Solid state drive lock temperature function automation test method, device and storage medium

Abstract

The application discloses a kind of solid state disk lock temperature function's automation test method, equipment and storage medium, the method includes: in the reference performance test of lock temperature function closing state, reference performance data is collected;In the first test cycle of lock temperature function closing state, first test data is collected;In the same second test cycle of lock temperature function opening state, second test data is collected;Comparative analysis reference performance data, first test data and second test data, calculate performance and temperature trade-off coefficient, performance stability improvement degree and heat recovery promotion rate such as quantitative index.The application realizes multi-dimensional accurate evaluation to lock temperature function efficiency by real application trajectory playback and long time compound stress test combination, establishes standardization test framework, and provides reliable data support for the thermal management performance optimization of solid state disk.

Description

Technical Field

[0001] This invention relates to the field of solid-state drive (SSD) testing technology, and in particular to an automated testing method, device, and storage medium for the temperature lock-in function of SSDs. Background Technology

[0002] As solid-state drives (SSDs) achieve ever-increasing storage density and transfer rates, their power consumption and heat generation during operation also increase dramatically. Excessively high core temperatures trigger the SSD's internal thermal throttling mechanism, leading to a sharp decline in performance and, in the long run, threatening the reliability of stored data and the lifespan of the chip. To address this issue, SSD manufacturers have introduced "temperature lock-in" or "low-power" functions (hereinafter referred to as "temperature lock-in"). This function uses firmware algorithms to proactively reduce the operating frequency and voltage of the controller or flash memory when the SSD temperature reaches or approaches a certain threshold, thereby controlling power consumption and temperature rise, aiming to maintain the SSD's performance stability under prolonged high loads.

[0003] However, existing technologies for testing temperature-locking functions typically employ simple comparative methods, which have several shortcomings: they lack analysis of the linkage between temperature and performance, making it impossible to verify the effectiveness of the temperature-locking mechanism; the test load is too idealized, failing to reflect the real impact on user experience; they neglect the assessment of performance stability and recovery capability; they do not consider power consumption indicators, making it impossible to comprehensively evaluate the energy efficiency ratio; and the test process lacks rigor, resulting in poor repeatability and comparability of the results. Summary of the Invention

[0004] This invention provides an automated testing method, device, and storage medium for the temperature lock function of solid-state drives, in order to solve the problems of existing temperature lock function testing having a single dimension and lacking linkage analysis capabilities.

[0005] Firstly, an automated testing method for the temperature lock-in function of solid-state drives is provided, including:

[0006] The control and testing equipment performs benchmark performance tests on the solid-state drive (SSD) with the temperature lock function disabled, and obtains benchmark performance data.

[0007] The control and testing equipment performs the first test cycle on the solid-state drive (SSD) with the temperature lock function turned off. The first test cycle includes applying real application trajectory playback test and long-term composite stress test to the SSD in sequence, and simultaneously collecting the first test data of the SSD.

[0008] The control test equipment performs a second test cycle on the solid-state drive (SSD) with the temperature lock function enabled. The second test cycle applies the same real application trajectory playback test and long-term composite stress test as the first test cycle, and simultaneously collects the second test data of the SSD.

[0009] By comparing and analyzing the first test data and the second test data, at least one quantitative indicator is calculated to evaluate the performance of the temperature-locking function. The quantitative indicator includes at least one of the following: performance-temperature trade-off coefficient, performance stability improvement, and thermal recovery improvement rate.

[0010] Secondly, an automated testing device for solid-state drive (SSD) temperature lock-in function is provided, comprising:

[0011] The initialization module is used to control the test equipment to perform benchmark performance tests on the solid-state drive (SSD) and obtain benchmark performance data when the SSD's temperature lock function is turned off.

[0012] The first test module is used to control the test equipment to execute the first test cycle on the solid-state drive when the temperature lock function of the solid-state drive is turned off. The first test cycle includes applying real application trajectory playback test and long-term composite stress test to the solid-state drive in sequence, and simultaneously collecting the first test data of the solid-state drive.

[0013] The second test module is used to control the test equipment to execute the second test cycle on the solid-state drive when the temperature lock function of the solid-state drive is enabled. The second test cycle applies the same real application trajectory playback test and long-term composite stress test as the first test cycle, and simultaneously collects the second test data of the solid-state drive.

[0014] The analysis module is used to compare and analyze the first test data and the second test data, and calculate at least one quantitative indicator for evaluating the performance of the temperature lock function. The quantitative indicator includes at least one of the following: performance-temperature trade-off coefficient, performance stability improvement degree, and thermal recovery improvement rate.

[0015] Thirdly, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the automated testing method for the above-mentioned solid-state drive temperature locking function.

[0016] Fourthly, a computer-readable storage medium is provided, which stores a computer program, and when the computer program is executed by a processor, it implements the steps of the automated testing method for the above-mentioned solid-state drive temperature locking function.

