Display panel and electronic equipment

Abstract

The invention discloses a display panel and electronic equipment, relates to the technical field of electronic equipment, and aims to solve the problem that the size of the electronic equipment is relatively large. According to the display panel provided by the embodiment of the invention, the wiring layer is arranged on the backlight side of the panel body; the wiring layer comprises a connecting line, and the connecting line is used for connecting a main board and an auxiliary board of the electronic equipment. The main board and the auxiliary board in the electronic equipment are connected through the connecting line, a connecting circuit board for connecting the main board and the auxiliary board does not need to be additionally arranged, occupied space is reduced, the size of the electronic equipment can be reduced, and miniaturization of the electronic equipment is facilitated.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of electronic equipment, and in particular, to a display panel and an electronic device. BACKGROUND

[0002] Electronic equipment (such as a mobile phone, a tablet computer, etc.) generally includes a main board, a sub-board, and a connecting circuit board. The main board and the sub-board are both printed circuit boards (PCB), and the connecting circuit board is generally a flexible printed circuit (FPC). The main board and the sub-board are connected through the connecting circuit board. However, the main board and the sub-board are generally at a certain distance from each other, which results in a relatively long length of the connecting circuit board, and thus a relatively large volume of the electronic equipment, making it difficult to realize miniaturization. SUMMARY

[0003] Embodiments of the present application provide a display panel and an electronic device, which can reduce the volume of the electronic device.

[0004] In a first aspect, embodiments of the present application provide a display panel, comprising: a panel body and a wiring layer, the wiring layer being disposed at a backlight side of the panel body; and the wiring layer comprising a connecting line, the connecting line being configured to connect a main board and a sub-board of an electronic device.

[0005] Through the above arrangement, the main board and the sub-board in the electronic device are connected through the connecting line, and there is no need to additionally arrange a connecting circuit board to connect the main board and the sub-board, which reduces the space occupation, and thus the volume of the electronic device can be reduced, facilitating the miniaturization of the electronic device.

[0006] In some embodiments that can include the above embodiments, the wiring layer comprises a first lead-out segment and a second lead-out segment, a projection of the first lead-out segment and the second lead-out segment in a thickness direction of the panel body at least partially overlaps the panel body, that is, part of the first lead-out segment and part of the second lead-out segment extend out of the panel body, or the first lead-out segment and the second lead-out segment are both completely attached to the panel body; one end of the connecting line is located at the first lead-out segment and is connected to the main board; the other end of the connecting line is located at the second lead-out segment and is connected to the sub-board. In this way, by arranging the first lead-out segment and the second lead-out segment to extend out of the panel body, the connection between the connecting line and the main board and the sub-board is facilitated.

[0007] It can be understood that the first lead-out segment extends towards the main board to be close to the main board, and thus the connection between the first lead-out segment and the main board is facilitated; and the second lead-out segment extends towards the sub-board to be close to the sub-board, and thus the connection between the second lead-out segment and the sub-board is facilitated.

[0008] In some embodiments which can comprise the above-mentioned embodiments, one end of the connecting line is located at the first lead-out section and connected to the main board, comprising: a first connecting point provided on the first lead-out section and connected to the one end of the connecting line, the first connecting point being connected to the main board; the other end of the connecting line is located at the second lead-out section and connected to the auxiliary board, comprising: a second connecting point provided on the second lead-out section and connected to the other end of the connecting line, the second connecting point being connected to the auxiliary board. The first connecting point and the second connecting point can each comprise a metal sheet, the width of the metal sheet being greater than the width of the connecting line, so as to facilitate the connection between the connecting line and the main board and the auxiliary board.

[0009] In some embodiments which can comprise the above-mentioned embodiments, the first connecting point is used for welding with the main board, and the second connecting point is used for welding with the auxiliary board. In this way, the connection can be achieved by welding, which can reduce the difficulty of connection and improve the assembly speed.

[0010] In some embodiments which can comprise the above-mentioned embodiments, the display panel further comprises a first adapter circuit board and a second adapter circuit board, the first connecting point being connected to the main board through the first adapter circuit board, and the second connecting point being connected to the auxiliary board through the second adapter circuit board. In this way, the connection between the wiring layer and the main board and the auxiliary board is facilitated. The first adapter circuit board and the second adapter circuit board can be flexible circuit boards, so that the first adapter circuit board and the second adapter circuit board have a certain flexibility, and the disassembly and installation of the first adapter circuit board and the second adapter circuit board are facilitated through the deformation of the first adapter circuit board and the second adapter circuit board.

[0011] In some embodiments which can comprise the above-mentioned embodiments, the first connecting point can be welded with the first adapter circuit board, the first adapter circuit board being provided with a first connector, the main board being provided with a first adapter matched with the first connector, the first connector being detachably connected to the first adapter to realize the connection with the main board. Similarly, the second connecting point is welded with the second adapter circuit board, the second adapter circuit board being provided with a second connector, the auxiliary board being provided with a second adapter matched with the second connector, the second connector being detachably connected to the second adapter to realize the connection with the auxiliary board.

[0012] In some embodiments which can comprise the above-mentioned embodiments, the first lead-out section is provided with a first positioning member for positioning the first lead-out section, and the second lead-out section is provided with a second positioning member for positioning the second lead-out section. In this way, the position accuracy of the first lead-out section and the second lead-out section can be improved to improve the installation accuracy.

[0013] In some embodiments which can comprise the above-mentioned embodiments, the first positioning member comprises a first protrusion and / or a first groove provided on the first lead-out section, and the second positioning member comprises a second protrusion and / or a second groove provided on the second lead-out section.

[0014] In the implementation mode that the first connecting point is directly welded with the mainboard, the mainboard is provided with a first matching piece matched with the first positioning piece, so that the positioning of the first lead-out section is realized through the matching between the first positioning piece and the first matching piece, and the welding precision is improved. For example, the first matching piece can include a first matching column and / or a first matching groove arranged on the mainboard. In a plane parallel to the mainboard, the projection of the first matching piece can completely coincide with the projection of the first positioning piece. When connected, the first positioning piece can be aligned with the first matching piece, and then the positioning of the first lead-out section is realized.

[0015] In the implementation mode that the first connecting point is connected with the mainboard through the first adapter circuit board, the first matching piece can be arranged on the first adapter circuit board. Similarly, in the implementation mode that the second connecting point is connected with the mainboard through the second adapter circuit board, the second matching piece can be arranged on the second adapter circuit board.

