Heat dissipation control methods, devices, systems, and media based on array chips

Abstract

This application discloses a heat dissipation control method, device, system, and medium based on an array chip. The method includes: determining a basic valve opening based on a temperature value and valve opening mapping table for any zone; determining the target valve opening for each electric valve based on the basic valve opening and a spray coverage overlap model, and sending the target valve opening to each electric valve; calculating the target total flow rate based on all target valve openings, adjusting the speed of the liquid supply pump via a frequency converter so that the flow sensor measurement value is the target total flow rate; determining the target pressure value based on the coolant saturation temperature, and adjusting the vacuum pump power or a three-way vacuum solenoid valve so that the pressure in the evaporation chamber is the target pressure value. This application integrates dispersed equipment into a whole by establishing a three-layer linkage logic of zoned precise temperature control, system flow coordination, and global pressure setting. Heat dissipation control achieves overall system-level adjustment without the need for frequent command control of each valve, thus reducing system power consumption.

Description

Technical Field

[0001] This application relates to, but is not limited to, the field of chip heat dissipation technology, and in particular to a heat dissipation control method, device, system, and medium based on array chips. Background Technology

[0002] Large-scale array chips often exhibit random local computational sites during operation, causing heat dissipation to fail to respond promptly to the heat source distribution in the affected areas. This leads to localized heat accumulation and high temperature rise, requiring a temperature control system to coordinate cooling in different zones to ensure the chip's operational efficiency. However, during the coordinated heat dissipation operation of the temperature control system, there is a lack of sound logic design and linkage control between the associated heat dissipation devices. The temperature control system needs to constantly adjust the operating status of each heat dissipation device to maintain a constant array chip temperature. This necessitates frequent information exchange between devices, resulting in the temperature control system requiring significant power consumption from pumps or fans, leading to substantial energy consumption. Summary of the Invention

[0003] This application provides a heat dissipation control method, device, system, and medium based on array chips, which can effectively reduce the power consumption of the temperature control system when dissipating heat from the chip.

[0004] In a first aspect, embodiments of this application provide a heat dissipation control method based on an array chip. This method is applied to a temperature control system, which is communicatively connected to the array chip. The array chip includes multiple partitions. The temperature control system includes an evaporation chamber, which is equipped with a coolant and a nozzle assembly. The nozzle assembly includes multiple nozzles, each facing a different partition. Each nozzle is equipped with an electric valve, and all electric valves are connected to a main pipeline. A flow sensor and a liquid supply pump are located at the end of the main pipeline away from the electric valves. The evaporation chamber is connected to a vacuum pump via a three-way vacuum solenoid valve. The method includes:

[0005] Obtain the temperature value of each of the partitions, and determine the corresponding basic valve opening from the valve opening mapping table based on any one of the temperature values, wherein the valve opening mapping table is used to indicate the mapping relationship between the temperature range and the valve opening.

[0006] Based on the basic valve opening and spray coverage overlap model, the target valve opening of the electric valve corresponding to each nozzle is determined, and the corresponding target valve opening is sent to each electric valve.

[0007] The target total flow rate is calculated based on the opening degree of all the target valves, and the speed of the liquid supply pump is adjusted by the frequency converter so that the measurement value of the flow sensor is the target total flow rate.

[0008] The target pressure value is determined based on the saturation temperature of the coolant. The pressure in the evaporation chamber is adjusted to the target pressure value by adjusting the power of the vacuum pump or the three-way vacuum solenoid valve. The saturation temperature of the coolant is determined by the temperature value of each partition of the array chip.

[0009] In some embodiments, determining the target valve opening of the electric valve corresponding to each nozzle based on the basic valve opening and the spray coverage overlap model includes:

[0010] For any of the nozzles, based on the spray coverage overlap model, the coupling compensation amount is calculated using the decoupling compensator and the opening degree of the basic valve;

[0011] Summing the coupling compensation amount and the corresponding basic valve opening, we obtain the corresponding target valve opening.

[0012] In some embodiments, based on the spray coverage overlap model, the coupling compensation amount is calculated using the decoupling compensator and the opening degree of the basic valve, and is obtained according to the following formula:

[0013] ;

[0014] ;

[0015] in, The coupling compensation amount is... This refers to the basic valve opening. For partitioning j For partitions i The coupling coefficient, For nozzle i Coverage area and nozzles j Overlapping area of ​​the coverage region For nozzle i The area covered is the heat transfer coefficient.

