A packaging structure for a memory chip and a curing and packaging device.

Abstract

This invention discloses a packaging structure and curing packaging equipment for a memory chip, belonging to the field of chip packaging technology. The device includes a housing, inside which a feeding tray is disposed. Several chip placement components are fixedly connected to the top edge of the feeding tray. A driving component for rotating the feeding tray is disposed below the feeding tray. Above the feeding tray, along the rotation direction, are sequentially arranged a loading station, a capping mechanism, a degassing mechanism, a sealing mechanism, and a unloading station. This invention, by setting up a degassing mechanism, applies negative pressure suction to exhaust gas after the chip is encapsulated by the chip cover. Gas near the center of the packaging housing is suctioned out through the central hole, while gas near the edges is discharged through the gap between the chip cover and the substrate. This avoids the problem of a large amount of gas inside the chip, which would reduce the sealing performance and allow dust from the external environment to enter, making the chip more susceptible to damage.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a packaging structure and curing packaging equipment for a memory chip. Background Technology

[0002] In the packaging process of semiconductor memory chips, epoxy molding compound (EMC) curing is a core step in ensuring the device's hermeticity and reliability. However, this process faces a long-standing technical challenge:

[0003] Residual gas can cause seal failure. During the curing process, adhesive materials, fluxes and other organic solvents, as well as the EMC itself, release volatile gases (including water vapor, CO2 and low molecular weight organic compounds) at high temperatures.

[0004] These gases form bubbles within the enclosed package (composed of a substrate and a cover plate), increasing the pressure difference between the inside and outside. If the gases cannot escape in time, they can compress uncured EMC, forming microchannels, or weaken interface adhesion, ultimately compromising the package's seal. In miniaturized high-density packaging, gases are more likely to accumulate in the center of the chip, forming localized high-pressure areas and exacerbating the risk of interface delamination. Furthermore, residual gases can attract dust and impurities, accelerating internal metal corrosion and significantly reducing chip lifespan. Therefore, improvements are necessary. Summary of the Invention

[0005] This invention provides a packaging structure for a memory chip and a curing packaging device, which can solve the problem of gas residue in the chip packaging curing process in the prior art.

[0006] This invention provides a packaging structure for a memory chip, including a packaging shell and a chip body. The chip body is disposed within the packaging shell. The packaging shell includes a substrate, and a chip cover is disposed on the top of the substrate. A plurality of snap-fit ​​parts are fixedly connected to the bottom edge of the chip cover. A plurality of mating grooves are formed on the inner wall of the substrate. One side edge of each of the snap-fit ​​parts is slidably connected to one of the mating grooves. The sides of the snap-fit ​​parts away from the mating grooves are all inclined towards the inner center of the packaging shell. A central hole is formed in the center of the chip cover, and a sealing block is disposed inside the central hole.

[0007] The present invention also provides a curing and packaging device for memory chips, used to achieve curing and packaging of the above-mentioned memory chip packaging structure. It includes a housing, and a feeding tray is provided inside the housing. A plurality of placement components for placing chips are fixedly connected to the top edge of the feeding tray. A driving component for driving the feeding tray to rotate is provided below the feeding tray. A feeding station, a capping mechanism, a debubbling mechanism, a sealing mechanism, and a unloading station are arranged sequentially above the feeding tray along the rotation direction of the feeding tray.

[0008] The defoaming mechanism includes a docking cylinder, the output end of which is fixedly connected to a docking cover, the inner cavity of which is the same size as the placement rack; a pressing ring is fixedly installed in the middle of the inner wall of the docking cover, a through groove is opened in the middle of the pressing ring, and a negative pressure pipe is fixedly connected to the top of the inner wall of the docking cover.

[0009] As a further aspect of the present invention: the sealing mechanism includes a transverse push rod, the output end of which is fixedly connected to a material-picking cylinder, the output end of which is fixedly connected to a material-picking plate, the bottom edge of which is fixedly connected to a material-picking suction cup, the middle of which is fixedly connected to a suction ring, the suction ring having a suction chamber inside, the bottom of which has several suction holes, and the top of which is fixedly connected to a suction pipe.

[0010] As a further aspect of the present invention: a sealing block is fixedly connected to the center of the bottom of the material receiving plate.

