Adhesive film laying method, preparation method of photovoltaic module and photovoltaic module

Abstract

The embodiment of the invention relates to an adhesive film laying method, a preparation method of a photovoltaic module and the photovoltaic module. The adhesive film laying method comprises the following steps: providing a first cover plate; a first adhesive film layer, a target device and a second adhesive film layer which are stacked are arranged on the surface of the first cover plate; cutting the first adhesive film layer and the second adhesive film layer; the first adhesive film layer and the second adhesive film layer with the projections located between a cutting track and the outer contour of the first cover plate are removed; wherein the reserved first adhesive film layer and the reserved second adhesive film layer are aligned in the thickness direction of the first cover plate, and the reserved second adhesive film layer completely covers the surface of one side, deviating from the first adhesive film layer, of the target device; the width of a gap between the outer contour of the first adhesive film layer and the outer contour of the first cover plate is greater than a preset value, and the gap is used for coating a sealant.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of device packaging, and particularly relate to a film laying method, a photovoltaic module preparation method, and a photovoltaic module. BACKGROUND

[0002] The film is widely used in the packaging of optical devices and the like due to its excellent water and oxygen isolation capacity and light transmittance. In the packaging process, a layer of film needs to be arranged on each of the two opposite surfaces of the device, and the peripheries of the two layers of film need to be attached to each other to form a sealed space capable of isolating water and oxygen. However, in the packaging process, the laying precision of the films on the two surfaces of the device is insufficient, which leads to film deviation and affects the packaging effect of the device. SUMMARY

[0003] Therefore, it is necessary to provide a film laying method capable of improving the laying precision of two layers of film, a photovoltaic module preparation method, and a photovoltaic module in view of the above technical problems.

[0004] In a first aspect, the present application provides a film laying method, which comprises:

[0005] providing a first cover plate;

[0006] arranging a first film layer, a target device, and a second film layer in the order of the first film layer, the target device, and the second film layer on the surface of the first cover plate;

[0007] cutting the first film layer and the second film layer;

[0008] removing the first film layer and the second film layer located between the cutting track and the outer contour of the first cover plate;

[0009] wherein the retained first film layer and the retained second film layer are aligned in the thickness direction of the first cover plate, the retained second film layer completely covers the side surface of the target device away from the first film layer, and the gap width between the outer contour of the retained first film layer and the outer contour of the first cover plate is greater than a preset value, and the gap is used for coating sealing glue.

[0010] In one of the embodiments, the cutting of the first film layer and the second film layer comprises:

[0011] synchronously cutting the first film layer and the second film layer.

[0012] In one of the embodiments, the cutting of the first film layer and the second film layer comprises:

[0013] synchronously cutting the first film layer and the second film layer by laser;

[0014] or using a laser step cutting the first adhesive film layer and the second adhesive film layer.

[0015] In one embodiment, the first adhesive film layer and the second adhesive film layer are both organic materials.

[0016] The cutting the first adhesive film layer and the second adhesive film layer comprises:

[0017] The first adhesive film layer and the second adhesive film layer are simultaneously cut by a laser with a preset energy, so that the first adhesive film layer and the second adhesive film layer located at the cutting track can undergo cross-linking reaction.

[0018] In one embodiment, the light source of the laser is a carbon dioxide laser.

[0019] Before the first adhesive film layer, the target device and the second adhesive film layer are arranged on the surface of the first cover plate, the method further comprises:

[0020] A protective plate is arranged on the surface of the first cover plate, and the protective plate covers at least the first cover plate located on the cutting track.

[0021] After the first adhesive film layer and the second adhesive film layer are cut, the method further comprises:

[0022] The protective plate is removed.

[0023] In one embodiment, the protective plate is arranged on the surface of the first cover plate, which comprises:

[0024] A plurality of sub-plates are arranged on the surface of the first cover plate, and the plurality of sub-plates collectively serve as the protective plate.

[0025] In one embodiment, the protective plate is made of light-proof material.

[0026] In one embodiment, the protective plate is made of at least one of metal and ceramic.

[0027] In one embodiment, at least one of the first adhesive film layer and the second adhesive film layer has a size larger than the first cover plate, so that after the first adhesive film layer and the second adhesive film layer are cut, the first adhesive film layer and the second adhesive film layer to be removed naturally fall off from the first cover plate.

[0028] In one embodiment, the first adhesive film layer and the second adhesive film layer located between the cutting track and the outer contour of the first cover plate are removed, which comprises:

[0029] pulling the part of the first adhesive film layer and / or the part of the second adhesive film layer to be removed in a direction away from the first cover plate to expose the first adhesive film layer and the second adhesive film layer to be removed at least partially to the outer contour of the first cover plate and naturally fall to be separated from the first cover plate.

[0030] In one of the embodiments, the gap width is greater than 5 mm.

[0031] In a second aspect, the application provides a method for preparing a photovoltaic module, comprising:

[0032] The first adhesive film layer and the second adhesive film layer are formed on the surface of the first cover plate by using the adhesive film laying method as described above, and the target device between the first adhesive film layer and the second adhesive film layer is a cell string.

[0033] A sealant is coated on the surface of the first cover plate, and the sealant is arranged between the outer contour of the first adhesive film layer after cutting and the outer contour of the first cover plate.

[0034] A second cover plate is arranged, and the second cover plate covers the surface of the second adhesive film layer after cutting and the sealant.

[0035] A laminating process is performed to form a photovoltaic module.

[0036] In one of the embodiments, the sealant is butyl rubber.

[0037] In a third aspect, the application provides a photovoltaic module, comprising:

[0038] The first cover plate, the first adhesive film layer, the cell string, the second adhesive film layer and the second cover plate are arranged in a stack, the size of the cell string is smaller than the first adhesive film layer and the second adhesive film layer, and the part of the first adhesive film layer exposed outside the cell string is adhered to the part of the second adhesive film layer exposed outside the cell string; wherein the first adhesive film layer and the second adhesive film layer are cut on the surface of the first cover plate.

[0039] A sealant is arranged outside the adhered first adhesive film layer and the second adhesive film layer, used for fixing the first cover plate and the second cover plate, and forming a sealed cavity with the first cover plate and the second cover plate for accommodating the first adhesive film layer, the cell string and the second adhesive film layer.

[0040] In one of the embodiments, the first adhesive film layer and the second adhesive film layer are synchronously cut on the surface of the first cover plate by using a laser.