[0016] In some embodiments, the target total flow rate is calculated based on all the target valve openings, using the following formula:

[0017] ;

[0018] in, The target total flow rate, For flow conversion factor, For the first i The target valve opening degree of the electric valve corresponding to each of the nozzles. This is the base flow compensation value.

[0019] In some embodiments, the evaporation chamber is further connected to a return pump, and each of the electric valves is connected to a PID controller. After adjusting the vacuum pump power or the three-way vacuum solenoid valve to make the pressure in the evaporation chamber the target pressure value, the method further includes:

[0020] The pressure value of the evaporation chamber, the temperature value of each of the partitions, and the liquid level of the evaporation chamber are monitored in real time.

[0021] When the pressure value exceeds the pressure threshold, the three-way vacuum solenoid valve is controlled to open the corresponding negative pressure circuit and start the vacuum pump.

[0022] When the temperature value exceeds the temperature threshold, the maximum cooling mode is activated, an alarm message is generated, and the alarm message is sent to the PID controller;

[0023] When the liquid level exceeds the first liquid level threshold, the speed of the return pump is adjusted by frequency conversion until the liquid level is less than the first liquid level threshold. When the liquid level is lower than the second liquid level threshold, the speed of the return pump is adjusted by frequency conversion until the liquid level is greater than the second liquid level threshold.

[0024] In some embodiments, after adjusting the vacuum pump power or the three-way vacuum solenoid valve to make the pressure in the evaporation chamber the target pressure value, the method further includes:

[0025] Upon receiving a heating demand, a new saturation temperature is determined based on the heating demand, and a new target pressure value is determined based on the new saturation temperature.

[0026] The pressure value of the evaporation chamber is adjusted to the new target pressure value by adjusting the power of the vacuum pump or the three-way vacuum solenoid valve.

[0027] Reduce the valve opening of the electric valves corresponding to each of the partitions, and reduce the speed of the liquid supply pump.

[0028] In some embodiments, adjusting the speed of the liquid supply pump via a frequency converter so that the measurement value of the flow sensor is the target total flow rate includes:

[0029] Determine the reference flow rate of the liquid supply pump, wherein the reference flow rate is the volumetric flow rate output when the liquid supply pump operates at its highest efficiency;

[0030] Volumetric flow rate constraints are generated based on a preset ratio range and the reference flow rate.

[0031] The operating efficiency constraint is to minimize the difference between the actual flow rate of the liquid supply pump and the target total flow rate, while the operating efficiency of the liquid supply pump is greater than the product of the maximum operating efficiency and the preset ratio value.

[0032] Based on the volumetric flow rate constraint and the operating efficiency constraint, the operation process of the frequency converter adjusting the speed of the liquid supply pump is constrained so that the measurement value of the flow sensor is the target total flow rate.

[0033] In a second aspect, embodiments of this application provide a control device, including at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, which, when executed by the at least one control processor, enables the at least one control processor to perform the heat dissipation control method based on the array chip as described in the first aspect.

[0034] Thirdly, embodiments of this application also provide a temperature control system, including the control device of the second aspect.

[0035] Fourthly, embodiments of this application also provide a computer-readable storage medium storing computer-executable instructions for performing the heat dissipation control method based on an array chip as described in the first aspect.

[0036] This application provides a heat dissipation control method, device, system, and medium based on an array chip. The method includes: acquiring the temperature values ​​of each of the partitions; determining the corresponding basic valve opening from a valve opening mapping table based on any one of the temperature values, wherein the valve opening mapping table is used to indicate the mapping relationship between temperature range and valve opening; determining the target valve opening of the electric valve corresponding to each nozzle based on the basic valve opening and a spray coverage overlap model, and sending the corresponding target valve opening to each electric valve; calculating the target total flow rate based on all the target valve openings, adjusting the speed of the liquid supply pump through a frequency converter so that the measurement value of the flow sensor is the target total flow rate; determining the target pressure value based on the saturation temperature of the coolant, and adjusting the power of the vacuum pump or the three-way vacuum solenoid valve so that the pressure of the evaporation chamber is the target pressure value, wherein the saturation temperature of the coolant is determined by the temperature values ​​of each partition of the array chip. According to the solution provided in the embodiments of this application, by establishing a three-layer linkage logic of zoned precise temperature control, system flow coordination, and global pressure setting, the dispersed devices are integrated into an organic intelligent whole. When temperature, flow, or negative pressure adjustment is required for heat dissipation control, the overall system-level adjustment can be achieved, so that the entire temperature control system operates in a stable and energy-saving state. There is no need to frequently operate hundreds or thousands of valves in the system by issuing commands one by one, which greatly reduces the number of control commands and the frequency of device operation, thereby effectively reducing the power consumption of the temperature control system when dissipating chip heat. Attached Figure Description