[0011] As a further aspect of the present invention: the sealing mechanism includes a sealing cylinder, the output end of the sealing cylinder is fixedly connected to an abutment post, the abutment post has a feeding channel inside, a linear motor is arranged above the feeding channel, the output end of the linear motor is fixedly connected to a push rod, one end of the push rod is slidably arranged inside the feeding channel, a heating wire is embedded at the bottom of the inner wall of the feeding channel, a feeding channel is arranged on one side of the feeding channel, and a feeding pipe is fixedly connected to one end of the feeding channel.

[0012] As a further aspect of the present invention: a partition sleeve is slidably connected to the outside of the abutting column, a plurality of shaped air ducts are fixedly connected to the bottom edge of the partition sleeve, a fixing ring is fixedly connected to the top of the outer wall of the abutting column, and a plurality of return springs are fixedly connected between the fixing ring and the top of the inner wall of the partition sleeve.

[0013] As a further aspect of the present invention: the placement component includes a placement groove, and a placement frame is engaged and connected inside the placement groove, the size of the inner cavity of the placement frame being consistent with the size of the substrate.

[0014] As a further aspect of the present invention: a vibration assembly is provided below the loading station, the vibration assembly includes a lifting cylinder, the output end of the lifting cylinder is fixedly connected to a vibrator, and the output end of the vibrator is fixedly connected to a contact plate.

[0015] As a further aspect of the present invention: the unloading station is provided with a cooling assembly, the cooling assembly includes an air supply frame, the inner wall of the air supply frame is provided with a plurality of air supply ports, a cooling pipe is fixedly connected to the middle of the inner wall of the air supply frame, an air supply pipe is fixedly connected to one side of the inner wall of the air supply frame, and a dustproof net is fixedly connected between the cooling pipe and the air supply port.

[0016] As a further embodiment of the present invention: a column is fixedly connected to the top of the inner wall of the housing, a plurality of connecting rings are fixedly connected to the middle of the column, and a mounting bracket is fixedly connected to one side of each of the plurality of connecting rings. The sealing mechanism, the defoaming mechanism, and the sealing mechanism are respectively fixedly installed on different mounting brackets, and one side of the air supply frame is fixedly connected to the column.

[0017] As a further aspect of the present invention: a feeding port is provided on the side of the machine housing near the feeding station, a discharging port is provided on the side of the machine housing near the unloading station, a conveying port is provided on the side of the machine housing near the sealing mechanism, a conveying frame is fixedly installed on the inner wall of the conveying port, and a cover plate conveyor belt is rotatably installed on the inner wall of the conveying frame.

[0018] As a further aspect of the present invention: the top center of the feeding tray is rotatably connected to the bottom of the column, and the driving component includes a servo motor, the output end of which is fixedly connected to the bottom of the feeding tray.

[0019] Compared with the prior art, the beneficial effects of the present invention are: by setting a degassing mechanism, the present invention performs negative pressure suction and exhaust after the chip cover is packaged and enclosed, and the gas near the center of the package shell is sucked out through the central hole, while the gas near the edge is discharged through the gap between the chip cover and the substrate. This avoids the problem that a large amount of gas inside the chip will exist, which will lead to a decrease in the sealing performance of the package and allow dust from the external environment to enter, making the chip vulnerable.

[0020] This invention uses a vibration component at the loading station to vibrate the placement rack and the chip semi-finished products inside it, so that the epoxy molding compound is horizontally and evenly distributed inside the substrate, allowing the chip body to be installed in a stable posture inside the substrate. At the same time, the vibration facilitates the discharge of air mixed inside the uncured epoxy molding compound.

[0021] The capping mechanism of this invention uses a transverse push rod to drive the picking cylinder to move laterally, which in turn drives the picking plate and picking suction cup to lift and lower, thus realizing the picking and packaging docking operation of the chip cover plate. The sealing block is used to seal the chip cover plate by docking with the center hole, ensuring the stability of the picking suction cup's adsorption effect. At the same time, the sealing block is used to position the chip cover plate by docking with the center hole, thereby ensuring that each snap-fit ​​part can accurately dock with each docking slot, so that the chip cover plate can be stably and accurately assembled with the substrate.

