manual prying operation, avoiding the damage to the blade edge that occurs when using auxiliary tooling to pry the ultrasonic dicing blade 500 in related technologies.

[0097] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0098] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as a second element, component, region, layer, or segment.

[0099] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0100] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0101] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. An assembly fixture for a wafer ultrasonic dicing blade, characterized in that, include: Base (100); A sleeve (200) is rotatably mounted on the base (100); Support ring (300), which is sleeved on the sleeve (200), is used to support the stacked wafer ultrasonic dicing blade (500). A clamping ring (700) is used to clamp the assembled ultrasonic dicing blade (500) on the wafer; The sleeve (200) is provided with a telescopic connector (400) on its side wall. The bottom surface of the support ring (300) is connected to the base (100) via a return spring (110); The inner wall of the support ring (300) is connected to the sleeve (200) via a telescopic connector (400); The top of the base (100) is provided with a buckle (120). During assembly, after the support ring (300) descends to the assembly station, the sleeve (200) rotates, causing the end of the telescopic connector (400) to engage in the buckle (120), thus limiting the position of the support ring (300). When it is necessary to remove the ultrasonic dicing blade (500) from the wafer, the sleeve (200) is rotated to release the snap-fit ​​between the telescopic connector (400) and the buckle (120), thereby releasing the limiting position on the support ring (300). The support ring (300) is then lifted up by the reset spring (110) to eject the assembled ultrasonic dicing blade (500). The sleeve (200) has a strip-shaped mounting hole (210) on its side wall along the axial direction. One end of the telescopic connector (400) is connected to the top of the strip mounting hole (210), and the other end is connected to the support ring (300) through the insert (411); The telescopic connector (400) includes: The bellows (410) and the buffer spring (420); One end of the bellows plate (410) is connected to the top of the strip mounting hole (210), and the other end is set downward along the axial direction of the sleeve (200). The insert (411) is set at the end of the bellows plate (410). One end of the buffer spring (420) is connected to the top of the strip mounting hole (210), and the other end is connected to the top surface of the insert (411); When it is necessary to remove the ultrasonic dicing blade (500) from the wafer, the rise of the support ring (300) is buffered by the buffer spring (420); The insert (411) extends radially inward to form a latch (411a) that is adapted to the latch (120). The insert (411) extends radially outward to form a connecting block (411b) that is inserted into the support ring (300). The support ring (300) and the connecting block (411b) are provided with a slot (310). The assembly fixture for the ultrasonic dicing blade for wafers also includes: A piston rod (600) is inserted into the sleeve (200); The sleeve (200) has multiple air holes (220) on its side wall; The side wall of the piston rod (600) abuts against the inner wall of the sleeve (200).

2. The assembly fixture for a wafer ultrasonic dicing blade as described in claim 1, characterized in that, The buckle (120) includes a connecting post (121) and a limiting strip (122); The limiting strip (122) is disposed above the base (100) and is connected to the base (100) through the connecting post (121); The bottom surface of the limiting strip (122) and the top surface of the base (100) form a limiting space for the locking block (411a) to be engaged.

3. The assembly fixture for a wafer ultrasonic dicing blade as described in claim 2, characterized in that, After the ultrasonic dicing blade (500) is assembled, the piston rod (600) descends and squeezes the space inside the sleeve (200) to blow gas out from the air hole (220) to clean the ultrasonic dicing blade (500) on the support ring (300).

4. A method of using the assembly fixture for a wafer ultrasonic dicing blade as described in any one of claims 1-3, characterized in that, The method of use includes: Press down the support ring (300) to lower the support ring (300) to the assembly station; Rotate the sleeve (200) so that the end of the telescopic connector (400) is engaged with the buckle (120) to limit the support ring (300); The ultrasonic dicing blade (500) is assembled on the support ring (300); The pressure ring (700) is fitted onto the sleeve and the wafer ultrasonic dicing blade (500) is squeezed. When it is necessary to remove the ultrasonic dicing blade (500) from the wafer, the pressure ring (700) is removed. By rotating the sleeve (200), the telescopic connector (400) is released from the snap fastener (120). The support ring (300) bounces up under the drive of the reset spring (110) so as to drive the assembled ultrasonic dicing blade (500) to pop out.

5. The method of using the assembly fixture for a wafer ultrasonic dicing blade as described in claim 4, characterized in that, The assembly fixture for the ultrasonic dicing blade for wafers also includes: A piston rod (600) is inserted into the sleeve (200); The sleeve (200) has multiple air holes (220) on its side wall; The side wall of the piston rod (600) abuts against the inner wall of the sleeve (200); After pressing the support ring (300) to lower it to the assembly station, and before assembling the wafer ultrasonic dicing blade (500), the method of use further includes: Pull the piston rod (600) so that the end of the piston rod (600) is located at the upper part of the sleeve (200); After the wafer ultrasonic dicing blade (500) is assembled, the method of use further includes: Pressing the piston rod (600) blows gas out of the air hole (220) to clean the wafer ultrasonic scribing blade (500) on the support ring (300).

6. The method of using the assembly fixture for a wafer ultrasonic dicing blade as described in claim 5, characterized in that, After the ultrasonic dicing blade (500) is removed from the wafer, the method of use further includes: Pull the piston rod (600) again so that the end of the piston rod (600) is located above the sleeve (200); Pressing the piston rod (600) blows gas out of the air hole (220) to clean the support ring (300).

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