[0037] Figure 1 This is a flowchart of the steps of a heat dissipation control method based on an array chip provided in one embodiment of this application;

[0038] Figure 2 This is a schematic diagram of a temperature control system provided in another embodiment of this application;

[0039] Figure 3 This is a structural diagram of a nozzle assembly provided in another embodiment of this application;

[0040] Figure 4 This is a structural diagram of a control device provided in another embodiment of this application. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0042] It is understandable that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, or the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0043] Large-scale array chips often exhibit random local computational sites during operation, causing heat dissipation to fail to respond promptly to the heat source distribution in the affected areas. This leads to localized heat accumulation and high temperature rise, requiring a temperature control system to coordinate cooling in different zones to ensure the chip's operational efficiency. However, during the coordinated heat dissipation operation of the temperature control system, there is a lack of sound logic design and linkage control between the associated heat dissipation devices. The temperature control system needs to constantly adjust the operating status of each heat dissipation device to maintain a constant array chip temperature. This necessitates frequent information exchange between devices, resulting in the temperature control system requiring significant power consumption from pumps or fans, leading to substantial energy consumption.

[0044] To address the aforementioned problems, this application provides a heat dissipation control method, apparatus, system, and medium based on an array chip. The method includes: acquiring the temperature values ​​of each of the partitions; determining the corresponding basic valve opening from a valve opening mapping table based on any one of the temperature values, wherein the valve opening mapping table indicates the mapping relationship between temperature range and valve opening; determining the target valve opening of the electric valve corresponding to each nozzle based on the basic valve opening and a spray coverage overlap model, and sending the corresponding target valve opening to each electric valve; calculating the target total flow rate based on all the target valve openings, adjusting the speed of the liquid supply pump through a frequency converter so that the measurement value of the flow sensor is the target total flow rate; determining the target pressure value based on the saturation temperature of the coolant, and adjusting the power of the vacuum pump or the three-way vacuum solenoid valve so that the pressure in the evaporation chamber is the target pressure value, wherein the saturation temperature of the coolant is determined by the temperature values ​​of each partition of the array chip. According to the solution provided in the embodiments of this application, by establishing a three-layer linkage logic of zoned precise temperature control, system flow coordination, and global pressure setting, the dispersed devices are integrated into an organic intelligent whole. When temperature, flow, or negative pressure adjustment is required for heat dissipation control, the overall system-level adjustment can be achieved, so that the entire temperature control system operates in a stable and energy-saving state. There is no need to frequently operate hundreds or thousands of valves in the system by issuing commands one by one, which greatly reduces the number of control commands and the frequency of device operation, thereby effectively reducing the power consumption of the temperature control system when dissipating chip heat.

[0045] The embodiments of this application will be further described below with reference to the accompanying drawings.

[0046] refer to Figure 1 , Figure 1 This is a flowchart illustrating the steps of a heat dissipation control method based on an array chip according to an embodiment of this application. This embodiment provides a heat dissipation control method based on an array chip, applied to a temperature control system. The temperature control system is communicatively connected to the array chip, which includes multiple partitions. The temperature control system includes an evaporation chamber, which is equipped with coolant and a nozzle assembly. The nozzle assembly includes multiple nozzles, each facing a different partition. Each nozzle is equipped with an electric valve, and all electric valves are connected to a main pipeline. A flow sensor and a liquid supply pump are located at the end of the main pipeline furthest from the electric valves. The evaporation chamber is connected to a vacuum pump via a three-way vacuum solenoid valve. The method includes, but is not limited to, the following steps:

[0047] Step S10: Obtain the temperature value of each zone, and determine the corresponding basic valve opening from the valve opening mapping table based on any temperature value. The valve opening mapping table is used to indicate the mapping relationship between the temperature range and the valve opening.

[0048] Understandably, in this embodiment, the valve opening mapping table records the valve opening of the corresponding nozzle electric valve for different zone temperature ranges. For example, for 30 to 35 degrees Celsius, the default valve opening is 50%, providing effective support for step S10 to adjust the actual valve opening of the corresponding nozzle electric valve based on the temperature value. For example, when the temperature value is 32 degrees Celsius, which falls within the temperature range of 30 to 35 degrees Celsius, the basic valve opening is determined to be 50%.