[0017] The aforementioned automated testing method, device, equipment, and storage medium for solid-state drive (SSD) temperature locking functions utilizes a comprehensive testing process that includes benchmark testing, real-world application trajectory playback, and long-term composite stress testing. By executing the same test cycle with the temperature locking function both off and on, it achieves a multi-dimensional and accurate evaluation of the temperature locking function's performance. This approach combines real-world application scenario simulation with standardized stress testing, simultaneously collecting and comparing multi-dimensional data such as temperature, performance, and power consumption to objectively reflect the temperature locking function's performance in actual use. Furthermore, by calculating quantitative indicators such as the performance-temperature trade-off coefficient, performance stability improvement, and thermal recovery rate, it provides a comprehensive evaluation of the temperature locking function's performance retention, temperature control, and recovery capabilities. This addresses the limitations of traditional testing methods, such as single-scenario testing and lack of multi-dimensional data linkage analysis. It not only accurately assesses the impact of temperature locking on SSD performance but also reflects its actual improvement in user experience, providing reliable data support for optimizing SSD thermal management design. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart illustrating an automated testing method for the temperature lock function of a solid-state drive in one embodiment of the present invention.

[0020] Figure 2 This is a flowchart illustrating an automated testing method for the solid-state drive temperature lock-up function in another embodiment of the present invention.

[0021] Figure 3 This is a flowchart illustrating an automated testing method for the solid-state drive temperature lock-up function in another embodiment of the present invention.

[0022] Figure 4 This is a schematic diagram of an automated testing device for solid-state drive temperature locking function in one embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of the structure of a computer device according to an embodiment of the present invention. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Please see Figure 1 As shown, Figure 1 A flowchart illustrating an automated testing method for solid-state drive temperature lock-up function provided in an embodiment of the present invention includes the following steps:

[0026] Step S11: Control the test equipment to perform benchmark performance tests on the solid-state drive with the temperature lock function turned off, and obtain benchmark performance data.

[0027] Specifically, the test environment was first prepared by installing the SSD under test as a slave drive on the test platform. The temperature lock function was forcibly disabled using a firmware configuration tool or NVMe command-line interface, allowing the SSD to idle for at least 30 minutes. Its core temperature was monitored using HWiNFO64 until the temperature fluctuation range stabilized within ±1°C of the ambient temperature, ensuring consistency with the initial conditions. Next, a peak temperature test was performed by running CrystalDiskMark v8.0, selecting a 1GiB test file size, and executing the "Sequential Write (Q32T1)" test. During the test, the core temperature of the SSD was continuously monitored once per second, and the highest temperature value reached during the test was recorded. This temperature value reflects the transient thermal performance of the SSD under short-term high-intensity write operations. Finally, basic performance data was collected by running AS SSDBenchmark 2.0 and ATTO Disk Benchmark in sequence to execute the complete test suite. The AS SSD test used a 1GB file size to record key indicators such as sequential read / write, 4K random read / write, and access latency. The ATTO test used a transfer range from 512B to 64MB to record the IO performance under different block sizes. All test results were screenshotted and saved to form a complete benchmark performance dataset.

[0028] Step S12: Control the test equipment to execute the first test cycle on the solid-state drive with the temperature lock function off. The first test cycle includes applying real application trajectory playback test and long-term composite stress test to the solid-state drive in sequence, and simultaneously collecting the first test data of the solid-state drive.

[0029] This step involves performing dynamic load testing with the temperature lock-in function disabled to establish a baseline for comparison without temperature control intervention. Specifically, during the real-world application playback test, the SSD is used as the system drive, and PCMark 10 Extended's "Full System Drive Benchmark" is run. This test suite simulates approximately 20 minutes of daily user use by replaying operation sequences from real-world application scenarios such as game loading, office application launches, and file transfers. During the test, HWiNFO64 is used to synchronously record core temperature and power consumption data at a sampling rate of once per second, and these data are aligned with the performance data output by PCMark 10 using timestamps. The long-term composite stress test employs a multi-stage dynamic load design, implemented using the FIO (Flexible I / O Tester) tool.

[0030] Preferably, a long-term composite stress test is applied to the solid-state drive, specifically including:

[0031] 1. The first phase is configured to apply a first sequential write load and continue for a first preset duration.

[0032] 2. The second phase is configured to apply a mixed random read / write load after the first phase and continue for a second preset duration.

[0033] 3. The third stage is configured to apply a second sequential write load after the second stage for a third preset duration, and the intensity of the second sequential write load is lower than that of the first sequential write load.

[0034] Specifically, the first, second, and third preset durations are pre-set. The first stage aims to quickly raise the solid-state drive (SSD) temperature to near the temperature lock-in function trigger threshold. The second stage aims to simulate the operating system's random access mode. The third stage aims to evaluate the SSD's sustained performance under thermal stability. It should be noted that in this embodiment, the total duration threshold of the long-term composite stress test is pre-set, and the long-term composite stress test stops executing after the total duration reaches the threshold. In other embodiments, the long-term composite stress test may also stop executing when the SSD's core temperature fluctuation is less than ±1°C within 2 minutes, i.e., when a steady state is reached. In a specific implementation:

[0035] The first stage is the high-intensity heating stage: the first preset duration is 5 minutes, the first sequential write load is 100% sequential write load, the input / output block size is 128KB, and the input / output queue depth is set to 32.