[0022] This invention uses a sealing mechanism to seal the central hole on a chip cover plate. A heating wire melts the sealing material ball, facilitating its secure connection with the central hole and enabling rapid shaping of the sealing block to prevent it from loosening. A shaping air duct is also included; after the abutment column rises and moves away, air is supplied to the sealing block to aid in rapid cooling and shaping. The pushing action of the push rod flattens the sealing material ball, effectively reducing its protrusion height and preventing it from falling off due to excessive external force. Attached Figure Description

[0023] Figure 1 This is a perspective view of the curing and packaging equipment of the present invention;

[0024] Figure 2 This is a schematic diagram of the internal structure of the curing and packaging equipment of the present invention;

[0025] Figure 3 This is a schematic diagram of the internal structure of the curing and packaging equipment of the present invention;

[0026] Figure 4 This is a cross-sectional schematic diagram of the material-grabbing suction cup of the present invention;

[0027] Figure 5 This is a cross-sectional schematic diagram of the docking cover of the present invention;

[0028] Figure 6 This is a cross-sectional schematic diagram of the abutment column of the present invention;

[0029] Figure 7 This is a cross-sectional schematic diagram of the cooling component of the present invention;

[0030] Figure 8 This is a perspective view of the chip packaging housing targeted by the present invention;

[0031] Figure 9 This is a cross-sectional schematic diagram of the chip packaging shell targeted by the present invention.

[0032] Explanation of reference numerals in the attached figures:

[0033] 101. Machine casing; 102. Feeding tray; 103. Column; 104. Connecting ring; 105. Loading station; 106. Unloading station; 107. Conveyor frame; 108. Servo motor; 109. Lifting cylinder; 110. Vibrator; 111. Contact plate; 112. Placement rack; 2. Sealing mechanism; 201. Picking cylinder; 202. Lateral push rod; 203. Picking plate; 204. Picking suction cup; 205. Suction ring; 206. Suction hole; 207. Suction pipe; 208. Sealing block; 3. Defoaming mechanism; 301. Docking cylinder; 302. Docking cover; 303. Pressing ring; 304, through groove; 305, negative pressure pipe; 4, sealing mechanism; 401, sealing cylinder; 402, abutting post; 403, separating sleeve; 404, feeding channel; 405, linear motor; 406, push rod; 407, feeding pipe; 408, shaping air duct; 409, fixing ring; 410, return spring; 411, sealing ball; 5, cooling assembly; 501, air supply frame; 502, air outlet; 503, cooling pipe; 504, dust screen; 601, substrate; 602, chip cover plate; 603, sealing block; 604, docking groove; 605, snap-fit ​​part. Detailed Implementation

[0034] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0035] like Figures 8 to 9 As shown, the basic structure of the memory chip targeted in this embodiment of the invention includes a package housing and a chip body. The chip body is disposed within the package housing and communicates with the outside through pin connections. The inner cavity of the package housing is filled with epoxy molding compound. The package housing includes a substrate 601, and a chip cover plate 602 is disposed on the top of the substrate 601, thereby constituting the basic structure of the chip. The chip structure targeted in this invention differs from the existing conventional chip structure in that:

[0036] A central hole is provided in the middle of the chip cover plate 602, and a sealing block 603 is disposed inside the central hole. The purpose of the central hole is that the adhesive materials, fluxes and other organic solvents used in the curing process, as well as the epoxy molding compound used for sealing, will release gas and generate bubbles under high temperature, resulting in a large pressure difference between the inside and outside, which will reduce the sealing performance of the package and allow dust from the external environment to enter, making the chip vulnerable to damage. Therefore, this application provides a central hole in the middle of the chip cover plate 602 to release and discharge the gas inside the package cavity during the curing process. After the gas is released, the sealing block 603 seals the central hole to ensure the sealing performance of the package.

[0037] This invention features a plurality of snap-fit ​​parts 605 fixedly connected to the bottom edge of a chip cover plate 602, and a plurality of mating grooves 604 formed on the inner wall of a substrate 601. One side edge of each snap-fit ​​part 605 is slidably connected to one of the mating grooves 604, and the sides of each snap-fit ​​part 605 away from the mating grooves 604 are inclined toward the inner center of the package housing. By setting a plurality of snap-fit ​​parts 605 and a plurality of mating grooves 604 to engage with each other, this application effectively improves the connection stability between the chip cover plate 602 and the substrate 601, avoiding the problem of displacement of the chip cover plate 602 during subsequent processing and installation. Furthermore, during the insertion process, the snap-fit ​​parts 605 push the unshaped epoxy molding compound inside, causing it to move toward the center, thereby reducing the presence of cavities inside the package housing and facilitating the concentrated discharge of gas to the central hole.