[0016] In some embodiments that can include the above embodiments, the wiring layer further includes a first test line, both ends of the first test line are located in the first lead-out section, and the two ends of the first test line are used to connect different test points on the mainboard. Through the test points on the mainboard connected with the two ends of the first test line, the conductivity between the connecting line and the mainboard can be evaluated, that is, whether the connecting line and the mainboard are connected perfectly. For example, the resistance between the test points on the mainboard connected with the two ends of the first test line can be measured. If the resistance between the test points on the mainboard connected with the two ends of the first test line is large (greater than the resistance value of the first test line itself), it indicates that the conductivity between the connecting line and the mainboard is poor.

[0017] In some embodiments that can include the above embodiments, the wiring layer further includes a second test line, both ends of the second test line are located in the second lead-out section, and the two ends of the second test line are used to connect different test points on the mainboard. Through the test points on the mainboard connected with the two ends of the first test line, the conductivity between the connecting line and the mainboard can be evaluated, that is, whether the connecting line and the mainboard are connected perfectly.

[0018] In some embodiments that can include the above embodiments, the connecting line includes a first connecting line, and the first connecting line is used to transmit a radio frequency signal. The radio frequency signal can be a signal from an antenna or a signal transmitted to an antenna. The resistance of the first connecting line is 35Ω±5Ω (such as 35Ω, 38Ω, 40Ω, etc.). The power of the radio frequency signal is large, and the resistance value of the first connecting line is small, which can reduce the loss and then reduce the influence of the resistance of the first connecting line on the radio frequency signal, so as to ensure the communication performance.

[0019] In some embodiments that can include the above-mentioned embodiments, the connection lines include a second connection line, the second connection line is used to transmit a clock signal, and the resistance of the second connection line is 50Ω±5Ω (such as 45Ω, 50Ω, 55Ω, etc.). In this way, the clock signal can be transmitted between the main board and the sub-board through the second connection line; and the resistance value of the second connection line is moderate to ensure the accuracy of the clock signal.

[0020] In some embodiments that can include the above-mentioned embodiments, the connection lines include a third connection line, the third connection line is used to transmit a peripheral signal, and the peripheral signal can include signals of devices such as a display panel, a camera, a sensor, and a microphone. The resistance of the third connection line is 90Ω±10Ω (such as 80Ω, 90Ω, 100Ω, etc.). In this way, the impedance of the third connection line is moderate, which can reduce the insertion loss, improve the return loss, and thus improve the signal transmission quality.

[0021] In some embodiments that can include the above-mentioned embodiments, the connection lines include a fourth connection line, the fourth connection line is used to transmit an interface signal, and the interface signal can be an I / O bus interface signal such as a PCIE signal and a USB signal. The PCIE signal corresponds to a Peripheral Component Interconnect Express (PCI) bus, and the USB signal corresponds to a Universal Serial Bus (USB). The resistance of the fourth connection line is 100Ω±10Ω (such as 90Ω, 100Ω, 110Ω). In this way, while reducing signal reflection, the width of the fourth connection line can be appropriately reduced to improve the wiring density.

[0022] In some embodiments that can include the above-mentioned embodiments, the connection lines include a fifth connection line, the fifth connection line is used to transmit a power supply signal, and the power supply signal can be a power supply signal between the main board and the sub-board to realize power supply between the main board and the sub-board (such as power supply from the main board to the sub-board or power supply from the sub-board to the main board). The resistance of the fifth connection line is less than or equal to 40mΩ (such as 20mΩ, 30mΩ, 40mΩ, etc.). In this way, the resistance of the fifth connection line is small, which can reduce the voltage drop in the transmission process to ensure the accuracy of the power supply voltage.

[0023] In some embodiments that can include the above-mentioned embodiments, the wiring layer further includes a grounding line, the grounding line is arranged in parallel with and spaced apart from the connection lines, and the grounding line is configured to be grounded. The grounding line can protect the connection lines, thereby preventing external electromagnetic signals from interfering with the signals transmitted by the grounding line and improving the signal transmission quality.

[0024] In some embodiments which can comprise the above-mentioned embodiments, the display panel further comprises a grounding layer, the grounding layer is arranged on the side of the wiring layer away from the panel body in a stacked manner, the grounding layer is configured to be grounded; the wiring layer is provided with a through hole extending to the grounding layer, and a conductor is arranged in the through hole and connected with the grounding wire and the grounding layer. In this way, the connection between the grounding wire and the grounding layer is realized through the conductor, and the grounding of the grounding wire is realized, and the structure is simple and convenient to manufacture.

[0025] In some embodiments which can comprise the above-mentioned embodiments, the wiring layer comprises a main body layer and a metal layer arranged in a stacked manner, and the metal layer comprises the connection wire. Through the above-mentioned arrangement, the main body layer can support the metal layer to avoid the metal layer from falling off.

[0026] In some embodiments which can comprise the above-mentioned embodiments, the display panel further comprises a back plate arranged on the backlight side of the panel body in a stacked manner, and the panel body can be supported through the back plate. In the implementation mode in which the main body layer is arranged between the metal layer and the panel body, the back plate can comprise the main body layer, that is, the back plate and the main body layer can be the same film layer. In this way, the main body layer does not need to be additionally arranged, the number of film layers of the display panel can be reduced, and the thickness and mass of the display panel are reduced.

[0027] In some embodiments which can comprise the above-mentioned embodiments, the wiring layer further comprises a flat layer covering the metal layer. Part of the flat layer is filled in the groove (between adjacent connection wires) on the metal layer, and the remaining part of the flat layer covers the metal layer. In this way, the flat layer can protect the metal layer from being damaged. In addition, the surface of the flat layer away from the main body layer is relatively flat, so as to facilitate the connection with other film layers.

[0028] In a second aspect, the embodiments of the present application further provide an electronic device, comprising: a main board, a sub-board and a display panel as described above; the main board and the sub-board are connected through the connection wire. The electronic device provided by the embodiments of the present application comprises the display panel in any of the above-mentioned embodiments, so that the same technical problems can be solved and the same technical effects can be achieved.