[0036] The second phase is the mixed load phase: the second preset duration is 15 minutes, and a random read and write mixed load is applied, in which read operations account for 70% and write operations account for 30%, the input and output block size used is 4KB, and the input and output queue depth is set to 4.

[0037] The third stage is the steady-state pressure stage: the third preset duration is 10 minutes, the second sequential write load is to apply 100% sequential write load, the input / output block size is 64KB, and the input / output queue depth is set to 16.

[0038] Step S13: Control the test equipment to perform the second test cycle on the solid-state drive with the temperature lock function enabled. The second test cycle applies the same real application trajectory playback test and long-term composite stress test as the first test cycle, and simultaneously collects the second test data of the solid-state drive.

[0039] This step repeats the exact same test procedure as the first test cycle with the temperature lock-in function enabled, establishing a comparative dataset with temperature control intervention. Specifically, after completing the first test cycle, the state is reset and the function is enabled. A secure erase operation is performed on the SSD to eliminate the effects of fragmentation and wear generated in the previous test. The temperature lock-in function is enabled through the SSD management tool or the NVMe set-feature command, and the preset temperature lock-in trigger temperature and release temperature threshold in the firmware are confirmed. The test begins after the SSD has completely cooled to the same temperature as the ambient temperature. All parameters in the test execution process are strictly replicated from the first test cycle. The real-world application trajectory playback test uses the same PCMark 10 test suite and version to ensure that the operation sequence is completely consistent. The long-term composite stress test uses the same FIO configuration file and parameter settings, including but not limited to block size, queue depth, number of jobs, and test duration. Data acquisition uses the same monitoring tools and sampling frequency to ensure data comparability.

[0040] Furthermore, both the first and second test data include temperature data of the main control chip read through the SMART log page of the NVMe protocol, real-time performance data obtained through performance testing software, and power consumption data measured by an external power meter.

[0041] Step S14: Compare and analyze the first test data and the second test data, and calculate at least one quantitative indicator for evaluating the performance of the temperature lock function. The quantitative indicator includes at least one of the following: performance-temperature trade-off coefficient, performance stability improvement degree, and thermal recovery improvement rate.

[0042] Specifically, this step generates quantitative evaluation indicators for the temperature-locking function by comparing and analyzing the data collected in the first and second test cycles.

[0043] Furthermore, in step S14, the calculation process of the performance-temperature tradeoff coefficient includes:

[0044] 1. Calculate the percentage of performance degradation based on the baseline performance data and the steady-state data from the second test data during the long-term composite stress test.

[0045] Specifically, firstly, the sequential write bandwidth baseline value is extracted from the baseline performance data. This value is taken from the average of the 1 GiB Q32T1 sequential write test results in the benchmark performance test; then, the average sequential write bandwidth of the third stage of the long-term composite stress test is extracted from the second test data. Finally, calculate the percentage of performance degradation. .

[0046] 2. Calculate the temperature suppression value based on the steady-state data from the first and second test data during the long-term composite pressure test.

[0047] Specifically, firstly, the average core temperature of the third phase of the long-term composite stress test is extracted from the first test data. Then, the average core temperature of the third phase of the long-term composite stress test was extracted from the second test data. Finally, the temperature suppression value is calculated. .

[0048] 3. Calculate the performance-temperature tradeoff coefficient using the percentage of performance degradation and the temperature suppression value. Performance-temperature tradeoff coefficient = (percentage of performance degradation / temperature suppression value) × 100%.

[0049] It should be noted that, in the specific implementation process, the steady-state stage refers to the third stage of the long-term composite stress test. At this point, the temperature and performance indicators of the solid-state drive have reached a relatively stable state. Within any 5-minute time window, the core temperature fluctuation does not exceed ±2℃, and the write bandwidth fluctuation does not exceed ±5%. This trade-off coefficient can be used to quantitatively evaluate the ability of the temperature lock function to balance performance and temperature. The lower the trade-off coefficient, the smaller the performance loss of the temperature lock function per unit temperature drop, and the higher its efficiency.

[0050] Specifically, the performance-temperature tradeoff coefficient reflects the intelligence and efficiency of the temperature lock-in algorithm. A lower coefficient indicates a more intelligent and efficient temperature lock-in function, meaning the firmware algorithm can achieve maximum cooling with minimal performance loss. This can be achieved through fine-tuning of frequency and voltage, or through better power allocation among different load components (such as the controller and flash memory). A higher coefficient indicates a more abrupt and inefficient temperature lock-in function, potentially suggesting that the algorithm simply resorts to drastic frequency reduction or bandwidth limitation to achieve cooling, resulting in excessive performance sacrifice despite temperature control.