[0038] Please see Figures 1-3 To address the aforementioned encapsulation and curing operations of memory chips, this invention provides a memory chip curing and encapsulation device, comprising a housing 101, an internal feeding tray 102, a plurality of chip placement components fixedly connected to the top edge of the feeding tray 102, a driving component for rotating the feeding tray 102 being disposed below the feeding tray 102, and a loading station 105, a capping mechanism 2, a debubbling mechanism 3, a sealing mechanism 4, and a unloading station 106 sequentially disposed above the feeding tray 102 along the rotation direction of the feeding tray 102; the driving component includes a servo motor 108, the output end of which is fixedly connected to the bottom of the feeding tray 102, and the servo motor 108 drives the feeding tray 102 to rotate intermittently, the rotation angle and timing being controlled according to the processing needs of each station and mechanism; the specific structure of the driving component can also be replaced by other feasible existing technologies;

[0039] In one embodiment, the placement member includes a placement groove, and a placement bracket 112 is engaged inside the placement groove. The size of the inner cavity of the placement bracket 112 is the same as the size of the substrate 601, and the depth of the inner cavity of the placement bracket 112 is slightly less than the thickness of the substrate 601 (see the structure of the substrate 601 for details). Figure 8 In specific implementation, an electric heater can be embedded inside the placement rack 112, or an electric heating device can be installed inside the housing 101, so as to realize real-time adjustment and control of the curing temperature;

[0040] The housing 101 has a feeding port at the corresponding feeding station 105 for feeding in the chip structure semi-finished product to be packaged. The semi-finished product structure includes a substrate 601, a chip body connected inside the substrate 601, and injected uncured epoxy molding compound.

[0041] In one embodiment, see Figures 1-2A vibration assembly is installed below the loading station 105. The vibration assembly includes a lifting cylinder 109, the output end of which is fixedly connected to a vibrator 110. The output end of the vibrator 110 is fixedly connected to a contact plate 111. The top of the contact plate 111 is correspondingly positioned to the bottom of the placement rack 112. The specific structure of the vibrator 110 can be implemented with reference to existing technologies. The lifting cylinder 109 drives the contact plate 111 to move up and down. When vibration is required, it drives the vibrator 110 to rise, so that the contact plate 111 contacts the placement rack 112, causing the placement rack 112 and the chip semi-finished products inside it to vibrate, so that the epoxy molding compound is horizontally and evenly distributed inside the substrate 601 (for the internal structure of the substrate 601, please refer to...). Figure 9 This allows the chip body to be mounted stably inside the substrate 601, while vibration facilitates the removal of air mixed inside the uncured epoxy molding compound. By applying vibration through a vibration component at this location, the stability of the soldered connection of the chip body can be tested. If there are soldering abnormalities such as poor soldering or voids in the previous soldering process, vibration increases the probability of breakage, thereby facilitating more accurate identification of defective chips in subsequent testing operations.

[0042] In one embodiment, see Figures 2-4 After the vibration operation is completed, the semi-finished product is sealed. This invention includes a sealing mechanism 2 along the rotation path of the feeding tray 102. The sealing mechanism 2 includes a transverse push rod 202, the output end of which is fixedly connected to a material-picking cylinder 201. The output end of the material-picking cylinder 201 is fixedly connected to a material-picking plate 203, and the bottom edge of the material-picking plate 203 is fixedly connected to a material-picking suction cup 204. Please refer to [link / reference]. Figure 1 The housing 101 has a conveying port on the side near the sealing mechanism 2. A conveying frame 107 is fixedly installed on the inner wall of the conveying port. A cover plate conveyor belt is rotatably installed on the inner wall of the conveying frame 107. One end of the cover plate conveyor belt passes into the housing 101 and is set corresponding to one side of the sealing mechanism 2. The horizontal push rod 202 drives the picking cylinder 201 to move horizontally. The picking cylinder 201 drives the picking plate 203 and the picking suction cup 204 to lift and lower, so as to realize the picking and packaging docking operation of the chip cover plate 602.

