Ion implantation equipment for semiconductor chip manufacturing

Abstract

The invention discloses semiconductor chip manufacturing ion implantation equipment, and belongs to the technical field of semiconductor chip manufacturing, and the semiconductor chip manufacturing ion implantation equipment comprises a bottom plate, a portal frame is arranged above the bottom plate, an ion implanter body is arranged in the portal frame, and an ion box is arranged at one end above the ion implanter body; the ion implanter comprises an ion implanter body, a bottom plate is arranged at one end of the upper portion of the ion implanter body, an exhaust fan is arranged at the other end of the upper portion of the ion implanter body, a cleaning assembly is arranged at one end of the upper portion of the bottom plate, a collecting assembly is arranged at the other end of the upper portion of the bottom plate, and an adjusting assembly is arranged below the bottom plate. According to the semiconductor chip cleaning device, the semiconductor chips can be cleaned conveniently, the collecting frame is arranged, the machined chips can be collected conveniently, and the adjusting base, the lifting plate, the lifting lead screw and the lifting motor are arranged, so that the device can be adjusted to a proper height conveniently according to the use requirements of workers.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor chip manufacturing, and particularly relates to a semiconductor chip manufacturing ion implantation equipment. BACKGROUND

[0002] With the rapid development of integrated circuit manufacturing technology, higher and higher requirements are put forward for semiconductor process equipment. In order to meet the needs of new technologies, ion implanters, as one of the key equipment of semiconductor ion doping process lines, need to be continuously improved in terms of beam indicators, beam energy purity, implantation depth control, implantation uniformity and productivity. The ion implanter is a kind of equipment used in the production process of semiconductor chips.

[0003] Chinese patent application No. 202321824976.1 discloses a semiconductor chip manufacturing ion implanter, which comprises a bottom plate, a chip processing box is fixedly connected to the upper part of the bottom plate, an installation plate is fixedly connected to the middle of the inner wall of the chip processing box, a motor is fixedly connected to the inner bottom of the chip processing box, a rotating shaft is fixedly connected to the output end of the motor, a gear is fixedly connected to the outer side of the top of the rotating shaft, a limiting groove is arranged on the upper part of the installation plate, a rack is slidably connected inside the limiting groove, and a clamping plate is fixedly connected to the upper part of the side away from the rack.

[0004] The above-mentioned patent has the following problems: 1. When in use, the chips need to be cleaned in the ion implantation straight line, and the device is inconvenient for cleaning the chips; 2. When in use, it is inconvenient to collect and process the processed semiconductor chips; 3. When in use, it is inconvenient to adjust the height of the device according to the use needs of the staff. SUMMARY

[0005] To solve the problems in the above background art, the application provides a semiconductor chip manufacturing ion implantation equipment, which has the characteristics of being convenient for cleaning the semiconductor chips before processing, convenient for collecting and processing the processed semiconductor chips, and convenient for adjusting the height of the device according to the use needs of the staff.

[0006] In order to achieve the above object, the present application provides the following technical scheme: a semiconductor chip manufacturing ion implantation equipment, comprising a base plate, a gantry is arranged above the base plate, an ion implantation machine body is arranged in the gantry, an ion box is arranged at one end above the ion implantation machine body, an exhaust fan is arranged at the other end above the ion implantation machine body, a cleaning assembly is arranged at one end above the base plate, a collecting assembly is arranged at the other end above the base plate, and an adjusting assembly is arranged below the base plate.

[0007] Preferably, the cleaning assembly comprises a cleaning box, an ultrasonic cleaner, an electric push rod, a mesh frame, a dismounting seat, a connecting block and a dismounting bolt, one end of the base plate is provided with the cleaning box, the ultrasonic cleaner is arranged below the inside of the cleaning box, the electric push rod is arranged above the inside of the cleaning box, the mesh frame is arranged at one end of the electric push rod, the dismounting seat is arranged at the connection of the electric push rod and the mesh frame, the connecting block is arranged below the dismounting seat, and the dismounting bolt is arranged on one side of the dismounting seat.

[0008] Preferably, one side of the cleaning box is provided with a blower, the air outlet end of the blower is provided with a wind pipe, one end of the wind pipe is provided with a wind cover, and the air inlet end of the blower is provided with a filter screen.