[0051] Furthermore, in step S14, the calculation process for the performance stability improvement includes:

[0052] 1. From the steady-state phase of the long-term composite stress test of the first test data and the second test data, the write bandwidth time series within the fourth preset time period are extracted to obtain two write bandwidth time series.

[0053] Specifically, the steady-state phase refers to the third stage of the long-term composite stress test, at which point the solid-state drive has entered a thermally stable state. The preset duration is 10 minutes, and data is captured from the 2nd minute of the third stage to the 12th minute to ensure that transient fluctuations during stage transitions are excluded. The data acquisition frequency is 1Hz, resulting in 600 consecutive write bandwidth sampling points, forming two complete time series: (Temperature lock-off state) and (Temperature lock-in enabled).

[0054] 2. Calculate the standard deviation of the two write bandwidth time series respectively.

[0055] Specifically, for Time series, calculate its standard deviation :

[0056] ;

[0057] in, Let be the write bandwidth value for the i-th sampling point. The average value of this time series is N=600, which is the total number of sampling points.

[0058] right For time series data, the standard deviation is also calculated. :

[0059] ;

[0060] in, Let be the write bandwidth value for the i-th sampling point. This is the average value of the time series.

[0061] 3. Calculate the performance stability improvement using the standard deviations of the two write bandwidth time series. Performance stability improvement = [(standard deviation of the first test data - standard deviation of the second test data) / standard deviation of the first test data] × 100%.

[0062] Specifically, this metric reflects the effectiveness of the latch-up function in suppressing write performance fluctuations. A positive improvement indicates improved performance stability after enabling the latch-up function; a larger improvement indicates a more significant effect of the latch-up function in maintaining performance stability. All data used in the calculation process has undergone outlier filtering to remove obvious abnormal sampling points caused by system scheduling or other reasons (such as abnormal data with a bandwidth value of 0 or exceeding 120% of the theoretical maximum bandwidth) to ensure the accuracy and reliability of the evaluation results.

[0063] Furthermore, in step S14, the calculation process for the thermal recovery improvement rate includes:

[0064] 1. After the long-term composite stress test load of the first and second test cycles is completed, immediately stop the load and monitor the temperature drop of the solid-state drive core.

[0065] Specifically, immediately after the third phase of the long-term composite stress test, all FIO processes are terminated via the test control software, allowing the SSD to enter a completely idle state. Simultaneously, a high-precision temperature monitoring program is initiated, continuously reading data from the controller chip's temperature sensor at a sampling frequency of 1Hz via the NVMe-MI interface. Monitoring continues until the SSD's core temperature drops to a preset ambient temperature threshold (typically set to the test ambient temperature +5°C, such as 28°C) and remains stable.

[0066] 2. Record the time required for the temperature to cool naturally from the highest temperature point at the end of the test to the preset temperature, and use these as the first cooling time and the second cooling time.

[0067] Specifically, firstly, the highest temperature point at the moment the test ends is determined from the temperature monitoring data of the first test cycle (with the temperature lock-up function off). Then, the time required for the temperature to drop to the preset temperature is calculated and recorded as the first cooling time. Next, from the temperature monitoring data of the second test cycle (with the temperature lock-up function on), the highest temperature point at the moment the test ends is similarly determined, and the time required for the temperature to drop to the same preset temperature is calculated and recorded as the second cooling time. This preset temperature refers to the temperature at which the solid-state drive's temperature lock-up function is released.

[0068] 3. Calculate the thermal recovery improvement rate using the first cooling time and the second cooling time. Thermal recovery improvement rate = [(first cooling time - second cooling time) / first cooling time] × 100%.

[0069] Specifically, this metric reflects the improvement effect of the temperature lock-in function on the thermal recovery capability of solid-state drives (SSDs). A positive improvement rate indicates that after enabling the temperature lock-in function, the SSD recovers from a high-temperature state to its normal operating temperature more quickly. This helps reduce the cumulative damage to flash memory chips caused by high temperatures and extends device lifespan. The entire cooling process was conducted under standard environmental conditions to ensure consistent airflow and eliminate interference from external cooling factors on the test results.

[0070] Furthermore, based on the above embodiments, in other embodiments, such as Figure 2 As shown, the automated testing method for the solid-state drive (SSD) temperature lock-in function also includes evaluating the percentage gain of the SSD's lifespan from the temperature lock-in function using a pre-built comprehensive lifespan correction model, specifically including:

[0071] Step S21: Calculate the write amplification rate under the conditions of temperature lock-in function being off and on, respectively, using the total host write volume and the total NAND flash memory write volume during the first test cycle and the second test cycle.

[0072] Specifically, key data during the test was obtained through the SMART attribute logs of the solid-state drive (SSD). The total host write volume was read from the SMART attribute "Host_Writes_Total," and the total NAND flash write volume was obtained from the "Media_Wear_Indicator" or "NAND_Writes" attribute. The write amplification rate was calculated using the following formula:

[0073] ;

[0074] in, To write the amplification, This represents the total amount of NAND flash memory written. This represents the total amount written to the host.