[0043] In one embodiment, see Figure 8 Because the chip cover plate 602 has a central hole, the presence of the central hole will allow air to pass through during the suction process of the pick-up suction cup 204. Therefore, to ensure the suction effect of the pick-up suction cup 204, please refer to [the relevant documentation / reference needed]. Figure 4A sealing block 208 is fixedly connected to the center of the bottom of the material picking plate 203. The sealing block 208 is used to seal the center hole to ensure the stability of the adsorption effect of the material picking suction cup 204. At the same time, the sealing block 208 is used to position the chip cover plate 602, thereby ensuring that each snap-fit ​​part 605 can accurately align with each docking groove 604, so that the chip cover plate 602 can be stably and accurately assembled with the substrate 601.

[0044] In one embodiment, due to the presence of the sealing block 208, the suction pipe 207 cannot be directly installed in the middle of the material suction cup 204. To ensure the uniformity of the suction force of the material suction cup 204, the present invention has a suction ring 205 fixedly connected in the middle of the material picking plate 203. The suction ring 205 has a suction chamber inside, and a number of equally spaced suction holes 206 are opened at the bottom of the suction chamber. The suction pipe 207 is fixedly connected to the top of the suction chamber, and one end of the suction pipe 207 is connected to an external negative pressure suction device.

[0045] In one embodiment, see Figure 2 and Figure 3 To fully expel the gas remaining inside the packaging shell after sealing and pressing down, the present invention provides a defoaming mechanism 3 on the rotation path of the feeding tray 102. The defoaming mechanism 3 includes a docking cylinder 301. The output end of the docking cylinder 301 is vertically downward and fixedly connected to a docking cover 302. The inner cavity of the docking cover 302 is the same size as the placement rack 112. In this way, the placement rack 112 is completely docked and sealed by the docking cover 302 to ensure the air extraction effect.

[0046] In one embodiment, see Figure 5 To prevent vibration and displacement of the chip cover 602 caused by the evacuation operation, a pressing ring 303 is fixedly installed in the middle of the inner wall of the mating cover 302. During the evacuation operation, the pressing ring 303 presses firmly against the top of the chip cover 602 to ensure the stability of the chip cover 602. During the evacuation process, the gas near the center of the package housing is drawn out through the central hole, and the gas near the edge is discharged through the gap between the chip cover 602 and the substrate 601 (see the positional structure of the chip cover 602 and the substrate 601 for details). Figure 8-9 );

[0047] In one embodiment, since the connection port between the negative pressure tube 305 and the docking cover 302 is located inside the pressing ring 303, in order to ensure the suction capability of the docking cover 302 to the edge of the chip, a through groove 304 is provided in the middle of the pressing ring 303, so that the inside and outside of the pressing ring 303 are connected. The negative pressure tube 305 is fixedly connected to the top of the inner wall of the docking cover 302, and one end of the negative pressure tube 305 is connected to an external negative pressure suction device.

[0048] In one embodiment, see Figure 3 and Figure 6 To ensure the overall sealing of the chip, after debubbling, the central hole on the chip cover plate 602 needs to be sealed. This invention includes a sealing mechanism 4 along the rotation path of the feeding tray 102. The sealing mechanism 4 includes a sealing cylinder 401, with a fixed connection to an abutment post 402 at the output end of the sealing cylinder 401. A feeding channel 404 is provided inside the abutment post 402. During the sealing operation, the abutment post 402 presses against the chip cover plate 602, aligning the bottom of the feeding channel 404 with the central hole. The sealing ball 411 is pushed into the central hole through the feeding channel 404. A linear motor 405 is positioned above the feeding channel 404, with its output end fixed... A push rod 406 is connected, with one end of the push rod 406 slidably disposed inside the feeding channel 404. The push rod 406 is pushed out by a linear motor 405, pushing the sealing ball 411 down into the central hole. An electric heating wire is embedded in the bottom of the inner wall of the feeding channel 404. The electric heating wire heats and melts the sealing ball 411 to facilitate its fixed connection with the central hole. A feeding channel is connected to one side of the feeding channel 404. The feeding channel is inclined downward toward the side of the feeding channel 404 to facilitate the introduction of the sealing ball 411. A feeding pipe 407 is fixedly connected to one end of the feeding channel. One end of the feeding pipe 407 extends out of the outer side of the housing 101 and is connected to an external sealing ball supply device.