[0049] Step S20: Determine the target valve opening of the electric valve corresponding to each nozzle based on the basic valve opening and spray coverage overlap model, and send the corresponding target valve opening to each electric valve.

[0050] Specifically, in this embodiment, the control of each electric valve is executed by a PID controller.

[0051] Specifically, in some embodiments, Figure 1 Step S20 includes, but is not limited to, the following steps:

[0052] Step S21: For any nozzle, based on the spray coverage overlap model, calculate the coupling compensation amount through the decoupling compensator and the basic valve opening.

[0053] Step S22: Sum the coupling compensation amount and the corresponding basic valve opening to obtain the corresponding target valve opening.

[0054] It should be noted that in this embodiment, based on the spray coverage overlap model, the coupling compensation amount is calculated using the decoupling compensator and the basic valve opening, and is obtained according to the following formula:

[0055] ;

[0056] ;

[0057] in, This is the coupling compensation amount. This is the basic valve opening (i.e., the adjustment output of the PID controller). For partitioning j For partitions i The coupling coefficient, For nozzle i Coverage area and nozzles j Overlapping area of ​​the coverage region For nozzle i The area covered The heat transfer coefficient is the coupling coefficient in this embodiment. It is calculated based on geometric coverage and heat transfer principles. In practical use, it can be specifically calibrated experimentally, requiring multiplication by an additional influencing factor (i.e., the heat transfer coefficient). ).

[0058] Specifically, the embodiments of this application do not limit the specific number of nozzles included in the nozzle assembly, and can be as follows: Figure 3 As shown, the nozzle assembly has 6 nozzles, each corresponding to a different array chip partition.

[0059] It is understood that in this embodiment, the nozzles for heat dissipation operations on different partitions of the array chip and the coverage area of ​​each nozzle are as follows: Figure 3 As shown, the coverage area of ​​the central nozzle does not coincide with the heat source area, the overlapping area of ​​adjacent nozzles (i.e., the area of ​​the spray overlap zone) is not 0, and the coverage areas of the outer nozzles (i.e., the second nozzle 212 to the sixth nozzle 216) do not coincide with the heat source area (i.e., the area on the array chip that actually generates heat). Based on this nozzle structure, it can be seen that no single nozzle can completely cover the heat source area; that is, the heat source area falls at the boundary of the coverage areas of two or more nozzles, i.e., the spray overlap zone. In this case, this embodiment calculates any coupling coefficient... To accurately know the corresponding nozzle j For adjacent nozzles i The extent of influence over the assigned region determines the effectiveness of the nozzle. j During the operation, a compensation amount is pre-calculated based on the spray coverage overlap model. to nozzle i To counteract the effects, the electric valves of each nozzle in each zone, while performing their own tasks, also coordinate with the electric valves of adjacent nozzles. This creates a physically strong coupling in the spray overlap area, achieving precise, stable, and energy-efficient temperature control. This effectively avoids situations where the system detects overheating in the heat source area within the spray overlap area and simultaneously increases the opening of the electric valves of the two nozzles in that area, leading to overcooling of the heat source area. Conversely, if the system detects a low temperature after overcooling and then decreases the opening, insufficient cooling and a temperature rebound would occur. Such multi-zone temperature coupling leads to frequent electric valve operations, drastic fluctuations in coolant flow, high energy consumption, and poor temperature control accuracy. In other words, this embodiment's scheme, which determines the target valve opening of each nozzle's electric valve based on the basic valve opening and the spray coverage overlap model, effectively reduces the energy consumption of the temperature control system while improving temperature control accuracy during heat dissipation operations, thus solving the problem of multi-zone temperature coupling.

[0060] Step S30: Calculate the target total flow rate based on the opening degree of all target valves, and adjust the speed of the liquid supply pump by the frequency converter so that the measurement value of the flow sensor is the target total flow rate.

[0061] It should be noted that in this embodiment, the target total flow rate is calculated based on the opening degree of all target valves, and is obtained according to the following formula:

[0062] ;

[0063] in, For the target total flow, For flow conversion factor, For the first i The target valve opening degree of the electric valve corresponding to each nozzle. This is the base flow compensation value.

[0064] It should be noted that, in some embodiments, Figure 1 Step S30 involves adjusting the speed of the liquid supply pump via a frequency converter so that the flow sensor reading is the target total flow rate. This includes, but is not limited to, the following steps:

[0065] Step S31: Determine the reference flow rate of the liquid supply pump, wherein the reference flow rate is the volumetric flow rate output when the liquid supply pump operates at its highest efficiency.