[0041] In one of the embodiments, the distance between the overall outer contour of the first cover plate and the second cover plate projected on the plane where the first cover plate is located and the outer contour of the first cover plate is greater than 5mm.

[0042] The above-mentioned adhesive film laying method, photovoltaic module preparation method and photovoltaic module can accurately determine the cutting position to make the final remaining adhesive film layer be located at the target position of the first cover plate, such as the central region of the first cover plate, after removing the peripheral first adhesive film layer and second adhesive film layer. Moreover, even if there is a certain laying error in the laying process of the first adhesive film layer and the second adhesive film layer, the misaligned part is usually located in the part to be removed, so that the above-mentioned error can be eliminated after removing the peripheral adhesive film layer. In addition, after the cutting of the adhesive film layer is completed, the first adhesive film layer and the second adhesive film layer do not need to be moved again, so as to effectively avoid the position error introduced in the moving process. Therefore, the adhesive film laying method of the embodiment can make the first adhesive film layer and the second adhesive film layer have high laying precision, so as to effectively reduce the influence of the laying error of the first adhesive film layer and the second adhesive film layer on the subsequent sealing glue coating process step, provide appropriate width of coating space for the sealing glue, and then improve the packaging yield of the target device. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the embodiments or related art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0044] Figure 1 It is a process flow diagram of the adhesive film layer cutting and laying in the related art;

[0045] Figure 2 It is one of the flowcharts of the adhesive film laying method of one embodiment;

[0046] Figure 3 It is one of the cross-sectional schematic views of the semi-finished product assembly after step S200 of one embodiment;

[0047] Figure 4 It is one of the top view schematic views of the semi-finished product assembly after step S200 of one embodiment;

[0048] Figure 5 It is a cross-sectional schematic view of the semi-finished product assembly after step S300 of one embodiment;

[0049] Figure 6FIG. 4 is a cross-sectional view of the semi-finished product assembly after step S400 of one embodiment;

[0050] Figure 7 FIG. 5 is a top view of the semi-finished product assembly after step S400 of one embodiment;

[0051] Figure 8 FIG. 6 is a partial cross-sectional view of the semi-finished product assembly after the cross-linking reaction of the first and second adhesive film layers of one embodiment;

[0052] Figure 9 FIG. 7 is a partial cross-sectional view of the laminated photovoltaic assembly of one embodiment;

[0053] Figure 10 FIG. 8 is a partial cross-sectional view of a laminated photovoltaic assembly in the related art;

[0054] Figure 11 FIG. 9 is a cross-sectional view of the semi-finished product assembly after step S200 of one embodiment;

[0055] Figure 12 FIG. 10 is a top view of the semi-finished product assembly after step S200 of one embodiment;

[0056] Figure 13 FIG. 11 is a structural view of the protective plate of one embodiment;

[0057] Figure 14 FIG. 12 is a cross-sectional view of the semi-finished product assembly after step S200 of one embodiment;

[0058] Figure 15 FIG. 13 is a cross-sectional view of the semi-finished product assembly after step S400 of one embodiment;

[0059] Figure 16 FIG. 14 is a flowchart of the method for manufacturing a photovoltaic assembly of one embodiment;

[0060] Figure 17 FIG. 15 is a cross-sectional view of the assembly to be laminated after step S30 of one embodiment;

[0061] Figure 18 FIG. 16 is a partial cross-sectional view of the laminated photovoltaic assembly after step S40 of one embodiment.

[0062] Element Number Description:

[0063] First cover plate: 100; first adhesive film layer: 200; retained first adhesive film layer: 210; first adhesive film layer to be removed: 220; target device: 300; second adhesive film layer: 400; retained second adhesive film layer: 410; second adhesive film layer to be removed: 420; protective plate: 500; sub-plate: 510; sealant: 600; second cover plate: 700. DETAILED DESCRIPTION

[0064] For the purpose of clarity, technical solution and advantages of the present application, the present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are intended to explain the present application, but not to limit the present application.

[0065] It should be understood that when an element or layer is referred to as being "on", "adjacent", "connected to" or "coupled to" another element or layer, it can be directly on, adjacent, connected or coupled to the other element or layer, or one intervening element or layer can be present. In contrast, when an element is referred to as being "directly on", "directly adjacent", "directly connected to" or "directly coupled to" another element or layer, then there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application. For example, a first adhesive film layer can become a second adhesive film layer, and similarly, a second adhesive film layer can become a first adhesive film layer; the first adhesive film layer and the second adhesive film layer are different adhesive film layers.

[0066] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and / or operation in addition to the orientations depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can also be oriented in the other directions (for example, rotated 90 degrees or at other orientations) and the spatial description terminology used herein is interpreted accordingly.

[0067] As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It should also be understood that the term "comprising" or "having" etc. specifies the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but does not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Meanwhile, in the present specification, the term "and / or" includes any and all combinations of the associated listed items.

[0068] Embodiments of the present application provide a method for cutting and laying a first adhesive film layer and a second adhesive film layer, so as to package and protect a target device, thereby improving the stability and reliability of the target device. The target device can be, but is not limited to, a chip, a battery string, a sensor, or the like, which has insufficient water and oxygen resistance. Taking the battery string as an example, the first adhesive film layer and the second adhesive film layer need to have good electrical insulation to reduce current leakage of the battery string. Moreover, the first adhesive film layer and the second adhesive film layer also need to have good isolation to inhibit water vapor in the environment from invading the battery string, thereby prolonging the service life and reliability of the battery string. However, the process precision of cutting and laying the adhesive film layer in the related art is insufficient, and it is difficult to meet the needs of users.

[0069] Specifically, in the related art, four steps are usually required to complete the cutting and laying of two adhesive film layers. Figure 1 For a process flow diagram of cutting and laying the adhesive film layer in the related art, reference is made to Figure 1 In the related art, the following is specifically performed:

[0070] Step 1: first, the first adhesive film layer is precisely cut, and the size of the precisely cut first adhesive film layer 210 is slightly larger than the battery string;

[0071] Step 2: the precisely cut first adhesive film layer 210 is laid on the first cover plate 100, and the welded battery string 300 is placed on the first adhesive film layer 210;

[0072] Step 3: the second adhesive film layer is precisely cut, and the size of the precisely cut second adhesive film layer 410 is the same as or similar to that of the precisely cut first adhesive film layer 210;

[0073] Step 4: the precisely cut second adhesive film layer 410 is covered on the battery string 300 and part of the first adhesive film layer 210, and the boundary of the second adhesive film layer 410 is aligned with the boundary of the first adhesive film layer 210.