[0009] Preferably, the filter screen is provided with a fixing block at both ends, and the fixing block is provided with a fixing bolt on one side.

[0010] Preferably, the collecting assembly comprises a clamping seat, a square insert block, a collecting frame, a clamping rod, a clamping sliding block and a clamping spring, one side of the gantry is provided with the clamping seat, the square insert block is inserted on one side of the clamping seat, the collecting frame is arranged below the square insert block, the clamping rod is arranged above the square insert block, the clamping sliding block is arranged on one side of the clamping rod, and the clamping spring is arranged above the clamping sliding block.

[0011] Preferably, a guide sliding opening is formed at one end of the clamping rod, and a clamping hole matched with the clamping rod is formed above the square insert block.

[0012] Preferably, the adjusting assembly comprises an adjusting seat, a lifting plate, a lifting lead screw and a lifting motor, the adjusting seat is arranged below the base plate, the lifting plate is arranged in the adjusting seat, the lifting lead screw is threadedly connected in the lifting plate, and the lifting motor is arranged at one end of the lifting lead screw.

[0013] Preferably, limit sliding blocks are arranged on both sides of the lifting plate, and a limit sliding rod is slidably arranged in the middle of the limit sliding blocks.

[0014] Compared with the prior art, the present application has the following beneficial effects: 1、The present application realizes the effect of facilitating the cleaning of the semiconductor chip before processing by setting the cleaning assembly, setting the cleaning box, ultrasonic cleaner, electric push rod, net frame, dismounting seat, connecting block and dismounting bolt, facilitating the cleaning of the semiconductor chip, setting the blower, air pipe, air cover and filter screen, facilitating the air drying of the cleaned chip.

[0015] 2、The present application realizes the effect of facilitating the collection and processing of the processed semiconductor chip by setting the collecting assembly, setting the collecting frame, facilitating the collection of the processed chip, setting the clamping seat, square insert block, clamping rod, clamping slide block and clamping spring, facilitating the dismounting of the collecting frame.

[0016] 3、The present application realizes the effect of facilitating the adjustment of the height of the device according to the use needs of the staff by setting the adjusting assembly, setting the adjusting seat, lifting plate, lifting screw and lifting motor, facilitating the adjustment of the device to the appropriate height according to the use needs of the staff. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is the overall structure diagram of the present application; Figure 2 is the main view cut structure diagram of the present application; Figure 3 is the structure diagram of the cleaning assembly of the present application; Figure 4 is the enlarged structure diagram of A in the cleaning assembly of the present application; Figure 5 is the enlarged structure diagram of B of the present application; Figure 6 is the structure diagram of the adjusting assembly of the present application.

[0018] In the figure: 1, bottom plate; 2, gantry; 3, ion implantation machine body; 4, ion box; 5, air extractor; 6, cleaning assembly; 61, cleaning box; 62, ultrasonic cleaner; 63, electric push rod; 64, net frame; 65, dismounting seat; 66, connecting block; 67, dismounting bolt; 611, blower; 612, air pipe; 613, air cover; 614, filter screen; 615, fixing block; 7, collecting assembly; 71, clamping seat; 72, square insert block; 73, collecting frame; 74, clamping rod; 75, clamping slide block; 76, clamping spring; 8, adjusting assembly; 81, adjusting seat; 82, lifting plate; 83, lifting screw; 84, lifting motor; 85, limiting slide block; 86, limiting slide rod. DETAILED DESCRIPTION

[0019] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of the present application.

[0020] Embodiment 1 Please refer to Figures 1-6 The present application provides the following technical solutions: a semiconductor chip manufacturing ion implantation equipment, comprising a bottom plate 1, a gantry 2 arranged above the bottom plate 1, an ion implantation machine body 3 arranged inside the gantry 2, an ion box 4 arranged at one end above the ion implantation machine body 3, an exhaust fan 5 arranged at the other end above the ion implantation machine body 3, a cleaning assembly 6 arranged at one end above the bottom plate 1, a collection assembly 7 arranged at the other end above the bottom plate 1, and an adjusting assembly 8 arranged below the bottom plate 1.