[0066] Step S32: Generate volumetric flow rate constraints based on a preset ratio range and reference flow rate;

[0067] Step S33: Minimize the difference between the actual flow rate of the liquid supply pump and the target total flow rate, while the operating efficiency of the liquid supply pump is greater than the product of the maximum operating efficiency and the preset ratio value as the operating efficiency constraint condition.

[0068] Step S34: Based on the volumetric flow rate constraint and the operating efficiency constraint, constrain the operation process of the frequency converter to adjust the speed of the liquid supply pump so that the measurement value of the flow sensor is the target total flow rate.

[0069] It is understood that this embodiment uses the target total flow rate, operating efficiency constraints, and volumetric flow rate constraints calculated based on the opening degree of all target valves as the control strategy for the liquid supply pump. This can effectively solve the defect of low operating efficiency of the liquid supply pump in the heat dissipation control process of large-scale array chips in the prior art. It ensures that while the temperature control system performs heat dissipation operations for the array chips, it can ensure the accuracy of temperature control and ensure that the operating efficiency of the liquid supply pump can be in the high-efficiency working range, thereby reducing the power consumption of the system.

[0070] It should be noted that the expression corresponding to the volumetric flow rate constraint condition generated based on the preset ratio range and reference flow rate is as follows: ,in, This refers to the numerical range of the actual flow rate of the liquid supply pump. For reference traffic, The range of proportions can be determined by those skilled in the art based on the actual situation.

[0071] It should be noted that this embodiment uses minimizing the difference between the actual flow rate of the supply pump and the target total flow rate, while ensuring that the operating efficiency of the supply pump is greater than the product of the maximum operating efficiency and a preset ratio, as the operating efficiency constraint condition. The corresponding expression is as follows: ,in, This refers to the actual flow rate of the liquid supply pump. For the target total flow, To improve the operating efficiency of the liquid supply pump, This is for the highest operating efficiency of the liquid supply pump. This is the preset ratio value.

[0072] Step S40: Determine the target pressure value based on the saturation temperature of the coolant. Adjust the vacuum pump power or the three-way vacuum solenoid valve to make the pressure in the evaporation chamber the target pressure value. The saturation temperature of the coolant is determined by the temperature value of each partition of the array chip.

[0073] It should be noted that in this embodiment, the target pressure value is determined based on the saturation temperature of the coolant and is calculated according to the following formula:

[0074] ;

[0075] in, For the target pressure value, This is the current saturation temperature of the coolant.

[0076] It is understood that in this embodiment, during the process of controlling the nozzle electric valve to achieve zoned spray cooling of the array chip, the saturation temperature of the coolant sprayed from the nozzle corresponds one-to-one with its ambient pressure (i.e., the pressure value of the evaporation chamber). This embodiment uses this correspondence to dynamically set the pressure value of the evaporation chamber, causing the saturation temperature to change dynamically, thereby indirectly setting the reference temperature for zoned cooling of the array chip, i.e., changing the boiling point and improving overall cooling. This allows the temperature control system to control the thermal state of the entire system by adjusting a macroscopic parameter (i.e., the pressure value of the evaporation chamber), rather than frequently generating and sending commands to control all micro-devices (electric valves) to combat temperature fluctuations. This significantly reduces the energy consumption of the temperature control system.

[0077] In some embodiments, the evaporation chamber is also connected to a return pump, and each electric valve is connected to a PID controller during execution. Figure 1 After step S40, the heat dissipation control method based on the array chip in this embodiment also includes, but is not limited to, the following steps:

[0078] Step S51: Monitor the pressure value of the evaporation chamber, the temperature value of each zone, and the liquid level of the evaporation chamber in real time.

[0079] Step S52: When the pressure value exceeds the pressure threshold, control the three-way vacuum solenoid valve to open the corresponding negative pressure circuit and turn on the vacuum pump.

[0080] Step S53: When the temperature value exceeds the temperature threshold, the maximum cooling mode is activated, an alarm message is generated, and the alarm message is sent to the PID controller.

[0081] Step S54: When the liquid level exceeds the first liquid level threshold, the speed of the return pump is adjusted by frequency converter until the liquid level is less than the first liquid level threshold. When the liquid level is less than the second liquid level threshold, the speed of the return pump is adjusted by frequency converter until the liquid level is greater than the second liquid level threshold.