[0029] In some embodiments which can comprise the above-mentioned embodiments, the electronic device further comprises a first middle frame and a second middle frame, the first middle frame and the second middle frame are foldably connected, the main board is arranged on the first middle frame, the sub-board is arranged on the second middle frame, and the display panel covers the first middle frame and the second middle frame. The electronic device is a foldable electronic device, and the user experience can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 An exploded view of the electronic device provided by the embodiments of the present application;

[0031] Figure 2 An axial side view of the electronic device provided by the embodiments of the present application;

[0032] Figure 3 An internal structure diagram of an electronic device provided for an embodiment of the present application;

[0033] Figure 4 A cross-sectional view of a display panel provided for an embodiment of the present application;

[0034] Figure 5 A connection schematic diagram between a display panel and a mainboard provided for an embodiment of the present application;

[0035] Figure 6 A connection schematic diagram between a display panel and a mainboard provided for an embodiment of the present application; Figure 5 A local enlarged view at M in FIG. 8;

[0036] Figure 7 A connection schematic diagram between a display panel and a screen circuit board provided for an embodiment of the present application;

[0037] Figure 8 A cross-sectional view of a wiring layer in a display panel provided for an embodiment of the present application Figure 1 ;

[0038] Figure 9 A structure schematic diagram of a wiring layer in a display panel provided for an embodiment of the present application Figure 1 ;

[0039] Figure 10 A structure schematic diagram of a first lead-out segment in a display panel provided for an embodiment of the present application;

[0040] Figure 11 A structure schematic diagram of a second lead-out segment in a display panel provided for an embodiment of the present application;

[0041] Figure 12 A connection schematic diagram between a wiring layer and a first adapter circuit board and a second adapter circuit board in a display panel provided for an embodiment of the present application;

[0042] Figure 13 A structure schematic diagram of a wiring layer in a display panel provided for an embodiment of the present application; Figure 12

[0043] A structure schematic diagram of a first adapter circuit board in a display panel provided for an embodiment of the present application; Figure 14 Figure 12 A structure schematic diagram of a first positioning member in a display panel provided for an embodiment of the present application

[0044] ; Figure 15 Figure 1 A structure schematic diagram of a first positioning member in a display panel provided for an embodiment of the present application

[0045] ; Figure 16 Figure 2

[0046] Figure 17 ​​A structure schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 1, in which a first test line is arranged on a wiring layer.

[0047] Figure 18 A structure schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 1, in which a first test line is arranged on a wiring layer. Figure 2

[0048] Figure 19 A partial enlarged view of A in FIG. 1 is shown in FIG. 2. Figure 18

[0049] A structure schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 1, in which a first test line is arranged on a wiring layer. Figure 20 Figure 3

[0050] A structure schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 1, in which a first test line is arranged on a wiring layer. Figure 21 Figure 2

[0051] FIG. 10 is a schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be described below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments of the present application.

[0053] ​​​​Hereinafter, the terms "first", "second", and the like are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of the indicated technical features. Therefore, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features.

[0054] In addition, in the embodiments of the present application, the orientation terms such as "upper", "lower", "left", "right", "horizontal" and "vertical" are defined with respect to the orientation of the components shown in the drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0055] The connection / connection in the embodiments of the present application should be understood in a broad sense. For example, the "connection" can be fixed connection, electrical connection, or detachable connection, or integral; can be directly connected, or indirectly connected through intermediate medium.

[0056] The electronic device provided in the embodiments of the present application can include a mobile phone, a tablet computer, a smart watch, etc. The electronic device is not limited in the embodiments of the present application.

[0057] Please refer to Figure 1 In some embodiments, the electronic device 10 can include a non-foldable electronic device. Taking a straight bar mobile phone as an example, the electronic device 10 can include a middle frame 110, a display panel 20, a main board 120, a sub-board 130, a battery 140, and a back cover 150. The middle frame 110 encloses a containing space 111. The display panel 20 covers one side of the middle frame 110. The back cover 150 covers the other side of the middle frame 110 to enclose the containing space 111. The main board 120, the sub-board 130, and the battery 140 are all arranged in the containing space 111. The battery 140 is used to supply power to the main board 120 and the sub-board 130.

[0058] In some implementations, the main board 120 and the sub-board 130 can both be printed circuit boards (PCBs). The sub-board 130 can be connected with devices such as a charging interface, a microphone, and a motor. The main board 120 can be connected with devices such as a camera and an antenna in the electronic device 10. The main board 120 can further be provided with a system chip (SOC) and a memory. Figure 1The main board 120 can be arranged on the upper part of the battery 140, and the auxiliary board 130 can be arranged on the lower part of the battery 140, so as to ensure the rationality of the layout of the electronic device 10. The main board 120 and the auxiliary board 130 are electrically connected to realize signal transmission between the main board 120 and the auxiliary board 130. The display panel 20 can be connected with the main board 120 or the auxiliary board 130 to display images under the control of the main board 120 or the auxiliary board 130.

[0059] Please refer to Figure 2 and Figure 3 In some embodiments, the electronic device 10 can be a folding electronic device. For example, the electronic device 10 can include a first middle frame 112, a second middle frame 113, and a display panel 20. The first middle frame 112 and the second middle frame 113 are foldable connected. For example, the first middle frame 112 and the second middle frame 113 can be connected by a hinge structure 160. The hinge structure 160 is configured to allow the first middle frame 112 to fold or unfold relative to the second middle frame 113. The embodiments of the present application do not limit the hinge structure 160. When the first middle frame 112 unfolds relative to the second middle frame 113 (the electronic device 10 is in an unfolded state), the first middle frame 112 and the second middle frame 113 can be located in substantially the same plane. When the first middle frame 112 and the second middle frame 110 are folded together (the electronic device 10 is in a folded state), the first middle frame 112 and the second middle frame 113 are approximately parallel and close to each other.

[0060] It can be understood that in the above embodiments, the display panel 20 covers the first middle frame 112 and the second middle frame 113. The display panel 20 is a flexible display panel, so that the display panel 20 is bent during folding or unfolding of the first middle frame 112 relative to the second middle frame 113. For example, in the folded state, the display panel 20 can be arranged between the first middle frame 112 and the second middle frame 113 (i.e., inner folding). Alternatively, in the folded state, the display panel 20 can cover the outside of the first middle frame 112 and the second middle frame 113 (i.e., outer folding). The embodiments of the present application do not limit this.

[0061] The first middle frame 112 surrounds the first accommodating space 114, and the second middle frame 113 surrounds the second accommodating space 115. The electronic device 10 further includes a main board 120 and a sub-board 130. The main board 120 can be arranged in the first accommodating space 114, and the sub-board 130 is arranged in the second accommodating space 115. The display panel 20 can be connected with the main board 120 or the sub-board 130 to display images under the control of the main board 120 or the sub-board 130. The main board 120 and the sub-board 130 are electrically connected to realize signal transmission between the main board 120 and the sub-board 130. For example, the main board 120 is provided with a system chip, a memory and the like. The main board 120 can also be connected with a camera, an antenna and the like. The sub-board 130 can be connected with a charging interface, a microphone, a motor and the like. The electronic device 10 further includes a first battery 141 and a second battery 142. The first battery 141 is arranged in the first accommodating space 114, and the second battery is arranged in the second accommodating space 115. The first battery 141 and the second battery 142 can increase the battery capacity of the electronic device 10, thereby increasing the standby time.

