High-cleanliness buffering conductive foam assembly

Abstract

The invention discloses a high-cleanliness buffer conductive foam assembly which comprises a protective film, a release film I and a release film II which are sequentially arranged from bottom to top, a conductive double-sided adhesive tape and a double-sided adhesive tape I are arranged on the release film II, a conductive foam single-sided adhesive tape is arranged on the conductive double-sided adhesive tape, and a conductive foam single-sided adhesive tape is arranged on the double-sided adhesive tape I; the ultra-soft slow-rebound polyurethane foam and the double-faced adhesive tape II are sequentially arranged on the double-faced adhesive tape I from bottom to top. The high-cleanliness buffering conductive foam assembly provided by the invention is used on a mainboard in a microcomputer host, a protective film at the bottommost part is a supporting layer, a release film with the same shape is arranged in a foam area, foam can be removed together with the release film after being punched and waste is discharged, foam scraps near a notch are prevented from being left, and the service life of the foam is prolonged. The protective film area is shielded by the blue film on the periphery, so that the exposed glue area is reduced, and the cleanliness of the product is remarkably improved; the foam with two different functions is integrated on the same film, so that the mounting step is reduced during use, and the operation efficiency is improved; the whole structure is simple and reasonable, and is suitable for industrial popularization and use.

Description

Technical Field

[0001] This invention belongs to the field of conductive foam technology, and specifically relates to a high-purity buffer conductive foam assembly. Background Technology

[0002] The motherboard inside a microcomputer host integrates a large number of precision electronic components, and foam is usually added to provide cushioning and protection. However, the cutting of the foam will generate dust, which can pose a great risk if it is not removed. If the precision electronic components are contaminated by dust or conductive particles, it can easily cause equipment failure, and in severe cases, even burn out the equipment. Summary of the Invention

[0003] To address the problems in the prior art, the present invention aims to provide a high-purity buffer conductive foam assembly.

[0004] To achieve the above objectives and technical effects, the technical solution adopted by this invention is as follows: A high-cleanliness cushioning conductive foam assembly includes a protective film, a release film I, and a release film II arranged sequentially from bottom to top. The release film II is provided with conductive double-sided adhesive and double-sided adhesive I. The conductive double-sided adhesive is provided with conductive foam single-sided adhesive. The double-sided adhesive I is provided with ultra-soft slow-rebound polyurethane foam and double-sided adhesive II arranged sequentially from bottom to top.

[0005] Furthermore, the protective film has several positioning holes of different sizes, and the thickness of the protective film is 70-90µm.

[0006] Furthermore, the release film I has release holes that correspond to the positions of the positioning holes, are the same in number, and are compatible with them. The release film I also has a first adhesive hole, a second adhesive hole, a third adhesive hole, a fourth adhesive hole, and a fifth adhesive hole.

[0007] Furthermore, the release film II includes a first release film, a second release film, a third release film, a fourth release film, and a fifth release film, wherein the first release film corresponds to the position of the first adhesive hole and is adapted in shape, the second release film corresponds to the position of the second adhesive hole and is adapted in shape, the third release film corresponds to the position of the third adhesive hole and is adapted in shape, the fourth release film corresponds to the position of the fourth adhesive hole and is adapted in shape, and the fifth release film corresponds to the position of the fifth adhesive hole and is adapted in shape.

[0008] Furthermore, the conductive double-sided adhesive includes a first conductive double-sided adhesive and a second conductive double-sided adhesive, wherein the first conductive double-sided adhesive corresponds to the position of the third release film and the third adhesive hole and is adapted in shape, and the second conductive double-sided adhesive corresponds to the position of the fourth release film and the fourth adhesive hole and is adapted in shape.

[0009] Furthermore, the conductive foam single-sided adhesive includes a first conductive foam single-sided adhesive and a second conductive foam single-sided adhesive, wherein the first conductive foam single-sided adhesive corresponds to the first conductive double-sided adhesive, the third release film, and the third adhesive hole in position and is adapted in shape, and the second conductive foam single-sided adhesive corresponds to the second conductive double-sided adhesive, the fourth release film, and the fourth adhesive hole in position and is adapted in shape.