[0074] To ensure the production rhythm, at least two film precision cutting machines need to be set up to cut the first film layer and the second film layer separately. It is found through testing that the cutting error of each film layer is about ±0.5mm when the film precision cutting machine is used to cut the film layer, and about ±0.5mm of precision laying error is introduced when the cut film layer is laid. Therefore, the cumulative error of the four steps in the related art will reach ±2mm. It can be understood that the error of ±2mm will greatly affect the subsequent process steps, and therefore is extremely challenging to production.

[0075] The embodiment provides a film laying method to improve the laying precision of the first film layer and the second film layer, Figure 2 For one of the flowcharts of the film laying method of the embodiment, refer to Figure 2 The method comprises steps S100 to S400.

[0076] Step S100, providing a first cover plate.

[0077] The first cover plate can be made of glass, plastic or other materials with high transmittance. The first cover plate is used to protect the device encapsulated inside from mechanical damage such as wind and sand erosion, hail impact, etc. Taking a battery string as an example, after the first film layer and the second film layer are arranged on both sides of the battery string, the first cover plate can be arranged on the side of the first film layer away from the battery string, and the second cover plate can be arranged on the side of the second film layer away from the battery string, and the battery string is encapsulated as a photovoltaic module, so as to better protect the battery string and better adapt to harsh outdoor environments such as mountainous areas and seashores, and ensure long-term stable operation of the photovoltaic module.

[0078] Step S200, arranging a laminated first film layer 200, a target device 300 and a second film layer 400 on the surface of the first cover plate 100.

[0079] Figure 3 For one of the cross-sectional schematic views of the semi-finished product assembly after step S200 of the embodiment, Figure 4Fig. 2 is a top view of the semi-finished assembly after step S200 of an embodiment. For ease of illustration, in this application, the structure composed of the first cover plate 100, the first adhesive film layer 200, the target device 300, and the second adhesive film layer 400 is referred to as a semi-finished assembly. The material of the first adhesive film layer 200 and the second adhesive film layer 400 can be the same or different, and can be, but is not limited to, any one of Ethylene-Vinyl Acetate (EVA), Polyolefin Elastomer (POE), and Ethylene-propylene Elastomer (EPE). The above-mentioned materials have good transparency and adhesion, and can effectively bond the cover plate and provide necessary cushioning protection. The thickness of a single layer of the first adhesive film layer 200 and the second adhesive film layer 400 can be 0.2 mm to 0.8 mm, for example, 0.2 mm, 0.3 mm, 0.5 mm, 0.8 mm, etc.

[0080] Step S300: cutting the first adhesive film layer 200 and the second adhesive film layer 400.

[0081] Here, cutting refers to leaving a cutting track on the first adhesive film layer 200 and the second adhesive film layer 400 by external force, so that the first adhesive film layer 200 and the second adhesive film layer 400 can be disconnected at the cutting track, Figure 4 The dashed line shown in the middle is the cutting track. Figure 5 Fig. 3 is a cross-sectional view of the semi-finished assembly after step S300 of an embodiment, with reference to Fig. 2. Figure 5 After cutting, the first adhesive film layer 200 is divided into a retained first adhesive film layer 210 and a first adhesive film layer 220 to be removed, and the second adhesive film layer 400 is divided into a retained second adhesive film layer 410 and a second adhesive film layer 420 to be removed. Specifically, any one of contact cutting and non-contact cutting can be used for cutting. That is, the embodiment does not limit the specific cutting method, but it is necessary to ensure that the first cover plate 100, the first adhesive film layer 200, and the second adhesive film layer 400 do not change in position relative to each other during cutting, thereby avoiding laying errors caused by movement of any adhesive film layer.

[0082] Step S400: removing the first adhesive film layer 220 and the second adhesive film layer 420 projected between the cutting track and the outer contour of the first cover plate 100.

[0083] The first adhesive film layer 210 and the second adhesive film layer 410 located inside the cutting track are projected onto the first cover plate 100, and the projection is the normal projection of the adhesive film layer onto the plane of the first cover plate 100. Therefore, the projections of the first adhesive film layer 220 and the second adhesive film layer 420 to be removed are coincident and located between the cutting track and the outer contour of the first cover plate 100. Figure 6 FIG. 6 is a cross-sectional view of the semi-finished product assembly after step S400 of an embodiment, Figure 7 FIG. 7 is a top view of the semi-finished product assembly after step S400 of an embodiment, in combination with FIG. 6, Figure 6 and Figure 7 The retained first adhesive film layer 210 and the second adhesive film layer 410 are aligned in the thickness direction of the first cover plate 100, and the retained second adhesive film layer 410 completely covers the side surface of the target device 300 away from the first adhesive film layer. Further, the gap between the outer contour of the retained first adhesive film layer 210 and the outer contour of the first cover plate 100 is greater than a preset value, and the gap is used for coating the sealant.

[0084] In the embodiment of the application, the first adhesive film layer 200 and the second adhesive film layer 400 are first laid on the first cover plate 100, and the first adhesive film layer 200 and the second adhesive film layer 400 are directly cut on the first cover plate 100. After the peripheral first adhesive film layer 220 and the peripheral second adhesive film layer 420 are removed, the finally retained adhesive film layers are located at the target positions of the first cover plate 100, for example, the central region of the first cover plate 100. Moreover, even if there is a certain laying error in the initial laying process of the first adhesive film layer 200 and the second adhesive film layer 400, the misaligned parts are usually located in the parts to be removed after cutting, so that the above-mentioned error can be eliminated after the peripheral adhesive film layers are removed. In addition, after the cutting of the adhesive film layers is completed, the first adhesive film layer 200 and the second adhesive film layer 400 do not need to be moved again, so that the laying error introduced in the moving process can be effectively avoided. Therefore, the adhesive film laying method of the embodiment can make the laid first adhesive film layer 210 and the second adhesive film layer 410 have high laying precision, so as to effectively reduce the influence of the laying error of the first adhesive film layer 210 and the second adhesive film layer 410 on the subsequent process step of coating the sealant, provide a proper width of coating space for the sealant, and thus improve the packaging yield of the target device 300. In one embodiment, the step S300 of cutting the first adhesive film layer 200 and the second adhesive film layer 400 includes simultaneously cutting the first adhesive film layer 200 and the second adhesive film layer 400. Specifically, the simultaneous cutting means that the cutting equipment simultaneously cuts the corresponding positions of the first adhesive film layer 200 and the second adhesive film layer 400. The corresponding positions can be understood as the positions where the first adhesive film layer 200 and the second adhesive film layer 400 are projected and overlapped in the thickness direction. In the embodiment of the application, the two adhesive film layers are cut together, so that one cutting equipment can be saved, and the production efficiency is greatly improved. Moreover, the simultaneous cutting method can reduce the error of the cutting equipment in different cutting periods, so as to further improve the overlapping degree of the first adhesive film layer 210 and the second adhesive film layer 410 after cutting, and thus the process control points can be reduced.