[0062] Please refer to Figure 4 In the embodiment of the present application, the display panel 20 includes a panel body 201. The panel body 201 is used to display images. For example, the panel body 201 can include an organic light-emitting diode display device (OLED), a liquid crystal display device (LCD), a min-LED device, and the like. The embodiment of the present application does not limit the panel body 201. It can be understood that, as shown in Figure 1 In the implementation mode in which the electronic device 10 is a non-foldable electronic device, the display panel 20 can be a rigid display panel, that is, the display panel 20 cannot be bent. As shown in Figure 2 In the implementation mode in which the electronic device 10 is a foldable electronic device, the display panel 20 is a flexible display panel, that is, the display panel 20 can be bent.

[0063] Please refer to Figure 5 and Figure 6 The panel body 201 includes a bending segment 240 located at the edge and bent to the backlight side of the panel body 201. The bending segment 240 is connected with the main board 120 through a screen circuit board 250 to display images under the control of the main board 120. In some implementation modes, the screen circuit board 250 is further provided with a driving chip 251. The driving chip 251 can drive the panel body 201 to display images under the control of the main board 120. Please refer to Figure 7In the implementation where the display panel 20 has a large size, a plurality of driving chips 251 can be arranged on the screen circuit board 250 to meet the driving requirements of the panel body 201. It can be understood that the light-emitting side is the side of the panel body 201 facing the user, and the backlight side is the side of the panel body 201 facing away from the user.

[0064] In the above implementation, the screen circuit board 250 can include a flexible printed circuit (FPC), and the screen circuit board 250 can be appropriately bent to facilitate connection with the main board 120.

[0065] In other embodiments, the screen circuit board 250 can also be connected to the sub-board 130 (as shown in Figure 1 and Figure 3 to display images under the control of the sub-board 130.

[0066] Continuing to refer to Figure 4 In some embodiments, the display panel 20 further includes a polarizer 202 (Pol) arranged on the light-emitting side of the panel body 201 in a stacked manner. The polarizer 202 can reduce the reflection of ambient light, thereby avoiding the interference of ambient light and improving the imaging quality of the display panel 20.

[0067] In some embodiments, the display panel 20 further includes a color filter on encapsulation (COE) arranged on the light-emitting side of the panel body 201 in a stacked manner. The color filter can also eliminate the interference of external ambient light, thereby improving the imaging quality of the display panel 20.

[0068] In the above implementation, the display panel 20 can further include a cover glass 204 (CG) and an optically clear adhesive 203 (OCA). The cover glass 204 covers the light-emitting side of the panel body 201, and the optically clear adhesive 203 is arranged between the cover glass 204 and the panel body 201. The optically clear adhesive 203 can be used to bond the cover glass 204 and the panel body 201. The cover glass 204 can be used to protect the panel body 201 from damage by external objects.

[0069] It can be understood that in the implementation where the display panel 20 includes the polarizer 202, the cover glass 204 can be arranged on the side of the polarizer 202 facing away from the panel body 201, and the cover glass 204 is connected to the polarizer 202 through the optically clear adhesive 203. In the implementation where the display panel 20 includes the color filter, the cover glass 204 can be arranged on the side of the color filter facing away from the panel body 201, and the cover glass 204 is connected to the color filter through the optically clear adhesive 203.

[0070] Please refer to Figure 4 and Figure 8 In the embodiment, the display panel 20 further includes a wiring layer 210, the wiring layer 210 is arranged on the backlight side of the panel body 201, and the wiring layer 210 includes a connecting line 211, the connecting line 211 is used to connect the mainboard 120 and the subboard 130 in the electronic device 10 (as shown in Figure 1 and Figure 3 illustrated); that is, the mainboard 120 and the subboard 130 in the above embodiment are connected through the connecting line 211 to realize signal transmission between the mainboard 120 and the subboard 130. The connecting line 211 can be one or more, and the number of the connecting line 211 is not limited in the embodiment.

[0071] In the embodiment, the connecting line 211 has a certain resistance, and the width and length of the connecting line 211 can be reasonably set to adjust the resistance of the connecting line 211. For example, increasing the length of the connecting line 211 can increase the resistance of the connecting line 211, and increasing the width of the connecting line 211 can reduce the resistance of the connecting line 211. The resistance of the connecting line 211 can be reasonably set according to the signal transmitted by the connecting line 211 to meet the use requirement.

[0072] In some embodiments, the connecting line 211 can include a first connecting line, and the first connecting line is used to transmit a radio frequency signal. The radio frequency signal can be a signal from an antenna or a signal transmitted to an antenna. The resistance of the first connecting line is 35Ω±5Ω (such as 35Ω, 38Ω, 40Ω, etc.). The radio frequency signal has a large power, and the resistance value of the first connecting line is small, which can reduce the loss and thus reduce the influence of the resistance of the first connecting line on the radio frequency signal to ensure the communication performance. It can be understood that the first connecting line can be multiple, and the multiple first connecting lines are arranged at intervals to transmit the radio frequency signal.

[0073] In some embodiments, the connecting line 211 includes a second connecting line, and the second connecting line is used to transmit a clock signal, and correspondingly, the resistance of the second connecting line is greater than or equal to 35Ω; for example, the resistance of the second connecting line is 50Ω±5Ω (such as 45Ω, 50Ω, 55Ω, etc.). In this way, the second connecting line can realize the transmission of the clock signal between the mainboard 120 and the subboard 130; and the resistance value of the second connecting line is moderate to ensure the accuracy of the clock signal. It can be understood that the second connecting line can be multiple, and the multiple second connecting lines are arranged at intervals to transmit the clock signal.

[0074] In some embodiments, the connection line 211 includes a third connection line for transmitting peripheral signals; the peripheral signals can include signals of devices such as the display panel 20, the camera, the sensor, the microphone, etc. The resistance of the third connection line is 90Ω±10Ω (such as 80Ω, 90Ω, 100Ω, etc.). In this way, the impedance of the third connection line is moderate, which can reduce the insertion loss, improve the return loss, and thus improve the signal transmission quality. It can be understood that the third connection line can be multiple, and the multiple third connection lines are arranged at intervals to transmit the peripheral signals.

[0075] In some embodiments, the connection line 211 includes a fourth connection line for transmitting interface signals; the interface signals can be I / O bus interface signals such as PCIE signals and USB signals; the PCIE signals correspond to a Peripheral Component Interconnect Express (PCI) bus, and the USB signals correspond to a Universal Serial Bus (USB). The resistance of the fourth connection line is 100Ω±10Ω (such as 90Ω, 100Ω, 110Ω); in this way, while reducing signal reflection, the width of the fourth connection line can be appropriately reduced to improve the wiring density. It can be understood that the fourth connection line can be multiple, and the multiple fourth connection lines are arranged at intervals to transmit the interface signals.