[0010] Furthermore, the double-sided adhesive I includes a first double-sided adhesive, a second double-sided adhesive, and a third double-sided adhesive, wherein the first double-sided adhesive corresponds to the position of the first release film and the first adhesive hole and is adapted in shape, the second double-sided adhesive corresponds to the position of the second release film and the second adhesive hole and is adapted in shape, and the third double-sided adhesive corresponds to the position of the fifth release film and the fifth adhesive hole and is adapted in shape.

[0011] Furthermore, the ultra-soft slow-rebound polyurethane foam includes a first polyurethane foam, a second polyurethane foam, and a third polyurethane foam. The first polyurethane foam is positioned and shaped to correspond with the first double-sided adhesive, the first release film, and the first adhesive hole. The second polyurethane foam is positioned and shaped to correspond with the second double-sided adhesive, the second release film, and the second adhesive hole. The third polyurethane foam is positioned and shaped to correspond with the third double-sided adhesive, the fifth release film, and the fifth adhesive hole.

[0012] Furthermore, the double-sided adhesive II includes a fourth double-sided adhesive, a fifth double-sided adhesive, and a sixth double-sided adhesive. The fourth double-sided adhesive corresponds to and is shaped with the first polyurethane foam, the first double-sided adhesive, the first release film, and the first adhesive hole. The fifth double-sided adhesive corresponds to and is shaped with the second polyurethane foam, the second double-sided adhesive, the second release film, and the second adhesive hole. The sixth double-sided adhesive corresponds to and is shaped with the third polyurethane foam, the third double-sided adhesive, the fifth release film, and the fifth adhesive hole.

[0013] Furthermore, the protective film has a thickness of 70-90µm, the release film I has a thickness of 70-80µm, the release film II has a thickness of 45-55µm, the 180° peel force is 7.5±2.5g / inch, the conductive double-sided adhesive has a thickness of 0.05±0.005mm, the 180° peel force is >1300g / 2.5cm, and the vertical conduction resistance is <0.05Ω, the conductive foam single-sided adhesive has a thickness of 1.3-1.8mm, the double-sided adhesive I has a thickness of 0.05mm, the 180° peel force is >15N / 25mm, the ultra-soft slow-rebound polyurethane foam has a thickness of 1.5±0.1mm, the double-sided adhesive II has a thickness of 0.05mm, and the 180° peel force is >15N / 25mm.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention discloses a high-cleanliness cushioning conductive foam assembly for use on the motherboard of a microcomputer host. It serves to cushion and protect the components while improving cleanliness. The bottom protective film acts as a support layer, and a release film of the same shape is placed in the foam area. When the foam is cut and waste is discharged, the release film can be removed together, avoiding foam debris residue near the cut. The protective film area is then covered with a blue film around the perimeter to reduce the exposed adhesive area and significantly improve the cleanliness of the product. By integrating multiple foam pieces with two different functions onto the same film, the installation steps can be reduced, improving work efficiency. The overall structure is simple and reasonably designed, making it suitable for industrial-scale promotion and use. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the structure of the protective film of the present invention; Figure 3 This is a schematic diagram of the structure of release film I of the present invention; Figure 4 This is a schematic diagram of the structure of the release film II of the present invention; Figure 5 This is a schematic diagram of the structure of the conductive double-sided adhesive of the present invention; Figure 6 This is a schematic diagram of the structure of the conductive foam single-sided adhesive of the present invention; Figure 7 This is a schematic diagram of the structure of the double-sided adhesive I of the present invention; Figure 8 This is a schematic diagram of the structure of the ultra-soft slow-rebound polyurethane foam of the present invention; Figure 9 This is a schematic diagram of the structure of the double-sided adhesive II of the present invention. Detailed Implementation

[0016] The present invention will now be described in detail so that its advantages and features can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention.

[0017] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.

[0018] like Figures 1-9As shown, this invention discloses a high-cleanliness cushioning conductive foam assembly for use on the motherboard inside a microcomputer host. It includes a protective film 1, a release film I 2, and a release film II 3 arranged sequentially from bottom to top. The release film II 3 is provided with conductive double-sided adhesive 4 and double-sided adhesive I 6. The conductive double-sided adhesive 4 is provided with conductive foam single-sided adhesive 5. The double-sided adhesive I 6 is provided with ultra-soft slow-rebound polyurethane foam 7 and double-sided adhesive II 8 arranged sequentially from bottom to top.