[0085] In one of the embodiments, the step S300 of cutting the first adhesive film layer 200 and the second adhesive film layer 400 comprises step-by-step cutting the first adhesive film layer 200 and the second adhesive film layer 400. In the step-by-step cutting, the second adhesive film layer 400 located at the upper layer is cut first, and then the first adhesive film layer 200 located at the lower layer is cut along the same cutting track as the second adhesive film layer 400. It can be understood that the synchronous cutting mode requires a cutting device with a larger cutting depth, and the larger cutting depth may cause damage to the first cover plate 100 below the first adhesive film layer 200 during the cutting process. Therefore, the synchronous cutting mode has a higher requirement for the control precision of the cutting force. In the embodiments of the application, the step-by-step cutting mode has a lower requirement for the depth of the cutting device, and is less likely to damage the first cover plate 100, thus having a lower requirement for the control precision of the force, and is a technical solution that is easier to implement in the process. It can be understood that if the step-by-step cutting mode is adopted, the second adhesive film layer 400 has a risk of moving after being cut, which may cause the second adhesive film layer 400 to block the cutting track of the first adhesive film layer 200, and thus cause the first adhesive film layer 200 to be incorrectly cut, or cause the finally formed first adhesive film layer 210 and the second adhesive film layer 410 to be misaligned. Therefore, either the synchronous cutting or the step-by-step cutting can be flexibly selected for cutting according to actual needs.

[0086] In one of the embodiments, the step S300 of cutting the first adhesive film layer 200 and the second adhesive film layer 400 comprises cutting the first adhesive film layer 200 and the second adhesive film layer 400 in a non-contact manner. The non-contact cutting includes, but is not limited to, laser cutting, water jet cutting, plasma cutting, etc. Laser cutting refers to using a high-energy laser beam to irradiate a cutting object, and performing precise cutting without contacting the cutting object by controlling the focal point and moving path of the laser. Water jet cutting refers to high-speed spraying of a mixture of abrasive media (such as diamond sand) and water to a cutting object by a high-pressure water pump to achieve the purpose of cutting the material. Plasma cutting refers to using a high-temperature plasma arc to melt the cutting object to achieve the effect of cutting. In the embodiments of the application, the non-contact cutting mode does not cause physical compression or damage to the adhesive film during the cutting process, which helps to maintain the integrity of the adhesive film and reduces the risk of contamination of the adhesive film layer.

[0087] In one of the embodiments, the step S300 of cutting the first adhesive film layer 200 and the second adhesive film layer 400 comprises cutting the first adhesive film layer 200 and the second adhesive film layer 400 in a non-contact manner. The non-contact cutting includes, but is not limited to, laser cutting, water jet cutting, plasma cutting, etc. Laser cutting refers to using a high-energy laser beam to irradiate a cutting object, and performing precise cutting without contacting the cutting object by controlling the focal point and moving path of the laser. Water jet cutting refers to high-speed spraying of a mixture of abrasive media (such as diamond sand) and water to a cutting object by a high-pressure water pump to achieve the purpose of cutting the material. Plasma cutting refers to using a high-temperature plasma arc to melt the cutting object to achieve the effect of cutting. In the embodiments of the application, the non-contact cutting mode does not cause physical compression or damage to the adhesive film during the cutting process, which helps to maintain the integrity of the adhesive film and reduces the risk of contamination of the adhesive film layer.

[0088] Optionally, the type of laser cutting can be, but is not limited to, fiber laser cutting, gas laser cutting, solid-state laser cutting, semiconductor laser cutting, ultrafast laser cutting, etc. Further, before laser cutting, an image can be captured by a camera to obtain the positions of the first cover plate 100, the target device 300, and the first and second adhesive film layers 200 and 400 to be cut according to the captured image. In the case where the target device 300 is determined to be located in the middle of the first cover plate 100, and the boundaries of the first and second adhesive film layers 200 and 400 are both located outside the cutting track, the cutting operation is then performed to ensure the yield of cutting. Further, the cutting track can be determined according to the outer contour of the first cover plate 100 to match the cutting track with the placement position and angle of the first cover plate 100, so that the first and second adhesive film layers 210 and 410 reserved after cutting are located in the middle of the first cover plate 100 to improve the positional accuracy of the first and second adhesive film layers 210 and 410.

[0089] In one embodiment, the first and second adhesive film layers 200 and 400 are cut by gas laser cutting, which is more suitable for processing some composite materials. Further, the gas laser cutting can be carbon dioxide laser cutting, i.e., the light source of the laser is a carbon dioxide laser. Carbon dioxide laser cutting refers to a technology of generating laser by electrically stimulating carbon dioxide mixture. The carbon dioxide laser emits laser in the mid-infrared band, with a wavelength of about 10.6 microns. Due to the longer wavelength, the light beam emitted by the carbon dioxide laser can be well absorbed by the adhesive film layer, thereby improving the cutting efficiency of the first and second adhesive film layers 210 and 410.