[0021] Specifically, the cleaning assembly 6 comprises a cleaning box 61, an ultrasonic cleaner 62, an electric push rod 63, a mesh frame 64, a dismounting seat 65, a connecting block 66, and a dismounting bolt 67. One end of the bottom plate 1 is provided with the cleaning box 61. The ultrasonic cleaner 62 is arranged below the inside of the cleaning box 61. The electric push rod 63 is arranged above the inside of the cleaning box 61. One end of the electric push rod 63 is provided with the mesh frame 64. The dismounting seat 65 is arranged at the connection between the electric push rod 63 and the mesh frame 64. The connecting block 66 is arranged below the dismounting seat 65. The dismounting bolt 67 is arranged on one side of the dismounting seat 65.

[0022] By adopting the above technical solutions, the semiconductor chip is placed in the mesh frame 64, then the mesh frame 64 is driven to move downward by the electric push rod 63 and enters the ultrasonic cleaner 62 for cleaning. After cleaning, the mesh frame 64 is lifted by the electric push rod 63 for draining, so that the device is convenient for cleaning the semiconductor chip before processing when in use, and the practicality of use is improved.

[0023] Specifically, one side of the cleaning box 61 is provided with a blower 611. The air outlet end of the blower 611 is provided with a wind pipe 612. One end of the wind pipe 612 is provided with a wind cover 613. The air inlet end of the blower 611 is provided with a filter screen 614.

[0024] By adopting the above technical solutions, when draining, the blower 611 is started to dry the semiconductor chip in the mesh frame 64 through the wind pipe 612 and the wind cover 613. When drying, dust is prevented from entering through the filter screen 614.

[0025] Specifically, both ends of the filter screen 614 are provided with fixing blocks 615. One side of the fixing block 615 is provided with a fixing bolt.

[0026] By adopting the technical scheme, when the filter screen 614 needs to be cleaned, the fixing bolt is unscrewed, the limiting of the fixing block 615 is released, and then the filter screen 614 can be taken out for cleaning.

[0027] In use, the semiconductor chip is placed in the net frame 64, the net frame 64 is driven to move downward by the electric push rod 63 and enters the ultrasonic cleaner 62 for cleaning, after the cleaning is completed, the net frame 64 is lifted by the electric push rod 63 for draining, during the draining, the blower 611 is started, the semiconductor chip in the net frame 64 is dried by the air conveying pipe 612 and the air cover 613, during the drying, the filter screen 614 prevents dust from entering, after the drying is completed, the dismounting bolt 67 is loosened, the net frame 64 is taken out, and the semiconductor chip is taken out, so that the device is convenient for cleaning the semiconductor chip before processing in use, and the practicality in use is improved.

[0028] Embodiment 2 The embodiment differs from the embodiment 1 in that specifically, the collecting assembly 7 comprises a clamping seat 71, a square insertion block 72, a collecting frame 73, a clamping rod 74, a clamping sliding block 75 and a clamping spring 76, one side of the portal frame 2 is provided with the clamping seat 71, one side of the clamping seat 71 is provided with the square insertion block 72, the lower side of the square insertion block 72 is provided with the collecting frame 73, the upper side of the square insertion block 72 is provided with the clamping rod 74, one side of the clamping rod 74 is provided with the clamping sliding block 75, and the upper side of the clamping sliding block 75 is provided with the clamping spring 76.

[0029] By adopting the technical scheme, the single semiconductor chip after processing is collected by the collecting frame 73, after the collection is completed, the clamping rod 74 is pulled to drive the clamping sliding block 75 to move and compress the clamping spring 76, until the clamping rod 74 is separated from the clamping hole, then the square insertion block 72 and the clamping seat 71 are separated, so that the collecting frame 73 fixed below the square insertion block 72 is taken away, so that the device is convenient for collecting the processed chip in use, and the practicality in use is improved.

[0030] Specifically, one end of the clamping rod 74 is provided with a guide sliding opening, and the upper side of the square insertion block 72 is provided with a clamping hole matched with the clamping rod 74.

[0031] By adopting the technical scheme, the guide sliding opening is convenient for the square insertion block 72 to abut against the clamping rod 74 when the square insertion block 72 is inserted into the clamping seat 71, and the clamping rod 74 can be driven to move upward, and the clamping hole is convenient for the clamping rod 74 to be inserted to clamp and fix the square insertion block 72.