[0019] The protective film 1 is model TS-5001-HP, with a thickness of 70-90µm. The protective film 1 has several positioning holes 11 of different sizes, which not only allows for precise positioning and application but also facilitates easy removal of the film.

[0020] Release film I2 is model 7530B with a thickness of 70-80µm. Release film I2 also has release holes 21 corresponding to the positions of positioning holes 11, which not only allows for precise positioning and mounting but also facilitates film removal. Release film I2 also has a first adhesive hole 22, a second adhesive hole 23, a third adhesive hole 24, a fourth adhesive hole 25, and a fifth adhesive hole 26.

[0021] Release film II3 is model SYB5008, with a thickness of 45-55µm and a 180° peel force of 7.5±2.5g / inch. It includes a first release film 31, a second release film 32, a third release film 33, a fourth release film 34, and a fifth release film 35. The first release film 31 corresponds to the first adhesive hole 22 in position and is adapted in shape. The second release film 32 corresponds to the second adhesive hole 23 in position and is adapted in shape. The third release film 33 corresponds to the third adhesive hole 24 in position and is adapted in shape. The fourth release film 34 corresponds to the fourth adhesive hole 25 in position and is adapted in shape. The fifth release film 35 corresponds to the fifth adhesive hole 26 in position and is adapted in shape.

[0022] The conductive double-sided adhesive 4 is model TT-219, with a thickness of 0.05±0.005mm, a 180° peel force of >1300g / 2.5cm, and a vertical conduction resistance of <0.05Ω. It includes a first conductive double-sided adhesive 41 and a second conductive double-sided adhesive 42. The first conductive double-sided adhesive 41 is positioned and shaped to correspond with the third release film 33 and the third adhesive hole 24. The second conductive double-sided adhesive 42 is positioned and shaped to correspond with the fourth release film 34 and the fourth adhesive hole 25.

[0023] The conductive foam single-sided adhesive 5 is model LY-XYZ-D-15, with a thickness of 1.3-1.8mm. It includes a first conductive foam single-sided adhesive 51 and a second conductive foam single-sided adhesive 52. The first conductive foam single-sided adhesive 51 corresponds to the first conductive double-sided adhesive 41, the third release film 33, and the third adhesive hole 24 in terms of position and shape. The second conductive foam single-sided adhesive 52 corresponds to the second conductive double-sided adhesive 42, the fourth release film 34, and the fourth adhesive hole 25 in terms of position and shape.

[0024] The first conductive foam single-sided adhesive 51 and the second conductive foam single-sided adhesive 52 are conductive foams with conductive adhesive on one side. Adding a layer of conductive adhesive to the foam surface can provide both bonding and conductivity functions, maintaining the stable operation of the equipment.

[0025] Double-sided adhesive I6 is model NITTO 56405, with a thickness of 0.05mm and a 180° peel force >15N / 25mm. It includes a first double-sided adhesive 61, a second double-sided adhesive 62, and a third double-sided adhesive 63. The first double-sided adhesive 61 corresponds to the first release film 31 and the first adhesive hole 22 in position and is adapted in shape. The second double-sided adhesive 62 corresponds to the second release film 32 and the second adhesive hole 23 in position and is adapted in shape. The third double-sided adhesive 63 corresponds to the fifth release film 35 and the fifth adhesive hole 26 in position and is adapted in shape.

[0026] The ultra-soft, slow-rebound polyurethane foam 7 has the model number 4790-92-12059-04P and a thickness of 1.5±0.1mm. It includes a first polyurethane foam 71, a second polyurethane foam 72, and a third polyurethane foam 73. The first polyurethane foam 71 is positioned and shaped to correspond with the first double-sided adhesive 61, the first release film 31, and the first adhesive hole 22. The second polyurethane foam 72 is positioned and shaped to correspond with the second double-sided adhesive 62, the second release film 32, and the second adhesive hole 23. The third polyurethane foam 73 is positioned and shaped to correspond with the third double-sided adhesive 63, the fifth release film 35, and the fifth adhesive hole 26.

[0027] The first polyurethane foam 71, the second polyurethane foam 72, and the third polyurethane foam 73 are ultra-soft slow-rebound foams that can provide cushioning protection for the precision electronic components on the motherboard. Double-sided adhesive is provided on the top and bottom sides for easy fixation.