[0076] In some embodiments, the connection line 211 includes a fifth connection line for transmitting power supply signals; the power supply signals can be power supply signals between the main board 120 and the auxiliary board 130 to realize power supply between the main board 120 and the auxiliary board 130 (such as power supply from the main board 120 to the auxiliary board 130 or power supply from the auxiliary board 130 to the main board 120). The resistance of the fifth connection line is less than or equal to 40mΩ (such as 20mΩ, 30mΩ, 40mΩ, etc.). In this way, the resistance of the fifth connection line is small, which can reduce the voltage drop in the transmission process to ensure the accuracy of the power supply voltage. It can be understood that the fifth connection line can be multiple, and the multiple fifth connection lines are arranged at intervals to transmit the power supply signals.

[0077] In some implementations, the connection line 211 can include one or more of the first connection line, the second connection line, the third connection line, the fourth connection line, and the fifth connection line. For example, the connection line 211 can include the first connection line, the second connection line, the third connection line, the fourth connection line, and the fifth connection line.

[0078] For example, Figure 4 and Figure 8As shown, in the display panel 20 in the embodiment of the present application, the wiring layer 210 is arranged on the backlight side of the panel body; the wiring layer 210 includes the connecting line 211, and the main board 120 and the auxiliary board 130 in the electronic device 10 are connected through the connecting line 211, without the need to additionally arrange a connecting circuit board for connecting the main board 120 and the auxiliary board 130, thereby reducing the space occupation, and further reducing the volume of the electronic device 10, facilitating the miniaturization of the electronic device 10.

[0079] As shown in Figure 1 , in the implementation mode in which the electronic device 10 is a non-foldable electronic device, the battery 140 is arranged between the main board 120 and the auxiliary board 130, and the connecting circuit board for connecting the main board 120 and the auxiliary board 130 will cross the battery 140, and the thickness of the electronic device 10 is limited, thus causing the thickness of the battery 140 to be small, and the capacity of the battery 140 to be small. As shown in Figure 1 and Figure 4 , in the embodiment of the present application, the main board 120 and the auxiliary board 130 are connected through the wiring layer 210 of the display panel 20, without the need to arrange a connecting circuit board, thereby increasing the thickness of the battery 140, improving the capacity of the battery 140, and further improving the standby time of the electronic device 10.

[0080] As shown in Figure 3 , in the implementation mode in which the electronic device 10 includes a foldable electronic device, the connecting circuit board for connecting the main board 120 and the auxiliary board 130 will pass through the hinge structure 160, causing the volume of the hinge structure 160 to be large. As shown in Figure 3 and Figure 4 , in the embodiment of the present application, the main board 120 and the auxiliary board 130 are connected through the wiring layer 210 of the display panel 20, without the need to arrange a connecting circuit board, thereby reducing the volume of the hinge structure 160.

[0081] Continuing to refer to Figure 4 and Figure 8 , in the embodiment of the present application, the wiring layer 210 includes a main body layer 212 and a metal layer 213, and the main body layer 212 and the metal layer 213 are arranged on the backlight side of the panel body 201 in a stacked manner; the material of the main body layer 212 can include an insulating material such as polyimide (PI), and the embodiment of the present application does not limit the material of the main body layer 212. The metal layer 213 includes the connecting line 211, that is, the connecting line 211 can be obtained by patterning the metal layer 213; for example, part of the metal layer 213 can be removed by etching, cutting, or the like to form the connecting line 211. Of course, the metal layer 213 with a certain pattern (the connecting line 211) can be formed by electroplating. The material of the metal layer 213 can include copper, aluminum, or the like, and the thickness of the metal layer 213 can be 4-10 μm (for example, 5 μm, 6 μm, 7 μm, 8 μm, or the like).

[0082] Through the above arrangement, the main body layer 212 can support the metal layer 213 to avoid the metal layer 213 from falling off.

[0083] In some embodiments, the metal layer 213 can be arranged between the main body layer 212 and the panel body 201, or the main body layer 212 is arranged between the metal layer 213 and the panel body 201.

[0084] Continuing to refer to Figure 4 and Figure 8 In the above implementation, the wiring layer 210 can further include a flat layer 214, which covers the metal layer 213; that is, part of the flat layer 214 fills in the recesses (between adjacent connecting lines 211) on the metal layer 213, and the rest of the flat layer 214 covers the metal layer 213. In this way, the flat layer 214 can protect the metal layer 213 from being damaged. In addition, the surface of the flat layer 214 away from the main body layer 212 is relatively flat, so as to facilitate the connection with other film layers. For example, the thickness of the flat layer 214 can be 8 pm ± 2 pm (e.g., 6 pm, 8 pm, 10 pm, etc.).

[0085] In some embodiments, the display panel 20 further includes a back plate 252 arranged on the backlight side of the panel body 201 in a stacked manner, and the panel body 201 can be supported by the back plate 252. In the implementation where the main body layer 212 is arranged between the metal layer 213 and the panel body 201, the back plate 252 can include the main body layer 212; that is, the back plate 252 and the main body layer 212 can be the same film layer. In this way, the main body layer 212 does not need to be additionally arranged, which can reduce the number of film layers of the display panel 20, and further reduce the thickness and mass of the display panel 20.

[0086] Continuing to refer to Figure 4 In some implementations, the display panel 20 further includes an adhesive layer 216 and a support layer 215 arranged on the backlight side of the panel body 201, the adhesive layer 216 is located between the support layer 215 and the wiring layer 210, and the support layer 215 and the wiring layer 210 can be connected by the adhesive layer 216, so as to fix the support layer 215; the support layer 215 can further support the panel body 201. For example, in the implementation where the electronic device is a non-foldable electronic device, the material of the support layer 215 can include copper, aluminum, etc.; in the implementation where the electronic device includes a foldable electronic device, the support layer 215 can include a bendable metal plate.

[0087] In the above implementation, the adhesive layer 216 can include a first adhesive layer 2161 and a second adhesive layer 2162 stacked to improve the adhesion of the adhesive layer 216. For example, the second adhesive layer 2162 can be located between the first adhesive layer 2161 and the support layer 215, the first adhesive layer 2161 can include a mesh adhesive, and the second adhesive layer 2162 can include a foam adhesive.

[0088] Please refer to Figure 9 In the embodiment, the wiring layer 210 includes a first lead-out section 217 and a second lead-out section 218, and the projections of the first lead-out section 217 and the second lead-out section 218 in the thickness direction of the panel body 201 at least partially overlap the panel body 201, that is, part of the first lead-out section 217 and part of the second lead-out section 218 can extend out of the panel body 201, or the first lead-out section 217 and the second lead-out section 218 are completely attached to the panel body 201. One end of the connection line 211 is located on the first lead-out section 217, and the other end of the connection line 211 is located on the second lead-out section 218; the connection line 211 on the first lead-out section 217 is used to connect the main board 120 (as shown in Figure 1 ), and the connection line 211 on the second lead-out section 218 is used to connect the auxiliary board 130. In this way, by providing the first lead-out section 217 and the second lead-out section 218 extending out of the panel body 201, the connection between the connection line 211 and the main board 120 and the auxiliary board 130 is facilitated.