[0032] The embodiment is used as follows: the single conductor chip processed is collected by the collecting frame 73, after collection, the clamping rod 74 is pulled, the clamping rod 74 drives the clamping sliding block 75 to move and compress the clamping spring 76, until the clamping rod 74 is separated from the clamping hole, then the square insertion block 72 and the clamping seat 71 can be separated, so that the collecting frame 73 fixed below the square insertion block 72 is taken away, so that the device is convenient for collecting the processed chip when in use, and the practicality of use is improved.

[0033] Embodiment 3 The difference between the embodiment and the embodiment 1 is that the adjusting assembly 8 comprises an adjusting seat 81, a lifting plate 82, a lifting screw rod 83 and a lifting motor 84, wherein the bottom plate 1 is provided below with the adjusting seat 81, the adjusting seat 81 is internally provided with the lifting plate 82, the lifting plate 82 is internally screw-connected with the lifting screw rod 83, and the lifting screw rod 83 is provided at one end with the lifting motor 84.

[0034] By adopting the above technical scheme, the lifting motor 84 is started, the lifting motor 84 drives the lifting screw rod 83 to rotate, the lifting screw rod 83 drives the lifting plate 82 to lift, so that the height of the device is adjusted, so that the height of the device is adjusted according to the use needs of the staff when in use, and the practicality of use is improved.

[0035] Specifically, the lifting plate 82 is provided at both sides with a limiting sliding block 85, and the limiting sliding block 85 is slidably provided with a limiting sliding rod 86 in the middle.

[0036] By adopting the above technical scheme, the limiting sliding block 85 and the limiting sliding rod 86 cooperate, so that the lifting range is limited.

[0037] The embodiment is used as follows: the lifting motor 84 is started, the lifting motor 84 drives the lifting screw rod 83 to rotate, the lifting screw rod 83 drives the lifting plate 82 to lift, so that the height of the device is adjusted, so that the height of the device is adjusted according to the use needs of the staff when in use, and the practicality of use is improved.

[0038] The ultrasonic cleaning machine 62 in the application is a prior art, and the selected model is KZ-D2.

[0039] The electric push rod 63 in the application is a prior art, and the selected model is YNT-03.

[0040] The structure and use principle of the ion implanter body 3, the ion box 4 and the air extractor 5 in the application have been disclosed in a semiconductor chip manufacturing ion implanter with patent application number 202321824976.1 in China. When the semiconductor chip needs to be clamped, the motor is started to drive the output shaft to rotate, the outer gear is driven to rotate by the rotating shaft, the gear drives the front and rear racks to slide relatively in the limiting groove, the rack drives the clamping plate to move relatively, and the semiconductor chip is clamped by the relative movement of the clamping plate, so that the ion implanter can clamp semiconductor chip samples of different sizes and shapes, and the practicability of the semiconductor chip manufacturing ion implanter is improved. When the semiconductor chip needs to be implanted with ions, the fan is started to run the air suction pipe at the input end of the fan to suck the air in the chip processing box into the fan, and the air is discharged from the fan through the air conveying pipe at the output end of the fan, so that the ion implanter can form a low pressure or even negative pressure environment in the chip processing box, reduce gas interference and ion scattering, and improve the ion implantation efficiency of the ion implanter.