[0028] Double-sided adhesive II 8 is model NITTO 56405, with a thickness of 0.05mm and a 180° peel force >15N / 25mm. It includes a fourth double-sided adhesive 81, a fifth double-sided adhesive 82, and a sixth double-sided adhesive 83. The fourth double-sided adhesive 81 corresponds to and is shaped with the first polyurethane foam 71, the first double-sided adhesive 61, the first release film 31, and the first adhesive hole 22. The fifth double-sided adhesive 82 corresponds to and is shaped with the second polyurethane foam 72, the second double-sided adhesive 62, the second release film 32, and the second adhesive hole 23. The sixth double-sided adhesive 83 corresponds to and is shaped with the third polyurethane foam 73, the third double-sided adhesive 63, the fifth release film 35, and the fifth adhesive hole 26.

[0029] This invention integrates two different types of foam (conductive foam single-sided adhesive 5 and ultra-soft slow-rebound polyurethane foam 7) onto the same film, which can reduce the application steps and improve work efficiency during use.

[0030] The motherboard integrates a large number of precision electronic components. Contamination by dust or conductive particles can easily cause equipment malfunctions, and in severe cases, even burn out the equipment. Furthermore, foam punching generates dust, which poses a significant risk if not removed. Therefore, an innovative double-layer design was implemented. The bottom protective film 1 serves as a support layer, with a release film of the same shape placed in the foam area. When waste is discharged after foam punching, the release film can be removed along with the foam, preventing foam debris residue near the cut. A blue film is then used to cover the protective film area around the perimeter, reducing exposed adhesive areas and improving product cleanliness.

[0031] Example 1 like Figures 1-9 As shown, a high-cleanliness cushioning conductive foam assembly is used on the motherboard inside a microcomputer host. It includes a protective film 1, a release film I 2 and a release film II 3 arranged sequentially from bottom to top. The release film II 3 is provided with conductive double-sided adhesive 4 and double-sided adhesive I 6. The conductive double-sided adhesive 4 is provided with conductive foam single-sided adhesive 5. The double-sided adhesive I 6 is provided with ultra-soft slow-rebound polyurethane foam 7 and double-sided adhesive II 8 arranged sequentially from bottom to top.

[0032] The protective film 1 is model TS-5001-HP and has a thickness of 90µm. The protective film 1 has several positioning holes 11 of different sizes, which not only allows for precise positioning and application but also facilitates easy removal of the film.

[0033] Release film I2 is model 7530B and has a thickness of 80µm. Release film I2 also has release holes 21 corresponding to the positions of positioning holes 11. During use, it can not only accurately position the mounting, but also easily remove the film. Release film I2 also has a first adhesive hole 22, a second adhesive hole 23, a third adhesive hole 24, a fourth adhesive hole 25, and a fifth adhesive hole 26.

[0034] Release film II3, model SYB5008, has a thickness of 55µm and a 180° peel force of 7.5g / inch. It includes a first release film 31, a second release film 32, a third release film 33, a fourth release film 34, and a fifth release film 35. The first release film 31 corresponds to the first adhesive hole 22 in position and is adapted in shape. The second release film 32 corresponds to the second adhesive hole 23 in position and is adapted in shape. The third release film 33 corresponds to the third adhesive hole 24 in position and is adapted in shape. The fourth release film 34 corresponds to the fourth adhesive hole 25 in position and is adapted in shape. The fifth release film 35 corresponds to the fifth adhesive hole 26 in position and is adapted in shape.

[0035] The conductive double-sided adhesive 4 is model TT-219, with a thickness of 0.05mm, a 180° peel force >1300g / 2.5cm, and a vertical conduction resistance <0.05Ω. It includes a first conductive double-sided adhesive 41 and a second conductive double-sided adhesive 42. The first conductive double-sided adhesive 41 is positioned and shaped to correspond with the third release film 33 and the third adhesive hole 24. The second conductive double-sided adhesive 42 is positioned and shaped to correspond with the fourth release film 34 and the fourth adhesive hole 25.

[0036] The conductive foam single-sided adhesive 5 is model LY-XYZ-D-15, with a thickness of 1.3mm. It includes a first conductive foam single-sided adhesive 51 and a second conductive foam single-sided adhesive 52. The first conductive foam single-sided adhesive 51 corresponds to the first conductive double-sided adhesive 41, the third release film 33, and the third adhesive hole 24 in terms of position and shape. The second conductive foam single-sided adhesive 52 corresponds to the second conductive double-sided adhesive 42, the fourth release film 34, and the fourth adhesive hole 25 in terms of position and shape.