[0075] This calculation requires statistical analysis of data from the first test cycle (lock-in closed) and the second test cycle (lock-in open).

[0076] Step S22: Calculate the temperature acceleration factor by using the average core temperature of the solid-state drive during the first and second test cycles, respectively, in conjunction with the Arrhenius equation.

[0077] Specifically, the effect of temperature on the aging rate of solid-state drives (SSDs) is calculated based on the Arrhenius equation. The calculation formula is as follows:

[0078] ;

[0079] in, As the activation energy, based on the failure mechanism of NAND flash memory, the value range is set to 0.6 eV to 1.0 eV, with a preferred value of 0.7 eV; Boltzmann constant ; For reference temperature, take the rated operating temperature from the solid-state drive's datasheet, such as 40°C (313.15K) or 55°C (328.15K). The average core temperature during the test needs to be converted to Kelvin. This calculation requires using the average temperature values ​​from two separate test cycles.

[0080] Step S23: Calculate the abnormal event correction factor by using the number of abnormal power outages and voltage fluctuation amplitudes during the first test cycle and the second test cycle, respectively.

[0081] Specifically, considering the impact of abnormal operating conditions on lifespan, the calculation formula is as follows:

[0082] ;

[0083] in, Abnormal event correction factor The number of abnormal power outages that occurred during the test can be obtained through SMART logs or system event records. The average fluctuation of the power supply voltage is measured in millivolts (mV) by an external monitoring device; and These are empirical weighting coefficients, set to 0.05 and 0.001 respectively based on historical data. This calculation needs to be performed separately for abnormal events during the two test cycles.

[0084] Step S24: Calculate the estimated remaining lifetime for the lock-in function in both the off and on states based on the write amplification, temperature acceleration factor, and abnormal event correction factor.

[0085] Specifically, taking into account the above factors, the remaining lifetime is estimated using the following model:

[0086] ;

[0087] in, To estimate remaining lifespan, This is the manufacturer's stated total write volume (TBW). Calculate the write volume when the lock-in function is disabled. When the temperature lock function is turned on .

[0088] Step S25: Calculate the percentage of lifespan gain based on the estimated remaining lifespan under the conditions of the temperature lock function being off and on.

[0089] Specifically, the improvement in lifespan achieved by the temperature lock-in function is ultimately quantified using the following formula:

[0090] ;

[0091] This embodiment, through the comprehensive lifespan correction model, extends the testing from short-term performance to long-term lifespan prediction, providing a more comprehensive technical means to evaluate the overall value of solid-state drive temperature lock-in functionality.

[0092] Furthermore, based on the above embodiments, in other embodiments, such as Figure 3 As shown, the automated testing method for the solid-state drive (SSD) temperature lock-in function also includes evaluating the actual protection effect of the temperature lock-in function on the SSD using a pre-built temperature prediction model, specifically including:

[0093] Step S31: Obtain the reported temperature and real-time average write bandwidth of the solid-state drive synchronously collected during the long-term composite stress test from the first test data or the second test data.

[0094] Specifically, the reported temperature is obtained from the Composite Temperature field in the SMART / Health Information log page (address 04h) of the NVMe protocol, with a sampling frequency of 1Hz. Real-time average write bandwidth is obtained by parsing the output logs of the FIO testing tool, calculated as a 10-second sliding window average. To ensure data synchronization, the acquisition system employs a timestamp alignment mechanism, unifying all data to the same time base.

[0095] Step S32: Input the reported temperature and real-time average write bandwidth into the pre-built temperature prediction model to calculate the estimated temperature of the NAND flash memory chip. The temperature prediction model is expressed as: ,in, To estimate the temperature, To report the temperature, For real-time average write bandwidth, These are the preset weighting coefficients.

[0096] It should be noted that the weighting coefficients were preset through experiments.

[0097] Step S33: Based on the estimated temperatures obtained when the lock-in function is off and on, evaluate the temperature suppression effect of the lock-in function on the NAND flash memory chip.

[0098] It should be noted that the evaluation of the temperature suppression effect of the temperature lock-in function on NAND flash memory chips is based on the estimated temperatures obtained with the temperature lock-in function off and on. Specific evaluation indicators include:

[0099] Peak temperature suppression rate: Calculate the first maximum estimated temperature under the lock-in closed state; calculate the second maximum estimated temperature under the lock-in open state; Peak temperature suppression rate = (first maximum estimated temperature - second maximum estimated temperature) / first maximum estimated temperature × 100%;

[0100] Average temperature improvement: Calculate the first average estimated temperature under the lock-up closed state during the entire pressure test; calculate the second average estimated temperature under the lock-up open state; Average temperature improvement = (first average estimated temperature - second average estimated temperature) / first average estimated temperature × 100%;

[0101] High temperature duration ratio: Statistically estimate the cumulative time that the temperature exceeds the preset safety threshold (e.g., 85℃); calculate the reduction ratio of high temperature duration after the temperature lock function is turned on.