[0049] In one embodiment, the heating effect of the heating wire on the sealing ball 411 causes the sealing ball 411 to soften. Combined with the pushing action of the push rod 406, this causes the sealing ball 411 to deform, gradually flatten, and adhere to the chip cover plate 602, thereby forming a sealing block 603 (see the positional structure of the sealing block 603 for details). Figure 8 To achieve rapid shaping of the sealing block 603 and prevent it from loosening, a partition sleeve 403 is slidably connected to the outside of the abutment column 402. Several shaping air ducts 408 are fixedly connected to the bottom edge of the partition sleeve 403. The shaping air ducts 408 are all fixedly connected to an external air pump through a connecting pipe. After the abutment column 402 rises and moves away, air is supplied to the sealing block 603 through the shaping air ducts 408 to assist it in rapid cooling and shaping. The pushing action of the push rod 406 flattens the sealing ball 411, which can effectively reduce its protrusion height and thus prevent it from falling off due to excessive external force.

[0050] In one embodiment, a retaining ring 409 is fixedly connected to the top of the outer wall of the abutment post 402, and a plurality of return springs 410 are fixedly connected between the retaining ring 409 and the top of the inner wall of the partition sleeve 403. In the natural state, the return springs 410 pull the partition sleeve 403 downward, so that the bottom height of the partition sleeve 403 is lower than the bottom height of the abutment post 402. This allows the partition sleeve 403 to maintain continuous pressing contact with the chip cover plate 602 after the installation of the sealing ball 411 is completed (see the positional structure of the chip cover plate 602 and the sealing block 603 for details). Figure 9 The positioning air duct on it then delivers air to cool the sealing block 603. The lifting of the push column after completing the installation of the sealing ball 411 can reduce the contact time between the heating wire and the chip, thereby avoiding the impact of high temperature on the chip body.

[0051] In one embodiment, see Figure 2 , Figure 3 and Figure 7 To achieve chip shaping, the unloading station 106 is equipped with a cooling component 5. The cooling component 5 includes an air supply frame 501. The inner wall of the air supply frame 501 has several air outlets 502. A cooling pipe 503 is fixedly connected to the middle of the inner wall of the air supply frame 501. Both ends of the cooling pipe 503 are connected to an external refrigeration device. An air supply pipe is fixedly connected to one side of the inner wall of the air supply frame 501. One end of the air supply pipe is fixedly connected to an external air pump. A dust filter 504 is fixedly connected between the cooling pipe 503 and the air outlets 502. Through the cooperation of the cooling pipe 503 and the air supply pipe, cold air is sent to the chip through the air outlets 502 to quickly cool and shape it.

[0052] In one embodiment, see Figure 2 and Figure 3 To enable the connection and installation of various mechanisms, a column 103 is fixedly connected to the top of the inner wall of the housing 101. Several connecting rings 104 are fixedly connected to the middle of the column 103. A mounting bracket is fixedly connected to one side of each of the connecting rings 104. The sealing mechanism 2, the defoaming mechanism 3, and the sealing mechanism 4 are fixedly installed on different mounting brackets. One side of the air supply frame 501 is fixedly connected to the column 103. The top center of the feeding plate 102 is rotatably connected to the bottom of the column 103.

[0053] In one embodiment, see Figure 1 The housing 101 has a feeding port on one side near the feeding station 106. The feeding port is set to correspond to the external feeding equipment, so as to facilitate the automatic feeding operation of the chip and ensure the continuous and automated operation of the device.

[0054] In use, the chip semi-finished product is placed into the placement rack 112 of the loading station 105 by an external feeding device. Specifically, in order to ensure the accuracy of the chip placement position, a robotic arm can be used to clamp and place the chip semi-finished product. After the semi-finished product is placed inside the placement rack 112, the lifting cylinder 109 drives the vibrator 110 to move upward, so that the contact plate 111 contacts the bottom of the placement rack 112. The vibrator 110 is started to work, driving the placement rack 112 and the chip semi-finished product inside it to vibrate, so that the epoxy molding compound is horizontally and evenly distributed inside the substrate 601.