[0089] In other implementations, the projections of the first lead-out section 217 and the second lead-out section 218 in the thickness direction of the panel body 201 are located outside the panel body 201, that is, the first lead-out section 217 and the second lead-out section 218 are located outside the panel body 201.

[0090] Please refer to Figure 9 In the implementation in which the wiring layer 210 includes a main body layer 212 (as shown in Figure 8 ), the main body layer 212 includes an attached layer 253, a first lead-out section 217, and a second lead-out section 218 in an integrated structure, the attached layer 253 is attached to the panel body 201 (as shown in Figure 4 ), the first lead-out section 217 and the second lead-out section 218 extend out of the panel body 201, one end of the connection line 211 is located on the first lead-out section 217, the other end of the connection line 211 is located on the second lead-out section 218, and the remaining part of the connection line 211 is located on the attached layer 253.

[0091] Please refer to Figure 9 It can be understood that the first lead-out section 217 is connected to the main board 120 (as shown in Figure 1 and Figure 3The first extension section 217 extends to be close to the main plate 120, thereby facilitating connection with the main plate 120; and the second extension section 218 extends to be close to the auxiliary plate 130, thereby facilitating connection with the auxiliary plate 130. The position of the first extension section 217 and the second extension section 218 is not limited in the embodiments of the present application, and can be set according to the position of the main plate 120 and the auxiliary plate 130. In the implementation mode in which the display panel includes the bending section 240 as shown in Figure 6 The first extension section 217 or the second extension section 218 can be located on the same side of the panel body as the bending section 240, or the first extension section 217 and the second extension section 218 can be located on different sides of the panel body from the bending section 240, which is not limited in the embodiments of the present application.

[0092] Please refer to Figure 9 and Figure 10 In some implementation modes, one end of the connection line 211 is located on the first extension section 217 and connected to the main plate 120, including that a first connection point 219 connected to the one end of the connection line 211 is arranged on the first extension section 217, and the first connection point 219 is used to connect the main plate 120 (as shown in Figure 1 and Figure 3 Similarly, as shown in Figure 9 and Figure 11 the other end of the connection line 211 is located on the second extension section 218 and connected to the auxiliary plate 130, including that a second connection point 220 connected to the other end of the connection line 211 is arranged on the second extension section 218, and the second connection point 220 is used to connect the auxiliary plate 130. The first connection point 219 and the second connection point 220 can each include a metal sheet, and the width of the metal sheet is greater than the width of the connection line 211, so as to facilitate the connection between the connection line 211 and the main plate 120 and the auxiliary plate 130. For example, the shape of the first connection point 219 and the second connection point 220 can be a regular shape such as a rectangle, a circle, a trapezoid, an ellipse, etc., and the shape of the first connection point 219 and the second connection point 220 can also be other irregular shapes.

[0093] It can be understood that in the implementation mode in which the connection line 211 includes multiple connection lines such as the first connection line, the second connection line, the third connection line, the fourth connection line and the fifth connection line, multiple first connection points 219 are arranged on the first extension section 217, and multiple second connection points 220 are arranged on the second extension section 218, one end of each connection line 211 is connected to one first connection point 219, and the other end of each connection line 211 is connected to one second connection point 220, so that one end of each connection line 211 is connected to the main plate 120 (as shown in Figure 1 and Figure 3As shown), the other end of each connecting line 211 is connected to the sub-board 130 through the corresponding second connecting point 220.

[0094] In some embodiments, the first connection point 219 is directly connected to the motherboard 120 (e.g., Figure 1 and Figure 3 As shown, the first connection point 219 can be soldered to the main board 120, and the second connection point 220 can be soldered to the sub-board 130. This configuration, using soldering, reduces connection difficulty and increases assembly speed. Soldering can be performed using laser soldering, rigid-flex PCB (FPC On Board, FOB) soldering, or hot-press soldering. In other implementations, the first connection point 219 can also be connected to the main board 120 via an anisotropic conductive film (ACF), and the second connection point 220 can also be connected to the sub-board 130 via anisotropic conductive film. The anisotropic conductive adhesive film includes a thermosetting resin doped with silver-coated resin particles. During use, the anisotropic conductive adhesive film is sandwiched between the first lead-out section 217 and the main board 120. Heating then destroys the resin particles, allowing the silver to connect the first connection point 219 to the main board 120. Similarly, when connecting the second lead-out section 218, the anisotropic conductive adhesive film is sandwiched between the second lead-out section 218 and the sub-board 130. Heating then destroys the resin particles, allowing the silver to connect the second connection point 220 to the sub-board 130.

[0095] Please refer to Figure 12 and Figure 13 In other embodiments, the display panel 20 further includes a first adapter circuit board 221 and a second adapter circuit board 222, with the first connection point 219 connected to the motherboard 120 (e.g., via the first adapter circuit board 221) through the first adapter circuit board 221. Figure 1 and Figure 3 (As shown) the connection; the second connection point 220 is connected to the sub-board 130 via the second adapter circuit board 222. This arrangement facilitates the connection between the wiring layer and the main board 120 and the sub-board 130. The first adapter circuit board 221 and the second adapter circuit board 222 can be flexible circuit boards, giving them a certain degree of flexibility. The deformation of the first adapter circuit board 221 and the second adapter circuit board 222 facilitates their disassembly and installation.

[0096] Continue to refer to Figure 12 and Figure 13It can be understood that the first connecting point 219 can be welded with the first adapter circuit board 221, the first adapter circuit board 221 is provided with the first connector 223, the main board 120 can be provided with the first adapter matched with the first connector 223, the first connector 223 is detachably connected with the first adapter, and then the connection between the main board 120 is realized. Similarly, the second connecting point 220 is welded with the second adapter circuit board 222, the second adapter circuit board 222 is provided with the second connector 224, the auxiliary board 130 is provided with the second adapter matched with the second connector 224, the second connector 224 is detachably connected with the second adapter, and then the connection between the auxiliary board 130 is realized. Of course, in other implementation manners, the first adapter circuit board 221 can be connected with the main board 120 by welding, and the second adapter circuit board 222 is connected with the auxiliary board 130 by welding, and the embodiment of the application does not limit the connection mode between the first adapter circuit board 221 and the main board 120 and the connection mode between the second adapter circuit board 222 and the auxiliary board 130.

[0097] Please refer to Figure 13 In some embodiments, the first lead-out section 217 is provided with the first positioning member 225, and the first positioning member 225 is used for positioning the first lead-out section 217; the second lead-out section 218 is provided with the second positioning member 227, and the second positioning member 227 is used for positioning the second lead-out section 218. In this way, the position accuracy of the first lead-out section 217 and the second lead-out section 218 can be improved, so as to improve the installation accuracy.