[0082] Understandably, this embodiment also includes a safety protection mechanism. By monitoring the pressure in the evaporation chamber, the temperature in each zone, and the liquid level in the evaporation chamber in real time, when the pressure exceeds a pressure threshold, the three-way vacuum solenoid valve is controlled to open the corresponding negative pressure circuit and the vacuum pump is activated to achieve negative pressure extraction. When the temperature exceeds a temperature threshold, the maximum cooling mode is activated, an alarm message is generated, and the alarm message is sent to the corresponding PID controller. When the liquid level exceeds a first liquid level threshold, the frequency converter adjusts the speed of the return pump until the liquid level is below the first liquid level threshold. When the liquid level is below a second liquid level threshold, the frequency converter adjusts the speed of the return pump until the liquid level is below the second liquid level threshold. The liquid level is greater than the second liquid level threshold. That is to say, this embodiment has a safety mechanism for the liquid level in the evaporation chamber. When the liquid level exceeds the limit, there are two situations: (1) it exceeds the highest predetermined value (i.e., the first liquid level threshold). At this time, the speed of the return pump is adjusted to lower it to a safe liquid level. The safe liquid level is within the range of less than the first liquid level threshold and greater than the second liquid level threshold. At the same time, it can maintain the low liquid level thin liquid film cooling mode and maximize the cooling efficiency of the spray; (2) the liquid level is lower than the lowest set value (i.e., the second liquid level threshold). The speed of the return pump is adjusted to be greater than the second liquid level threshold to prevent local dry burning and liquid film drying, which would lead to a sharp deterioration in the cooling effect and a temperature surge. Combined with these safety protection mechanisms, it can be ensured that the temperature control system can safely control the heat dissipation of the array chip.

[0083] In addition, this embodiment also includes a pressure buffer tank and a liquid supply branch. The pressure buffer tank is located between the liquid supply pump and the electric valve of the spray, the liquid supply branch is located between the liquid reservoir and the electric valve of the spray, and a vacuum breaking valve is connected to the top of the evaporation chamber.

[0084] It is understood that this embodiment has a three-layer architecture (temperature control layer, system coordination layer, and safety protection layer). In the first layer, the temperature control layer, the valve opening control of the electric valves of the nozzles corresponding to each zone is involved. In the second layer, the system coordination layer, the flow rate coordination control under the pump efficiency constraint of the liquid supply pump is involved, as well as the dynamic mapping relationship between the saturation temperature of the coolant and the pressure value of the evaporation chamber, so as to control the thermal state of the temperature control system by controlling the pressure value of the evaporation chamber. In the safety protection layer, the liquid level, pressure of the evaporation chamber and the temperature of the array chip zone are monitored for exceeding the limit. Referring to the description of the above embodiment, the three-layer architecture is interconnected. When temperature, flow rate or negative pressure adjustment is required, the overall system-level adjustment can be achieved, so that the entire temperature control system operates in a stable and energy-saving state. It does not require frequent operation of issuing commands to hundreds or thousands of valves in the system one by one, which greatly reduces the number of control commands and the frequency of equipment operation, thereby effectively reducing the power consumption of the temperature control system when dissipating heat from the chip.

[0085] In addition, during execution Figure 1 After step S40, the heat dissipation control method based on the array chip in this embodiment also includes, but is not limited to, the following steps:

[0086] Step S55: When a heating demand is received, a new saturation temperature is determined based on the heating demand, and a new target pressure value is determined based on the new saturation temperature.

[0087] Step S56: Adjust the vacuum pump power or the three-way vacuum solenoid valve to make the pressure value of the evaporation chamber a new target pressure value.

[0088] Step S57: Reduce the valve opening of the electric valves corresponding to each zone and reduce the speed of the liquid supply pump.

[0089] In addition, in some embodiments, based on the above three-layer architecture, when a heating demand is received, a new saturation temperature is determined based on the heating demand, and a new target pressure value is determined based on the new saturation temperature. By adjusting the vacuum pump power or the three-way vacuum solenoid valve, the pressure value of the evaporation chamber is made to the new target pressure value, the valve opening of the electric valves corresponding to each zone is reduced, and the speed of the liquid supply pump is reduced. For example, when the pressure is increased, the speed of the liquid supply pump is reduced proportionally to 60% to 80% of the rated speed; the opening of the electric valves of the nozzles corresponding to each zone is reduced to 20% to 50% of the reference value, thereby achieving heating control and effectively solving the problem of difficult heating control in the prior art.