[0055] After the vibration operation is completed, the lifting cylinder 109 drives the vibrator 110 to move down, causing the contact plate 111 to disengage from the placement rack 112. Then, the drive motor drives the feeding tray 102 to rotate one station, aligning the semi-finished product with the capping mechanism 2. At this time, the cover plate conveyor belt rotates, carrying the chip cover plate 602 into the housing 101 and transporting it to the vicinity of the capping mechanism 2. The transverse push rod 202 drives the picking cylinder 201 to move laterally, which in turn drives the picking plate 203 and the picking suction cup 204 to rise and fall, so that the picking suction cup 204 docks with the chip cover plate 602. During picking, the sealing block 208 and the middle The alignment of the central hole positions the chip cover plate 602 and seals the central hole. Then, the external negative pressure suction device is connected and started. Air is drawn through the suction pipe 207, and negative pressure is generated at the suction hole 206 on the suction ring 205 to pick up the chip cover plate 602. Then, the horizontal push rod 202 drives the picking cylinder 201 to reset. The picking cylinder 201 drives the picking plate 203 and the picking suction cup 204 to descend, connecting the chip cover plate 602 with the semi-finished product on the placement rack 112. This ensures that each snap-fit ​​part 605 and each docking groove 604 are aligned and engaged, achieving stable installation of the chip cover plate 602.

[0056] After installation, the drive motor drives the feeding tray 102 to rotate one station so that it is aligned with the defoaming mechanism 3. At this time, the docking cylinder 301 drives the docking cover 302 to press down, which completely covers the placement rack 112 until the pressing ring 303 is in close contact with the chip cover plate 602. At this time, the docking cylinder 301 stops pressing down, and then the external negative pressure suction device is started. The negative pressure pipe 305 draws in negative pressure to generate negative pressure in the docking cover 302, and the air inside the chip package shell is discharged.

[0057] After venting is complete, the drive motor rotates the feeding tray 102 one position, aligning the semi-finished product with the sealing mechanism 4. At this point, the sealing cylinder 401 moves the abutment post 402 downwards until it contacts the chip cover plate 602. The abutment post 402 presses against the chip cover plate 602, aligning the bottom of the feeding channel 404 with the center hole. The linear motor 405 drives the push rod 406 to push out, inserting the sealing ball 411 into the center hole. Simultaneously, the heating wire is activated to heat and melt the sealing ball 411. Combined with the pushing force of the push rod 406, this... The sealing ball 411 deforms and fits into the central hole to form the sealing block 603. Then, the sealing cylinder 401 drives the abutment post 402 to move upward a certain distance, so that the heating wire moves away from the chip cover plate 602. At this time, the pull action of the reset spring 410 keeps the separator sleeve 403 in contact with the chip cover plate 602. Then, the external air pump is started, and the airflow is sent out through the shaping air duct 408 to quickly cool and shape the sealing block 603. After the shaping is completed, the sealing cylinder 401 continues to drive the abutment post 402 to move upward until the separator sleeve 403 is completely separated from the chip cover plate 602.

[0058] Then, the drive motor drives the feeding tray 102 to rotate one station, so that the semi-finished product rotates to the unloading station 106 and aligns with the cooling component 5. At this time, airflow is sent out by the air supply pipe, and at the same time, the external refrigeration equipment is connected to circulate and send cooling medium into the cooling pipe 503 to cool the airflow sent out by the air supply pipe. The cooled airflow is then cooled and shaped quickly. Then, the unloading equipment takes out the chip through the unloading port.

[0059] The above-disclosed embodiments are merely a few specific examples of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A solidification packaging apparatus for a memory chip, characterized by, The application relates to a chip packaging device, which comprises a casing (101), the inside of the casing (101) is provided with a feeding disc (102), the top edge of the feeding disc (102) is fixedly connected with a plurality of placing parts for placing chips, the lower portion of the feeding disc (102) is provided with a driving part for driving the feeding disc (102) to rotate, the upper portion of the feeding disc (102) is sequentially provided with a feeding station (105), a capping mechanism (2), a bubble removing mechanism (3), a hole sealing mechanism (4) and a discharging station (106) along the rotating direction of the feeding disc (102). The bubble removing mechanism (3) comprises a docking air cylinder (301), the output end of the docking air cylinder (301) is fixedly connected with a docking cover (302), the inner cavity of the docking cover (302) is consistent in size with the size of the placing rack (112); the middle portion of the inner wall of the docking cover (302) is fixedly installed with a pressing ring (303), the middle portion of the pressing ring (303) is provided with a through groove (304), the top portion of the inner wall of the docking cover (302) is fixedly connected with a negative pressure pipe (305). The packaging structure of the storage chip comprises a packaging shell and a chip main body, the chip main body is arranged in the packaging shell, the packaging shell comprises a base plate (601), the top portion of the base plate (601) is provided with a chip cover plate (602), the bottom edge of the chip cover plate (602) is fixedly connected with a plurality of clamping portions (605), the inner wall of the base plate (601) is provided with a plurality of docking grooves (604), one side edge of the clamping portions (605) is respectively and slidably connected with the docking grooves (604), and the side, away from the docking grooves (604), of the clamping portions (605) is obliquely arranged towards the middle portion of the inner side of the packaging shell; the middle portion of the chip cover plate (602) is provided with a center hole, and the inside of the center hole is provided with a blocking material block (603).

