An HBM-DRAM grouping test system and method

By adopting a modular probe card and high-performance FPGA design, the complexity of the HBM test system under a high number of interfaces was solved through the group test system, achieving cost optimization and improved test efficiency.

CN121191564BActive Publication Date: 2026-06-26CARBON CORE MICROELECTRONICS TECH (SHENZHEN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CARBON CORE MICROELECTRONICS TECH (SHENZHEN) CO LTD
Filing Date
2025-11-25
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing HBM testing systems face challenges when dealing with HBM products with a high number of interfaces. The complexity of probe card design and manufacturing, as well as the high resource requirements of the test host, result in high costs and difficulty in expansion.

Method used

The group test system adopts a design that separates the main test controller from multiple test execution units. It utilizes modular probe cards and low-pin-count probe card modules, combined with an independent power conditioning and monitoring subsystem and a high-performance FPGA, to achieve modularity and scalability of test resources.

Benefits of technology

It reduces the manufacturing cost and calibration difficulty of probe cards, improves testing efficiency and fault location accuracy, protects user investment, and shortens the test development cycle.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application belongs to the technical field of semiconductor testing, and particularly relates to an HBM-DRAM grouping test system and method, which comprises a main test controller and a plurality of test execution units arranged in the system. The main test controller and the plurality of test execution units are connected in communication through a preset test coordination bus. By physically dividing the test interface into a plurality of independent, low-needle probe card modules, the challenge of designing and manufacturing a single, huge and super-high-needle probe card is fundamentally avoided. This not only greatly reduces the manufacturing cost, calibration difficulty and maintenance cost of each probe card module, but also significantly improves the yield and service life of the whole probe card.
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Citation Information

Patent Citations

  • Method of designing an application specific probe card test system

    CN101501512A

  • Test architecture having multiple fpga based hardware accelerator blocks for testing multiple duts independently

    CN105378494A

  • Multi-core test processor and integrated circuit test system and method

    CN113514759A