[0090] It is understood that the heat dissipation control of each partition of the array chip in this embodiment is applied to the controller of the temperature control system. The controller includes a temperature control module for implementing partition PID control and decoupling compensation, i.e., executing steps S10 to S20 of the above embodiment; a flow coordination module for dynamically calculating the total flow demand and dynamically controlling the flow of the liquid supply pump, i.e., executing step S30; a negative pressure control module for calculating the saturation pressure setpoint in real time to dynamically adjust the pressure value of the evaporation chamber, i.e., executing step S40; steps S55 to S57 are executed through linkage with the temperature control module, the flow coordination module and the negative pressure control module; and a safety monitoring module for handling events of liquid level, pressure and temperature exceeding limits, i.e., executing steps S51 to S54.

[0091] In addition, the temperature control system in this embodiment is as follows: Figure 2 As shown, the liquid supply pump 102 is connected to the filter 103 and the main pipeline electric valve 104, flow sensor 105, temperature sensor 106, and first pressure sensor 107 via the main pipeline. The end of the filter 103 away from the liquid supply pump 102 is connected to the liquid receiver 111. The liquid receiver 111 is connected to the evaporation chamber 101 via the return pump 110. The liquid receiver 111 is connected to the three-way vacuum solenoid valve 113 via the condenser 114. The three-way vacuum solenoid valve 113 is also connected to the vacuum pump 108. The three-way vacuum solenoid valve 113 is also connected to... The evaporation chamber 101 is connected to the evaporation chamber 101. A second pressure sensor 115 is installed between the three-way vacuum solenoid valve 113 and the evaporation chamber 101 (the pressure value of the evaporation chamber 101 can be determined based on the second pressure sensor 115). The evaporation chamber 101 is equipped with a nozzle assembly 210, which includes six nozzles (i.e., the first nozzle 211, the second nozzle 212, the third nozzle 213, the fourth nozzle 214, the fifth nozzle 215, and the sixth nozzle 216). Different nozzles correspond to different spray zones, such as... Figure 3 As shown: the first nozzle 211 located at the center covers the inner ring, and the second nozzle 212, the third nozzle 213, the fourth nozzle 214, the fifth nozzle 215 and the sixth nozzle 216 cover the outer ring. Each nozzle is equipped with an independent electric valve 500. The evaporation chamber 101 is provided with multiple spray zones. The steam outlet of the evaporation chamber 101 is connected to the condenser 114 through a three-way vacuum solenoid valve 113. The evaporation chamber 101 is equipped with a temperature sensor and a liquid level sensor, and the liquid reservoir 111 is equipped with a liquid level sensor.

[0092] Specifically, the heat dissipation control method based on array chips provided in this application embodiment can be applied to the manufacturing process of semiconductor device special equipment such as integrated circuit manufacturing, production of special lithography machines, and etching machines.

[0093] like Figure 4 As shown, Figure 4This is a structural diagram of a control device provided in one embodiment of this application. The present invention also provides a control device 300, comprising:

[0094] The processor 310 can be implemented using a general-purpose central processing unit (CPU), microprocessor, application specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.

[0095] The memory 320 can be implemented as a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory 320 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 320 and is called and executed by the processor 310 to implement the heat dissipation control method based on the array chip of this application embodiment.

[0096] Input / output interface 330 is used to realize information input and output;

[0097] The communication interface 340 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0098] Bus 350 transmits information between various components of the device (e.g., processor 310, memory 320, input / output interface 330, and communication interface 340);

[0099] The processor 310, memory 320, input / output interface 330 and communication interface 340 are connected to each other within the device via bus 350.

[0100] In addition, this application also provides a temperature control system, including the control device 300 of the above embodiments.

[0101] In addition, this application embodiment also provides a storage medium, which is a computer-readable storage medium, storing a computer program that, when executed by a processor, implements the above-described heat dissipation control method based on an array chip.

[0102] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0103] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically include computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0104] The above provides a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of the present invention.