[0041] The working principle and use process of the application: the application is used for semiconductor chip manufacturing, ion implantation, adjusting the device to the appropriate height through the adjusting assembly 8, and then using, cleaning the semiconductor chip through the cleaning assembly 6, after cleaning, putting it into the ion implanter body 3, then pumping the inside of the ion implanter body 3 through the air pump 5 to form a low pressure or even negative pressure environment, reducing gas interference and ion scattering, improving the ion implantation efficiency of the ion implanter, then processing, after processing, collecting the semiconductor chip through the collecting assembly 7, when using the cleaning assembly 6, putting the semiconductor chip into the mesh frame 64, then driving the mesh frame 64 to move down through the electric push rod 63, entering the ultrasonic cleaner 62 to clean, after cleaning, raising the mesh frame 64 through the electric push rod 63, draining, when draining, starting the air blower 611, drying the semiconductor chip in the mesh frame 64 through the air pipe 612 and the air cover 613, when drying, preventing dust from entering through the filter screen 614, after drying, loosening the disassembly bolt 67, then taking out the mesh frame 64, taking out the semiconductor chip, so that the device is convenient for cleaning the semiconductor chip before processing when in use, improving the practicality of use, when using the collecting assembly 7, collecting the processed single semiconductor chip through the collecting frame 73, after collecting, pulling the clamping rod 74, the clamping rod 74 drives the clamping sliding block 75 to move and compress the clamping spring 76 until the clamping rod 74 is separated from the clamping hole, then separating the square insert block 72 and the clamping seat 71, so as to take away the collecting frame 73 fixed below the square insert block 72, so that the device is convenient for collecting the processed chip when in use, improving the practicality of use, when using the adjusting assembly 8, starting the lifting motor 84, the lifting motor 84 drives the lifting lead screw 83 to rotate, the lifting lead screw 83 drives the lifting plate 82 to lift, so as to adjust the height of the device, so that the device is convenient for adjusting the height of the device according to the use needs of the staff when in use, improving the practicality of use.

[0042] Although the embodiments of the application have been shown and described, it is to be understood that for the purpose of the present application, the changes, modifications, equivalents, substitutions and variations of the embodiments can be understood by those skilled in the art without departing from the principles and spirit of the application, and the scope of the application is defined by the appended claims and their equivalents.

Claims

1. An ion implantation apparatus for semiconductor chip manufacturing, comprising a substrate, characterized in that: A gantry frame is installed above the base plate, and an ion implanter body is installed inside the gantry frame. An ion box is installed at one end above the ion implanter body, and an exhaust fan is installed at the other end above the ion implanter body. A cleaning component is installed at one end above the base plate, and a collection component is installed at the other end above the base plate. An adjustment component is installed below the base plate.

2. The semiconductor chip manufacturing ion implantation equipment according to claim 1, characterized in that: The cleaning assembly includes a cleaning tank, an ultrasonic cleaner, an electric push rod, a mesh frame, a mounting base, a connecting block, and mounting bolts. The cleaning tank is located at one end above the base plate, the ultrasonic cleaner is located at the lower part of the cleaning tank, the electric push rod is located at the upper part of the cleaning tank, a mesh frame is located at one end of the electric push rod, a mounting base is located at the connection between the electric push rod and the mesh frame, a connecting block is located below the mounting base, and mounting bolts are located on one side of the mounting base.

3. The semiconductor chip manufacturing ion implantation equipment according to claim 2, characterized in that: A blower is installed on one side of the cleaning box. An air supply pipe is installed at the air outlet of the blower. A hood is installed at one end of the air supply pipe. A filter is installed at the air inlet of the blower.

4. The semiconductor chip manufacturing ion implantation equipment according to claim 3, characterized in that: The filter screen has fixing blocks at both ends, and fixing bolts are provided on one side of the fixing blocks.

5. The semiconductor chip manufacturing ion implantation equipment according to claim 1, characterized in that: The collection assembly includes a clamping seat, a square insert, a collection frame, a clamping rod, a clamping slider, and a clamping spring. The clamping seat is provided on one side of the gantry frame, a square insert is inserted into one side of the clamping seat, a collection frame is provided below the square insert, a clamping rod is provided above the square insert, a clamping slider is provided on one side of the clamping rod, and a clamping spring is provided above the clamping slider.

6. The semiconductor chip manufacturing ion implantation equipment according to claim 5, characterized in that: One end of the clamping rod is provided with a guide slide, and the square insert is provided with a clamping hole that matches the clamping rod.

7. The ion implantation equipment for semiconductor chip manufacturing according to claim 1, characterized in that: The adjustment assembly includes an adjustment seat, a lifting plate, a lifting screw, and a lifting motor. The adjustment seat is located below the base plate, and the lifting plate is located inside the adjustment seat. The lifting screw is threadedly connected to the inside of the lifting plate, and a lifting motor is located at one end of the lifting screw.

8. The semiconductor chip manufacturing ion implantation apparatus according to claim 7, characterized in that: The lifting plate is provided with limit sliders on both sides, and a limit rod slides in the middle of the limit sliders.

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