[0098] For example, the first positioning member 225 includes the first protrusion and / or the first groove arranged on the first lead-out section 217. Similarly, the second positioning member 227 includes the second protrusion and / or the second groove arranged on the second lead-out section 218. In this way, the first positioning member 225 and the second positioning member 227 are relatively simple, and the manufacturing of the display panel is facilitated.

[0099] Please refer to Figure 10 and Figure 11 In the implementation manner that the first connecting point 219 is directly welded with the main board 120 (as shown in Figure 1 and Figure 3 , the main board 120 is provided with the first matching member matched with the first positioning member 225, so as to limit the first lead-out section 217 through the cooperation between the first positioning member 225 and the first matching member, and the welding accuracy is improved. For example, the first matching member can include the first matching column and / or the first matching groove arranged on the main board 120, and the projection of the first matching member can be completely coincident with the projection of the first positioning member 225 in the plane parallel to the main board 120. When connected, the first positioning member 225 can be aligned with the first matching member, and then the positioning of the first lead-out section 217 is realized.

[0100] Similarly, at the second connection point 220, it is directly connected to the sub-board 130 (e.g. Figure 1 and Figure 3 In the welding implementation shown, the sub-plate 130 is provided with a second mating member that cooperates with the second positioning member 227. The second lead-out section 218 is limited by the cooperation between the second positioning member 227 and the second mating member, thereby improving welding accuracy. For example, the second mating member may include a second mating post and / or a second mating groove provided on the sub-plate 130. In a plane parallel to the sub-plate 130, the projection of the second mating member can completely coincide with the projection of the second positioning member 227. During connection, the second positioning member 227 can be aligned with the second mating member to achieve positioning of the second lead-out section 218.

[0101] like Figure 12- Figure 14 As shown, it can be understood that at the first connection point 219, the first adapter circuit board 221 connects to the main board 120 (e.g., Figure 1 and Figure 3 In the implementation of the connection shown, the first mating component 226 can be disposed on the first adapter circuit board 221. Similarly, in the implementation where the second connection point 220 is connected to the main board sub-board 130 via the second adapter circuit board 222, the second mating component can be disposed on the second adapter circuit board 222. The structures of the first positioning component 225 and the first mating component 226 are roughly similar to those in the above implementation, and the structures of the second positioning component 227 and the second mating component are also roughly similar to those in the above implementation, and will not be described further here.

[0102] In the above implementation, the first positioning member 225 is parallel to the motherboard 120 (e.g., Figure 1 and Figure 3 The projection of the first positioning member 225 onto the plane parallel to the motherboard 120 can be a regular shape such as a circle or rectangle; of course, the projection of the first positioning member 225 onto the plane parallel to the motherboard 120 can also be other irregular shapes. For example, the projection of the first positioning member 225 onto the plane parallel to the motherboard 120 can be a cross shape (such as...). Figure 15 As shown), a semi-"I" shape (such as...) Figure 16 (as shown in the figure). The second positioning member 227 and the first positioning member 225 may have the same or different shapes. This application embodiment does not limit this.

[0103] like Figure 17 and Figure 18As shown in the above embodiments, the wiring layer 210 further comprises a first test line 229, both ends of the first test line 229 are located at the first lead-out section 217, and the two ends of the first test line 229 are used to connect different test points on the main board 120; by the test points on the main board 120 connected to the two ends of the first test line 229, the continuity between the connecting line 211 and the main board 120 (such as Figure 1 and Figure 3 shown) can be evaluated, that is, whether the connecting line 211 and the main board 120 are connected well. For example, the resistance between the test points on the main board 120 connected to the two ends of the first test line 229 can be measured to evaluate the continuity between the connecting line 211 and the main board 120, and if the resistance between the test points on the main board 120 connected to the two ends of the first test line 229 is large (greater than the resistance of the first test line 229 itself), it indicates that the continuity between the connecting line 211 and the main board 120 is poor.

[0104] It can be understood that the first test line 229 can be multiple, and the two ends of each first test line 229 are connected to different test points on the main board 120; or one end of the multiple first test lines 229 is connected to the same test point on the main board 120, and the other end of each first test line 229 is connected to different test points on the main board 120. If the resistance between the test points at both ends of each first test line 229 is small (approximately equal to the resistance of the first test line 229 itself), it can be determined that the continuity between the connecting line 211 and the main board 120 is good, and if there is a first test line 229 with large resistance between the test points at both ends, it can be determined that the continuity between the connecting line 211 and the main board 120 is poor.

[0105] Continuing to refer to Figure 18 In some embodiments, the wiring layer 210 further comprises a second test line 230, both ends of the second test line 230 are located at the second lead-out section 218, and the two ends of the second test line 230 are used to connect different test points on the sub-board 130 (such as Figure 1 and Figure 3 shown); by the test points on the sub-board 130 connected to the two ends of the second test line 230, the continuity between the connecting line 211 and the sub-board 130 can be evaluated, that is, whether the connecting line 211 and the sub-board 130 are connected well. For example, the resistance between the test points on the sub-board 130 connected to the two ends of the second test line 230 can be measured to evaluate the continuity between the connecting line 211 and the sub-board 130, and if the resistance between the test points on the sub-board 130 connected to the two ends of the second test line 230 is large (greater than the resistance of the second test line 230 itself), it indicates that the continuity between the connecting line 211 and the sub-board 130 is poor.

[0106] It can be understood that the second test line 230 can be multiple, and two ends of each second test line 230 are connected with different test points on the auxiliary plate 130; or one end of multiple second test lines 230 is connected with the same test point on the auxiliary plate 130, and the other end of each second test line 230 is connected with different test points on the auxiliary plate 130. If the resistance between the test points at two ends of each second test line 230 is small (approximately equal to the resistance of the second test line 230 itself), it can be determined that the conduction between the connection line 211 and the auxiliary plate 130 is good, and if there is a second test line 230 with large resistance between the test points at two ends, it can be determined that the conduction between the connection line 211 and the auxiliary plate 130 is poor.

[0107] Please refer to Figure 18 and Figure 19 In some embodiments, the wiring layer 210 further includes a grounding line 231, the grounding line 231 is arranged in parallel with the connection line 211, and the grounding line 231 is configured to be grounded. The grounding line 231 can protect the connection line 211, thereby preventing external electromagnetic signals from interfering with the signals transmitted by the grounding line 231, and improving the signal transmission quality.