Claims

1. A heat dissipation control method based on an array chip, characterized in that, The method is applied to a temperature control system, which is communicatively connected to an array chip. The array chip includes multiple partitions. The temperature control system includes an evaporation chamber, which is equipped with a coolant and a nozzle assembly. The nozzle assembly includes multiple nozzles, each facing a different partition. Each nozzle is equipped with an electric valve, and all the electric valves are connected to a main pipeline. A flow sensor and a liquid supply pump are located at the end of the main pipeline away from the electric valves. The evaporation chamber is connected to a vacuum pump via a three-way vacuum solenoid valve. The method includes: Obtain the temperature value of each of the partitions, and determine the corresponding basic valve opening from the valve opening mapping table based on any one of the temperature values, wherein the valve opening mapping table is used to indicate the mapping relationship between the temperature range and the valve opening. For any of the nozzles, based on the spray coverage overlap model, the coupling compensation amount is calculated through the decoupling compensator and the opening of the basic valve. The coupling compensation amount and the corresponding opening of the basic valve are summed to obtain the corresponding target valve opening. The corresponding target valve opening is then sent to each of the electric valves. The target total flow rate is calculated based on the opening degree of all the target valves, and the speed of the liquid supply pump is adjusted by the frequency converter so that the measurement value of the flow sensor is the target total flow rate. The target pressure value is determined based on the saturation temperature of the coolant. The pressure in the evaporation chamber is made to the target pressure value by adjusting the power of the vacuum pump or the three-way vacuum solenoid valve. The saturation temperature of the coolant is determined by the temperature value of each partition of the array chip. Based on the spray coverage overlap model, the coupling compensation amount is calculated using the decoupling compensator and the opening degree of the basic valve, and is obtained according to the following formula: ； ； in, The coupling compensation amount is... This refers to the opening degree of the basic valve. For partitioning j For partitions i The coupling coefficient, For nozzle i Coverage area and nozzles j Overlapping area of ​​the coverage region For nozzle i The area covered is the heat transfer coefficient.

2. The heat dissipation control method based on an array chip according to claim 1, characterized in that, The target total flow rate is calculated based on the opening degree of all the target valves, using the following formula: ； in, The target total flow rate, For flow conversion factor, For the first i The target valve opening degree of the electric valve corresponding to each of the nozzles. This is the base flow compensation value.

3. The heat dissipation control method based on an array chip according to claim 1, characterized in that, The evaporation chamber is also connected to a return pump, and each of the electric valves is connected to a PID controller. After adjusting the power of the vacuum pump or the three-way vacuum solenoid valve to make the pressure in the evaporation chamber reach the target pressure value, the method further includes: The pressure value of the evaporation chamber, the temperature value of each of the partitions, and the liquid level of the evaporation chamber are monitored in real time. When the pressure value exceeds the pressure threshold, the three-way vacuum solenoid valve is controlled to open the corresponding negative pressure circuit and start the vacuum pump. When the temperature value exceeds the temperature threshold, the maximum cooling mode is activated, an alarm message is generated, and the alarm message is sent to the PID controller; When the liquid level exceeds the first liquid level threshold, the speed of the return pump is adjusted by frequency conversion until the liquid level is less than the first liquid level threshold. When the liquid level is lower than the second liquid level threshold, the speed of the return pump is adjusted by frequency conversion until the liquid level is greater than the second liquid level threshold.

4. The heat dissipation control method based on an array chip according to claim 1, characterized in that, After adjusting the vacuum pump power or the three-way vacuum solenoid valve to make the pressure in the evaporation chamber reach the target pressure value, the method further includes: Upon receiving a heating demand, a new saturation temperature is determined based on the heating demand, and a new target pressure value is determined based on the new saturation temperature. The pressure value of the evaporation chamber is adjusted to the new target pressure value by adjusting the power of the vacuum pump or the three-way vacuum solenoid valve. Reduce the valve opening of the electric valves corresponding to each of the partitions, and reduce the speed of the liquid supply pump.

5. The heat dissipation control method based on an array chip according to claim 1, characterized in that, Adjusting the speed of the liquid supply pump via a frequency converter so that the flow sensor measures the target total flow rate includes: Determine the reference flow rate of the liquid supply pump, wherein the reference flow rate is the volumetric flow rate output when the liquid supply pump operates at its highest efficiency; Volumetric flow rate constraints are generated based on a preset ratio range and the reference flow rate. The operating efficiency constraint is to minimize the difference between the actual flow rate of the liquid supply pump and the target total flow rate, while the operating efficiency of the liquid supply pump is greater than the product of the maximum operating efficiency and the preset ratio value. Based on the volumetric flow rate constraint and the operating efficiency constraint, the operation process of the frequency converter adjusting the speed of the liquid supply pump is constrained so that the measurement value of the flow sensor is the target total flow rate.

6. A control device, characterized in that, It includes at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, which, when executed by the at least one control processor, enable the at least one control processor to perform the array chip-based heat dissipation control method as described in any one of claims 1 to 5.

7. A temperature control system, characterized in that, Includes the control device as described in claim 6.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions for causing a computer to perform the heat dissipation control method based on an array chip as described in any one of claims 1 to 5.

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