[0090] In one of the embodiments, the first encapsulant layer 200 and the second encapsulant layer 400 both include organic materials, and the step S300 of cutting the first encapsulant layer 200 and the second encapsulant layer 400 includes synchronously cutting the first encapsulant layer 200 and the second encapsulant layer 400 by using a laser with a preset energy, so that the first encapsulant layer 210 and the second encapsulant layer 410 located at the cutting track can have cross-linking reaction. Accordingly, the encapsulant layers at the laser cutting track can have a higher cross-linking degree than the encapsulant layers at other positions. In this embodiment, the organic materials of the first encapsulant layer 200 and the second encapsulant layer 400 can be the same, so that the cross-linking reaction is more likely to occur. Specifically, the laser can provide the energy required for the cross-linking reaction of the organic materials in the encapsulant layers. When the laser irradiates the organic materials in the encapsulant layers, the photons are absorbed by the organic molecules. After the organic molecules absorb the photons, the organic molecules are excited from the ground state to the excited state, and the organic molecules in the excited state have a higher chemical reactivity. The higher chemical reactivity makes the original chemical bonds in the organic molecules easy to break and form new chemical bonds, thereby forming a network structure, i.e., cross-linking reaction. It can be understood that when the laser irradiates the surface of the encapsulant layers, the energy is absorbed by the encapsulant layers and converted into heat energy, which causes the temperature of the encapsulant layers to rise. That is, the higher the energy density of the laser, the faster the temperature of the organic materials in the encapsulant layers rises, and many cross-linking reactions need to be carried out at a higher temperature to be effective. Therefore, the rapid temperature rise helps to promote the cross-linking reaction between the two encapsulant layers. Moreover, at high temperatures, the organic materials in the encapsulant layers will melt, and the activity of the organic molecular chains in the molten state is enhanced, so that the cross-linking reaction is more likely to occur. However, if the energy density is too high, it may cause the organic materials in the encapsulant layers to ablate or degrade, which in turn destroys the cross-linking structure. Therefore, the appropriate laser energy can be determined according to the type of organic materials in the first encapsulant layer 200 and the second encapsulant layer 400, so that the cross-linking reaction has a better effect. Further, the speed and efficiency of the cross-linking reaction of the first encapsulant layer 210 and the second encapsulant layer 410 can also be controlled by adjusting the power density (power / unit area) of the laser.

[0091] Figure 8 FIG. 6 is a partial cross-sectional view of a semi-finished product assembly after the cross-linking reaction of the first encapsulant layer 210 and the second encapsulant layer 410 of one embodiment, with reference to FIG. 1. Figure 8 After the cross-linking reaction of the first encapsulant layer 210 and the second encapsulant layer 410, the cut portion can be understood to be in a closed state. Figure 9 FIG. 7 is a partial cross-sectional view of a laminated photovoltaic module of one embodiment, with reference to FIG. 1. Figure 9, based on the closed first adhesive film layer 210 and the second adhesive film layer 410, after the sealing adhesive 600 is coated and laminated, the sealing adhesive 600 is not easy to squeeze into the gap between the first adhesive film layer 210 and the second adhesive film layer 410, so as to ensure that the sealing adhesive 600 after lamination has a wider effective width d1, thereby ensuring the isolation effect of the sealing adhesive 600. After the first adhesive film layer and the second adhesive film layer are laid in the related art, the cutout is in an open state, Figure 10 is a partial view of a photovoltaic module after lamination in the related art, referring to Figure 10 , during the lamination process, the adhesive is easy to be pierced, which means that part of the sealing adhesive 600 is squeezed into the gap between the two adhesive film layers, thereby reducing the effective width d2 of the sealing adhesive 600. In the embodiment, through the cross-linking reaction of the first adhesive film layer 210 and the second adhesive film layer 410, the piercing condition can be greatly reduced, thereby ensuring the effective width of the sealing adhesive 600 after lamination, and further ensuring the sealing effect of the sealing adhesive 600.

[0092] In one of the embodiments, the gap width is greater than 5mm. The gap width may, for example, be 5mm, 6mm, 8mm, etc. Among them, the gap width is positively correlated with the effective waterproof width of the module formed after the sealing adhesive is coated and laminated. The effective waterproof width refers to the distance between the overall outer contour of the first adhesive film layer 210 and the second adhesive film layer 410 projected on the surface where the first cover plate 100 is located and the outer contour of the first cover plate 100. The distance between the two outer contours can be understood as the distance between the intersection of a straight line perpendicular to the outer contour direction and the two outer contours. Due to the process limitation, the above-mentioned distance of each part of the two outer contours may not be exactly the same, so the average distance of multiple parts of the two outer contours can be greater than 5mm. Specifically, 5mm can provide a better waterproof effect for the packaged target device. If the adhesive film layer laying method in the related art is used, due to the aforementioned piercing problem, it is difficult to provide sufficient effective waterproof distance. Therefore, in the embodiment, based on the gap width greater than 5mm, a method capable of setting a larger effective waterproof distance is provided.

[0093] Figure 11 is a cross-sectional view of the semi-finished product module after step S200 of one embodiment, Figure 12 is a top view of the semi-finished product module after step S200 of one embodiment, Figure 11 and Figure 12 The dashed line in the figure represents the cutting track. It should be noted that in order to make the cutting track in Figure 12 clear, the second adhesive film layer 400 in Figure 12 is omitted. For reference, Figure 11 and Figure 12 ​In one of the embodiments, before the laminated first adhesive film layer 200, target device 300 and second adhesive film layer 400 are arranged on the surface of the first cover plate 100, a protective plate 500 is arranged on the surface of the first cover plate 100. The protective plate 500 covers at least the first cover plate 100 on the cutting track. It can be understood that in order to ensure that the laser can completely cut the first adhesive film layer 200, a laser with a large energy needs to be used for cutting. However, when the energy of the laser is large, it is difficult to avoid that the first cover plate 100 is damaged by the laser, thereby causing the first cover plate 100 to be easily broken at the damaged part, affecting the reliability of the first cover plate 100. Therefore, the protective plate 500 can be arranged on the surface of the first cover plate 100 first, and then the first adhesive film layer 200, the target device 300 and the second adhesive film layer 400 are arranged in layers. The first adhesive film layer 200 is partially arranged on the protective plate 500 and partially arranged on the surface of the first cover plate 100. In the embodiments, when the first adhesive film layer 200 and the second adhesive film layer 400 are cut by the laser, even if the energy of the laser is large, only the protective plate 500 on the cutting track will be damaged, thereby protecting the first cover plate 100. Accordingly, based on the fact that the first cover plate 100 has been well protected, a laser with a larger energy can be used for cutting to ensure that the first adhesive film layer 200 and the second adhesive film layer 400 are completely cut, so that the peripheral adhesive film layer can be completely removed along the cutting track, and the situation that the adhesive film layer to be retained is deformed due to pulling during removal of the adhesive film layer can be effectively avoided.