[0108] It can be understood that the grounding line 231 can be multiple, and multiple grounding lines 231 can be arranged on one side of the connection line 211 along the direction parallel to the panel body 201 (as shown in Figure 4 ). To prevent external electromagnetic signals on one side of the connection line 211 from interfering with it. Alternatively, some of the multiple grounding lines 231 are located on one side of the connection line 211 along the direction parallel to the panel body 201, and the remaining grounding lines 231 are located on the other side of the connection line 211 along the direction parallel to the panel body 201, which can prevent electromagnetic signals on both sides of the connection line 211 from interfering with it, and further improve the signal transmission quality.

[0109] As shown in Figure 4 and Figure 6 In the above implementation, the display panel 20 further includes a grounding layer, the grounding layer is arranged on the side of the wiring layer 210 away from the panel body 201 in a stacked manner, and the grounding layer is configured to be grounded. For example, the grounding layer can be a grounding metal plate attached to the side of the wiring layer 210 away from the panel body 201; or in the implementation in which the display panel 20 includes a support layer 215, the support layer 215 is grounded, and at this time the grounding layer can be the support layer 215, that is, the support layer 215 serves as the grounding layer, so as to simplify the structure of the display panel 20.

[0110] Please refer to Figure 20 and Figure 21The via hole 232 is arranged on the wiring layer 210 and extends to the ground layer. A conductor is arranged in the via hole 232 and connected with the ground line 231 and the ground layer. In this way, the connection between the ground line 231 and the ground layer is realized through the conductor, and the ground of the ground line 231 is realized. The structure is simple and convenient for manufacturing. For example, the conductor can include a metal wall arranged on the hole wall of the via hole 232. Of course, the conductor can also include a metal column filled in the via hole 232, and the embodiments of the present application are not limited in this regard.

[0111] It can be understood that, continuing to refer to Figure 8 and Figure 21 In the implementation where the wiring layer 210 includes the main body layer 212, the metal layer 213 and the flat layer 214, and the flat layer 214 faces the panel body 201, the via hole 232 can be arranged on the flat layer 214. In the implementation where the wiring layer 210 includes the main body layer 212, the metal layer 213 and the flat layer 214, and the main body layer 212 faces the panel body 201, the via hole 232 can be arranged on the main body layer 212.

[0112] The above merely provides the specific implementation of the embodiments of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed in the present application, and all the changes or replacements should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A display panel, characterized by, The display panel comprises: a panel body; a wiring layer arranged on the backlight side of the panel body; the wiring layer comprises a connection line for connecting a mainboard and a subboard of an electronic device.

2. The display panel of claim 1, wherein, The wiring layer comprises a first lead-out section and a second lead-out section, projections of the first lead-out section and the second lead-out section in the thickness direction of the panel body at least partially overlap with the panel body; one end of the connection line is located in the first lead-out section and connected to the mainboard; the other end of the connection line is located in the second lead-out section and connected to the subboard.

3. The display panel of claim 2, wherein, The one end of the connection line is located in the first lead-out section and connected to the mainboard, comprising: a first connection point is arranged on the first lead-out section and connected to the one end of the connection line, the first connection point is connected to the mainboard; the other end of the connection line is located in the second lead-out section and connected to the subboard, comprising: a second connection point is arranged on the second lead-out section and connected to the other end of the connection line, the second connection point is connected to the subboard.

4. The display panel of claim 3, wherein, The first connection point is used for welding with the mainboard, and the second connection point is used for welding with the subboard.

5. The display panel of claim 3, wherein, The display panel further comprises a first adapter circuit board and a second adapter circuit board, the first connection point is connected to the mainboard through the first adapter circuit board; the second connection point is connected to the subboard through the second adapter circuit board.

6. The display panel of claim 4 or 5, wherein, The first lead-out section is provided with a first positioning member, and the first positioning member is used for positioning the first lead-out section; the second lead-out section is provided with a second positioning member, and the second positioning member is used for positioning the second lead-out section.

7. The display panel of claim 6, wherein, The first positioning member comprises a first protrusion and / or a first groove arranged on the first lead-out section; the second positioning member comprises a second protrusion and / or a second groove arranged on the second lead-out section.

8. The display panel according to any one of claims 2-7, characterized in that, The wiring layer further comprises a first test line, both ends of the first test line are located in the first lead-out section, and both ends of the first test line are used for connecting different test points on the mainboard.

9. The display panel according to any one of claims 2-8, characterized in that, The wiring layer further comprises a second test line, both ends of the second test line are located in the second lead-out section, and both ends of the second test line are used for connecting different test points on the subboard.

10. The display panel of any of claims 1-9, wherein, The connection line comprises a first connection line, the first connection line is used for transmitting a radio frequency signal, and the resistance of the first connection line is 35Ω±5Ω.

11. The display panel of any of claims 1-10, wherein, The connection line comprises a second connection line, the second connection line is used for transmitting a clock signal, and the resistance of the second connection line is 50Ω±5Ω.

12. The display panel of any of claims 1-11, wherein, The connection line comprises a third connection line, the third connection line is used for transmitting a peripheral signal, and the resistance of the third connection line is 90Ω±10Ω.

13. The display panel of any of claims 1-12, wherein, The connection line comprises a fourth connection line, the fourth connection line is used for transmitting an interface signal, and the resistance of the fourth connection line is 100Ω±10Ω.

14. The display panel of any of claims 1-13, wherein, The connection line comprises a fifth connection line, the fifth connection line is used for transmitting a power supply signal, and the resistance of the fifth connection line is less than or equal to 40mΩ.

15. The display panel of any of claims 1-14, wherein, The wiring layer further comprises a ground line, the ground line is arranged in parallel and spaced apart with the connection line, and the ground line is configured to be grounded.

16. The display panel of claim 15, wherein, The display panel further comprises a ground layer, the ground layer is arranged on the wiring layer away from the panel body in a stacked manner, the ground layer is configured to be grounded; the wiring layer is provided with a through hole, the through hole extends to the ground layer, a conductor is arranged in the through hole, and the conductor is connected with the ground wire and the ground layer.

17. The display panel of any of claims 1-16, wherein, The wiring layer comprises a main body layer and a metal layer arranged in a stacked manner, and the metal layer comprises the connection line.

18. The display panel of claim 17, wherein, The wiring layer further comprises a flat layer, and the flat layer covers the metal layer.

19. The display panel of claim 17 or 18, wherein, The display panel comprises a back plate arranged on the backlight side of the panel body in a stacked manner, and the back plate comprises the main body layer.

20. An electronic device, comprising: The electronic device comprises: a main board, a sub-board, and the display panel of any one of claims 1-19; The main board and the sub-board are connected by the connection line.

21. The electronic device of claim 20, wherein, The electronic device further comprises a first middle frame and a second middle frame, the first middle frame and the second middle frame are foldably connected, the main board is arranged on the first middle frame, the sub-board is arranged on the second middle frame, and the display panel covers the first middle frame and the second middle frame.

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