[0102] Specifically, the aforementioned quantitative indicators enable an objective assessment of the actual protective effect of the temperature lock-in function on NAND flash memory chips, providing crucial information for the reliability design and lifespan prediction of solid-state drives. The introduction of this temperature prediction model overcomes the limitations of relying solely on the controller's reported temperature for evaluation, achieving more precise monitoring of the thermal state of flash memory chips.

[0103] This embodiment constructs a complete test process including benchmark testing, real-world application trajectory playback, and long-term composite stress testing. It executes the same test cycle with the temperature lock function both off and on, achieving a multi-dimensional and accurate evaluation of the temperature lock function's performance. By combining real-world application scenario simulation with standardized stress testing, and simultaneously collecting and comparing multi-dimensional data such as temperature, performance, and power consumption, it objectively reflects the performance of the temperature lock function in actual use. Furthermore, by calculating quantitative indicators such as the performance-temperature trade-off coefficient, performance stability improvement, and thermal recovery rate, it achieves a comprehensive evaluation of the temperature lock function's performance maintenance, temperature control, and recovery capabilities. This solves the problems of traditional testing methods, such as single test scenarios and lack of multi-dimensional data linkage analysis. It not only accurately assesses the impact of the temperature lock function on SSD performance but also reflects its actual improvement effect on user experience, providing reliable data support for optimizing SSD thermal management design.

[0104] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0105] In one embodiment, an automated testing device for the solid-state drive (SSD) temperature lock-in function is provided, which corresponds one-to-one with the automated testing method for the SSD temperature lock-in function described in the above embodiments. For example... Figure 4 As shown, the automated testing device for the solid-state drive's temperature lock function includes an initialization module 11, a first testing module 12, a second testing module 13, and an analysis module 14.

[0106] Initialization module 11 is used to control the test equipment to perform benchmark performance tests on the solid-state drive when the temperature lock function of the solid-state drive is turned off, and to obtain benchmark performance data;

[0107] The first test module 12 is used to control the test equipment to perform a first test cycle on the solid-state drive when the temperature lock function of the solid-state drive is turned off. The first test cycle includes applying real application trajectory playback test and long-term composite stress test to the solid-state drive in sequence, and simultaneously collecting the first test data of the solid-state drive.

[0108] The second test module 13 is used to control the test equipment to perform a second test cycle on the solid-state drive when the solid-state drive's temperature lock function is enabled. The second test cycle applies the same real application trajectory playback test and long-term composite stress test as the first test cycle, and simultaneously collects the second test data of the solid-state drive.

[0109] Analysis module 14 is used to compare and analyze the first test data and the second test data, and calculate at least one quantitative indicator for evaluating the performance of the temperature lock function. The quantitative indicator includes at least one of the following: performance-temperature trade-off coefficient, performance stability improvement degree, and thermal recovery improvement rate.

[0110] Optionally, the first test module 12 and the second test module 13 perform a long-term composite stress test on the solid-state drive, specifically including:

[0111] The first phase is configured to apply a first sequential write load and continue for a first preset duration;

[0112] The second phase is configured to apply a mixed random read / write load after the first phase and continue for a second preset duration;

[0113] The third stage is configured to apply a second sequential write load after the second stage for a third preset duration, wherein the intensity of the second sequential write load is lower than that of the first sequential write load.

[0114] Optionally, both the first test data and the second test data include the temperature data of the main control chip read through the SMART log page of the NVMe protocol, the real-time performance data obtained through performance testing software, and the power consumption data measured by an external power meter.

[0115] Optionally, the analysis module 14 performs the operation of calculating the performance-temperature tradeoff coefficient, specifically including:

[0116] The percentage of performance degradation is calculated based on the steady-state data from the baseline performance data and the second test data during the long-term composite stress test.

[0117] Based on the data from the first and second test data during the steady-state phase of the long-term composite pressure test, the temperature suppression value is calculated.

[0118] The performance-temperature tradeoff coefficient is calculated using the percentage of performance degradation and the temperature suppression value. Performance-temperature tradeoff coefficient = (percentage of performance degradation / temperature suppression value) × 100%.

[0119] Optionally, the analysis module 14 performs the operation of calculating the improvement in performance stability, specifically including:

[0120] From the steady-state phase of the long-term composite stress test of the first and second test data, the write bandwidth time series within the fourth preset duration are extracted to obtain two write bandwidth time series.

[0121] Calculate the standard deviation of the two write bandwidth time series respectively;

[0122] The performance stability improvement is calculated using the standard deviations of the two write bandwidth time series. Performance stability improvement = [(standard deviation of the first test data - standard deviation of the second test data) / standard deviation of the first test data] × 100%.

[0123] Optionally, the analysis module 14 performs the operation of calculating the thermal recovery improvement rate, specifically including:

[0124] After the long-term composite stress test load of the first and second test cycles is completed, the load is immediately stopped and the temperature drop of the solid-state drive core is monitored.

[0125] Record the time required for the temperature to cool naturally from the highest temperature point at the end of the test to the preset temperature, and use these as the first cooling time and the second cooling time.