[0094] In one of the embodiments, the protective plate 500 is made of a lightproof material. Specifically, the material of the protective plate can include at least one of metal and ceramic. That is, the material of the protective plate can also be a composite material including metal or ceramic. The metal material can be, but is not limited to, copper, zinc, aluminum, stainless steel, etc., which is not limited in the present embodiment. The protective plate 500 made of metal material is not easy to be penetrated by laser, and is not easy to deform and is easy to clean. Therefore, the protective plate 500 made of metal material can well protect the first cover plate 100, thereby greatly improving the reliability of the first cover plate 100.

[0095] In one of the embodiments, after the step S300 of cutting the first adhesive film layer 200 and the second adhesive film layer 400, the method further comprises removing the protective plate 500. It can be understood that, since the protective plate 500 covers the cutting track, the first adhesive film layer 220 and the second adhesive film layer 440 to be removed are necessarily located on the protective plate, so that the first adhesive film layer 220 and the second adhesive film layer 420 projected between the cutting track and the outer contour of the first cover plate 100 can be removed simultaneously when the protective plate 500 is removed. Accordingly, when the protective plate 500 is removed, the partial first adhesive film layer 200 and the partial second adhesive film layer 400 on the protective plate 500 inside the cutting track need to be separated from the protective plate 500 and fall on the surface of the first cover plate 100. Therefore, the protective plate 500 can be made of a material with relatively low adhesion to the adhesive film layer, so that the first adhesive film layer 210 and the partial second adhesive film layer 410 to be retained can be smoothly separated from the protective plate 500. Further, the surface of the protective plate 500 can be pretreated before the first adhesive film layer 200 is arranged, so as to reduce the adhesion between the protective plate 500 and the first adhesive film layer 200, thereby avoiding damage to the first adhesive film layer 210 to be retained when the protective plate 500 is removed.

[0096] Figure 13 FIG. 4 is a structural schematic view of the protective plate 500 according to one of the embodiments, and Figure 13 In one of the embodiments, the protective plate 500 is arranged on the surface of the first cover plate 100, which comprises arranging a plurality of sub-plates 510 on the surface of the first cover plate 100. The plurality of sub-plates 510 collectively serve as the protective plate 500. It should be noted that, in order to clearly show the respective sub-plates 510, Figure 13 FIG. 4 shows the gaps between adjacent sub-plates 510, but in actual use, the adjacent sub-plates 510 are in close contact to form the protective plate 500 surrounded by the plurality of sub-plates 510. Further, the cutting track is a polygon surrounding the periphery of the target device, and each sub-plate 510 corresponds to one side of the polygon. For example, the cutting track is a rectangle surrounding the periphery of the target device, and four sub-plates 510 correspond to the four sides of the rectangle, respectively. In the embodiments of the application, the protective plate 500 is formed by combining a plurality of sub-plates 510, and when the protective plate 500 is removed, each sub-plate 510 only needs to be moved away from the center of the adhesive film layer. Therefore, each sub-plate 510 needs to be moved a relatively small distance and will not touch the first adhesive film layer 200 in the middle, thereby reducing damage to the first adhesive film layer 210 when the protective plate 500 is removed.

[0097] Figure 14 FIG. 3 is a cross-sectional view of the semi-finished assembly after the step S200 according to one of the embodiments, and Figure 14In one embodiment, at least one of the first adhesive film layer 200 and the second adhesive film layer 400 has a size larger than the first cover plate 100, so that the first adhesive film layer 220 and the second adhesive film layer 420 to be removed can naturally fall off from the first cover plate 100 after the cutting step. Specifically, since the adhesive film layer is soft, when the contact area between the first adhesive film layer 220 and the second adhesive film layer 420 to be removed and the first cover plate 100 is small after cutting, the first adhesive film layer 220 and the second adhesive film layer 420 to be removed will naturally fall off under the action of gravity without the support of the first cover plate 100. In the embodiment, the first adhesive film layer 220 and the second adhesive film layer 420 to be removed can naturally fall off from the first cover plate 100 after cutting without additional removal operation, thereby improving the packaging efficiency of the target device 300.

[0098] Further, referring to Figure 15 Since there is no target device 300 between the first adhesive film layer 220 and the second adhesive film layer 420 to be removed, the first adhesive film layer 220 to be removed will be attached to the second adhesive film layer 420 to be removed after the cutting operation is completed. Therefore, as long as one of the first adhesive film layer 220 and the second adhesive film layer 420 naturally falls off from the first cover plate 100, the other will also fall off together. Accordingly, as long as at least one of the first adhesive film layer 200 and the second adhesive film layer 400 has a size larger than the first cover plate 100, the first adhesive film layer 220 and the second adhesive film layer 420 to be removed can fall off together, without the need to set the size of the first adhesive film layer 200 and the second adhesive film layer 400 to be larger than the first cover plate 100, thereby reducing the amount of the first adhesive film layer 200 or the second adhesive film layer 400.

[0099] In one of the embodiments, the step S400 removes the first adhesive film layer 220 and the second adhesive film layer 420 located between the cutting track and the outer contour of the first cover plate, including pulling the part of the first adhesive film layer 220 and / or the part of the second adhesive film layer 420 to be removed in a direction away from the first cover plate 100, so that the first adhesive film layer 220 and the second adhesive film layer 420 to be removed are at least partially exposed to the outer contour of the first cover plate 100 and naturally fall off to separate from the first cover plate 100. Specifically, the part of the first adhesive film layer 220 and / or the part of the second adhesive film layer 420 to be removed can be pulled in a direction parallel to the surface of the first cover plate 100 by a clamp, so that the first adhesive film layer 220 and the second adhesive film layer 420 to be removed are at least partially exposed to the outer contour of the first cover plate 100, and then the first adhesive film layer 220 and the second adhesive film layer 420 lacking the support of the first cover plate 100 naturally fall off under the action of gravity. It can be understood that the present embodiment and the previous embodiment are applicable to the adhesive film cutting scenario without the protective plate 500, and provide a more convenient removal scheme for the peripheral first adhesive film layer 220 and the second adhesive film layer 420.

[0100] The present application also provides a preparation method of a photovoltaic module, Figure 16 For the flowchart of the preparation method of the photovoltaic module of one embodiment, reference is made to Figure 16 The preparation method of the photovoltaic module includes steps S10 to S40.