[0037] The first conductive foam single-sided adhesive 51 and the second conductive foam single-sided adhesive 52 are conductive foams with conductive adhesive on one side. Adding a layer of conductive adhesive to the foam surface can provide both bonding and conductivity functions, maintaining the stable operation of the equipment.

[0038] Double-sided adhesive I6 is model NITTO 56405, with a thickness of 0.05mm and a 180° peel force >15N / 25mm. It includes a first double-sided adhesive 61, a second double-sided adhesive 62, and a third double-sided adhesive 63. The first double-sided adhesive 61 corresponds to the first release film 31 and the first adhesive hole 22 in position and is adapted in shape. The second double-sided adhesive 62 corresponds to the second release film 32 and the second adhesive hole 23 in position and is adapted in shape. The third double-sided adhesive 63 corresponds to the fifth release film 35 and the fifth adhesive hole 26 in position and is adapted in shape.

[0039] The ultra-soft, slow-rebound polyurethane foam 7 has the model number 4790-92-12059-04P and a thickness of 1.5mm. It includes a first polyurethane foam 71, a second polyurethane foam 72, and a third polyurethane foam 73. The first polyurethane foam 71 is positioned and shaped to correspond with the first double-sided adhesive 61, the first release film 31, and the first adhesive hole 22. The second polyurethane foam 72 is positioned and shaped to correspond with the second double-sided adhesive 62, the second release film 32, and the second adhesive hole 23. The third polyurethane foam 73 is positioned and shaped to correspond with the third double-sided adhesive 63, the fifth release film 35, and the fifth adhesive hole 26.

[0040] The first polyurethane foam 71, the second polyurethane foam 72, and the third polyurethane foam 73 are ultra-soft slow-rebound foams that can provide cushioning protection for the precision electronic components on the motherboard. Double-sided adhesive is provided on the top and bottom sides for easy fixation.

[0041] Double-sided adhesive II 8 is model NITTO 56405, with a thickness of 0.05mm and a 180° peel force >15N / 25mm. It includes a fourth double-sided adhesive 81, a fifth double-sided adhesive 82, and a sixth double-sided adhesive 83. The fourth double-sided adhesive 81 corresponds to and is shaped with the first polyurethane foam 71, the first double-sided adhesive 61, the first release film 31, and the first adhesive hole 22. The fifth double-sided adhesive 82 corresponds to and is shaped with the second polyurethane foam 72, the second double-sided adhesive 62, the second release film 32, and the second adhesive hole 23. The sixth double-sided adhesive 83 corresponds to and is shaped with the third polyurethane foam 73, the third double-sided adhesive 63, the fifth release film 35, and the fifth adhesive hole 26.

[0042] This invention integrates two different types of foam (conductive foam single-sided adhesive 5 and ultra-soft slow-rebound polyurethane foam 7) onto the same film, which can reduce the application steps and improve work efficiency during use.

[0043] The motherboard integrates a large number of precision electronic components. Contamination by dust or conductive particles can easily cause equipment malfunctions, and in severe cases, even burn out the equipment. Furthermore, foam punching generates dust, which poses a significant risk if not removed. Therefore, an innovative double-layer design was implemented. The bottom protective film 1 serves as a support layer, with a release film of the same shape placed in the foam area. When waste is discharged after foam punching, the release film can be removed along with the foam, preventing foam debris residue near the cut. A blue film is then used to cover the protective film area around the perimeter, reducing exposed adhesive areas and improving product cleanliness.

[0044] Any parts or structures not specifically described in this invention can be made using existing technologies or products, and will not be elaborated upon here.

[0045] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A high-cleanliness cushioning conductive foam assembly, characterized by, It comprises, from bottom to top, a protective film, a release film I and a release film II, the release film II is provided with conductive double-sided adhesive and double-sided adhesive I, the conductive double-sided adhesive is provided with conductive foam single-sided adhesive, the double-sided adhesive I is sequentially provided with super-soft slow-rebound polyurethane foam and double-sided adhesive II from bottom to top.

2. A high-cleanliness, cushioning, conductive foam assembly according to claim 1, wherein, A plurality of positioning holes of different sizes are formed in the protective film, and the thickness of the protective film is 70-90µm.