2. A curing encapsulation apparatus for a memory chip as claimed in claim 1, wherein, The capping mechanism (2) comprises a transverse push rod (202), the output end of the transverse push rod (202) is fixedly connected with a material taking air cylinder (201), the output end of the material taking air cylinder (201) is fixedly connected with a material taking plate (203), the bottom edge of the material taking plate (203) is fixedly connected with a material taking suction disc (204), the middle portion of the material taking plate (203) is fixedly connected with a suction ring (205), the inside of the suction ring (205) is provided with a suction cavity, the bottom portion of the suction cavity is provided with a plurality of suction holes (206), and the top portion of the suction cavity is fixedly connected with a suction pipe (207).

3. A curing encapsulation apparatus for a memory chip as claimed in claim 2, wherein, The center of the bottom portion of the material taking plate (203) is fixedly connected with a blocking block (208).

4. The curing encapsulation apparatus for a memory chip of claim 1, wherein, The hole sealing mechanism (4) comprises a hole sealing cylinder (401), the output end of the hole sealing cylinder (401) is fixedly connected with an abutting column (402), the inside of the abutting column (402) is provided with a discharging hole (404), the upper portion of the discharging hole (404) is provided with a linear motor (405), the output end of the linear motor (405) is fixedly connected with a pushing rod (406), one end of the pushing rod (406) is slidably arranged in the discharging hole (404), the inner wall bottom of the discharging hole (404) is embedded with an electric heating wire, one side of the discharging hole (404) is provided with a feeding channel, and one end of the feeding channel is fixedly connected with a feeding pipe (407).

5. A curing encapsulation apparatus for a memory chip as claimed in claim 4, wherein, The outside of the abutting column (402) is slidably connected with a separation sleeve (403), the bottom edge of the separation sleeve (403) is fixedly connected with a plurality of shaped air pipes (408), the outer wall top of the abutting column (402) is fixedly connected with a fixed ring (409), and the fixed ring (409) and the inner wall top of the separation sleeve (403) are fixedly connected with a plurality of return springs (410).

6. A curing encapsulation apparatus for a memory chip as recited in claim 1, wherein, The placing part comprises a placing groove, and the placing groove is internally clamped with a placing rack (112); the inner cavity of the placing rack (112) is consistent in size with the size of the substrate (601).

7. A curing encapsulation apparatus for a memory chip as claimed in claim 6, wherein, A vibration assembly is arranged below the feeding station (105), the vibration assembly comprises a jacking cylinder (109), the output end of the jacking cylinder (109) is fixedly connected with a vibrator (110), the output end of the vibrator (110) is fixedly connected with a contact plate (111), and the top of the contact plate (111) is arranged in correspondence with the bottom of the placing rack (112).

8. A curing encapsulation apparatus for a memory chip as defined in claim 1, wherein, The discharging station (106) is provided with a cooling assembly (5), the cooling assembly (5) comprises a blowing frame (501), a plurality of blowing ports (502) are formed in the inner wall of the blowing frame (501), a cooling pipe (503) is fixedly connected to the middle of the inner wall of the blowing frame (501), a blowing pipe is fixedly connected to one side of the inner wall of the blowing frame (501), and a dust screen (504) is fixedly connected between the cooling pipe (503) and the blowing port (502).

9. A curing encapsulation apparatus for a memory chip as defined in claim 1, wherein, The inner wall top of the shell (101) is fixedly connected with a stand column (103), the middle of the stand column (103) is fixedly connected with a plurality of connecting rings (104), one side of each of the plurality of connecting rings (104) is fixedly connected with a mounting frame, and the cover mechanism (2), the bubble removing mechanism (3) and the hole sealing mechanism (4) are respectively fixedly mounted on different mounting frames.

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