[0101] In step S10, the first adhesive film layer 210 and the second adhesive film layer 410 are formed on the surface of the first cover plate 100 and cut by using the adhesive film laying method as described above.

[0102] After the initial laid adhesive film layer is cut and the peripheral adhesive film layer is removed, it can be considered that the cutting of the adhesive film layer is completed. The target device 300 between the first adhesive film layer 210 and the second adhesive film layer 410 is a cell string, and the cell string includes a plurality of cell pieces connected in series. The type of the cell piece can be, but is not limited to, an aluminum back surface field (Al-BSF), a passivated emitter and rear cell (PERC), a tunnel oxide passivated contact (TOPCon), and a heterojunction technology (HJT), which is not limited in the present embodiment. Further, the number of the cell string can be multiple, and the multiple cell strings are electrically connected in series and / or in parallel. Specifically, in some embodiments, the multiple cell strings can be electrically connected through a conductive ribbon.

[0103] In step S20, the sealant 600 is coated on the surface of the first cover plate 100.

[0104] The sealing glue 600 is arranged between the outer contour of the first glue film layer 210 after cutting and the outer contour of the first cover plate 100. Specifically, since the battery piece is a water vapor sensitive device, the sealing glue 600 is used for edge waterproofing in this embodiment to further improve the waterproofing level of the photovoltaic module.

[0105] In step S30, the second cover plate 700 is arranged.

[0106] Figure 17 A cross-sectional view of the to-be-laminated assembly after step S30 of the embodiment is shown in FIG. 6. For ease of description, the structure including the first cover plate 100, the first glue film layer 210, the battery string, the second glue film layer 410, the second cover plate 700, and the sealing glue 600 can be referred to as a to-be-laminated assembly. Referring to FIG. 6, Figure 17 The second cover plate 700 covers the surface of the second glue film layer 410 and the sealing glue 600 after cutting.

[0107] In step S40, a lamination process is performed to form a photovoltaic module.

[0108] The lamination process includes placing the to-be-laminated assembly into a laminator, and controlling the temperature and pressure applied by the laminator to melt and solidify the first glue film layer 210, the second glue film layer 410, and the sealing glue 600 to form the photovoltaic module. After the solidification process is completed, the photovoltaic module can be visually and functionally inspected to ensure that there are no bubbles, cracks, or other defects. Figure 18 A partial cross-sectional view of the photovoltaic module after the lamination process in step S40 of the embodiment is shown in FIG. 7. Referring to FIG. 7, Figure 18 The effective waterproofing distance of the photovoltaic module after the lamination process is d1 in the figure.

[0109] It can be understood that the size or position offset of the glue film layer will change the distance between the outer contour of the glue film layer and the outer contour of the first cover plate, thereby changing the coating area reserved for the sealing glue. Specifically, if the coating area reserved for the sealing glue is too small, the sealing glue may be directly coated on the glue film layer when the glue is applied, thereby increasing the stacking failure rate, and thus the material cost and time cost are increased. If the coating area reserved for the sealing glue is too large, the glue may be missing. In the embodiments of the application, based on the aforementioned glue film laying method, the appropriate coating space can be reserved for the sealing glue 600 to reduce the increase in the stacking failure rate caused by the direct coating of the sealing glue 600 on the glue film layer, and to reduce the missing of the sealing glue 600, thereby greatly improving the packaging yield of the photovoltaic module.

[0110] In one of the embodiments, the sealing glue 600 is butyl glue. The butyl glue has very low water vapor permeability, which can effectively block the penetration of moisture and gas, thereby protecting the battery string from the influence of a humid environment. In addition, the butyl glue has good chemical stability and is not easy to react with other substances, and can remain stable in a wide temperature range, so that the butyl glue can have stable performance in various environments, thereby achieving reliable protection of the battery string.

[0111] It should be understood that, although each step in each flowchart is shown in sequence according to the direction of the arrow, these steps are not necessarily executed in the order indicated by the arrow. Unless otherwise specified herein, there is no strict order limitation for the execution of these steps, and these steps can be executed in other orders. Moreover, at least part of the steps in each flowchart can include multiple sub-steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution order of these sub-steps or stages is not necessarily sequential, but can be executed alternately or alternately with at least part of other steps or sub-steps or stages of other steps.

[0112] The embodiments of the present application also provide a photovoltaic module, which continues to refer to Figure 17 The photovoltaic module includes a first cover plate 100, a first glue film layer 210, a battery string 300, a second glue film layer 410, and a second cover plate 700 arranged in a stack. The size of the battery string 300 is smaller than the first glue film layer 210 and the second glue film layer 410, and the part of the first glue film layer 210 exposed outside the battery string 300 is bonded to the part of the second glue film layer 410 exposed outside the battery string 300. In the case where the first glue film layer 210 and the second glue film layer 410 are made of the same material, the first glue film layer 210 and the second glue film layer 410 can be understood as forming an integrated structure. The photovoltaic module further includes a sealing glue 700, which is arranged outside the bonded first glue film layer 210 and the second glue film layer 410, for fixing the first cover plate 100 and the second cover plate 700, and forming a sealing cavity with the first cover plate 100 and the second cover plate 700 for accommodating the first glue film layer 210, the battery string 300, and the second glue film layer 410. The first glue film layer 210 and the second glue film layer 410 are cut on the surface of the first cover plate. Further, the photovoltaic module can be prepared by using the preparation method of the photovoltaic module as described above.

[0113] In one of the embodiments, the distance between the overall outer contour of the first cover plate 100 and the outer contour of the first cover plate 100 in the projection of the first cover plate 100 is greater than 5 mm. The distance may, for example, be 5 mm, 6 mm, 8 mm, etc. That is, the effective waterproof width of the photovoltaic module is greater than 5 mm. The 5 mm can provide sufficient waterproof effect for the encapsulated target device. If the related art encapsulation method is used, it is difficult to provide sufficient effective waterproof distance due to the aforementioned glue penetration problem. Therefore, in the embodiments of the application, a photovoltaic module capable of providing better waterproof effect is provided.