[0126] The thermal recovery improvement rate is calculated using the first cooling time and the second cooling time. Thermal recovery improvement rate = [(first cooling time - second cooling time) / first cooling time] × 100%.

[0127] Optionally, the analysis module 14 is also used to evaluate the percentage gain in the lifespan of the solid-state drive from the lock-in function using a pre-built comprehensive lifespan correction model, specifically including:

[0128] The write amplification rate was calculated using the total host write volume and the total NAND flash write volume during the first and second test cycles, respectively, with the lock-in function off and on.

[0129] The temperature acceleration factor was calculated by using the average core temperature of the solid-state drive during the first and second test cycles, respectively, in conjunction with the Arrhenius equation.

[0130] The abnormal event correction factor is calculated by using the number of abnormal power outages and voltage fluctuation amplitudes during the first and second test cycles, respectively.

[0131] The estimated remaining lifetime is calculated based on the write amplification, temperature acceleration factor, and abnormal event correction factor under the conditions of lock-in function being off and on.

[0132] The percentage gain in lifetime is calculated based on the estimated remaining lifetime under both the on and off states of the temperature lock function.

[0133] Optionally, the analysis module 14 is also used to evaluate the actual protection effect of the temperature lock-in function on the solid-state drive using a pre-built temperature prediction model, specifically including:

[0134] Acquire the reported temperature and real-time average write bandwidth of the solid-state drive synchronously collected during the long-term composite stress test in the first or second test data.

[0135] The reported temperature and real-time average write bandwidth are input into a pre-built temperature prediction model to calculate the estimated temperature of the NAND flash memory chip. The temperature prediction model is expressed as follows: ,in, To estimate the temperature, To report the temperature, For real-time average write bandwidth, These are the preset weighting coefficients;

[0136] The effect of the temperature lock-in function on the temperature suppression of NAND flash memory chips was evaluated based on the estimated temperatures obtained when the temperature lock-in function was off and on.

[0137] Specific limitations regarding the automated testing device for SSD temperature locking functionality can be found in the above section on the limitations of the automated method for SSD temperature locking functionality, and will not be repeated here. Each module in the aforementioned automated testing device for SSD temperature locking functionality can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in the computer device, or stored in the computer device's memory as software, so that the processor can call and execute the corresponding operations of each module.

[0138] In one embodiment, a computer device is provided, the internal structure of which can be shown in the following diagram. Figure 5As shown. The computer device includes a processor, memory, network interface, and database connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile and / or volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The network interface is used to communicate with external clients via a network connection. When the computer program is executed by the processor, it performs the following steps:

[0139] The control and testing equipment performs benchmark performance tests on the solid-state drive (SSD) with the temperature lock function disabled, and obtains benchmark performance data.

[0140] The control and testing equipment performs the first test cycle on the solid-state drive (SSD) with the temperature lock function turned off. The first test cycle includes applying real application trajectory playback test and long-term composite stress test to the SSD in sequence, and simultaneously collecting the first test data of the SSD.

[0141] The control test equipment performs a second test cycle on the solid-state drive (SSD) with the temperature lock function enabled. The second test cycle applies the same real application trajectory playback test and long-term composite stress test as the first test cycle, and simultaneously collects the second test data of the SSD.

[0142] By comparing and analyzing the first test data and the second test data, at least one quantitative indicator is calculated to evaluate the performance of the temperature-locking function. The quantitative indicator includes at least one of the following: performance-temperature trade-off coefficient, performance stability improvement, and thermal recovery improvement rate.

[0143] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0144] The control and testing equipment performs benchmark performance tests on the solid-state drive (SSD) with the temperature lock function disabled, and obtains benchmark performance data.

[0145] The control and testing equipment performs the first test cycle on the solid-state drive (SSD) with the temperature lock function turned off. The first test cycle includes applying real application trajectory playback test and long-term composite stress test to the SSD in sequence, and simultaneously collecting the first test data of the SSD.

[0146] The control test equipment performs a second test cycle on the solid-state drive (SSD) with the temperature lock function enabled. The second test cycle applies the same real application trajectory playback test and long-term composite stress test as the first test cycle, and simultaneously collects the second test data of the SSD.

[0147] By comparing and analyzing the first test data and the second test data, at least one quantitative indicator is calculated to evaluate the performance of the temperature-locking function. The quantitative indicator includes at least one of the following: performance-temperature trade-off coefficient, performance stability improvement, and thermal recovery improvement rate.

[0148] It should be noted that the functions or steps that can be implemented by the computer-readable storage medium or computer device described above can be referred to the relevant descriptions in the foregoing method embodiments. To avoid repetition, they will not be described one by one here.