3. A high-cleanliness, cushioning, conductive foam assembly according to claim 2, wherein, A plurality of release holes corresponding to the positions of the positioning holes, the same number and suitable for each other are formed in the release film I, and first, second, third, fourth and fifth glue holes are also formed in the release film I.

4. A high-cleanliness, cushioning, conductive foam assembly according to claim 3, wherein, The release film II comprises first, second, third, fourth and fifth release films, wherein the first release film corresponds to the position of the first glue hole and is suitable in shape, the second release film corresponds to the position of the second glue hole and is suitable in shape, the third release film corresponds to the position of the third glue hole and is suitable in shape, the fourth release film corresponds to the position of the fourth glue hole and is suitable in shape, and the fifth release film corresponds to the position of the fifth glue hole and is suitable in shape.

5. A high-cleanliness, cushioning, conductive foam assembly according to claim 4, wherein, The conductive double-sided adhesive comprises first and second conductive double-sided adhesive, wherein the first conductive double-sided adhesive corresponds to the positions of the third release film and the third glue hole and is suitable in shape, and the second conductive double-sided adhesive corresponds to the positions of the fourth release film and the fourth glue hole and is suitable in shape.

6. A high-cleanliness, cushioning, conductive foam assembly according to claim 5, wherein, The conductive foam single-sided adhesive comprises first and second conductive foam single-sided adhesive, wherein the first conductive foam single-sided adhesive corresponds to the positions of the first conductive double-sided adhesive, the third release film and the third glue hole and is suitable in shape, and the second conductive foam single-sided adhesive corresponds to the positions of the second conductive double-sided adhesive, the fourth release film and the fourth glue hole and is suitable in shape.

7. A high-cleanliness, cushioning, conductive foam assembly according to claim 4, wherein, The double-sided adhesive I comprises first, second and third double-sided adhesive, wherein the first double-sided adhesive corresponds to the positions of the first release film and the first glue hole and is suitable in shape, the second double-sided adhesive corresponds to the positions of the second release film and the second glue hole and is suitable in shape, and the third double-sided adhesive corresponds to the positions of the fifth release film and the fifth glue hole and is suitable in shape.

8. A high-cleanliness, cushioning, conductive foam assembly according to claim 7, wherein, The super-soft slow-rebound polyurethane foam comprises first, second and third polyurethane foam, wherein the first polyurethane foam corresponds to the positions of the first double-sided adhesive, the first release film and the first glue hole and is suitable in shape, the second polyurethane foam corresponds to the positions of the second double-sided adhesive, the second release film and the second glue hole and is suitable in shape, and the third polyurethane foam corresponds to the positions of the third double-sided adhesive, the fifth release film and the fifth glue hole and is suitable in shape.

9. A high-cleanliness, cushioning, conductive foam assembly according to claim 8, wherein, The double-sided adhesive II comprises fourth, fifth and sixth double-sided adhesive, wherein the fourth double-sided adhesive corresponds to the positions of the first polyurethane foam, the first double-sided adhesive, the first release film and the first glue hole and is suitable in shape, the fifth double-sided adhesive corresponds to the positions of the second polyurethane foam, the second double-sided adhesive, the second release film and the second glue hole and is suitable in shape, and the sixth double-sided adhesive corresponds to the positions of the third polyurethane foam, the third double-sided adhesive, the fifth release film and the fifth glue hole and is suitable in shape.

10. A high-cleanliness, cushioning, conductive foam assembly according to claim 1, wherein, The thickness of the protective film is 70-90 µm, the thickness of the release film I is 70-80 µm, the thickness of the release film II is 45-55 µm, the 180° peeling force is 7.5±2.5 g / inch, the thickness of the conductive double-sided adhesive tape is 0.05±0.005 mm, the 180° peeling force is >1300 g / 2.5 cm, the vertical conduction resistance is <0.05 Ω, the thickness of the conductive foam single-sided adhesive tape is 1.3-1.8 mm, the thickness of the double-sided adhesive tape I is 0.05 mm, the 180° peeling force is >15 N / 25 mm, the thickness of the ultra-soft slow-rebound polyurethane foam is 1.5±0.1 mm, the thickness of the double-sided adhesive tape II is 0.05 mm, and the 180° peeling force is >15 N / 25 mm.

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