[0114] The embodiments of the application further provide a photovoltaic system comprising the photovoltaic module as described above. The photovoltaic system can be applied in a photovoltaic power station, such as a ground power station, a roof power station, a water surface power station, etc., and can also be applied in a device or apparatus using solar energy to generate power, such as a user solar power source, a solar street lamp, a solar car, a solar building, etc. Of course, it can be understood that the application scenarios of the photovoltaic system are not limited to this, that is, the photovoltaic system can be applied in all fields requiring solar energy to generate power. Taking a photovoltaic power generation system network as an example, the photovoltaic system can comprise a photovoltaic array, a combiner box and an inverter, the photovoltaic array can be an array combination of a plurality of photovoltaic modules, for example, a plurality of photovoltaic modules can form a plurality of photovoltaic arrays, the photovoltaic array is connected to the combiner box, the combiner box can combine the current generated by the photovoltaic array, the combined current flows through the inverter to convert into alternating current required by the power grid, and then is connected to the power network to realize solar power supply.

[0115] The technical features of the above embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present application.

[0116] The above embodiments only express several implementation manners of the embodiments of the application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be noted that for those skilled in the art, without departing from the concept of the embodiments of the application, some modifications and improvements can be made, which are within the scope of the embodiments of the application. Therefore, the protection scope of the patent of the embodiments of the application should be subject to the appended claims.

Claims

1. A method of tape laying, characterized by, The method comprises: providing a first cover plate; providing a first adhesive film layer, a target device and a second adhesive film layer on the surface of the first cover plate in sequence; cutting the first adhesive film layer and the second adhesive film layer; removing the first adhesive film layer and the second adhesive film layer which are projected between the cutting track and the outer contour of the first cover plate; wherein the retained first adhesive film layer and the retained second adhesive film layer are aligned in the thickness direction of the first cover plate, and the retained second adhesive film layer completely covers the side surface of the target device which is away from the first adhesive film layer, and the gap between the outer contour of the retained first adhesive film layer and the outer contour of the first cover plate is greater than a preset value, and the gap is used for coating sealant.

2. The method of laying a membrane according to claim 1, wherein, The cutting of the first adhesive film layer and the second adhesive film layer comprises: synchronously cutting the first adhesive film layer and the second adhesive film layer.

3. The method of claim 2, wherein, The cutting of the first adhesive film layer and the second adhesive film layer comprises: synchronously cutting the first adhesive film layer and the second adhesive film layer by using a laser; or cutting the first adhesive film layer and the second adhesive film layer by using a laser in steps.

4. The method of claim 3, wherein The material of the first adhesive film layer and the second adhesive film layer comprises organic matter. The cutting of the first adhesive film layer and the second adhesive film layer comprises: synchronously cutting the first adhesive film layer and the second adhesive film layer by using a laser with a preset energy, so that the first adhesive film layer and the second adhesive film layer at the cutting track can have cross-linking reaction.

5. The method of claim 3, wherein The light source of the laser is a carbon dioxide laser.

6. The method of laying a membrane according to any one of claims 1 to 5, wherein, Before the step of providing the first adhesive film layer, the target device and the second adhesive film layer on the surface of the first cover plate in sequence, the method further comprises: providing a protective plate on the surface of the first cover plate, and the protective plate covers at least the first cover plate on the cutting track.

7. The method of laying a membrane according to claim 6, wherein, After the cutting of the first adhesive film layer and the second adhesive film layer, the method further comprises: removing the protective plate.

8. The method of claim 6, wherein, The step of providing the protective plate on the surface of the first cover plate comprises: providing a plurality of sub-plates on the surface of the first cover plate, and the plurality of sub-plates collectively serve as the protective plate.

9. The method of claim 6, wherein, The protective plate is made of light-proof material.

10. The method of laying a membrane according to claim 9, wherein, The material of the protective plate comprises at least one of metal and ceramic.

11. The method of laying a membrane according to any one of claims 1 to 5, wherein, At least one of the first adhesive film layer and the second adhesive film layer has a size greater than the first cover plate, so that after the step of cutting the first adhesive film layer and the second adhesive film layer, the first adhesive film layer and the second adhesive film layer to be removed naturally fall off the first cover plate.

12. The method of laying a membrane according to any one of claims 1 to 5, wherein, The step of removing the first adhesive film layer and the second adhesive film layer which are projected between the cutting track and the outer contour of the first cover plate comprises: pulling part of the first adhesive film layer and / or part of the second adhesive film layer to be removed away from the first cover plate, so that the first adhesive film layer and the second adhesive film layer to be removed are at least partially exposed to the outer contour of the first cover plate and naturally fall off the first cover plate.

13. The method of laying a membrane according to claim 1, wherein, The gap width is greater than 5mm.

14. A method of making a photovoltaic module, characterized by, The method comprises: forming the first adhesive film layer and the second adhesive film layer which are provided on the surface of the first cover plate and are cut by using the adhesive film laying method according to any one of claims 1 to 13, and the target device between the first adhesive film layer and the second adhesive film layer is a battery string; A sealant is coated on the surface of the first cover plate, and is arranged between the outer contour of the first adhesive film layer after cutting and the outer contour of the first cover plate; A second cover plate is arranged; the second cover plate covers the surface of the second adhesive film layer and the sealant after cutting; Laminating treatment is performed to form a photovoltaic module.

15. The method of claim 14, wherein the method further comprises: The sealant is butyl sealant.

16. A photovoltaic module, characterized by The application further discloses a photovoltaic module comprising: A first cover plate, a first adhesive film layer, a battery string, a second adhesive film layer and a second cover plate are arranged in sequence, the size of the battery string is smaller than the first adhesive film layer and the second adhesive film layer, and the part of the first adhesive film layer exposed outside the battery string is adhered to the part of the second adhesive film layer exposed outside the battery string; wherein the first adhesive film layer and the second adhesive film layer are cut on the surface of the first cover plate; A sealant is arranged outside the adhered first adhesive film layer and the second adhesive film layer, and is used for fixing the first cover plate and the second cover plate, and forms a sealed cavity with the first cover plate and the second cover plate for accommodating the first adhesive film layer, the battery string and the second adhesive film layer.

17. The photovoltaic module of claim 16, wherein, The first adhesive film layer and the second adhesive film layer are synchronously cut on the surface of the first cover plate by using a laser.

18. The photovoltaic module of claim 16, wherein, The distance between the overall outer contour of the first adhesive film layer and the second adhesive film layer projected on the surface of the first cover plate and the outer contour of the first cover plate is greater than 5 mm.

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