[0149] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other storage media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0150] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is used as an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0151] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for automated testing of a solid state drive lock temperature function, the method comprising: It comprises: ​ controlling the test equipment to perform a benchmark performance test on the solid state disk in the lock temperature function off state of the solid state disk, and obtaining benchmark performance data; controlling the test equipment to perform a first test cycle on the solid state disk in the lock temperature function off state of the solid state disk, the first test cycle comprising sequentially applying real application trajectory playback test and long-time composite stress test to the solid state disk, and synchronously collecting first test data of the solid state disk; controlling the test equipment to perform a second test cycle on the solid state disk in the lock temperature function on state of the solid state disk, the second test cycle applying the same real application trajectory playback test and long-time composite stress test as the first test cycle, and synchronously collecting second test data of the solid state disk; comparing and analyzing the first test data and the second test data, and calculating at least one quantitative index for evaluating the efficiency of the lock temperature function, the quantitative index comprising at least one of performance and temperature trade-off coefficient, performance stability improvement degree and heat recovery improvement rate; the calculation process of the performance and temperature trade-off coefficient, comprising: calculating the performance decay percentage based on the benchmark performance data and the data in the steady state stage of the long-time composite stress test in the second test data; calculating the temperature suppression value based on the first test data and the data in the steady state stage of the long-time composite stress test in the second test data; calculating the performance and temperature trade-off coefficient using the performance decay percentage and the temperature suppression value, the performance and temperature trade-off coefficient = (performance decay percentage / temperature suppression value) × 100%; the calculation process of the performance stability improvement degree, comprising: respectively intercepting the write bandwidth time series in the fourth preset time from the steady state stage of the long-time composite stress test of the first test data and the second test data, to obtain two write bandwidth time series; respectively calculating the standard deviations of the two write bandwidth time series; calculating the performance stability improvement degree using the standard deviations of the two write bandwidth time series, the performance stability improvement degree = [(standard deviation corresponding to the first test data - standard deviation corresponding to the second test data) / standard deviation corresponding to the first test data] × 100%; the calculation process of the heat recovery improvement rate, comprising: immediately stopping the load and monitoring the falling process of the core temperature of the solid state disk after the long-time composite stress test load of the first test cycle and the second test cycle ends; respectively recording the time required for natural cooling from the highest temperature point at the end of the test to the preset temperature as the first cooling time and the second cooling time; calculating the heat recovery improvement rate using the first cooling time and the second cooling time, the heat recovery improvement rate = [(first cooling time - second cooling time) / first cooling time] × 100%.

2. The method of claim 1, wherein, applying the long-time composite stress test to the solid state disk, comprising: a first stage configured to apply a first sequential write load and last for a first preset time; a second stage configured to apply a random read-write mixed load after the first stage for a second preset time duration; a third stage configured to apply a second sequential write load after the second stage for a third preset time duration, the second sequential write load having a lower intensity than the first sequential write load.

3. The method of claim 1, wherein, The first test data and the second test data each include temperature data of a host chip read through a SMART log page of an NVMe protocol, real-time performance data acquired through performance test software, and power consumption data measured through an external power meter.

4. The method of claim 1, wherein, The method further includes evaluating a life span gain percentage of the lock temperature function on the solid state disk using a pre-constructed comprehensive life span correction model, specifically including: calculating write amplification rates in a closed state and an open state of the lock temperature function using total host write amounts and total NAND flash write amounts during the first test cycle and the second test cycle, respectively; calculating temperature acceleration factors using average core temperatures of the solid state disk during the first test cycle and the second test cycle, respectively, in combination with an Arrhenius equation; calculating abnormal event correction factors using abnormal power-off times and voltage fluctuation amplitudes during the first test cycle and the second test cycle, respectively; calculating estimated residual life spans in the closed state and the open state of the lock temperature function based on the write amplification rates, the temperature acceleration factors, and the abnormal event correction factors in the closed state and the open state of the lock temperature function, respectively; calculating the life span gain percentage based on the estimated residual life spans in the closed state and the open state of the lock temperature function.

5. The method of claim 1, wherein, The method further includes evaluating an actual protection effect of the lock temperature function on the solid state disk using a pre-constructed temperature prediction model, specifically including: acquiring a reported temperature and a real-time average write bandwidth of the solid state disk synchronously collected in the long-time compound stress test in the first test data or the second test data; inputting the reported temperature and the real-time average write bandwidth into a pre-constructed temperature prediction model to calculate an estimated temperature of the NAND flash chip, the temperature prediction model being represented as: wherein, is the estimated temperature, is the reported temperature, is the real-time average write bandwidth, is a preset weighting coefficient; evaluating a temperature suppression effect of the lock temperature function on a NAND flash chip based on estimated temperatures obtained in the closed state and the open state of the lock temperature function, respectively.

6. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, The computer program is executed by the processor to implement the steps of the automatic test method of the lock temperature function of the solid state disk according to any one of claims 1 to 5.

7. A computer-readable storage medium storing a computer program, wherein the computer program comprises the following steps of: receiving a request for a resource from a client; determining whether the client is authorized to access the resource; and if the client is authorized to access the resource, providing the resource to the client. The computer program is executed by the processor to implement the steps of the automatic test method of the lock temperature function of the solid state disk according to any one of claims 1 to 5.

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