Injection molding apparatus for low voltage connector assemblies
By using step-by-step injection molds and precision positioning devices, the problem of difficult injection positioning of low-voltage connector assemblies was solved, achieving high yield and low-cost production, and simplifying the processing procedures.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FOSHAN SHUNDE TIANMASHI ELECTRONICS CO LTD
- Filing Date
- 2025-11-25
- Publication Date
- 2026-07-21
AI Technical Summary
The existing low-voltage connector assemblies are difficult to position during injection molding, resulting in a high product defect rate, increased production costs, and the need for additional machining, making the process complex.
A step-by-step injection mold is adopted. First, injection molding is carried out in the molds of the low-pressure pin and the copper busbar sleeve, and then the whole assembly is formed in the mold. The lifting and rotating device is used to achieve precise positioning of the upper and lower pins. Combined with the limiting and sliding device, deformation is prevented and subsequent processing is simplified.
It improved product yield, reduced production costs, simplified the processing flow, and avoided additional machining steps.
Smart Images

Figure CN121179649B_ABST